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D&R IP SoC Day
China
September 11th, 2025

Co-organized with:
ssipex
jiatao

When : September 11th, 2025

Renaissance Shanghai Pudong Hotel
No.719 Yingchun Road, Lianyang District, Pudong,
Shanghai, China




A worldwide connected Event !!

D&R IP-SoC China 2025 Day is the unique worldwide event in China fully dedicated to IP (Silicon Intellectual Property) and IP based Electronic Systems.

IP-SoC providers, the seed of innovation in Electronic Industry, are invited to highlight their latest products and services and share their vision about the next innovation steps in the Electronic Industry.

IP consumers can view at a glance the latest Technology trends and exciting Innovative IP/SoC products. Through a global view, Electronic systems leaders may identify disruptive innovation leading to new market segment growth.

The event is a face to face meeting. In order to enhance the market attention the talk material and videos are posted concurrently on www.design-reuse-china.com and Youku.

Any question? Please contact us



First Contributions - More to come


Introduction
  • IP vendor the seed of innovation in the semiconductor world, D&R
  • Status and Trend of China's IP, SSIPEX
  • Your Trusted Turnkey Partner with One-Stop lP and SoC Platform Solutions, Brite Semiconductor Shanghai Co. Ltd.

Chiplets
  • Chiplets as an enabler for shorter Time-To-Market (TTM), Secure-IC
  • Mastering UCIe 2.0: Overcoming Fabric Management Hurdles for Chiplet Integration, Siemens EDA
  • UCIe-S v1.1 PHY IP: Measured Silicon Results and Robust Design Methodology from Simulation to Silicon, Qualitas Semiconductor

Connectivity
  • eTopus IOD: The Optimal Solution for the 'Warring States Era' of Scale-up Ecosystems, eTopus Technology Inc.
  • Highspeed Connectivity Solutions for 22nm Tech Nodes, Extoll GmbH

Analog and Memory IP
  • Advancing Power Telemetry, Movellus, Inc.
  • PVT Monitors fulfilling the desire for increasing levels of control in advanced nodes for complete silicon lifecycle management in SoCs, Synopsys, Inc.

Memory Subsystem
  • Semiconductor IPs for Memory, Flash storage and wireless applications, Mobiveil Inc.
  • Ensuring NVMe Infrastructure Readiness: Verification Before Live Migration, Siemens EDA

Memory Interface
  • LPDDR6 application in edge AI, OPENEDGES Technology, Inc.
  • Unlocking Generative AI at the Edge: How LPDDR enables Scalable & Efficient Intelligence, Rambus, Inc.

Automotive Solutions
  • GPU and RISC-V Collaborating for Smarter Automotive Solutions, Imagination Technologies Group Ltd.
  • Cadence DSP success in Automotive, Cadence Design Systems, Inc.

Artificial Intelligence
  • Interface IP for AI Scale-Up and Scale-Out Infrastructure, Cadence Design Systems, Inc.
  • A new era of on-device AI, Imagination Technologies Group Ltd.
  • VeriSilicon’s High-Performance Vitality GPU-AI IP Empowers AI PCs and Cloud Gaming Servers, VeriSilicon Microelectronics (Shanghai) Co., Ltd.
  • Allegro DVT’s NVP300 Neural Video Processor IP the AI Engine for Video, Allegro DVT

Security Solutions
  • How to Build Robust Security into Your AI SoC Designs, Synopsys, Inc.
  • Protecting Data in Motion with MACsec, Rambus, Inc.

High Perfomance Computing
  • Unlocking Computing Bottlenecks: How DRAM, SerDes, and Chiplet IP Are Reshaping the High-Performance Chip Landscape, Innosilicon Technology Ltd

And more to come...

Exhibitors

  • Akrostar Technology Co.Ltd.
  • Allegro DVT
  • Brite Semiconductor (Shanghai) Co., Ltd.
  • Cadence Design Systems, Inc.
  • CAST Inc.
  • eTopus technology Inc.
  • Innosilicon Technology Ltd
  • MAXVY Technologies Pvt Ltd
  • Mobiveil, Inc.
  • Movellus
  • OPENEDGES Technology, Inc.
  • Qualitas Semiconductor Co.,Ltd
  • Rambus, Inc.


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