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- IP-SoC Days 2026
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- YorChip and Sofics Expand UCIe PHY Across TSMC Nodes (Jan. 23, 2026)
- PlexusAV And IntoPIX Strengthen IPMX Ecosystem With New P-AVN-4 Featuring JPEG XS TDC (Jan. 23, 2026)
- Cadence Unveils Tensilica HiFi iQ DSP Purpose-Built for Next-Generation Voice AI and Audio Applications (Jan. 22, 2026)
- Dolphin Semiconductor Marks its First Anniversary with Major Expansion Push and Active Merge & Acquisition Strategy (Jan. 22, 2026)
- Why Quobly, STMicro, Soitec See Quantum as a Manufacturing Challenge (Jan. 22, 2026)
- Samsung Reportedly Moves Custom HBM Logic Die to 2nm Foundry Process for the First Time (Jan. 22, 2026)
- Siemens Introduces New Type of Digital Twin Software for SDV Development (Jan. 22, 2026)
- 'ReRAM is the replacement for (NAND) flash': $170 billion US tech company backs tiny startup in race to find the holy Grail of universal memory (Jan. 22, 2026)
- TES offers PKCS IP Core for System-on-Chip (SoC) Designs (Jan. 22, 2026)
- Spiking Performance in AI Applications (Jan. 22, 2026)
- EU Council backs creation of AI gigafactories in Europe (Jan. 22, 2026)
- Keysight Collaborates on Airbus UpNext SpaceRAN Demonstrator to Advance 5G NTN Innovation (Jan. 22, 2026)
- Italy’s Quiet Exposure to China in Automotive and Power Chips (Jan. 22, 2026)
- CEA-Leti Advances Silicon-Integrated Quantum Cascade Lasers for Mid-Infrared Photonics (Jan. 22, 2026)
- CEA-Leti Demonstrates Combined MicroLED and Organic Photodetector Architecture For Display-Integrated Optical Sensing (Jan. 22, 2026)
- Synopsys Announces New Converge Conference, March 11-12, to Drive Intelligent Systems Innovation (Jan. 22, 2026)
- Vietnam breaks ground on first semiconductor chip plant in Hanoi (Jan. 22, 2026)
- T2M Presents TGE200 RISC-V IP Core: Ultra-Low-Power for IoT & MCU Platforms (Jan. 19, 2026)
- Samsung to close down one of its 8-inch foundry fabs within the year (Jan. 19, 2026)
- Samsung perfecting 2nm Exynos 2600 yields, TSMC eyes 1.6nm in 2026 (Jan. 19, 2026)
- Breakthrough in silicon switches: Prof. Hua Wang’s IDEAS Group presents new class of high-frequency switches in "Nature Electronics" (Jan. 19, 2026)
- SiFive to Power Next-Gen RISC-V AI Data Centers with NVIDIA NVLink Fusion (Jan. 19, 2026)
- Processors for Smart Manufacturing (Jan. 19, 2026)
- Chips&Media Accelerates AI-Based Video IP Evolution and Autonomous Driving Reference Expansion (Jan. 19, 2026)
- TSMC Will Struggle to Meet AI Demand for Years, Analysts Say (Jan. 19, 2026)
- Keysight Unveils Machine Learning Toolkit to Accelerate Device Modeling and PDK Development (Jan. 19, 2026)
- Defending the Digital Highway: Cybersecurity for Software-Defined Vehicles (Jan. 19, 2026)
- NVIDIA Includes Ethernet Photonics in New Six-Chip AI Rubin Platform (Jan. 19, 2026)
- Why PICs Power Next-Gen Data Centers and Quantum-Safe Security (Jan. 19, 2026)
- TSMC Reports Fourth Quarter EPS of NT$19.50 (Jan. 19, 2026)
- Portugal enters the European semiconductor map (Jan. 19, 2026)
- Sassine Ghazi 2026 Letter to Stakeholders: Re-engineering Engineering in the Age of AI (Jan. 19, 2026)
- Quadric's SDK Selected by TIER IV for AI Processing Evaluation and Optimization, Supporting Autoware Deployment in Next-Generation Autonomous Vehicles (Jan. 16, 2026)
- Quadric, Inference Engine for On-Device AI Chips, Raises $30M Series C as Design Wins Accelerate Across Edge (Jan. 16, 2026)
- SST and UMC Announce Immediate Availability of 28nm SuperFlash® Gen 4 Automotive Grade 1 Platform (Jan. 16, 2026)
- QuickLogic Announces Orders for Strategic Radiation Hardened FPGA Development Kit (Jan. 16, 2026)
- eMemory and PUFsecurity’s PUFPQC Achieves NIST FIPS 205 and SP 800-208 Certification, Reaching a Milestone in Comprehensive Post-Quantum Cryptography Protection (Jan. 16, 2026)
- 5 Chiplets Design Challenges Hampering Wider Take-off (Jan. 15, 2026)
- Inside CEA-Leti’s Push to Industrialize MicroLED Interconnects (Jan. 15, 2026)
- Innosilicon ships 14.4 Gbps LPDDR6 IP to its first customers (Jan. 15, 2026)
- A Cost-Effective Solution for Monitoring Aging Infrastructure (Jan. 15, 2026)
- The Countdown: Preparing Manufacturing Systems for the Post-Quantum Era (Jan. 15, 2026)
- Ceva Expands Edge AI Portfolio From Wearables to SDVs (Jan. 15, 2026)
- AI Boom Reshapes Global Semiconductor Supply Chains (Jan. 15, 2026)
- Photonics Lights Up Canada’s Semiconductor Scene (Jan. 15, 2026)
- Leonardo launches the course "Climate Action 2026", for a more sustainable Supply Chain (Jan. 15, 2026)
- Intel, Infineon, Synopsys Back European Scaleup Program (Jan. 15, 2026)
- Interview: Weebit Nano, TI, and the Future of Resistive RAM (Jan. 15, 2026)
- Siemens acquires ASTER Technologies to deliver industry-leading PCB test engineering solutions (Jan. 15, 2026)
- Samsung’s Non-memory Chip Business Signals Return to Profitability This Year (Jan. 15, 2026)
- TES is introducing a new 10-bit SAR ADC IP for XFAB’s XT018 technology. (Jan. 15, 2026)
- Cadence Delivers Enterprise-Level Reliability with Next-Gen Low-Power DRAM for AI Applications Featuring Microsoft RAIDDR ECC Technology (Jan. 14, 2026)
- GlobalFoundries to Acquire Synopsys’ Processor IP Solutions Business, Expanding Capabilities to Accelerate Physical AI Applications (Jan. 14, 2026)
- Arteris Closes Acquisition of Cycuity (Jan. 14, 2026)
- LTSCT and Andes Technology Sign Strategic IP Licensing Master Agreement to accelerate RISC-V Based Advanced Semiconductor Solutions (Jan. 13, 2026)
- Microservice Store Launches "embedded Microservice Runtime", The Foundational Technology Powering a Secure Marketplace for IoT Devices (Jan. 12, 2026)
- Quintauris Demonstrates RISC-V Innovation in Automotive at CES (Jan. 12, 2026)
- Quintauris and SiFive Announce Partnership to Advance RISC-V Ecosystem Development (Jan. 12, 2026)
- T2M Presents TGE100 RISC-V CPU Core: Ultra-Low-Power Computing for Area-Constrained IoT and MCU Platforms (Jan. 12, 2026)
- TSMC to Lead Rivals at 2-nm Node, Analysts Say (Jan. 12, 2026)
- Samsung Electronics Gets Green Light in Foundry Business (Jan. 12, 2026)
- Energy-efficient RF power modules developed using SOI technology (Jan. 12, 2026)
- 6 Snapshots Show RISC-V Solidifying Its Stronghold in Products and Plans (Jan. 12, 2026)
- SiMa.ai Announces First Integrated Capability with Synopsys to Accelerate Automotive Physical AI Development (Jan. 12, 2026)
- Faster SDV development with IPG Automotive and Synopsys collaboration (Jan. 12, 2026)
- Keysight Achieves Industry-Leading Live NR-NTN Connectivity in n252 S-Band, Including Satellite-to-Satellite Mobility, in Collaboration with Samsung (Jan. 12, 2026)
- Polymage Labs ties up with US-based Tenstorrent to develop AI compiler (Jan. 12, 2026)
- Soluna and Siemens Collaborate to Solve GPU Power Swings in Behind-the-Meter AI (Jan. 12, 2026)
- 6G standardisation moves closer as 2026 begins (Jan. 12, 2026)
- EnSilica reports strong revenue growth, improved profitability (Jan. 12, 2026)
- TSMC Reportedly Plans Mature-Node Tool Shift to Singapore, Accelerates Exit as Arizona Expands (Jan. 12, 2026)
- Pixelworks Completes Previously Proposed Sale of its Shanghai Semiconductor Subsidiary to VeriSilicon (Jan. 12, 2026)
- Soitec Board of Directors appoints Laurent Rémont Chief Executive Officer, effective April 2026 (Jan. 12, 2026)
- TES offers CAN Flexible Data-Rate Controller IP Core for System-on-Chip (SoC) Designs (Jan. 09, 2026)
- Digital Blocks DB9000 Display Controller IP Core Family Extends Leadership in 8K, Automotive, Medical, Aerospace, and Industrial SoC Designs (Jan. 08, 2026)
- BAE Systems Licenses Time Sensitive Networking (TSN) Ethernet IP Cores from CAST (Jan. 08, 2026)
- TSMC's 2nm chips: The results are out. (Jan. 08, 2026)
- CES 2026: Intel Core Ultra Series 3 Debut as First Built on Intel 18A (Jan. 08, 2026)
- AMD, NVIDIA and Others Reportedly to Debut New Chips at CES 2026, Spotlighting TSMC 3nm and 5nm (Jan. 08, 2026)
- MIPS S8200 Delivers Software-First RISC-V NPU To Enable Physical AI at the Autonomous Edge (Jan. 08, 2026)
- Meta and Qualcomm push RISC-V market share towards 25% (Jan. 08, 2026)
- Tenstorrent Unveils First Gen Compact AI Accelerator Device (Jan. 08, 2026)
- Marvell to Acquire XConn Technologies, Expanding Leadership in AI Data Center Connectivity (Jan. 08, 2026)
- Weebit Nano reports on 2025 targets achievement (Jan. 08, 2026)
- Keysight Launches Software Solution to Ensure Trustworthy AI Deployment in Safety-Critical Environments (Jan. 08, 2026)
- Siemens unveils technologies to accelerate the industrial AI revolution at CES 2026 (Jan. 08, 2026)
- SK hynix Showcases Next-Generation AI Memory Innovations at CES 2026 (Jan. 08, 2026)
- Synopsys Showcases Vision For AI-Driven, Software-Defined Automotive Engineering at CES 2026 (Jan. 08, 2026)
- CES 2026: Nordic Semiconductor simplifies edge AI for billions of IoT devices (Jan. 08, 2026)
- GUC’s HBM4E IP Honored with Best IP / Processor and Five-Year Achievement in EE Awards Asia 2025 (Jan. 08, 2026)
- Siemens unveils mobile showroom experience at CES 2026, bringing the future of adaptive automation directly to industry (Jan. 08, 2026)
- CES 2026 Consumer Tech Trends: EMEA Will Lead Growth (Jan. 08, 2026)
- Ceva Delivers Real-Time AI Acceleration on NXP’s Processors for Software-Defined Vehicles (Jan. 07, 2026)
- BOS Semiconductors Selects Ceva’s AI DSP for Next-Generation ADAS Platforms (Jan. 07, 2026)
- Ceva Enhances NeuPro-Nano NPU Ecosystem with Addition of Sensory’s TrulyHandsfree Voice Activation (Jan. 07, 2026)
- Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market (Jan. 07, 2026)
- Creonic Releases Updated SDA OCT IP Core Supporting OCT 4.0 and Enhanced Synchronization (Jan. 06, 2026)
- Weebit Nano secures a license agreement with Texas Instruments (Jan. 05, 2026)
- Chips&Media and Visionary.ai Unveil the World’s First AI-Based Full Image Signal Processor, Redefining the Future of Image Quality (Jan. 05, 2026)
- TSMC begins quietly volume production of 2nm-class chips — first GAA transistor for TSMC claims up to 15% improvement at ISO power (Jan. 05, 2026)
- Samsung Emerges as Potential Second Foundry for NVIDIA Alongside TSMC After Groq Licensing Deal (Jan. 05, 2026)
- Japan’s Rapidus set to rival TSMC and Samsung for chip supremacy (Jan. 05, 2026)
- IoT in 2026: the technologies driving the next wave of IoT growth (Jan. 05, 2026)
- CES is now a major player in artificial intelligence — thanks to Nvidia CEO Jensen Huang (Jan. 05, 2026)
- Initiative CHASSIS for Chiplet Technology in the Automotive Sector (Jan. 05, 2026)
- Canada Focuses Funding on Photonics and Quantum (Jan. 05, 2026)
- EU backs German chip fabs with €623m State aid (Jan. 05, 2026)
- SEMI forecasts semiconductor equipment sales reaching $156B by 2027 (Jan. 05, 2026)
- China’s SMIC moves to consolidate domestic chipmaking as it buys out SMNC minority stake. (Jan. 05, 2026)
- Five-Year-Old Chinese EDA Firm Univista Sets Sights on IPO, Led by Ex-Synopsys and Cadence Team (Jan. 05, 2026)
- Nordic Semiconductor and OQ Technology demonstrate direct NTN LEO satellite connectivity (Jan. 05, 2026)
- GUC Monthly Sales Report – Dec 2025 (Jan. 05, 2026)
- RISC-V IP: T2M Showcases RISC-V Production IP Core Portfolio for Next-Generation SoCs at CES’26 (Dec. 29, 2025)
- Challenges and Opportunities in the New Era of IoT Connectivity Opened by SGP.32 eSIM (Dec. 26, 2025)
- BOS Semiconductors to Exhibit at CES 2026, Showcasing AI Box Demo for Next-Generation Mobility (Dec. 24, 2025)
- The Chiplet Revolution: How Advanced Packaging and UCIe are Redefining AI Hardware in 2025 (Dec. 24, 2025)
- Partnership Drives RISC-V Adoption in Automotive (Dec. 24, 2025)
- Nvidia stock plunges after Intel’s 18A move: what does it mean for AI chips? (Dec. 24, 2025)
- New Role of Ethernet in AI, Automotive, and Connectivity (Dec. 24, 2025)
- Global Foundry 2.0 Market Revenue Surges 17% YoY in 3Q 2025 (Dec. 24, 2025)
- Qualitas Semiconductor Expands Automotive Momentum with 5nm IP Bundle Agreement (Dec. 23, 2025)
- Samsung Set to Benefit from TSMC's 'N-2' Rule as AMD, Google Eye U.S. 2nm Production (Dec. 23, 2025)
- AI in 2025: Chips, robots, and the race for scale (Dec. 23, 2025)
- China urges Dutch government to revoke administrative order against semiconductor manufacturer Nexperia (Dec. 23, 2025)
- Arm sheds billions in market capitalization after Qualcomm hints at RISC-V adoption with Ventara Micro acquisition (Dec. 22, 2025)
- NVIDIA Synopsys Partnership: Accelerating Engineering Workflows with GPU and Agentic AI (Dec. 20, 2025)
- Omni Design Technologies Appoints Hinesh Shah as Vice President of Strategic Sales (Dec. 19, 2025)
- QuickLogic Announces Expanded Scope of Strategic Radiation Hardened FPGA Contract (Dec. 19, 2025)
- Qualcomm Completes Acquisition of Alphawave Semi (Dec. 19, 2025)
- Cadence Tapes Out UCIe IP Solution at 64G Speeds on TSMC N3P Technology (Dec. 19, 2025)
- India Launches DHRUV64, First Indigenous 64-Bit Dual-Core Processor (Dec. 19, 2025)
- Six IoT semiconductor predictions for 2026 (Dec. 19, 2025)
- Trends for semiconductor and IC packaging materials market 2025-35 (Dec. 19, 2025)
- Semiconductor technology trends and predictions for 2026 (Dec. 19, 2025)
- SiFive and IAR Collaborate to Advance the Automotive Ecosystem and Drive RISC-V Innovation in Automotive Electronics (Dec. 18, 2025)
- Quobly marks a new milestone towards industrialization with Soitec’s 28Si FD-SOI substrates now cycling in ST’s 300mm fab (Dec. 18, 2025)
- Toshiba to accelerate semiconductor design innovation with Siemens’ EDA software (Dec. 18, 2025)
- Keysight Accelerates Electronic Design Productivity with Secure AI-Powered Assistants (Dec. 18, 2025)
- Global Semiconductor Equipment Sales Projected to Reach a Record of $156 Billion in 2027, SEMI Reports (Dec. 18, 2025)
- Samsung nears 2nm foundry deal with AMD as it closes gap with TSMC (Dec. 18, 2025)
- Intel Installs ASML TWINSCAN EXE:5200B High-NA EUV Machine for 14A Node (Dec. 18, 2025)
- Chinese SMIC Achieves 5 nm Production on N+3 Node Without EUV Tools (Dec. 18, 2025)
- India Unveils DHRUV64: Nation’s First Indigenous 64-Bit Dual-Core Microprocessor (Dec. 18, 2025)
- Addressing the Biggest Bottleneck in the AI Semiconductor Ecosystem (Dec. 18, 2025)
- Chiplet Technology in Automotive Applications: A Cost-Effective Path to Advanced Electronics (Dec. 18, 2025)
- Keysight Accelerates Automotive Innovation from Design to Defense at CES 2026 (Dec. 18, 2025)
- Significant 8 nm Order at Samsung Foundry Linked to Futuristic Intel 900-series Chipset (Dec. 18, 2025)
- onsemi to Develop Next-Generation GaN Power Devices with GlobalFoundries (Dec. 18, 2025)
- Using Synopsys Tools, Complex AI SoC Achieves Verification in 5 Weeks (Dec. 18, 2025)
- Keysight Joins Forces with Singapore's Quantum Leaders to Advance Capabilities in the Design and Control of Qubits (Dec. 18, 2025)
- Global Trends Overview: The Rapid Evolution of the USB-C Charging Cable Market (Dec. 18, 2025)
- Canada Tempers AI Aspirations with Data Sovereignty (Dec. 18, 2025)
- Siemens' new PAVE360 Automotive drives next-generation vehicle development with real-world validation (Dec. 18, 2025)
- The Green Paradox: How Semiconductor Giants are Racing to Decarbonize the AI Boom (Dec. 18, 2025)
- GlobalFoundries Accelerates and Strengthens Europe’s Semiconductor Ecosystem through Strategic Partnership with Cloudberry (Dec. 18, 2025)
- VeriSilicon responds to the termination of the acquisition of Nuclei Smart Fusion: The RISC-V business layout plan remains unchanged, and the Point Semiconductor merger is proceeding concurrently. (Dec. 18, 2025)
- S2C, MachineWare, and Andes Introduce RISC-V Co-Emulation Solution to Accelerate Chip Development (Dec. 17, 2025)
- Rapidus unveils new AI design tools for advanced semiconductor manufacturing (Dec. 17, 2025)
- Cadence's Zhuo Li discusses how their latest platform is reshaping LEC, low-power signoff, and ECO implementation using AI technologies. (Dec. 17, 2025)
- Deep Dive Into VSF TR-07 JPEG XS TS With A Wireshark Dissector (Dec. 17, 2025)
- Europe picks its own lane at EFECS 2025 – Turning semiconductor strategy into competitive strength (Dec. 17, 2025)
- IntoPIX At CES 2026: Premium Visual Experiences — No Compromise. IntoPIX Delivers Real-Time, Low-Power Video Technologies At CES 2026 (Dec. 16, 2025)
- DI3CM-HCI, A High-Performance MIPI I3C Host Controller IP Core for Next-Generation Embedded Designs (Dec. 16, 2025)
- Joachim Kunkel Joins Quadric Board of Directors (Dec. 16, 2025)
- Projections to 2030: How Korea’s Chipmakers Could Re-Shape the Semi World (Dec. 16, 2025)
- SEMI Reports Global Semiconductor Equipment Sales to Reach $156 Billion in 2027 (Dec. 16, 2025)
- BOS Semiconductors and LIG Nex1 Sign Strategic MOU on Physical AI for Robotics & Drones (Dec. 16, 2025)
- Renesas Fast-Tracks SDV Innovation with R-Car Gen 5 SoC-Based End-to-End Multi-Domain Solution Platform (Dec. 16, 2025)
- Nordic Semiconductor secures Skylo certification for nRF9151 module enabling global IoT connectivity (Dec. 16, 2025)
- Qualitas Semiconductor Signs First ASIL-B-Compliant MIPI Sub-system IP Agreement for Autonomous ADAS SoC (Dec. 15, 2025)
- Siemens and GlobalFoundries collaborate to deploy AI-driven manufacturing to strengthen global semiconductor supply (Dec. 15, 2025)
- Samsung’s 4nm Process Has Witnessed Yield Improvements In The 60-70% Range, Enabling It To Reportedly Win A $100 Million Order To Develop An Omni Processing Unit For A U.S. Firm (Dec. 15, 2025)
- UMC Inaugurates the Circular Economy & Recycling Innovation Center (Dec. 15, 2025)
- Intel Foundry Collaborates with Partners to Drive an Open Chiplet Marketplace (Dec. 15, 2025)
- Industry’s First End-to-End eUSB2V2 Demo for Edge AI and AI PCs at CES (Dec. 15, 2025)
- Three PCIe Encryption Weaknesses Expose PCIe 5.0+ Systems to Faulty Data Handling (Dec. 15, 2025)
- Quintauris and SiFive Announce Partnership to Advance RISC-V Ecosystem Development (Dec. 15, 2025)
- ISOLDE Project Demonstrates Advancements in European Open-Source RISC-V for Automotive, Space, and IoT (Dec. 15, 2025)
- BOS Semiconductors @ AISFC 2025 (Dec. 15, 2025)
- Hardware security to bolster interconnect IPs for SoCs, chiplets (Dec. 15, 2025)
- Synopsys to Showcase Future of Automotive Engineering at CES 2026 (Dec. 15, 2025)
- EU injects €623m to boost semiconductor manufacturing in Germany (Dec. 15, 2025)
- Tata and Intel Announce Strategic Alliance to Establish Silicon and Compute Ecosystem in India (Dec. 15, 2025)
- South Korea to consider setting up $3.1 bln foundry to grow local chip sector (Dec. 15, 2025)
- Quadric Appoints Ravi Chakaravarthy VP SW Engineering (Dec. 15, 2025)
- Samsung Reportedly Nears 2nm Foundry Deal With AMD, Decision Possible Around Early 2026 (Dec. 15, 2025)
- Taiwan helps Slovakia build semiconductor lab (Dec. 13, 2025)
- Arteris to Expand Portfolio with Acquisition of Cycuity, a Leader in Semiconductor Cybersecurity Assurance (Dec. 12, 2025)
- BrainChip Announces $25 Million (USD) Funding Ahead of CES to Power Next-Gen Edge AI (Dec. 12, 2025)
- Silicon Creations and Chip Interfaces Announce Successful Interoperability for JESD204B/C, Interlaken, and CPRI (Dec. 12, 2025)
- RaiderChip NPU leads edge LLM benchmarks against GPUs and CPUs in academic research paper (Dec. 12, 2025)
- Nordic Semiconductor launches nRF9151 software and development kit combining satellite and cellular IoT connectivity (Dec. 11, 2025)
- CAST Introduces Microsecond Channel Controller IP Core for Automotive Power and Sensor Interfaces (Dec. 11, 2025)
- UMC Licenses imec’s iSiPP300 Technology to Extend Silicon Photonics Capabilities for Next-Generation Connectivity (Dec. 11, 2025)
- Developing high-performance compute and storage systems (Dec. 11, 2025)
- TSMC November 2025 Revenue Report (Dec. 11, 2025)
- CEA-Leti & STMicroelectronics’ Paper at IEDM 2025 Demonstrates Path to Fully Monolithic Silicon RF Front-Ends with 3D Sequential Integration (Dec. 11, 2025)
- Tenstorrent Blackhole Support & Other New RISC-V + ARM64 Hardware In Linux 6.19 (Dec. 11, 2025)
- India Paves Dual RISC-V Tracks with C-DAC and Startup Silicon (Dec. 11, 2025)
- Qualcomm Acquires Ventana Micro Systems, Deepening RISC-V CPU Expertise (Dec. 11, 2025)
- Korea unveils $534 bil. plan to lead global chip race in AI era (Dec. 11, 2025)
- Semiconductor industry enters unprecedented ‘giga cycle’, says report — scale of artificial intelligence is rewriting compute, memory, networking, and storage economics all at once (Dec. 11, 2025)
- CoMira Announces One of the Industry’s First Commercially Available UALink IP Solutions for Next-Generation AI Scale-Up Networks (Dec. 11, 2025)
- Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2025 (Dec. 11, 2025)
- Synopsys records record-breaking full-year revenue as it beats expectations again (Dec. 10, 2025)
- HCLTech partners with Dolphin Semiconductor to develop energy-efficient chips for IoT and data center applications (Dec. 10, 2025)
- Andes Announces First Customer Tape-Out Delivery of the AX46MPV for Cloud AI Acceleration (Dec. 10, 2025)
- MEMTECH Unveils New LPDDR3 Memory Subsystem Family with Hyper-Bandwidth, Automotive Safety, and Ultra-Low Power Innovations (Dec. 10, 2025)
- Meeting the Demands of Next-Gen Client Computing with a High-Performance, High-Reliability SPD Hub (Dec. 10, 2025)
- Silicon-Proven 16-bit 5MSps SAR ADC IP Cores Optimised for Automotive, Industrial, and IoT (Dec. 09, 2025)
- TES Launches 3.3 V CAN Transceiver IP for Single‑Chip Solutions (Dec. 09, 2025)
- FortifyIQ Partners with Nexus-GT to Expand its Security Market Reach in Israel (Dec. 09, 2025)
- TSMC Strengthening Foundry 2.0 Leadership Amid Strong AI and Packaging Demand (Dec. 08, 2025)
- UMC and Polar Collaborate to Meet Growing Demand for U.S. Onshore Semiconductor Manufacturing (Dec. 08, 2025)
- CXL Adds Port Bundling to Quench AI Thirst (Dec. 08, 2025)
- Risc-v Cores and Neuromorphic Arrays Enable Scalable Digital Processors for EdgeAI Applications (Dec. 08, 2025)
- Innatera and 42T join forces to power the next wave of intelligent product innovation (Dec. 08, 2025)
- Ceva-XC21 Named "Best IP/Processor of the Year" at EE Awards Asia (Dec. 08, 2025)
- Nordic Semiconductor unveils nRF54LV10A - a breakthrough low-voltage Bluetooth LE SoC for next-gen healthcare wearables (Dec. 08, 2025)
- Global cybersecurity agencies publish secure AI integration principles for OT (Dec. 08, 2025)
- First-ever quantum chip combining electronics and photonics made in commercial CMOS foundry (Dec. 08, 2025)
- Silicon Photonics Momentum Builds: Samsung Ramps R&D in Singapore, UMC Teams With IMEC (Dec. 08, 2025)
- Silicon’s Green Revolution: How Cutting-Edge Innovations are Forging a Sustainable Future for Semiconductors (Dec. 08, 2025)
- SoftBank's Arm plans to set up chip training facility in South Korea (Dec. 08, 2025)
- Perceptia Announces Availability of Cryogenic 10-bit ADC and DAC IP in GF 22FDX (Dec. 08, 2025)
- DVB-S2 Demodulator Available For Integration From Global IP Core (Dec. 08, 2025)
- From Launch to Leadership: The Microservice Store Nominated for TechWorks Cybersecurity Award (Dec. 04, 2025)
- Open Chiplet Design Moves Forward with Tenstorrent’s OCA Plan (Dec. 04, 2025)
- Idaho Scientific Selects QuickLogic eFPGA Hard IP to Enable Crypto Agility (Dec. 04, 2025)
- Certus Semiconductor adopts AI-powered Solido to accelerate IO library, analog IP and ESD development (Dec. 04, 2025)
- The AI Future is Now All About the Edge (Dec. 04, 2025)
- VeriSilicon’s NPU IP VIP9000NanoOi-FS has achieved ISO 26262 ASIL B certification (Dec. 04, 2025)
- Imec strengthens its global presence with new regional research & development hub in Qatar (Dec. 04, 2025)
- Fraunhofer HHI advances indium phosphide photonics for high-speed data communication (Dec. 04, 2025)
- BOS Semiconductors at 2025 Korea Tech Festival (Dec. 04, 2025)
- Could an EU Chips Act 2.0 Bridge the Lab-to-Fab Gap? (Dec. 04, 2025)
- Germany Redirects Intel Funds Into New Wave of Semiconductor Projects (Dec. 04, 2025)
- DCD-SEMI Unveils Ultra-Fast DAES IP Core for AES Encryption (Dec. 04, 2025)
- MosChip Collaborates with EMASS on Silicon Implementation for its Breakthrough Edge AI SoC (Dec. 04, 2025)
- Synopsys launches AI exploration at AI Everywhere 2025 (Dec. 03, 2025)
- Attopsemi I-fuse® OTP was successfully adopted by Wiliot for IoT Pixels (Dec. 03, 2025)
- Semidynamics Welcomes Iakovos Stamoulis as Chief Technology Officer (Dec. 03, 2025)
- NVIDIA and Synopsys Announce Strategic Partnership to Revolutionize Engineering and Design (Dec. 02, 2025)
- Arteris Selected by Black Sesame Technologies for Next Generation of Intelligent Driving Silicon (Dec. 02, 2025)
- SAICEC Partners with Siemens to Accelerate Chip-to-vehicle Validation (Dec. 01, 2025)
- Intel Could Manufacture Apple M-Series Chips in 2027 with 18A-P Node (Nov. 28, 2025)
- Sovereign AI: The New Foundation of National Power (Nov. 28, 2025)
- EU digital package promises €155B in savings with streamlined AI and data rules (Nov. 28, 2025)
- Intel confirms steady 18A yield improvements and 14A progress (Nov. 27, 2025)
- TSMC to Build Three New 2 nm Fabs in Taiwan for $28 Billion (Nov. 27, 2025)
- RPI and GlobalFoundries Partner on Semiconductor Research, Education, and Workforce Development Initiatives (Nov. 27, 2025)
- InPsytech showcases 3nm UCIe 3.0 at OCP 2025, accelerating innovation in chiplet ecosystem (Nov. 27, 2025)
- Synopsys Demonstrates Framework for Optimizing Manufacturing Processes with Digital Twins at Microsoft Ignite (Nov. 27, 2025)
- Codasip announces strategic licensing agreement with EnSilica for its CHERI-enabled embedded CPU from the 700 family (Nov. 27, 2025)
- 6 IoT semiconductor predictions for 2026 (Nov. 27, 2025)
- BKT Waluj Plant Wins CII National Water Award for 25% Water Reduction (Nov. 27, 2025)
- Semiconductor supply risk management From firefighting to proactive strategy (Nov. 27, 2025)
- Europe tackles e-waste with eco-friendly innovation that helps reuse and repair (Nov. 27, 2025)
- Keysight Technologies Reports Fourth Quarter and Fiscal Year 2025 Results (Nov. 27, 2025)
- Sustainability moves upstream delivering greener semiconductor design (Nov. 27, 2025)
- Finland: At the forefront of specialised microelectronics in Europe (Nov. 27, 2025)
- Tenstorrent QuietBox tested: A high-performance RISC-V AI workstation trapped in a software blackhole (Nov. 27, 2025)
- Edge AI’s Next Battlefield: Development Tools (Nov. 27, 2025)
- BOS Semiconductors Eyes Expansion into ‘Intelligent Space’ AI Market Beyond ADAS (Nov. 27, 2025)
- WAVE-N v2: Chips&Media’s Custom NPU Retains 16-bit FP for Superior Efficiency at High TOPS (Nov. 26, 2025)
- Neuromorphic Photonic Computing: Lights On (Nov. 26, 2025)
- HiPEAC Vision, a Blueprint for European Survival (Nov. 26, 2025)
- The 10 Hottest Semiconductor Startups Of 2025 (Nov. 26, 2025)
- Qualitas Semiconductor Demonstrates Live of PCIe Gen 6.0 PHY and UCIe v2.0 Solutions at ICCAD 2025 (Nov. 25, 2025)
- Perceptia Begins Port of pPLL03 to Samsung 14nm Process Technology (Nov. 25, 2025)
- Samsung Reportedly Hits 55–60% 2nm Yields, Eyeing an Edge Through Early GAA Deployment (Nov. 25, 2025)
- Siemens: Industrial AI Can Deliver Marked Green Improvements (Nov. 25, 2025)
- How A New eSIM Standard Is Opening New IoT Opportunities For Partners (Nov. 25, 2025)
- Why PCB security matters in military electronics (Nov. 25, 2025)
- Cadence to Present at UBS Global Technology and AI Conference (Nov. 25, 2025)
- VSORA and GUC Partner on Jotunn8 Datacenter AI Inference Processor (Nov. 24, 2025)
- Samsung announces 2nm GAA process has 5% more perf, 8% more efficient than 3nm GAA (Nov. 24, 2025)
- Rapidus Selected as Official Business Operator by Japan Government (Nov. 24, 2025)
- Fragmentation to Standardization: Evaluating RISC-V’s Path Across Data Centers, Automotive, and Security (Nov. 24, 2025)
- Synopsys Convenes Industry Leaders to Discuss Future of Automotive Engineering for Software-Defined Vehicles (Nov. 24, 2025)
- Cadence Adds 10 New VIP to Strengthen Verification IP Portfolio for AI Designs (Nov. 24, 2025)
- Engineering Education in the Age of AI (Nov. 24, 2025)
- Oulu’s semiconductor industry: A rising European wireless technology hub (Nov. 24, 2025)
- Photonics Investments—Part 3: Three Game-Changing Photonics Technologies (Nov. 24, 2025)
- How Europe Can Build—and Keep—the Next Generation of Deep-Tech Giants (Nov. 24, 2025)
- Beyond Silicon: Exploring new materials for Photonic Integrated Circuits (Nov. 24, 2025)
- Sustainability moves upstream delivering greener semiconductor design (Nov. 24, 2025)
- Japanese government to invest 100 bil. yen in chipmaker Rapidus (Nov. 24, 2025)
- TSMC gets NT$147bn in subsidies in two years (Nov. 24, 2025)
- CEA-Leti to Launch Multilateral Program to Accelerate AI with MicroLED Data Links (Nov. 20, 2025)
- GlobalFoundries Acquires Advanced Micro Foundry, Accelerating Silicon Photonics Global Leadership and Expanding AI Infrastructure Portfolio (Nov. 20, 2025)
- Chinese crypto-mining manufacturers order next-gen 2nm GAA chips from Samsung Foundry (Nov. 20, 2025)
- Cadence Debuts Its First System Chiplet Silicon To Accelerate Physical AI Development (Nov. 20, 2025)
- Siemens and Microsoft team up to deliver Polarion X on Azure (Nov. 20, 2025)
- RISC-V And Its Modularity Shine Across Applications (Nov. 20, 2025)
- proteanTecs and Akeana Announce Joint Initiative to Drive Next-Generation RISC-V Processor Performance (Nov. 20, 2025)
- GlobalFoundries and BAE Systems Collaborate on Semiconductors for Space (Nov. 20, 2025)
- AMD maps out strategy for leadership in future compute and AI (Nov. 20, 2025)
- Arm Neoverse platform integrates NVIDIA NVLink Fusion to accelerate AI data center adoption (Nov. 20, 2025)
- Denmark Opens 300-mm Wafer Fab to Strengthen Europe’s Sovereignty (Nov. 20, 2025)
- Scintil Photonics: AI at the speed of light (Nov. 20, 2025)
- Three Ethernet Design Challenges in Industrial Automation (Nov. 20, 2025)
- Dnotitia Revolutionizes AI Storage at SC25: New VDPU Accelerator Delivers Up to 9x Performance Boost (Nov. 20, 2025)
- Mixel MIPI IP Integrated into Automotive Radar Processors Supporting Safety-critical Applications (Nov. 20, 2025)
- Breker Verification Systems and Frontgrade Gaisler Collaborate on High-Reliability RISC-V Fault-Tolerant Processor Core (Nov. 20, 2025)
- EagleChip Selects CAST TSN IP Core to Enhance Advanced Intelligent Control SoC (Nov. 19, 2025)
- QuickLogic eFPGA Hard IP Selected by Chipus for 12 nm High Performance Data Center ASIC (Nov. 19, 2025)
- SAICEC and Siemens to accelerate chip-to-vehicle validation using digital twin technology (Nov. 18, 2025)
- Moreh and Tenstorrent reveal joint AI data center solution (Nov. 18, 2025)
- GUC and Ayar Labs Partner to Advance Co-Packaged Optics for Hyperscalers (Nov. 17, 2025)
- EnSilica to develop quantum-resilient secure processor chip for critical national infrastructure applications backed by £5m UK Government ‘Contract for Innovation’ (Nov. 17, 2025)
- Intel's 18A process technology – a lifeline for the Intel Foundry department? (Nov. 17, 2025)
- TSMC, Samsung Reportedly Cut 8-Inch Wafer Output, Boosting Korea’s DB HiTek (Nov. 17, 2025)
- Silicon Photonic Chiplets with In-memory Computing Accelerate LLM Inference, Surpassing H100 Efficiency (Nov. 17, 2025)
- Renesas’ Industry-First Gen6 DDR5 Registered Clock Driver Sets Performance Benchmark by Delivering 9600 MT/s (Nov. 17, 2025)
- EPI announces SC25 attendance to present results: Proactive Compute showcases FAUST and FEVER (Nov. 17, 2025)
- EPI announces the open-source release of the CEA-List VPSim simulator (Nov. 17, 2025)
- Bluetooth Channel Sounding: The Next Leap in Bluetooth Innovation (Nov. 17, 2025)
- GlobalFoundries Reports Third Quarter 2025 Financial Results (Nov. 17, 2025)
- Samsung & Nvidia: Rewiring Manufacturing With AI Megafactory (Nov. 17, 2025)
- AI's Speed Problem Sparks Light-Based Chip Revolution (Nov. 17, 2025)
- Ceva Receives 2025 IoT Edge Computing Excellence Award from IoT Evolution World (Nov. 17, 2025)
- d-Matrix and Andes Team on World's Highest Performing, Most Efficient Accelerator for AI Inference at Scale (Nov. 17, 2025)
- SkyeChip Berhad and Persimmons, Inc. Announce Strategic IP Licensing Partnership (Nov. 14, 2025)
- CAST Introduces JPEG XL Encoder IP Core for High-Quality, On-Camera Still-Image Compression (Nov. 14, 2025)
- IntelPro Licenses Ceva Wi-Fi 6 and Bluetooth 5 IPs to Launch AIoT Matter-Ready SoCs (Nov. 14, 2025)
- GlobalFoundries Licenses GaN Technology from TSMC to Accelerate U.S.-Manufactured Power Portfolio for Datacenter, Industrial and Automotive Customers (Nov. 13, 2025)
- How Advanced Packaging is Unleashing Possibilities for Edge AI (Nov. 13, 2025)
- lowRISC® and Partners to Deliver Commercial-Quality, Open-Source CHERI Secure Enclave with InnovateUK Support (Nov. 13, 2025)
- VeriSilicon and Google Jointly Launch Open-Source Coral NPU IP (Nov. 13, 2025)
- Innatera signs Joya as ODM customer, bringing neuromorphic edge AI into everyday connected products (Nov. 13, 2025)
- Cadence Welcomes ChipStack (Nov. 13, 2025)
- QuickLogic Reports Fiscal Third Quarter 2025 Financial Results (Nov. 13, 2025)
- TSMC Board of Directors Meeting Resolutions (Nov. 13, 2025)
- Metalenz and UMC Bring Breakthrough Face Authentication Solution Polar ID to Mass Production (Nov. 13, 2025)
- Siemens and NVIDIA Preview Industrial Tech Stack for AI-Era Manufacturing (Nov. 13, 2025)
- Key ASIC Signals Strong Growth Momentum Amid AI Boom (Nov. 13, 2025)
- Keysight Named a Leader in 2025 Gartner® Magic Quadrant™ for AI-Augmented Software Testing Tools (Nov. 13, 2025)
- TSMC sales solid, but may be slowing (Nov. 13, 2025)
- European Technological Sovereignty: Visionary or Illusory? (Nov. 13, 2025)
- Light into data: How silicon photonics is powering the AI data center revolution (Nov. 13, 2025)
- Secure-IC, now a part of Cadence, unveils Securyzr™ Xperience, an Exclusive Gateway to Security Innovation (Nov. 12, 2025)
- Ceva, Inc. Announces Third Quarter 2025 Financial Results (Nov. 12, 2025)
- United Micro Technology and Ceva Collaborate for 5G RedCap SoC to Accelerate Connected Vehicle Adoption (Nov. 12, 2025)
- CAST Reaches 200 CAN IP Core Customers (Nov. 11, 2025)
- Blaize Deploys Arteris NoC IP to Power Scalable, Energy-Efficient Edge AI Solutions (Nov. 11, 2025)
- TSMC October 2025 Revenue Report (Nov. 10, 2025)
- Adeia Initiates Patent Infringement Litigation Against AMD (Nov. 10, 2025)
- Global Semiconductor Sales Increase 15.8% from Q2 to Q3; Month-to-Month Sales Grow 7.0% in September (Nov. 10, 2025)
- Keysight Recognized with 2025 TSIA STAR Award for Excellence in Omnichannel Customer Experience Optimization (Nov. 10, 2025)
- QuickLogic Accelerates Space Innovation with Secure, Customizable eFPGA Hard IP (Nov. 10, 2025)
- TSMC’s 3nm Process Has Entered ‘Golden Period Of Mass Production,’ Estimates State That Monthly Wafer Production Can Reach 160,000 Units By The End Of 2025 (Nov. 10, 2025)
- TSMC Reportedly Plans 12 New Advanced Process and Packaging Fabs in Taiwan as 2nm Supply Tightens (Nov. 10, 2025)
- High Tech Campus Eindhoven Invests in, and Constructs Building and Cleanroom Facilities for TNO’s 6-inch Photonic Chip Pilot Line (Nov. 10, 2025)
- Day 2 of PIC Summit: Photonic Chip Applications Taking Centre Stage (Nov. 10, 2025)
- The ISA Wars Have Ended And The Heterogeneous CPU Era Has Arrived (Nov. 10, 2025)
- Aion Silicon Expands Barcelona Design Center to Meet Surging Demand for ASIC and SoC Solutions (Nov. 07, 2025)
- Logic Fruit Technologies Appoints Sunil Kar as President & CEO to Accelerate Global Growth (Nov. 06, 2025)
- Perceptia Updates Design Kit for pPLL03 on GlobalFoundries 22FDX Platform (Nov. 06, 2025)
- Samsung’s Taylor Plant In Texas About To Commence Operations, New Report Says ASML Will Form A Team Soon To Set Up EUV Machinery And Ease Production Transition (Nov. 06, 2025)
- Europe Must Play to Its Strengths (Nov. 06, 2025)
- Thalia Design Automation announces AMALIA Platform release 25.3 qualified for advanced process nodes down to 4nm (Nov. 06, 2025)
- RISC-V Summit spurs new round of automotive support (Nov. 06, 2025)
- Keysight and MediaTek Collaborate to Advance Pre-6G Integrated Sensing and Communication Technology (Nov. 06, 2025)
- SEALSQ and IC’Alps Unify Expertise to Deliver Integrated Post-Quantum Cybersecurity and Functional Safety for Autonomous Vehicles (Nov. 06, 2025)
- European sales of semiconductors up 7.2% QoQ in the last quarter (Nov. 06, 2025)
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 3% Year-on-Year in Q3 2025 (Nov. 06, 2025)
- Canadian semiconductor leaders see opportunity, and risk, in US takeovers (Nov. 06, 2025)
- BOS Semiconductors Driving Innovation in Automotive AI Chips (Nov. 06, 2025)
- CoreHW’s Locator and Tag Series Achieve Bluetooth Certification (Nov. 06, 2025)
- CAST Expands Security IP Line with New Family of Post-Quantum Cryptography Cores (Nov. 05, 2025)
- Ceva Partners with Microchip Technology to Enable AI Acceleration Across Edge Devices and Data Center Infrastructure (Nov. 05, 2025)
- Arteris Selected by Altera to Advance Intelligent Computing Across Cloud-to-Edge Applications (Nov. 04, 2025)
- Qualitas Semiconductor Expands Global Presence with 4nm UCIe and PCIe Gen 6.0 IP Licensing Agreement in the U.S. AI Market (Nov. 03, 2025)
- Introducing Microservice Store - A New Era for Embedded Systems Begins (Nov. 03, 2025)
- GlobalFoundries and Silicon Labs Expand Partnership to Accelerate Wireless Connectivity Solutions and Strengthen U.S. Chip Manufacturing (Nov. 03, 2025)
- Keysight Advances Quantum Engineering with New System-Level Simulation Solution (Nov. 03, 2025)
- BOS Semiconductors and Tenstorrent Partner to Build an Open Chiplet Ecosystem (Nov. 03, 2025)
- Chiplet-Based Solutions Accelerate the Development of Embedded NVM (Nov. 03, 2025)
- Arm Opens Access to Chiplet Architectures and AI Platforms (Nov. 03, 2025)
- The next RISC-V processor frontier: AI (Nov. 03, 2025)
- Siemens and Capgemini deepen partnership to empower industries for the next era of manufacturing (Nov. 03, 2025)
- Cadence Completes Acquisition of Secure-IC (Nov. 03, 2025)
- TSMC A14 fab construction approved, set to start soon: Science park (Nov. 03, 2025)
- Samsung Teams With NVIDIA To Lead the Transformation of Global Intelligent Manufacturing Through New AI Megafactory (Nov. 03, 2025)
- Recycling Rare Earths: Europe’s Push for Independence (Nov. 03, 2025)
- QuickLogic to Exhibit at Embedded World North America 2025 (Nov. 03, 2025)
- ASIL Qualified MIPI C-PHY/D-PHY IP Core Delivering Industry-Leading Performance for Automotive SoCs in advanced process nodes (Nov. 03, 2025)
- PUFsecurity’s PUFrt Anchors the Security of Silicon Labs’ SoC to Achieve the Industry’s First PSA Certified Level 4 (Oct. 31, 2025)
- Northern Poland: Building Europe’s Next Semiconductor and Mobility Hub (Oct. 31, 2025)
- GlobalFoundries Plans Billion-Euro Investment to Expand Chip Manufacturing in Germany (Oct. 30, 2025)
