Layer transfer tech comes to high volume chiplet, 2nm manufacturing

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The EV Group (EVG) in Austria has launched the first layer release system for high volume manufacturing of chiplets and sub-3nm processes.

www.eenewseurope.com/, Dec. 08, 2023 – 

Layer transfer is a key technology for assembling disaggregated chiplet systems and leading edge chip making proceses. This previously required glass carriers to hold the die and making packages thicker and heavier.

In a 3D integration process, glass substrates have become an established method for building up device layers through temporary bonding with organic adhesives, using an ultraviolet (UV) wavelength laser to dissolve the adhesives and release the device layers, which are subsequently permanently bonded onto the final product wafer. However, glass substrates are difficult to process with semiconductor fab equipment that have been designed primarily around silicon, and that require costly upgrades to enable glass substrate processing. In addition, organic adhesives are generally limited to processing temperatures below 300 °C, limiting their use to back-end processing.

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The EVG850 NanoCleave layer transfer release system is the first platform to use EVG's NanoCleave technology for nanometre-precision release of bonded, deposited or grown layers from silicon carrier substrates. The system uses an infrared (IR) laser coupled with specially formulated inorganic release materials in a proven, high-volume-manufacturing (HVM) capable platform.

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