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Cadence Significantly Advances ECAD/MCAD Convergence for Electronic Systems with New Celsius Studio AI Thermal Platform


  • Thermal, stress and electronics cooling in-design analysis empowers designers to utilize ECAD and MCAD seamlessly for multiphysics simulation of electro-mechanical systems
  • Convergence of FEM and CFD engines addresses thermal integrity challenges from the chip to the packaging, to the board and out through the complete electronic system
  • Architected for massively parallel execution, Celsius Studio achieves up to 10X faster performance than prior solutions
  • Seamlessly integrated within Cadence IC, packaging, PCB and microwave design platforms, Celsius Studio enables in-design thermal analyses as well as final signoff

www.cadence.com/en_US/home.html, Jan. 31, 2024 – 

SAN JOSE, Calif.– Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced Cadence® Celsius™ Studio, the industry's first complete AI thermal design and analysis solution for electronic systems. Celsius Studio addresses thermal analysis and thermal stress for 2.5D and 3D-ICs and IC packaging, in addition to electronics cooling for PCBs and complete electronic assemblies. While current product offerings consist mostly of disparate point tools, Celsius Studio introduces an entirely new approach with a unified platform that lets electrical and mechanical/thermal engineers concurrently design, analyze and optimize product performance without the need for geometry simplification, manipulation and/or translation.

Celsius Studio brings a new system-level thermal integrity solution into the marketplace, converging electro-thermal co-simulation, electronics cooling and thermal stress into one cohesive offering. Made possible by Cadence's acquisition of Future Facilities in 2022, best-in-class electronics cooling technology is now accessible to electrical and mechanical engineers. Additionally, the ability to employ Celsius Studio seamlessly for in-design multiphysics analysis empowers designers to identify thermal integrity issues early in the design process and efficiently leverage generative AI optimization and novel modeling algorithms to determine ideal thermal designs.

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