- Socionext Unveils "Flexlets™", a Configurable Chiplet Ecosystem to Accelerate Multi-die Silicon Innovation (Oct. 30, 2025)
- Cadence Reports Third Quarter 2025 Financial Results (Oct. 30, 2025)
- Faraday Reports Third Quarter 2025 Results (Oct. 30, 2025)
- Synopsys Spotlights Agentic AI, Accelerated Computing, and AI Physics at NVIDIA GTC Washington, D.C. (Oct. 30, 2025)
- Ceva and embedUR systems Partner to Launch ModelNova for NeuPro NPU Family, Expanding Edge AI Model Ecosystem (Oct. 29, 2025)
- MosChip to Launch ProductXcelerate™ Blueprints at Embedded World North America (Oct. 29, 2025)
- Rambus Shines in Earnings Call with Record Growth (Oct. 29, 2025)
- Keysight to Showcase Quantum-AI Collaboration at GTC 2025 with NVIDIA NVQLink (Oct. 28, 2025)
- Nordic Semiconductor first to bring Bluetooth Channel Sounding to open-source Android app (Oct. 28, 2025)
- European chips also for defense: Merz visits Globalfoundries (Oct. 28, 2025)
- Intel's 18A Process Challenges TSMC, Samsung Foundry (Oct. 27, 2025)
- Cambridge GaN Devices partners with GlobalFoundries for advanced power devices (Oct. 27, 2025)
- UMC Introduces 55nm BCD Platform to Elevate Power Efficiency for Smartphones, Consumer Electronics, and Automotive Applications (Oct. 27, 2025)
- SmartDV Announces Multiple Customer Licenses for MIPI® SoundWire® I3S℠ 1.0 IP Portfolio (Oct. 27, 2025)
- RISC-V Takes First Step Toward International Standardization as ISO/IEC JTC1 Grants PAS Submitter Status (Oct. 27, 2025)
- VSORA Launches Europe’s Most Powerful AI Inference Chip (Oct. 27, 2025)
- Arm AI Chiplets Drive Open Standard for AI Infrastructure (Oct. 27, 2025)
- Tesla splits AI5 chip production between Samsung and TSMC in strategic dual-foundry move (Oct. 27, 2025)
- Bosch, Volkswagen, Nokia and Europe’s Tech Giants Unite to Secure Photonics Future in FP10 (Oct. 27, 2025)
- Nordic Semiconductor’s nRF Cloud powered by Memfault wins Cloud Computing Innovation of the Year Award at Mobile Breakthrough Awards (Oct. 27, 2025)
- The AI Chip Wars Intensify: Patent Battles Threaten to Reshape Semiconductor Innovation (Oct. 27, 2025)
- Intellectual Property Office survey: AI boom drives patent applications, placing Taiwan top 10 (Oct. 27, 2025)
- Europe Urged to Mobilize Private Capital for Quantum Competitiveness (Oct. 27, 2025)
- Arm VP highlights Korea as rising hub for AI semiconductor innovation (Oct. 27, 2025)
- FortifyIQ Secures the Quantum Era with Over-the-Air Updatable Cryptography (Oct. 27, 2025)
- Advanced Deposition Chemistry for Sub-2nm Chips (Oct. 27, 2025)
- CAST looks to simplify RISC-V IP adoption with new program (Oct. 27, 2025)
- Intel Stock Hits 18-Month High as AI Hype and $15 B Deals Fuel Stunning Rally (Oct. 27, 2025)
- Key ASIC Berhad Secures Repeat AI ASIC Order Worth RM2.088 Million (Oct. 27, 2025)
- Cadence forecasts fourth-quarter profit below estimates as US-China trade tensions weigh (Oct. 27, 2025)
- SOI Technology: Powering the Next Wave of AI and Advanced Computing with Unprecedented Efficiency (Oct. 24, 2025)
- Airbus, Leonardo and Thales unite to form European space powerhouse (Oct. 24, 2025)
- TSMC Reportedly Doubles Lithography Patents From 2016 to 2023, Extending Lead Over Rivals (Oct. 23, 2025)
- Tenstorrent Announces Open Chiplet Atlas™ Ecosystem to Accelerate and Standardize an Open Chiplet Ecosystem (Oct. 23, 2025)
- Upbeat Technology’s RISC-V MCU Takes Flight With Near-Threshold Computing (Oct. 23, 2025)
- SiPearl Unveils Athena1 Processor for Europe’s Dual-Use Needs (Oct. 23, 2025)
- Keysight Enables SK hynix to Achieve Top-Tier OCP S.A.F.E. Evaluation for Solid-State Drive Solution (Oct. 23, 2025)
- Soitec and CEA partner to develop automotive cybersecurity with advanced FD-SOI technology (Oct. 23, 2025)
- Tata Technologies collaborates with Synopsys to accelerate Software‑Defined Vehicle innovation (Oct. 23, 2025)
- Siemens updates Designcenter Solid Edge with AI and cloud-driven enhancements (Oct. 23, 2025)
- Axelera Announces Europa AIPU, Setting New Industry Benchmark for AI Accelerator Performance, Power Efficiency and Affordability (Oct. 23, 2025)
- Photonics21 and European industry campaign to secure photonics’ future (Oct. 23, 2025)
- From Polish photonics to European EMS insights (Oct. 23, 2025)
- Samsung Electronics Ranks 5th in Global Brands for the Sixth Consecutive Year (Oct. 23, 2025)
- Preliminary Characterisation Report for Perceptia’s pPLL08W in GF 22FDX Now Available (Oct. 23, 2025)
- Arteris Selected by Axelera AI to Accelerate Computer Vision for Edge Devices (Oct. 23, 2025)
- RISC-V Exceeding Expectations in AI, China Deployment (Oct. 23, 2025)
- Ceva Introduces Wi-Fi 7 1x1 Client IP to Power Smarter, More Responsive AI-Enabled IoT Devices and Emerging Physical AI Systems (Oct. 22, 2025)
- Weebit Nano delivers record quarterly customer receipts (Oct. 22, 2025)
- Menta Brings its Pioneering eFPGA Technology to Embedded World North America 2025 (Oct. 22, 2025)
- CAST Simplifies RISC-V Embedded Processor IP Adoption with New Catalyst Program (Oct. 22, 2025)
- Arteris and Alibaba DAMO Academy Extend Partnership to Accelerate High-Performance RISC-V SoC Designs (Oct. 22, 2025)
- Semidynamics Inferencing Tools Accelerate AI App Deployment on Cervell NPU (Oct. 22, 2025)
- Arm Accelerates the Edge AI Revolution with Easy, Low-Cost Access to Armv9 Platforms through Arm Flexible Access (Oct. 21, 2025)
- Ethernet IP Core Leaders – Comprehensive Portfolio from 10M to 10G (Oct. 21, 2025)
- Arteris Selected by 2V Systems for IO Chiplet for Data Center (Oct. 21, 2025)
- Sofics Tapes Out Test Chip on TSMC 4nm Process with Novel ESD IP and Low-Power 1.8V and 3.3V GPIO Solutions (Oct. 21, 2025)
- NVIDIA partners with TSMC, and the first wafer of the Blackwell chips manufactured in the United States is unveiled. (Oct. 20, 2025)
- Intel Foundry Reportedly Secures 18A Order from Microsoft for Maia 3 Accelerator (Oct. 20, 2025)
- Synopsys Unveils ‘Silicon Bring-Up’ of LPDDR6 IP On TSMC’s Cutting-Edge N2P Node, Reaching Bandwidth Up to a Whopping 86 GB/s (Oct. 20, 2025)
- Andes Showcases Expanding RISC-V Ecosystem and Next-Generation "Cuzco" High-Performance CPU at RISC-V Summit North America 2025 (Oct. 20, 2025)
- Upbeat Technology’s RISC-V MCU Takes Flight With Near-Threshold Computing (Oct. 20, 2025)
- The Road to embedded world North America: PQShield Future-Proofs Embedded Security (Oct. 20, 2025)
- Get Your Board On Board: Talking To Leadership About Post-Quantum Cryptography (Oct. 20, 2025)
- SEALSQ Announces Development of QASIC, the Quantum-Resistant ASIC, By IC’Alps (Oct. 20, 2025)
- AI Chips Shifting from Round to Rectangular (Oct. 20, 2025)
- Google's €5 Billion AI Bet in Belgium Ignites European Tech Landscape (Oct. 20, 2025)
- The Green Revolution in Silicon: How the Semiconductor Industry is Forging a Sustainable Future (Oct. 20, 2025)
- Nordic Semiconductor showcases comprehensive range of chip-to-cloud solutions at embedded world North America 2025 (Oct. 20, 2025)
- Keysight Completes Acquisition of Synopsys’ Optical Solutions Group and Ansys’ PowerArtist (Oct. 20, 2025)
- Keysight Technologies Completes Acquisition of Spirent Communications PLC (Oct. 20, 2025)
- TSMC Raises 2025 Revenue Forecast on AI Boom, U.S. Stock Rallies 1.6% (Oct. 20, 2025)
- TSN Technology from CAST Powers Advanced Cancer Treatment (Oct. 17, 2025)
- Open Compute Project Expands Open Chiplet Economy Ecosystem (Oct. 16, 2025)
- Why RISC-V + Blockchain Is the Conversation I’ve Been Waiting to Have (Oct. 16, 2025)
- Arm and Meta Deepen Strategic Partnership to Power the Next Era of AI, from Megawatts to Milliwatts, for Billions Worldwide (Oct. 16, 2025)
- GlobalFoundries, Infineon, Silicon Box, STATS ChipPAC, TIER IV Join imec Automotive Chiplet Program (Oct. 16, 2025)
- Foundry Market Set to Grow as AI and Advanced Packaging Drive Demand (Oct. 16, 2025)
- Samsung to buy ASML’s most advanced lithography tools to rival TSMC (Oct. 16, 2025)
- Intel's 18A production starts before TSMC’s competing N2 tech — here's how the two process nodes compare (Oct. 16, 2025)
- Renesas Powers 800 Volt Direct Current AI Data Center Architecture with Next-Generation Power Semiconductors (Oct. 16, 2025)
- Cadence Giving Foundation Announces Multi-Year Commitment to Expand the AI Hub at San José State University (Oct. 16, 2025)
- Keysight Introduces Optical Automotive Ethernet Transmitter Test Solution for nGBASE-AU Standard (Oct. 16, 2025)
- Nordic Semiconductor simplifies cellular IoT connectivity with nuSIM solution for nRF91 Series (Oct. 16, 2025)
- Milestone in strengthening Europe’s semiconductor manufacturing capacity under Chips Act reached (Oct. 16, 2025)
- Ceva Leads Next Gen Location: First IP Provider to Achieve Bluetooth 6.0 Qualification with Channel Sounding, Strong Momentum with 10+ Customers (Oct. 16, 2025)
- MIPI Alliance Releases New Groundbreaking Audio Interface Specification for High-Bandwidth, Low-Latency Consumer Electronics, Automotive and Industrial Applications (Oct. 16, 2025)
- Breker Donates Advanced Test Suite Components to RISC-V International for Use in Future Compliance Activities (Oct. 16, 2025)
- Arm Sets the Standard for Open, Converged AI Data Centers (Oct. 15, 2025)
- InPsytech showcases 3nm UCIe 3.0 technology at OCP 2025, Accelerating Innovation in Chiplet Ecosystem (Oct. 14, 2025)
- Andes and Arculus System Collaborate to Integrate iPROfiler™ into AndeSysC, Expanding Virtual Platform Support for RISC-V SoC Design (Oct. 14, 2025)
- Secure-IC Enables World’s First PSA Level 4 Certification within Silicon Labs Series 3’s Secure Vault (Oct. 14, 2025)
- Chips&Media Completes RTL for 'WAVE-P,' the World's First Standalone APV HW CODEC IP, Ready (Oct. 13, 2025)
- Quintauris and Andes Technology Partner to Scale RISC-V Ecosystem (Oct. 13, 2025)
- 16-Bit 5Msps SAR ADC IP Core on 40nm Node Sets a New Benchmark in Precision and Power Efficiency (Oct. 13, 2025)
- Andes Technology Hosts First-Ever RISC-V CON in Munich, Powering Next-Gen AI and Automotive Solutions (Oct. 10, 2025)
- Synopsys Receives Final Regulatory Approval to Close Planned Divestitures of Synopsys Optical Solutions Group and Ansys PowerArtist (Oct. 10, 2025)
- TSMC Stock Soars on AI Boom – Record Highs, Key News, Risks & 2025 Outlook (Oct. 10, 2025)
- Europe Achieves a Key Milestone with the Europe's First Out-of-Order RISC-V Processor chip, with the eProcessor Project (Oct. 09, 2025)
- Perceptia's pPLL08W Deployed in Production Tapeout of 5G Radio Chip for Smartphones (Oct. 09, 2025)
- IntoPIX Accelerates Automotive Innovation With TicoRAW & JPEG XS On Lattice Low Power FPGAs (Oct. 09, 2025)
- Sumitomo Riko Leverages Ansys AI Technology to Accelerate Simulation Over 10x for Automotive Component Design and Manufacturing (Oct. 09, 2025)
- What Meta’s Purchase of Rivos Says About RISC-V (Oct. 09, 2025)
- EU funds 83 Digital Hubs with €342M to boost AI innovation (Oct. 09, 2025)
- Keysight Enables 6G Digital Twin Research at the University of Texas at Austin (Oct. 09, 2025)
- The Things Conference 2025: IoT Depends on an Intelligent and Secure Edge (Oct. 09, 2025)
- Samsung May Make 2nm AI Chips for Another Client (Oct. 09, 2025)
- EU Member States back Chips Act 2.0 (Oct. 09, 2025)
- Everything Is Quantum (Oct. 09, 2025)
- RISC-V set to announce 25% market penetration - open-standard ISA is ahead of schedule, securing fast-growing silicon footprint (Oct. 09, 2025)
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- Intel's Confidence Shows As It Readies New Processors on 18A (Oct. 09, 2025)
- Semiconductor Tech Leaks Heat Up: Latest on Samsung, SK hynix, and TSMC Trade Secret Cases (Oct. 09, 2025)
- VeriSilicon Soars with AI Surge: Quarterly Revenue Doubles as Demand for Specialized Silicon Skyrockets (Oct. 08, 2025)
- Korea, U.S. DRAM Giants Reportedly Halt Pricing for a Week, Memory Module Makers Follow (Oct. 08, 2025)
- DCD-SEMI Brings Full ASIL-D Functional Safety to Entire Automotive IP Cores Portfolio (Oct. 07, 2025)
- Omni Design Technologies Tapes Out Ultra-High-Speed 64GSPS ADC on TSMC N3 process (Oct. 07, 2025)
- AI's Silicon Revolution: How Intelligent Machines are Redrawing the Semiconductor Landscape (Oct. 07, 2025)
- ASIC North Enters Strategic Channel Partnership with GlobalFoundries (Oct. 06, 2025)
- Rapidus Reportedly Flags U.S. Firms as Potential Customers, IBM and Tenstorrent Lead the Pack (Oct. 06, 2025)
- Intel Allegedly in Talks with AMD for Potential Foundry Manufacturing Deal (Oct. 06, 2025)
- Keller says Intel needs to fix its foundry game (Oct. 06, 2025)
- Analog Bits Awarded TSMC's 2025 OIP Partner of the Year Award (Oct. 06, 2025)
- Siemens Unveils Groundbreaking Software for Automated Analog IC Tests (Oct. 06, 2025)
- Siemens and ASE collaborate on Innovator3D IC driven 3Dblox workflows for ASEs VIPack platform (Oct. 06, 2025)
- SiPearl: launch of Athena1, the sovereign processor dedicated to dual-use (Oct. 06, 2025)
- Tenstorrent Considers Multiple Chipmakers for Production Amid AI Growth (Oct. 06, 2025)
- Project SpikeHERO Researches AI Chip for Fiber Optic Networks (Oct. 06, 2025)
- Samsung and OpenAI Announce Strategic Partnership to Accelerate Advancements in Global AI Infrastructure (Oct. 06, 2025)
- AI Drives PCIe Aspirations (Oct. 06, 2025)
- Keysight Expands End-of-Line Test Portfolio to Power the Future of Electric Mobility (Oct. 06, 2025)
- From Foundry to Fridge: Europes Role in the Global Quantum Supply Chain (Oct. 06, 2025)
- Toward a secure Europe: The Netherlands to build a pan-European quantum network (Oct. 06, 2025)
- GlobalFoundries, Corning collaborate on co-packaged optics (Oct. 06, 2025)
- STARLight Ignites Europes Silicon Photonics Ambitions: From Lab to Fab at 300mm (Oct. 06, 2025)
- NLM Photonics validates silicon-organic hybrid performance at over 200G (Oct. 06, 2025)
- India ready to rev up chipmaking, industry pioneer says (Oct. 06, 2025)
- QuickLogic Announces $1M eFPGA Hard IP Contract for Data Center ASIC (Oct. 06, 2025)
- Creonic Updates Doppler Channel IP Core with Extended Frequency Band and Sampling Range (Oct. 06, 2025)
- Weebit Nano tapes out embedded ReRAM test chips at onsemi production fab (Oct. 06, 2025)
- Andes Technology Expands Comprehensive AndeSentry™ Security Suite with Complete Trusted Execution Environment Support for Embedded Systems (Oct. 06, 2025)
- Micron Brings the Next Evolution of AI PC Memory (Oct. 06, 2025)
- Arm Announces Earnings Release Date for Second Quarter Fiscal Year Ended 2026 (Oct. 06, 2025)
- Dnotitia Releases "Dnotitia NIAH," an Open-Source Benchmark for Long-Context LLM Performance (Oct. 02, 2025)
- Imec debuts a beyond-110GHz C-band GeSi electro-absorption modulator (EAM) on its 300mm silicon photonics platform (Oct. 02, 2025)
- Photonics leaders call for a €2 bn EU program to 'keep Europe competitive' (Oct. 01, 2025)
- Analogue Insight IP Group Launches Analogue Insight SAFE in Portland, Oregon to Deliver Certification-Grade Security IP for Next-Gen SoCs and Chiplets. (Oct. 01, 2025)
- Key ASIC Berhad Signs RM1.11 Million Contract to Jointly Develop AI-Driven, Ultra-Low Power RF Navigation Chip with Middle East Partner (Oct. 01, 2025)
- Codasip RISC-V processors certified up to ASIL-D (Oct. 01, 2025)
- Alphawave Semi Delivers Cutting-Edge UCIe Chiplet IP on TSMC 3DFabric Platform (Oct. 01, 2025)
- TSMC Price Hikes End the Era of Cheap Transistors (Oct. 01, 2025)
- Synopsys Gives Its Major EDA Offerings a Gen-AI Facelift (Oct. 01, 2025)
- Soitec initiates succession process for chief executive officer Pierre Barnabé (Oct. 01, 2025)
- Taiwan will not agree to 50-50 chip production deal with US, negotiator says (Oct. 01, 2025)
- Northern Poland Emerging as Europe's Next Semiconductor Hub (Oct. 01, 2025)
- Advanced 112G SerDes PAM4 IP core for Low-Power, Multi-Reach Connectivity Across Silicon-Proven 12/7/6/5nm Nodes (Sept. 30, 2025)
- Silicon Creations Receives 9th Consecutive TSMC OIP Partner of the Year Award for Mixed Signal IP (Sept. 30, 2025)
- Chip Interfaces and Prodigy Technovations validate I3C Target at MIPI Plugfest in Poland (Sept. 30, 2025)
- CAST Expands Security IP Portfolio with High‑Performance SM4 Cipher Core (Sept. 30, 2025)
- Keysight Unveils 3GPP AI Simulation Platform to Accelerate AI-enabled 6G Communications (Sept. 30, 2025)
- GlobalFoundries and Corning Collaborate To Deliver Detachable Fiber Connector Solutions to Scale Next-Generation Optical Connectivity (Sept. 29, 2025)
- Quantum eMotion and Jmem Technology Join Forces to Deliver the First-Ever Full-Stack Quantum-Resilient Security Chip (Sept. 29, 2025)
- Synopsys Introduces Digital Twin Racetrack and NVIDIA Omniverse to STEM Racing (Sept. 29, 2025)
- Semiconductor coalition demands revamped EU Chips Act (Sept. 29, 2025)
- French Team Led by CEA-Leti Develops First Hybrid Memory Technology Enabling On-Chip AI Learning and Inference (Sept. 27, 2025)
- Xiphera and iWave Partner to deliver secure solutions on Altera FPGAs (Sept. 26, 2025)
- Weebit Nano Joins EDGE AI FOUNDATION to Advance Intelligent Systems at the Edge (Sept. 26, 2025)
- Innosilicon to Showcase High-Speed Interface IP and Advanced SoC Solutions at the 2025 TSMC OIP Ecosystem Forum (Sept. 26, 2025)
- AI and Chiplets Prominent at TSMC OIP 2025 (Sept. 26, 2025)
- eMemory Recognized with 16th TSMC Open Innovation Platform® (OIP) Partner of the Year Award (Sept. 25, 2025)
- Perceptia Introduces pPLL08N: A Family of Compact Narrow-Band RF PLLs which Complement pPLL08W (Sept. 25, 2025)
- Cadence Partners with TSMC to Power Next-Generation Innovations Using AI Flows and IP for TSMC Advanced Nodes and 3DFabric (Sept. 25, 2025)
- Siemens collaborates with TSMC to accelerate 3D IC and AI-driven circuit and systems design (Sept. 25, 2025)
- Synopsys Collaborates with TSMC to Drive the Next Wave of AI and Multi-Die Innovation (Sept. 25, 2025)
- M31 Advances AIoT Innovation with Ultra Low Power Memory Compilers on TSMC N6e Platform (Sept. 25, 2025)
- proteanTecs Announces Silicon-Proven IP on TSMC's Advanced N2P Process (Sept. 25, 2025)
- Tenstorrent and CoreLab Technology Forge Alliance to Launch Open-Architecture Platform for Robotics and Automotive AI (Sept. 25, 2025)
- Baya Systems Collaborates with Tenstorrent to demonstrate Optimized Subsystem for TT-Ascalon™ Processors, Joins OCA Ecosystem (Sept. 25, 2025)
- Tenstorrent and CoreLab Technology Forge Alliance to Launch Open-Architecture Platform for Robotics and Automotive AI (Sept. 25, 2025)
- Cadence Unveils AI-Driven ROCS X AI-Enabled Molecular Search, Unlocking Multi-trillion Molecule Virtual Screening (Sept. 25, 2025)
- Allegro DVT Supports AV2 Standard Ecosystem with the Launch of Comprehensive Compliance Test Tools (Sept. 25, 2025)
- Europe drives to dominate photonics (Sept. 25, 2025)
- Intel Reportedly Explores Investment Talks With Apple, Foundry Seen as Key (Sept. 25, 2025)
- ARM unveils design office for advanced chips as India pushes chip growth (Sept. 25, 2025)
- Tenstorrent Productizes RISC-V CPU And AI IP (Sept. 25, 2025)
- The Quantum Race: Finding Europe's Formula 1 (Sept. 25, 2025)
- Arteris Selected by NanoXplore for Space Applications (Sept. 24, 2025)
- GlobalFoundries and Egis Partner to Develop Next-Generation Smart Sensing Technology for Mobile and IoT Applications (Sept. 24, 2025)
- GUC Launches Next - Generation 2.5D/3D APT Platform Leveraging TSMC's Latest 3DFabric® and Advanced Process Technologies (Sept. 24, 2025)
- Siemens adds AI to Simcenter Testlab to reinvent modal testing and analysis processes (Sept. 24, 2025)
- Alphawave Semi Taped-Out Industry Leading 64Gbps UCIe™ IP on TSMC 3nm for the IP Ecosystem, Unleashing Next Generation of AI Chiplet Connectivity (Sept. 24, 2025)
- TSMC, chip design software firms tap AI to help chips use less energy (Sept. 24, 2025)
- Samsung's Share in HBM Market Projected to Surpass 30% in 2026 (Sept. 24, 2025)
- VeriSilicon Introduces FD-SOI Wireless IP Platform for Diverse IoT and Consumer Electronics Applications (Sept. 24, 2025)
- Keysight to Demonstrate AI-enabled 6G and Wireless Technologies at India Mobile Congress 2025 (Sept. 24, 2025)
- MIPI A-PHY Reaches Milestone of First SerDes Standard to Enter Mass Production with Global Automotive OEM (Sept. 23, 2025)
- EnSilica and Codasip announce strategic partnership (Sept. 23, 2025)
- Siemens accelerates complex semiconductor design and test with Tessent IJTAG Pro (Sept. 23, 2025)
- Thalia and X-FAB Forge Strategic Partnership to Safeguard Supply and Accelerate IP Migration (Sept. 23, 2025)
- New Investments Flowing Into Photonics (Sept. 23, 2025)
- Nordic Semiconductor launches full device observability and OTA capabilities via nRF Cloud powered by Memfault (Sept. 23, 2025)
- T2M-IP's RISC-V Portfolio with Production-Ready CPU IP Cores for AI, Automotive, and Edge Applications (Sept. 22, 2025)
- Analog Bits Adds New Power and Energy Management IP Blocks Proven on TSMC N2P and N3P Processes at TSMC 2025 OIP Ecosystem Forum (Sept. 22, 2025)
- TSMC 2nm Customer Surge: 15 Clients Reportedly Secured, 10 in HPC (Sept. 22, 2025)
- NanoEdge AI Studio v5, 1st AutoML tool with Synthetic Data Generation (Sept. 22, 2025)
- OpenAI and NVIDIA Announce Strategic Partnership (Sept. 22, 2025)
- BOS CEO, Jaehong Park, Introduces Eagle-N - Our Innovative AI Accelerator (Sept. 21, 2025)
- 22nm RISC-V AI Chip Targets Wearables and IoT (Sept. 19, 2025)
- STMicroelectronics and the Transformation of the Automotive Industry (Sept. 19, 2025)
- Qualitas Semiconductor Successfully Demonstrates Live UCIe PHY IP at AI Infra Summit 2025 (Sept. 18, 2025)
- Sofics joins GlobalFoundries' GlobalSolutions Ecosystem to Enhance Chip Robustness, Performance and Design Efficiency (Sept. 18, 2025)
- Ceva Appoints Former Microsoft AI and Hardware Leader Yaron Galitzky to Accelerate Cevas AI Strategy and Innovation at the Smart Edge (Sept. 18, 2025)
- RISC-V: Shaping the Future of Mobility with Open Standards and Strong Partnership (Sept. 18, 2025)
- Silicon Creations Announces 1000th Production FinFET Tapeout at TSMC and Immediate Availability of Full IP Library on TSMC N2 Technology (Sept. 18, 2025)
- Comcores MACsec IP is compliant with the OPEN Alliance Standard (Sept. 18, 2025)
- Nordic Semiconductor expands the nRF54L Series with nRF54LM20A, a high-memory wireless SoC for advanced Bluetooth LE and Matter applications (Sept. 18, 2025)
- EPI Forum in Paris, October 6-7, L'Hotel des Arts & Metiers (Sept. 18, 2025)
- Nvidia takes $5bn stake in Intel, becoming one of the companys biggest shareholders (Sept. 18, 2025)
- Making connections: The pursuit of chiplet interconnect standardization (Sept. 18, 2025)
- Deca, SST collaborate on NVM chiplet solutions (Sept. 18, 2025)
- Qualitas Semiconductor Signs PCIe Gen 4.0 PHY IP License Agreement with Leading Chinese Fabless Customer (Sept. 17, 2025)
- Dnotitia Unveils VDPU IP, the First Accelerator IP for Vector Database (Sept. 17, 2025)
- Omni Design Technologies Secures over $35 Million in Series A Funding to Advance Its Leadership in Wideband Signal Processing™ for the AI Data Revolution (Sept. 17, 2025)
- TSMC's SiC Substrate Strategy: Scaling Thermal Performance for AI and 3D Packaging (Sept. 17, 2025)
- Room-Temperature Quantum Can Revitalize Europe's Semiconductor Industry (Sept. 17, 2025)
- Why Chip Legend Jim Keller and Tenstorrent Are Betting on Taiwan (Sept. 17, 2025)
- MediaTek's First Chipset Using TSMC's 2nm Process Expected in Late 2026 (Sept. 16, 2025)
- TSMC's first 2 nm Node Customers are Apple, AMD, NVIDIA, and MediaTek; Intel Missing (Sept. 16, 2025)
- Putting 3D IC to work for you (Sept. 16, 2025)
- Cadence Collaborates with NVIDIA to Predict Data Center Power Demands (Sept. 16, 2025)
- Canadian AI company Cohere opens Paris hub to expand EMEA operations (Sept. 16, 2025)
- STMicroelectronics to advance next-generation chip manufacturing technology with new PLP pilot line in Tours, France (Sept. 16, 2025)
- Siemens unveils groundbreaking Tessent AnalogTest software for automated analog circuit test generation (Sept. 16, 2025)
- Analog Power Conversion LLC adopts Silvacos Design Technology Co-Optimization Flow for Next Generation Silicon and Silicon Carbide Power Devices (Sept. 16, 2025)
- ARTE Debuts New MPEG-H Dialog+ Feature (Sept. 16, 2025)
- Dnotitias Seahorse Cloud 2.0 Ushers in a New Era of Enterprise AI with AgentOps (Sept. 15, 2025)
- TSMC Moves to Lead in "Silicon Photonics"... More Than Twice as Many Patent Applications as Intel (Sept. 15, 2025)
- Silicon Photonics in the Spotlight: TSMC Lifts the Curtain on COUPE at SEMICON Taiwan (Sept. 15, 2025)
- From Foundry to Forum: Taiwans Repositioning in the New Semiconductor Order (Sept. 15, 2025)
- Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution (Sept. 15, 2025)
- Socionext and imec Update Core Partner Program (Sept. 15, 2025)
- Arm Goes for Rebrand for Mobile CSS, Drops Cortex, Immortalis (Sept. 15, 2025)
- RISC-V IP expands AI capabilities at the edge (Sept. 15, 2025)
- Axelera AI Boosts LLMs at the edge by 2x with the Metis M.2 Max (Sept. 15, 2025)
- BOS CSO Highlights Future of Automotive AI at AI Semiconductor Forum (Sept. 15, 2025)
- Qualcomm and Valeo join hands to provide pre-integrated ADAS & AD platform (Sept. 15, 2025)
- AccelerComm Joins the Mobile Satellite Services Association (MSSA) (Sept. 15, 2025)
- Europe's Semiconductor Plan Caught Between Vision and Reality (Sept. 15, 2025)
- Leading UK semiconductor firm up for sale (Sept. 15, 2025)
- SK hynix Maintains Memory Leadership with First HBM4 (Sept. 15, 2025)
- MCU Design Enablement: T2M-IP Expands Footprint via Key IP Licensing in South Korea (Sept. 15, 2025)
- Infineon Reportedly Set to Build RISC-V Auto MCUs at TSMC Dresden Fab, Mass Production in 2028 (Sept. 15, 2025)
- Altera CEO: 'We Need To Fully Focus On Execution' (Sept. 15, 2025)
- Keysight to Demonstrate New Solutions that Support AI Infrastructure and Optical Innovations at ECOC 2025 (Sept. 15, 2025)
- Korea tackles quantum 'harvest now, decrypt later' threat (Sept. 14, 2025)
- Perceptia Begins Port of pPLL03 to Samsung 8nm Process Technology (Sept. 11, 2025)
- Deca and Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions (Sept. 11, 2025)
- IntoPIX JPEG XS Powers Barnfind BarnPalette Flow-XS For Next-Generation Broadcast Workflows (Sept. 11, 2025)
- SiFives New RISC-V IP Combines Scalar, Vector and Matrix Compute to Accelerate AI from the Far Edge IoT to the Data Center (Sept. 11, 2025)
- ASML, Mistral AI enter strategic partnership (Sept. 11, 2025)
- Valens Semiconductor and Samsung partner to enhance the MIPI A-PHY standard (Sept. 11, 2025)
- Auracast broadcast audio solution powers assistive listening in public spaces with Nordic Semiconductor wireless connectivity (Sept. 11, 2025)
- Alibaba, Baidu begin using own chips to train AI models, The Information reports (Sept. 11, 2025)
- Samsungs Exynos 2600 Beats Apple's A19 Pro in Shocking Benchmark Upset (Sept. 11, 2025)
- Agile Analog announces deal with tier 1 US customer for agileSecureanti-tamper IP (Sept. 10, 2025)
- Cadence Expands Digital Twin Platform Library with NVIDIA DGX SuperPOD Model to Accelerate AI Data Center Deployment and Operations (Sept. 10, 2025)
- BrainChip Appoints James Shields as Vice President of Sales and Business Development (Sept. 10, 2025)
- Intel 14A node confirmed more expensive than 18A due to High-NA EUV (Sept. 10, 2025)
- Perforce's Delphix AI used in software development to boost speed and security (Sept. 10, 2025)
- ASML partners with Mistral AI on lithography innovation (Sept. 10, 2025)
- Smarter, Faster, More Personal AI Delivered on Consumer Devices with Arm's New Lumex CSS Platform, Driving Double-Digit Performance Gains (Sept. 10, 2025)
- Nvidia Specializes GPU for First Stage of Transformer Inference (Sept. 10, 2025)
- TSMC Releases August 2025 Revenue Report (Sept. 10, 2025)
- Arm Goes for Rebrand for Mobile CSS, Drops Cortex, Immortalis (Sept. 10, 2025)
- Network on Chip (NOC) IP Core Now Offered Under Whitebox License: Full Source Code, Unlimited Usage, Complete Modification Rights (Sept. 09, 2025)
- SiFive details second generation RISC-V cores for AI accelerators (Sept. 09, 2025)
- Cadence to Acquire Hexagons Design & Engineering Business, Accelerating Expansion in Physical AI and System Design and Analysis (Sept. 08, 2025)
- Synopsys and GlobalFoundries Establish Pilot Program to Bring Chip Design and Manufacturing to University Classrooms (Sept. 08, 2025)
- IntoPIX Receives 2025 Emmy® Award For The Development Of JPEG XS (Sept. 08, 2025)
- Comcores Launches OmniGate: A Versatile and Compact Hardware Evaluation Platform for TSN Ethernet End Stations, Switches, and Gateways (Sept. 08, 2025)
- Sarcina pioneers next-generation UCIe-A/S chiplet interconnects for AI systems (Sept. 08, 2025)
- Jmem Tek has achieved NIST CAVP certification, with ASCON algorithm implementation, and will be showcased at SEMICON Taiwan. (Sept. 08, 2025)
- Siemens Joins the CHERI Alliance: a United Front for Cutting-Edge Cybersecurity (Sept. 08, 2025)
- Quantinuum Raises $600 Million to Drive Scalable Quantum Computing (Sept. 08, 2025)
- China's AI Chip Ambitions Limited by HBM Memory Supply, Notes Report (Sept. 08, 2025)
- CG Power to MosChip Technologies: Five semiconductor stocks to watch out for in 2025 (Sept. 07, 2025)
- Gen 5 NVMe Host IP on AGILEX 7 R-Tile ! (Sept. 05, 2025)
- Global IP Core Announces the Availability of the NavIC LDPC/BCH Decoder FEC IP for Immediate Integration (Sept. 05, 2025)
- Leader And IntoPIX Boost IP Stream Monitoring With JPEG XS Integration (Sept. 05, 2025)
- Xiphera Builds Faster and More Secure Data Processing Business Finland Supports Development (Sept. 05, 2025)
- Silvaco Names Chris Zegarelli as Chief Financial Officer (Sept. 05, 2025)
- BrainChip's Cloud Platform Lets Developers Use Its Neuromorphic Tech (Sept. 05, 2025)
- Custom hardware helps deliver safety and security for electric traction (Sept. 05, 2025)
- BOS Semiconductors Introduces the Industry's First Chiplet-Based NPU Samples, Expanding Supply to Global Automotive OEMs (Sept. 04, 2025)
- Andes Technology Announces D23-SE: A Functional Safety RISC-V Core with DCLS and Split-Lock for ASIL-B/D Automotive Applications (Sept. 04, 2025)
- IntoPIX And Arkona Technologies Double JPEG XS Densityfor Next-Generation IP Broadcast Workflows (Sept. 04, 2025)
- Synopsys Announces Expanding AI Capabilities for its Leading EDA Solutions (Sept. 04, 2025)
- Time-Sensitive Networking IP Core CAST RANiX Automotive Antenna System (Sept. 04, 2025)
- Data Patterns (India) Ltd. connects design to manufacturing with software from Siemens Xcelerator (Sept. 04, 2025)
- Signatureip Achieves PCI-SIG® Pcie® 5.0 Certification, Joining Elite Group On Official Integrators List (Sept. 04, 2025)
- New MIPI I/O Bridges Working Group - A Conversation with Chair Aruni Nelson (Sept. 04, 2025)
- Silicon Creations Named GlobalFoundries Analog Mixed Signal IP Partner of the Year (Sept. 03, 2025)
- OPENEDGES Technology Expands ISO 26262 ASIL-B Certification to Network-on-Chip IP (Sept. 03, 2025)
- Chip Interfaces and Soliton Technologies jointly test their I3C Solution at MIPI Plugfest in Poland (Sept. 03, 2025)
- Fraunhofer IIS receives EMMY® Award for its JPEG XS high-quality, low-latency video codec (Sept. 03, 2025)
- GPS-Buddy RFID-Tag and ST's LIS2DUX12: Let's talk about the new era of tracking assets and safety monitoring (Sept. 03, 2025)
- TSMC raises prices. Tech giants and consumers will pay for geopolitics (Sept. 03, 2025)
- Securing the future of Terabit Ethernet: introducing the Rambus Multi-Channel Engine MACsec-IP-364 (Sept. 02, 2025)
- Synopsys Deploys AI-Optimized NVIDIA RTX PRO Servers for Advanced Simulation Workloads (Sept. 02, 2025)
- TSMC hits record 70% foundry market share, making a synapse singeing $30.24 billion in revenue last quarter alone (Sept. 02, 2025)
- IBM and AMD to merge AI accelerators, quantum computers, and HPC development (Sept. 02, 2025)
- Global foundry revenue surged to $41.7 billion in Q2 2025, with TSMC capturing a record 70 percent market share (Sept. 02, 2025)
- The 3 Hidden Risks That Can Derail Your IC Design Project! How to Avoid Them? (Sept. 02, 2025)
- AiM Future and Franklin Wireless Sign MOU to Jointly Develop Lightweight AI Model and High-Efficiency 1 TOPS AI SoC Chipset (Sept. 01, 2025)
- EXTOLL received GlobalFoundries Award for "Interface IP Partner of the Year" (Sept. 01, 2025)
- Ethernet PHY IP Cores - Unmatched Leadership from 1G to 10G (Sept. 01, 2025)
- Rapidus 2HP Reportedly Surpasses Intel 18A Logic Density Impacted by BSPDN, Rivals TSMC (Sept. 01, 2025)
- CXL 3.1 MXC and the Future of Data Center Memory Architecture (Sept. 01, 2025)
- Rapidus 2HP 2 nm Node to Match TSMC N2 on Logic Density (Sept. 01, 2025)
- BOS CSO Wonju Park to Speak at 12th AI Semiconductor Forum (Aug. 31, 2025)
- Weebit Nano quadruples revenue to $4.4 million (Aug. 29, 2025)
- Andes Technology Further Expands Long-term Collaboration with Sequans Communications with AndesCore™ A25MP and N25F RISC-V CPU Core Licenses (Aug. 29, 2025)
- GlobalFoundries Announces Availability of 22FDX+ RRAM Technology for Wireless Connectivity and AI Applications (Aug. 29, 2025)
- TSMC reportedly cuts Chinese chipmaking tools from 2nm fabs as suppliers face scrutiny due to emerging new US restrictions (Aug. 29, 2025)
- SMIC 1H25 Net Profit Rises 35.6%, 7nm Capacity Reportedly to Double in 2026 (Aug. 29, 2025)
- ENISA to manage €36M EU Cybersecurity Reserve (Aug. 29, 2025)
- Perceptia Appoints Running Springs Technology as Representative for Taiwan and China (Aug. 28, 2025)
- Aion Silicon Joins Intel Foundry Accelerator Value Chain Alliance to Design and Deliver Best-in-Class ASIC and SOC Solutions (Aug. 28, 2025)
- Dnotitia Paper on Korean Cultural Dataset Accepted to ACM Multimedia 2025 Dataset Track (Aug. 28, 2025)
- Industrys first high-performance complementary BiCMOS technology delivers performance and power advantages for essential markets and applications (Aug. 28, 2025)
- TSMC's first 1.4nm chip facility ahead of schedule, initial investment could be close to $50B (Aug. 28, 2025)
- GlobalFoundries and Silicon Labs Partner to Scale Industry-Leading Wi-Fi Connectivity (Aug. 28, 2025)
- Intel receives $5.7bn as Trump administration buys 10 percent stake (Aug. 28, 2025)
- Arteris Joins UALink Consortium to Accelerate High-Performance AI Networks Scale Up (Aug. 27, 2025)
- Chip Interfaces, through its JESD204C IP, supports Extoll's collaboration in the development of Eridan's next-generation ASIC (Aug. 27, 2025)
- Chips&Media's 'WAVE' IP Successfully Enters the Global Mobile Market (Aug. 27, 2025)
- Arasan MIPI DSI-2 Rx Controller ISO 26262 ASIL-B Certification (Aug. 27, 2025)
- QuickLogic Showcases eFPGA Hard IPs at GlobalFoundries Technology Summit (Aug. 27, 2025)
- Arm develops low-power AI infrastructure in collaboration with Korean firms (Aug. 27, 2025)
- Cadence Completes Acquisition of Arm Artisan Foundation IP Business (Aug. 27, 2025)
- Aion Silicon Marks Completion of Leadership Transition (Aug. 26, 2025)
- Intel and Trump Administration Reach Historic Agreement to Accelerate American Technology and Manufacturing Leadership (Aug. 26, 2025)
- EXTOLL collaborates with ERIDAN as a Key Partner for Lowest Power High-Speed SerDes IP on GlobalFoundries 22FDX (Aug. 26, 2025)
- Rapidus Announces Strategic Collaboration with Keysight To Improve Yield and Achieve High-Precision PDK For 2nm GAA Semiconductors (Aug. 26, 2025)
- How Synopsys De-Risks The Road From Concept To Chip (Aug. 26, 2025)
- HBM Innovation Outpaces Standards Development (Aug. 26, 2025)
- Will New Ultra-High-Performance AI Inference Chips Make AI Data Centers Cost-Effective? (Aug. 26, 2025)
- proteanTecs and Dream Chip Technologies Announce Collaboration to Advance Functional Safety in Automotive and HPC Markets (Aug. 26, 2025)
- How Smart Data Unlocks the Next Era of AI-Enhanced Design (Aug. 26, 2025)
- Presto Engineering Announces New VP Sales & Marketing to Accelerate Growth in Turnkey ASIC Services (Aug. 26, 2025)
- Keysight and USM Collaborate to Advance Semiconductor and Photonics Education in Malaysia (Aug. 26, 2025)
- Network Interconnect IP Core: High Bandwidth, Low Power, Future-Ready for Complex Semiconductor SoCs (Aug. 25, 2025)
- The Qualcomm AMR Reference Platform driven by ST Technology (Aug. 25, 2025)
- GlobalFoundries Champions 'Essential Technologies' over Moore's Law (Aug. 25, 2025)
- Rambus Launches MACsec-IP-364 (+363) Engine to Secure Terabit Ethernet Networks (Aug. 24, 2025)
- What Does SoftBank's Investment in Intel Stand For? (Aug. 22, 2025)
- Silvaco Announces CEO Transition (Aug. 22, 2025)
- Chiplets Consolidation Wave is Just Beginning (Aug. 22, 2025)
- Nordic-powered LE Audio and Auracast modules simplify product development and reduce time to market for wireless audio solutions (Aug. 22, 2025)
- Nvidia CEO Jensen Huang to Visit TSMC (Aug. 22, 2025)
- Photonic wins $1 million CAD grant to advance quantum networking (Aug. 22, 2025)
- Chips&Media Launches Cframe60: A Lossless & Lossy frame Compression Standalone HW IP (Aug. 21, 2025)
- Former BelGaN-site to become Europe's first 'full-fledged photonic chip centre' (Aug. 21, 2025)
- Samsung to set up chip packaging R&D center in Yokohama, raise stakes vs TSMC (Aug. 21, 2025)
- MSU Leveraging Intel 16 and the Cadence Tool Flow for Academic Chip Tapeout (Aug. 21, 2025)
- Keysight Completes Industry-First PSA Certified Level 4 Evaluation for Silicon Labs SiXG301 SoC (Aug. 21, 2025)
- Superspeed PCIe coming in 2028 (Aug. 21, 2025)
- European Project to Repurpose Fiber-Optic Cables Into Photonic Sensors (Aug. 20, 2025)
- SoftBank Group and Intel Corporation Sign $2B Investment Agreement (Aug. 20, 2025)
- Ansys Announces Agreement to Offer Access to NVIDIA Omniverse Technology from within Simulation Solutions (Aug. 20, 2025)
- India's First Compound Semiconductor Wafer Fab Gets Approval (Aug. 20, 2025)
- New Renesas USB-C Power Solution with Innovative Three-Level Topology Improves Performance and Reduces System Size (Aug. 20, 2025)
- UK needs 7000 AI chip designers over the next five years says report (Aug. 20, 2025)
- DEEPX Signs 2nm Process Agreement with Samsung Foundry to Develop World's First On-Device Generative AI Chip 'DX-M2' (Aug. 20, 2025)
- DDR4, LPDDR4 Supply Tightens Sharply Amid Structural Shortage-drive Price Surge (Aug. 20, 2025)
- Dassault Systemes and Vietnam's National Innovation Center Unite Industry Leaders to Accelerate Nation's Semiconductor Rise (Aug. 20, 2025)
- Arteris Wins Gold Stevie® Award for Most Innovative Tech Company of the Year (Aug. 19, 2025)
- Cirrus Logic and GlobalFoundries Expand Strategic Investment to Advance Next-Generation Mixed-Signal Semiconductor Manufacturing in the U.S. (Aug. 19, 2025)
- UCIe 3.0 Supports Full Backward Compatibility, Boosts Data Rate for 2D Chiplets (Aug. 19, 2025)
- The Future of the Edge: The Rising Tide for Better AI Performance, Scalability, and Security (Aug. 19, 2025)
- Keysight Technologies Reports Third Quarter 2025 Results (Aug. 19, 2025)
