In this issue
• Faraday Unveiled FPGA-Go-ASIC Prototyping Platform to Accelerate FPGA-to-ASIC Conversion
• MIPI UniPro v2.0 Doubles Peak Data Rate and Delivers Greater Throughput and Reduced Latency for Flash Memory Storage Applications
• Samsung Foundry Achieves 2X Productivity on Large-Scale Analog and Mixed-Signal IP with the Spectre FX Simulator
• STMicroelectronics and GlobalFoundries agreed to build a steel factory in France for production of chips on 300-mm FDSOI substrates
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