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You are here : design-reuse-embedded.com  > Interconnect, D2D, C2C  > Die-to-die

600MBps Low Power D2D Interface in 16nm

Overview

Custom die-to-die interface in 16nm process technology. The I/O cell is bi-directional and has two modes of operation: standard rail-to-rail swing or a custom low-noise pseudo-differential interface. Rx cells have a weak pull-down feature.

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