www.design-reuse-embedded.com
SEARCH IP   
    • Categories
    • RISC-V
    • Embedded Processing
    • 5G, 3GPP LTE IP
    • IoT IP
    • Artificial Intelligence IP
    • Automotive IP
    • Space and Avionics
    • Security IP
    • Audio & Video IP
    • Design Platforms
    • Monitoring and Verification
    • SoC Design Services
    • Find your best SoC design partner
Partner Videos D&R Events
    • IP-SoC Days 2024
    • IP-SoC Days 2023
    • IP-SoC Days 2022
    • IP-SoC Days 2021
    • IP-SoC Days 2020
    • IP-SoC 2023
    • IP-SoC 2022
    • IP-SoC 2021
    • IP-SoC 2020
NEWS
Find Top SoC Solutions
for AI, Automotive, IoT, Security, Audio & Video...
You are here : design-reuse-embedded.com  > Interconnect, D2D, C2C  > Die-to-die

16G UCIe Standard PHY for TSMC 3nm

Overview

UCIe enables chiplet industry standard interoperability combined with ultra-low latency, extreme power efficiency, and high performance bandwidth for die-to-die link interconnectivity

Partner with us

Contact Us
Partnership Offers

List your Products

Suppliers, list and add your products for free.

List your Products

More about D&R Privacy Policy

© 2024 Design And Reuse

All Rights Reserved.

No portion of this site may be copied, retransmitted, reposted, duplicated or otherwise used without the express written permission of Design And Reuse.