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European plugfest for MIPI I3C spec
www.eenewseurope.com, Sept. 27, 2022 –
Sixteen groups from seven companies have met in Munich, Germany, to show interoperability of the MIPI I3C specification.
The plugfest showed interoperability between multi-vendor controller and target devices in a confidential environment with a mix of electronics manufacturers, including both MIPI members and nonmembers. These included Binho , Intel, Introspect Technology, Prodigy Technovations Robert Bosch. and STMicroelectronics
MIPI I3C is a scalable, intelligent utility and control bus interface for connecting peripherals to an application processor, giving developers unprecedented opportunities to craft innovative designs for an array of products–smartphones, personal computers, wearables, IoT devices, systems in automobiles and other devices. Designed as the successor to I2C, I3C incorporates key attributes of the traditional I2C and SPI interfaces to provide a high-performance, very-low-power solution with backward compatibility and a robust, flexible upgrade path.
The MIPI I3C specification is available to MIPI members, while the publicly available, royalty-free MIPI I3C Basic is a subset of I3C that bundles the most commonly needed I3C features for developers and other standards organizations.
"Interop plugfests are great for ensuring interoperability among new device prototypes from a broad range of vendors," said Eyuel Zewdu Teferi, senior hardware design engineer with STMicroelectronics and vice chair of the MIPI I3C Basic Ad Hoc Working Group.
"As the first in-person MIPI I3C activity in two years, it was highly anticipated and allowed us to exchange experiences with other companies involved in I3C implementation and validating solutions," he said.
"STMicroelectronics brought several new products, and by validating our products with Conformance Test Suite (CTS) solutions provided by other contributors, the products all successfully passed the interoperability tests. We eagerly anticipate future interoperability events and hope more attendees will join, as these events are now open to both members and nonmembers to help them validate their solutions by directly interacting with other I3C implementers."
MIPI I3C Basic has been adopted into JEDEC's Sideband Bus and DDR5 standards, and in June, MIPI and ETSI Technical Committee Secure Element Technologies (TC SET) announced the adoption of I3C Basic as a physical and logical link layer for the ETSI Smart Secure Platform (SSP).
"Interoperability testing early in the design cycle is crucial to reducing time to market and ensuring seamless functionality among multi-vendor devices in deployment," said Sanjiv Desai, chair of MIPI Alliance. "Events such as the MIPI I3C Interop Workshop are so important because they help companies optimize the manufacturability of their designs, avoid deployment issues and deliver higher-quality products upon which their customers can rely from day one."
"The MIPI I3C Interop Workshop provided us with an incredible opportunity to not only validate the technical implementation of our I3C Basic protocol analyzer, but also to have a hands-on session with the experts working at the forefront of I3C. Getting their feedback was invaluable to further refine our solution," said Jonathan Georgino, founder of Binho LLC. "The collaborative spirit among the workshop attendees was inspiring–engineers from industry competitors sitting down together to solve technical challenges will further advance widespread I3C adoption."
"This workshop was a great opportunity to see how MIPI I3C is becoming an increasingly adopted protocol and also understand how much progress other companies have made in implementing it," said Franco Alessandro Brucato, ASIC digital design engineer with Robert Bosch. "But the best part was, without a doubt, working side by side with well-prepared colleagues from other companies and learning from them. I hope there are more events like this in future."
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