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35 "Interconnect, D2D, C2C" SoCs

1
25-112Gbps Short-Reach PHY
The Alphawave DieCORE delivers the world’s highest density, lowest power die-to-die connectivity solution for MCMs based on IEEE XSR/USR serial standards. The DieCORE is a companion IP to the AlphaCO...

2
AresCORE 16G Die-to-Die IP
AresCORE is a market leading extremely low-power, low-latency interface IP designed by Alphawave IP for very high bandwidth connections between two dies that are on the same package.

3
D2D PHY (Die-to-Die Interface)
Die-to-Die (D2D) PHY IP is based on HBM electrical specification and will also be compatible with upcoming interface standards. It is used specifically for heterogenous chiplet solutions in wired comm...

4
D2D Controller IP (Die-to-Die Interface)
OpenFive's Die-to-Die (D2D) Controller IP is targeted for heterogenous chiplet solutions in wired communications, AI and HPC applications. With recent advances in package technologies, it is possible ...

5
DesignWare Die-to-Die Controller IP with AXI Interface

The DesignWare Die-to-Die Controller IP, optimized for latency, bandwidth, power and area, enables efficient inter-die connectivity in server, AI accelerator, networking and high-performance comput...


6
DesignWare Die-to-Die Controller IP with AXI Interface
The DesignWare Die-to-Die Controller IP, optimized for latency, bandwidth, power and area, enables efficient inter-die connectivity in server, AI accelerator, networking and high-performance computing...

7
DesignWare Die-to-Die PHY IP in TSMC N7 Process
The DesignWare Die-to-Die PHY IP enables high-bandwidth ultra and extra short reach interfaces in multi-chip modules (MCMs) for hyperscale data center, AI, and networking applications. The low-latency...

8
Fortrix - Self-contained IP platform for Root-of-Trust and Security
Fortrix™ is a self-contained, feature-rich IP platform which provides Root-of-Trust and cybersecurity features to chiplet based systems and standard SoCs. It s unique combination of hardware an...

9
RAMLinx interconnect
RAM of any size and kind in your EFLX® array

10
CXL (Compute Express Link) Dual Mode Controller
Highly Configurable, Technology Independent, System Validated.

11
Mobiveil RapidIO Controller (GRIO)
Generic RapidIO (GRIO) controller is a highly flexible and configurable IP to provide RapidIO interface on one side and a generic interface on the system side.

12
1-56/112G Multi-protocol Serdes (Interlaken, JESD204, CPRI, Ethernet, OIF/CEI)
eTopus designs ultra-high speed mixed-signal semiconductor IP solutions for high-performance computing and data center applications. Our 1-56/112Gbps ultra-high speed SerDes IP is adopted by global Ti...

13
1-56G-PCIe Gen5 ePHY Multi-Protocol SerDes IP - 7nm Low Power and Latency
Ultra-high speed SerDes IP, adopted by global Tier-1 network/storage/5G OEMs and major semiconductor companies. eTopus is the pioneer on PAN4 ADC/DSP-based SerDes, the first startup demonstrated 56Gb...

14
C2C Chip to Chip Link Inter-chip Connectivity IP
The purpose of inter-chip connectivity IP is to connect two different chips together to share computing resources, limit chip-to-chip latency, or maintain the highest possible chip-to-chip bandwidth. ...

15
FlexLLI MIPI Low Latency Interface (MIPI LLI) Digital Controller Interchip Connectivity IP
Arteris FlexLLI digital controller IP is the industry s first and only silicon-proven implementation of the MIPI Low Level Interface (LLI) specification. Arteris FlexLLI digital controller IP can con...

16
FlexNoC Network on Chip SoC Interconnect IP
FlexNoC is the ideal interconnect for SoC designs requiring higher performance with minimum area and power. Its flexible architecture makes it the right solution for interconnects with both low latency requirements and high throughput needs. FlexNoC provides support for the additional features that today SoCs require, such as clock domain conversion, width conversion, security, and multi-protocol support. The product supports the AMBA (APB, AHB, AXI) protocols and OCP and can easily be extended to support proprietary protocols.