- Softbank backs Intel in $2bn deal (Aug. 19, 2025)
- BOS CSMO Shares Insights on the Future Car (Aug. 19, 2025)
- GlobalFoundries Completes Acquisition of MIPS (Aug. 18, 2025)
- QuickLogic Appoints Ron Shelton to Board of Directors (Aug. 18, 2025)
- NIST Finalizes Lightweight Cryptography Standard to Protect Small Devices (Aug. 18, 2025)
- Cadence Accelerates Development of Billion-Gate AI Designs with Innovative Power Analysis Technology Built on NVIDIA (Aug. 18, 2025)
- TSMC 6-inch Wafer Fab Exit Affirms Strategy Shift (Aug. 18, 2025)
- CFX's 40nm HV Process OTP IP Now Available at Fab (Aug. 18, 2025)
- Smart glasses becoming a serious market (Aug. 18, 2025)
- MIPI C/D PHY and DSI Controller IP Licensed by Tier-1 US Customer, Strengthening T2M's Position in Automotive and AR/VR Markets (Aug. 18, 2025)
- Feature-packed smart ring modules integrate Nordic's nRF54L15 SoC delivering next level processing and power consumption performance (Aug. 18, 2025)
- U.K. Startup Scaling Quantum Computing With Photonics (Aug. 15, 2025)
- Dominic Maidment, Unilever: IoT gives supply chains 'a sixth sense' (Aug. 15, 2025)
- Perceptia Completes Silicon Characterisation of pPLL03 for GF 22FDX - Report Now Available (Aug. 14, 2025)
- Brite Semiconductor Releases PCIe 4.0 PHY IP (Aug. 14, 2025)
- EnSilica Establishes New EU Mixed-Signal Design Centre in Budapest, Hungary (Aug. 14, 2025)
- TSMC Board of Directors Meeting Resolutions (Aug. 14, 2025)
- Oxford Ionics delivers quantum computer to UK NQCC (Aug. 14, 2025)
- Siemens, Arm and Southampton Uni announce Cre8Ventures Education Program (Aug. 14, 2025)
- Will Robots Use Reasoning At The Edge? (Aug. 14, 2025)
- Embracing the Chiplet Journey (Aug. 14, 2025)
- MIPI I3C/I3C Basic Implementers Collaborate to Test, Improve Innovations at Recent Plugfest (Aug. 14, 2025)
- Intel Shows Its Cutting-Edge 18A Process Is Ready for Non-x86 SoCs in a Live Demo, Aiming to Attract Fabless Customers Like Apple That Rely on ARM (Aug. 14, 2025)
- Arm Neural Technology Delivers Smarter, Sharper, More Efficient Mobile Graphics for Developers (Aug. 13, 2025)
- Cadence Accelerates Development of Billion-Gate AI Designs with Innovative Power Analysis Technology Built on NVIDIA (Aug. 13, 2025)
- Wave Photonics launches its PDK Management Platform with CORNERSTONE as the first user (Aug. 13, 2025)
- Samsung boosts HBM specialist hiring, scales back foundry recruitment (Aug. 13, 2025)
- TSMC 6-inch Wafer Fab Exit Affirms Strategy Shift (Aug. 13, 2025)
- Wave Photonics launches its PDK Management Platform with CORNERSTONE as the first user (Aug. 13, 2025)
- Can Huawei's open-sourced CANN toolkit break the CUDA monopoly? (Aug. 13, 2025)
- Why does it MATTER? Understanding the universal protocol thats making smart homes even smarter (Aug. 13, 2025)
- Anthropic details its AI safety strategy (Aug. 13, 2025)
- AI and Semiconductors Dance a Quick Two-Step (Aug. 13, 2025)
- Nordic Semiconductor continues to power ahead (Aug. 13, 2025)
- Siemens empowers Europe's next generation of semiconductor innovators with Open Higher Education Program (Aug. 13, 2025)
- Silvaco's CEO, Babak Taheri, to Attend the Jefferies' Semis, IT Hardware & Comm Tech Summit in Chicago (Aug. 13, 2025)
- OIF at ECOC 2025: Eliminating Barriers and Accelerating Innovation (Aug. 13, 2025)
- Dnotitia Launches the World's First MCP-Based AI Agent Workstation with Integrated Vector Database (Aug. 12, 2025)
- Ceva, Inc. Announces Second Quarter 2025 Financial Results (Aug. 12, 2025)
- NVIDIA latest: Blackwell GPU and software updates (Aug. 12, 2025)
- Key Asic Berhad Secures 21 International Patents With 19 More Pending (Aug. 12, 2025)
- Open Compute Project Enables Silicon Diversity in AI Clusters (Aug. 11, 2025)
- GlobalFoundries Expands Partnership with Apple to Advance Wireless Connectivity and Power Management, Reinforcing U.S. Chip Manufacturing Leadership (Aug. 11, 2025)
- Eseye: Why the true cost of IoT connectivity is often hidden (Aug. 11, 2025)
- AIoT 2.0 brings smarter voice and visual features to connected devices (Aug. 11, 2025)
- Linus Torvalds Rejects RISC-V Changes For Linux 6.17: "Garbage" (Aug. 09, 2025)
- Cyient Semiconductors Enters Strategic Channel Partnership with GlobalFoundries (Aug. 08, 2025)
- ALi Corporation and Ceva Announce Strategic Collaboration to Bring Scalable Edge AI to Next-Gen Video Platforms (Aug. 08, 2025)
- Aion Silicon Successfully Completes ISO 9001 and ISO/IEC 27001 Surveillance Audit, Strengthening Commitment to Quality and Security (Aug. 08, 2025)
- UCIe 3.0 Doubles Data Rate For 2D Chiplets (Aug. 08, 2025)
- Arasan Announces the industries first MIPI SWI3S Manager IP and Peripheral Controller IP (Aug. 07, 2025)
- ALi Corporation and Ceva Announce Strategic Collaboration to Bring Scalable Edge AI to Next-Gen Video Platforms (Aug. 07, 2025)
- CFX Achieves Major Breakthrough in 40nm SONOS Embedded eFlash IP (Aug. 07, 2025)
- NVIDIA on RVA23: "We Wouldn't Have Considered Porting CUDA to RISC-V Without It" (Aug. 07, 2025)
- Teledyne e2v Unveils 16GB Radiation-Tolerant DDR4 Engineering Models for Space Applications (Aug. 07, 2025)
- Silicon Labs Secures Industry First with PSA Level 4 Certification for SiXG301 SoC (Aug. 07, 2025)
- Fraunhofer IPMS, AlixLabs and NSS Water Partner to Revolutionize Sustainable Ultrapure Water Management in Semiconductor Manufacturing (Aug. 07, 2025)
- Qualitas Semiconductor Signs Licensing Agreement with Chinese SoC Company for DSI-2 Controller and MIPI PHY IP (Aug. 06, 2025)
- Ceva's 20 Billion Device Milestone Paves the Way for a New Era in Smart Edge Innovation (Aug. 06, 2025)
- BrainChip launches Akida Cloud for instant access to latest Akida neuromorphic technology (Aug. 06, 2025)
- Intel 18A yields remain critically low at just 10 per cent, according to reports (Aug. 06, 2025)
- Bosch Propels Advanced ADAS Forward With Pair of Radar SoCs (Aug. 06, 2025)
- GlobalFoundries Partners with Chinese Foundry for Localized Automotive-Grade CMOS Production (Aug. 06, 2025)
- Arteris To Provide FlexGen Smart NoC IP In Next-Generation AMD AI Chiplet Designs (Aug. 05, 2025)
- Weebit Nano well-positioned to achieve 2025 commercial targets (Aug. 05, 2025)
- UCIe Consortium Introduces 3.0 Specification With 64 GT/s Performance and Enhanced Manageability (Aug. 05, 2025)
- Codasip looks to Silicon Creations' PLL to drive RISC-V Automotive Safety-Critical Core (Aug. 05, 2025)
- UCIe 3.0 Spec Released with Big Speed Up for Chiplets (Aug. 05, 2025)
- PCI-SIG® Announces PCI Express® 8.0 Specification to Reach 256.0 GT/s (Aug. 05, 2025)
- China Unyielding Ascent in RISC-V (Aug. 05, 2025)
- Chiplets Are The New Baseline for AI Inference Chips (Aug. 05, 2025)
- GlobalFoundries Reports Second Quarter 2025 Financial Results (Aug. 05, 2025)
- 7 Critical Components of the Car of Tomorrow (Aug. 05, 2025)
- Enabling Space-Grade AI/ML with RISC-V: A Fully European Stack for Autonomous Missions (Aug. 05, 2025)
- Navigate new EU security regulations with ST solutions (Aug. 05, 2025)
- Advanced GNSS IP Cores (RF + Digital + Software) for Enhanced Positioning, Navigation, & Tracking for Next-Gen Products (Aug. 04, 2025)
- Silvaco Completes Acquisition of Mixel Group, Inc. a Provider of Low-Power, High-Performance Mixed-Signal Connectivity IP Solutions (Aug. 04, 2025)
- Silicon Labs Extends IoT Security Leadership with World's First PSA Level 4 Certification (Aug. 04, 2025)
- QpiAI Raises $32M to Build Indias First Full-Stack Quantum-AI Platform (Aug. 01, 2025)
- Perceptia Releases Design Kit for pPLL05 on GlobalFoundries 22FDX Platform (Jul. 31, 2025)
- Arm considers stepping up investment in chiplet and solution development (Jul. 31, 2025)
- Creonic Releases DVB-S2X Demodulator Version 6.0 with Increased Bitwidth and Annex M Support (Jul. 31, 2025)
- Japan unveils $550B investment to reshape global trade, strengthen chip supply chains, and support TSMC's U.S. expansion under new U.S. tariff deal (Jul. 31, 2025)
- Rapidus adopts Teamcenter for Semiconductor Lifecycle Management (Jul. 31, 2025)
- X-CUBE-PQC: Why post-quantum cryptography matters already and how STM32 embedded systems are ready for future attacks (Jul. 31, 2025)
- Female-founded semiconductor AI startup SixSense raises $8.5M (Jul. 31, 2025)
- Armv9 and CSS Royalties Drive Growth in $1bn Arm Q1 Earnings (Jul. 31, 2025)
- Silvaco to Acquire Mixel, Inc. a Provider of Low-Power, High-Performance Mixed-Signal Connectivity IP Solutions (Jul. 30, 2025)
- 'World's First' Photonic AI Processor Installed in Supercomputing Facility (Jul. 30, 2025)
- SiMa.ai Expands Strategic Collaboration with Synopsys to Accelerate Automotive AI Innovation (Jul. 30, 2025)
- Socionext enters into licensing agreement with aiMotive (Jul. 30, 2025)
- What It Will Take to Build a Resilient Automotive Compute Ecosystem (Jul. 30, 2025)
- SNUG India 2025: AI, Modular Chips, and India's Semiconductor Future (Jul. 30, 2025)
- Smartphone brands to accelerate LPDDR5X adoption as LPDDR4X supply tightens (Jul. 29, 2025)
- Renesas Introduces 64-bit RZ/G3E MPU for High-Performance HMI Systems Requiring AI Acceleration and Edge Computing (Jul. 29, 2025)
- TSMC Gets 300,000 H20 Chip Order from NVIDIA Amid China Market Boom (Jul. 29, 2025)
- Chiplets Are Here - And They're Reshaping Everything (Jul. 29, 2025)
- Cadence Found Guilty of Illegally Supplying China Military (Jul. 29, 2025)
- Ceva Retains Top Spot in Wireless Connectivity IP in Latest IPnest Report (Jul. 29, 2025)
- Semiconductor innovations transforming automotive displays (Jul. 29, 2025)
- Keysight Installs World's Largest Commercial Quantum Control System at AIST's Leading-Edge G-QuAT Center (Jul. 29, 2025)
- Keysight Announces Date of Third Quarter 2025 Financial Results Conference Call (Jul. 29, 2025)
- Next-Gen High-Speed Transceiver IP Core Unveiled: Power, Performance, and Protocol Versatility in One Core (Jul. 28, 2025)
- Samsung to produce Tesla's next-gen AI chips in $16.5b foundry breakthrough (Jul. 28, 2025)
- Chiplet design basics for engineers (Jul. 28, 2025)
- ST announces plans to acquire NXP's MEMS sensors business (Jul. 28, 2025)
- Rambus Reports Second Quarter 2025 Financial Results (Jul. 28, 2025)
- Cadence Reports Second Quarter 2025 Financial Results (Jul. 28, 2025)
- Intel issues a new warning (Jul. 28, 2025)
- How Tesla and Samsung's Strategic Alliance is Revolutionizing AI Semiconductors and Accelerating Autonomous Driving (Jul. 27, 2025)
- L&T Semiconductors eyes global play with Fujitsu General's deal, sharp focus on IP and automotive (Jul. 26, 2025)
- Silicon Photonics Market to Hit Significant Growth (Jul. 25, 2025)
- Paving the Way for Integrated Photonic Chips (Jul. 25, 2025)
- Intel facing another crossroads: 18A or 14A process node (Jul. 25, 2025)
- China Emerging as Significant Force in RISC-V Development and Adoption (Jul. 25, 2025)
- Tech giant Intel cancels investments in Poland, Germany (Jul. 25, 2025)
- Soitec VP: 'In the Near Term, Caution Is the Name of the Game' (Jul. 25, 2025)
- MIPS and Cyient Collaborate on RISC-V Power Solutions (Jul. 25, 2025)
- Top Automotive Semiconductor Solutions Powering the Cars of Tomorrow (Jul. 25, 2025)
- Taiwan deepens semiconductor cooperation with Europe (Jul. 25, 2025)
- Keysight Supports Post-Quantum Cryptography Evaluation (Jul. 24, 2025)
- How the semiconductor industry is grappling with cybersecurity threats (Jul. 24, 2025)
- Intel Earnings Call Preview: 14A Strategy, Foundry Challenges, and More (Jul. 24, 2025)
- TSMC's 2nm Production Is Expected to Break Records, With Capacity Surpassing 3nm & Soaring Demand Driven by Massive Interest From Big Tech (Jul. 24, 2025)
- Mike Yeager: 'Simulation Is Now Driving Product Design, Not Just Validating It' (Jul. 24, 2025)
- Mixel Supports Automotive SerDes Alliance (ASA) Motion Link SerDes IP (Jul. 23, 2025)
- TSMC to Exit GaN, Focus on Advanced Packaging (Jul. 23, 2025)
- UMC Announces Software Acquisition and Upcoming Earnings Release (Jul. 23, 2025)
- ADAS and Lidar Technology Revolutionize Automotive Safety in Modern Vehicles (Jul. 23, 2025)
- Arteris Selected by Whalechip for Near-Memory Computing Chip (Jul. 22, 2025)
- Samsung shortsightedly rejected Nvidia CEO Jensen Huang's reported HBM production and Foundry business proposals in 2018 (Jul. 22, 2025)
- Designing the future: AI innovation accelerated through university collaboration (Jul. 22, 2025)
- Synopsys strengthens India's role with push for world's first AI-based chip foundry (Jul. 22, 2025)
- Ansys and SASTRA Deemed University Establish Center of Excellence for Advanced Space and Defense Technologies (Jul. 22, 2025)
- ICTK Obtains 'CC EAL6' Certification, a High Level of Security Assurance for IT Products (Jul. 22, 2025)
- Arm Zena Compute Subsystems: Paving the Way to Scalable Automated Driving for the AI-Defined Era (Jul. 22, 2025)
- How Ireland is powering a sustainable future for the global semiconductor industry (Jul. 22, 2025)
- SEMI Predicts Record $125.5 Billion in Global Semiconductor Equipment Sales for 2025 (Jul. 22, 2025)
- Axiomise Partners With Bluespec to Verify Its RISC-V Cores (Jul. 21, 2025)
- 12-bit 5Msps High-Speed, Silicon-Proven ADC IP Core Available for Immediate Licensing (Jul. 21, 2025)
- EnSilica cuts post-quantum cryptography (PQC) silicon area with three-in-one IP block (Jul. 21, 2025)
- Siemens and UMC collaborate to advance EM/IR drop analysis with mPower technology (Jul. 21, 2025)
- Top 5% Companies Sweep Profits in Global AI Semiconductor Industry (Jul. 21, 2025)
- NVIDIA's CUDA Now Supports RISC-V Processors in AI Systems, Marking a Major Development & Posing a Threat to the x86 and ARM Duopoly (Jul. 19, 2025)
- Synopsys Completes Acquisition of Ansys (Jul. 18, 2025)
- Europe's photonic computing opportunity: Q.ANT's funding boosts competitive edge (Jul. 18, 2025)
- Rapidus Achieves Significant Milestone at its State-of-the-Art Foundry with Prototyping of Leading-Edge 2nm GAA Transistors (Jul. 18, 2025)
- Cadence Races First to Release LPDDR6/5X Memory IP for AI Infrastructure (Jul. 18, 2025)
- Fraunhofer IPMS and DIVE target cleaner, more efficient chip production (Jul. 18, 2025)
- President of Armenia Awards Synopsys Armenia President Yervant Zorian the First-Class Medal for "Service to the Homeland" (Jul. 18, 2025)
- TSMC to top $100bn as it plans 11 fabs in Taiwan (Jul. 18, 2025)
- Korea joins Horizon Europe R&D programme (Jul. 18, 2025)
- New Semiconductor Material for the Chips of the Future (Jul. 18, 2025)
- 2025 TSMC Technical Talk: Exploring Diverse Paths in Semiconductor Technology (Jul. 17, 2025)
- Pioneering Performance: How Allegro DVT Is Accelerating AV1 Adoption in SiliconPermalink (Jul. 17, 2025)
- Innosilicon Scales LPDDR5X/5/4X/4 and DDR5/4 Combo IPs to 28nm and 22nm, Cementing Its Position as the "One Stop" for Memory Interface Solutions (Jul. 17, 2025)
- Perceptia Devices Release pPLL08W, best-in-class RF PLL IP in GF22FDX (Jul. 17, 2025)
- The chiplet future could be harmonious (Jul. 17, 2025)
- How Mature-Technology ASICs Can Give You the Edge (Jul. 17, 2025)
- TSMC Reports Second Quarter EPS of NT$15.36 (Jul. 17, 2025)
- Quantropi brings post-quantum cryptography to STM32 just in time to face new threats (Jul. 17, 2025)
- Sustainability in Action 2025, a strategic vision for a responsible and resilient business (Jul. 17, 2025)
- European Funding Deals: SiPearl, Exein, Q.Ant Aim For Scaleup (Jul. 17, 2025)
- German government plans new semiconductor factories (Jul. 17, 2025)
- Fraunhofer develops "resource-efficient" measurement system for semiconductor wafer production (Jul. 17, 2025)
- ESD Alliance Reports Electronic System Design Industry Posts $5.1 Billion in Revenue in Q1 2025 (Jul. 16, 2025)
- InPsytech Tapes Out F2F SoIC Design Compliant with UCIE 2.0 Standard Enabling High-Speed Interconnects for 3D Heterogeneous Integration (Jul. 16, 2025)
- Siemens collaborates with SK keyfoundry to launch 130nm automotive power semiconductor Calibre PERC PDK (Jul. 16, 2025)
- Thalia Design Automation launches AMALIA Platform 25.2 (Jul. 16, 2025)
- IHP, eMemory and its subsidiary PUFsecurity Break Ground on Open Access to Hardware PUF-based Security IP in Europe (Jul. 16, 2025)
- New architecture for AI datacentres proposed (Jul. 16, 2025)
- Semiconductor Fab Shakeups Signal Application-Focused Plans Ahead (Jul. 16, 2025)
- How AI is Pushing Semiconductor Manufacturing into a Generational Shift (Jul. 16, 2025)
- Synopsys Receives All Necessary Approvals for Proposed Acquisition of Ansys (Jul. 15, 2025)
- GUC Tapes Out Industry-Leading UCIe Face-Up IP for TSMC SoIC-X (Jul. 15, 2025)
- Siemens' Veloce CS selected by Arm for Neoverse compute subsystems verification and validation (Jul. 15, 2025)
- Niobium Superconducting Interconnects Open New Horizons for Quantum Computing (Jul. 15, 2025)
- Breakthrough in AR/VR SoC Innovation: Full Suite of Cutting-Edge Interface & Analog IP Cores Licensed by Tier-1 U.S. Customer (Jul. 14, 2025)
- IPrium releases SOQPSK-TG Demodulator for Aerospace Telemetry (Jul. 14, 2025)
- proteanTecs Launches Solution for System Production Analytics Based on Chip Telemetry (Jul. 14, 2025)
- HCLTech Q1 FY26: Reports 10.8% QoQ net profit decline at Rs. 3,843 Cr (Jul. 14, 2025)
- Broadcom Cancels Spain Fab, Impacting Europe Semiconductor Ambitions (Jul. 14, 2025)
- First Tetrivis LTD Consumer Product is Finalist in IEEE Smart Lighting "Let's Make Light" Contest. (Jul. 11, 2025)
- Arasan Announces immediate availability of its Total IP for Embedded USB2 (eUSB2) with Controller and PHY (Jul. 11, 2025)
- IC'Alps Joins GlobalFoundries GlobalSolutions™ Ecosystem to Accelerate ASIC Development (Jul. 11, 2025)
- JEDEC Releases New LPDDR6 Standard to Enhance Mobile and AI Memory Performance (Jul. 11, 2025)
- RISC-V Solidifies Presence in China as Global Momentum Builds (Jul. 11, 2025)
- Andes Technology Advances High-Performance RISC-V Strategy with U.S.-based Design Center: Condor Computing (Jul. 10, 2025)
- Lossless Data Compression Webinar: Choosing Algorithms and IP Core Accelerators (Jul. 10, 2025)
- Andes Technology's AutoOpTune™ Applies Genetic Algorithms to Accelerate RISC-V Software Optimization (Jul. 10, 2025)
- Europe's first HPC ARM processor lands at TSMC (Jul. 10, 2025)
- TSMC June 2025 Revenue Report (Jul. 10, 2025)
- Custom ASIC Design for CGM, TPMS & SATCOM applications from T2M-IP (Jul. 09, 2025)
- Cadence Introduces Industry-First LPDDR6/5X 14.4Gbps Memory IP to Power Next-Generation AI Infrastructure (Jul. 09, 2025)
- SiPearl finally tapes out Europe's supercomputer chip (Jul. 09, 2025)
- 3 Acquisitions Show Heavy Investment in AI, IoT, and High-End Processors (Jul. 09, 2025)
- Exclusive: Arm estimates a 14-fold increase in data center customers since 2021, company says (Jul. 09, 2025)
- Japanese Semiconductor Manufacturer Races Toward 2nm, Backed by IBM (Jul. 09, 2025)
- From smarter sensing to safer driving: GlobalFoundries solutions driving ADAS innovation (Jul. 09, 2025)
- Ceva, Inc. Schedules Second Quarter 2025 Earnings Release and Conference Call (Jul. 09, 2025)
- PUFsecurity, a subsidiary of eMemory, Achieves NIST CAVP Certification for PQC Algorithms, Launches PUFpqc Architecture for Quantum-Resilient SoCs (Jul. 08, 2025)
- GlobalFoundries to Acquire MIPS to Accelerate AI and Compute Capabilities (Jul. 08, 2025)
- French Startup Combines Electronics, Photonics And Optics For AI (Jul. 08, 2025)
- OpenAI scales security to protect IP from Chinese foreign espionage threats (Jul. 08, 2025)
- Keysight and Korea Automotive Technology Institute Team Up to Improve Vehicle-to-Everything Component Testing (Jul. 08, 2025)
- Samsung's Q2 profit falls short as chip slump, tariffs take toll (Jul. 08, 2025)
- Menta Licenses Menta Embedded FPGA Programmable IP To Renesas For Its ForgeFPGA Product Line (Jul. 07, 2025)
- Samsung Targets 70% 2nm Yield in 6 Months to Win Big Clients (Jul. 07, 2025)
- 160-core RISC V Board Is The M.2 CoProcessor You Didn't Know You Needed (Jul. 07, 2025)
- Samsung delays 1.4nm node, doubles down on 2nm process enhancement (Jul. 04, 2025)
- TSMC to exit gallium nitride semiconductor business in two years (Jul. 04, 2025)
- Are open-source RISC-V CPUs a threat to ARM Holdings' business? (Jul. 04, 2025)
- Synopsys, Cadence, and Siemens resume EDA supply to China (Jul. 04, 2025)
- Qt to buy IAR for $230m (Jul. 04, 2025)
- South Korean chipmakers accelerate facility investments amid booming AI demand (Jul. 04, 2025)
- Infineon to Start 300 mm GaN Wafer Production as TSMC Exits Market (Jul. 04, 2025)
- Tech Note: Use this Flexible and Efficient AC97 IP Core for Simple Audio Interfaces and Legacy System Upgrades (Jul. 04, 2025)
- Intel Shifts foundry focuses to 14A node; UBS keeps Neutral rating. (Jul. 03, 2025)
- Renesas unveils RA8P1 MCUs with Cortex-M85, NPU (Jul. 03, 2025)
- A statement from Tony Hemmelgarn (Jul. 03, 2025)
- Tenstorrent Acquires Blue Cheetah Analog Design (Jul. 02, 2025)
- Consumer-Tech Brand, Nothing, Taps Ceva's RealSpace Software to Bring Immersive Spatial Audio to Headphones and Earbuds (Jul. 02, 2025)
- Intel Reportedly Weighs Dropping 18A, Bets on 14A to Attract Clients and Challenge TSMC (Jul. 02, 2025)
- Arteris Expands Multi-Die Network-on-Chip Design IP and Software (Jul. 02, 2025)
- Three Pillars for Semiconductor Success in the Chiplet Economy (Jul. 02, 2025)
- MIPI Alliance Recognizes Members for Contributions and Leadership at 12th Annual Awards Ceremony (Jul. 02, 2025)
- Nordic Semiconductor and Sercomm Corporation partner on cellular IoT module designed for applications demanding reliable, power-saving performance (Jul. 02, 2025)
- Scaling for Success: How Weebit is Preparing for its Next Phase of Growth (Jul. 02, 2025)
- Europe prepares its Quantum Act (Jul. 02, 2025)
- How GF FDX™ and FinFET solutions are powering the next generation of Wi-Fi (Jul. 02, 2025)
- Chips&Media's New APV CODEC Delivers Extreme Visual Quality to the Android Industry (Jul. 01, 2025)
- Codasip board initiates an expedited process to sell the company (Jul. 01, 2025)
- Renesas Strengthens Power Leadership with New GaN FETs for High-Density Power Conversion in AI Data Centers, Industrial and Charging Systems (Jul. 01, 2025)
- How AI Is Proving Useful in New Materials Discovery for the 2nm Era (Jul. 01, 2025)
- Siemens completes acquisition of Dotmatics (Jul. 01, 2025)
- What Tech Innovations Did Arm Deliver in June 2025? (Jul. 01, 2025)
- Quantum Computers Just Reached the Holy Grail - No Assumptions, No Limits (Jul. 01, 2025)
- Wavetek Deploys Silvacos Victory TCAD™ to Drive Innovation in GaN-Based Connectivity Solutions (Jul. 01, 2025)
- Ethernet IP Core for Next-Gen Automotive SoCs: Complementing CAN, LIN, and FlexRay with Scalable Connectivity (Jun. 30, 2025)
- Vayavya Labs Accelerating Agile Automotive Development for OEMs and Tier-1s with Virtual ECUs (Jun. 30, 2025)
- Synopsys and Ansys Provide Update Regarding Expected Timing of Acquisition Close (Jun. 30, 2025)
- Keysight and Synopsys employ AI for RF design migration (Jun. 30, 2025)
- Synopsys receives Frost & Sullivan's Technology Innovation Leadership Award (Jun. 30, 2025)
- Synopsys Reinvents Semiconductor Design: AI-Driven EDA Tools Lead the Charge in Next-Gen Chip Innovation (Jun. 28, 2025)
- FH (Frequency Hopping) - OFDM Modem Available For Immediate Implementation From Global IP Core (Jun. 27, 2025)
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core (Jun. 27, 2025)
- Ceva Brings Precise, Spatial Control to Smart TV, IoT Interfaces (Jun. 27, 2025)
- Level 2+ Could Be a Long-Term Middle Ground (Jun. 27, 2025)
- Photonics, Power, and Packaging at the 6G Research Frontier (Jun. 27, 2025)
- Intel begins "major" programme of layoffs and closes automotive unit (Jun. 27, 2025)
- Arm: Chiplets Can't Deliver on TCO Without an Ecosystem (Jun. 27, 2025)
- The 10 Hottest Semiconductor Startups Of 2025 (So Far) (Jun. 27, 2025)
- eMemory's NeoFuse OTP Qualifies on TSMC's N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips (Jun. 26, 2025)
- China to have 30% of foundry capacity by 2030 (Jun. 26, 2025)
- VeriSilicon Expands DSP Portfolio with Silicon-Proven ZSP5000 Vision Core Series for Edge Intelligence (Jun. 26, 2025)
- Arteris Wins "AI Engineering Innovation Award" at the 2025 AI Breakthrough Awards (Jun. 26, 2025)
- VTT joins PIXEurope, the advanced European photonics pilot line (Jun. 26, 2025)
- Imec-Backed Eyeo Splits Light into Colors (Jun. 26, 2025)
- ELENA project pioneers Europe's LNOI PIC supply chain (Jun. 26, 2025)
- Silvaco, Fraunhofer ISIT partner to advance GaN technology (Jun. 26, 2025)
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- Programmable Hardware Delivers 10,000X Improvement in Verification Speed over Software for Forward Error Correction (Jun. 26, 2025)
- Siemens streamlines design and analysis of complex, heterogeneously integrated 3D ICs (Jun. 25, 2025)
- BrainChip and HaiLa Partner to Demonstrate Ultra-Low Power Edge AI Connectivity for IoT Sensor Applications (Jun. 25, 2025)
- Sofics Delivers Remarkable PPA & R Performance Near Physical Limits on TSMC 2nm Technology (Jun. 25, 2025)
- Nordic Semiconductor acquires Memfault, launches the first complete chip-to-cloud platform for lifecycle management of connected products (Jun. 25, 2025)
- Samsung Reportedly Prioritizes 2nm/4nm Improvements, with 1.4nm Unlikely Before 2028-29 (Jun. 25, 2025)
- Xiphera and Austin Electric Partner to Strengthen Hardware-Based Security in South Korea (Jun. 25, 2025)
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- Cadence appoints CFO (Jun. 25, 2025)
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- IPValue Affiliate Licenses Samsung to Patent Portfolio Acquired from Intel (Jun. 25, 2025)
- How Chip Startups Are Changing the Way Chips Are Designed (Jun. 25, 2025)
- Faraday Delivers Latest SerDes IP to Complete Interface Lineup on UMC's 22nm Platform (Jun. 24, 2025)
- Creonic's DVB-S2 and DVB-S2X IP Cores Now Support the New DVB-NIP Standard (Jun. 24, 2025)
- Ceva Launches MotionEngine™ Hex: Bringing Precise, Touch-Free, Spatial Control to Smart TV, Gaming, and IoT Interfaces (Jun. 24, 2025)
- New EDA tools arrive for chiplet integration, package verification (Jun. 24, 2025)
- Samsung Foundry Postpones 1.4nm Trial Line Investment, Focuses on 2nm (Jun. 24, 2025)
- LASER 2025: UK Photonics industry surges to £18.5 billion turnover in 2024 (Jun. 24, 2025)
- Global Semiconductor Foundry 2.0 Markets Q1 2025 Revenue Jumps 13% YoY Driven by AI Chip Demand (Jun. 24, 2025)
- AMD will launch PCIe 6.0 devices next year but consumers will have to wait almost half a decade to get it - here's why (Jun. 24, 2025)
- RISC-V and AI: Innateras PULSAR Shakes Up the Edge (Jun. 24, 2025)
- TU/e Launches Research Hub for Semiconductors and Photonics (Jun. 24, 2025)
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- Rapidus announces collaboration with Siemens for 2nm semiconductor design (Jun. 23, 2025)
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- Continental to Create an Advanced Electronics & Semiconductor Solutions Organization (Jun. 23, 2025)
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- Ausdia Solves Critical Design Flow Gap with OneSource Constraint Translation at DAC 2025 (Jun. 23, 2025)
- Launch of BrainChip Developer Hub Accelerates Event-Based AI Innovation on Akida™ Platform with Release of MetaTF 2.13 (Jun. 22, 2025)
- 3 Trending Sessions Led by Veriest at DAC 2025 (Jun. 22, 2025)
- SMIC - Beneficiary of China's Semiconductor Self-Sufficiency Drive (Jun. 22, 2025)
- True Circuits Introduces the Low-jitter Digital Ultra+ PLL at the Design Automation Conference (Jun. 20, 2025)
- The Chiplet Economy: Three Pillars for Semiconductor Success (Jun. 20, 2025)
- EU Project ELENA Pioneers LNOI Platform for Next-Gen Photonic Circuits & Europe's 1st Commercial Supplier of LNOI Wafers (Jun. 20, 2025)
- From Rigid to Agile: Make the Shift from Open Source to Agnisys IDesignSpec (Jun. 20, 2025)
- CEA-Leti and Soitec Announce Strategic Partnership to Leverage FD-SOI for Enhanced Security of Integrated Circuits (Jun. 19, 2025)
- Keysight Enables AMD to Showcase Electrical PCI Express® Compliance up to 64 GT/s (Jun. 19, 2025)
- BT Group Joins the CHERI Alliance to Advance Cybersecurity Innovation (Jun. 19, 2025)
- CAST Launches Multi-Channel DMA IP Core Ideal for Streaming Applications (Jun. 19, 2025)
- Irelands "Silicon Island" strategy could boost Europes analog ecosystem (Jun. 19, 2025)
- DCD-SEMI Joins MIPI Alliance and Unveils Latest I3C IP at MIPI Plugfest Warsaw 2025 (Jun. 18, 2025)
- Siemens collaborates with Samsung Foundry on advanced node product certifications and EDA innovation (Jun. 18, 2025)
- PCIe 7.0 Keeps Pace with AI Demands (Jun. 18, 2025)
- QuickLogic to Exhibit at Chips to Systems Conference (DAC) 2025 (Jun. 18, 2025)
- Synopsys Accelerates AI and Multi-Die Design Innovation on Advanced Samsung Foundry Processes (Jun. 17, 2025)
- Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry (Jun. 17, 2025)
- Xylon Celebrates 30 Years of Innovation in Embedded Electronics (Jun. 17, 2025)
- Nordic Semiconductor accelerates edge AI leadership with acquisition of Neuton.AI (Jun. 17, 2025)
- Arteris Accelerates AI-Driven Silicon Innovation with Expanded Multi-Die Solution (Jun. 17, 2025)
- HBM development roadmap revealed: HBM8 with a 16,384-bit interface and embedded NAND in 2038 (Jun. 17, 2025)
- Why Standardized SerDes Interfaces Are Essential for In-Vehicle Networks (Jun. 17, 2025)
- Photonics West: Vision Components MIPI camera drivers for Raspberry Pi (Jun. 17, 2025)
- InCore Unveils SoC Generator Platform: From Idea to FPGA Validation in Minutes; Demonstrates Silicon Proof of Auto-Generated SoC (Jun. 16, 2025)
- Advanced MIPI IP Cores for Automotive, IoT, Consumer, Imaging & Display SoCs (Jun. 16, 2025)
- Safety Without Security Is an Illusion in the Age of Autonomous Vehicles (Jun. 16, 2025)
- SmartDV Introduces Advanced H.264 and H.265 Video Encoder and Decoder IP (Jun. 16, 2025)
- TSMC: King Of Data Center AI (Jun. 16, 2025)
- Sustainable semiconductor manufacturing - too little too late or Europe protectionism? (Jun. 16, 2025)
- TSMC's Phenomenal 2nm Yield Rates Would Likely Put Alternatives From Samsung & Intel Foundry Way Behind; Apple, NVIDIA & AMD to Be Major Customers (Jun. 16, 2025)
- Imec and Tokyo Electron extend partnership to accelerate the development of beyond-2nm nodes (Jun. 16, 2025)
- BOS Joins VESA and UCIe to Advance Global Standards in Display and Chiplet Technology (Jun. 16, 2025)
- Samsung, TSMC set stage for fierce race in 2nm chip tech (Jun. 15, 2025)
- M31 Ranked in the Top 5% of TPEx-Listed Companies in the Corporate Governance Evaluation for Four Consecutive Years (Jun. 13, 2025)
- Samsung Foundry Struggles With 3nm Yields at 50% as TSMC Climbs Past 90% (Jun. 13, 2025)
- Ai drives power management into top ten fabless chip list (Jun. 13, 2025)
- Risks of Lack of Strategy for AI in Supply Chains (Jun. 13, 2025)
- Nordic Semiconductor to showcase cutting-edge cellular IoT solutions at MWC Shanghai 2025 (Jun. 13, 2025)
- Chinese regulator holds off on clearing $35B Synopsys-Ansys merger - report (Jun. 13, 2025)
- PCI-SIG® Announces PCIe® Optical Interconnect Solution (Jun. 12, 2025)
- Alphawave Semi at the Forefront of PCIe® 7.0 Specification: Showcasing Next-Gen Chiplet Interoperability and Optical PCIe Technology at PCI-SIG® Developers Conference 2025 (Jun. 12, 2025)
- Imec achieves record-breaking RF GaN-on-Si transistor performance for high-efficiency 6G power amplifiers (Jun. 12, 2025)
- "TSMC-UTokyo Lab" Launched to Promote Advanced Semiconductor Research, Education and Talent Incubation (Jun. 12, 2025)
- Elliptic Labs' AI Platform Now Optimized for Ceva's NeuPro-Nano NPU - Enabling Smarter Edge Devices (Jun. 11, 2025)
- IP Cores, Inc. ships new FFT4T Streaming Multi-Channel FFT Core (Jun. 11, 2025)
- Numem Addresses AI's Dirty Secret: Memory Is the Real Bottleneck (Jun. 11, 2025)
- CFX's 130nm EEPROM IP Passes Customer Product-Level Evaluation, Ready for Mass Commercial Adoption (Jun. 11, 2025)
- VeriSilicons AI-ISP Custom Chip Solution Enables Mass Production of Customers Smartphones (Jun. 11, 2025)
- Siemens' PAVE360 to support new Arm Zena Compute Subsystems (Jun. 11, 2025)
- OPENEDGES Collaborates with Renesas on Memory Subsystem IPs for Next-Generation MPU Platform Development (Jun. 11, 2025)
- Cadence Advances Design and Engineering for Europe's Manufacturers on NVIDIA Industrial AI Cloud (Jun. 11, 2025)
- Imec presents 150 GSa/s Digital-to-Analog Converter (DAC) achieving 300 Gb/s data transmission (Jun. 11, 2025)
- Synopsys Achieves PCIe 6.x Interoperability Milestone with Broadcom's PEX90000 Series Switch at PCI-SIG DevCon 2025 (Jun. 11, 2025)
- UK plans $1bn AI supercomputer (Jun. 11, 2025)
- Honda Reportedly Plans Rapidus Investment to Secure Advanced Chips Beyond TSMC Deal (Jun. 11, 2025)
- Qualcomm opens new AI R&D center in Vietnam (Jun. 11, 2025)
- I3C: The Next-Generation Serial Communication Bus (Jun. 11, 2025)
- Andes Technology Announces AndeSight™ IDE v5.4 to Streamline AI and Embedded Software Development on RISC-V (Jun. 10, 2025)
- VeriSilicon's Ultra-Low Energy NPU Provides Over 40 TOPS for On-Device LLM Inference in Mobile Applications (Jun. 10, 2025)
- IntoPIX Presents Its New Titanium Software Suite: Empowering AV-Over-IP Workflows With Speed, Quality & Interoperability (Jun. 10, 2025)
- Qualitas Semiconductor Successfully Develops UCIe v2.0-Compliant PHY IP, Enabling Up to 512Gbps Die-to-Die Connectivity (Jun. 10, 2025)
- sureCore launches comprehensive suite of silicon services (Jun. 10, 2025)
- Silicon Proven DisplayPort 1.4 Tx & Rx PHY IP Cores, Ready to license in 12/28/40/55nm (Jun. 10, 2025)
- Faraday Unveils FlashKit™-22RRAM: an eNVM-based SoC Development Platform for IoT (Jun. 10, 2025)
- IAR Platform Accelerates Embedded Development with Updated Toolchains for Arm and RISC-V (Jun. 10, 2025)
- BOS Semiconductors, Selected for the 2025 Innovation Premier 1000 (Jun. 10, 2025)
- TSMC May 2025 Revenue Report (Jun. 10, 2025)
- QuickLogic Joins Intel Foundry Chiplet Alliance (Jun. 10, 2025)
- VeriSilicon's Scalable High-Performance GPGPU-AI Computing IPs Empower Automotive and Edge Server AI Solutions (Jun. 09, 2025)
- Qualcomm To Acquire UK's Alphawave For US$2.4 Billion (Jun. 09, 2025)
- Sarcina Technology advances photonic package design to address key data center challenges (Jun. 09, 2025)
- IntoPIX Accelerates Automotive Innovation With TicoRAW & JPEG XS On Lattice Low Power FPGAs (Jun. 09, 2025)
- Samsungs Gap with China's SMIC in Foundry Market Narrows to Mere 1.7% (Jun. 09, 2025)
- How to Optimize Energy Consumption in IoT Devices (Jun. 09, 2025)
- Andes Technology Unveils AndesAIRE™ AnDLA™ I370: A Next-Generation Deep Learning Accelerator for Edge and Endpoint AI (Jun. 08, 2025)
- Keysight and Synopsys Deliver an AI-Powered RF Design Migration Flow for Transition from TSMC's N6RF+ to N4P Process Node (Jun. 06, 2025)
- IntoPIX And Nextera-Adeas Announce Latest IPMX Demo Design With JPEG XS On Compact FPGAs At Infocomm 2025 (Jun. 06, 2025)
- Imec and Ghent University build integrated microwave photonics chip (Jun. 06, 2025)
- Project GENESIS minimizes ecological footprint in Europe's semiconductor industry (Jun. 06, 2025)
- €1.1bn plan for GF fab in Dresden – reports (Jun. 06, 2025)
- FAMES Pilot Line Launches FAMES Academy To Train Europe's Chip Engineers with Skills to Leverage FD-SOI Technology and Design Circuits Using Advanced Setups (Jun. 06, 2025)
- Rambus at Rosenblatt's AI Summit: Navigating Memory in AI's Future (Jun. 06, 2025)
- Automakers Can Launch AI-Defined Vehicles a Full Year Sooner - Powered by Arm Zena CSS (Jun. 05, 2025)
- Chips&Media Unveils WAVE-N: A Custom NPU for High-Quality, High-Resolution Imaging (Jun. 05, 2025)
- GlobalFoundries Announces $16B U.S. Investment to Reshore Essential Chip Manufacturing and Accelerate AI Growth (Jun. 05, 2025)
- IntoPIX Showcases Smart Image Sensor Compression At AutoSens US 2025 (Jun. 05, 2025)
- CAST Expands Functional Safety Line with Additional Certified IP Cores (Jun. 05, 2025)
- Alphawave Semi Tapes Out Breakthrough 36G UCIe™ IP on TSMC 2nm, Unlocking Foundational AI Platform IP on Nanosheet Processes (Jun. 05, 2025)
- Intel Foundry Direct Connect 2025 Expands Roadmap And Partnerships (Jun. 05, 2025)
- TSMC Achieves 90% Yield in 2nm Memory Chip Production (Jun. 05, 2025)
- Plug and Play Expands Semiconductor Ecosystem Program with New Synopsys Collaboration to Accelerate Chip Design Innovation (Jun. 05, 2025)
- NCSC proposes its PQC transition timeline to UK Policy makers: guiding the UK to a quantum-safe future, Jeremy Bradley NCSC (Jun. 05, 2025)
- Transition Plan: Leonardo publishes its transition strategy (Jun. 05, 2025)
- IP Cores, Inc. Announces New Shipment of PQC1 Hardware Accelerator for Post-Quantum Cryptography (Jun. 04, 2025)
- Dolphin Semiconductor Provides High-Efficiency DC-DC Converter in 40nm to XHSC for High-end Industrial Products Applications (Jun. 04, 2025)
- New president reiterates commitment to Korea's tech future (Jun. 04, 2025)
- Using Design-to-Test Workflows and Managing the IP Lifecycle in Chiplet Designs (Jun. 04, 2025)
- Arm Unwraps Automotive Compute Platform Aimed at 'AI-Defined Vehicles' (Jun. 04, 2025)
- Cadence Extends Support for Automotive Solutions on Arm Zena Compute Subsystems (Jun. 04, 2025)
- Joseph von Fraunhofer Prize 2025 for research team at Fraunhofer IIS (Jun. 04, 2025)
- AccelerComm Secures $15m Funding to Speed Adoption of Technology for Space-Based 5G Networks to Deliver Universal Mobile Coverage (Jun. 03, 2025)
- OpenGMSL™ Association Announces Formation to Revolutionize the Future of In-Vehicle Connectivity (Jun. 03, 2025)
- FlexGen Streamlines NoC Design as AI Demands Grow (Jun. 03, 2025)
- Addressing e-waste with recyclable, healable circuit boards (Jun. 03, 2025)
- Siemens and Northrop Grumman continue collaboration to advance digital ecosystem (Jun. 03, 2025)
- Making Technology Real: GlobalFoundries' Vision for the Future (Jun. 02, 2025)
- Siemens and IBM collaborate to bring SysML v2 model-based systems engineering to Siemens Xcelerator (Jun. 02, 2025)
- HPC Innovator Taps Aion Silicon for $12M RISC-V Accelerator Program (Jun. 02, 2025)
- Chevin are proud to be awarded runner-up of Arm Silicon Startups Contest 2025 (Jun. 02, 2025)
- 12-bit, 5MS/s SAR ADC IP Core for Ultra-Low Power Precision Applications: T2M Unveils New IP (Jun. 02, 2025)
- What's making smart cities and homes even smarter? (Jun. 02, 2025)
- Ex-TSMC executive joins Samsung Foundry to lead US expansion (Jun. 02, 2025)
- Metanoia Communications Selects Andes Technology RISC-V Processor to Boost 5G O-RAN Efficiency and Accelerate Development (Jun. 02, 2025)
- Japan's Softbank will join hands with U.S. Intel to develop a new memory semiconductor that will be used for artificial intelligence (AI) (Jun. 01, 2025)
- How Cadence Is Powering Greener Semiconductor Innovation (May. 30, 2025)
- SCI Semiconductor raises £2.5m to develop security-enhanced microcontroller based on CHERI (May. 29, 2025)
