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You are here : design-reuse-embedded.com  > Interconnect, D2D, C2C  > Die-to-die

33G Die-to-Die SerDes PHY (12nm 16nm)

Overview

The AnalogX AXDieIO IP utilizes the silicon-proven AXLinkIO transceiver architecture for die-to-die, in package, type of channel links.

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