Design and Reuse Embedded - From Silicon on Chip Solutions to Asic Design Platforms

Cadence Design Systems, Inc.

Revolutionizing the Automotive Industry with Quside, Siemens Cre8Ventures, and Digital Twins

Carson Bradbury
Siemens - Tessent Embedded Analytics

DDR5 vs DDR4 DRAM - All the Advantages & Design Challenges

Rambus press
Rambus, Inc.

What's new for Polarion X for Automotive 2404

Alexander Heyers
Siemens - Tessent Embedded Analytics

Flash Memory on a Rollercoaster Ride: Q3 Update

Martin Schreiber
Swissbit AG

3D Integration in VLSI Circuits

Maven Silicon

KANs Upend the AL/ML Scene, and We're Ready

Quadric

FIPS 140-3: Enhancing Cryptographic Security for Modern Challenges

Chris Collier

Adding Cache to IPs and SoCs

Andy Nightingale
Arteris IP

Automotive-SPICE 4.0 What´s new?

Denis Liwoch
Siemens - Tessent Embedded Analytics

Creating SoC Designs Better and Faster With Integration Automation

Insaf Meliane
Arteris IP

GUC Leverages 3DIC Compiler to Enable 2.5D/3D Multi-Die Package

Synopsys Editorial Staff, WeiHsun Liao
Synopsys, Inc.

Our partners at event

Industry Articles

Proven solutions for converting a chip specification into RTL and UVM

Nikita Gulliya
Agnisys

An Introduction to Direct RF Sampling in a World Evolving Towards Chiplets - Part 1

Niloufar Mosharafian
Analogue Insight

Optimizing Automated Test Equipment for Quality and Complexity

Jeorge Hurtarte
Teradyne

Revolutionizing Chip Design with AI-Driven EDA

Thomas Andersen
Synopsys

How to cost-efficiently add Ethernet switching to industrial devices

Comcores

Optimizing Analog Layouts: Techniques for Effective Layout Matching

Abhishek BV
eInfochips

Why Interlaken is a great choice for architecting chip to chip communications in AI chips

Chip Interfaces

Fully Automating Chip Design

Hans Bouwmeester
PrimisAI

Ensure Cybersecurity in the Connected Vehicles Era With ISO/SAE 21434

Ricardo Camacho
Parasoft

Key considerations and challenges when choosing LDOs

Chris Morrison
Agile Analog

Why Transceiver-Rich FPGAs Are Suitable for Vehicle Infotainment System Designs

Danny Fisher
Gowin Semiconductor

NoCs and the transition to multi-die systems using chiplets

Ashley Stevens
Arteris

Search SoC Solutions

D&R Partners >>

ASIC Design Partners

Design Platforms

Monitoring and Verification

D&R Events

IP-SoC South Korea 24
- September 9^th, 2024 NOW OPEN ! Watch Now >>

IP-SoC China 24
- September 12^th, 2024 Registration Open >>

IP-SoC Japan 24
- September 17^th, 2024 Registration Open >>

IP SoC EU 24
- December 10^th-11^th, 2024 Submission Open >>

Silvaco's Fab Technology Co-Optimization (FTCO): From Atoms to Systems

**NIST Releases First 3 Finalized Post-Quantum Encryption Standards - Sept. 13, 2024 ❖**

NIST has released a final set of encryption tools designed to withstand the attack of a quantum computer. These post-quantum encryption standards secure a wide range of electronic informa... > Read

**Xiphera Announces Quantum-Resistant Secure Boot - Aug. 28, 2024 ❖**

The new Secure Boot for the nQrux® Hardware Trust Engines family uses a hybrid signature scheme, offering a fundamental building block for creating trust in computing systems. -- Xiph... > Read

All News >>

Business News

**GUC Monthly Sales Report - August 2024 - Sept. 05, 2024 ❖**

GUC (TAIEX: 3443) today announced its net sales for Aug 2024 were NT1,945 million, decreased 33.0% month-overmonth and also decreased 14.4% year-over-year. Net sales for eight months of 20... > Read

**UMC Reports Sales for August 2024 - Sept. 05, 2024 ❖**

-- United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), today reported unaudited net sales for the month of August 2024. Period Y/Y... > Read

**Q2 2024 Global Semiconductor Equipment Billings Increased 4% Year-Over-Year, SEMI Reports - Sept. 05, 2024 ❖**

– Global semiconductor equipment billings increased 4% year-over-year to US$26.8 billion in the second quarter of 2024, while quarter-over-quarter billings edged up 1% during the same... > Read

All News >>

RISC-V

RISC-V Ecosystem

**RISC-V Builds the Backbone of Three New Consumer Devices - Sept. 04, 2024 ❖**

RISC-V, the open-standard ISA, has inspired a host of innovative designs in tablets, cameras, and laptops. In the past few years, RISC-V has transitioned from a project relegated to academia ... > Read

