Intel in cooler chips project

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The U.S. Department of Energy (DOE) has announced its selection of Intel as one of 15 organizations tasked with developing high-performance, energy-efficient cooling solutions for future data centers.

www.electronicsweekly.com/, Jun. 14, 2023 – 

The award is part of the COOLERCHIPS program – Cooling Operations Optimized for Leaps in Energy, Reliability, and Carbon Hyperefficiency for Information Processing Systems – supported by DOE's Advanced Research Projects Agency-Energy (ARPA-E).

Data centers account for approximately 2% of total U.S. electricity consumption, while data center cooling can account for up to 40% of data center energy usage overall.

The selected projects seek to reduce the energy necessary to cool data centers and lower the operational carbon footprint associated with this critical infrastructure.

To meet the growing demands for computing capacity and performance, future data center processors are expected to require power in excess of 2 kilowatts (kW), which would be challenging to cool with existing technologies. (Today's most powerful chips are fast approaching 1 kW of power use.)

Intel will collaborate with academic and industry leaders to develop its innovative immersion cooling solution. Intel will oversee the research effort, provide thermal test vehicles for evaluation, and define the form factor and constraints for the next-generation processors, including hot spot locations.

Intel's project develops ultra-low-thermal resistance, coral-shaped immersion cooling heat sinks integrated within a 3D vapor chamber cavity to support denser, higher-performance devices.

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