D&R IP-SoC China 2023 Day 是中国首个完全致力于IP（硅知识产权）和基于IP电子系统的独特全球性活动。
作为芯片设计业创新的种子，IP-SoC展商受邀展示他们最新的产品和服务，并分享他们对半导体行业下一步创新的展望。
IP用户可以一目了然地查看最新的技术趋势和令人兴奋的创新IP/SoC产品。通过全局视角，电子系统领袖可以识别颠覆性创新，带来新的细分市场增长。
本活动将是一次线下面对面会议。为了增强市场关注度，演讲材料和视频将同时发布在 www.design-reuse-china.com 和Youku上。
有任何问题吗？请与我们联系。
Registration and Exhibition installation opens at 7 am. Event closes at 6 pm.
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This year will also be the celebration year of D&R 25th anniversary
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Thus in a welcome session, gurus from various IP business fields will deliver their vision about the past quarter of century of IP business and give their prediction about the trends for the next decade.
- Introduction Session - Chair person : Dr Hao NI, SMIC
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9.00 am
Welcome
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- 欢迎共建全球IP SOC社区
Gabrièle Saucier
CEO & Founder
Design And Reuse
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中国集成电路产业现状与IP核业务趋势
徐步陆
Vice Director
上海硅知识产权交易中心总顾问 汤天申 博士
with 汤天申
General Consultant
上海硅知识产权交易中心总顾问 汤天申 博士
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10.00 am
Break
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10.30 am
Multi-Die Systems
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Chiplet and Die-to-Die (D2D) Interface Interoperability - How to Accelerate the Path to an Open Ecosystem
郭大瑋
Sr. Director of Sales
Alphawave Semi
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通过UCIe揭示芯粒系统的未来
耿睿
主任应用工程师
新思科技解决方案事业部
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11.15 am
Automotive
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芯动科技汽车电子全套解决方案
谌彤
产品总监
Innosilicon Technology Ltd
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接口IP--为汽车搭建“智慧神经网络”，为智能驾驶保驾护航
黄浩然
Product Marketing Director
AkroStar Technology Co., Ltd.
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Tensilica Xtensa 下一代体系架构 LX8 处理器平台
Wei Wang
AE Director
Cadence Design Systems, Inc.
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12.15 pm
Lunch Break
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- Session 1 - Chair person : Mark MA, Jiatao
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1.00 pm
RISC-V and Heterogeneous Computing
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RISC-V：性能全方位优化
张岩
SiFive 首席现场应用工程师
Sifive, Inc.
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RISC-V processor IP product line
Alexander Kozlov
CTO
CloudBEAR
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全球首个RISC-V大小核IP子系统
Jay Zhou
Starfive
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统一的超异构并行计算生态
Wenke Zhao
HSA BU G.M
上海硅知识产权交易中心异构计算总监 赵文科 博士
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2.20 pm
Break
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2.50 pm
Video and Imaging Solutions
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面向智能显示设备的超分辨率技术
毛夏飞
芯原股份机器学习软件高级总监
VeriSilicon Microelectronics (Shanghai) Co., Ltd.
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创新的视频标准 – LCEVC
韦裕京
亚太区商务副总裁
Allegro DVT
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Leveraging VESA Video Compression & MIPI DSI-2 for High-Performance Displays
Visually lossless video compression is essential for handling the growing bandwidth requirements of cutting-edge displays with higher resolutions, faster refresh rates, and greater pixel depths. This presentation will show designers how they can deve lop cutting-edge display products without compromising on display quality, battery life or cost using a combination of VESA video compression and MIPI DSI-2 technology.  ... 
Larry Lai
SMTS现场应用工程师
Rambus, Inc.
Online Only
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视频 IP 解决方案的现在和未来
Summer Yoon
Technical PR Manager
Chips&Media, Inc.
Online Only
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3.30 pm
Break
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4.00 pm
Artificial Intelligence
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适用大模型AI芯片的接口IP
Arno Li
AE Director
Cadence Design Systems, Inc.
