Ceva Wireless Platform IP Family Accelerates Enhanced Connectivity in MCUs and SOCs

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The Ceva-Waves Links platform IPs support the latest wireless standards to address the surging demand for connectivity-rich chips targeting smart edge devices .

www.eetasia.com/, Apr. 15, 2024 – 

Ceva Inc. has launched Ceva-Waves Links, a new family of multi-protocol wireless platform IPs that supports the latest wireless standards to address the surging demand for connectivity-rich chips targeting smart edge devices in the consumer IoT, industrial, automotive, and personal computing markets.

These industry-leading IPs include Wi-Fi, Bluetooth, Ultra-Wideband (UWB), and IEEE 802.15.4 (for Thread, Zigbee, and Matter), to offer a range of qualified, easy-to-integrate, multi-protocol wireless communications subsystems, each featuring optimized co-existence schemes and adapted to various radios and configurations.

The Links family leverages the newly rebranded Ceva-Waves portfolio of wireless connectivity IPs, formerly known as RivieraWaves. Ceva-Waves Links100, an integrated, low power, Wi-Fi 6/Bluetooth 5.4/802.15.4 communications subsystem IP for IoT applications is the first IP available in this family and is currently being deployed by a leading OEM customer.

The demand for smaller, low-cost, high-performing, innovative devices with versatile connectivity is driving the need to consolidate multiple connectivity protocols in a single chip. ABI Research reflects on the move from module-level integration to on-die chip integration and forecasts that Wi-Fi plus Bluetooth combo chipset shipments will approach 1.6 billion chips annually by 2028.

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