www.design-reuse-embedded.com
Find Top SoC Solutions
for AI, Automotive, IoT, Security, Audio & Video...
You are here : design-reuse-embedded.com  > Artificial Intelligence  > Interconnect for AI

1 - 33Gbps Die-to-Die SerDes PHY (AXDieIO), connectivity for AI

Overview

The AXDieIO IP utilizes the silicon-proven AXLinkIO transceiver architecture for die-to-die, in package, type of channel links.

Partner with us

List your Products

Suppliers, list and add your products for free.

More about D&R Privacy Policy

© 2024 Design And Reuse

All Rights Reserved.

No portion of this site may be copied, retransmitted, reposted, duplicated or otherwise used without the express written permission of Design And Reuse.