**RISC-V Builds the Backbone of Three New Consumer Devices - Sept. 04, 2024 ❖**

RISC-V, the open-standard ISA, has inspired a host of innovative designs in tablets, cameras, and laptops. In the past few years, RISC-V has transitioned from a project relegated to academi... > Read

**SiFive and Arkmicro Accelerate RISC-V Adoption in Automotive Electronics with SiFive's Automotive IP for the High-end SoC ... - Sep 02, 2024 ❖**

— Today SiFive, Inc. announced that it has licensed its SiFive Automotive RISC-V IP cores to Arkmicro Technologies (Shenzhen), accelerating the adoption of RISC-V in automotive electro... > Read

All News >>

Automotive IP

Automotive - Avionics

**SiliconAuto adopts Siemens' PAVE360 to accelerate pre-silicon ADAS SoC development - Sept. 04, 2024 ❖**

September 4, 2024 - Plano, Texas, USA -- Siemens Digital Industries Software announced today that SiliconAuto has adopted PAVE360™ software to help reduce development time for its ran... > Read

**Thalia joins Siemens digital twin marketplace for automotive - Sept. 02, 2024 ❖**

UK design migration tool developer Thalia Design Automation is joining the Siemens Cre8Ventures Digital Twin Marketplace. The collaboration between Thalia in Wales and the Siemens Cre8Venture... > Read

All News >>

IoT IP

Internet of Things

**CoreHW and Presto Engineering Announce Ground-breaking Collaboration to Advance Global Penetration of Ultra-low-power RF I... - Sept. 03, 2024 ❖**

CoreHW, a prominent fabless semiconductor company, and Presto Engineering, a European leader in application-specific integrated circuit (ASIC) design, engineering, and production services, h... > Read

**CoreHW and Presto Engineering Announce Ground-breaking Collaboration to Advance Global Penetration of Ultra-low-power RF I... - Sept. 03, 2024 ❖**

All News >>

View Products

Interconnect, D2D, C2C

**Blue Cheetah Collaborates with LG to Demonstrate Successful Silicon Bring-Up of Chiplet-Based Design - Sept. 03, 2024 ❖**

-- Blue Cheetah Analog Design and LG Electronics Inc. (LG) announced that they are collaborating and have demonstrated silicon success for a new generation of chiplets that can potentially b... > Read

All News >>

Foundry and Technology News

**Urgent Orders Boost Wafer Foundry Utilization in Q2; Global Top 10 Foundry Revenue Grows 9.6% while VIS Climbs Two Spots, ... - Sep 02, 2024 ❖**

-- TrendForce’s latest investigations have found that the arrival of China’s 618 mid-year shopping season as well as inventory levels of consumer electronics reaching healthier l... > Read

**Intel considers foundry split, fab cancellations - Sept. 02, 2024 ❖**

By Peter Clarke , eeNews Europe (September 1, 2024) Intel is considering its strategic options around its manufacturing unit known as Intel Foundry, according to a Bloomberg report that ci... > Read

All News >>

AI Products

Artificial Intelligence

**DeepX Hints At Next-Gen AI Chips - Sep 02, 2024 ❖**

By Sally Ward-Foxton, EETimes (August 30, 2024) SANTA CLARA, Calif.—DeepX demonstrated its two first-generation chips, which are aimed at different markets, at the Embedded Vision Sum... > Read

**F5 and Intel collaboration simplifies the security and delivery of AI services - Aug. 28, 2024 ❖**

F5 has announced that it is bringing application security and delivery capabilities to AI deployments powered by Intel. This is a new joint solution that combines security and traffic manag... > Read

All News >>

Developer Help

SoC Design Platforms and Services

**Technology combinations for complex chip - Aug. 30, 2024 ❖**

Reducing manual effort and achieving better coverage with AI and formal techniques Partner Content Given the size and complexity of modern semiconductor designs, functional verification has ... > Read

100 Qualified Design Partners >>

View Products

Embedded Processing

**Efficient and GlobalFoundries Partner to Enable a New Category of Ultra Energy-Efficient, High-Performance Processors - Aug. 29, 2024 ❖**

New combination of ultra energy efficiency and high performance enables new use cases and applications in industrial IoT, defense, space, wearables and health -- Today, Efficient announc... > Read

**GigaDevice Semiconductor expands its Arm MCU product roadmap through Arm Total Access - Aug. 27, 2024 ❖**

— GigaDevice, a leading semiconductor company specializing in Flash Memory , 32-bit Microcontrollers (MCUs) , Sensors , and Power Management technologies , announces it has signed ... > Read

All News >>

D&R Events

IP-SoC South Korea 24
- September 9^th, 2024 NOW OPEN ! Watch Now >>

IP-SoC China 24
- September 12^th, 2024 Registration Open >>

IP-SoC Japan 24
- September 17^th, 2024 Registration Open >>

IP SoC EU 24
- December 10^th-11^th, 2024 Submission Open >>

Partner Highlight

More than IP : SoC Platform

New SoC Products

New in Design and Verification World

Blogs

Industry Articles