TSMC's biggest chiplet backend fab opens for business

Find the Latest SoC Solutions
for... Automotive... IoT... Security... Audio... Video

TSMC has opened its Advanced Backend Fab 6 – a major packaging and testing fab to realize 3DFabric integration, the foundry's approach to chiplet and multi-die component assembly.

www.eenewsanalog.com/, Jun. 13, 2023 – 

The fab is prepared for mass production of TSMC-SoIC (System on Integrated Chips) process technology and will support other advanced packaging and silicon stacking technologies such as InFO and CoWoS.

Construction of Advanced Backend Fab 6 commenced in 2020 to support the next generation of HPC, AI, mobile applications and other products.

Located in Zhunan Science Park, Miaoli County, northern Taiwan, the fab has a base area of 14.3 hectares, making it TSMC's largest advanced backend fab to date with a cleanroom area larger than the sum of TSMC's other advanced backend fabs. TSMC estimates that the fab will have the capacity to produce more than 1 million 300mm wafer equivalent 3DFabric process technology per year, and more than 10 million hours of testing services per year.

"Chiplet stacking is a key technology for improving chip performance and cost-effectiveness. In response to the strong market demand for 3D IC, TSMC has completed early deployment of advanced packaging and silicon stacking technology production capacity, and offers technology leadership through the 3DFabric platform," said Jun He, vice president of advanced packaging operations at TSMC, in a statement.

TSMC has increased the amount of automation in the factory and automatic material handling system built into the factory has a total length of more than 32 kilometers. From wafer to die, production information is connected with agile dispatching systems to shorten the production cycle. These systems are combined with artificial intelligence to simultaneously execute precise process control, detect abnormalities in real time, and establish a robust die-level big data quality defense network. The data processing capacity per second is 500 times that of a front-end fab, and a complete production history for each die is constructed through die traceability.

click here to read more...

 Back