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Samsung Foundry Expands 'Packaging Coalition' with Ten Additional Members

www.businesskorea.co.kr, Jun. 06, 2024 – 

Samsung Electronics is solidifying its alliance to enhance semiconductor packaging technology, aiming to catch up with the packaging technology competitiveness of TSMC, the world's leading foundry in semiconductor contract manufacturing.

According to industry sources on June 5th, Samsung Electronics Foundry has increased its partners in the 2.5 and 3D MDI (Multi Die Integration) Alliance to 30 this year, up from 20 partners last year—an increase of 10 in just one year.

On May 12th and 13th (local time), in Silicon Valley, U.S., Samsung Electronics will host its first workshop for MDI Alliance members at the "Samsung Foundry Forum 2024." The MDI Alliance, launched by Samsung Electronics in June last year, is a coalition formed to freely implement 'chiplet' and 'heterogeneous integration' technologies necessary for semiconductor packaging. Chiplets involve designing and manufacturing small chip fragments that separate functions from existing chips, which are then integrated into a single chip through post-processing technology. This technology combines central processing units (CPUs), graphics processing units (GPUs), and high-bandwidth memory (HBM) into a single 'heterogeneous integration' packaging.

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