- 300mm RF silicon interposer platform for chiplet-based heterogeneous integration demonstrates record-low insertion loss at frequencies up to 325GHz (May. 29, 2025)
- TSMC to Open EU Design Center in Munich in Q3 (May. 29, 2025)
- Synopsys Issues Statement in Connection with BIS Letter (May. 29, 2025)
- AI memory chip guru to unveil road map for next-generation HBMs (May. 29, 2025)
- EnSilica Establishes New Engineering Hub in Cambridge (May. 28, 2025)
- Brite Semiconductor Releases TCAM IP based on 28HKC+ Process (May. 28, 2025)
- TSMC to Open First European Design Center in Munich by Q3 2025, Focusing on AI and Automotive (May. 28, 2025)
- TSMC dazzles in Amsterdam (May. 28, 2025)
- SCI Semiconductor secures £2.5m towards developing CHERI-secured MCU (May. 28, 2025)
- ICTK Partners with BTQ of Canada for Quantum-safe Security Solutions (May. 28, 2025)
- Toward High-Density Embedded LiDAR for the Autonomous Vehicle of Tomorrow (May. 28, 2025)
- Rapidus to assist training in Vietnam's semiconductor industry (May. 28, 2025)
- Arteris Bridges Hardware-Software Gap with New EDA Tool (May. 28, 2025)
- CEA Backs RISC-V for Sovereign, Scalable Computing (May. 28, 2025)
- Aion Silicon Tapped for $12M RISC-V Accelerator Program for HPC and AI (May. 28, 2025)
- Synopsys Posts Financial Results for Second Quarter Fiscal Year 2025 (May. 28, 2025)
- Trump Blocks Chip Design Software Firms From Selling In China (May. 28, 2025)
- Ireland Maps Out Silicon Island National Semiconductor Strategy (May. 28, 2025)
- Keysight Technologies (KEYS) to Acquire Divested Assets from Synopsys and Ansys (May. 28, 2025)
- Imec's 300mm RF silicon interposer platform for chiplet-based heterogeneous integration demonstrates record-low insertion loss at frequencies up to 325GHz (May. 27, 2025)
- 300mm RF silicon interposer platform for chiplet-based heterogeneous integration demonstrates record-low insertion loss at frequencies up to 325GHz (May. 27, 2025)
- Towards next-generation edge-AI technologies: EU consortium opens services to external customers (May. 27, 2025)
- Soitec reports fourth quarter revenue and Full-year results of fiscal year 2025 (May. 27, 2025)
- Alphawave IP extends Qualcomm PUSU deadline for third time (May. 27, 2025)
- Imec ITF World 2025: The hardware horizon for AI (May. 27, 2025)
- Keysight Announces Executive Leadership Transitions and New Appointments (May. 27, 2025)
- High-Performance USB 3.2 Gen1 & Gen2 PHY and Controller IP Cores from T2M, Powers Next-Gen SoCs (May. 26, 2025)
- RISC-V Turns 15 With Fast Global Adoption (May. 26, 2025)
- AMD sees TSMC as the clear favorite for 2nm, but Samsung remains in the game (May. 26, 2025)
- CFX's 55nm BCD process OTP IP has been put on the shelves (May. 26, 2025)
- Veriest & Xsight - Advancing Data Transfer for Cloud Data Centers (May. 26, 2025)
- Samsung to use Glass Substrate for Semiconductor manufacturing in 2028 (May. 25, 2025)
- Xiphera Wins ECSO STARtup Award 2025 for Innovation in Cybersecurity (May. 23, 2025)
- Analogue Insight and Tetrivis Announce Joint Development of "Eurytion RFK1," a UCIe based 12nm Ka/Ku-Band RF Chiplet Transceiver (May. 23, 2025)
- Smart Chips, Safe Trips: How DFT Powers the Future of Autonomy with Vijayaprabhuvel Rajavel (May. 23, 2025)
- GlobalFoundries partners with A*STAR to accelerate advanced packaging innovation (May. 22, 2025)
- SiFive Collaborates with Red Hat to Support Red Hat Enterprise Linux for RISC-V (May. 22, 2025)
- EnSilica expands satcoms user terminal portfolio with dual-beam, dual-polarization Ku-band analogue beamformer chipset (May. 22, 2025)
- Pioneering energy-efficient AI with innovative ferroelectric technology (May. 22, 2025)
- Samsung Electronics Nears Decision on Foundry Business Separation (May. 22, 2025)
- How Taiwan stays ahead in semiconductor race (May. 22, 2025)
- BrainChip CTO to Present on Architectural Innovation for Low-Power AI at the Embedded Vision Summit (May. 21, 2025)
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- Expedera's Origin Evolution NPU IP Brings Generative AI to Edge Devices (May. 21, 2025)
- Creonic Adds oFEC Codec IP Core to Portfolio, Expanding High-Speed Networking Solutions for ASIC and FPGA (May. 21, 2025)
- The RISC-V World Sees Changes, Milestones, and Innovations (May. 21, 2025)
- Intel eyes sale of network and edge unit as cost-cutting continues: report (May. 21, 2025)
- Five workflows for tackling heterogeneous integration of chiplets for 2.5D/3D (May. 21, 2025)
- Siemens democratizes AI-driven PCB design for small and medium electronics teams (May. 21, 2025)
- NVIDIA Unveils NVLink Fusion for Industry to Build Semi-Custom AI Infrastructure With NVIDIA Partner Ecosystem (May. 20, 2025)
- sureCore extends its sureFIT design service to include custom memory solutions for AI applications (May. 20, 2025)
- GlobalFoundries partners with A*STAR to accelerate advanced packaging innovation (May. 20, 2025)
- Advanced IC Packaging: The Roadmap to 3D IC Semiconductor Scaling (May. 20, 2025)
- Movellus Claims First On-Die Power Delivery Network Analyzer (May. 20, 2025)
- Boosting RISC-V SoC performance for AI and ML applications (May. 20, 2025)
- SiFive Collaborates with Red Hat to Support Red Hat Enterprise Linux for RISC-V (May. 20, 2025)
- Infineon to revolutionize power delivery architecture for future AI server racks with NVIDIA (May. 20, 2025)
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- Versatile Whitebox 1G Ethernet PHY IP Core with BroadR-Reach™ for Connected Automotive and Industrial Systems (May. 19, 2025)
- Codasip: Toward Custom, Safe, Secure RISC-V Compute Cores (May. 19, 2025)
- Semidynamics: From RISC-V with AI to AI with RISC-V (May. 19, 2025)
- InPsytech Joins Samsung SAFE™ IP Partner Program for Excellence in ONFI and UCIe IP Solutions (May. 19, 2025)
- Secure-IC at Computex 2025: Enabling Trust in AI, Chiplets, and Quantum-Ready Systems (May. 19, 2025)
- RISC-V Technology Seeing Growing Maturity and Penetration (May. 19, 2025)
- Siemens to bring advanced timing constraint capabilities to EDA design flow with Excellicon acquisition (May. 19, 2025)
- Siemens to bring advanced timing constraint capabilities to EDA design flow with Excellicon acquisition (May. 19, 2025)
- Programmable AI Silicon Would Help Meet AI Workload Demand (May. 19, 2025)
- Six HCLTech campuses in India receive the coveted TRUE Zero Waste Platinum Certification (May. 19, 2025)
- Imec and TNO Launch Holst Centre Photonics Lab to Accelerate Integrated Photonics Innovation in the Netherlands (May. 18, 2025)
- Perforce Partners with Siemens for Software-Defined, AI-Powered, Silicon-Enabled Design (May. 16, 2025)
- Semidynamics: From RISC-V with AI to AI with RISC-V (May. 16, 2025)
- TSMC Board of Directors Meeting Resolutions (May. 16, 2025)
- Arm Evolves Compute Platform Naming for the AI Era (May. 16, 2025)
- Quantum Computing Roadmaps: A Look at The Maps And Predictions of Major Quantum Players (May. 16, 2025)
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- Samsung Reportedly Revises High-NA EUV Plans: Limited Memory Use, Foundry Begins at 1.4nm (May. 16, 2025)
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- Secafy Licenses Menta's eFPGA IP to Power Chiplet-Based Secure Semiconductor Designs (May. 15, 2025)
- Arteris Announces Financial Results for the First Quarter and Estimated Second Quarter and Updated Full Year 2025 Guidance (May. 15, 2025)
- Perforce Partners with Siemens for Software-Defined, AI-Powered, Silicon-Enabled Design (May. 15, 2025)
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- Keysight Quantum Control System Embedded within Fujitsu and RIKENs World-Leading 256-Qubit Quantum Computer (May. 15, 2025)
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- Siemens leverages AI to close industry's IC verification productivity gap in new Questa One smart verification solution (May. 14, 2025)
- Rambus Delivers Industry-Leading Client Chipsets for Next-Generation AI PC Memory Modules (May. 14, 2025)
- 5G-OT Alliance launched to bring 5G/LTE to OT environments (May. 14, 2025)
- Synopsys ramps up collaboration with Taiwan's TSMC on A16 process (May. 14, 2025)
- Parallel AI RISC-V compiler enters alpha testing (May. 14, 2025)
- RISC-V International Promotes Andrea Gallo to CEO (May. 13, 2025)
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- Alps Alpine Adopts Silvaco's Jivaro Pro to Accelerate SPICE Post-Layout Simulation (May. 13, 2025)
- Arteris Q1 2025 presentation highlights 28% revenue growth, strategic automotive wins (May. 13, 2025)
- Historic Quantum Technology Agreement Signed by EU, Japan (May. 13, 2025)
- QuickLogic Reports Fiscal First Quarter 2025 Financial Results (May. 13, 2025)
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- SiFive and Kinara Partner to Offer Bare Metal Access to RISC-V Vector Processors (May. 09, 2025)
- KEYSOM is heading to RISC-V Summit Europe in Paris! (May. 09, 2025)
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- India Releases Guidelines for Electronics Components Manufacturing Scheme (May. 01, 2025)
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs (Apr. 30, 2025)
- SkyeChip Joins Intel Foundry Accelerator IP Alliance (Apr. 30, 2025)
- CFX 0.13μm eFuse OTP IP has been applied in the mass production of over 15,000 CMOS image sensors (Apr. 30, 2025)
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies (Apr. 30, 2025)
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications (Apr. 30, 2025)
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC (Apr. 30, 2025)
- EU likely to miss 2030 microchip target (Apr. 30, 2025)
- Imec coordinates EU Chips Design Platform (Apr. 30, 2025)
- Intel tweaks its 18A process with variants tailored to mass-market chips, big AI brains (Apr. 30, 2025)
- Enabling the next generation of smart glasses (Apr. 30, 2025)
- IC'Alps joins Intel Foundry Accelerator program as Value Chain Alliance (VCA) and Design Services Alliance (DSA) partner (Apr. 30, 2025)
- Weebit Nano and DB HiTek to demonstrate chips integrating Weebit ReRAM at PCIM 2025 (Apr. 30, 2025)
- Codasip launches complete exploration platform to accelerate CHERI adoption (Apr. 29, 2025)
- New Audio Sample Rate Converter (ASRC) IP Core from CAST Offers Versatility with High Fidelity (Apr. 29, 2025)
- VeriSilicon Launches the Industry-Leading Automotive-Grade Intelligent Driving SoC Design Platform (Apr. 29, 2025)
- BrainChip Collaborates with Chelpis-Mirle on Security Solution (Apr. 29, 2025)
- VSORA Raises $46 Million to Bring World's Most Powerful AI Inference Chip to Market (Apr. 29, 2025)
- European AI processor developer gets €40m for manufacturing (Apr. 29, 2025)
- UK grants 2D semiconductor research £6 million (Apr. 29, 2025)
- Keysight EDA and Intel Foundry Collaborate on EMIB-T Silicon Bridge Technology for Next-Generation AI and Data Center Solutions (Apr. 29, 2025)
- Silvaco Expands Product Offerings in Photonics and Wafer-Scale Plasma Modeling for AI Applications with Acquisition of Tech-X Corporation (Apr. 29, 2025)
- Award-winning, Nordic-powered outdoor asset tracker supports sustainable logistics (Apr. 29, 2025)
- Cadence to Buy Artisan to Support Chiplet, 3D IC Future (Apr. 29, 2025)
- QuickLogic to Report First Quarter Fiscal 2025 Financial Results on Tuesday, May 13 (Apr. 29, 2025)
- Spain launches €800m quantum strategy (Apr. 29, 2025)
- Multi-talented magnetic field sensor: Robust position, angle and current measurement with the same chip (Apr. 29, 2025)
- Baya Systems, Imagination Technologies and Andes Technology to Present on Heterogeneous Compute Architectures at Andes RISC-V CON Silicon Valley (Apr. 28, 2025)
- Faraday Adds QuickLogic eFPGA to FlashKit-22RRAM SoC for IoT Edge (Apr 28, 2025)
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale (Apr. 28, 2025)
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration (Apr. 28, 2025)
- Premier ASIC and SoC Design Partner Rebrands as Aion Silicon (Apr. 28, 2025)
- Wi-Fi 7 (802.11be) RF Transceiver IP Core Ready for High Speed Wireless Connectivity Applications (Apr. 28, 2025)
- Premier ASIC and SoC Design Partner Rebrands as Aion Silicon (Apr 28, 2025)
- NEXT Semiconductor Technologies Collaborates with BAE Systems to Develop Next Generation Space-Qualified Chips (Apr. 28, 2025)
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip (Apr. 28, 2025)
- Crypto Quantique announces QRoot Lite - a lightweight and configurable root-of-trust IP for resource-constrained IoT devices (Apr. 25, 2025)
- Xylon Introduces Xylon ISP Studio (Apr. 25, 2025)
- Faraday Adds QuickLogic eFPGA to FlashKit‑22RRAM SoC for IoT Edge (Apr. 25, 2025)
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation (Apr. 25, 2025)
- Arteris Wins Two Gold and One Silver Stevie® Awards in the 2025 American Business Awards® (Apr. 25, 2025)
- FPGA prototyping harnessed for RISC-V processor cores (Apr. 25, 2025)
- Aion Silicon to Showcase Advanced SoC Design Capabilities at Andes RISC-V CON Silicon Valley (Apr. 25, 2025)
- €6m for free space photonic networks for smart factories (Apr. 25, 2025)
- Intel's CEO Lip-Bu Tan Reportedly Met With TSMC's CEO To Discuss Foundry Partnership; Raising Possibility of a Deal (Apr. 25, 2025)
- Arteris Wins Two Gold and One Silver Stevie® Awards in the 2025 American Business Awards® (Apr 25, 2025)
- Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC's A16 and N2P Process Technologies (Apr. 24, 2025)
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium (Apr. 24, 2025)
- Synopsys and TSMC Usher In Angstrom-Scale Designs with Certified EDA Flows on Advanced TSMC A16 and N2P Processes (Apr. 24, 2025)
- Andes Technology and Imagination Technologies Showcase Android 15 on High-Performance RISC-V Based Platform (Apr. 24, 2025)
- M31 Collaborates with TSMC to Advance 2nm eUSB2 IP Innovation (Apr. 24, 2025)
- BrainChip Extends RISC-V Reach with Andes Technology Integration (Apr. 24, 2025)
- PQShield launches UltraPQ-Suite for deeply specialized implementations of post-quantum cryptography (Apr. 24, 2025)
- S2C and Andes Technology Announce FPGA-Based Prototyping Partnership to Accelerate Advanced RISC-V SoC Development (Apr. 24, 2025)
- Silicon Proven AV1 Decoder IP with support for 12-bit pixel size and 4:4:4 Chroma Sub-Sampling Released by Allegro DVT (Apr. 24, 2025)
- Cadence Enables Next-Gen AI and HPC Systems with Industry's Fastest HBM4 12.8Gbps IP Memory System Solution (Apr. 24, 2025)
- Certus Semiconductor Joins TSMC IP Alliance Program to Enhance Custom I/O and ESD Solutions (Apr. 23, 2025)
- Alphawave Semi Delivers Foundational AI Platform IP for Scale-Up and Scale-Out Networks (Apr. 23, 2025)
- DVB-S2X Wideband LDPC/ BCH Encoder FEC IP Core Available For Licensing and Integration From Global IP Core (Apr. 23, 2025)
- Crypto Quantique publishes independent cetome analysis on streamlining CRA compliance with the QuarkLink security platform (Apr. 23, 2025)
- QuickLogic to Present and Exhibit at Andes RISC-V CON Technology Summit in San Jose (Apr. 23, 2025)
- MosChip® to showcase Silicon Engineering Services at TSMC 2025 North America Technology Symposium (Apr. 22, 2025)
- Cadence Advances AI in the Cloud with Industry-First DDR5 12.8Gbps MRDIMM Gen2 Memory IP System Solution (Apr. 22, 2025)
- Thalia joins GlobalFoundries' GlobalSolutions Ecosystem to advance IP reuse and design migration (Apr. 22, 2025)
- Ceva Neural Processing Unit IP for Edge AI Selected by Nextchip for Next-Generation ADAS Solutions (Apr. 22, 2025)
- GlobalFoundries Accelerates GHG Reductions Commitments with Near Term Science-Based Target (Apr. 22, 2025)
- MosChip® to showcase Silicon Engineering Services at TSMC 2025 North America Technology Symposium (Apr 22, 2025)
- Andy Nightingale, VP of Product Marketing at Arteris – Interview Series (Apr. 22, 2025)
- Automating Hardware-Software Consistency in Complex SoCs (Apr. 21, 2025)
- Analog Bits to Demonstrate IP Portfolio on TSMC 3nm and 2nm Processes at TSMC 2025 Technology Symposium (Apr. 21, 2025)
- Equal1 advances scalable quantum computing with CMOS-compatible silicon spin qubit technology (Apr 21, 2025)
- Alphawave Semi Audited Results for the Year Ended 31 December 2024 (Apr. 21, 2025)
- Shifting Sands in Silicon by Global Supply Chains (Apr 21, 2025)
- Analog Bits to Demonstrate IP Portfolio on TSMC 3nm and 2nm Processes at TSMC 2025 Technology Symposium (Apr 21, 2025)
- EU Bolsters Cybersecurity With NIS2 Directive (Apr. 21, 2025)
- Quadric's Chimera GPNPU Named Best Edge AI Processor IP by Edge AI and Vision Alliance (Apr. 21, 2025)
- BOS Joins Plug and Play NeoCity 2025 (Apr. 19, 2025)
- New Breakthroughs in China's RISC-V Chip Industry (Apr. 18, 2025)
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion (Apr. 17, 2025)
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies (Apr. 17, 2025)
- BrainChip Gives the Edge to Search and Rescue Operations (Apr. 17, 2025)
- ASML targeted in latest round of US tariffs (Apr 17, 2025)
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC (Apr. 17, 2025)
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC (Apr 17, 2025)
- Intel Announces Strategic Investment by Silver Lake in Altera (Apr. 16, 2025)
- Cadence to Acquire Arm Artisan Foundation IP Business (Apr. 16, 2025)
- AMD Achieves First TSMC N2 Product Silicon Milestone (Apr. 16, 2025)
- Orthogone Technologies and Blackcore® Technologies Announce Strategic Partnership to Deliver Ultra-Low Latency Solutions for High-Frequency Trading (Apr. 16, 2025)
- Secafy selects Siemens' EDA tools for innovative hardware security development (Apr. 16, 2025)
- How NoC architecture solves MCU design challenges (Apr. 16, 2025)
- VeriSilicon Launches Ultra-Low Power OpenGL ES GPU with Hybrid 3D/2.5D Rendering for Wearables (Apr. 16, 2025)
- Smart and compact sensors with Edge-AI (Apr. 16, 2025)
- Silicon Photonics Enables Low-power AI Accelerator Platform (Apr. 16, 2025)
- Taiwan to focus on silicon photonics, build new economic shield (Apr. 16, 2025)
- Samsung achieves 40%+ test yields with 4nm logic die (Apr. 16, 2025)
- Equal1 Validates CMOS-Compatible Silicon Spin Qubit Platform Using GlobalFoundries' 22FDX Process (Apr. 16, 2025)
- Has AI Finally Destroyed the Need for Software Testing? (Apr. 16, 2025)
- Gartner Says Worldwide Semiconductor Revenue Grew 21% in 2024 (Apr. 15, 2025)
- Doteck Integrates intoPIX JPEG XS for High-Performance ST 2110 8K & 4K Encoding (Apr. 15, 2025)
- eDP/DP 1.4 Tx PHY & Controller IP Cores Now Available to Meet Rising Demand for High-Performance Display Solutions with Next-Gen Visual Connectivity (Apr. 15, 2025)
- Vertex Growth commits €10M in Dolphin Semiconductor (Apr. 15, 2025)
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks (Apr. 15, 2025)
- Vertex Growth commits €10M in Dolphin Semiconductor (Apr 15, 2025)
- Korea unveils massive $23.2B semiconductor support plan (Apr. 15, 2025)
- Defacto Technologies Automates Front-End SoC Integration for Large RISC-V Designs (Apr. 14, 2025)
- Beware of the Open-Source Licensing Gap (Apr 14, 2025)
- Expedera Achieves ISO 9001:2015 Certification for Quality Management Systems (Apr. 14, 2025)
- Why Do Hyperscalers Design Their Own CPUs? (Apr. 14, 2025)
- EnSilica - Ongoing Investment in Space Industry Fuelling Silicon Chip Demand (Apr. 14, 2025)
- Omni Design Technologies Offers 3nm, Single Core-voltage Supply Rail Process, Voltage and Temperature (PVT) Monitor (Apr. 14, 2025)
- BOS Semiconductors at Auto Shanghai 2025 (Apr. 14, 2025)
- Semiconductor Companies Make Strategic Acquisitions to Bolster Portfolios (Apr. 11, 2025)
- EnSilica Signs MoU with European Satellite Operator (Apr. 10, 2025)
- TSMC March 2025 Revenue Report (Apr. 10, 2025)
- Hailo Selects Avnet ASIC as Channel Partner for TSMC Silicon Production (Apr. 10, 2025)
- VeriSilicon Unveils a High-Efficiency LCEVC Video Decoder Supporting 8K Ultra HD (Apr. 10, 2025)
- Ubuntu developer images now available for OrangePi RV2: a low-cost RISC-V SBC (Apr. 10, 2025)
- Samsung Reportedly Begins 1nm Process Development, Targets 2029 Mass Production (Apr. 10, 2025)
- Semiwise Completes the Development of the Virtual Reality Semiconductor Fabrication Training Facility (Apr. 09, 2025)
- Cadence Urges Tech Leaders to Push Data Centre Innovation (Apr. 09, 2025)
- Time-Sensitive Networking: the factory's traffic cop (Apr. 09, 2025)
- Cyient Announces the Launch of Semiconductor Subsidiary (Apr. 09, 2025)
- Blumind Secures Series A Funding to Accelerate Analog AI Revolution (Apr. 09, 2025)
- UMC Reports Sales for March 2025 (Apr. 09, 2025)
- Kandou AI Appoints Srujan Linga as CEO and Amin Shokrollahi as CTO (Apr. 09, 2025)
- JPEG XS Technology Integrated by Cobalt Digital with intoPIX TicoXS FIP Codec, supporting High Profile and new TDC Profile (Apr. 08, 2025)
- Infineon further strengthens its number one position in automotive microcontrollers and boosts systems capabilities for software-defined vehicles with acquisition of Marvell's Automotive Ethernet business (Apr. 08, 2025)
- ZeroPoint and Rebellions Forge Strategic Alliance to Revolutionize AI Accelerator Performance and Efficiency (Apr. 08, 2025)
- Alliance Aims to Deliver Memory-Optimized AI for Inferencing (Apr. 08, 2025)
- Arm Powers Software-Defined Vehicle Revolution (Apr. 08, 2025)
- Call to boost energy security in Europe (Apr. 08, 2025)
- Siemens acquires DownStream Technologies to expand PCB design-to-manufacturing flow (Apr. 08, 2025)
- Dnotitia and Hanyang University Launch Open-Source Platform Benchmarking AI Quantization (Apr. 08, 2025)
- Altera Starts Production Shipments of Industry's Highest Memory Bandwidth FPGA (Apr. 07, 2025)
- Analysts question TSMC-Intel JV plan (Apr 07, 2025)
- Will RISC-V reduce auto MCU's future risk? (Apr. 07, 2025)
- GUC Monthly Sales Report - March 2025 (Apr. 07, 2025)
- Global Semiconductor Sales Increase 17.1% Year-to-Year in February (Apr. 07, 2025)
- HCLTech recognized as Leader in all three service areas in ISG Provider Lens ™ 2024 - Advanced Analytics and AI Services reports for US and Europe (Apr. 07, 2025)
- Infineon Technologies to buy Marvell's auto ethernet business for $2.5 billion (Apr. 07, 2025)
- Siemens chooses Canada for $150M AI manufacturing research hub in Oakville (Apr. 05, 2025)
- Matrox Video and intoPIX Expand Interoperable IPMX & ST 2110 Solutions with JPEG XS Innovation at NAB 2025 (Apr. 04, 2025)
- Frontgrade Gaisler and wolfSSL Collaborate to Enhance Cybersecurity in Space Applications (Apr. 04, 2025)
- HCLTech joins Samsung Advanced Foundry Ecosystem as a Design Solution Partner (Apr. 04, 2025)
- Continuous-Variable Quantum Key Distribution (CV-QKD) system demonstration (Apr. 04, 2025)
- 2025 RISC-V CON: Andes Technology Celebrates 20 Years, Bringing Together Innovators, Engineers, and Ecosystem Leaders (Apr. 04, 2025)
- Major Manufacturing Shake-up: Intel Agrees to TSMC Takeover of Chip Foundries, Sources Say (Apr. 04, 2025)
- Japan's Rapidus in talks with Apple, Google to mass-produce chips, Nikkei reports (Apr. 04, 2025)
- Silicon Photonics and Co-Packaged Optics Shine a Light at OFC 2025 (Apr. 04, 2025)
- Latest intoPIX JPEG XS Codec Powers FOR-A's FA-1616 for Efficient IP Production at NAB 2025 (Apr. 03, 2025)
- Frontgrade Gaisler Launches New GRAIN Line and Wins SNSA Contract to Commercialize First Energy-Efficient Neuromorphic AI for Space Applications (Apr. 03, 2025)
- VeriSilicon Launches ISP9000: The Next-Generation AI-Embedded ISP for Intelligent Vision Applications (Apr. 03, 2025)
- BrainChip Partners with RTX's Raytheon for AFRL Radar Contract (Apr. 03, 2025)
- GUC Announces Tape-Out of the World's First HBM4 IP on TSMC N3P (Apr. 03, 2025)
- Arteris Opens New Engineering Hub in Poland (Apr. 03, 2025)
- Qualcomm considers buying Alphawave Semi (Apr. 03, 2025)
- Alphawave IP Response to announcement from Qualcomm (Apr. 03, 2025)
- New splitting method: Fraunhofer IIS brings satellites into the 5G era (Apr. 03, 2025)
- QuickLogic to Exhibit at HEART Conference in Monterey (Apr. 03, 2025)
- ST's Automotive MCU technology for next-generation vehicles (Apr. 03, 2025)
- Europe consults on critical raw materials (Apr. 03, 2025)
- Digital Core Design Unveils DPSI5 - The Next-Generation IP Core for PSI5 Communication (Apr. 02, 2025)
- ProMOS Adopts Silvaco Victory TCAD Solution for the Development of Next-Gen Silicon Photonics Devices (Apr. 02, 2025)
- Fraunhofer IIS Walks the Line for Edge AI (Apr. 02, 2025)
- Siemens acquires Dotmatics to extend AI-powered software portfolio to Life Sciences (Apr. 02, 2025)
- Capgemini recognized as a 'Leader' in Application Modernization and Multicloud Managed Services by independent research firm (Apr. 02, 2025)
- Will RISC-V reduce auto MCU's future risk? (Apr. 02, 2025)
- QuickLogic Announces $1.4 Million Incremental Funding Modification for its Strategic Radiation Hardened Program (Apr. 01, 2025)
- Village Island Enhances its AI100 with intoPIX's JPEG XS Technology for Advanced Real-Time Analysis (Apr. 01, 2025)
- Silicon-Proven MIPI CSI-2 & DSI-2 Tx/Rx IP Cores for your Camera & Display SoCs (Apr. 01, 2025)
- Movellus and RTX's SEAKR Engineering Collaborate on Advancing Mission-Critical ASICs (Apr. 01, 2025)
- GlobalFoundries and UMC Mull Potential Merger (Apr. 01, 2025)
- Exploring the Rationale for HAV in Complex SoCs (Apr. 01, 2025)
- TeraSignal to Showcase Retimer-Less PCIe 6.0 over Optics Featuring Synopsys IP at OFC 2025 (Apr. 01, 2025)
- TSMC opens up 2nm wafer fab, races to mass production (Apr. 01, 2025)
- VeriSilicon introduces AcuityPercept: an AI-powered automatic ISP tuning system (Mar. 31, 2025)
- Avant Technology Partners with COSEDA Technologies to Enhance System-Level Software Solutions (Mar. 31, 2025)
- X-FAB, SMART Photonics and Epiphany Design demonstrate InP-on-Silicon design flow for next-generation optical transceivers at OFC (Mar. 31, 2025)
- SEALSQ and IC'ALPS Join Forces to Advance Post-Quantum Secure ASICs for Automotive Functional Safety (Mar. 31, 2025)
- New cryostatic systems elevate current research on Qubits (Mar. 31, 2025)
- Phonemic has Full Registration on ESA STAR, Strengthening Its Position in Space FPGA Engineering (Mar. 31, 2025)
- LDRA Updates Tools to Automate Worst-Case Execution Time Analysis for RISC-V (Mar. 29, 2025)
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production (Mar. 28, 2025)
- Intel brings 3nm production to Europe in 2025 (Mar. 28, 2025)
- How Soitec Engineers Substrates for Cloud and Edge AI (Mar. 28, 2025)
- Faraday Technology Selects Silvaco FlexCAN IP for Advanced Automotive ASIC Design (Mar. 27, 2025)
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract (Mar. 27, 2025)
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board (Mar. 27, 2025)
- Qualcomm initiates global anti-trust complaint about Arm (Mar. 27, 2025)
- Sarcina Technology launches AI platform to enable cost-effective customizable AI packaging solutions (Mar. 27, 2025)
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation (Mar. 27, 2025)
- Crypto Quantique Simplifies CRA Compliance for Embedded Security (Mar. 27, 2025)
- Pragmatic Semiconductor set to revolutionise NFC connectivity with sustainable flexible chips (Mar. 27, 2025)
- Korea's science ministry partners with Samsung, SK hynix, and DB HiTek for MoaFab upgrades (Mar. 27, 2025)
- PolarFire® SoC FPGAs Achieve AEC-Q100 Qualification (Mar. 26, 2025)
- EnSilica Opens Second Brazilian Design Centre Following Multimillion Pound Design and Manufacturing Contract Win (Mar. 26, 2025)
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market (Mar. 26, 2025)
- intoPIX JPEG XS Cores Power Delta Video's IP Video Transmission Solutions (Mar. 26, 2025)
- TSMC Reportedly Speeds Up AP7 and AP8 Build-Outs, Targets Doubling SoIC Capacity (Mar. 26, 2025)
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software (Mar. 26, 2025)
- SiliconIntervention Announces Availability of Silicon Based Fractal-D™ Audio Amplifier Evaluation Board (Mar. 26, 2025)
- PolarFire® SoC FPGAs Achieve AEC-Q100 Qualification (Mar. 26, 2025)
- X-FAB, SMART Photonics, and Epiphany Design Collaborate on Advanced Heterogeneous Photonics Integration Platform (Mar. 26, 2025)
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era (Mar. 25, 2025)
- Fraunhofer to show AI, robotics and connected data for healthcare (Mar. 25, 2025)
- AI platform enables customisable packaging solutions for AI applications (Mar. 25, 2025)
- Renesas Introduces Low-Power Bluetooth Low Energy SoC for Automotive Applications (Mar. 25, 2025)
- Spanish government invests €13.8m in 5G satellites (Mar. 25, 2025)
- Cadence Launches Conformal AI Studio, Improves SoC Productivity by 10x (Mar. 25, 2025)
- Siemens is European patent champion (Mar. 25, 2025)
- SoCs Get a Helping Hand from AI Platform FlexGen (Mar. 24, 2025)
- Brite Semiconductor Releases DDR3/4, LPDDR3/4 Combo IP (Mar. 24, 2025)
- Accellera Announces IEEE Standard 1801?-2024 is Available Through IEEE GET Program (Mar. 24, 2025)
- 'World-Leading' Semiconductor Design Centre Will 'Strengthen Wales' Leadership in Chip Design' (Mar. 24, 2025)
- M31 Technology - AI-Powered Automotive Dual Engines and 2nm Technology Boost Revenue to Record Highs (Mar. 24, 2025)
- EnSilica Agrees a Multimillion Pound Design and Manufacturing Services Contract (Mar. 24, 2025)
- Strategies for Addressing More Complex Custom Chip Design (Mar. 24, 2025)
- Accellera Announces IEEE Standard 1801™-2024 is Available Through IEEE GET Program (Mar 24, 2025)
- Delivering sustainable electronics manufacturing (Mar. 24, 2025)
- Hong Kong investment arm backs Chinese RISC-V start-up StarFive in tech push (Mar. 21, 2025)
- Silvaco Announces Departure of Chief Financial Officer (Mar. 21, 2025)
- Menta Unveils 'Launch Pad' Low-Cost Embedded FPGA (eFPGA) Technology Access Program For Defense And Aerospace Customers (Mar. 20, 2025)
- Omni Design Technologies Delivers Multi-Gigahertz SWIFT™ Data Converter Solutions for Satellite Communications (Mar. 20, 2025)
- SoftBank Group to Acquire Ampere Computing (Mar. 20, 2025)
- Global Top 10 IC Design Houses See 49% YoY Growth in 2024, NVIDIA Commands Half the Market, Says TrendForce (Mar. 20, 2025)
- Zero ASIC launches world's first open standard eFPGA product (Mar. 20, 2025)
- Omni Design Technologies Delivers Multi-Gigahertz SWIFT™ Data Converter Solutions for Satellite Communications (Mar 20, 2025)
- Dnotitia and HyperAccel Partner to Develop RAG-Optimized AI Inference System (Mar. 20, 2025)
- Synopsys: Autonomous AI Agents to Tame Chip Design Complexity (Mar. 20, 2025)
- Siemens Xcelerator: Siemens accelerates IT and OT integration with Microsoft for Edge, Cloud, AI and Simulation (Mar. 20, 2025)
- Vayavya Labs At The ADAS Show 2025 (Mar. 20, 2025)
- QuickLogic Announces the Amendment and Extension of Credit Facility (Mar. 20, 2025)
- Embedded World, Nuremberg: Nordic Semiconductor's Strategy for Secure and Efficient IoT Connectivity (Mar. 20, 2025)
- Sofics and Dolphin Semiconductor Announce Strategic Partnership (Mar. 19, 2025)
- KiviCore and CAST Release Post-Quantum Cryptographic Key Encapsulation IP Core (Mar. 19, 2025)
- Comcores is now a member of the OPEN Alliance (Mar. 19, 2025)
- Cycuity Collaborates with SiFive and BAE Systems to Demonstrate Advanced Microelectronics Design Supply Chain Security (Mar. 19, 2025)
- FAMES Pilot Line Launches Open-Access Call for Chip Industry (Mar. 19, 2025)
- Soitec contributes to accelerated development of integrated optical connectivity solutions for AI datacentres with its silicon photonics SOI technology (Mar. 19, 2025)
- Accellera Announces IEEE Standard 1801™-2024 is Available Through IEEE GET Program (Mar. 19, 2025)
- Arteris Selected by Nextchip to Accelerate Chip Designs for Automotive Vision Technology (Mar. 18, 2025)
- Synopsys Accelerates Chip Design with NVIDIA Grace Blackwell and AI to Speed Electronic Design Automation (Mar. 18, 2025)
- Cadence Accelerates AI-Driven Engineering Design and Science with NVIDIA Grace Blackwell (Mar. 18, 2025)
- GlobalFoundries' expansion starts despite CHIPS Act questions (Mar. 18, 2025)
- Speeding AI and HPC Workloads with Composable Memory and Hardware Compression / Decompression Acceleration (Mar. 18, 2025)
- Canada Funds Quantum Auto Security Research (Mar. 18, 2025)
- PQShield Ltd - PQShield Podcast (Mar. 18, 2025)
- Quantum computing shows strong growth into the datacenter (Mar. 18, 2025)
- Cadence Recognized as One of Fast Company's Most Innovative Companies of 2025 (Mar. 18, 2025)
- The Case for Hardware-Assisted Verification in Complex SoCs (Mar. 17, 2025)
- China Bets on Homegrown Chip Tech With RISC-V Push (Mar. 17, 2025)
- SerDes Hard Macro IP in GlobalFoundries 22FDX - Available For Licensing and Implementation from Global IP Core (Mar. 17, 2025)
- Automotive Ethernet PHY IP Core in 28nm with BroadR-Reach and 100BaseT1 Compatibility for Automotive Applications (Mar. 17, 2025)
- Andes Technology Achieves Record Annual Revenue Amid Strong AI Demand (Mar. 17, 2025)
- TSMC and MediaTek Demonstrate First Integrated PMU and PA for Wireless Connectivity Products on N6RF+ Process Technology (Mar. 17, 2025)
- Cadence Joins Intel Foundry Accelerator Design Services Alliance (Mar. 17, 2025)
- Samsung Rumored to Mull on Scrapping 1.4nm Node to Prioritize 2nm/3nm Yield Gains (Mar. 17, 2025)
- The Transformative Growth Potential of the Semiconductor Industry (Mar. 17, 2025)
- InPsytech Joins Intel Foundry Accelerator IP Alliance to Boost HPC, AI, And Automotive Applications (Mar. 14, 2025)
- GUC Announces Successful Launch of Industry's First 32G UCIe Silicon on TSMC 3nm and CoWoS Technology (Mar. 13, 2025)
- Intel's New CEO Called "Strong Choice" to Respin Company (Mar. 13, 2025)
- Phonemic Officially Registered as Semiconductor Design Center with Polish Space Agency, Strengthening Position in Space Technology (Mar. 13, 2025)
- Renesas targets high volume vision AI with DRP AI core (Mar. 13, 2025)
- Perforce Releases 2025 Automotive Software Report: AI Adoption, Safety Priorities, and Code Complexity Challenges (Mar. 13, 2025)
- Open-source chip design spurring on AI (Mar. 13, 2025)
- Japan's Rapidus Preps 2nm Foundry Process And Chiplets (Mar. 13, 2025)
- BOS Semiconductors Signed Development Contract for ADAS Chiplet SoC with an European OEM (Mar. 12, 2025)
- CAST and Shikino High-Tech Partner to Expand Silicon IP Offerings and Market Reach (Mar. 12, 2025)
- Axelera AI and Kudelski IoT Partner for Next-Generation Edge Intelligent Ecosystem (Mar. 12, 2025)
- Allegro DVT Acquires Vicuesoft to Build a Worldwide Leader in Video Codecs Compliance and Analysis Solutions (Mar. 12, 2025)
- Omni Design Technologies Opens Austin Design Center (Mar. 12, 2025)
- TSMC pitched Intel foundry JV to Nvidia, AMD and Broadcom, sources say (Mar. 12, 2025)
- Fifth quantum-secure encryption algorithm selected (Mar. 12, 2025)
- The Critical Factors of a High-performance Audio Codec. What Chip Designers Need to Know. (Mar. 12, 2025)
- Synopsys SNUG Silicon Valley 2025 to Feature Arm, OpenAI and Microsoft Executive Talks (Mar. 12, 2025)
- Rambus Enhances Data Center and AI Protection with Next-Gen CryptoManager Security IP Solutions (Mar. 11, 2025)
- Weebit Nano fully qualifies ReRAM module to AEC-Q100 for automotive applications (Mar. 11, 2025)
- Crypto Quantique demonstrating device security platform that accelerates CRA-compliant development (Mar. 11, 2025)
- Vector Informatik and Synopsys Announce Strategic Collaboration to Advance Software-Defined Vehicle Development (Mar. 11, 2025)
- Allegro DVT Launches its First AI-Based Neural Video Processing IP (Mar. 11, 2025)
- Arm Kleidi Arrives in Automotive Markets to Accelerate Performance for AI-based Applications (Mar. 11, 2025)
- BrainChip Demonstrates Event-based Vision at Embedded World 2025 (Mar. 11, 2025)
- Kudelski IoT and u-blox collaborate to bring advanced security to autonomous driving, drones and agricultural applications (Mar. 11, 2025)
- Qualcomm to Bolster AI and IoT Capabilities with Edge Impulse Acquisition (Mar. 11, 2025)
- Powering the Future of On-Device AI with FPGAs (Mar. 11, 2025)
- High-Precision 12bit ADC and 16bit ADC IP Cores Licensed to Leading Automotive Customer, Meeting Stringent Automotive Standards (Mar. 10, 2025)
- Veriest Strengthens its Software Domain Activities at embedded world 2025 (Mar. 10, 2025)
- Synopsys Introduces Virtualizer Native Execution on Arm Hardware to Accelerate Software-defined Product Development (Mar. 10, 2025)
- Imagination GPU Powers Renesas R-Car Gen 5 SoC (Mar. 10, 2025)
- How AI Will Define the Next Silicon Supercycle (Mar. 10, 2025)
- Tenstorrent and UnsungFields Announce Strategic Technology Alliance (Mar. 10, 2025)
- Logic Fruit Technologies Releases High-Speed Interface IPs Stack for Advanced Computing (Mar. 10, 2025)
- Europe's chip market continues to shrink amidst global growth (Mar. 10, 2025)
- Semiconductor partnership aims to boost sustainability in the EU (Mar. 10, 2025)
- Axelera AI Secures up to €61.6 Million Grant to Develop Scalable AI Chiplet for High-Performance Computing (Mar. 07, 2025)
- Baya Systems Revolutionizes AI Scale-Up and Scale-Out with NeuraScale™ Fabric (Mar. 07, 2025)
- From AI to satellite: Mobile World Congress 2025 (Mar. 07, 2025)
- EMASS and Weebit Nano collaborate on ultra-low-power edge AI demonstration using ReRAM (Mar. 06, 2025)
- Weebit Nano - 1H FY25 financial results (Mar. 06, 2025)
- EMASS and Weebit Nano collaborate on ultra-low-power edge AI demonstration using ReRAM (Mar. 06, 2025)
- EnSilica Secures €2.13 Million European Space Agency Development Contract (Mar. 06, 2025)
- QuantWare raises €20 million Series A to power the world's largest quantum computers (Mar. 06, 2025)
- Europe takes a major step towards digital autonomy in supercomputing and AI with the launch of DARE project (Mar. 06, 2025)
- Infineon brings RISC-V to the automotive industry and is first to announce an automotive RISC-V microcontroller family (Mar. 06, 2025)
- Intel Foundry's Moment of Truth: Will 18A Deliver? (Mar. 06, 2025)
- Renesas and Altium Announce Introduction of Renesas 365, Powered by Altium: Groundbreaking Industry Solution for Software-Defined Products (Mar. 06, 2025)
- Pragmatic launches platform for mixed-signal flexible ASIC design (Mar. 06, 2025)
- Infineon, Synopsys to show virtual prototype of first automotive RISC-V microcontroller (Mar. 06, 2025)
- €240m DARE project for AI RISC-V chiplets (Mar. 06, 2025)
- Nordic Semiconductor partners with Skylo for IoT expansion (Mar. 06, 2025)
- Neurons cast in silicon: AI chip SENNA accelerates spiking neural networks (Mar. 06, 2025)
- Codasip selected to design a high-end RISC-V processor for the EU-funded DARE project (Mar. 06, 2025)
- Quintauris launches the first RISC-V profile for today's real-time automotive applications (Mar. 05, 2025)
- Omni Design Technologies Extends Swift™ Data Converter Solutions for FR1 and FR2 5G Subsystems (Mar. 05, 2025)
- Pragmatic Semiconductor launches next-generation platform for mixed-signal flexible ASIC design with early-access programme (Mar. 05, 2025)
