Advanced Packaging: Interview with Intel's Ramune Nagisetty

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The IC industry is renewing its focus on advanced packaging. Chiplets may be the least mature option, but it is also one of the most widely promising. A conversation with Intel's Ramune Nagisetty...

www.eetasia.com, Nov. 11, 2020 – 

EE Times recently sat down with Ramune Nagisetty, Intel's packaging maven, to discuss the progress in advanced packaging technologies in recent years, and where Intel sees them going in the future. Here's what we learned.

The IC industry is clearing its path forward by relying on what was once one of its most mundane tools: packaging. There are several relatively new approaches to IC packaging, and they can all help significantly boost IC-level performance. The great thing is that many of these technologies are mature enough and have been around long enough that they are now accessible to even startups and universities.

While some of these technologies are already being offered by major foundries, one of the newest and most promising – chiplets technology – is still immature. What's missing that would help advance the state of the art, says Intel's Ramune Nagisetty, would be the creation of more standardized interfaces for mixing and matching the silicon components in advanced packages.

"The exciting part is lowering the barriers to play in this ecosystem," she said. "Ten years from now, we'll see fruits of this approach."

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