TSMC Staffing R&D for 3nm Process

Julien Happich, EETimes, Oct. 04, 2016 – 

PARIS - Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) will actively develop 5-nanometer process technology, while dedicating between 300 and 400 R&D personnel in developing a 3-nanometer process, ultimately aiming at the 1-nanometer manufacturing process, reports Taiwanese magazine CTimes.

In an interview, Dr. Mark Liu, President and Co-Chief Executive Officer of TSMC, said the company will use its three-dimensional stacked architecture technology to break the limitation of Moore's law and move toward the 3nm manufacturing node.

Liu stressed that TSMC has established the complete ecosystems with the intellectual property, automation solutions and equipment providers, and will continue to invest in technology development and research, and to make Taiwan become the strongest fortress in the global semiconductor industry.

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