- MosChip® Launches MosChip DigitalSky GenAIoT™ to Accelerate the Development of Next-Gen Connected, Intelligent Products (Mar. 05, 2025)
- AONDevices Partners with Faraday to Enhance Production Capabilities (Mar. 05, 2025)
- Quantware raises €20m for 1m qubit quantum computer (Mar. 05, 2025)
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition (Mar. 05, 2025)
- Arm Compute Platform at the Heart of Malaysia's Silicon Vision (Mar. 05, 2025)
- Vietnam approves $500 million for semiconductor plant (Mar. 05, 2025)
- Malaysia taps ARM for $250m chip boost (Mar. 05, 2025)
- Semidynamics' Aliado SDK Accelerates AI Development for RISC-V with Seamless ONNX Integration (Mar. 04, 2025)
- Ceva Collaborates with Arm and SynaXG to Redefine Energy Efficient 5G NR Processing for Sustainable LEO Satellites and 5G-Advanced Wireless Infrastructure (Mar. 04, 2025)
- MIPS Drives Real-Time Intelligence into Physical AI Platforms (Mar. 04, 2025)
- Arm vs. Qualcomm: The Legal Tussle Continues (Mar. 04, 2025)
- Broadcom, NVIDIA Reportedly Running Test Chips Through Intel's Foundry Business (Mar. 04, 2025)
- indie Semiconductor and GlobalFoundries Announce Strategic Collaboration to Accelerate Automotive Radar Adoption (Mar. 04, 2025)
- STMicroelectronics Announces Two New Generations of Microcontrollers (MCUs) for IoT Devices (Mar. 04, 2025)
- Silvaco Expands Product Offering with Acquisition of Cadence's Process Proximity Compensation Product Line (Mar. 04, 2025)
- TSMC Intends to Expand Its Investment in the United States to US$165 Billion to Power the Future of AI (Mar. 04, 2025)
- Agile Analog extends leadership in customizable analog security IP with new clock attack monitor (Mar. 03, 2025)
- eMemory and PUFsecurity Launch World's First PUF-Based Post-Quantum Cryptography Solution to Secure the Future of Computing (Mar. 03, 2025)
- CAST Releases First Commercial SNOW-V Stream Cipher IP Core (Mar. 03, 2025)
- intoPIX Expands its offering for Medical, Human & Machine Vision Applications with TicoRAW & JPEG-XS on Lattice Low-Power FPGAs (Mar. 03, 2025)
- Ceva and Sharp Collaborate on "Beyond 5G" IoT Terminals (Mar. 03, 2025)
- SEALSQ Enters Into Exclusive Negotiations to Acquire 100% of IC'ALPS (Mar. 03, 2025)
- Marvell Demonstrates Industry's Leading 2nm Silicon for Accelerated Infrastructure (Mar. 03, 2025)
- Guest Post: Current Challenges With Protecting Quantum Computing IP (Mar. 01, 2025)
- Does Your NPU Do VLMs? It Better! (Mar. 01, 2025)
- Nvidia's Record $39.3 Billion Q1, Synopsys Q1 and Blackwell, Plus Chips Act Funding (Feb. 28, 2025)
- SEALSQ Enters Into Exclusive Negotiations to Acquire 100% of IC'ALPS (Feb. 28, 2025)
- Weebit Nano accelerates commercial activity through a licence with onsemi (Feb. 28, 2025)
- Sustainable design is an evolution of industrial design (Feb. 27, 2025)
- Attopsemi Expands its Proven I-fuse® OTP Portfolio on X-FAB's 180nm Platform (Feb. 27, 2025)
- Dolphin Semiconductor Provides High-Performance LDO Regulators in TSMC 22nm to Ingenic for IPC Applications (Feb. 27, 2025)
- VeriSilicon unveils low-power AI Noise Reduction and AI Super Resolution IPs (Feb. 27, 2025)
- SkyWater to Acquire Infineon's Austin Fab and Establish Strategic Partnership to Expand U.S. Foundry Capacity for Foundational Chips (Feb. 27, 2025)
- Arm Drives Next-Generation Performance for IoT with World's First Armv9 Edge AI Platform (Feb. 27, 2025)
- X-Silicon Revolutionizes AI and Graphics at the Edge with "Constellation" Software Platform (Feb. 27, 2025)
- Ceva Unveils Latest High-Performance, High-Efficiency Communication DSPs for Advanced 5G and 6G Applications (Feb. 27, 2025)
- GlobalFoundries and MIT Collaborate to Advance Research and Innovation on Essential Chips for AI (Feb. 27, 2025)
- Baya Systems and Semidynamics Collaborate to Accelerate RISC-V System-on-Chip Development (Feb. 26, 2025)
- Semiconductor Industry Faces a Seismic Shift (Feb. 26, 2025)
- BrainChip Collaborates with Onsor Technologies To Power Epileptic Seizure-Detecting Glasses (Feb. 26, 2025)
- Meet T2M @ MWC 2025 to learn about Cutting-Edge RF, Wireless, Automotive Semiconductor IP Cores & ASIC services (Feb. 26, 2025)
- Intel, Synopsys, TSMC All Unveil Record Memory Densities The move to nanosheet transistors is a boon for SRAM (Feb. 26, 2025)
- QuickLogic Announces $1.1M eFPGA IP Contract with new Defense Industrial Base Customer (Feb. 26, 2025)
- Socionext Announces Strategic Partnership with Google Quantum AI in Quantum Computing Development (Feb. 26, 2025)
- PsiQuantum Announces Omega, a Manufacturable Photonic Quantum Computing Chipset (Feb. 26, 2025)
- Interview with Xiphera CEO - Adapting to Market Changes (Feb. 26, 2025)
- Synopsys shares gain on stronger-than-expected earnings forecast (Feb. 26, 2025)
- Jim Keller joins ex-Intel chip designers in RISC-V startup focused on breakthrough CPUs (Feb. 26, 2025)
- sureCore PowerMiser IP enables KU Leuven chip for AI applications to achieve dynamic power saving of greater than 40% (Feb. 25, 2025)
- Q.ANT and IMS CHIPS Launch Production of High-Performance AI Chips, Establish Blueprint for Strengthening Chip Sovereignty (Feb. 25, 2025)
- Imagination takes efficiency up a level with latest D-Series GPU IP (Feb. 25, 2025)
- Arteris Releases the Latest Generation of Magillem Registers to Automate Semiconductor Hardware/Software Integration (Feb. 25, 2025)
- Andes Technology and proteanTecs Partner to Bring Performance and Reliability Monitoring to RISC-V Cores (Feb. 25, 2025)
- Dnotitia and Finders Establish Strategic Partnership to Develop AI-driven Insurance Solution (Feb. 25, 2025)
- Siemens delivers certified and automated design flows for TSMC 3DFabric technologies (Feb. 24, 2025)
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing (Feb. 24, 2025)
- ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50% (Feb. 24, 2025)
- Quadric Announces Lee Vick is New VP Worldwide Sales (Feb. 24, 2025)
- Cortus MINERVA Out-of-Order 4GHz 64-bit RISC-V Processor Platform targets automotive applications (Feb. 24, 2025)
- Intel set to begin 18A tape-outs later this year, according to reports (Feb. 24, 2025)
- Maximum efficiency at minimum power consumption: New options for integrating RFicient® receivers (Feb. 24, 2025)
- TSMC's Efforts In 2nm Production Could See The Company Reaching 50,000 Monthly Wafers In 2025; With Both Facilities Operational, Output Could Reach 80,000 Units (Feb. 24, 2025)
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification (Feb. 21, 2025)
- CEA and Quobly Report Simultaneous, Microsecond Qubit-Readout Solution With 10x Power-Use Reduction (Feb. 20, 2025)
- CEA and Quobly Report Simultaneous, Microsecond Qubit-Readout Solution With 10x Power-Use Reduction (Feb 20, 2025)
- Intel in advanced talks to sell Altera to Silverlake (Feb. 20, 2025)
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025 (Feb. 20, 2025)
- EU funding for Infineon Dresden smart power fab approved (Feb. 20, 2025)
- Driving the efficiency of artificial intelligence (Feb. 20, 2025)
- Ex-Intel team raise $21.5m to pursue RISC-V for AI (Feb. 20, 2025)
- STMicroelectronics Unveils Silicon Photonics, BiCMOS Technologies to Power Next-Gen AI Data Centers (Feb. 20, 2025)
- STMicroelectronics to ramp new silicon photonics process (Feb. 20, 2025)
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results (Feb. 19, 2025)
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models (Feb. 19, 2025)
- CEA and Quobly report microsecond qubit-readout solution with 10x power-use reduction (Feb. 19, 2025)
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI (Feb. 19, 2025)
- Getting Started with Chip Eco-Design Methodology (Feb. 19, 2025)
- 2025 Outlook with Paul Wells of sureCore (Feb. 19, 2025)
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset (Feb. 18, 2025)
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset (Feb 18, 2025)
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution (Feb. 18, 2025)
- Unlocking Quantum Advantage Lies Not Just with Qubits but with Gates (Feb. 18, 2025)
- Synopsys Teams Up with SEMI Foundation to Drive Workforce Development Initiatives in Semiconductor Industry (Feb. 18, 2025)
- VeriSilicon: The "IP family" is on fire, and the three major markets will go hand in hand in 2025 (Feb. 18, 2025)
- €29m for 6G chiplet packaging line in Finland (Feb. 18, 2025)
- ARM signs Meta as first chip product customer, says report (Feb. 17, 2025)
- TSMC Will Not Take Over Intel Operations, Observers Say (Feb. 17, 2025)
- Blueshift Memory starts £2.77 million development project with AP Memory and Syntronix of Taiwan (Feb. 17, 2025)
- Funding to boost Europe's semiconductor production (Feb. 17, 2025)
- Mirabilis Design Accelerates SoC Development with New System-Level IP Library for Cadence Tensilica Processors (Feb. 17, 2025)
- Why RISC-V is a viable option for safety-critical applications (Feb. 14, 2025)
- Qualitas Semiconductor entered into IP Licensing Agreement with a Leading Korean System Semiconductor Design Company (Feb. 14, 2025)
- Arm takes manufacturing into its own hands as it plans to sell chips (Feb. 14, 2025)
- Can silicon photonics overcome scaling challenges for AI and data centers? (Feb. 13, 2025)
- Worldwide Silicon Wafer Shipments and Revenue Start Recovery in Late 2024, SEMI Reports (Feb. 13, 2025)
- Paras Defence Invests in Logic Fruit Technologies to Boost Defence Tech Capabilities at AERO India 2025 (Feb. 13, 2025)
- Synopsys Expands the Industry's Highest Performance Hardware-Assisted Verification Portfolio to Propel Next-Generation Semiconductor and Design Innovation (Feb. 13, 2025)
- Ceva, Inc. Announces Fourth Quarter and Full Year 2024 Financial Results (Feb. 13, 2025)
- What Will Sustainable Semiconductor Manufacturing Look Like by 2035? (Feb. 13, 2025)
- New Memory Architectures for SoCs and Multi-Die Systems (Feb. 13, 2025)
- TSMC Board of Directors Meeting Resolutions (Feb. 12, 2025)
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership (Feb. 12, 2025)
- Could Thomas Caulfield lead Intel or a merged Intel-GloFo? (Feb. 12, 2025)
- Semiconductor Giants Navigate AI Boom & Trade War (Feb. 12, 2025)
- OpenAI to tape-out on TSMC 3nm this year (Feb. 12, 2025)
- Soitec Accelerates Diversification to Withstand Down Cycles (Feb. 12, 2025)
- Groundbreaking Formal Verification Further Enhances the Quality of CHERIoT-Ibex (Feb. 11, 2025)
- ListenAI Licenses Ceva-Waves Wi-Fi 6 IP, Bringing Seamless Wireless Connectivity to its Edge AI Portfolio (Feb. 11, 2025)
- intoPIX Drives Innovation in Automotive Ethernet and Data Transmission (Feb. 11, 2025)
- Veriest Solutions Strengthens North American Presence at DVCon US 2025 (Feb. 10, 2025)
- Gartner Says Worldwide Semiconductor Revenue Grew 18% in 2024 (Feb. 10, 2025)
- CEA-Leti Announces FAMES Pilot Line In Nature Reviews Electrical Engineering (Feb. 10, 2025)
- SoftBank in talks to buy server chip firm Ampere (Feb. 10, 2025)
- CEA-Leti Announces FAMES Pilot Line in Nature Reviews Electrical Engineering (Feb. 10, 2025)
- T2M IP Announces Licensing of ASIL-B Qualified CAN XL, QSPI, LIN 2.0, I2C IP Cores to Leading Automotive Customer (Feb. 10, 2025)
- QuickLogic Unveils Aurora 2.9: Enhanced Performance and Seamless Integration (Feb. 10, 2025)
- QuickLogic Integrates Synopsys Synplify Synthesis for Best-in-Class Quality of Results (Feb. 10, 2025)
- EnSilica: Unaudited Results for the Half Year Ended 30 November 2024 (Feb. 10, 2025)
- TSMC January 2025 Revenue Report and the Statement on the Impact of Earthquake (Feb. 10, 2025)
- Logic Fruit Announces Strategic Partnership with PACE at Aero India 2025 (Feb. 10, 2025)
- Qualcomm says Arm has withdrawn license breach notice (Feb. 10, 2025)
- Onsemi's Treo Taps Weebit ReRAM (Feb. 10, 2025)
- EnSilica: Unaudited Results for the Half Year Ended 30 November 2024 (Feb 10, 2025)
- Gelsinger Invests In British AI Chip Startup Fractile (Feb. 10, 2025)
- CEA-Leti Announces FAMES Pilot Line In Nature Reviews Electrical Engineering (Feb 10, 2025)
- UMC Reports Sales for January 2025 (Feb. 10, 2025)
- Silicon Creations Expands Clocking IP Portfolio on TSMC N2P Technology including Novel Temperature Sensor Design (Feb. 10, 2025)
- Exploring Rapidus' Path to 2nm Mass Production: 3 Key Challenges Ahead (Feb. 10, 2025)
- Rambus to Present at Loop Capital Expert Call and Morgan Stanley Technology, Media & Telecom Conference (Feb. 10, 2025)
- High-Performance 16-Bit ADC and DAC IP Cores Now Available for Licensing (Feb. 07, 2025)
- Samsung Foundry 2 nm initial yields highly promising after last year's 3 nm struggles (Feb. 07, 2025)
- Axiomise Launches footprint, Area Analyzer for Silicon Design (Feb. 06, 2025)
- Why UCIe is Key to Connectivity for Next-Gen AI Chiplets (Feb. 06, 2025)
- Arm Holdings plc Reports Results for the Third Quarter of the Fiscal Year Ended 2025 (Feb. 06, 2025)
- Post-Quantum Cryptography–Securing Semiconductors in a Post-Quantum World (Feb. 06, 2025)
- Intel partners with Japanese research institution for next-generation quantum computer (Feb. 06, 2025)
- Mirabilis Design Adds System-Level Modelling Support for Industry-Standard Arteris FlexNoC and Ncore Network-on-Chip IPs (Feb. 05, 2025)
- GlobalFoundries Announces Leadership Transition to Drive Next Phase of Growth (Feb. 05, 2025)
- Accellera Board Approves Universal Verification Methodology for Mixed-Signal (UVM-MS) 1.0 Standard for Release (Feb. 05, 2025)
- Ceva-Waves Wi-Fi 6 IP Powers WUQI Microelectronics Wi-Fi/Bluetooth Combo Chip (Feb 05, 2025)
- Cadence Virtuoso Studio advanced optimization enhances MediaTek's efficiency by 30% (Feb. 05, 2025)
- Global semiconductor revenue to hit $705 billion in 2025 on rising AI demand (Feb. 05, 2025)
- Arm Reports Record Revenue in Q3 (Feb. 05, 2025)
- Dolphin Semiconductor strengthens its governance with two key Board appointments (Feb. 04, 2025)
- RISC-V in Space Workshop 2025 in Gothenburg (Feb. 04, 2025)
- intoPIX Unveils Cutting-Edge AV Innovations at ISE 2025 (Feb. 04, 2025)
- Rambus Reports Fourth Quarter and Fiscal Year 2024 Financial Results (Feb. 04, 2025)
- CoMira Solutions unveils its new 1.6T Ethernet UMAC IP (Feb. 04, 2025)
- TSMC plans for 1nm-capable gigafab in Tainan, says report (Feb. 04, 2025)
- CHERI Protects Memory at the Hardware Level (Feb. 04, 2025)
- OpenAI, SoftBank tap Samsung for Stargate AI initiative (Feb. 04, 2025)
- The First Step to a Quantum-Safe Future With Samsung Knox (Feb. 04, 2025)
- Predictions for Multi-Die System Designs in 2025 (Feb. 04, 2025)
- UK Space Agency Awards EnSilica £10.38m for Satellite Broadband Terminal Chips (Feb. 03, 2025)
- Intel Halts Products, Slows Roadmap in Years-Long Turnaround (Feb. 03, 2025)
- UK Space Agency Awards EnSilica £10.38m for Satellite Broadband Terminal Chips (Feb 03, 2025)
- TSMC Accelerates Efforts To Achieve 1nm Production, Plans To Set Up "Giga Fabs" In Taiwan (Feb. 03, 2025)
- AI chips in 2025: Smaller, faster, smarter (Feb. 03, 2025)
- Cadence aims to strengthen its presence in India's growing data center sector (Feb. 03, 2025)
- Forget CPUs! RaiderChip Has a Hardware-Based Generative AI Accelerator (Feb. 01, 2025)
- European Commission Funds €3 Million ($3.1 Million USD) Quantum Chip Project to Address Scalability Challenges (Feb. 01, 2025)
- Rapidus aims to deploy 10 EUV machines for 2nm chip production in Japan (Jan. 31, 2025)
- Cadence: Leveraging Sustainability for a Competitive Edge (Jan. 31, 2025)
- Europe approves €48m for Envision AESC French battery gigafactory (Jan. 31, 2025)
- Barcelona will host a new quantum computer at the BSC-CNS (Jan. 31, 2025)
- Keysight and KD Partner to Advance Multigigabit Optical Automotive Ethernet Testing with New Signal Analysis Capability (Jan. 30, 2025)
- Ceva, Inc. Appoints Amir Faintuch to its Board of Directors (Jan. 30, 2025)
- Quadric Opens Subsidiary in Japan with Industry Veteran Jan Goodsell as President (Jan. 30, 2025)
- Codasip and RED Semiconductor Sign Memorandum of Understanding to Develop AI Acceleration Technologies (Jan. 30, 2025)
- intoPIX and EvertzAV Strengthen IPMX AV-over-IP Interoperability with Groundbreaking JPEG XS TDC Compression Capabilities at ISE 2025 (Jan. 30, 2025)
- Baya Systems Welcomes Manish Muthal and Siva Yerramilli to Board of Directors (Jan. 30, 2025)
- Celestial AI Announces Appointment of Semiconductor Industry Icon Lip-Bu Tan to Board of Directors (Jan. 30, 2025)
- EXTOLL collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC (Jan. 30, 2025)
- Intel 18A Process Technology Simply Explained (Jan. 30, 2025)
- Synopsys makes a bold prediction (Jan. 30, 2025)
- Poland Advances Development of Military Quantum Computer Prototype, Source Says (Jan. 30, 2025)
- More than €1 billion from the European Defence Fund to develop next generation defence technologies and innovation (Jan. 30, 2025)
- Certus releases radiation-hardened I/O Library in GlobalFoundries 12nm LP/LP+ (Jan. 29, 2025)
- intoPIX and Nextera-Adeas Announce Latest IPMX Demo Design with JPEG XS on Compact FPGAs at ISE 2025 (Jan. 29, 2025)
- Mixel Announces the Opening of New Branch in Da Nang, Vietnam (Jan. 29, 2025)
- Plexus and intoPIX Expand IPMX Solutions Offering (Jan. 28, 2025)
- Alphawave Semi to Showcase Innovations and Lead Expert Panels on 224G, 128G PCIe 7.0, 32G UCIe, HBM 4, and Advanced Packaging Techniques at DesignCon 2025 (Jan. 28, 2025)
- Codasip, RED Semiconductor team for RISC-V AI acceleration (Jan. 28, 2025)
- SoftBank and Quantinuum Target Practical Applications for Quantum Computing and AI (Jan. 28, 2025)
- Automotive Chiplet Ecosystem Heralds Agility and Flexibility (Jan. 28, 2025)
- RaiderChip unveils its fully Hardware-Based Generative AI Accelerator: The GenAI NPU (Jan. 27, 2025)
- TeraSignal Demonstrates Interoperability with Synopsys 112G Ethernet PHY IP for High-Speed Linear Optics Connectivity (Jan. 27, 2025)
- Chiplet Summit 2025 Nods to a Bright Future for Disaggregated Computing (Jan. 24, 2025)
- SoC design: What's next for NoCs? (Jan. 24, 2025)
- Andes Technology D45-SE Processor Achieves ISO 26262 ASIL-D Certification for Functional Safety (Jan. 23, 2025)
- VeriSilicon and Innobase collaboratively launched second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP (Jan. 23, 2025)
- Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation (Jan. 23, 2025)
- ARM boost in $100bn Stargate data centre project (Jan. 23, 2025)
- Synopsys to Hold Annual User Group Conference and Inaugural Executive Forum March 19-20 in Silicon Valley (Jan. 23, 2025)
- Tiny RISC-V chip for the digital product passport (DPP) (Jan. 23, 2025)
- EU funding new chip to solve quantum computing roadblocks (Jan. 23, 2025)
- Synopsys to Hold Annual User Group Conference and Inaugural Executive Forum March 19-20 in Silicon Valley (Jan. 23, 2025)
- ST-GloFo fab plan shelved (Jan 22, 2025)
- Alphawave Semi Q4 2024 Trading and Business Update (Jan. 22, 2025)
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon (Jan. 22, 2025)
- MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs (Jan. 22, 2025)
- MIPI Alliance Announces Board Leadership Appointments (Jan. 22, 2025)
- GlobalFoundries to create new silicon photonics facility (Jan. 22, 2025)
- Can Photonics Keep Moore's Law Alive? (Jan. 22, 2025)
- China's second-largest foundry hires former Intel executive to lead advanced node development (Jan. 22, 2025)
- YorChip announces patent-pending Universal PHY for Open Chiplets (Jan. 21, 2025)
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan (Jan. 21, 2025)
- Credo to Exhibit at Chiplet Summit 2025 (Jan. 21, 2025)
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP (Jan. 21, 2025)
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit (Jan. 21, 2025)
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X (Jan. 21, 2025)
- Intel Foundry gains new defense clients for 18A process (Jan. 21, 2025)
- Support added in RISC-V IP for automotive high safety and security applications (Jan. 21, 2025)
- Synopsys, NXP, and Infineon Drive Focus on Software-Defined Vehicles (Jan. 21, 2025)
- Alphawave Semi shares rise on record-breaking quarter (Jan. 21, 2025)
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development (Jan. 20, 2025)
- High-Performance 16-Bit ADC and DAC IP Cores Ready to licence (Jan. 20, 2025)
- Qualitas Semiconductor Signs IP Licensing Agreement with Edge AI Leader Ambarella (Jan. 20, 2025)
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura's Cyberthreat Intelligence Tool (Jan. 20, 2025)
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports (Jan. 20, 2025)
- Modulation, manipulation, precision: spatial light modulators for industry and research (Jan. 20, 2025)
- Nvidia teams up with TSMC in silicon photonics development (Jan. 18, 2025)
- GlobalFoundries Announces New York Advanced Packaging and Photonics Center (Jan. 17, 2025)
- European 1nm, photonics chip pilot lines launch (Jan. 17, 2025)
- QuickLogic to Exhibit at Chiplet Summit 2025 (Jan. 17, 2025)
- Alchip opens 3DIC ASIC design services (Jan. 17, 2025)
- Progressing on Track: PCIe 7.0 Specification, Version 0.7 Now Available for Member Review (Jan. 17, 2025)
- TSMC refuses to make Samsung Exynos: no surprise (Jan. 17, 2025)
- Commerce Department Finalizes CHIPS Act Awards, Adds $75M for GlobalFoundries Expansion (Jan. 17, 2025)
- RIKEN adopts Siemens' emulation and High-Level Synthesis platforms for next-generation AI device research (Jan. 16, 2025)
- CAST to Enter the Post-Quantum Cryptography Era with New KiviPQC-KEM IP Core (Jan. 16, 2025)
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology (Jan. 16, 2025)
- Breaking Ground in Post-Quantum Cryptography Real World Implementation Security Research (Jan. 16, 2025)
- Ultra Accelerator Link Consortium (UALink) Welcomes Alibaba, Apple and Synopsys to Board of Directors (Jan 16, 2025)
- European regulator approves Synopsys' $35bn Ansys acquisition after companies agree to divest software assets (Jan. 15, 2025)
- The inevitable opportunity for photonics In quantum computing (Jan. 15, 2025)
- Fraunhofer IZM is powering the evolution of chiplet technologies as part of the APECS pilot line (Jan. 15, 2025)
- RISC-V in AI and HPC Part 2: Per Aspera Ad Astra? (Jan. 14, 2025)
- Creonic Introduces Doppler Channel IP Core (Jan. 14, 2025)
- YorChip and ChipCraft announce low-cost, high-speed 200Ms/s ADC Chiplet (Jan. 14, 2025)
- Chip Interfaces Successfully Completes Interlaken IP Interoperability Test with Cadence 112G Long-Reach PHY (Jan. 14, 2025)
- € 20m for imec MRAM in-memory compute chiplet spinout (Jan. 14, 2025)
- MZ Technologies Unveils Next Generation Chiplet/Package Design Tool (Jan. 14, 2025)
- Ultra Accelerator Link™ Consortium (UALink™) Welcomes Alibaba, Apple and Synopsys to Board of Directors (Jan. 14, 2025)
- CES 2025: Automotive suppliers focus on software and safety (Jan. 14, 2025)
- Samsung reportedly to cut NAND production (Jan. 14, 2025)
- QuickLogic Signs Agreement with Magenta to Expand Distribution Network to Turkiye and UAE (Jan. 14, 2025)
- Vertical Compute, a new imec spin-off, raises €20 million to Revolutionize the Future of AI Computing (Jan. 14, 2025)
- Alphacore's Digital CMOS Impulse Ground-Penetrating Radar (GPR) Transceiver ASIC (Jan. 13, 2025)
- Synopsys Responds to the European Commission Approving its Proposed Acquisition of Ansys in Phase 1 (Jan. 13, 2025)
- Exostiv Labs Unveils AMD Versal Adaptive SoC Device Support for Exostiv and Exostiv Blade Platforms (Jan. 13, 2025)
- TSMC December 2024 Revenue Report (Jan. 13, 2025)
- NASA Awards Alphacore Four Contracts for Radiation Hardened Microelectronics Innovation (Jan. 13, 2025)
- BrainChip Brings Neuromorphic Capabilities to M.2 Form Factor (Jan. 13, 2025)
- Imagination pulls out of RISC-V CPUs (Jan 13, 2025)
- SIA Statement on Biden Administration Action Imposing New Export Controls on AI Chips (Jan. 13, 2025)
- Foundry Giants' Advanced Node Expansion Efforts Beyond 2025: TSMC, Intel, Rapidus and More (Jan. 13, 2025)
- Europe's technology trends for 2025 (Jan. 13, 2025)
- By 2032, SerDes Market Set to Cross USD 2,422.8 million (Jan. 12, 2025)
- EU approves Synopsys' $35 billion Ansys deal under conditions (Jan. 10, 2025)
- FPGA company Altera announces independence from Intel (Jan. 10, 2025)
- TTTech divests strategic stake in landmark transaction to NXP to fuel future growth with technology investments in core business (Jan. 09, 2025)
- Qualitas Semiconductor and Verisilicon signed a licensing agreement for 4nm PCIe 6.0 PHY IP (Jan. 09, 2025)
- M31's 12nm GPIO IP Adopted by C*Core Technology, Powering Innovation in Advanced Process Automotive Chips (Jan. 09, 2025)
- Ansys sells power design tool to Keysight in Synopsys deal (Jan. 09, 2025)
- First full wafer-scale fabrication of electrically-pumped GaAs-based nano-ridge lasers on 300 mm silicon wafers (Jan. 09, 2025)
- Multi-Die Health and Reliability: Synopsys and TSMC Showcase UCIe Advances (Jan. 09, 2025)
- Imagination quits RISC-V CPU business to focus on GPUs and AI (Jan. 09, 2025)
- Cognizant collaborates with Siemens on solution accelerator for Software-Defined Vehicles (Jan. 09, 2025)
- Why Secure by Design Is Essential for Cybersecurity (Jan. 09, 2025)
- Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports (Jan. 08, 2025)
- VeriSilicon's Display Processing IP DC8200-FS has achieved ISO 26262 ASIL B certification (Jan. 08, 2025)
- BrainChip Unveils Edge AI Box Partner Ecosystem for Gestures, Cybersecurity, Image Recognition, and Computer Vision (Jan. 08, 2025)
- Synopsys Responds to the UK Competition and Markets Authority Provisionally Accepting its Proposed Remedies in Phase 1 Regarding its Proposed Acquisition of Ansys (Jan. 08, 2025)
- Ansys and Synopsys Announce Agreement with Keysight Technologies for Sale of Ansys PowerArtist (Jan. 08, 2025)
- Ceva Powers Oritek's Next-Gen ADAS chipsets for Smarter, Safer Electric Vehicles (Jan. 08, 2025)
- Silicon Photonics Pioneer CEA-Leti Will Unveil Major R&D Gains At Photonics West Jan. 25-30 (Jan. 08, 2025)
- Cadence: Leading the EDA Industry with AI-Powered Platforms (Jan. 08, 2025)
- Samsung invests in neural sensor startup Pison (Jan. 08, 2025)
- Chiplet technology and advanced SoCs are shaping the future of software-defined vehicles (Jan. 08, 2025)
- 2025 Will See Huge Advances in Quantum Computing. So What is a Quantum Chip And How Does it Work? (Jan. 08, 2025)
- Qualitas Semiconductor Secures Multiple Project Licensing Agreements with Pansemi Following Successful Initial Collaboration (Jan. 07, 2025)
- GUC Taped Out UCIe 40Gbps IP using Adaptive Voltage Scaling (AVS) (Jan. 07, 2025)
- UMC Reports Sales for December 2024 (Jan. 07, 2025)
- Secure-IC's worldwide leading safe & secure automotive solutions achieve a new breakthrough: Securyzr™ S700 neo series reach ASIL-D grade (Jan. 07, 2025)
- QuickLogic Announces Strategic Process for SensiML (Jan. 07, 2025)
- Ceva Embedded AI NPUs Gain Traction in AIoT and MCU Markets, with Multiple Customer Wins and Enhanced AI Software Studio (Jan. 07, 2025)
- Ceva Expands Embedded AI NPU Ecosystem with New Partnerships That Accelerate Time-to-Market for Smart Edge Devices (Jan. 07, 2025)
- Nvidia and TSMC team up on a silicon photonics chip prototype (Jan. 07, 2025)
- Siemens launches new program to empower startups with cutting-edge technology (Jan. 07, 2025)
- Is Imagination Technologies for sale again? (Jan. 06, 2025)
- Samsung's New 2025 Monitors Bring AI Capabilities, Gaming Performance and Enhanced Productivity to CES (Jan. 06, 2025)
- GUC Monthly Sales Report - December 2024 (Jan. 06, 2025)
- GlobalFoundries and IBM Announce Settlement and Resolution of All Litigation Matters (Jan. 06, 2025)
- Flash Memory LDPC Decoder IP Core Available For Integration From Global IP Core (Jan. 06, 2025)
- CXL Update Emphasizes Security (Jan. 06, 2025)
- Ceva Wi-Fi 6 and Bluetooth IPs Power Bestechnic's New Combo Products (Jan. 06, 2025)
- MediaTek and Ceva Collaborate for More Immersive Spatial Audio Mobile Entertainment Experience (Jan. 06, 2025)
- Quantum Motion Announces Partnership with Semiconductor Manufacturer GlobalFoundries (Jan. 06, 2025)
- Siemens unveils breakthrough innovations in industrial AI and digital twin technology at CES 2025 (Jan. 06, 2025)
- Samsung Expands 'AI for All' Vision at CES 2025 To Bring AI Everyday, Everywhere (Jan. 06, 2025)
- RISC-V in AI and HPC Part 1: Per Aspera Ad Astra? (Jan. 06, 2025)
- Ansys to Demonstrate Solutions that Power Next-Generation Mobility Technology at CES 2025 (Jan. 03, 2025)
- Sustainable PCB Manufacturing: Eco-Friendly Materials and Practices (Jan. 03, 2025)
- TSMC To Lose Qualcomm's 2nm Chip Business To Samsung, Potentially Avoiding Higher Costs And Overcoming Production Hurdles (Jan. 03, 2025)
- Cadence Announces Fourth Quarter and Fiscal Year 2024 Financial Results Webcast (Jan. 03, 2025)
- Siemens Xcelerator: Eplan and Siemens Enable Data Interoperability in Machine Engineering (Jan. 03, 2025)
- Intel Is Raining Edge AI Processors at CES 2025 (Jan. 03, 2025)
- Weebit Nano licenses its ReRAM technology to onsemi (Jan. 02, 2025)
- Ceva Unveils Ceva-Waves Links200 - A Breakthrough Multi-Protocol Wireless Connectivity Platform IP Featuring Next generation Bluetooth High Data Throughput (HDT) and IEEE 802.15.4 (Jan. 02, 2025)
- Softbank Izanagi AI processor expected next year (Jan 02, 2025)
- HDMI 2.2 confirmed to launch at CES 2025 (Jan. 02, 2025)
- Silvaco To Present at the 27th Annual Needham Growth Conference (Jan. 02, 2025)
- Industry Weighs in With 2025 Forecasts Company Predictions (Jan. 02, 2025)
- TSMC sets up 2nm pilot line with production due to start in 2026 (Jan. 02, 2025)
- Intel Has a Lot to Prove in 2025 (Jan. 01, 2025)
- Silicon Photonics' Fab Future (Jan. 01, 2025)
- RISC-V Made Nice Software Progress In 2024 While Interesting Hardware Still Rare (Jan. 01, 2025)
- Automotive trends for 2025 (Jan. 01, 2025)
- SoftBank's Izanagi AI processor could arrive in 2025, says report (Dec. 31, 2024)
- 2025 Expert Quantum Predictions - PQC And Quantum Cybersecurity (Dec. 31, 2024)
- Can Samsung outpace TSMC in the 2nm era? (Dec. 31, 2024)
- Established "Advanced SoC Research for Automotive" with 12 companies, led by automotive manufacturers (Dec. 31, 2024)
- Video Interview: Progress on FAMES Pilot Line for 10-nm and 7-nm FD-SOI (Dec. 31, 2024)
- Top Merger and Acquisition in Tech in 2024: Key Acquisitions Shaping the Business Landscape (Dec. 30, 2024)
- TSMC (TSM) Spotlight: The Foundry of 21st Century Gold (Dec. 30, 2024)
- Software-defined vehicle (SDV): A technology to watch in 2025 (Dec. 30, 2024)
- TSMC silicon photonics tech first co-package optics (CPO) samples ready for NVIDIA, Broadcom (Dec. 30, 2024)
- 64Gbps Universal chiplet boosts interconnect data rates (Dec. 30, 2024)
- CES 2025: AI-powered tech to dominate world's biggest electronics trade show (Dec. 29, 2024)
- EnSilica PLC Demonstrates Strong Growth and Market Position in ASIC Industry (Dec. 28, 2024)
- TSMC Sets Key Milestone in Japan as Kumamoto Fab Begins Mass Production (Dec. 27, 2024)
- China Becomes a Contender in Quantum Computing (Dec. 27, 2024)
- Software-Defined Vehicles: 'State-of-the-Art' and Challenges with AD and ADAS Computing Systems (Dec. 27, 2024)
- Cadence Appoints Moshe Gavrielov to Board of Directors (Dec. 27, 2024)
- South Korea accelerates world's largest semiconductor complex (Dec. 27, 2024)
- 7 top IoT trends to watch in 2025 and beyond (Dec. 27, 2024)
- Chiplets Extend Automotive SoC AI and GPU Capability (Dec. 27, 2024)
- Gen3 UCIe IP elevates chiplet link speeds (Dec. 26, 2024)
- L&T Technology Services Marks 10 Years of Engineering Excellence with Siemens (Dec. 26, 2024)
- GUC Joins Arm Total Design Ecosystem to Strengthen ASIC Design Services (Dec. 24, 2024)
- TSMC, Intel, Samsung Foundry ready to battle over the start of 2nm production next year (Dec. 24, 2024)
- Infineon Ranked Among World's Most Sustainable Companies (Dec. 24, 2024)
- Arm vs. RISC-V in 2025: Which Architecture Will Lead the Way? (Dec. 24, 2024)
- QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program (Dec. 23, 2024)
- Micon Global and Silvaco Announce New Partnership (Dec. 23, 2024)
- Everything Goes Up! Top Trends of 2024 (Dec. 23, 2024)
- Synopsys' $35 bln Ansys acquisition to be approved in EU, sources say (Dec. 23, 2024)
- Arm loses out in Qualcomm court case, wants a re-trial (Dec. 22, 2024)
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU (Dec. 20, 2024)
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition (Dec. 20, 2024)
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity (Dec. 20, 2024)
- Jury is out in the Arm vs Qualcomm trial (Dec. 20, 2024)
- With an Eye on TSMC, Rapidus Foundry Approaches 2nm Process (Dec. 20, 2024)
- Europe okays Italy's €1.3 billion subsidy for chiplet fab (Dec. 20, 2024)
- VeriSilicon unveils next-generation high-performance Vitality architecture GPU IP series (Dec. 19, 2024)
- RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models (Dec. 19, 2024)
- Third day for Arm vs Qualcomm trial (Dec. 19, 2024)
- Enhancements to Creonic's DVB-S2X IP Cores for Greater Flexibility and Performance (Dec. 19, 2024)
- Reimagining Video Excellence at CES 2025 with intoPIX (Dec. 18, 2024)
- Andes Technology Partners with ProvenRun to Strengthen RISC-V Trusted Execution Environment (Dec. 18, 2024)
- ARM versus Qualcomm court case opens (Dec. 18, 2024)
- Crypto Quantique adds TRNG to its quantum-derived, side-channel protected PUF hardware IP block (Dec. 18, 2024)
- Samsung Reportedly Considering Partnership with TSMC to Jointly Produce Exynos 2500 (Dec. 18, 2024)
- Siemens extends Veloce hardware-assisted verification support of EPGM Ethernet to 1.6 Tbps (Dec. 18, 2024)
- Cadence Rolls Out System Chiplet to Reorganize the SoC (Dec. 18, 2024)
- Soitec: Silicon Photonics to Power Next-Gen AI Data Centres (Dec. 18, 2024)
- Dolphin Semiconductor transfers HQ to Canada (Dec. 17, 2024)
- sureCore teams with Sarcina to package cryo chips (Dec. 17, 2024)
- M31 Unveils Full Range of Automotive IP Solutions at ICCAD Illuminating the Future of Automotive Chip Development (Dec. 17, 2024)
- BrainChip Awarded Air Force Research Laboratory Radar Development Contract (Dec. 17, 2024)
- Synopsys and SiMa.ai Announce Strategic Collaboration to Accelerate Development of Automotive Edge AI Solutions (Dec. 17, 2024)
- QuickLogic Announces Appointment of Andy Jaros as Vice President of IP Sales (Dec. 17, 2024)
- Chiplet Summit Features the Latest Chip Design Technology (Dec. 17, 2024)
- Fraunhofer IAF expands technology capabilities for chiplet innovations within the APECS pilot line (Dec. 17, 2024)
- Frontgrade Gaisler Licenses BrainChip's Akida IP to Deploy AI Chips into Space (Dec. 16, 2024)
- Industry Grade ASIL-B IP Cores licensed to Power Next-Gen Automotive Systems (Dec. 16, 2024)
- Frontgrade Gaisler Leads European Initiative for Ultra Deep Sub-Micron Semiconductor Technology for Space Applications (Dec. 16, 2024)
- Samsung and TSMC locked in intense 2nm chip competition (Dec. 16, 2024)
- NVIDIA and TSMC Unveil Silicon Photonics Innovations at IEDM 2024 (Dec. 16, 2024)
- European chiplet pilot line starts operations (Dec. 16, 2024)
- SEMICON Korea 2025 to Spotlight Edge Technologies Shaping the AI Era (Dec. 16, 2024)
- Innovation and Collaboration: Powering Sustainable Exponential Growth (Dec. 13, 2024)
- India's Semiconductor revolution: Opportunities for engineers (Dec. 13, 2024)
- BOS and Tenstorrent Unveil Eagle-N, Industry's First Automotive AI Accelerator Chiplet SoC (Dec. 12, 2024)
- BBright Expands Ultra HD Capabilities with intoPIX JPEG XS Technology in its V2.2 Decoder Platform (Dec. 12, 2024)
- Powering the NVM and Embedded Chip Security Technologies (Dec. 12, 2024)
- MosChip selects Cadence tools for the design of HPC Processor "AUM" for C-DAC (Dec. 12, 2024)
- Silicon industry veteran Oreste Donzella joins Sondrel board as Non-Executive Director (Dec. 12, 2024)
- TrendForce: Advanced Processes, Chinese Policies Drive 3Q 2024 Global Top 10 Foundry Revenue to Record Highs (Dec. 12, 2024)
- Marvell partners with Micron, Samsung, and SK hynix on custom HBM (Dec. 12, 2024)
- European Night: Celebrating European tech innovators at CES 2025 (Dec. 12, 2024)
- MosChip selects Cadence tools for the design of HPC Processor "AUM" for C-DAC (Dec. 11, 2024)
- CEA-Leti Demonstrates Embedded FeRAM Platform Compatible with 22nm FD-SOI Node (Dec. 11, 2024)
- Quobly announces key milestone for fault-tolerant quantum computing (Dec. 11, 2024)
- Cadence and Rapidus Collaborate on Leading-Edge 2nm Semiconductor Solutions for AI and HPC Applications (Dec. 11, 2024)
- MosChip selects Cadence tools for the design of HPC Processor “AUM” for C-DAC (Dec 11, 2024)
- Synopsys Announces Industry's First Ultra Ethernet and UALink IP Solutions to Connect Massive AI Accelerator Clusters (Dec. 11, 2024)
- Jmem Tek and Andes Technology Partner on the World' s First Quantum-Secure RISC-V Chip (Dec. 11, 2024)
- PIMIC Unveils Business Strategy, and Silicon Technology to Revolutionize AI at the Edge (Dec. 11, 2024)
- Nordic's Thingy prototypes IoT products (Dec. 11, 2024)
- TSMC founder: Intel should have prioritized AI over foundry (Dec. 11, 2024)
- Democratizing Chiplets (Dec. 11, 2024)
- Micon Global Selected as Sales Representative for Blue Cheetah Analog Design (Dec. 10, 2024)
- TSMC November 2024 Revenue Report (Dec. 10, 2024)
- Comprehensive ADC/DAC and AFE IP Solutions: Enabling Next-Generation Applications Across Varying Technology Nodes (Dec. 10, 2024)
- Crypto Quantique upgrades QuarkLink IoT device security platform for post-quantum cryptography (PQC) (Dec. 10, 2024)
- Rambus and Micron Technology Extend Patent License Agreement (Dec. 10, 2024)
- ST rolls out AI-microcontroller family (Dec. 10, 2024)
- UMC's Collaboration with Suppliers to Build a Sustainable Supply Chain Contributes to 2.64 Million Tons of Carbon Reduction (Dec. 10, 2024)
- Rapidus Collaborates with Synopsys to Shorten Semiconductor Design Cycles (Dec. 10, 2024)
- UPMEM selects Semidynamics RISC-V AI IP for Large Language Model Application (Dec. 09, 2024)
- Avant Technology Appointed as Sales Representative in Asia for EnSilica's eSi-Crypto IP (Dec. 09, 2024)
- Sondrel now shipping chips as part of a complete turnkey project (Dec. 09, 2024)
- Arasan Announces immediate availability of its SPMI IP (System Power Management Interface) (Dec. 09, 2024)
- Samsung foundry 'relief pitcher' Han Jin-man vows to improve 2-nm yields (Dec. 09, 2024)
- Qualitas Semiconductor's MIPI D-PHY IP Powers Mass Production of Renesas AI MPU (Dec. 06, 2024)
- UMC Reports Sales for November 2024 (Dec. 06, 2024)
- Global Semiconductor Sales Increase 22.1% Year-to-Year in October; Annual Sales Projected to Increase 19.0% in 2024 (Dec. 06, 2024)
- Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2024 (Dec. 06, 2024)
- Alphawave IP - Announcement regarding leadership transition (Dec. 06, 2024)
- CXL Consortium Announces Compute Express Link 3.2 Specification Release (Dec. 06, 2024)
- TSMC to Begin Mass Production of 2nm Chips Next Year (Dec. 06, 2024)
- TSMC Achieves New Milestone With Its 2nm Process, As Trial Production Yields Exceed 60 Percent, Which Was Better Than Expected (Dec. 06, 2024)
