USB 3.0 femtoPHY in TSMC (28nm, 22nm, 16nm, 12nm)

Overview

The Synopsys USB-C™ 3.0 and USB 3.0 femtoPHY IP provide designers with a complete physical (PHY) layer IP solution for low-power mobile and consumer applications such as digital cameras, networking and storage as well as next– generation feature-rich smartphones, tablets, digital TVs and media players requiring high throughput USB capability. The Synopsys USB-C 3.0 femtoPHY also offers support for the reversible USB Type-C™ connector. Offering reduced silicon cost and longer battery life, the Synopsys USB-C and USB 3.0 femtoPHY IP offers a small die size with low power consumption. The Synopsys USB-C 3.0 femtoPHY is optimized to reduce pin count by 40% compared to dual-PHY solutions and removes the need for external switch components.

Tech Specs

Part Numberdwc_usb3_femtophy_otg_tsmc
Short DescriptionUSB 3.0 femtoPHY in TSMC (28nm, 22nm, 16nm, 12nm)
Provider
Maturity Available on request
FoundryTSMC
Geometry nm12, 16, 22, 28
Target Process NodeTSMC 28nm, 22nm, 16nm, 12nm - HPM, HPC, HPC+, ULP, FF+LL, FF+GL, FFC
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