D&R News Alert
www.design-reuse-embedded.com
www.design-reuse.com
www.design-reuse-china.com
May 20th, 2024
In this issue
• Demonstrating the UCIe Chiplet Interconnect
• AiM Future Brings GenAI Applications to Mainstream Consumer Devices
• Qualitas Semiconductor expands presence in chinese market through strategic partnership with chinese chip design company
$var->USER_FIRSTNAME

Welcome to the issue of May 20th, 2024 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

Webinar: Addressing Real-Time Workloads in
Automotive Applications with Efficient ARC-V™ Processors
Synopsys
When: Thursday, May 30, 2024 | 10:00-11:00 a.m. PDT
By Rich Collins - Sr. Product Management Director
Register Now >>

Foundry News
■TSMC Reportedly Prepares Next-generation HBM4 Manufacturing, Utilizing 12nm and 5nm Process Nodes
Packaging Technology
■Demonstrating the UCIe Chiplet Interconnect
Analog, Interface and Connectivity IP

Products
 ❖ Rambus CXL IP: A Journey from Spec to Compliance

New Products
 ❖ 16 bit, 5 Msps DAC - Omni Design Technologies
❖ DDR5 Registering Clock Driver (RCD) - MAXVY Technologies

Analog Bits New Silicon Proven IP's

• Scalable LDO, High Accuracy PVT Sensor, Clocks, Droop Detector in N3P
• Patented Pinless PLL's and Sensors in N3, N4, N5
• Automotive Grade SERDES, PLL's, Sensors and IOs in N5A
See demo at www.analogbits.com

Artificial Intelligence
■RaiderChip raises 1 Million Euros in seed capital to market its innovative generative AI accelerator: the GenAI v1
■AiM Future Brings GenAI Applications to Mainstream Consumer Devices
■Softbank’s Arm new AI chips ready by 2025, aims to become an AI powerhouse
■South Korea Reportedly Plans to open AI Chip Center in San Jose
Blog
 ❖ How AI is augmenting design tools

Wireless
■High-Speed Data Transmission Enhanced by 28nm JESD204B Tx PHY & Controller IP Cores Licensed for MCU Applications
New Products
 ❖ eDP 1.5a RX PHY Samsung 14nm - Qualitas Semiconductor

AiM Future GAIA NPU IP & Synabro SDK

• Advanced Generative AI Architecture
• Concurrent multimodal inferencing at the edge
• Configurable, synthesizable, scalable to 100s of TOPS
• Host CPU agnostic – Arm, RISC-V, x86
Learn more >>

Automotive
■CFX announces commercial availability of low cost automotive grade SonoS based charge trapping EFlash/MTP technology on 90nm BCD process
■TSMC plans automotive chiplet process for 2025
Products
 ❖ Functional Safety for Control and Status Registers

New Products
 ❖ CAN XL Controller - Digital Core Design

Green Electronics
■Next-generation sustainable electronics are doped with air
Partner News
■Qualitas Semiconductor expands presence in chinese market through strategic partnership with chinese chip design company
Finance News
■Solid second-quarter performance – Outlook confirmed
■M31 Q1 Revenue Increases 9.3% YoY, Advanced Processes Drive QoQ Growth







HBM3 PHY IP on TSMC N5
• Low latency, small area, low power
• Compatible with JEDEC standard HBM3 DRAMs

What they said at
IP SoC Silicon Valley 24

Interview with Randy Caplan - VP/Co-Founder - Silicon Creations

Interview with Farzad Zarrinfar - Innosilicon

Interview with Bart Keppens - Chief Business Development - Sofics

Interview with Justin Endo - Marketing & Sales - Mixel, Inc.

Interview with Geir Eide - Director, Product Management - Siemens EDA

Interview with Jayson Bethurem - VP Marketing - Flex Logix Technologies, Inc.

Interview with Ravi Thummarukudy - Mobiveil Inc.

REGISTER:
If this newsletter was forwarded to you by a colleague, you can have it sent directly to you at no cost. To register for D&R SoC News Alert, go to: https://www.design-reuse.com/users/signup.php

UPDATE YOUR PROFILE / UNSUBSCRIBE :
You are subscribed as $var->USER_MAIL and you receive this Alert in html format.

* If you wish to unsubscribe, you can do it there:
https://www.design-reuse.com/users/alert.php?u=$var->USER_ID&e=$var->USER_MAIL