- GlobalFoundries Receives Funding to Accelerate GaN Chip Manufacturing (Dec. 06, 2024)
- Secure-IC wins KES Innovation Award 2024 (Dec. 06, 2024)
- GUC Monthly Sales Report - November 2024 (Dec. 05, 2024)
- Ceva-NeuPro-Nano Wins Product of the Year Award at Prestigious EE Awards Asia Event (Dec. 05, 2024)
- Advanced Processes and Chinese Policies Drive 3Q24 Global Top 10 Foundry Revenue to Record Highs, Says TrendForce (Dec. 05, 2024)
- YorChip and Digitho developing breakthrough 2D Chiplet Packaging for Mass Markets (Dec. 05, 2024)
- Intel Foundry Fails To Impress Once Again, 18A Process "Yield Rates' Are Reported To Be Only 10% Making Mass-Production Impossible (Dec. 05, 2024)
- Imagination PowerVR Driver Being Extended To Work On RISC-V (Dec. 05, 2024)
- Samsung Press Conference at CES 2025 'AI for All: Everyday, Everywhere' (Dec. 05, 2024)
- X-FAB Releases Embedded Flash Solution on its 110nm Automotive BCD-on-SOI Technology (Dec. 04, 2024)
- Alphawave Semi Joins UALink™ Consortium to Accelerate High-Speed AI Connections (Dec. 04, 2024)
- AST SpaceMobile and Cadence Collaborate to Advance the World's First and Only Planned Space-Based Global Cellular Broadband Network (Dec. 04, 2024)
- Comcores Announces Availability of its Ultra-Compact Ethernet TSN End Station Controller IP for Automotive Networks (Dec. 04, 2024)
- Kudelski IoT and PUFsecurity Combine IoT Security Strengths to Meet the Challenges of Increasing Global Regulation (Dec. 04, 2024)
- Now Gelsinger is gone, what is Intel's Plan B? (Dec. 04, 2024)
- Silvaco Joins SMART USA Institute to Propel Digital Twin Innovations Under CHIPS Manufacturing USA Program (Dec. 04, 2024)
- Soitec and Globalfoundries Collaborate in the Production of High-Performance Rf-Soi Semiconductors (Dec. 04, 2024)
- SiFive Empowers AI at Scale with RISC-V Innovation (Dec. 04, 2024)
- TSMC's Role In Shaping the Global Semiconductor Landscape: Trends And Innovations for 2025 (Dec. 04, 2024)
- Comprehensive ADC/DAC and AFE IP Solutions: Empowering Next-Gen Applications Across Diverse Technology Nodes (Dec. 03, 2024)
- Arteris Deployed by Menta for Edge AI Chiplet Platform (Dec. 03, 2024)
- Allegro DVT Launches TV 3.0 Test Suite for Brazil's Next Generation Digital Terrestrial Television System (Dec. 03, 2024)
- Intel CEO's Departure Leaves Top U.S. Chipmaker Adrift (Dec. 03, 2024)
- Post-Quantum Cryptography: Moving Forward (Dec. 03, 2024)
- Marvell Unveils Industry's First 3nm 1.6 Tbps PAM4 Interconnect Platform to Scale Accelerated Infrastructure (Dec. 03, 2024)
- SmartDV Licenses SDIO IP Family to Ranix for V2X Products (Dec. 03, 2024)
- Europe's chip market shrinks as WSTS trims forecasts for 2025 (Dec. 03, 2024)
- SK Hynix to produce HBM4 on 3 nm foundry process in 2025 (Dec. 03, 2024)
- Intel Announces Retirement of CEO Pat Gelsinger (Dec. 02, 2024)
- Tenstorrent closes $693M+ of Series D funding led by Samsung Securities and AFW Partners (Dec. 02, 2024)
- TSMC's Path to Semiconductor Foundry Leadership: Insights from Morris Chang's Memoir (Dec. 02, 2024)
- TSMC 2024 Supply Chain Management Forum Presents Awards to Outstanding Suppliers (Dec. 02, 2024)
- IP players prominent in chiplet's 2024 diary (Dec. 02, 2024)
- Apple Orders M5 Chips from TSMC for Next-Gen Devices (Nov. 30, 2024)
- Leonardo in EECONE, for a sustainable electronics supply chain (Nov. 29, 2024)
- Infineon wins German Sustainability Award 2025 (Nov. 29, 2024)
- At COP29, Leonardo's solutions to combat climate change (Nov. 29, 2024)
- Germany budgets for extra euro-billions in chip subsidies (Nov. 29, 2024)
- VeriSilicon partners with LVGL to enable advanced GPU acceleration for wearable devices and beyond (Nov. 29, 2024)
- Interconnected devices and security: how to protect the Internet of Things? (Nov. 29, 2024)
- Advanced Packaging and Chiplets Can Be for Everyone (Nov. 29, 2024)
- Siemens' Solido SPICE now certified for multiple leading-edge Samsung Foundry processes (Nov. 28, 2024)
- Silicon Creations Collaborates with Interex Semiconductor to Distribute High-Performance IPs in India (Nov. 28, 2024)
- Imagination DXS GPU IP recognised as game-changer for the car industry (Nov. 28, 2024)
- HighTec C/C++ Compiler Suite Supports Andes' ISO 26262 Certified RISC-V IP for Automotive Safety and Security Applications (Nov. 28, 2024)
- Think Silicon and LVGL Accelerate Graphics Libraries for Microcontrollers (Nov. 27, 2024)
- Government of India creating enabling environment for Semiconductor Design Community with direct access to National Chip Design Infrastructure (Nov. 27, 2024)
- TSMC May Bring 2nm Manufacturing Node to the U.S. After 2025 (Nov. 27, 2024)
- Samsung Electronics Restructures Leadership, Reinforces Focus on Semiconductor Innovation (Nov. 27, 2024)
- Andes Technology Collaborates with Lauterbach to Deliver RISC-V Trace Solution (Nov. 26, 2024)
- Alphawave Semi Drives Innovation in Hyperscale AI Accelerators with Advanced I/O Chiplet for Rebellions Inc (Nov. 26, 2024)
- Availability of New 16-bit 5MSps SAR ADC in 40nm Node Sets New Standards for High-Performance Data Conversion (Nov. 26, 2024)
- sureCore now licensing its CryoMem range of IP for Quantum Computing (Nov. 26, 2024)
- CryoMem Suite of Memory IP for QC is Now Available For Licensing (Nov. 26, 2024)
- Renesas Extends Line-up For Industrial Ethernet and Multi-Axis Motor Control Solutions with High Performance Quad-Core Application Processor (Nov. 26, 2024)
- France to buy Atos supercomputing, quantum business for €1.1bn (Nov. 26, 2024)
- Tower Semiconductor Releases 300mm Silicon Photonics Process as a Standard Foundry Offering (Nov. 26, 2024)
- Integrated silicon photonics: making the quantum future a reality (Nov. 26, 2024)
- Using AI to build next generation wireless systems (Nov. 26, 2024)
- Samsung Receiving Industry's First Global Recognition for Environmental Sustainability of its Semiconductor Solutions (Nov. 26, 2024)
- Siliconally Releases SinglePHY 100BASE-T1 22FDX, an Automotive Ethernet PHY IP (Nov. 25, 2024)
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- US backs GlobalFoundries' semiconductor growth with $1.5 billion (Nov. 25, 2024)
- GlobalFoundries and IDEMIA Secure Transactions to Enable Next-Generation Smart Card IC on GF 28ESF3 Platform (Nov. 25, 2024)
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- EU looks to change rules on technology transfer, patent pools (Nov. 22, 2024)
- Redefining Hearing Aids with Cadence DSPs (Nov. 22, 2024)
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy (Nov. 21, 2024)
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers (Nov. 21, 2024)
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M (Nov. 21, 2024)
- TSMC drives A16, 3D process technology (Nov. 21, 2024)
- Optical Transmission Modulation Methods Advance (Nov. 21, 2024)
- Solid Sands and VyperCore Collaborate to Ensure C/C++ Compliance in New Accelerator Chip Design (Nov. 21, 2024)
- SC24 Observations: China, Politics, RISC-V and CXL (Nov. 21, 2024)
- Universal AI RISC-V processor does it all - CPU, GPU, DSP, FPGA (Nov. 21, 2024)
- China's Huawei, SMIC 'to Ramp Production' of Newest AI Chip (Nov. 21, 2024)
- GlobalFoundries awarded $1.5bn subsidy (Nov. 21, 2024)
- Cadence Unveils Arm-Based System Chiplet (Nov. 20, 2024)
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP (Nov. 20, 2024)
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology (Nov. 20, 2024)
- GlobalFoundries and U.S. Department of Commerce Announce Award Agreement on CHIPS Act Funding for Essential Chip Manufacturing (Nov. 20, 2024)
- Japan proposes $1.3bn investment in Rapidus (Nov. 20, 2024)
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- Renesas Introduces Industry's First Complete Memory Interface Chipset Solutions for Second-Generation DDR5 Server MRDIMMs (Nov. 20, 2024)
- Capgemini, Mistral AI and Microsoft collaborate to further accelerate adoption of generative AI technologies (Nov. 20, 2024)
- CAST Adds New SafeSPI Controller to its Functional Safety IP Core Product Line (Nov. 19, 2024)
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards (Nov. 19, 2024)
- Infineon and Siemens collaborate to bring AURIX TC4x to next generation software-defined vehicles (Nov. 19, 2024)
- Dnotitia Unveils the World's First Hardware-Accelerated Vector Database, Seahorse, at Super Computing 2024 (Nov. 19, 2024)
- QuickLogic to Showcase Advanced eFPGA Hard IP Solutions at Space Tech Expo Europe 2024 (Nov. 18, 2024)
- SLS Launches Industry-First USB 20Gbps Device IP Core (Nov. 18, 2024)
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC (Nov. 18, 2024)
- NVIDIA Announces Omniverse Real-Time Physics Digital Twins With Industry Software Leaders (Nov. 18, 2024)
- Climate-friendly electricity is derived from ammonia (Nov. 18, 2024)
- Credo Completes First GHG Emissions Calculation, Strengthens Commitment to Environmental Sustainability (Nov. 18, 2024)
- Siemens Launches TIA Portal Version 20 Focused on Improved Performance (Nov. 16, 2024)
- RISC-V for HPC at SC24 (Nov. 16, 2024)
- Alphawave Semi Partners with PCISig, CXL Consortium, UCIe Consortium, Samtec and Lessengers to Showcase Advances in AI Connectivity at Supercomputing 2024 (Nov. 15, 2024)
- Grass Valley Adds JPEG XS Support to AMPP, Powered by intoPIX FastTicoXS Technology, Enhancing Cloud-Based Live Production (Nov. 15, 2024)
- AI Software Startup Moreh Partners with AI Semiconductor Company Tenstorrent to Challenge NVIDIA in AI Data Center Market (Nov. 15, 2024)
- Siemens presents next-generation AI-supported software for electronic system design (Nov. 15, 2024)
- Imec Chipset Alliance Aims to Expand AI to Cars (Nov. 15, 2024)
- QuickLogic to Showcase Advanced eFPGA Hard IP Solutions at Space Tech Expo Europe 2024 (Nov. 15, 2024)
- TSMC grabs US$11 billion for Arizona fabs from US Chips Act (Nov. 15, 2024)
- Imec Chiplet Alliance Aims to Expand AI to Cars (Nov. 15, 2024)
- Renesas Unveils Industry's First Automotive Multi-Domain SoC Built with 3-nm Process Technology (Nov. 14, 2024)
- Renesas' New R-Car SoC Supports Centralized Car Compute (Nov. 14, 2024)
- What RISC-V Means for the Future of Chip Development (Nov. 13, 2024)
- intoPIX and Media Links: Powering Next-Generation IP Media Transport with JPEG XS at InterBEE 2024 (Nov. 12, 2024)
- NanoXplore acquires Dolphin Design's ASIC business and strengthens its strategic position in aerospace (Nov. 12, 2024)
- SEMIFIVE Collaborates with Synopsys to Develop Advanced Chiplet Platform for High-Performance Multi-Die Designs (Nov. 12, 2024)
- Siemens extends Veloce hardware-assisted verification and validation with new Innexis shift-left software (Nov. 12, 2024)
- lowRISC and SCI Semiconductor Partner to Create First CHERIoT Commercial Tapeout (Nov. 12, 2024)
- Kudelski IoT Launches Quantum-Resistant Security IP, Future-Proofing Semiconductors Against Emerging Quantum Threats (Nov. 12, 2024)
- Samsung Reportedly Joins TSMC in Halting 7nm and Below AI Chip Supplies to China (Nov. 12, 2024)
- Arteris and MIPS Partner on High-Performance RISC-V SoCs for Automotive, Datacenter and Edge AI (Nov. 12, 2024)
- Silicon Creations Celebrates Milestone with Delivery of 1,000th Production License for Fractional-N PLL (Nov 12, 2024)
- intoPIX JPEG XS Powers Village Island's VICO-2L-XS for Cost-effective SDI/IP Conversion (Nov. 12, 2024)
- CHERI builds global chip security alliance (Nov. 12, 2024)
- LG and Tenstorrent Expand Partnership to Enhance AI Chip Capabilities (Nov. 12, 2024)
- CHERI Alliance Officially Launches, Adds Major Partners including Google, to Tackle Cybersecurity Threats at the Hardware Level (Nov. 12, 2024)
- Achronix and BigCat Wireless Collaborate to Deliver Unprecedented Power Efficiency and Performance for 5G/6G Wireless Applications (Nov. 12, 2024)
- Silvaco Reports Third Quarter 2024 Financial Results (Nov. 12, 2024)
- TI opens its first product distribution centre in Europe (Nov. 12, 2024)
- Oriole Networks Selects EnSilica as ASIC Partner and Contract Award for Photonics Controller ASIC (Nov. 11, 2024)
- Delivering industry-leading solutions with Comprehensive Automotive Grade Silicon IP Portfolio with ISO 26262 and ASIL Certifications (Nov. 11, 2024)
- DMP Released Next-Generation AI Accelerator IP "ZIA A3000 V2" - Industry-leading PPA efficiency to propel the future of edge AI (Nov. 11, 2024)
- Imagination DXS GPU officially certified as ASIL-B compliant (Nov. 11, 2024)
- Flex Logix Acquired By Analog Devices (Nov. 11, 2024)
- Oriole Networks Selects EnSilica as ASIC Partner and Contract Award for Photonics Controller ASIC (Nov. 11, 2024)
- U.S. restricts TSMC's export of advanced chips to China (Nov. 11, 2024)
- Will Europe become the world's foundry for photonic chips? (Nov. 11, 2024)
- Where the Future Begins: Samsung Showcases Pioneering Innovations for AI and Automotive Technologies at electronica 2024 in Munich (Nov. 11, 2024)
- MIPS Releases P8700, Industry's First High-Performance AI-Enabled RISC-V Automotive CPU for ADAS and Autonomous Vehicles (Nov. 08, 2024)
- Siemens launches fully electronic e-Starter with semiconductor technology (Nov. 08, 2024)
- Last-Time Buy Notifications For Your ASICs? How To Make the Most of It (Nov. 08, 2024)
- Global battery passport boost from pilot schemes (Nov. 08, 2024)
- CEA-Leti to Present Breakthroughs in Memory, RF, FDSOI at IEDM (Nov. 08, 2024)
- IonQ Strengthens Quantum Computing Capabilities through Partnerships with imec and NKT Photonics (Nov. 08, 2024)
- Sondrel announces that it is opening up its library of IP for licensing (Nov. 07, 2024)
- Ceva, Inc. Announces Third Quarter 2024 Financial Results (Nov. 07, 2024)
- Panasonic Automotive Systems and Arm Partner to Standardize Software-Defined Vehicles (Nov. 07, 2024)
- TSMC and GlobalFoundries finalize CHIPS Act funding agreements (Nov. 07, 2024)
- Merck KGaA, Darmstadt, Germany and Intel Launch Academic Research Program in Europe for More Sustainable Semiconductor Manufacturing (Nov. 07, 2024)
- Comcores Announces Strategic Sales Partnership with Micon Global (Nov. 06, 2024)
- Arteris Announces Financial Results for the Third Quarter 2024 and Fourth Quarter and Full Year 2024 Guidance (Nov. 06, 2024)
- M31 Launches USB4 IP for TSMC 5nm Process (Nov. 06, 2024)
- Revolutionize AIoT with MYC-LR3576: The Ultimate Rockchip Octa-core Arm Processor Solution (Nov. 06, 2024)
- Bill Gropp on 'Different Approaches to AI' (Nov. 06, 2024)
- Renesas Announces Additional Key Leadership Changes (Nov. 06, 2024)
- Tessolve to Acquire Germany's Dream Chip Technologies (Nov. 06, 2024)
- Orca Semi Unveils IO-Link Comms Transceiver for the Smart Factory (Nov. 06, 2024)
- ST plans integrated automotive microcontroller line (Nov. 06, 2024)
- Arm Achieves Record Q2 Results (Nov. 06, 2024)
- EnSilica plc - Audited Full Year Results for the Year Ended 31 May 2024 (Nov. 05, 2024)
- Tenstorrent Expands Deployment of Arteris' Network-on-Chip IP to Next-Generation of Chiplet-Based AI Solutions (Nov. 05, 2024)
- Siemens' Tessent In-System Test software enables advanced, deterministic testing throughout the silicon lifecycle (Nov. 05, 2024)
- Jolt Capital buys and invests in Dolphin Design's carved-out mixed-signal IP activities (Nov. 05, 2024)
- Renesas Brings the High Performance of Arm Cortex-M85 Processor to Cost-Sensitive Applications with New RA8 Entry-Line MCU Groups (Nov. 05, 2024)
- Tenstorrent to Build Japanese Engineering Talent with US-Based AI and RISC-V Training (Nov. 05, 2024)
- GlobalFoundries revenue drops 6% to $1.74 bn (Nov. 05, 2024)
- Samsung set to scale back foundry production (Nov. 05, 2024)
- ULYSS1, Microcontroller (MCU) for Automotive market, designed by Cortus is available (Nov. 04, 2024)
- Sondrel announces CEO transition to lead next phase of growth (Nov. 04, 2024)
- M31 is partnering with Taiwan Cooperative Bank to launch an Employee Stock Ownership Trust to strengthen talent retention (Nov. 04, 2024)
- Logic Design Solutions launches Gen4 NVMe host IP (Nov. 04, 2024)
- Research for the future, application transfer for the present (Nov. 04, 2024)
- Flexible RISC-V Microprocessor Under $1 Redefines Electronics (Nov. 04, 2024)
- PiMCHIP Deploys Ceva Sensor Hub DSP in New Edge AI SoC (Oct. 31, 2024)
- Weebit Nano continuing to make progress with potential customers and qualifying its technology Moving closer to finalisation of licensing agreements Q1 FY25 Quarterly Activities Report (Oct. 31, 2024)
- JEDEC Publishes LPDDR5 CAMM2 Connector Performance Standard (Oct. 31, 2024)
- Alphawave Semi Selected for AI Innovation Research Grant from UK Government's Advanced Research + Invention Agency (Oct. 31, 2024)
- PUF security IPs bolstered by test suite, PSA certification (Oct. 31, 2024)
- BoS Semiconductors joins UCIe Consortium for its ADAS chiplet SoC family (Oct. 30, 2024)
- Secure-IC obtains the first worldwide CAVP Certification of Post-Quantum Cryptography algorithms, tested by SERMA Safety & Security (Oct. 30, 2024)
- Arm's power play will backfire (Oct. 30, 2024)
- Cadence Reports Third Quarter 2024 Financial Results (Oct. 30, 2024)
- DENSO and U.S. Startup Quadric Sign Development License Agreement for AI Semiconductor (NPU) (Oct. 30, 2024)
- MIPI Alliance Releases Camera Security Specifications for Flexible End-to-End Protection of Automotive Image Sensor Data (Oct. 30, 2024)
- Xiphera and Crypto Quantique Announce Partnership for Quantum-Resilient Hardware Trust Engines (Oct. 30, 2024)
- Faraday Unveils HiSpeedKit?-HS Platform for High-speed Interface IP Verification in SoCs (Oct. 30, 2024)
- Back-end semiconductor equipment: advanced packaging to propel the market in 2025 (Oct. 30, 2024)
- BrainChip Accerates AI at the Edge With New Low-Power Neural Processor (Oct. 30, 2024)
- The dead end of chips: Manufacturing semiconductors consumes as much energy as entire countries (Oct. 30, 2024)
- Siemens strengthens leadership in industrial software and AI with acquisition of Altair Engineering (Oct. 30, 2024)
- PQShield listed as fastest-growing startup in cyber-security : Fortune Cyber 60 (Oct. 30, 2024)
- Rambus Reports Third Quarter 2024 Financial Results (Oct. 29, 2024)
- Xylon Announces New logicBRICKS Vision AI Framework for AMD Adaptive SoCs (Oct. 29, 2024)
- Arteris Selected by TIER IV for Intelligent Vehicles (Oct. 29, 2024)
- Logic Fruit and ElectraIC Announce Strategic Partnership to Serve Turkish Market (Oct. 29, 2024)
- Siemens and CELUS collaborate to empower SMBs with AI-powered PCB design (Oct. 29, 2024)
- 4 Highlights From the RISC-V Summit North America (Oct. 29, 2024)
- Navigating Round 2 of NIST's call for additional PQ signature schemes (Oct. 29, 2024)
- OpenAI working with Broadcom and TSMC to develop custom AI inference chip (Oct. 29, 2024)
- Synopsys Announces Earnings Release Date For Fourth Quarter and Fiscal Year 2024 (Oct. 29, 2024)
- Intel's Foundry Struggles Deepen As TSMC Rules Out Fab Acquisition (Oct. 29, 2024)
- Qualitas Semiconductor Expands Cutting-Edge IP Portfolio with the Successful Development of the MIPI DSI-2 TX Controller Solution (Oct. 28, 2024)
- PUFsecurity Collaborate with Arm on PSA Certified RoT Component Level 3 Certification for its Crypto Coprocessor to Provide Robust Security Subsystem Essential for the AIoT era (Oct. 28, 2024)
- Alchip Announces Successful 2nm Test Chip Tapeout (Oct. 28, 2024)
- Gartner Forecasts Worldwide Semiconductor Revenue to Grow 14% in 2025 (Oct. 28, 2024)
- BoS Semiconductors joins UCIe Consortium for its ADAS chiplet SoC family (Oct. 28, 2024)
- SEMIFIVE Joins World Economic Forum's Global Innovators Community (Oct. 28, 2024)
- HCLTech announces its first delivery centre in Kochi (Oct. 28, 2024)
- Cadence Reports Third Quarter 2024 Financial Results (Oct. 28, 2024)
- Rapidus Plans Second Plant for 1.4nm Process if 2nm Mass Production Proceeds Smoothly (Oct. 28, 2024)
- From AI to Sustainability: Arm Has a Comprehensive Approach to Innovation (Oct. 28, 2024)
- Siemens teams for digital twin of Dutch grid (Oct. 26, 2024)
- Former Intel directors believe Intel must split in two to survive (Oct. 26, 2024)
- Silvaco Inc. Achieves ISO 9001 Certification for Comprehensive Suite of TCAD, EDA, and IP Products (Oct. 25, 2024)
- Next generation AI chip design exploration at imec UK (Oct. 25, 2024)
- Empowering a sustainable AI revolution (Oct. 25, 2024)
- Synopsys' $34 Billion Ansys Deal Gets UK Antitrust Scrutiny (Oct. 25, 2024)
- Arm puts Qualcomm on notice of cancellation of its licence (Oct 24, 2024)
- SCI Semiconductor announces Global-First CHERI enabled devices and Early Access Program (Oct. 24, 2024)
- Intel-Samsung foundry collaboration (Oct 24, 2024)
- Mature Process Capacity to Grow 6% in 2025; Chinese Foundries Lead Expansion (Oct 24, 2024)
- IC'Alps obtains Common Criteria site certification with Tiempo Secure as sponsor (Oct. 24, 2024)
- The Role of Edge Computing in Evolving Software-Defined Vehicle Architectures (Oct. 24, 2024)
- Silicon IP Provider, Chips&Media Unveils New Multi Video Codec IP, WAVE6 Gen2+ (Oct. 23, 2024)
- Logic Design Solutions launches an EXFAT IP Soft Core for NVMe Host (Oct. 23, 2024)
- GlobalFoundries and NXP to Deliver Next-Generation 22FDX Solutions for Automotive, IoT and Smart Mobile (Oct. 23, 2024)
- M31 Once Again Ranked Among Forbes' "Asia 200 Best Under a Billion" List (Oct. 23, 2024)
- Celestial AI Acquires Rockley Photonics Patent Portfolio, Strengthening Photonic Fabric IP (Oct. 23, 2024)
- First CHERI RISC-V embedded chip and Early Access Programme (Oct. 23, 2024)
- Google Reportedly Switching To TSMC 3nm 'N3E' Process For Its Tensor G5, Tensor G6 To Be Mass Produced On The More Advanced 'N3P' Technology (Oct. 23, 2024)
- RISC-V reaches milestone with RVA23 profile ratification (Oct. 23, 2024)
- Fraunhofer ISE opens battery research centre in Freiburg (Oct. 23, 2024)
- MosChip Technologies joins Renesas RZ Partner Ecosystem as AI/ML Design Partner (Oct. 22, 2024)
- Logic Fruit Technologies Welcomes Mr. Gurudutt (GD) Bansal as Senior Vice President Engineering (Oct. 22, 2024)
- RISC-V Announces Ratification of the RVA23 Profile Standard (Oct. 22, 2024)
- VeriSilicon's DeWarp Processing IP DW200-FS achieved ISO 26262 ASIL B certification (Oct. 22, 2024)
- Logic Design Solutions launches an EXFAT IP Soft Core for NVMe Host Targeting embedded recorder systems (Oct. 22, 2024)
- Alphawave Semi Q3 2024 Trading and Business Update (Oct. 22, 2024)
- Andes Technology Unveils the D45-SE RISC-V Processor Targeting ASIL-D Certification (Oct. 22, 2024)
- DeepComputing and Andes Technology Partner to Develop the World's First RISC-V AI PC with 7nm QiLai SoC, Featuring Ubuntu Desktop (Oct. 22, 2024)
- Fractile Licenses Andes Technology's RISC-V Vector Processor as It Builds Radical New Chip to Accelerate AI Inference (Oct. 22, 2024)
- Intel Explores Foundry Alliance with Samsung in High-Level Talks (Oct. 22, 2024)
- Keysight collaborates with Siemens EDA enabling next generation of wireless design (Oct. 22, 2024)
- China's first 3nm SoC by Xiaomi marks a seven-year gap since its last launch, likely manufactured by TSMC (Oct. 22, 2024)
- Improved materials for microchip interconnections (Oct. 22, 2024)
- White Paper - CANsec: Security for the Third Generation of the CAN Bus (Oct. 22, 2024)
- IoT providers need to deliver more than connectivity, says report (Oct. 22, 2024)
- DeepComputing and Andes Technology Partner to Develop the Worlds First RISC-V AI PC with 7nm QiLai SoC, Featuring Ubuntu Desktop (Oct. 22, 2024)
- EnSilica plc - Award of £2 million Controller ASIC Design Services Contract (Oct. 21, 2024)
- Andes Announces the AndesCore™ AX66 supporting RVA23, Multi-cluster, Hypervisor and Android (Oct. 21, 2004)
- Arteris and SiFive Deliver Pre-verified Solution for the Datacenter Market (Oct 21, 2024)
- Codasip enables secure Linux by donating CHERI RISC-V SDK to the CHERI Alliance (Oct 21, 2024)
- Andes Announces the AndesCore™ 46-Series Family and the 3rd generation Vector Processor AX46MPV with Matrix Extension (Oct. 21, 2024)
- SiFive HiFive Premier P550 Development Boards Now Shipping (Oct. 21, 2024)
- The pace quickens for cryptography (Oct. 21, 2024)
- Arteris Evolves Its Network-on-Chip Tiling to Accelerate AI Designs (Oct. 19, 2024)
- The role of RISC-V in the European Processor Initiative - Interview with Roger Espasa (Oct 18, 2024)
- TSMC Reports Third Quarter EPS of NT$12.54 (Oct 18, 2024)
- Thalia adds analog and mixed-signal IP reuse to Siemens' Cre8Ventures Digital Twin Marketplace (Oct 17, 2024)
- EnSilica - Design and Supply contract award for a controller ASIC for automotive and industrial markets (Oct 17, 2024)
- Rebellions Builds Chiplet Roadmap, Merges with Sapeon (Oct. 17, 2024)
- Samsung offers first 24Gb GDDR7 DRAM for AI computing (Oct. 17, 2024)
- Ex-Samsung executive wants a slice of self-driving car market (Oct. 17, 2024)
- Outlook 2025: Embracing the chiplet journey (Oct. 17, 2024)
- ADTechnology Partners with Arm, Samsung Foundry, and Rebellions on AI CPU Chiplet Platform (Oct. 16, 2024)
- Successful tape out of Chip Interfaces' JESD204D IP by a tier 1 semiconductor company (Oct. 16, 2024)
- Samsung Foundry Pushes Up The Race Against TSMC In "Process Superiority", Starts Prepping 2nm & 1.4nm Production Lines (Oct. 16, 2024)
- Rebellions partners with Arm on AI computing chiplet Techs (Oct. 16, 2024)
- Efabless Goes the Custom Route for Edge ML (Oct. 16, 2024)
- Intel and AMD form x86 Ecosystem Advisory Group (Oct. 16, 2024)
- eMemory Join Forces with Siemens on Groundbreaking SRAM Repair Toolset: Pre-integrated Tessent MemoryBIST with NeoFuse OTP (Oct. 15, 2024)
- Agile Analog announces MoU to support new Southern Taiwan IC Design Industry (Oct. 15, 2024)
- CAST Partners with KiviCore for Post-Quantum Cryptography (Oct. 15, 2024)
- Weebit Nano expands global sales infrastructure to support increased demand (Oct. 15, 2024)
- Codasip unveils versatile automotive-grade embedded RISC-V core (Oct. 15, 2024)
- CEA-Leti Launches OpenTRNG, an Open-Source Project For True Random Number Generators Using Ring-Oscillator-Based Architectures (Oct. 15, 2024)
- Arm Total Design Ignites Growing Ecosystem of Arm-based Silicon for a Sustainable AI Datacenter (Oct. 15, 2024)
- Arteris Network-on-Chip Tiling Innovation Accelerates Semiconductor Designs for AI Applications (Oct. 15, 2024)
- Rambus Unveils Industry-First Complete Chipsets for Next-Generation DDR5 MRDIMMs and RDIMMs to Deliver Breakthrough Performance for Data Center and AI (Oct. 15, 2024)
- Cadence Announces Fem.AI Alliance to Lead Gender Equity Revolution in the AI Workforce (Oct. 15, 2024)
- Silvaco Announces Preliminary Unaudited Revenue for Q3 and Updates Full Year 2024 (Oct. 15, 2024)
- Axiomise 7th birthday - we are proud to be at DVCon Europe (Oct. 15, 2024)
- AI and Semiconductors: A Symbiotic Relationship (Oct. 15, 2024)
- Siemens Updates Simcenter Testlab for Advanced Manufacturers (Oct. 14, 2024)
- SEMIFIVE Concluded Mass Production Contract for AI Chip with HyperAccel (Oct. 14, 2024)
- SEMIFIVE Extends Partnership with Arm to Advance AI and HPC SoC Platforms (Oct. 14, 2024)
- DisplayPort Rx PHY and Controller IP Cores in multiple Leading Technology Nodes for Next-Generation Video SoCs (Oct. 14, 2024)
- Exclusive Interview: Antti Rauhala Discusses CoreHW's CHW3021 Radio Front-End IC (Oct. 14, 2024)
- TSMC "already planning" for more European fabs (Oct. 14, 2024)
- Credo Announces PCI Express 6 /7, Compute Express Link CXL 3.x Retimers, and AEC PCI Express Product Line at OCP Summit 2024 (Oct. 14, 2024)
- Samsung's Next Move? Early HBM4 Mass-production and 2nm Foundry Solutions Could Be the Cure (Oct. 14, 2024)
- Kernkonzept and Lauterbach Make Virtualized RISC-V Systems Possible (Oct. 14, 2024)
- Supercharging Automotive Production Line With AI-Powered Manufacturing (Oct. 14, 2024)
- September foundry sales: a tale of differing fortunes (Oct. 12, 2024)
- IEDM: CFETs make progress at 5nm and 7angstrom (Oct. 11, 2024)
- Infineon intensifies collaboration on CO2 reduction targets with suppliers and honors top performers with Green Awards (Oct. 11, 2024)
- SensiML Expands Platform Support to Include the RISC-V Architecture (Oct 10, 2024)
- Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo commit to join imec's Automotive Chiplet Program (Oct. 10, 2024)
- Why Chiplets Are the Next Big Innovation in Silicon (Oct. 10, 2024)
- Deeptech Keysom completes a €4M fundraising and deploys the first "no-code" tool dedicated to the design of tailor-made processors (Oct 10, 2024)
- Crypto Quantique teams up with Attopsemi to simplify the implementation of PUF technology in MCUs and SoCs (Oct 10, 2024)
- TSMC September 2024 Revenue Report (Oct 10, 2024)
- Bosch, Tenstorrent to collaborate on standardizing automotive chips (Oct. 10, 2024)
- LDRA Announces Extended Support for RISC-V High Assurance Software Quality Tool Suite to Accelerate On-Target Testing of Critical Embedded Applications (Oct. 09, 2024)
- Intel Architects Start RISC-V Business with AheadComputing (Oct. 09, 2024)
- Silicon Labs and Kudelski IoT Partner to Accelerate Matter Device Certification (Oct. 09, 2024)
- Rambus to Announce Third Quarter Fiscal Year 2024 Results (Oct. 09, 2024)
- How Poland became key to Europe's semiconductor sovereignty (Oct. 09, 2024)
- MIPI Alliance Announces OEM, Expanded Ecosystem Support for MIPI A-PHY Automotive SerDes Specification (Oct 09, 2024)
- Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production (Oct. 08, 2024)
- Secure-IC unveils its Securyzr™ neo Core Platform at Embedded World North America 2024 (Oct. 08, 2024)
- OPENEDGES Technology Achieves ISO 26262 ASIL-B Certification (Oct. 08, 2024)
- Intel, TSMC to detail 2nm processes at IEDM (Oct. 08, 2024)
- Revolutionizing High-Performance Silicon: Alphawave Semi and Arm Unite on Next-Gen Chiplets (Oct. 08, 2024)
- Debug and Trace Support for Synopsys ARC-V Processor IP (Oct. 08, 2024)
- Efabless Unveils New Custom Chip Platform Designed for Edge ML Products (Oct. 08, 2024)
- Silicon Labs Series 3 Platform Guides the IoT Evolution (Oct. 08, 2024)
- MosChip Reaches Embedded World North America 2024 With its DigitalSky (Oct. 08, 2024)
- Quantum Tunneling and PUFs: The Future of IoT Security (Oct. 08, 2024)
- Global Semiconductor Sales Increase 20.6% Year-to-Year in August (Oct. 07, 2024)
- Bluetooth® V6.0 Channel Sounding RF Transceiver IP Core in 22nm & 40nm for ultra-low power distance aware Bluetooth connected devices (Oct. 07, 2024)
- UMC Reports Sales for September 2024 (Oct. 07, 2024)
- GUC Monthly Sales Report - September 2024 (Oct. 07, 2024)
- intoPIX to Showcase Innovative Automotive Imaging Solutions at AutoSens Europe 2024 (Oct 07, 2024)
- NVMe Updates Expand Discoverability, Security (Oct 07, 2024)
- Electronic System Design Industry Posts $4.7 Billion in Revenue in Q2 2024, ESD Alliance Reports (Oct 07, 2024)
- A New Phase for Quantum Competition in Europe (Oct. 07, 2024)
- PQShield achieves first FIPS 140-3 certification (Oct 07, 2024)
- Boosting Efficiency and Reducing Costs: Silvaco's Approach to Semiconductor Fabrication (Oct 07, 2024)
- Alphacore teams with Southwest Advanced Prototyping HUB at ASU to advance national security with nearly $30 million in federal funding award (Oct 07, 2024)
- Xylon's Updated logiHSSL IP Core Seamlessly Connects Infineon AURIX Microcontrollers with AMD Adaptive SoCs and FPGAs (Oct. 07, 2024)
- Accelerating Europe's Photonics Lab-to-Fab Journey (Oct. 07, 2024)
- UK announces sustainable electronics centre (Oct. 07, 2024)
- Samsung ports Tizen OS to RISC-V (Oct. 05, 2024)
- Murata opens silicon capacitor production line at French manufacturing site (Oct. 04, 2024)
- Xiphera Partners with IPro for the Israeli Chip Design Market (Oct. 03, 2024)
- Crypto Quantique collaborates with ADLINK to simplify and enhance device security in industrial PCs (Oct. 03, 2024)
- Launching MosChip DigitalSky™ for Building Connected Intelligent Enterprises (Oct. 03, 2024)
- South Korean AI IC Design Companies Shifting to Dual-Foundry Model with Both Samsung and TSMC (Oct. 03, 2024)
- Uncovering Silent Data Errors with AI (Oct. 03, 2024)
- Significant EU funding for VTT's semiconductor development - supporting the growth of the semiconductor industry (Oct. 03, 2024)
- Achronix Releases Groundbreaking Speedster AC7t800 Mid-Range FPGA, Driving Innovation in AI/ML, 5G/6G and Data Center Applications (Oct. 02, 2024)
- EXTOLL collaborates with Frontgrade Technologies for High-Speed SerDes IP (Oct. 02, 2024)
- Siemens collaborates with GlobalFoundries to certify Analog FastSPICE for the foundry's high-performance processes (Oct. 02, 2024)
- Faraday Enhances 3D-IC Design Service with Ansys Multiphysics Analysis (Oct. 02, 2024)
- ST and Qualcomm announce strategic wireless/IoT collaboration (Oct. 02, 2024)
- QuickLogic Delivers eFPGA IP Targeting TSMC N12e Process in Record Time (Oct. 01, 2024)
- MulticoreWare collaborates with Arm to optimize and advance x265 video encoding on AWS Graviton4 (Oct. 01, 2024)
- Comcores announces the launch of the Centralized Network Configurator for TSN-based networks (Oct. 01, 2024)
- BrainChip Introduces Lowest-Power AI Acceleration Co-Processor (Oct. 01, 2024)
- RaiderChip brings Meta Llama 3.2 LLM HW acceleration to low cost FPGAs (Oct. 01, 2024)
- STMicroelectronics and Qualcomm Expand Collaboration to Drive Wireless IoT Solutions (Oct. 01, 2024)
- Synopsys Software Integrity Group Rebrands as Black Duck ‐ A New Era in Application Security (Oct. 01, 2024)
- First IBM Quantum Data Centre opens in Europe (Oct. 01, 2024)
- Will Intel's restructuring affect Samsung's foundry business? (Oct. 01, 2024)
- Samsung's New 3nm GAA Technology Has Failed To Attract New Customers Because Of Unstable Yields, With Industry Watchers Forecasting A $385 Million Loss (Oct. 01, 2024)
- Paul Williamson on Edge AI, Llama 3.2 on Arm (Sept. 30, 2024)
- Global Semiconductor Industry Plans to Invest $400 Billion in 300mm Fab Equipment Over Next Three Years, SEMI Reports (Sept. 30, 2024)
- Unveiling the Availability of Industry's First Silicon-Proven 3nm, 24Gbps UCIe™ IP Subsystem with TSMC CoWoS® Technology (Sept. 30, 2024)
- Qualcomm and Sequans Complete Sale of 4G IoT Technology (Sept. 30, 2024)
- Siemens brings industry leading Capital electrical and electronic systems design software to the cloud as a service (Sept. 30, 2024)
- Flexible RISC-V processor offers prospect of low-cost smart objects (Sept. 30, 2024)
- Breakthrough in lithium-metal solid-state battery technology (Sept. 30, 2024)
- A Q&A with Quantum Systems Accelerator Director Bert de Jong (Sept. 30, 2024)
- M31 Honored with MSCI ESG 'A' Rating ‐ Advancing Toward a New Milestone in Sustainability (Sept. 30, 2024)
- Dnotitia Announces Strategic Partnership with Korea University Anam Hospital and Advanced Medical Imaging Research Institute to Develop LLM-based Medical AI Solutions (Sept. 27, 2024)
- Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design (Sept. 26, 2024)
- EXTOLL collaborates with BAE Systems as a Key Partner for High-Speed SerDes IP (Sept. 26, 2024)
- Siemens extends collaboration with TSMC to advance integrated circuit and systems design (Sept. 26, 2024)
- EnSilica joins TSMC Design Center Alliance (Sept. 26, 2024)
- M31 Launches ONFi5.1 I/O IP on TSMC 5nm Process (Sept. 26, 2024)
- eMemory Won TSMC OIP Partner of the Year Award for the Outstanding Development of its NVM IP on Advanced Nodes (Sept. 26, 2024)
- TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven IP and 3D-IC Solutions (Sept. 26, 2024)
- Silicon Creations Awarded TSMC's 2024 Open Innovation Platform Partner of the Year for Mixed Signal IP (Sept. 26, 2024)
- MIPI Alliance Releases A-PHY v2.0, Doubling Maximum Data Rate of Automotive SerDes Interface To Enable Emerging Vehicle Architectures (Sept. 26, 2024)
- SIAE Microelettronica Selects Ensilica as Key Partner to Design ASICs for Next-Generation Telecom Equipment (Sept. 26, 2024)
- Alphawave Semi Wins Fifth Consecutive TSMC OIP Ecosystem Forum Partner of the Year Award (Sept. 26, 2024)
- Europe takes a quantum leap: LUMI-Q consortium signs contract to establish quantum computer in the Czech Republic (Sept. 26, 2024)
- Quside and PQShield Partner to Launch Integrated Quantum-Safe Cryptographic Solution for Enhanced Digital Security (Sept. 26, 2024)
- The paradox of semiconductors - EU governance between sovereignty and interdependence (Sept. 26, 2024)
- Preferred Networks Inc. adopts Siemens' PowerPro software for next-generation AI chip design (Sept. 25, 2024)
- Certus Semiconductor releases I/O library in TowerJazz's 65nm process (Sept. 25, 2024)
- Silvaco Expands its Victory TCAD and Digital Twin Modeling Platform to Planar CMOS, FinFET and Advanced CMOS Technologies (Sept. 25, 2024)
- Introducing a Versatile 1G Ethernet PHY IP Core with BroadR-Reach™ Technology for Automotive and Industrial Applications (Sept. 25, 2024)
- Alphawave Semi and Arm to Present on Chiplets for Architecting Next-Generation Terabit AI Networks at the TSMC OIP Ecosystem Forum North America (Sept. 25, 2024)
- Samsung develops automotive SSD based on 8th-generation V-NAND (Sept. 25, 2024)
- EU Launches €73M Quantum Chip Funding to Support Technological Sovereignty and Semiconductor Innovation (Sept. 25, 2024)
- Security Concerns Plague Emerging Chip Architecture (Sept. 25, 2024)
- CEA-Leti Announces Launch of FAMES Pilot Line As Part of EU Chips Act Initiative (Sept. 25, 2024)
- Boosting Efficiency and Reducing Costs: Silvacos Approach to Semiconductor Fabrication (Sept. 25, 2024)
- Intel More Likely to Divest Units Than Seek Buyout (Sept. 25, 2024)
- Alphawave Semi and InnoLight Extend PCIe over Optics Collaboration with Demonstration of 128Gbps Gen 7.0 over Low Latency Linear Pluggable Optics at ECOC 2024 (Sept. 24, 2024)
- SigmaSense Teams Up with Dolphin Design to Deliver Power Efficiency in their Advanced SDC300 Touch Controller (Sept. 24, 2024)
- Ceva and Edge Impulse Join Forces to Enable Faster, Easier Development of Edge AI Applications (Sept. 24, 2024)
- GUC Announces Adoption of HBM3E IP by CSP Data Center (Sept. 24, 2024)
- Dnotitia Announces Strategic MOU with VESSL AI to Pioneer Next-Generation AI Innovation (Sept. 24, 2024)
- GenAI v1-Q launched with 4 bits Quantization support to accelerate larger LLMs at the Edge (Sept. 24, 2024)
- Renesas Leads ADAS Innovation with Power-Efficient 4th-Generation R-Car Automotive SoCs (Sept. 24, 2024)
- Intel's entire turnaround plan hinges on this one new chip family - Clearwater Forest pictured, Intel's first 18A chip slated for high-volume manufacturing (Sept. 24, 2024)
- Alphawave Semi - Interim results for the six months ended 30 June 2024 (Sept. 23, 2024)
- RAAAM Memory Technologies and NXP Semiconductors Announce Collaboration to Implement High Density On-Chip Memory (Sept. 23, 2024)
- Comcores and Extoll successfully completed the interoperability test of Comcores JESD204C IP core and Extoll SerDes PHY (Sept. 23, 2024)
- XtremeSilica Successfully Ships First SDRAM Controller for Tapeout GF40nm (Sept. 23, 2024)
