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D&R IP SoC Day
South Korea
September 16th, 2025

Co-organized with:
ksia

When : September 16th, 2025

Where: COEX Conference Rooms 317 and 318
3rd Floor, COEX, 513 Yeongdong-daero, Gangnam-gu, Seoul, 06164, South Korea




A worldwide connected Event !!

D&R IP-SoC South Korea 2025 Day is the unique worldwide event fully dedicated to IP (Silicon Intellectual Property) and IP based Electronic Systems.

IP-SoC providers, the seed of innovation in Electronic Industry, are invited to highlight their latest products and services and share their vision about the next innovation steps in the Electronic Industry.

IP consumers can view at a glance the latest Technology trends and exciting Innovative IP/SoC products. Through a global view, Electronic systems leaders may identify disruptive innovation leading to new market segment growth.

Physical meeting between vendors and consumers is the unique and non-replaceable vehicle to engage business discussions between vendors and clients. Nevertheless this event will also be "replicated" on line after the event aiming at triggering more business opportunities. Posting their talk and recording their presentations on easily accessible platforms will extend innovation sharing among the worldwide IP-SoC Community.

Any question? Please contact us



First Contributions - More to come



Welcome Session
  • Event introduction, KSIA
  • Welcome to the IP SoC community, Design and Reuse

Chiplets and Network on Chip
  • How UCIe is Progressing to enable Chiplets, Synopsys, Inc.
  • Mastering UCIe 2.0: Overcoming Fabric Management Hurdles for Chiplet Integration, Siemens EDA
  • UCIe IP for the AI Era: Cadence High-Bandwidth, Low-Latency Solution, Cadence Design Systems, Inc.
  • Updated Methodology to Generate Optimal NoC in 2025, Arteris

Analog and Memory IP
  • Analog IP Solution for SAMSUNG Foundry, LeoLSI
  • Advancing Power Telemetry, Movellus, Inc.
  • SLM PVT Monitors IP Overview, Synopsys, Inc.
  • Ensuring NVMe Infrastructure Readiness: Verification Before Live Migration, Siemens EDA

Automotive
  • Advanced Automotive AI/ML Networks, Quadric
  • High-performance LPDDR IP Solution for Automotive AI, OPENEDGES Technology, Inc.

Video IP
  • CFrame60 - Frame Buffer Compression for bandwidth reduction using lossy/lossless techniques in video processing, Chips&Media, Inc.
  • AV1 Video Encoder IP for Data Center-Grade Quality, BLUEDOT

High Performance Computing
  • Building Tomorrow Today: Enabling the Future of HPC With 4lynx’s High-Performance PVT Monitoring Solutions, 4lynx, Inc.
  • Shaping the Future of High-Performance Chips: DRAM, SerDes, and Chiplet IP Innovations, Innosilicon Technology
  • Vector Data Processing Unit, Dnotitia
  • Efficient Lossless Compression: Trade-offs, Performance of Algorithms and IP Cores, CAST,Inc.

Artificial Intelligence
  • Scalable, Flexible Edge AI accelerator - Silicon-Proven IP for Smart-X and Robotics, AiM Future, Inc.
  • Unlocking Generative AI at the Edge: How LPDDR enables Scalable & Efficient Intelligence, Rambus, Inc.
  • The Next Evolution of AI: Edge First!, Ceva, Inc.
  • Image compression for AI and machine learning, intoPIX

Security Solutions
  • Securing the Future: Challenges and Solutions in Post-Quantum Cryptography, Secure-IC
  • Error-Redundant Implementation of Commercial IP Cores: A Practical Example, SmartDV Technologies
  • Protecting Data in Motion with MACsec, Rambus, Inc.
  • Integrated, Scalable, Proven: Why Security IP Outclasses Custom Approaches, Kudelski Labs

And more to come...


Exhibitors

  • 4lynx
  • AiM Future, Inc.
  • Arkchips
  • BLUEDOT
  • Brite Semiconductor (Shanghai) Co., Ltd.
  • BTREE Co. Ltd.
  • Cadence Design Systems, Inc.
  • CAST Inc.
  • Chips&Media, Inc.
  • IntoPIX
  • LeoLSI
  • OPENEDGES Technology, Inc.
  • Quadric
  • Qualitas Semiconductor
  • Silicon Storage Technology
  • SmartDV Technologies
  • Wellang


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