- 2-16Gbps Die-to-Die (D2D) Multi-Protocol IO Supporting BOW, OHBI and UCIe
- 25-112Gbps Extra Short-Reach (XSR) Multi-Standard SerDes (MSS)
- D2D PHY (Die-to-Die Interface)
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electronicdesign.com, May. 15, 2025 –
Synopsys’ Mick Posner talks about the Universal Chiplet Interconnect Express and its importance in today’s designs.
The UCIe Consortium’s Universal Chiplet Interconnect Express (UCIe) specification is in its second iteration. It targets designs built around chiplets providing the interconnect between die. The die-to-die standard defines a complete stack from the physical layer on up.
UCIe has quite a following, including Synopsys, which provides IP as well as design tools that support UCIe. I talked with Mick Posner, Vice President of Product Management at Synopsys, about UCIe and what it involves from design to testing.
UCIe supports a multi-vendor ecosystem for system-on-chip (SoC) designs using chiplets. It complements other die-to-die interconnects like the Open Compute Project’s bunch-of-wires (BOW) specification.
The UCIe 2.0 specification added features like optional manageability and the UCIe DFx Architecture (UDA). It defines a management fabric within each chiplet to support telemetry, testing, and debug services to provide a unified approach to chip management. The new specification is backward compatible with features like spare link, which allows for continued operation when another link fails.
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