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Samsung Receives Maiden 2nm AI Accelerator Order, Including HBM and Advanced Packaging

Most chip manufacturing companies are continuously making efforts to expand, accent, and enhance chip manufacturing to meet the ever-growing demand. Samsung Electronics, TSMC, and Intel are now working on 2nm chip manufacturing, which will go live for production next year. Amidst all this, Samsung Foundry has received its first 2nm AI Accelerator Order along with HBM and Advanced Packaging Services.

www.gizmochina.com/, Feb. 05, 2024 – 

In an announcement along with the Q4 2023 report, Samsung mentions the jump in demand for smartphones and PCs, which is also turning the tide for the foundry business. According to assumptions, the chip foundry market will return to the demand level of 2022 this year. With increasing demand for AI and other complex processes, chip makers are continuously increasing their efforts to start developing 2nm chipsets.

Samsung in particular is currently mass-producing 3nm GAA chips, while the 2nm process is slated for next year. The new process aims to increase performance by 25% in comparison with the 3nm GAP process. Even so, it will improve the power efficiency by 12% and reduce the size by over 5% in comparison with the 3nm 3GAP. Samsung could get a Snapdragon 8 Gen 4 manufacturing consignment, which will use their 3nm GAP process.

Major players like TSMC, Intel, and Samsung are leading the charge to tackle the growing demand for the latest and most advanced semiconductor manufacturing process. Reports suggest that Apple is set to become TSMC's inaugural customer for the 2nm process. Additionally, Intel has announced receiving orders for its 18A process, specifically for 5G infrastructure chips, from Ericsson.

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