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What's new for Polarion X for Automotive 2404

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Flash Memory on a Rollercoaster Ride: Q3 Update

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3D Integration in VLSI Circuits

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KANs Upend the AL/ML Scene, and We're Ready

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FIPS 140-3: Enhancing Cryptographic Security for Modern Challenges

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Adding Cache to IPs and SoCs

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Automotive-SPICE 4.0 What´s new?

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Creating SoC Designs Better and Faster With Integration Automation

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GUC Leverages 3DIC Compiler to Enable 2.5D/3D Multi-Die Package

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Industry Articles

Proven solutions for converting a chip specification into RTL and UVM

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Agnisys

An Introduction to Direct RF Sampling in a World Evolving Towards Chiplets - Part 1

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Optimizing Automated Test Equipment for Quality and Complexity

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Revolutionizing Chip Design with AI-Driven EDA

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How to cost-efficiently add Ethernet switching to industrial devices

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Optimizing Analog Layouts: Techniques for Effective Layout Matching

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Key considerations and challenges when choosing LDOs

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Why Transceiver-Rich FPGAs Are Suitable for Vehicle Infotainment System Designs

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NoCs and the transition to multi-die systems using chiplets

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Silvaco's Fab Technology Co-Optimization (FTCO): From Atoms to Systems

**NIST Releases First 3 Finalized Post-Quantum Encryption Standards - Sept. 13, 2024 ❖**

NIST has released a final set of encryption tools designed to withstand the attack of a quantum computer. These post-quantum encryption standards secure a wide range of electronic informa... > Read

**Xiphera Develops Quantum-Resilient Hardware Security Solutions for Space - Sep 10, 2024 ❖**

Quantum-resilient Authenticated Boot and Hardware Root of Trust solutions bring future-proof security to space infrastructures. -- Xiphera, Ltd, a Finnish company designing and implementing ... > Read

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AI Products

Artificial Intelligence

**Sondrel announces Advanced Modelling Process for AI chip designs - Sep 10, 2024 ❖**

Sondrel, a leading provider of ultra-complex custom chips for leading global technology brands, has announced an Advanced Modelling Process for AI chip designs. This runs through every stage o... > Read

**Rambus Announces Industry-First HBM4 Controller IP to Accelerate Next-Generation AI Workloads - Sep 10, 2024 ❖**

SAN JOSE, Calif. – Sep. 9, 2024 – Rambus Inc. (NASDAQ: RMBS ), a premier chip and silicon IP provider making data faster and safer, today announced the industry’s first... > Read

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Business News

**TSMC August 2024 Revenue Report - Sep 10, 2024 ❖**

TSMC (TWSE: 2330, NYSE: TSM) today announced its net revenue for July 2024: On a consolidated basis, revenue for July 2024 was approximately NT$256.95 billion, an increase of 23.6 percent from... > Read

**Qualitas Semiconductor Enters into Landmark the World's 1st 2nm MIPI DCPHY Licensing Agreement with Leading U.S. Fabless C... - Sep 09, 2024 ❖**

SEOUL, South Korea – September 9, 2024 – Qualitas Semiconductor Co., Ltd. (hereinafter referred to as QUALITAS) (KOSDAQ: 432720), a leading provider in high-speed interface IP, a... > Read

**SMIC cuts capex and R&D - Sept. 09, 2024 ❖**

China’s leading foundry, SMIC, has been cutting capex and R&D despite soaring imports of chip manufacturing equipment into China. By David Manners, ElectronicsWeekly (September ... > Read

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Automotive IP

Automotive - Avionics

**BrainChip Identifies Advantages to Radar and Lidar Systems Leveraging Event-Based AI - Sep 10, 2024 ❖**

– Developers of radar and lidar systems have a new option in addressing key detection and tracking challenges by utilizing event-based AI computing architectures that provide performance... > Read

**SiliconAuto adopts Siemens' PAVE360 to accelerate pre-silicon ADAS SoC development - Sept. 04, 2024 ❖**

September 4, 2024 - Plano, Texas, USA -- Siemens Digital Industries Software announced today that SiliconAuto has adopted PAVE360™ software to help reduce development time for its ran... > Read

