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Interconnect, D2D, C2C Catalog
 Chip to Chip (5)
 Die-to-die (25)
 Intra SoC Connectivity (13)
 Network Interconnect (7)
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25 "Die-to-die" SoCs

1
2-16Gbps Die-to-Die (D2D) Multi-Protocol IO Supporting BOW, OHBI and UCIe
AresCORE is a market leading extremely low-power, low-latency interface IP designed by Alphawave IP for very high bandwidth connections between two dies that are on the same package.

2
25-112Gbps Extra Short-Reach (XSR) Multi-Standard SerDes (MSS)
The Alphawave DieCORE delivers the world s highest density, lowest power die-to-die connectivity solution for MCMs based on OIF XSR/USR serial standards. The DieCORE is a companion IP to the AlphaCOR...

3
D2D PHY (Die-to-Die Interface)
Die-to-Die (D2D) PHY IP is based on HBM electrical specification and will also be compatible with upcoming interface standards. It is used specifically for heterogenous chiplet solutions in wired comm...

4
D2D Controller IP (Die-to-Die Interface)
OpenFive s Die-to-Die (D2D) Controller IP is targeted for heterogenous chiplet solutions in wired communications, AI and HPC applications. With recent advances in package technologies, it is possible ...

5
DesignWare Die-to-Die Controller IP with AXI Interface

The DesignWare Die-to-Die Controller IP, optimized for latency, bandwidth, power and area, enables efficient inter-die connectivity in server, AI accelerator, networking and high-performance comput...

6
DesignWare Die-to-Die Controller IP with AXI Interface
The DesignWare Die-to-Die Controller IP, optimized for latency, bandwidth, power and area, enables efficient inter-die connectivity in server, AI accelerator, networking and high-performance computing...

7
DesignWare Die-to-Die PHY IP in TSMC N7 Process
The DesignWare Die-to-Die PHY IP enables high-bandwidth ultra and extra short reach interfaces in multi-chip modules (MCMs) for hyperscale data center, AI, and networking applications. The low-latency...

8
Fortrix - Self-contained IP platform for Root-of-Trust and Security
Fortrix™ is a self-contained, feature-rich IP platform which provides Root-of-Trust and cybersecurity features to chiplet based systems and standard SoCs. It s unique combination of hardware an...

9
Multi-Die interLink (GLink 2.3) IP
GUC multi-die interLink (GLink) IP provides world’s best class solution for high-bandwidth, low-power, low-latency multi-channel interconnection in a package for applications such as High Performance ...

10
TSMC CLN6FF/7FF Die-to-Die Interface PHY
IGAD2DX01A is a high speed die-to-die interface PHY which transmits data through INFO RDL channels. IGAD2DX01A contains 32 Tx lanes and 32 Rx lanes per slice and supports 8 slices in one PHY. Each Tx/...

11
Analog I/O + ESD protection for Die-2-die interfaces
Analog I/OS and power line ESD solutions All voltage domains (0.75V to 5V) Additional voltage (e.g. 12V in 28nm proven)

12
Die-to-Die (D2D) Interconnect
Lightweight die-to-die interconnect solution optimized for highest performance with the lowest power and area overhead

13
16G UCIe Advanced PHY for TSMC 3nm
UCIe enables chiplet industry standard interoperability combined with ultra-low latency, extreme power efficiency, and high performance bandwidth for die-to-die link interconnectivity

14
16G UCIe Standard PHY for TSMC 3nm
UCIe enables chiplet industry standard interoperability combined with ultra-low latency, extreme power efficiency, and high performance bandwidth for die-to-die link interconnectivity

15
16G UCIe Standard PHY for TSMC 7nm
UCIe enables chiplet industry standard interoperability combined with ultra-low latency, extreme power efficiency, and high performance bandwidth for die-to-die link interconnectivity

16
33G Die-to-Die SerDes PHY (12nm 16nm)
The AnalogX AXDieIO IP utilizes the silicon-proven AXLinkIO transceiver architecture for die-to-die, in package, type of channel links.

17
40G Ultralink D2D PHY for GF12LP+
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity

18
40G Ultralink D2D PHY for Samsung 7LPP
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity

19
40G Ultralink D2D PHY for TSMC 3nm
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity

20
40G Ultralink D2D PHY for TSMC 5nm
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity

21
40G Ultralink D2D PHY for TSMC 7nm
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity

22
BlueLynx Executable Generator Technology
BlueLynx™ technology revolutionizes the game in silicon design and engineering. Using proprietary technology, Blue Cheetah eliminates inefficiencies inherent in traditional silicon design processes while maintaining complete integrity.

23
Bunch of Wires [BoW] PHY IP
Blue Cheetah's Bunch of Wires [BoW] PHY IP design incorporates the maximum benefit of the Open Compute Project's (OCP) inter-chiplet PHY specification, targeting best in class power, performa...

24
KNiulink Chiplet Solution
Based on the traditional advantages of SerDes and DDR IP, KNiulink Semiconductor has launched a solution that meets the UCIe standard based on local requirements of domestic chip customers. The D2D pr...

25
Universal Chiplet Interconnect Express (UCIe 1.0) Controller
Ultra-low latency UCIe controller for standard industry chiplet interoperability on streaming, PCIe, and CXL protocols

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