Advanced packaging to have 31% CAGR 2019-25

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The high-end packaging market will reach more than $4 billion by 2025 with a 31% CAGR between 2019 and 2025, says Yole Développement.

www.electronicsweekly.com, Nov. 05, 2020 – 

The high-end packaging market will reach more than $4 billion by 2025 with a 31% CAGR between 2019 and 2025, says Yole Développement.

The biggest market today is related to telecom and infrastructure applications.

The biggest growth will be in mobile & consumer and automotive & mobility with 60% and 88% market shares respectively.

Technology: fuelled by digital end-system demands and technological innovation, high-end packaging technology options are increasingly abundant and ground-breaking.

Companies of different business models including foundry, IDM and OSAT are competing.

Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging. But how will Samsung react?

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