Interconnect, D2D, C2C / Die-to-die SoC Catalog

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Interconnect, D2D, C2C Catalog

Chip to Chip (3)

Die-to-die (28)

Intra SoC Connectivity (9)

Network Interconnect (10)

1

16G UCIe Advanced PHY for TSMC 3nm

UCIe enables chiplet industry standard interoperability combined with ultra-low latency, extreme power efficiency, and high performance bandwidth for die-to-die link interconnectivity

2

16G UCIe Standard PHY for TSMC 3nm

UCIe enables chiplet industry standard interoperability combined with ultra-low latency, extreme power efficiency, and high performance bandwidth for die-to-die link interconnectivity

3

16G UCIe Standard PHY for TSMC 7nm

UCIe enables chiplet industry standard interoperability combined with ultra-low latency, extreme power efficiency, and high performance bandwidth for die-to-die link interconnectivity

4

2-16Gbps Die-to-Die (D2D) Multi-Protocol IO Supporting BOW, OHBI and UCIe

AresCORE is a market leading extremely low-power, low-latency interface IP designed by Alphawave IP for very high bandwidth connections between two dies that are on the same package.

5

25-112Gbps Extra Short-Reach (XSR) Multi-Standard SerDes (MSS)

The Alphawave DieCORE delivers the world s highest density, lowest power die-to-die connectivity solution for MCMs based on OIF XSR/USR serial standards. The DieCORE is a companion IP to the AlphaCOR...

6

40G Ultralink D2D PHY for GF12LP+

Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity

7

40G Ultralink D2D PHY for Samsung 7LPP

Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity

8

40G Ultralink D2D PHY for TSMC 3nm

Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity

9

40G Ultralink D2D PHY for TSMC 5nm

Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity

10

40G Ultralink D2D PHY for TSMC 7nm

Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity

11

D2D PHY (Die-to-Die Interface)

Die-to-Die (D2D) PHY IP is based on HBM electrical specification and will also be compatible with upcoming interface standards. It is used specifically for heterogenous chiplet solutions in wired comm...

12

D2D Controller IP (Die-to-Die Interface)

OpenFive s Die-to-Die (D2D) Controller IP is targeted for heterogenous chiplet solutions in wired communications, AI and HPC applications. With recent advances in package technologies, it is possible ...

13

DesignWare Die-to-Die Controller IP with AXI Interface

The DesignWare Die-to-Die Controller IP, optimized for latency, bandwidth, power and area, enables efficient inter-die connectivity in server, AI accelerator, networking and high-performance computing...

14

DesignWare Die-to-Die Controller IP with AXI Interface

The DesignWare Die-to-Die Controller IP, optimized for latency, bandwidth, power and area, enables efficient inter-die connectivity in server, AI accelerator, networking and high-performance comput...

15

DesignWare Die-to-Die PHY IP in TSMC N7 Process

The DesignWare Die-to-Die PHY IP enables high-bandwidth ultra and extra short reach interfaces in multi-chip modules (MCMs) for hyperscale data center, AI, and networking applications. The low-latency...

16

Universal Chiplet Interconnect Express (UCIe 1.0) Controller

Ultra-low latency UCIe controller for standard industry chiplet interoperability on streaming, PCIe, and CXL protocols

17

Multi-Die interLink (GLink 2.3) IP

GUC multi-die interLink (GLink) IP provides world’s best class solution for high-bandwidth, low-power, low-latency multi-channel interconnection in a package for applications such as High Performance ...

18

TSMC CLN6FF/7FF Die-to-Die Interface PHY

IGAD2DX01A is a high speed die-to-die interface PHY which transmits data through INFO RDL channels. IGAD2DX01A contains 32 Tx lanes and 32 Rx lanes per slice and supports 8 slices in one PHY. Each Tx/...

19

Analog I/O + ESD protection for Die-2-die interfaces

Analog I/OS and power line ESD solutions All voltage domains (0.75V to 5V) Additional voltage (e.g. 12V in 28nm proven)

20

2GBps Low Power D2D Interface

Custom die-to-die high-speed interface in 28nm process technology. The I/O cells are defined as TX only, and RX only, and have two modes of operation, standard full rail to swing, or a custom low nois...

21

600MBps Low Power D2D Interface in 16nm

Custom die-to-die interface in 16nm process technology. The I/O cell is bi-directional and has two modes of operation: standard rail-to-rail swing or a custom low-noise pseudo-differential interface. ...

22

BlueLynx Executable Generator Technology

BlueLynx™ technology revolutionizes the game in silicon design and engineering. Using proprietary technology, Blue Cheetah eliminates inefficiencies inherent in traditional silicon design processes while maintaining complete integrity.

23

Bunch of Wires [BoW] PHY IP

Blue Cheetah's Bunch of Wires [BoW] PHY IP design incorporates the maximum benefit of the Open Compute Project's (OCP) inter-chiplet PHY specification, targeting best in class power, performa...

24

Die-to-Die (D2D) Interconnect

Lightweight die-to-die interconnect solution optimized for highest performance with the lowest power and area overhead

25

KNiulink Chiplet Solution

Based on the traditional advantages of SerDes and DDR IP, KNiulink Semiconductor has launched a solution that meets the UCIe standard based on local requirements of domestic chip customers. The D2D pr...

26

UCIe PHY & D2D Adapter

Neuron IP’s UCIe PHY & D2D Adapter IP portfolio includes 32Gbps UCIe-Advanced (UCIe-A) & Standard (UCIe-S) cores as per the latest UCIe v1.1 specification for Chiplet products supporting various appli...

27

33G Die-to-Die SerDes PHY (12nm 16nm)

The AnalogX AXDieIO IP utilizes the silicon-proven AXLinkIO transceiver architecture for die-to-die, in package, type of channel links.

28

Eliyan uses its NuLink technology to develop die-to-die PHY IP products to support multiple standards (including UCIe and BoW) and multiple packaging types (including advanced packaging and standar...

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