Intel will bring a performance-improving feature to its chips one year ahead of TSMC

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In October 2021, Intel CEO Pat Gelsinger said that Intel would reclaim process leadership from TSMC and Samsung Foundry by 2025. Intel is looking to challenge TSMC and Samsung Foundry in the contract foundry segment of the industry. A contract foundry takes the chip designs from fabless chip designers (fabless means that they do not own a fabrication facility, like Apple for example) and manufacturers the chip. TSMC is the global leader followed by Samsung Foundry.

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Currently, both TSMC and Samsung Foundry are shipping 3nm chips and in the second half of next year, both could be mass-producing 2nm chips. Later this year, according to The Motley Fool, Intel will be using its 20A process (equivalent to 2nm for TSMC and Samsung Foundry) which will be used to build Intel's Arrow Lake PC chips. So at that point, Intel will have process leadership and that will only continue next year when Intel debuts its 18A process node, equivalent to 1.8nm when you compare it to TSMC and Samsung Foundry. The latter two will be debuting their 2nm node in the second half of next year.

Intel's process nodes will go from 20A this year to 14A by 2027

Everyone is expected to catch up with each other in 2027 when Intel's 14A (1.4nm) joins 1.4nm output from TSMC and Samsung Foundry. The bottom line is that the size of the transistors used with these chips gets smaller as the process node shrinks. That means more transistors can fit inside a component. The more transistors inside a chip, typically the more powerful and/or energy efficient a chip is.

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