GreenWaves GAP9 AI/IoT ULP app processor on GF's 22FDX to sample H1 2020; mass production 2021

Find the Latest SoC Solutions
for... Automotive... IoT... Security... Audio... Video

soiconsortium.org, Feb. 05, 2020 – 

The GAP9, GreenWaves Technologies latest IoT application processor – which is being fabbed on GlobalFoundries 22FDX (FD-SOI) technology – will be sampling in the first half of 2020, according to EETimes (read the whole article here). Mass production is slated for 2021. Greenwaves (which has been an SOI Consortium member for several years now) is a fabless semiconductor startup designing disruptive ultra-low power embedded solutions for AI processing in sensing devices at the very edge.

GreenWaves marketing director Martin Croome told EETimes, "We are using the body biasing ability in FD-SOI to allow us to achieve even lower power consumption." Compared to GreenWaves' currently shipping product, GAP8 (which is on a 55nm bulk process), GAP9 reduces energy consumption by 5 times while enabling inference on neural networks 10 times larger. This is thanks to architectural enhancements and the move to GF's 22FDX semiconductor process.

Click here to read more...

 Back