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WhisperExtractor: Enabling μW Voice AI for Always-On Applications
Lida CAI
China FAE Manager
Dolphin Design
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多媒体接口在边缘人工智能市场的最新进展
许可
资深产品市场经理
新思科技解决方案事业部
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Neural-network Processing Unit hardware-software co-design IP
Luba Tang
CEO
Skymizer Inc.
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5.30 pm
END
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- Session 2 - Chair person : Bulu Xu, SSIPEX
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1.00 pm
Memory and Storage
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通过 Mobiveil 的内存、存储和 5G IP 解决方案保持领先地位
Ravi Thummarukudy
首席执行官
Mobiveil Inc.
Online Only
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LPDDR5/DDR5 Design Challenges & The Need for Flexibility
With the introduction of DDR5/LPDDR5, the latest DDR standards have surpassed beyond 5Gbps peak data rates and are rapidly approaching 10Gbps. However, DDR technologies' physical channels have remained relatively unchanged, exposing bandwidth limitat ions as data rates advance. At the same time, designing memory subsystem IPs that address a wide range of DRAM configurations, DRAM vendors, and platform options is becoming a real challenge. In this context, OPENEDGES' unique design flow and architecture prove to be a game-changer, effectively tackling these challenges and delivering the best-in-class customer experience. By offering platform flexibility, accelerated bring-up, and performance optimization, OPENEDGES' memory PHY integrates the proprietary microcontroller Programmable State Machine (PSM) network, which effectively addresses market needs. This multi-threaded PSM architecture meets real-time and speed capabilities but also provides full coverage verification capabilities from the design stage to ultra-fast in-silicon debugging and customization. ...
Richard Fung
CEO of The Six Semiconductor
OPENEDGES Technology, Inc.
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1.45 pm
Break
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2.15 pm
Interface Solution
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高性能计算IP“三件套”推动HPC芯片创新
高专
副总裁/技术总监
Innosilicon Technology Ltd
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PCIe 6.0与CXL 3.0 开创高速数据传输的无限可能
张小林
资深产品市场经理
新思科技解决方案事业部
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3.00 pm
Break
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3.30 pm
Monitoring and life cycle management
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利用 RISC-V 的嵌入式追踪技术管理风险
RISC-V 架构在芯片设计领域崭露头角，但也面临着一些风险和挑战。首先， 0001;于 RISC-V 是相对较新的架构，其生态系统和软件工具的支持相对较少，此外 RISC-V 架构的可扩展性和性能也是关键问题。如何实现高性能、低功耗和高效能的芯片设计是一个复杂的任务，需要仔细的架构优化和系统级设计。 ...
Yifan Li
Siemens - Tessent Embedded Analytics
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芯片生命周期管理的重要推动因素
余建
新思科技EDA事业部- 硬件分析和测试解决方案高级经理
新思科技解决方案事业部
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Second Source Management - the solution to securing product delivery
Fionn Liu
Thalia
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4.30 pm
Break
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4.45 pm
Security Solutions
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Secure-IC安峪科技: 从芯片到云端采用后量子密码学的网络物理安全
To ensure a fully managed and secure end-to-end cybersecurity solution, it is necessary to have full control over the product lifecycle and its security. Lifecycle management solutions cover the different stages of a product life: from IC design, se curity evaluation and certification, manufacturing to field deployment and then the decommissioning of devices that include those ICs. To ensure the security at all stages, Secure-IC offers a fully comprehensive solution that ensures product security is maintained, and that each stakeholder only has access to the relevant functions and services at each step of the product’s life. Especially for connected devices lifecycle management, a complete chip to cloud solution that enables provisioning, device management, device monitoring and device identity management, and offers differentiated security services for chip manufacturers and users can bring high additional value to the products. This approach comes in combination with having a scalable integrated Secure Element on the Embedded Edge device side. The challenge of lifecycle security management is also now impacted by the emergence of PQC (Post-Quantum Cryptography). Secure-IC will address those questions and propose an approach from chip security hardware solution to Chip-to-Cloud complete security solution. ...
Shengnan Wang
General Manager China
Secure-IC
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支撑，共享与安全 芯片开发中的数字资产管理
Pei Li
李培，龙智大规模安全研发技术专家
上海龙智数码科技股份有限公司
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5.30 pm
END
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