17
FlexNoC Resilience Package
The Arteris FlexNoC Resilience Package provides hardware-based data protection for increased SoC reliability and functional safety.

18
FlexNoC Resilience Package IP
The Arteris FlexNoC Resilience Package is a complementary product to Arteris FlexNoC fabric IP. It implements hardware resilience features essential for systems-on-chip (SoCs) targeted for mission-cri...

19
Innovative Ultra-High-Speed Chiplet Solution
Innosilicon INNOLINK™ IP provides a leading-edge chiplet solution allowing massive amounts of low-latency data to pass seamlessly between smaller chips as if they were all on the same bus. Chiplets, d...

20
Multi-Die interLink (GLink 2.3) IP
GUC multi-die interLink (GLink) IP provides world’s best class solution for high-bandwidth, low-power, low-latency multi-channel interconnection in a package for applications such as High Performance ...

21
Ncore Cache Coherent Interconnect IP
For scalable and area-efficient heterogeneous cache coherent systems.

22
PIANO 2.0 Automated Interconnect Timing Closure Technology
PIANO 2.0 solves back-end timing problems with technology that works earlier in the SoC design flow, thereby reducing schedule risk.

23
TSMC CLN6FF/7FF Die-to-Die Interface PHY
IGAD2DX01A is a high speed die-to-die interface PHY which transmits data through INFO RDL channels. IGAD2DX01A contains 32 Tx lanes and 32 Rx lanes per slice and supports 8 slices in one PHY. Each Tx/...

24
Analog I/O + ESD protection for Die-2-die interfaces
Analog I/OS and power line ESD solutions All voltage domains (0.75V to 5V) Additional voltage (e.g. 12V in 28nm proven)

25
Interconnect Technology
EXTOLL introduces a new interconnection network architecture for High-Performance Computing, which brings a rich set of features to the HPC application space.

26
33G Die-to-Die SerDes PHY (12nm 16nm)
The AnalogX AXDieIO IP utilizes the silicon-proven AXLinkIO transceiver architecture for die-to-die, in package, type of channel links.

27
AXLinkIO MR
The AXLinkIO MR IP utilizes the silicon-proven AXLinkIO transceiver architecture for medium-reach and PCIe type of channel links.

28
BlueLynx Executable Generator Technology
BlueLynx™ technology revolutionizes the game in silicon design and engineering. Using proprietary technology, Blue Cheetah eliminates inefficiencies inherent in traditional silicon design processes while maintaining complete integrity.

29
Bunch of Wires [BoW] PHY IP
Blue Cheetah's Bunch of Wires [BoW] PHY IP design incorporates the maximum benefit of the Open Compute Project's (OCP) inter-chiplet PHY specification, targeting best in class power, performa...

30
CXL Host Device Dual mode controllers
Primesoc s CXL IP supports dual mode of Host and device , integrated with PCIE Gen5 and well tested.

31
KNiulink Chiplet Solution
Based on the traditional advantages of SerDes and DDR IP, KNiulink Semiconductor has launched a solution that meets the UCIe standard based on local requirements of domestic chip customers. The D2D pr...

32
Nutcracker XSR Connectivity Chiplet

Core and analog logic may not always deploy at the same time in the same process. Maturing high performance analog typically takes longer in moving to next generation of advanced process geometries...


33
ANOC - Asynchronous Network on Chip IP
ANoC, a clock-less interconnect solution, aimed at simplifying the design of complex SoC, using standard synchronous tools & flow

34
Highly configurable Interlaken ILA & ILK
Tamba Networks offers a highly configurable Interlaken ILA and ILK core. The core is compliant with the Interlaken and Interlaken look-aside specifications, and targets FPGA and ASIC operation. The S...

35
Scatter-Gather DMA - AXI4-Stream to/from AXI4 Memory Map Transfers
The Digital Blocks DB-DMAC-MC-AXI4-MM-STREAM Verilog RTL IP Core is a Multi-Channel Scatter-Gather DMA Controller that transfers data between AXI4 Memory Map and AXI4-Stream Interfaces.

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