- Synopsys Enters Definitive Agreement with Keysight Technologies For Sale of Optical Solutions Group (Sept. 23, 2024)
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium (Sept. 23, 2024)
- VyperCore plans 5nm RISC-V server chip and card (Sept. 23, 2024)
- Analog Bits to Demonstrate Power Management and Embedded Clocking and High Accuracy Sensor IP at the TSMC 2024 Open Innovation Platform Ecosystem Forum (Sept. 23, 2024)
- Omni Design Technologies extends partnership with EnSilica and expands Swift™ Data Converter IP portfolio (Sept. 23, 2024)
- JEDEC® Adds to Suite of Standards Supporting Compute Express Link® (CXL®) Memory Technology with Publication of Two New Documents (Sept. 23, 2024)
- Omni Design Technologies extends partnership with EnSilica and expands Swift™ Data Converter IP portfolio (Sep 23, 2024)
- €10m for European IoT 5G satellites (Sept. 23, 2024)
- TSMC and Samsung consider major chip manufacturing plants in UAE (Sept. 23, 2024)
- JEDEC® Adds to Suite of Standards Supporting Compute Express Link® (CXL®) Memory Technology with Publication of Two New Documents (Sep 23, 2024)
- Codeplay Brings RISC-V Support to the oneAPI Construction Kit (Sept. 23, 2024)
- TSMC's Strategic Win: Full-Scale Semiconductor Production Starts Ahead of Schedule (Sept. 20, 2024)
- Cryptomathic and PQShield form strategic alliance to offer PQC solutions for code signing and data protection in compliance with latest NIST and CNSA recommendations (Sept. 19, 2024)
- Advanced Packaging Drives New Memory Solutions for the AI Era (Sept. 19, 2024)
- Synopsys Enters Definitive Agreement with Keysight Technologies For Sale of Optical Solutions Group (Sept. 19, 2024)
- Cadence Tensilica HiFi 5 DSPs Used in NXP's Next-Gen Audio DSP Family (Sept. 18, 2024)
- Alphawave Semi to Showcase Latest Advances in AI Connectivity IP at ECOC 2024 (Sept. 18, 2024)
- RaaS, a collaborative initiative, adopted Menta's eFPGA technology for RaaS Edge Computing platform (Sept. 18, 2024)
- SiFive Highlights Key Inflection Points Driving RISC-V Adoption for AI and Introduces Intelligence XM Series for AI Workload Acceleration (Sept. 18, 2024)
- Chiplet Summit 2024 Shows How Advanced Packaging Keeps Moore's Law Alive (Sept. 18, 2024)
- Cadence boss on what's wrong with India's semiconductor plan (Sept. 18, 2024)
- Cracks Emerge in U.S. CHIPS Act (Sept. 18, 2024)
- Joachim Kunkel Joins Arteris Board of Directors (Sept. 17, 2024)
- Intel and AWS Expand Strategic Collaboration, Helping Advance U.S.-Based Chip Manufacturing (Sept. 17, 2024)
- Andes core wins control slot in Rivos' RISC-V SoC (Sept. 17, 2024)
- Ultralight Edge AI Platform Unveiled (Sept. 17, 2024)
- How the FPGA Came To Be, Did General Electric invent the PLD and EPLD in 1971? (Sept. 17, 2024)
- More than 30 Projects, Overview of China's Semiconductor Industry Project Progress in 2024 (Sept. 17, 2024)
- Intel signs up AWS for AI chips, splits off foundry business (Sept. 17, 2024)
- Chinese researchers develop ultra-efficient AI processor (Sept. 17, 2024)
- The CAN XL Controller IP Core with a complete safety package is now available for immediate licensing to high-end automotive and consumer applications (Sept. 16, 2024)
- intoPIX Pre-Releases New JPEG XS IP-Cores & SDK with Master and Proxy Encoding at IBC 2024 (Sept. 16, 2024)
- Omni Design Technologies Partners with Aura Intelligent Systems on Next Generation Radar (Sept. 16, 2024)
- Thalia launches AI-powered Layout Automation software with AMALIA 24.3 (Sept. 16, 2024)
- Expedera Appoints Siyad Ma as New CEO to Drive Expansion, Innovation (Sept. 16, 2024)
- Arm Accelerates AI From Cloud to Edge With New PyTorch and ExecuTorch Integrations to Deliver Immediate Performance Improvements for Developers (Sept. 16, 2024)
- A message from Intel CEO Pat Gelsinger to employees regarding the next phase of Intel's transformation (Sept. 16, 2024)
- Taking 5G into space (Sept. 16, 2024)
- Samsung Secures US AI Chip Firm "Ambarella" Orders For Its 2nm Process, Signaling A Breakthrough (Sept. 15, 2024)
- NIST Releases First 3 Finalized Post-Quantum Encryption Standards (Sept. 13, 2024)
- Arm Announces Appointment of Young Sohn to its Board of Directors (Sept. 13, 2024)
- Logic Design Solutions launches a new version of its NVMe HOST IP Targeting embedded recorder systems (Sep 13, 2024)
- Enosemi and GlobalFoundries announce the availability of silicon-validated electronic-photonic design IP available in the GF Fotonix platform (Sept. 13, 2024)
- SEALSQ Adopts RISC-V the Open-Standard RISC-V Architecture; Achievement Aligns with Rising Global Demand for Edge-AI and Machine Learning Applications (Sept. 13, 2024)
- The Funding Gap in Green Technology: A Barrier to Progress (Sept. 13, 2024)
- Imagination Announces Highest Performance Automotive GPU IP with FuSa Advancement (Sept. 12, 2024)
- Samsung's 2nm Yield Rate at Most 20%, Withdraws Personnel from Texas Taylor Plant (Sept. 12, 2024)
- Axiomise launches Essential Introduction to Practical Formal Verification Training (Sept. 12, 2024)
- intoPIX Launches Access Program for Titanium Viewer and Titanium Show Apps at IBC 2024 Amsterdam (Sep 12, 2024)
- Chevin Technology, Alpha-Data & Correct Designs collaborate to deliver fast and secure data offload for NASA-JPL's Airborne Visible/Infrared Imaging Spectrometer-3 (AVIRIS-3) (Sep 12, 2024)
- Rivos Selects Andes NX45 for Control Functions in Upcoming High-Performance RISC-V SoC (Sep 11, 2024)
- Sondrel appoints new Head of Projects (Sep 11, 2024)
- Logic Fruit Launches the Advanced Kritin iXD 6U VPX Single Board Computer (SBC) (Sep 11, 2024)
- China wants to challenge the U.S. in AI – here's what Chinese giants are doing with the tech (Sept. 11, 2024)
- Bluetooth 6.0 Channel Sounding is Here (Sept. 11, 2024)
- Xiphera Develops Quantum-Resilient Hardware Security Solutions for Space (Sep 10, 2024)
- Faraday Unveils Advanced Packaging Coordinated Platform for Multi-source Chiplets (Sep 10, 2024)
- Sondrel announces Advanced Modelling Process for AI chip designs (Sep 10, 2024)
- TSMC August 2024 Revenue Report (Sep 10, 2024)
- Rambus Announces Industry-First HBM4 Controller IP to Accelerate Next-Generation AI Workloads (Sep 10, 2024)
- intoPIX and BCnexxt Join Forces to Revolutionize Live Playout with JPEG XS Technology (Sep 10, 2024)
- BrainChip Identifies Advantages to Radar and Lidar Systems Leveraging Event-Based AI (Sep 10, 2024)
- Synopsys Powers World's Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps (Sep 10, 2024)
- EXTOLL collaborates with PsiQuantum as a Key Partner for High-Speed SerDes IP (Sep 10, 2024)
- ZeroPoint Technologies Releases New Hardware-Accelerated Memory Optimization Solutions and Receives Industry Recognition for Innovation (Sep 10, 2024)
- Arteris Interconnect IP Selected by VeriSilicon for High-Performance SoC Design (Sept. 10, 2024)
- Intel Architects Start RISC-V Business with AheadComputing (Sept. 10, 2024)
- Qualitas Semiconductor Enters into Landmark the World's 1st 2nm MIPI DCPHY Licensing Agreement with Leading U.S. Fabless Company (Sep 09, 2024)
- Semidynamics on major recruitment drive for RISC-V software engineers (Sept. 09, 2024)
- T2M IP Unveils Advanced H.264 and H.265 HEVC Codec IP Cores for High-Efficiency Video Solutions (Sept. 09, 2024)
- SMIC cuts capex and R&D (Sept. 09, 2024)
- Alphawave Semi "Redefines Connectivity" in AI Hardware and Edge AI Summit 2024 Presentation on Chiplet Interconnects (Sept. 09, 2024)
- Tenstorrent and Movellus Form Strategic Engagement for Next-Generation Chiplet-Based AI and HPC Solutions (Sept. 09, 2024)
- Lack of Fresh Money Threatens Green Tech Sector (Sept. 09, 2024)
- Advancing AI the Brazilian Way: Fostering Innovation Through Collaboration and Open Standards (Sept. 09, 2024)
- Inspired by neurons: Neuromorphic hardware and the future of chip design (Sept. 09, 2024)
- Samsung Partners with TSMC, Its Foundry Rival, on HBM4 Development (Sept. 06, 2024)
- Adani Group partners Israel's Tower Semiconductor to build $10 billion chip plant in India: All details (Sept. 06, 2024)
- U.S. seeking export controls on quantum computing; limited impact expected for S. Korean firms (Sept. 06, 2024)
- China's DRAM Expansion Raises Concerns, Potentially Impacting Samsung and SK hynix Profits (Sept. 06, 2024)
- Qualcomm Rumored to Consider Acquiring Parts of Intel's Chip Design Business, with a Focus on PC Segment (Sept. 06, 2024)
- En route towards the first German quantum computer (Sept. 05, 2024)
- GUC Monthly Sales Report - August 2024 (Sept. 05, 2024)
- UMC Reports Sales for August 2024 (Sept. 05, 2024)
- CAST Ships I2C/SPI Controller IP Core for Easier Serial Communication (Sept. 05, 2024)
- Q2 2024 Global Semiconductor Equipment Billings Increased 4% Year-Over-Year, SEMI Reports (Sept. 05, 2024)
- Quebec's AI hub drives semiconductor research and development (Sept. 05, 2024)
- Two Indian startups showcase innovations at Semicon Taiwan 2024 (Sept. 05, 2024)
- SiliconAuto adopts Siemens' PAVE360 to accelerate pre-silicon ADAS SoC development (Sept. 04, 2024)
- Global Semiconductor Sales Increase 18.7% Year-to-Year in July (Sept. 04, 2024)
- RISC-V Builds the Backbone of Three New Consumer Devices (Sept. 04, 2024)
- Blue Cheetah Collaborates with LG to Demonstrate Successful Silicon Bring-Up of Chiplet-Based Design (Sept. 03, 2024)
- CoreHW and Presto Engineering Announce Ground-breaking Collaboration to Advance Global Penetration of Ultra-low-power RF IoT Devices (Sept. 03, 2024)
- EnSilica announces first production order for industrial ASIC (Sept. 03, 2024)
- We are speaking, British Embassy, Paris, 3 October 2024 by PQShield (Sept. 03, 2024)
- Europe's semiconductor sector calls for immediate 'Chips Act 2.0' (Sept. 03, 2024)
- Samsung and TSMC Unlikely to Be Buyers for Intel's Rumored Foundry Business Sale (Sept. 03, 2024)
- Advanced USB 3.0 IP in 22nm boasting a very low power ULP and ULL Technology Licensed to Over 10 Global Customers (Sep 02, 2024)
- SiFive and Arkmicro Accelerate RISC-V Adoption in Automotive Electronics with SiFive's Automotive IP for the High-end SoC Market (Sep 02, 2024)
- DeepX Hints At Next-Gen AI Chips (Sep 02, 2024)
- Urgent Orders Boost Wafer Foundry Utilization in Q2; Global Top 10 Foundry Revenue Grows 9.6% while VIS Climbs Two Spots, Says TrendForce (Sep 02, 2024)
- Intel considers foundry split, fab cancellations (Sept. 02, 2024)
- OpenAI joins Apple in securing TSMC's A16 Angstrom process for in-house AI chip (Sept. 02, 2024)
- STMicroelectronics joins Quintauris to boost RISC-V adoption (Sept. 02, 2024)
- Thalia joins Siemens digital twin marketplace for automotive (Sept. 02, 2024)
- Intel and Cadence Collaborate to Advance the All-Important UCIe Standard (Sept. 02, 2024)
- Efficient Computer signs an agreement with GlobalFoundries to build MRAM chips on the GF 22FDX process (Sept. 01, 2024)
- Will Intel split itself up after all? (Aug. 30, 2024)
- Technology combinations for complex chip (Aug. 30, 2024)
- Siemens brings industry leading Capital electrical and electronic systems design software to the cloud as a service (Aug. 30, 2024)
- Resiltech and Andes Technology Announce Collaboration to Deliver Advanced STL Solutions for Andes Automotive-Grade RISC-V Processor IP (Aug. 29, 2024)
- Arasan Announces immediate availability of its I3C Host / Device Dual Role Controller IP (Aug. 29, 2024)
- Samsung and TSMC competing to dominate 2nd-gen 3nm at global foundry industry (Aug. 29, 2024)
- Efficient and GlobalFoundries Partner to Enable a New Category of Ultra Energy-Efficient, High-Performance Processors (Aug. 29, 2024)
- Lip-Bu Tan quit Intel board after "differences" with CEO, says Reuters (Aug 29, 2024)
- Finwave Semiconductor and GlobalFoundries Partner on RF GaN-on-Si Technology for Cellular Handset Applications (Aug. 29, 2024)
- Xiphera Announces Quantum-Resistant Secure Boot (Aug. 28, 2024)
- PQShield and SiFive collaborate to advance post-quantum cryptography in RISC-V (Aug. 28, 2024)
- CEVA Wins Prestigious OFweek China Automotive Industry Award 2024 (Aug. 28, 2024)
- Accelerating AI with Essential Chips at GlobalFoundries Technology Summit 2024 (Aug. 28, 2024)
- SK Hynix to apply chiplet tech to memory controller (Aug. 28, 2024)
- Siemens joins Global Battery Alliance to accelerate sustainable battery development (Aug. 28, 2024)
- RISC-V Datacenter Future: SiFive P870-D Delivers Scalability (Aug. 28, 2024)
- F5 and Intel collaboration simplifies the security and delivery of AI services (Aug. 28, 2024)
- Dolphin Design announces partnership with Fraunhofer IIS to enhance power management in edge AI (Aug. 27, 2024)
- Crypto Quantique Unveils Open-Source Randomness Test Suite for Physical Unclonable Functions (Aug. 27, 2024)
- GigaDevice Semiconductor expands its Arm MCU product roadmap through Arm Total Access (Aug. 27, 2024)
- Kudelski IoT Security IP Audit Provides High Level of Confidence for Semiconductor Manufacturers Seeking Common Criteria Certification (Aug. 27, 2024)
- Intel pursues successes in the 18A manufacturing process (Aug. 27, 2024)
- Samsung's Foundry Strategy Focuses on AI/HPC Growth and Enhanced 2nm Process Amid TSMC's Dominance (Aug. 27, 2024)
- Strategies to Dominate the AI Accelerator Market (Aug. 27, 2024)
- Senior Intel CPU architects splinter to develop RISC-V processors - veterans establish AheadComputing (Aug. 25, 2024)
- Everspin Awarded $14.55M to Provide Continued, Stable On-Shore MRAM Manufacturing (Aug. 22, 2024)
- PQSecure Joins the Post-Quantum Cryptography Coalition (PQCC) (Aug. 22, 2024)
- Samsung's new 2 nm foundry process to cut chip size by 17% (Aug. 22, 2024)
- intoPIX Solutions Tackle the Biggest Challenges in Automotive Imaging at ADAS & Autonomous Vehicle Expo 2024 (Aug. 22, 2024)
- Synopsys Posts Financial Results for Third Quarter Fiscal Year 2024 (Aug. 22, 2024)
- JEDEC Releases New Standard for LPDDR5/5X Serial Presence Detect (SPD) Contents (Aug. 22, 2024)
- Cadence Launches Fem.AI, Pledges $20M to Kickstart Gender Equity in the AI Workforce (Aug. 22, 2024)
- Report says that promise of AI relies on scaling security as edge AI booms (Aug. 22, 2024)
- Siemens recognized as a leader in building decarbonization consulting (Aug. 22, 2024)
- ESMC Breaks Ground on Dresden Fab (Aug. 21, 2024)
- New RISC-V Innovations Lead AI to Open Standard (Aug. 21, 2024)
- Industrial Maintenance: How AI Can Predict Failures Before They Happen (Aug. 21, 2024)
- Going Beyond Ethernet: Securing Automotive Networks with MACsec (Aug. 21, 2024)
- European Commission permits 'first-of-its-kind' microchip manufacturing plant (Aug. 21, 2024)
- Chip design software firm Synopsys delivers record revenue as AI accelerates demand (Aug. 21, 2024)
- ADC IP - 14-Bit, 4.32 GSps Silicon-Proven: Now Available for Whitebox Licensing with No Royalty (Aug. 20, 2024)
- Axiomise Showcases Value of Formal Verification at DVCon Japan and DVCon India (Aug. 20, 2024)
- Global Foundry Industry's Revenue Rises on AI Demand (Aug. 20, 2024)
- Silvaco's Fab Technology Co-Optimization (FTCO): From Atoms to Systems (Aug. 20, 2024)
- SEALSQ introduces new RISC-V secure hardware platform for IoT security (Aug. 20, 2024)
- EU Ecodesign Regulation for the adhesives and sealants industry: key role for circular economy and electronics recycling (Aug. 20, 2024)
- Polish startup secures funding to enhance speech with AI (Aug. 20, 2024)
- Everspin Announces a $9.25M Contract to Provide MRAM Technology for Strategic Radiation Hardened eMRAM Macro (Aug. 19, 2024)
- Intel sells Arm shares (Aug. 19, 2024)
- Everspin Announces Contract to Provide MRAM Technology for Strategic Radiation Hardened FPGA (Aug 19, 2024)
- SignatureIP Networks-on-Chips (NoCs) to Accelerate RISC-V Designs (Aug. 19, 2024)
- Global Semiconductor Manufacturing Industry Strengthens in Q2 2024, SEMI Reports (Aug. 19, 2024)
- SEALSQ Introduces QS7001, a Newly Developed Cutting-Edge RISC-V Secure Hardware Platform, Specifically Designed for IoT security in the Post-Quantum Era (Aug. 19, 2024)
- How Innovative Is China in Semiconductors? (Aug. 19, 2024)
- Samsung Foundry to Manufacture 5nm AI Chips for DeepX (Aug. 18, 2024)
- US Finalises Its V2X Plan with 5G (Aug. 18, 2024)
- First Post-Quantum Cryptography Standards Announced (Aug. 17, 2024)
- How Synopsys IP and TSMC's N12E Process Are Driving AIoT (Aug. 16, 2024)
- Ferroelectric RAM looking rusty and stuck (Aug. 16, 2024)
- European RISC-V firms support SignatureIP NoC Networks-on-Chip (Aug. 15, 2024)
- Welcome to Silicon-to-Systems Space (Where No One Can Hear You Scream) (Aug. 15, 2024)
- AutoChips integrated multiple VeriSilicon's IPs in its intelligent cockpit domain control SoC (Aug 14, 2024)
- NIST Releases First 3 Finalized Post-Quantum Encryption Standards (Aug 14, 2024)
- Movellus Joins the Silicon Catalyst In-Kind Partner Ecosystem (Aug 14, 2024)
- CEO interview: Coby Hanoch, Weebit Nano on ReRAM for AI (Aug 14, 2024)
- SiFive Announces New High-performance RISC-V Datacenter Processor for Demanding AI Workloads (Aug 14, 2024)
- Xiphera's xQlave® Product Family Enables Full Compliance with Finalised NIST PQC Standards (Aug 14, 2024)
- Huawei Rumored to Launch New High-End AI Chip, Potentially Rivaling NVIDIAs H100 (Aug. 14, 2024)
- First third-party ISO/SAE 21434-certified IP product for automotive cybersecurity (Aug. 14, 2024)
- Draper Aims to Provide DoD Advanced Chips by 2027 (Aug. 14, 2024)
- Intel Has Offloaded Stake in ARM, Reportedly Raising nearly USD 150 Million (Aug. 14, 2024)
- Chiplet interconnect pioneer Eliyan gains additional financial backing from AI chip ecosystem with strategic investment from VentureTech Alliance (Aug 13, 2024)
- Ceva Expands its Market Share Leadership in Wireless Connectivity IP, Strengthening its Solutions for Smart Edge AI/IoT applications (Aug 13, 2024)
- OPENEDGES Unveils UCIe Chiplet Controller IP, Expanding Design Portfolio (Aug. 13, 2024)
- Akeana™ exits stealth mode with comprehensive RISC-V processor portfolio, challenging the semiconductor industry status quo (Aug 13, 2024)
- Akeana™ exits stealth mode with comprehensive RISC-V processor portfolio, challenging the semiconductor industry status quo (Aug 13, 2024)
- Intel 18A Advanced Packaging is Key to Tech Leadership (Aug. 13, 2024)
- Efinix Topaz RISC-V SoC FPGA Family for High Volume and Mass Market Applications (Aug. 13, 2024)
- Qualitas Semiconductor Expands Licensing Agreement with Key South Korean Fabless company (Aug 12, 2024)
- 16-Bit, 5MSPS SAR ADC IP Core Silicon-Proven: Delivers Superior Dynamic Performance with Flexible Resolution Modes for Next-Generation Applications (Aug 12, 2024)
- TSMC's Expansion beyond 2nm Taking Shape? Angstrom-Class Fabs Possibly in Southern Taiwan (Aug. 12, 2024)
- Secure-IC signs International Collaboration with Taiwan Quantum Safe Association and PQC-CIA (Aug 12, 2024)
- Rupert Baines joins Nanusens board (Aug 12, 2024)
- SMIC Reports 2024 Second Quarter Results (Aug 12, 2024)
- Fraunhofer IPMS remains important research partner for GlobalFoundries Dresden (Aug 12, 2024)
- TSMC July 2024 Revenue Report (Aug 12, 2024)
- AMD Completes Acquisition of Silo AI to Accelerate Development and Deployment of AI Models on AMD Hardware (Aug 12, 2024)
- Linux Foundation Welcomes the Open Model Initiative to Promote Openly Licensed AI Models (Aug 12, 2024)
- Agnisys Joins Arm Partner Program and Releases Solution Brief for Functionally Safe Arm-Based SoC Design (Aug 12, 2024)
- Rapidus to Fully Automate 2nm Fab, Claiming Chip Delivery Times at One-Third of Its Competitors (Aug. 12, 2024)
- Synopsys's Plans to Buy Ansys for $35B Falls on UK Regulatory Radar (Aug. 12, 2024)
- EU project joins forces towards the era of scalable control technology for quantum processors (Aug. 12, 2024)
- Korea's Memory Exports to Taiwan Surge 225% in 1H 2024 Driven by Strong HBM Demand (Aug. 11, 2024)
- Simplifying AI Deployment from the Cloud to Edge and Endpoint (Aug. 08, 2024)
- Scaling sustainability impact (Aug. 08, 2024)
- The Uberization of Engineering (Aug. 08, 2024)
- Raspberry Pi Launch New RP2350 Microcontroller and Pico 2 Development Board with RISC-V Support (Aug. 08, 2024)
- NVM Express Releases NVM Express Specifications to Unify AI, Cloud, Client, and Enterprise Storage (Aug. 07, 2024)
- Imec demonstrates logic and DRAM structures using High NA EUV Lithography (Aug. 07, 2024)
- QuickLogic Announces Partnership with CTG to Strengthen Aerospace & Defense Supply Chain (Aug. 07, 2024)
- Ceva, Inc. Announces Second Quarter 2024 Financial Results (Aug 07, 2024)
- ZeroPoint Technologies introduces zstd Decompression Hardware IP (Aug 07, 2024)
- UMC Reports Sales for July 2024 (Aug 07, 2024)
- Why Transceiver-Rich FPGAs Are Suitable for Vehicle Infotainment System Designs (Aug. 07, 2024)
- Femtosense Combines AI Chiplet with MCU for Audio SiP (Aug. 07, 2024)
- Intel Foundry Achieves Major Milestones (Aug. 06, 2024)
- NVM Express Releases NVM Express Specifications to Unify AI, Cloud, Client, and Enterprise Storage (Aug. 06, 2024)
- Samsung Electronics Begins Mass Production of Industry's Thinnest LPDDR5X DRAM Packages for On-Device AI (Aug. 06, 2024)
- AI, 3D printing, electrification drive automotive supply chain (Aug. 06, 2024)
- Silvaco To Present at the Rosenblatt 4th Annual Technology Summit (Aug. 06, 2024)
- Consult Red Announces Strategic Partnership with CAST, Inc. (Aug. 06, 2024)
- T2M-IP Unveils MIPI D-PHY v2.5 Tx and DSI Tx Controller v1.2: Silicon-Proven, Low-Power, Cost-Effective IP Core Solutions for Advanced SoCs (Aug. 05, 2024)
- Crypto Quantique appoints ITEC to sell its IoT device security technology in Israel (Aug. 05, 2024)
- GUC Monthly Sales Report - July 2024 (Aug. 05, 2024)
- Alphawave Semi Appoints Chief Accounting Officer, Sameer Ladiwala (Aug. 05, 2024)
- Arteris Announces Financial Results for the Second Quarter 2024 and Third Quarter and Full Year 2024 Guidance (Aug. 05, 2024)
- Worldwide Silicon Wafer Shipments Increase 7% in Q2 2024, SEMI Reports (Aug. 05, 2024)
- NEO Semiconductor Announces the Development of its 3D X-AI Chip; Targeted to Replace Existing HBM Chips and Solve Data Bus Bottlenecks (Aug 05, 2024)
- Global Semiconductor Sales Increase 18.3% in Q2 2024 Compared to Q2 2023; Quarter-to-Quarter Sales Up 6.5% (Aug. 05, 2024)
- Imec: Getting High-Precision Sensors to Market (Aug. 05, 2024)
- ZeroPoint Technologies introduces LZ4 Compression and Decompression Hardware IP (Aug. 05, 2024)
- DDR5 Gains Enhanced Security, Reliability, and Power Management Features (Aug. 02, 2024)
- Intel once again confirms future Intel 10A node, Intel 14A process progresses smoothly (Aug. 02, 2024)
- Scaling sustainability impact (Aug. 01, 2024)
- M31 cooperates with Tower Semiconductor to develop advanced SRAM and ROM solutions for its 65nm Power Management Platform (Aug. 01, 2024)
- Renesas Completes Acquisition of Altium (Aug. 01, 2024)
- Arm's calendar Q2 revenues up 39% y-o-y (Aug. 01, 2024)
- Chip index collapses 7% as Arm punctures AI optimism (Aug. 01, 2024)
- HCLTech recognized as Microsoft Partner of the Year for Dynamics 365 Service (Aug. 01, 2024)
- FuriosaAI and GUC Partner on RNGD, the Most Efficient AI Accelerator for LLMs (Jul. 31, 2024)
- Weebit Nano moves closer to availability at DB HiTek; tapes out first chip (Jul. 31, 2024)
- Sondrel's SFA 100 is ideal for AI at the Edge (Jul. 31, 2024)
- Weebit Nano and DB HiTek tape-out ReRAM module in DB HiTek's 130nm BCD process (Jul. 31, 2024)
- QuickLogic Signs Distribution Agreement with Astute Electronics to Expand Global Reach (Jul. 31, 2024)
- Samsung Sees Solid Demand for 3nm in 2H24, Aiming a Ninefold Increase in AI/HPC Sales by 2028 (Jul. 31, 2024)
- Europe launches 'AI Factories' (Jul. 31, 2024)
- Samsung set to ship HBM3E chips in H2 after strong H1 (Jul. 31, 2024)
- Alphawave Semi Launches Industry's First 3nm UCIe IP with TSMC CoWoS Packaging (Jul. 30, 2024)
- Faraday Reports Second Quarter 2024 Results (Jul. 30, 2024)
- Rambus Reports Second Quarter 2024 Financial Results (Jul. 30, 2024)
- Rambus Expands Industry-Leading Memory Interface Chip Offering to High-Performance PCs with DDR5 Client Clock Driver (Jul. 30, 2024)
- BAE Systems Partners with Siemens for Industry 4.0 Revolution (Jul. 30, 2024)
- Silicon-Proven 14-Bit 4.32 GSps Wide Band ADC IP Core with Time-Interleaved Pipeline Architecture Now Available for Whitebox Licensing with No Royalty Fees (Jul 29, 2024)
- Release of Post-Quantum Cryptographic Standards Is Imminent (Jul. 29, 2024)
- Raaam signs lead licensee for SRAM replacement technology (Jul. 29, 2024)
- Weebit Nano to present test results of ReRAM performance on GlobalFoundries 22FDX® wafers at FMS 2024 (Jul. 29, 2024)
- RAAAM Memory Technologies Secures 5.25M€ from the European Innovation Council for its Groundbreaking On-Chip Memory Solution (Jul. 29, 2024)
- Tessolve partners with SigmaSense to develop their innovative DSP-based sensing ASIC (Jul. 29, 2024)
- It is reported that TSMC's A14 process will be put into risk trial production in the first half of 2026 (Jul. 29, 2024)
- DDR5 Gets More Security, Power Management Features (Jul. 26, 2024)
- Fractile raises $15m seed funding to develop radical new AI chip and unlock exponential performance improvements from frontier AI models (Jul 26, 2024)
- Leveraging Safety Processor Expertise to Develop RISC-V Based Automotive Implementations (Jul. 26, 2024)
- HCLTech launches Enterprise AI Foundry on Microsoft Azure (Jul. 26, 2024)
- Ian Walsh appointed as Sondrel's Regional VP for America (Jul. 25, 2024)
- Agile Analog delivers customizable IP on GlobalFoundries' FinFet and FDX processes (Jul. 25, 2024)
- The transformational impact of AI (Jul. 25, 2024)
- Conference on Battery Direct Recycling 2024 (Jul. 25, 2024)
- Systems Designed Today Must Support Post-Quantum Cryptography Tomorrow (Jul. 25, 2024)
- Ceva Bluetooth Low Energy and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor's Balletto Family of MCUs (Jul. 25, 2024)
- Sustainability vs. Progress: The Tightrope Walk of AI Chip Manufacturing (Jul. 25, 2024)
- Comcores supports BAE systems as a key partner with JESD204C IP (Jul. 24, 2024)
- Alphawave Semi: Q2 2024 Trading and Business Update (Jul. 24, 2024)
- Efinix Releases Topaz Line of FPGAs, Delivering High Performance and Low Power to Mass Market Applications (Jul. 24, 2024)
- Imagination Technologies announces new capital investment from Fortress Investment Group (Jul. 24, 2024)
- Imec achieves record-low charge noise for Si MOS quantum dots fabricated on a 300mm CMOS platform (Jul. 24, 2024)
- Experts urge EU to increase investment in photonics (Jul. 24, 2024)
- Alphawave IP Q2 revenues up 98% y-o-y (Jul. 24, 2024)
- Faraday Adds Video Interface IP to Support All Advanced Planar Nodes on UMC Platform (Jul. 23, 2024)
- Infineon and Amkor Sign MoU to Boost Supply Chain Sustainability (Jul. 23, 2024)
- China's EDA startup X-Epic forced to lay off staff, says report (Jul 22, 2024)
- Source Photonics Licenses 800G Transceiver Module Designs from Intel (Jul 22, 2024)
- Samsung Slows Opening of Texas Fab Despite CHIPS Stimulus (Jul 22, 2024)
- JEDEC Unveils Plans for DDR5 MRDIMM and LPDDR6 CAMM Standards to Propel High-Performance Computing and AI (Jul. 22, 2024)
- U.S.-China Tech War Likely to Escalate, Analysts Say (Jul 22, 2024)
- TSMC Reports Second Quarter EPS of NT$9.56 (Jul 22, 2024)
- MIPI C-D Combo PHY and DSI Controller IP Cores, Silicon Proven, Immediate licensing at a Competitive Price for Your Next Project (Jul 22, 2024)
- Tenstorrent launches new Wormhole high-performance AI chip using RISC-V architecture (Jul. 21, 2024)
- RISC-V Shows Ambitious Prospects in Europe (Jul 19, 2024)
- Tata Technologies partners with Arm to drive innovation in software-defined vehicles (SDVs) (Jul 19, 2024)
- ARM SoC with GPU for space AI (Jul. 19, 2024)
- Who Leads the Semiconductor Foundry Market? (Jul. 19, 2024)
- CXL Fulfills AI's Need for Open Industry Standard Interconnect (Jul. 18, 2024)
- John Chubb becomes Sondrel's CEO (Jul. 18, 2024)
- TSMC Introduces "Foundry 2.0" to Include Packaging, Testing, Mask making and Others (Jul. 18, 2024)
- EU and South Korea announce winners of four co-funded semiconductor projects (Jul. 18, 2024)
- Resilient and Sustainable Supply of Functionally Reliable Materials: Fraunhofer Develops Digital Ecosystem (Jul. 18, 2024)
- Quadric's 3rd Generation Chimera GPNPU Product Family Expands to 864 TOPs, Adds Automotive-Grade Safety Enhanced Versions (Jul. 17, 2024)
- Synopsys Advances Automotive Security with Industry's First IP Product to Achieve Third-Party Certification for ISO/SAE 21434 Cybersecurity Compliance (Jul. 17, 2024)
- RISC-V power controller adds flash memory (Jul. 17, 2024)
- HCLTech wins Equinix Social Governance Award for Asia Pacific (Jul. 17, 2024)
- GlobalWafers gets $400m Chips Act subsidy (Jul. 17, 2024)
- Canada Steps Up Semiconductor Investment (Jul. 17, 2024)
- Crypto Quantique partners with silicon IP distributors across Asia to deliver quantum-driven chip security (Jul. 16, 2024)
- Electronic System Design Industry Posts $4.5 Billion in Revenue in Q1 2024, ESD Alliance Reports (PRNewsfoto/SEMI) (Jul. 16, 2024)
- Qualitas Semiconductor Announces First Domestic Development of PCIe 6.0 PHY IP (Jul. 16, 2024)
- Allegro DVT Launches The Industry's First Real-Time VVC/H.266 Encoder IP (Jul. 16, 2024)
- Expedera Achieves ISO 26262 ASIL-B Automotive Safety Certification (Jul. 16, 2024)
- Navigating the RISC-V Ecosystem (Jul. 16, 2024)
- Samsung Completes Validation of Industry's Fastest LPDDR5X for Use with MediaTek's Flagship Mobile Platform (Jul. 16, 2024)
- Advanced MIPI DSI Tx & Rx Controller IP Cores: Low-Power, Cost-Effective Solutions for Modern Display SoCs (Jul. 15, 2024)
- OPENEDGES Successfully Validated Its 7nm HBM3 Testchip (Jul. 15, 2024)
- L&T Semiconductor to acquire chip design company SiliConch (Jul. 15, 2024)
- L&T Semiconductor Technologies Partners with CP Plus to develop Semiconductor Chips for CCTV Camera Solutions (Jul. 15, 2024)
- Samsung to mass-produce HBM4 on 4 nm foundry process (Jul. 15, 2024)
- AI-driven SRAM demand needs integrated repair and security (Jul. 15, 2024)
- SiFive Becomes First IP Supplier to Achieve Automotive ISO/SAE 21434:2021 Product Certification (Jul. 12, 2024)
- SEALSQ RISC-V Semiconductors is Pioneering Sustainability Through Decentralized Processing (Jul. 12, 2024)
- Graphcore joins SoftBank Group to build next generation of AI compute (Jul. 12, 2024)
- HCLTech delivers another solid quarter with revenue growth of 5.6% YoY (CC) (Jul. 12, 2024)
- Can Softbank Be An AI Supercomputer Player? Will Arm Lend A Hand? (Jul. 12, 2024)
- Alphawave Semi to form South Korean office (Jul. 12, 2024)
- Samsung Electronics To Provide Turnkey Semiconductor Solutions With 2nm GAA process and 2.5D Package to Preferred Networks (Jul. 11, 2024)
- TSMC June 2024 Revenue Report (Jul. 11, 2024)
- STMicroelectronics Integrates Ceva Cellular IoT Platform in its NB-IoT Industrial Module (Jul. 11, 2024)
- HBM4 memory standard is almost ready, according to JEDEC (Jul. 11, 2024)
- Keysight Joins the AI-RAN Alliance to Advance AI Innovations in Mobile Networks (Jul. 11, 2024)
- From wireless communication specialist to system provider (Jul. 11, 2024)
- RISC-V Thrives Through Research, International Collaboration (Jul. 10, 2024)
- New MIPI SDCA Specification Simplifies Audio Software Architecture and Driver Requirements, Optimizing Integration of Audio Devices into Open Host Platforms (Jul. 10, 2024)
- JEDEC Approaches Finalization of HBM4 Standard, Eyes Future Innovations (Jul. 10, 2024)
- Pusan National University proposes backscatter comms for low-power IoT (Jul. 10, 2024)
- Generative AI is Set To Be Adopted By 85% Of The Software Workforce Over The Next Two Years (Jul. 10, 2024)
- SiliconIntervention announces an innovative Fractal-D Audio Amplifier Family (Jul. 09, 2024)
- Siemens advances integrated circuit test and analysis at 5nm and below (Jul. 09, 2024)
- Microchip Technology Expands Processing Portfolio to Include Multi-Core 64-bit Microprocessors (Jul. 09, 2024)
- MIPI C-PHY / D-PHY Combo IP (4.5Gbps) and CSI Tx Controller IP Cores, to meet the highest standards of performance and reliability for a wide range of applications (Jul. 09, 2024)
- Samsung Electronics To Provide Turnkey Semiconductor Solutions With 2nm GAA Process and 2.5D Package to Preferred Networks (Jul. 09, 2024)
- Sustainable and intelligent infrastructure in Zermatt (Jul. 09, 2024)
- Imec's Virtual Fab Strives for More Sustainable Chip Production (Jul. 09, 2024)
- Japan's semiconductor revival (Jul. 09, 2024)
- Tiny titans: Unveiling the power of 2nm and 1nm chips (Jul. 09, 2024)
- Imecs Virtual Fab Strives for More Sustainable Chip Production (Jul. 09, 2024)
- Global Semiconductor Sales Increase 19.3% Year-to-Year in May (Jul. 08, 2024)
- GUC Monthly Sales Report - June 2024 (Jul. 08, 2024)
- Addressing AI While Keeping the MIPSiness In MIPS (Jul. 08, 2024)
- JEDEC® Announces Publication of Compute Express Link® (CXL®) Support Standards (Jul. 08, 2024)
- Vybium, develops European AI/ML accelerators based on the Stream Computing NPU IP (Jul. 08, 2024)
- QuickLogic Announces $5.26 Million Contract Award (Jul. 08, 2024)
- HCLTech sweeps top honors in the Institutional Investor Research Annual Asia Executive Team survey (Jul. 05, 2024)
- UMC Reports Sales for June 2024 (Jul. 04, 2024)
- METASAT Project Celebrates 18 Months of Innovation: Key Developments in Satellite Technology (Jul. 04, 2024)
- TSMC Reportedly Secures 3nm Order After Tapeout for Google's Tensor G5 (Jul. 04, 2024)
- EU project to develop advanced navigation for satellites (Jul. 04, 2024)
- How RISC-V is changing the server market (Jul. 04, 2024)
- Quantum communication : How will 'quantum-secure' communication technologies develop in future? (Jul. 04, 2024)
- eMemory's Security-Enhanced OTP Qualifies on TSMC N5A Process Specializing in High-Performance Automotive Chips (Jul. 03, 2024)
- YorChip predicts 2026 will be the year of the chiplet (Jul. 03, 2024)
- How AI impacts the qualification of safety-critical automotive software (Jul. 03, 2024)
- Siemens and Boson Energy enter agreement to accelerate the green energy transition through waste-to-hydrogen (to-X) technology (Jul. 03, 2024)
- Google Shifts Foundry Partnership from Samsung to TSMC for Tensor G5 Chip (Jul. 03, 2024)
- New European Semiconductor Company, Vybium, develops European AI/ML accelerators based on the Stream Computing NPU IP (Jul. 03, 2024)
- Introducing Next-Generation Security IPs: Unmatched Protection with EEC, AES, SHA-2, CRP1A, and ECDSA (Jul. 02, 2024)
- Mixel Announces Immediate Availability of MIPI C-PHY/D-PHY Combo IP on STMicroelectronics 40LP Process Technology (Jul. 02, 2024)
- Tiempo Secure and Menta announce strategic partnership to enhance security solutions (Jul. 02, 2024)
- Flex Logix Boosts AI Accelerator Performance and Long-Term Efficiency (Jul. 02, 2024)
- C-DAC partners with MosChip and Socionext for design of HPC Processor AUM based on Arm architecture (Jul. 02, 2024)
- Renesas and Altium Announce the Conclusion of the Regulatory Review for Renesas' Proposed Acquisition of Altium (Jul. 02, 2024)
- GlobalFoundries acquires Tagore Technology's GaN technology (Jul. 02, 2024)
- Creating a Center of Excellence for IC Design (Jul. 01, 2024)
- CEO Interview: Sameer Wasson of MIPS -- "Have a Steady Hand, Don't be Distracted" (Jul 01, 2024)
- Arteris Joins Russell 2000® Index (Jul. 01, 2024)
- Building Intel's Foundry Ecosystem for the AI Era (Jul. 01, 2024)
- Arteris Joins Russell 2000® Index (Jul. 01, 2024)
- Altair Signs Agreement to Acquire Metrics Design Automation Inc. Expands Footprint in EDA Industry (Jul. 01, 2024)
- EDA Companies Unite With Samsung for AI and 3D IC Technology (Jun. 30, 2024)
- RISC-V Summit Europe News - Processor IP, Verification Tools, and More (Jun. 28, 2024)
- STMicroelectronics restructures for the AI age (Jun. 28, 2024)
- Faraday Joins Intel Foundry Accelerator Design Services Alliance to Target Advanced Applications (Jun. 27, 2024)
- Frontgrade Gaisler Awarded ESA Contract to Qualify Spacecraft Avionics Microcontroller for Flight (Jun. 27, 2024)
- All systems go for 7nm FDSOI (Jun. 27, 2024)
- Rambus offers DDR5 server PMICs to address AI workloads (Jun. 27, 2024)
- Axelera AI raises $68m for data centre push (Jun. 27, 2024)
- Crafting a Silicon Lifecycle Management Strategy for HPC and Data Centers (Jun. 27, 2024)
- New leap in Belgian quantum communication infrastructure: imec, UGent and Belnet realize first QKD links (Jun. 27, 2024)
- FortifyIQ Introduces FortiPKA-RISC-V: A Breakthrough in Public Key Cryptography Acceleration (Jun. 26, 2024)
- Tenstorrent To Offer AI Workstation For Developers (Jun. 26, 2024)
- Cadence Expands System IP Portfolio with Network on Chip to Optimize Electronic System Connectivity (Jun. 26, 2024)
- M31 Debuts at the North American Design Automation Conference, Showcasing IP Solutions for Advanced Processes (Jun. 26, 2024)
- Lattice Introduces New Secure Control FPGA Family with Advanced Crypto-Agility and Hardware Root of Trust (Jun. 26, 2024)
- Semidynamics releases Tensor Unit efficiency data for its new All-In-One AI IP (Jun 25, 2024)
- Siemens delivers a major leap toward mainstream 3D-IC adoption with new Calibre 3DThermal (Jun 25, 2024)
- CEA-Leti Announces Launch of FAMES Pilot Line As Part of EU Chips Act Initiative (Jun 25, 2024)
- Siemens introduces Innovator3D IC - a comprehensive multiphysics cockpit for 3D IC design, verification and manufacturing (Jun 25, 2024)
- Synopsys Accelerates Chip Innovation with Production-Ready Multi-Die Reference Flow for Intel Foundry (Jun 25, 2024)
- Siemens and Intel Foundry collaborate to deliver new tools certifications and EMIB/3D-IC innovation (Jun 25, 2024)
- Enosemi announces availability of C-band-compatible electronic-photonic design IP (Jun. 25, 2024)
- ESWIN Computing Pairs SiFive CPU, Imagination GPU and In House NPU in Latest RISC-V Edge Computing SoC (Jun. 25, 2024)
- Comcores Unveils Industry-First MAC Privacy Protection IP for Enhanced Ethernet Security (Jun. 25, 2024)
- SiFive Announces 4th Generation of Popular Essential Product Line to Spur Innovation Across Embedded Applications (Jun. 25, 2024)
- X-Silicon Introduces the World's First Vulkan Driver Implementation for RISC-V, Enabling an entire Ecosystem of 3D Graphics, AI and Compute for Low-Power, Mobile, Edge and IOT Devices (Jun. 25, 2024)
- Intel's Latest FinFET Is Key to Its Foundry Plans (Jun. 25, 2024)
- Europe invests 830 million euros to build FAMES FD-SOI pilot line to achieve 7nm with planar CMOS (Jun. 25, 2024)
- RISC-V in Space Workshop in Gothenburg on April 2-3, 2025! (Jun. 24, 2024)
- Figuring Out the Carbon Footprint of an Individual Chip (Jun. 24, 2024)
- True Circuits Introduces the JSPICE™ Design Environment (JDE™) at the Design Automation Conference (Jun. 24, 2024)
- Ventana CEO to Deliver a Keynote at RISC-V Summit Europe (Jun. 24, 2024)
- T2M-IP Announces Silicon-Proven MIPI D-PHY v2.5 Tx and DSI-2 Tx Controller Low-Power, Cost-Effective IP Cores Solutions for Advanced SoCs (Jun. 24, 2024)