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Interconnect, D2D, C2C

**Faraday Unveils Advanced Packaging Coordinated Platform for Multi-source Chiplets - Sep 10, 2024 ❖**

-- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today introduced its advanced packaging coordinated platform for the vertical disintegration of c... > Read

**Synopsys Powers World's Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps - Sep 10, 2024 ❖**

Complete Synopsys 40G UCIe IP Solution Delivers Maximum Bandwidth for Die-to-Die Connectivity in High-Performance AI Data Center Chips – Synopsys, Inc. (Nasdaq: SNPS ) today announ... > Read

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Audio, Voice, Video

**intoPIX and BCnexxt Join Forces to Revolutionize Live Playout with JPEG XS Technology - Sep 10, 2024 ❖**

Enhancing Broadcast Efficiency and Quality with Real-Time, Low-Latency HD Stream Decoding – intoPIX , the leading expert in innovative video compression solutions, is proud to announc... > Read

**T2M IP Unveils Advanced H.264 and H.265 HEVC Codec IP Cores for High-Efficiency Video Solutions - Sept. 09, 2024 ❖**

T2M IP , a leading provider of semiconductor IP cores, proudly announces the immediate availability of their partner's H.264 and H.265 HEVC Codec IP cores. These state-of-the-art solutions ar... > Read

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RISC-V

RISC-V Ecosystem

**Semidynamics on major recruitment drive for RISC-V software engineers - Sept. 09, 2024 ❖**

Also recruiting for engineers to produce test chips Barcelona, Spain – September 9, 2024. Semidynamics, the European RISC-V custom core AI specialist, is on a major recruitment driv... > Read

**Two Indian startups showcase innovations at Semicon Taiwan 2024 - Sept. 05, 2024 ❖**

Two Indian startups, Silizium Circuits and Calligo Technologies, are making their mark at Semicon Taiwan 2024, as they seek to establish a foothold in the global semiconductor market. ... > Read

**RISC-V Builds the Backbone of Three New Consumer Devices - Sept. 04, 2024 ❖**

RISC-V, the open-standard ISA, has inspired a host of innovative designs in tablets, cameras, and laptops. In the past few years, RISC-V has transitioned from a project relegated to academia ... > Read

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Foundry and Technology News

**Samsung Partners with TSMC, Its Foundry Rival, on HBM4 Development - Sept. 06, 2024 ❖**

No eternal allies. No perpetual enemies. The old proverb seems so true when it comes to the semiconductor industry, when the world's top foundry, TSMC, announced the collaboration with its... > Read

**Adani Group partners Israel's Tower Semiconductor to build $10 billion chip plant in India: All details - Sept. 06, 2024 ❖**

Gautam Adani's Adani Group is partnering with Israel's Tower Semiconductor to establish a semiconductor fabrication plant in India. The project will enhance India's chipmaking capacity, creati... > Read

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IoT IP

Internet of Things

**CoreHW and Presto Engineering Announce Ground-breaking Collaboration to Advance Global Penetration of Ultra-low-power RF I... - Sept. 03, 2024 ❖**

CoreHW, a prominent fabless semiconductor company, and Presto Engineering, a European leader in application-specific integrated circuit (ASIC) design, engineering, and production services, h... > Read

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Developer Help

SoC Design Platforms and Services

**Technology combinations for complex chip - Aug. 30, 2024 ❖**

Reducing manual effort and achieving better coverage with AI and formal techniques Partner Content Given the size and complexity of modern semiconductor designs, functional verification has ... > Read

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Embedded Processing

**Efficient and GlobalFoundries Partner to Enable a New Category of Ultra Energy-Efficient, High-Performance Processors - Aug. 29, 2024 ❖**

New combination of ultra energy efficiency and high performance enables new use cases and applications in industrial IoT, defense, space, wearables and health -- Today, Efficient announc... > Read

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