IP SoC China 26
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Exhibition
When : September 10th, 2026

Where: No.669 Shengxia Road, JiYunTianDi Building T3,
Pudong New Area, Shanghai, China
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Join D&R IP SoC China 26 !!        A worldwide connected Event !!
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Co-organized with:
Shanghai EDA/IP Innovation Center
In association with:
   Shanghai Silicon Intellectual Property Exchange Co.,Ltd
   Shanghai Jiatao Industrial Co.,LTD.
A worldwide connected Event !!

D&R IP-SoC China 2026 is the unique worldwide Spring event fully dedicated to IP (Silicon Intellectual Property) and IP based Electronic Systems.

IP-SoC providers, the seed of innovation in Electronic Industry, are invited to highlight their latest products and services and share their vision about the next innovation steps in the Electronic Industry.

IP consumers can view at a glance the latest Technology trends and exciting Innovative IP/SoC products. Through a global view, Electronic systems leaders may identify disruptive innovation leading to new market segment growth.

The event is a face to face meeting. In order to enhance the market attention the talk material and videos are posted concurrently on www.design-reuse-china.com and Youku.

Any question? Please contact us

9.00 am
Welcome Session
Chairperson: Gabrièle Saucier - Design And Reuse
Welcome to the IP SoC world
Gabrièle Saucier
CEO
Design & Reuse
About me
The AI-Powered IP Era: From Intelligent Design to Intelligent IP
Weijin Dai
Chief strategy Officer
VeriSilicon Microelectronics (Shanghai) Co., Ltd.
About me
Full‑Spectrum RISC‑V IP: Removing Boundaries for Computing
Bob Hu
Founder and Chairman
Nuclei System Technology
About me
9.45 am
Break
10.00 am
AI Chip Architecture I
Architecting the AI Future with RISC-V
Franky Fan
Business Development Director
Sifive, Inc.
About me
RISC-V+DSA: Pioneering a New Paradigm of Specialized Computing for Edge AI Fields
Zeng Yi
CEO
WingSemi Technology
About me
AI ASIC Chip Platform
XU Wei
Senior Design Director,
JoinSilicon
About me
10.45 am
Break
11.00 am
AI Chip Architecture II
Chairperson: Franky Fan - Sifive
YouIP & YouSiP: Dual Engines Powering AI Chip Innovation in the Intelligent Computing Era
Eunice Rao
IP Project Director
Brite Semiconductor
About me
Reshaping AI Chip Architecture: Advances in High-Speed Interface IP and Chiplet Integration
Jing Li
Director of Product Marketing
MSquare Technology
About me
Wasted Voltage Margin is Wasted Performance: Returning Lost Performance to AI Systems
Julian Hu
VP China Sales
Movellus, Inc.
About me
11.45 am
Break
12.00 pm
AI Memory strategy
Chairperson: Insung Jeon, ARTICRON
Scalable Memory-Centric Inference IP Platform
Andy Kwon
Head of Partnerships and Overseas Sales
Articron
About me
Intelligent Edge to AI Data Center: Optimized Memory and Storage IP solutions
Ravi Thummarukudy
Mobiveil Inc.
About me
AI Inference Needs a Mix-and-Match Memory Strategy
Kai Zhao
SPE Field Applications Engineering, Silicon IP
Rambus, Inc.
About me
1.00 pm
Lunch Break
Room 1
Packaging Solutions
Chairperson: Bulu Xu, SSIPEX
High-speed I/F IP solution for the Physical AI Era: From Camera/Display to Chiplet System.
Limo Xiao
Qualitas Semiconductor
About me
From Monolithic SoCs to Chiplets: A New Hardware Security Paradigm
Samuel Chiang
Director of Business Development, Semiconductor IP Partnership
Rambus, Inc.
About me
RAPTuner: An AI-Agent-Friendly Physical-Aware EDA Platform for Single-Die and Die-to-Die Design Optimization
Chin Choi Phaik
SkyeChip
About me
Foundation IP
Chairperson: Bulu Xu, SSIPEX
Synopsys SLM PVT Monitor IP Overview
Xinggang Liu
Sales Account Management, Staff
Synopsys, Inc.
About me
Enabling DTCO Exploration with Automatic Std-Cell Layout Synthesis and Optimization
Yiyun Zhang
Senior Project Manager
Huaxin Jushu (Hangzhou) Microelectronics Co., Ltd.
About me
Empowering SRAM IP Design Efficiency through Advanced EDA Tools
Li-rou Xu
Primarius Tech
About me
Room 2
VPU and GPU
Chairperson: Alex Zhou, Innosail
Scalable VPU IP Widely Deployed in High-Performance AI Servers, Embedded Systems and Ultra-Low-Power Wearables
Qijun Jiang
Vice President of VPU Product
VeriSilicon Microelectronics (Shanghai) Co., Ltd.
About me
GPU Virtualization Technologies
Zack Zheng
product director
Imagination Technologies Group Ltd.
About me
Interface and SoC Design
Chairperson: Alex Zhou, Innosail
High-Speed nterconnects Empower Computing to the Edge
Qing Chang
Marketing Director
KNiulink Semiconductor Ltd.
About me
Breaking the Data Bottleneck: Hardware Compression IP for Next-Generation AI, Storage, and High-Performance SoCs
Dr. Calliope-Louisa Sotiropoulou
Sales Engineering Manager
CAST
About me
Video subsystem
Chairperson: Alex Zhou, Innosail
Why Next-Generation Video Subsystems Need AV2?
Yujing Wei
VP APAC Business Development
Allegro DVT
About me
Automotive and high safety application
Chairperson: Alex Zhou, Innosail
Trust at the Edge: Securing Next-Gen Automotive AI
Matthew Ma
Sr Staff Application Engineering
Synopsys, Inc.
About me
Innovation in Distributed Functional Safety
Qiao Wang
Senior Applications Engineering Manager
Imagination Technologies Group Ltd.
About me
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