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TSMC Celebrates 30th North America Technology Symposium with Innovations Powering AI with Silicon Leadership - Apr. 25, 2024TSMC (TWSE: 2330, NYSE: TSM) today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leader... > Read Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing - Apr. 24, 2024By joining forces with industry leaders in the Arm Total Design ecosystem, Kalray is helping more companies integrate its AI and data-processing solution into their next-generation chips. Kal... > Read |
Numem at the Design & Reuse IP SoC Silicon Valley 2024 - Apr. 25, 2024-- Numem, the pioneering provider of Memory SOC IPs and Chip/Chiplets, is excited to announce that Numem CEO Jack Guedj will discuss cutting-edge memory solutions at the Design & Reuse IP... > Read Credo at TSMC 2024 North America Technology Symposium - Apr. 24, 2024-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO) an innovator in providing secure, high-speed connectivity solutions that deliver improved energy efficiency as data rates and co... > Read |
Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes - Apr. 25, 2024Collaboration on AI-Driven Design Flows for Optimization and Productivity, Advancements in Photonic IC Integration, Plus Broad IP Development on TSMC 2nm Technology -- Synopsys, Inc. (Nas... > Read M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process - Apr. 25, 2024-- M31 Technology Corporation (M31), a leading global provider of silicon intellectual property (IP), announced that the M31 MIPI C/D-PHY Combo IP has obtained silicon validation on the adva... > Read |
Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development - Apr. 25, 2024By Anton Shilov, embedded.com (April 24, 2024) Ceva’s new line up of IPs include Wi-Fi 6, Wi-Fi 7, Bluetooth 5.4, next-generation Bluetooth, narrowband IEEE 802.15.4 (for Thread, Zi... > Read IP block covers Wi-Fi 6, Bluetooth 5.4 dual mode and IEEE 802.15.4 for IoT chips - Apr. 16, 2024Ceva has introduced a multi-radio intellectual property package for IoT IC designers that combines Wi-Fi 6, Bluetooth 5.4 and 802.15.4 modems with a 2.4GHz transceiver aimed at TSMC's 22n... > Read |
Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node - Apr. 24, 2024-- Keysight Technologies, Inc. (NYSE: KEYS), Synopsys, Inc. (Nasdaq: SNPS), and Ansys (Nasdaq: ANSS) introduce a new integrated radio frequency (RF) design migration flow from TSMC's N... > Read |
Alphawave Semi Audited Results for the Year Ended 31 December 2023 - Apr. 23, 2024– Alphawave IP Group plc (LSE: AWE, the “Company” or “Alphawave Semi”), a global leader in high-speed connectivity for the world’s technology infras... > Read Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets - Apr. 23, 2024QUALITAS SEMICONDUCTOR CO., LTD. (QUALITAS) (KOSDAQ: 432720), a leading provider of interconnect solutions, proudly announces the appointment of HongKong HuaSun Rich Point Technology Ltd. (HS... > Read Cadence Reports First Quarter 2024 Financial Results - Apr. 23, 2024Record First Quarter Backlog of $6.0 Billion and cRPO of $3.1 Billion Raising 2024 Revenue Outlook -- Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced results for the first qua... > Read |
Siemens and Mercedes-Benz Transform Future of Sustainable Factory Planning with Digital Energy Twin - Apr. 23, 2024Siemens and Mercedes-Benz have collaboratively developed a Digital Energy Twin to facilitate the future of sustainable factory planning in the automotive industry. Under a strategic p... > Read Faraday Partners with Arm to Innovate AI-driven Vehicle ASICs - Apr. 18, 2024Faraday Technology Corporation (TWSE: 3035), a leading provider of ASIC design services and IP solutions, announced it is leveraging the latest Arm® Automotive Enhanced (AE) technology, l... > Read |
Controversial former Arm China CEO founds RISC-V chip startup - Apr. 22, 2024A number of former Arm China employees have reportedly followed Allen Wu to new venture The ex-chief executive of Arm China, Allen Wu, has reportedly founded a RISC-V chip company to potentia... > Read Brazil and Europe sign innovative project with RISC-V technology for HPC - Apr. 15, 2024An international collaboration between BSC and Instituto ELDORADO will enable Brazil to develop open-source RISC-V technologies to accelerate research and development in the areas of semicon... > Read VISC: The New Coprocessing RISC-V Architecture for AI Efficiency - Apr. 13, 2024Red Semiconductor has announced the availability of its Versatile Intrinsic Structured Computing (VISC) architecture for RISC-V. VISC is an extension to RISC-V IP that accelerates complex alg... > Read |
DVB-S2X Wideband LDPC/ BCH Decoder IP Core Available For Integration From Global IP Core - Apr. 19, 2024- Global IP Core Sales - The DVB-S2X LDPC Decoder is a powerful FEC core decoder for Digital Video Broadcasting via Satellite. It implements extensions to the DVB-S2X design for better perfo... > Read Fraunhofer IIS offers JPEG XS plugin for NVIDIAs Holoscan for Media Architecture - Apr. 16, 2024The Fraunhofer Institute for Integrated Circuits IIS today announces it has developed JPEG XS plugins and microservices especially designed for seamless data processing and exchange with NVI... > Read |
GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers - Apr. 19, 2024– Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that the GLink-3D interface (GUC’s Link for 3D die stacking) for the TSMC 3DFabric SoIC-X 3D stacking pl... > Read |