D&R News Alert
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January 11th, 2024
In this issue
• GUC Tapes Out Complex 3D Stacked Die Design on Advanced FinFET Node Using Cadence Integrity 3D-IC Platform
• Packetcraft and Synopsys Collaborate to Deliver Turnkey Bluetooth Qualified 5.4 PAwR and LE Audio Solutions
• Ceva and THX Ltd. Partner to Bring Premium Spatial Audio to Hearables, Consumer and Mobile Products
• VeriSilicon extends watch GUI ecosystem in partnership with QDay Technology for enhanced user experience
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Welcome to the issue of January 11th, 2024 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

Foundry and Technology
Chiplet News
Products
 ❖ GUC Multi-Die interLink (GLink 2.3) IP
❖ Certus 600MBps Low Power D2D Interface in 16nm

Products
 ❖ Optimizing Communication and Data Sharing in Multi-Core SoC Designs

Ememory
eMemory OTP's Qualification Breakthrough in Adv. Nodes (N4P) and How it Revolutionized SRAM Repairing
OTP >>

PUF >>
Join our Webinar

Register Webinar >>

Design Platform
Interface IP
RISC-V
Products
 ❖ AndesCore D25F - Compact High-Speed 32-bit CPU Core
❖ MIPS eVocore P8700
❖ Synopsys ARC-V RHX-105 dual-issue, 32-bit multi-core RISC-V processor for real-time applications

Internet of Things
Products
 ❖ Verisilicon OpenVG GPU - Open Vector Graphics IP

Cadence
 We are at CES 24 (Jan 9-12)
  • Meet with key Cadence business and technology leaders
  • Hear about Tensilica, PCIe, and CXL solutions for consumer, automotive, and industrial markets
  • See exciting demonstrations.
Where: at the Venetian Expo, Level 2, Bellini 2101B. >>>

Artificial Intelligence
Wireless Communication
Products
 ❖ Packetcraft Bluetooth LE Controller with Link Layer and optional 802.15.4 MAC
❖ Sub-GHz 433, 868, 915MHz IEEE 802.15.4 RF Transceiver IP

Article
 ❖ BLE Set to Dominate Indoor Positioning Systems

Audio
Products
 ❖ CEVA RivieraWaves Bluetooth 5.4 Low Energy Baseband Controller / Link Layer, software and profiles
❖ CEVA Spatial Audio & Head Tracking Solution

Trilinear Collaborative DisplayPort Solutions
• Industry Expert Support From Pre-to-Post Silicon
• PHY Integration Included, Always
• Custom Display IP Designed For Your Project
Learn more

Automotive
Products
 ❖ Verisilicon Image Signal Processor IP
❖ Curious Automotive MIPI A-PHY Sink IP (2-Lane)

Security
Products
 ❖ Crypto Quantique Quantum-Driven Identity

Green Electronics
Partner News
Business News






What they said at
IP SoC Conference 23

Vince Wu - Sales Manager and Niraj Dengale - Senior Engineer - Andes Technology Corp.

Graeme Hickey - VP Engineering - PQShield

Chouki Aktouf - Co-Founder - Innova Advanced Technologies

Alexander Kovalevsky - Principal Engineer - NTLab

Welcome : Innovation in semi conductor industry
Gabrièle Saucier, CEO, D&R

Empowering Innovation in the Age of Custom Silicon
Eric Lalardie, Director, Arm Ltd.

Greening the Road Ahead: Revolutionizing the Automotive Industry with FD SOI Technology
Philippe Flatresse, Product Marketing, SOITEC

Technologies enabling future mobile connectivity & sensing
Francois Brunier, Partnership Program Manager, SOITEC

Digital Beamforming design in mmW: A 22nm FDSOI transceiver practical case
Jérôme Prouvée, Layout Engineer & Project Manager, CEA

Meeting the Needs of AI Training with HBM3
Philip Van Den Heuvel, Regional Sales Manager, Rambus, Inc.

Innovative Integrated IP SoC Design for Edge AI
Tim Menasveta, Director of IoT Product Management, Arm Ltd.

The Lossless Compression Challenge: from Networking to Data centers
Dr. Calliope-Louisa Sotiropoulou, Sales Engineer, CAST, Inc.

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