- Flex Logix Celebrates 10 Years of Success and Innovation (Jun. 24, 2024)
- Ceva Extends its Smart Edge IP Leadership, Adding New TinyML Optimized NPUs for AIoT Devices to Enable Edge AI Everywhere (Jun. 24, 2024)
- Crypto Quantique, ZARIOT and Kigen unveil quantum-safe hardware root-of-trust for cellular IoT (Jun. 24, 2024)
- Semiwise, sureCore, and Cadence Showcase Breakthrough in Cryogenic CMOS Circuit Development for Quantum Computing and Energy-Efficient Data Centers (Jun. 24, 2024)
- Siemens delivers AI- accelerated verification for analog, mixed-signal, RF, memory, library IP and 3D IC designs in Solido Simulation Suite (Jun. 24, 2024)
- Baya Systems and Blue Cheetah Partner to Deliver Chiplet Interconnect Solutions (Jun. 24, 2024)
- SignatureIP Makes Network-on-Chip (NoC) Design Widely Accessible with Cloud-Based iNoCulator™ Platform (Jun 24, 2024)
- Can Semiconductor Chips be Recycled? (Jun. 24, 2024)
- Efabless Empowers 40 Commercial Companies to Design Chips (Jun. 24, 2024)
- Siemens gets certification for Solido SPICE on Intel nodes, and adds EMIB (Jun. 24, 2024)
- EDA vendors put Intel EMIB interconnect in design flows for 3D ICs (Jun. 24, 2024)
- Andes Technology Showcases Leadership in AI and Automotive Applications at RISC-V Summit Europe 2024 (Jun. 21, 2024)
- Baya Systems Introduces New Technology to Transform SoCs and Chiplets for Emerging Applications (Jun. 21, 2024)
- Tenstorrent Licenses Baya Systems' Fabric into next-generation AI and Compute Chiplet Solutions (Jun 21, 2024)
- Breker Verification Systems Readies RISC-V CoreAssurance and SoCReady SystemVIP for Automated, Certification-level RISC-V Verification Coverage (Jun. 20, 2024)
- PQShield raises $37m in Series B funding to deliver the widespread commercial adoption of quantum resistant cryptography (Jun. 20, 2024)
- System-level UCIe IP for early architecture analysis of 3D Chiplet Design and Packaging (Jun. 20, 2024)
- Primemas Selects Achronix Embedded FPGA Technology For System-on-Chip (SoC) Hub Chiplet Platform (Jun. 20, 2024)
- lowRISC and Microsoft Collaborate to Help Bring the Revolutionary CHERIoT-Ibex Core to Production Grade (Jun. 20, 2024)
- Alphawave Semi Unlocks 1.2 TBps Connectivity for High-Performance Compute and AI Infrastructure with 9.2 Gbps HBM3E Subsystem (Jun. 20, 2024)
- Dovetail Electric Aviation adopts Siemens Xcelerator to pioneer sustainable aviation (Jun. 20, 2024)
- OPENEDGES to Premiere PHY Vision 2.0 at Design Automation Conference 2024 (Jun. 19, 2024)
- Movellus Introduces Aeonic Power™ Product Family for On-Die Voltage Regulation (Jun. 19, 2024)
- Dream Chip and Cadence Demo Automotive SoC Featuring Tensilica AI IP at embedded world 2024 (Jun. 19, 2024)
- M31 Announces the Launch of Advanced LPDDR Memory IP to Support HPC Applications (Jun. 19, 2024)
- YorChip announces Low Latency 200G Chiplet for edge AI (Jun. 19, 2024)
- Alphawave Reveals Multiprotocol I/O Chiplet Tapeout, Collabs with Arm, Samsung (Jun. 19, 2024)
- Global partnership unveils quantum-safe hardware root-of-trust for cellular IoT (Jun. 19, 2024)
- Why do defects occur in battery production? Explainable AI supports process optimization. (Jun. 19, 2024)
- EU proposes budget cuts to tech programmes in 2025 (Jun. 19, 2024)
- Rapidus Set to Open 2-nm Pilot Fab, CEO Says (Jun. 19, 2024)
- Intel 3 '3nm-class' process technology is in high-volume production (Jun. 19, 2024)
- Slide Shows Samsung May be Developing a RISC-V CPU for In-memory AI Chip (Jun. 19, 2024)
- onsemi selects Czech Republic for SiC production for advanced power semiconductors (Jun. 19, 2024)
- Sequans Announces a New $15 Million Licensing Agreement (Jun. 18, 2024)
- Faraday to Exhibit Next-gen ASIC Solutions at DAC 2024 (Jun. 18, 2024)
- QuickLogic Joins Intel Foundry Accelerator IP and USMAG Alliance Programs (Jun. 18, 2024)
- Intel 3 Represents an Intel Foundry Milestone (Jun. 18, 2024)
- Samsung Foundry Struggles with Yield and Power Efficiency Issues (Jun. 18, 2024)
- Are We Prepared for Cyberthreats in The New Era of Transportation? (Jun. 18, 2024)
- EU is mandating Digital Product Passports (Jun. 17, 2024)
- Initial members join CHERI Alliance to drive adoption of memory safety and scalable software compartmentalization (Jun 17, 2024)
- Imec unveils CMOS-based 56Gb/s zero-IF D-band beamforming transmitter, featuring superior output power and energy efficiency (Jun. 17, 2024)
- Codasip Claims 'Best-in-Class' RISC-V Core for Power-Conscious Designs (Jun. 15, 2024)
- Japan to send 200 engineers to U.S. for AI chip training at Tenstorrent (Jun. 15, 2024)
- Synopsys Achieves Certification of its AI-driven Digital and Analog Flows and IP on Samsung Advanced SF2 GAA Process (Jun. 13, 2024)
- ADTechnology announces next-generation platform "ADP600" at Samsung Foundry Forum 2024 (Jun. 13, 2024)
- Sondrel secures major funding today (Jun. 13, 2024)
- Siemens collaborates with Samsung Foundry to expand 3D-IC enablement tools, optimize other EDA solutions for foundry's newest processes (Jun. 13, 2024)
- Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology (Jun. 13, 2024)
- Samsung Showcases AI-Era Vision and Latest Foundry Technologies at SFF 2024 (Jun. 13, 2024)
- Consortium led by Crosshill Oy signs defense technology development agreement for F-35 Program with Lockheed Martin (Jun. 13, 2024)
- Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for High-Performance Compute and AI Infrastructure (Jun. 13, 2024)
- Flow Computing Emerges from Stealth with Licensable, On-Die Parallel Processing Enabling 100X Improved Performance For Any CPU Architecture (Jun. 13, 2024)
- Axiomise Heads to RISC-V Summit Europe June 25-27 in Munich (Jun. 13, 2024)
- Cadence and Samsung Foundry Accelerate Chip Innovation for Advanced AI and 3D-IC Applications (Jun 13, 2024)
- SEMIFIVE joins Arm Total Design with plans to develop Arm Neoverse-powered HPC Platform (Jun. 12, 2024)
- Rambus Unveils PCIe 7.0 IP Portfolio for High-Performance Data Center and AI SoCs (Jun. 12, 2024)
- Alphawave Semi to Showcase Next-Generation PCIe® 7.0 IP Platform for High-Performance Connectivity and Compute at PCI-SIG® DevCon 2024 (Jun. 12, 2024)
- SureCore Balances Power and Cooling Costs With Cryogenic Memory (Jun. 12, 2024)
- Silvaco Announces Initiatives to Enhance Workforce Development in Semiconductor Industry (Jun. 12, 2024)
- SEMIFIVE Collaborates with OPENEDGES on Chiplet Development (Jun. 12, 2024)
- Arteris Selected by Esperanto Technologies to Integrate RISC-V Processors for High-Performance AI and Machine Learning Solutions (Jun 11, 2024)
- Alphawave Semi Expands Partnership with Samsung Foundry to Further Drive Innovation at Advanced Semiconductor Nodes (Jun 11, 2024)
- Siemens and KU Leuven collaborate to research Digital Twin for Smart and Sustainable Products (Jun. 11, 2024)
- OPENEDGES Announces Silicon-Proven Success of its LPDDR5X Combo PHY IP on Samsung Foundry's SF5A Technology (Jun 10, 2024)
- Introducing USB 3.0, PCIe 2.0 and SATA 3.0 Combo PHY IP Cores to empower Next Gen Connectivity Chipsets (Jun 10, 2024)
- intoPIX Launches Titanium at InfoComm, Boosting professional AV-over-IP Workflow Efficiency (Jun 10, 2024)
- Synopsys Accelerates Trillion Parameter HPC & AI Supercomputing Chip Designs with Industry's First PCIe 7.0 IP Solution (Jun 10, 2024)
- eXpreso eFPGA Compiler Achieves 98.6% Packing Density (Jun 10, 2024)
- Global Semiconductor Sales Increase 15.8% Year-to-Year in April; New Industry Forecast Projects Market Growth of 16.0% in 2024 (Jun 10, 2024)
- Sondrel offers leading edge chip design teams (Jun. 10, 2024)
- Andes Technology Announces the Annual ANDES RISC-V CON on June 11th at the DoubleTree San Jose Hotel (Jun. 07, 2024)
- Sigasi Redefines Chip Design Creation, Integration, Validation Leveraging Shift-Left Principles (Jun. 07, 2024)
- Mobiveil's PSRAM Controller IP Lets SoC Designers fully Leverage AP Memory's Ultra High Speed (UHS) PSRAM Memory (Jun. 07, 2024)
- MediaTek Joins Arm Total Design to Shape the Future of AI Computing (Jun. 07, 2024)
- Nuvoton Develops OpenTitan® based Security Chip as Next Gen Security Solution for Chromebooks (Jun 07, 2024)
- TSMC May 2024 Revenue Report (Jun 07, 2024)
- Efabless Welcomes Weebit Nano's ReRAM to Its Custom Chip Design Platform (Jun. 07, 2024)
- Andes RISC-V CON: Deep Dive into Automotive, AI Application Processors and Security Trend (Jun. 07, 2024)
- Siemens announces breakthroughs in high-level verification of C++ (Jun. 06, 2024)
- GUC Monthly Sales Report - May 2024 (Jun. 06, 2024)
- Arm looking for 50% of Windows PC market (Jun 06, 2024)
- UMC Reports Sales for May 2024 (Jun. 06, 2024)
- BrainChip Introduces TENNs-PLEIADES in New White Paper (Jun. 06, 2024)
- Alphawave Semi Collaborates with Arm on High-Performance Compute Chiplet (Jun. 06, 2024)
- Siemens brings formal methods to high-level verification with C++ coverage closure and property checking (Jun 06, 2024)
- Q1 2024 Global Semiconductor Equipment Billings Edge Down 2% Year-Over-Year, SEMI Reports (Jun. 06, 2024)
- Synthara Raises Over USD 11M to expand the embedded computing market and enable AI applications (Jun. 06, 2024)
- Samsung Foundry Expands 'Packaging Coalition' with Ten Additional Members (Jun. 06, 2024)
- Qualitas Semiconductor Announces 5nm MIPI C-PHY IP with 8Gsps Data Rate (Jun. 05, 2024)
- Skymizer Launches Groundbreaking LLM Accelerator IP for on-device LLM Inferencing, EdgeThought, the game-changer in on-device GenAI era (Jun. 05, 2024)
- RaiderChip launches its Generative AI hardware accelerator for LLM models on low-cost FPGAs (Jun. 05, 2024)
- AI Edge Inference IP Leader Expedera Opens R&D Office in India (Jun. 05, 2024)
- ElevATE Semiconductor and GlobalFoundries Partner on High-Voltage Chips for Commercial and National Security Applications (Jun. 05, 2024)
- Intel sells off half its Irish fab for $11bn (Jun. 05, 2024)
- Qualcomm is considering a "dual-sourcing" strategy with Samsung and TSMC for Snapdragon 8 Gen 5 (Jun. 05, 2024)
- Energy transition, electrification, and electrolysis - research for greater environmental and climate action (Jun. 05, 2024)
- New LZ4 & Snappy IP Core from CAST Enables Fast Lossless Data Decompression (Jun. 04, 2024)
- Raspberry Pi Selects Hailo to Enable Advanced AI Capabilities for Raspberry Pi 5 (Jun. 04, 2024)
- Kalray and Pliops enters into exclusive negotiations to create a global leader in data accelerators for AI and storage acceleration (Jun. 04, 2024)
- SureCore announces low power cryogenic memory technology that could help dramatically cut data centre power usage (Jun. 04, 2024)
- Codasip introduces best-in-class RISC-V core for power-efficient applications (Jun. 04, 2024)
- UK digital twin leader joins Siemens Xcelerator (Jun. 04, 2024)
- Frontgrade Technologies Selected by MDA Space as Part of MDA AURORA™ Supply Chain (Jun. 04, 2024)
- Why hardware security underlies AI progress (Jun. 04, 2024)
- AI expected to drive TSMC growth over next few years (Jun. 04, 2024)
- Cadence Acquires Beta CAE (Jun. 04, 2024)
- ARM could take 50% of Windows PC market, says CEO (Jun. 04, 2024)
- Rain AI Unveils Andes Technology as Its RISC-V Partner (Jun. 03, 2024)
- Silicon-Proven 14-Bit 4.32 GSps Wide Band ADC IP core Time-Interleaved Pipeline Solution Now Available for Whitebox Licensing with No Royalty (Jun. 03, 2024)
- Alphawave IP Group Plc ("Alphawave Semi" or the "Company") London Capital Markets Day on 4 June 2024 (Jun. 03, 2024)
- OMNIVISION Announces New High-resolution Image Sensors for Industrial and Consumer Security Surveillance Cameras (Jun. 03, 2024)
- Cadence Completes Acquisition of BETA CAE (Jun. 03, 2024)
- Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors (Jun. 03, 2024)
- Simplifying AI Deployment from the Cloud to Edge and Endpoint (Renesas WP) (Jun. 01, 2024)
- OPENEDGES' Memory Subsystem IPs Selected by ASICLAND for Next-gen AI Applications (May. 31, 2024)
- Startup offers low-cost neuromorphic quantum computing (May. 31, 2024)
- STMicroelectronics to build the world's first fully integrated silicon carbide facility in Italy (May. 31, 2024)
- Andes Technology Announced the QiLai SoC and the Voyager Development Board (May. 30, 2024)
- Fifth generation ARM Cortex-X for 3nm AI chip designs (May. 30, 2024)
- Xiphera's Customisable nQrux™ Confidential Computing Engine Protects Cloud, Edge, and AI Environments (May. 30, 2024)
- Redefining Mobile Experiences with AI-Optimized Arm CSS for Client and New Arm Kleidi Software (May. 30, 2024)
- NUMEM & IC'ALPS Collaborate to Develop an ultra-low-power SOC for Sensor and AI applications (May. 30, 2024)
- HCLTech integrates its GenAI platform HCLTech AI Force™ with Google Gemini (May. 30, 2024)
- Can investment from TSMC, Infineon, and others revive Europe's chip dreams? (May. 30, 2024)
- MIPS To Showcase New Embedded and Edge AI Innovations At Computex 2024 (May. 29, 2024)
- Fifth generation ARM Cortex-X for 3nm AI chip designs (May. 29, 2024)
- Samsung Electronics Opens Path to Chase TSMC with 3nm Foundry Collaboration with AMD (May. 29, 2024)
- Samsung Expected to Unveil its 1nm Plan in June, Advancing it to 2026 (May. 29, 2024)
- World's first RISC-V multi-mode LTE chipset for 450MHz (May. 29, 2024)
- The power of AI for environmental stewardship and optimised industry (May. 29, 2024)
- Malaysia looks for over $100bn in semiconductor industry investment (May. 28, 2024)
- RISC-V Summit Europe NewsProcessor IP, Verification Tools, and More (May. 28, 2024)
- Need a Perfect Ethernet IP? Key ASIC's 0.13um 10/100 PHY IP Solution is Ready Now (May. 27, 2024)
- Dolphin Design teams up with Raspberry Pi for advanced chip power management (May. 27, 2024)
- T2M-IP announces Silicon-Proven eDisplayPort v1.4 Tx PHY and Controller IP Core in 22ULP readily available for licensing for your futuristic SoCs (May. 27, 2024)
- HCLTech and Arm collaborate on custom silicon chips optimized for AI workloads (May. 27, 2024)
- SEALSQ RISC-V Chips Adoption is Predicted to Get AI Boost Making it a Viable Competitor to Traditional GPUs (May. 27, 2024)
- MerlinTPS Partners with Bluespec to Provide Urgently Needed GPS Augmentation and Backup Without Satellites (May. 27, 2024)
- RISC-V adoption predicted to get AI boost ? forecast shows 50% growth every year until 2030 for the open-standard ISA (May. 27, 2024)
- Navigating the Quantum Revolution (May. 27, 2024)
- Macron and Steinmeier visit Fraunhofer in Dresden (May. 26, 2024)
- 4DS Unveils New Interface Switching ReRAM Technology for Faster and Energy Efficient Memory for AI Processing (May. 24, 2024)
- Weebit Nano and Efabless collaborate to enable easy, affordable prototyping of innovative SoC designs (May. 24, 2024)
- TSMC's 3nm Production Capacity Will Triple This Year! Nanjing Plant Receives "Indefinite Exemption"! (May. 24, 2024)
- Samsung/Arm collaboration drives software research in communication technologies (May. 24, 2024)
- X-FAB and Soitec team up on SiC wafers (May. 23, 2024)
- Qualitas Semiconductor's eDP RX PHY IP v1.5a is Ready for Mass Production (May. 23, 2024)
- ZeroPoint Technologies Closes Funding Round for Groundbreaking Hardware-Accelerated Memory Compression Technology (May. 23, 2024)
- JPEG XS Joins GenICam, a Machine Vision Standard Managed by EMVA (May. 23, 2024)
- IMEC Spearheads the Construction of Sub-2nm Pilot Line Project with a Fund of EUR 2.5 Billion (May. 23, 2024)
- HCLTech Forges Ahead in Engineering Services to global Communication Services Providers (CSPs) with purchase of Communications Technology Group assets from Hewlett Packard Enterprise (HPE) (May. 23, 2024)
- Embedded artificial intelligence: How to increase security for industrial systems? (May. 23, 2024)
- China's largest chipmaker SMIC is now the No. 3 foundry in the world, Counterpoint says (May. 23, 2024)
- Analog Bits Joins the Silicon Catalyst In-Kind Partner Ecosystem (May. 22, 2024)
- Quadric Presents and Demos AI+ML Chimera GPNPU at Embedded Vision Summit 2024 (May. 22, 2024)
- S2C and Sirius Wireless Collaborate on Wi-Fi 7 RF IP Verification System (May. 22, 2024)
- Using generative AI to simply program a quantum computer (May. 22, 2024)
- Unleashing the potential of industrial and commercial IoT (May. 22, 2024)
- GlobalFoundries Announces Launch of $950 Million Secondary Offering of Ordinary Shares, Including Concurrent $200 Million Share Repurchase (May. 22, 2024)
- Soitec and Tokai Carbon enter into SiC partnership (May. 22, 2024)
- Siemens drives sustainable and future-proof power distribution across Norway (May. 22, 2024)
- JEDEC Reveals Massive Speed Boosts For Next-Gen DDR6 And LPDDR6 Memory (May. 22, 2024)
- TSMC Launches "Eco Plus! - Ecological Harmony Program" to Enhance Green Conservation in Three Key Aspects (May. 22, 2024)
- Synopsys Posts Financial Results for Second Quarter Fiscal Year 2024 (May. 22, 2024)
- Revolutionizing HPC workflows: EPI optimised kernels (May. 22, 2024)
- Samsung Collaborates With Arm To Drive Research in Software for Next-Generation Communication Technologies (May. 21, 2024)
- Andes Technology and Arteris Partner To Accelerate RISC-V SoC Adoption (May. 21, 2024)
- Siemens simplifies development of AI accelerators for advanced system-on-chip designs with Catapult AI NN (May. 21, 2024)
- Crucial role for imec in EU Chips Act (May. 21, 2024)
- Expedera Raises $20M Series B Funding Round Led By indie Semiconductor (May. 21, 2024)
- Fraunhofer IPMS supports the 300 mm process development of smart power technologies for the semiconductor manufacturer Infineon at the Dresden site (May. 21, 2024)
- Why verification matters in network-on-chip (NoC) design (May. 21, 2024)
- University of East London reduces carbon emissions in first stage of net zero strategy (May. 21, 2024)
- GlobalFoundries Partners with Micron and U.S. National Science Foundation to Drive Semiconductor Workforce Development at Minority Serving Institutions (May. 21, 2024)
- JEDEC Confirms CAMM2 Memory For Desktop PCs: DDR6 Up To 17.6 Gbps & LPDDR6 Up To 14.4 Gbps (May. 21, 2024)
- RISC-V adoption predicted to get AI boost - forecast shows 50% growth every year until 2030 for the open-standard ISA (May. 21, 2024)
- Qualitas Semiconductor expands presence in chinese market through strategic partnership with chinese chip design company (May. 20, 2024)
- CFX announces commercial availability of low cost automotive grade SonoS based charge trapping EFlash/MTP technology on 90nm BCD process (May. 20, 2024)
- High-Speed Data Transmission Enhanced by 28nm JESD204B Tx PHY & Controller IP Cores Licensed for MCU Applications (May. 20, 2024)
- RaiderChip raises 1 Million Euros in seed capital to market its innovative generative AI accelerator: the GenAI v1. (May. 20, 2024)
- RISC-V adoption will be accelerated by AI, according to new research (May. 20, 2024)
- TSMC Reportedly Prepares Next-generation HBM4 Manufacturing, Utilizing 12nm and 5nm Process Nodes (May. 17, 2024)
- Softbank's Arm new AI chips ready by 2025, aims to become an AI powerhouse (May. 17, 2024)
- South Korea Reportedly Plans to open AI Chip Center in San Jose (May. 17, 2024)
- Defacto SoC Compiler performance on AWS Graviton3 (May. 17, 2024)
- AiM Future Brings GenAI Applications to Mainstream Consumer Devices (May. 16, 2024)
- Siemens Sustainability report 2023 (May. 16, 2024)
- Axiomise Names Two Executives to Newly Formed Technical Advisory Board (May. 16, 2024)
- Next-generation sustainable electronics are doped with air (May. 16, 2024)
- Solid second-quarter performance - Outlook confirmed (May. 16, 2024)
- TSMC Confirms Construction for Its First European Chip Plant to Commence in Q4, as Scheduled (May. 16, 2024)
- Actions Technology's smart watch SoC adopted VeriSilicon's 2.5D GPU IP (May. 15, 2024)
- New Automotive Grade Linux Platform Release Adds Cloud-Native Functionality, RISC-V Architecture and Flutter-Based Applications (May. 15, 2024)
- Esperanto Technologies and Rapidus Partner to Enable More Energy-Efficient Designs for the Coming "Post GPU Era" (May. 15, 2024)
- RISC-V Chip Combines CPU, GPU, and NPU Into One Core (May. 15, 2024)
- An Introduction to Post-Quantum Cryptography Algorithms (May. 15, 2024)
- Cybersecurity threat model for embedded devices (May. 15, 2024)
- TSMC plans automotive chiplet process for 2025 (May. 15, 2024)
- Bosch Powers Battery Recycling Innovation (May. 15, 2024)
- Frontgrade Gaisler Leads the Way in RISC-V Processor Development for Space Applications (May. 14, 2024)
- M31 Q1 Revenue Increases 9.3% YoY, Advanced Processes Drive QoQ Growth (May. 14, 2024)
- ADTechnology and ANAFLASH to Team Up for Embedded Vision Summit (EVS) showcase (May. 14, 2024)
- Andes, HiRain, and HPMicro Join Hands to Build RISC-V AUTOSAR Software Ecosystem (May. 14, 2024)
- Kevin O'Buckley to Lead Foundry Services at Intel (May. 14, 2024)
- Digital Core Design in cooperation with DCD-SEMI Unveils DCAN-XL: Revolutionary CAN XL IP Core Bridging the Gap Between CAN FD and Ethernet (May. 14, 2024)
- Siemens partners with Microsoft to deliver AI-enhanced solutions for resilient product lifecycle management with Azure (May. 14, 2024)
- Green IT: 10 years of cooperation on the circular economy with a record in 2023 (May. 14, 2024)
- Silicon Proven PCIe 5.0 PHY and Controller IP Cores in 12nm to Revolutionize Connectivity solutions (May. 13, 2024)
- Qualcomm confirms that Huawei no longer need its chips (May. 13, 2024)
- NEO Semiconductor Reveals a Performance Boosting Floating Body Cell Mechanism for 3D X-DRAM during IEEE IMW 2024 (May. 13, 2024)
- Is Graphcore Deal Finally About to Close? (May. 13, 2024)
- lowRISC Deploys Real Intent Ascent Lint, Meridian CDC, & Meridian RDC for OpenTitan Project (May. 13, 2024)
- TSMC April 2024 Revenue Report (May. 13, 2024)
- GDDR7 Adds Headroom to Meet AI Pressures (May. 13, 2024)
- SiPearl: Rhea1 key features to accelerate HPC & AI inference (May. 13, 2024)
- TransferTalk "Sustainability as the Success Factor in Industries" (May. 13, 2024)
- SiPearl chooses Italy to open its third international subsidiary (May. 13, 2024)
- Demonstrating the UCIe Chiplet Interconnect (May. 13, 2024)
- SAPEON Enhances AI Accelerator with proteanTecs Reliability and Performance Monitoring (May. 09, 2024)
- VESA Elevates PC and Laptop HDR Display Performance with Updated DisplayHDR Specification (May. 09, 2024)
- Softbank reported to be in talks to buy Graphcore (May. 09, 2024)
- X-Silicon Announces a NEW Low-Power Open-Standard Vulkan-Enabled C-GPU™ - a RISC-V Vector CPU Infused with GPU ISA and AI/ML acceleration in a Single Processor Core (May. 09, 2024)
- Silvaco Announces Pricing of Initial Public Offering (May. 09, 2024)
- Arm revenues up 47%; shares fall (May. 09, 2024)
- Ceva, Inc. Announces First Quarter 2024 Financial Results (May. 09, 2024)
- Sondrel awarded new Video Processor ASIC design and supply contract for a leading provider of High-Performance Video systems (May. 09, 2024)
- X-Silicon Announces a NEW Low-Power Open-Standard Vulkan-Enabled C-GPU™ - a RISC-V Vector CPU Infused with GPU ISA and AI/ML acceleration in a Single Processor Core (May 09, 2024)
- Qualitas to raise funds for research into UCIe PHY IP for chiplets (May. 09, 2024)
- GlobalFoundries' Q1 2024 Revenue Down 16% YoY, Decline Limited by Automotive Growth (May. 09, 2024)
- Arasan's Total MIPI Camera IP solution with CSI and C-PHY achieve ISO26262 Certification (May. 08, 2024)
- sureCore announces successful tape-out of cryogenic IP demonstrator (May. 08, 2024)
- Samsung tapes out 3nm mobile processor, closing gap with TSMC (May. 08, 2024)
- Rapidus and Fraunhofer IZM join Forces for High-End Performance Packaging (May. 08, 2024)
- TSMC Certifies a Host of Top EDA Tools for New Process Nodes (May. 08, 2024)
- Cybersecurity professionals say generative AI can be exploited in cyberattacks - but it can also be a powerful defense (May. 08, 2024)
- Credo Schedules Fourth Quarter and Fiscal Year 2024 Financial Results Conference Call (May. 08, 2024)
- TSMC crunch heralds good days for advanced packaging (May. 08, 2024)
- FMD's Albert Heuberger: Supporting Heterogeneous System Integration (May. 08, 2024)
- Synopsys collaborates with TSMC on 2nm IP portfolio and photonics ICs (May. 07, 2024)
- UMC Reports Sales for April 2024 (May. 07, 2024)
- Siemens delivers end-to-end silicon quality assurance for next-generation IC designs with new Solido IP Validation Suite (May. 07, 2024)
- Apple M4 moves to TSMC N3E (May. 07, 2024)
- Kudelski IoT Selected as One of Zoom's Authorized Hardware Certification Testing Labs (May. 07, 2024)
- Announcing Availability of Silicon-Proven 12bit 1Msps SAR ADC IP Core for Whitebox Licensing with Royalty Free (May. 06, 2024)
- BrainChip and Frontgrade Gaisler to Augment Space-Grade Microprocessors with AI Capabilities (May. 06, 2024)
- Fabless semiconductor startup Mindgrove launches India's first indigenously designed commercial high-performance MCU chip (May. 06, 2024)
- A Conversation with GlobalFoundries Europe's Manfred Horstmann (May. 06, 2024)
- Arteris Announces Financial Results for the First Quarter 2024 and Second Quarter and Full Year 2024 Guidance (May. 06, 2024)
- Arm Brings Transformers to IoT Devices (May. 06, 2024)
- Zhuhai Chuangfeixin: OTP IP Based on 55nm High-Voltage Process Successfully Qualified for Listing (May. 06, 2024)
- Synopsys Enters Definitive Agreement to Sell its Software Integrity Business to Clearlake Capital and Francisco Partners (May. 06, 2024)
- oneNav announces the first L5-direct GNSS receiver technology (May 06, 2024)
- Q3 FY24 Quarterly Activities Report: Weebit Nano advancing negotiations with partners and customers; demonstrates ReRAM robustness (May 06, 2024)
- GUC Monthly Sales Report - April 2024 (May. 06, 2024)
- BrainChip, Gaisler work on AI in space (May. 06, 2024)
- Why Synopsys is selling its application security testing business (May. 06, 2024)
- Arm Brings Transformers to IoT Devices (May. 04, 2024)
- Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU with Leading Performance on Samsung Foundry's GAA Process (May. 03, 2024)
- Alphawave Semi announced today a refocussing of the Board of Directors after reaching the three-year milestone since the Company's IPO (May. 03, 2024)
- PCI-SIG® Announces CopprLink™ Cable Specifications for PCIe® 5.0 and 6.0 Technology (May. 02, 2024)
- Radiation-Tolerant PolarFire® SoC FPGAs Offer Low Power, Zero Configuration Upsets, RISC-V Architecture for Space Applications (May. 02, 2024)
- Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024, SEMI Reports (May. 02, 2024)
- GOWIN's progress in global automotive market gathers momentum with award of ISO 26262 certification for its FPGA design environment (May. 02, 2024)
- Radiation-Tolerant PolarFire® SoC FPGAs Offer Low Power, Zero Configuration Upsets, RISC-V Architecture for Space Applications (May 02, 2024)
- Intel aims to produce scalable silicon-based quantum processors (May. 02, 2024)
- Packetcraft Delivers Bluetooth Software Enabling Channel Sounding to Early Access Licensees (May. 01, 2024)
- QuickLogic Releases Aurora 2.6 with Expanded Operating System Support and Up to 15% Faster Performance (May. 01, 2024)
- Rapid Silicon Introduces Revolutionary Rapid eFPGA Configurator for Hassle Free Embedded FPGA Evaluation (May. 01, 2024)
- Radiation-Tolerant RISC-V FPGA for Linux in space (May. 01, 2024)
- The End of an Era: Zilog Discontinues the Z80 Microprocessor (May. 01, 2024)
- Synopsys 3DIO Solution for Multi-Die Integration (2.5D/3D) (May. 01, 2024)
- Silvaco Announces Launch of Initial Public Offering (Apr. 30, 2024)
- TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips (Apr. 30, 2024)
- Synopsys Introduces Polaris Assist: AI-Powered Application Security Assistant (Apr. 30, 2024)
- Samsung Q1 profit up 10x (Apr. 30, 2024)
- CAN FD Controller & LIN 2.1 Controller IP Cores, Available for Immediate Licensing with Proven Automotive Compatibility (Apr. 29, 2024)
- Altera in negotiation on private equity partner (Apr. 29, 2024)
- TSMC's A16 Process Moves Goalposts in Tech-Leadership Game (Apr. 29, 2024)
- EDA toolset parade at TSMC's U.S. design symposium (Apr. 29, 2024)
- Arm China's ex-CEO sets up RISC-V company (Apr 29, 2024)
- Siemens' tools certified for TSMC N2 (Apr. 29, 2024)
- Rambus Expands Chipset for Advanced Data Center Memory Modules with DDR5 Server PMICs (Apr. 29, 2024)
- STMicroelectronics hits 71% renewable electricity, targets 100% by 2027 (Apr. 29, 2024)
- Rambus Reports First Quarter 2024 Financial Results (Apr. 29, 2024)
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30% (Apr. 26, 2024)
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System (Apr. 26, 2024)
- TSMC plans 1.6nm process for 2026 (Apr. 26, 2024)
- Automotive Cybersecurity: A Review of 2023 (Apr. 26, 2024)
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development (Apr. 25, 2024)
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes (Apr. 25, 2024)
- TSMC Celebrates 30th North America Technology Symposium with Innovations Powering AI with Silicon Leadership (Apr. 25, 2024)
- Numem at the Design & Reuse IP SoC Silicon Valley 2024 (Apr. 25, 2024)
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design (Apr. 25, 2024)
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process (Apr. 25, 2024)
- TSMC unveils 1.6nm process technology with backside power delivery, rivals Intel's competing design (Apr. 25, 2024)
- TSMC unveils 1.6nm process technology with backside power delivery, rivals Intel's competing design (Apr. 25, 2024)
- Rambus Advances AI 2.0 with GDDR7 Memory Controller IP (Apr. 24, 2024)
- Credo at TSMC 2024 North America Technology Symposium (Apr. 24, 2024)
- Leveraging Cryogenics and Photonics for Quantum Computing (Apr. 24, 2024)
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones (Apr. 24, 2024)
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing (Apr. 24, 2024)
- Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node (Apr. 24, 2024)
- Industry's First General-Purpose 32-bit RISC-V MCU Core Expands Design Freedom (Apr. 24, 2024)
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium (Apr. 23, 2024)
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process (Apr. 23, 2024)
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets (Apr. 23, 2024)
- Alphawave Semi Audited Results for the Year Ended 31 December 2023 (Apr. 23, 2024)
- Faraday Reports First Quarter 2024 Results (Apr. 23, 2024)
- RAAAM Memory Technologies Closes $4M Seed Round to Commercialize Super Cost Effective On-Chip Memory Solutions (Apr. 23, 2024)
- Cadence Reports First Quarter 2024 Financial Results (Apr. 23, 2024)
- Fundamental inventions enable the best ppa and most portable eFPGA/DSP/SDR/AI IP for adaptable SOCs (Apr. 23, 2024)
- Siemens and Mercedes-Benz Transform Future of Sustainable Factory Planning with Digital Energy Twin (Apr. 23, 2024)
- Efabless Announces the Launch of the Tiny ML on Tiny Tapeout Contest (Apr. 23, 2024)
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC (Apr. 22, 2024)
- T2M-IP Unveils Revolutionary MIPI D-PHY & DSI Controller IP Cores with speed 2.5Gbps/lane, Redefining High-Speed Data Transfer and Display Interfaces (Apr. 22, 2024)
- How Close Are We to Commercial Quantum Computers? (Apr. 22, 2024)
- Palladium emulation: Nvidia's Jensen Huang is a fan (Apr. 22, 2024)
- Controversial former Arm China CEO founds RISC-V chip startup (Apr. 22, 2024)
- Siemens Xcelerator: Scaling roll-out of generative AI with Siemens Industrial Copilot (Apr. 22, 2024)
- Infineon's Global Forum: Driving Change With WBG Technologies for a Sustainable Future (Apr. 22, 2024)
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers (Apr. 19, 2024)
- DVB-S2X Wideband LDPC/ BCH Decoder IP Core Available For Integration From Global IP Core (Apr. 19, 2024)
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows (Apr. 19, 2024)
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance (Apr. 19, 2024)
- TSMC Reports First Quarter EPS of NT$8.70 (Apr. 19, 2024)
- Brisbane Silicon publishes DPTx 1.4 IP Core (Apr 19, 2024)
- Fraunhofer IIS Opens Laboratory in Space (Apr. 19, 2024)
- Faraday Partners with Arm to Innovate AI-driven Vehicle ASICs (Apr. 18, 2024)
- Demonstration of Weebit ReRAM on GF 22FDX® Wafers at EW24 (Apr. 18, 2024)
- Cadence Announces Most Comprehensive True Hybrid Cloud Solution to Provide Seamless Data Access and Management (Apr. 18, 2024)
- Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins (Apr 18, 2024)
- Dolphin Design expands GoAsic partnership to enhance the semiconductor Industry's Supply Chain (Apr. 18, 2024)
- M31 Successfully Validates 5nm IP Solution to Empower Global AI Applications (Apr. 18, 2024)
- Cadence Collaborates with MemVerge to Increase Resiliency and Cost-Optimization of Long-Running High-Memory EDA Jobs on AWS Spot Instances (Apr. 18, 2024)
- Rivos Raises More Than $250M Targeting Data Analytics and Generative AI Markets (Apr 17, 2024)
- U.S. Subsidy for TSMC Has AI Chips, Tech Leadership in Sight (Apr 17, 2024)
- Silvaco Announces Expanded Partnership with Micron Technology (Apr. 17, 2024)
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass-Produced (Apr. 17, 2024)
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results (Apr. 17, 2024)
- JEDEC Updates JESD79-5C DDR5 SDRAM Standard: Elevating Performance and Security for Next-Gen Technologies (Apr. 17, 2024)
- Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins (Apr. 17, 2024)
- Samsung Develops Industry's Fastest 10.7Gbps LPDDR5X DRAM, Optimized for AI Applications (Apr. 17, 2024)
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass Production (Apr 17, 2024)
- STMicroelectronics opens up the FD-SOI era for MCU (Apr. 17, 2024)
- Infineon provides FOXESS with power semiconductors to improve efficiency and power density of energy storage applications (Apr. 17, 2024)
- OPENEDGES Unveils ENLIGHT Pro: A High-Performance NPU IP Quadrupling its Previous Generation's Performance (Apr. 16, 2024)
- Fraunhofer IIS offers JPEG XS plugin for NVIDIAs Holoscan for Media Architecture (Apr. 16, 2024)
- Movellus Extends Droop Management Leadership with Aeonic Generate™ AWM3 (Apr. 16, 2024)
- CMC Microsystems and AIoT Canada Sign Memorandum of Understanding to support IoT and semiconductor ecosystem growth in Canada (Apr. 16, 2024)
- Fraunhofer IIS offers JPEG XS plugin for NVIDIA´s Holoscan for Media Architecture (Apr 16, 2024)
- Movellus Extends Droop Management Leadership with Aeonic Generate™ AWM3 (Apr 16, 2024)
- IP block covers Wi-Fi 6, Bluetooth 5.4 dual mode and IEEE 802.15.4 for IoT chips (Apr. 16, 2024)
- ITRI launches AIoT certification center with Arm (Apr. 16, 2024)
- Arm accelerates Edge AI with Ethos-U NPU and IoT reference design platform (Apr. 16, 2024)
- Challenges in designing automotive radar systems (Apr. 16, 2024)
- STMicroelectronics Publishes 2024 Sustainability Report (Apr. 16, 2024)
- TSMC Reports Solid Earnings Boost Amid Surging AI Demand (Apr. 16, 2024)
- Emotors adopts Siemens' Simcenter solutions for NVH testing of next-generation automotive e-drives (Apr. 16, 2024)
- Unveiling Silicon-proven USB 3.0 PHY IP Core in 22nm, Elevating High-Speed Data Transmission with Advanced Transceiver Technology, backward compatible with USB 2.0 (Apr. 15, 2024)
- Brazil and Europe sign innovative project with RISC-V technology for HPC (Apr. 15, 2024)
- intoPIX Unveils Titanium at NAB for Accelerating IP Media Workflows (Apr. 15, 2024)
- Khronos Releases OpenXR 1.1 to Further Streamline Cross-Platform XR Development (Apr. 15, 2024)
- Microchip Technology Acquires Neuronix AI Labs (Apr. 15, 2024)
- New Wave Design and Verification Announces Strategic Brand Evolution to Sharpen Focus on Innovation and Growth (Apr. 15, 2024)
- Semiconductor Capacity Is Up, But Mind the Talent Gap (Apr 15, 2024)
- Siemens and Microsoft to converge Digital Twin Definition Language with W3C Thing Description Standard (Apr. 15, 2024)
- Ceva Wireless Platform IP Family Accelerates Enhanced Connectivity in MCUs and SOCs (Apr. 15, 2024)
- A Brief and Personal History of EDA, Cadence, Synopsys, and Mentor Graphics - The EDA Era (Apr. 15, 2024)
- Rapidus opens sales office in Silicon Valley (Apr. 15, 2024)
- Samsung gets $6.4bn Chips Act money (Apr. 15, 2024)
- U.S. Subsidy for TSMC Has AI Chips, Tech Leadership in Sight (Apr. 15, 2024)
- VISC: The New Coprocessing RISC-V Architecture for AI Efficiency (Apr. 13, 2024)
- intoPIX Unveils Latest JPEG XS FPGA Cores with Nextera-Adeas ST2110/IPMX, Streamlining IPMX Development at NAB Show (Apr. 12, 2024)
- Creonic GmbH Introduces Fast Fourier Transform IP Core (Apr. 12, 2024)
- Logic Fruit Technologies Inc. Excitedly Welcomes Mr. Akshaya Sharma as the new CEO of US Operations (Apr. 12, 2024)
- Kudelski IoT's Semiconductor Alliances set to redefine IoT provisioning (Apr. 12, 2024)
- Xiphera and Kaviaz Technology Announce a Partnership for IP Distribution in Taiwan (Apr. 11, 2024)
- Think Silicon and Edge Impulse Democratize ML on NEOX® for Wearables and AIoT (Apr. 11, 2024)
- Think Silicon and Edge Impulse Democratize ML on NEOX® for Wearables and AIoT (Apr 11, 2024)
- TSMC March 2024 Revenue Report (Apr. 10, 2024)
- Google Cloud Delivers Customized Silicon Powered by Arm Neoverse for General-Purpose Compute and AI Inference Workloads (Apr. 10, 2024)
- Tiempo Secure - CryptoNext Security partnership, bringing High-End Post-Quantic IP Security innovation to the next level. (Apr. 10, 2024)
- TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix (Apr. 10, 2024)
- Innova finalizes its flow and resource management software platform and opens up to the international market (Apr. 10, 2024)
- Winners of the Embedded World awards (Apr. 10, 2024)
- VeriSilicon showcased its latest power-efficient IP applications at Embedded World 2024 (Apr. 09, 2024)
- Arm Accelerates Edge AI with Latest Generation Ethos-U NPU and New IoT Reference Design Platform (Apr. 09, 2024)
- Ambiq and PUFsecurity Join Forces on Energy-Efficient, Security-Enhanced SoC with PUF-based Root of Trust (Apr. 09, 2024)
- SiFive Unveils the HiFive Premier P550, the First Commercially Available Out-of-Order RISC-V Development Board (Apr. 09, 2024)
- TASKING presents compiler toolset for RISC-V in safety- and security-critical automotive applications (Apr. 09, 2024)
- Xiphera Launches nQrux™ Family of Hardware Trust Engines for Hardware-Isolated Cryptographic Services and Computing Environments (Apr. 09, 2024)
- Autotalks and Secure-IC Collaborate to Create the Most Secure V2X Communication Chipset (Apr. 09, 2024)
- Xiphera Launches nQrux™ Family of Hardware Trust Engines for Hardware-Isolated Cryptographic Services and Computing Environments (Apr. 09, 2024)
- Electronic System Design Industry Posts $4.4 Billion in Revenue in Q4 2023, ESD Alliance Reports (Apr. 09, 2024)
- Rebellions Selects Arteris for Its Next-Generation Neural Processing Unit Aimed at Generative AI (Apr. 09, 2024)
- MIPS Continues To Expand With The Addition Of Industry Leaders from NVIDIA, Google and SiFive (Apr. 09, 2024)
- AI-Driven HBM Uptake Is Power-Sensitive (Apr. 09, 2024)
- RISC-V compiler toolset targets automotive functional safety (Apr. 09, 2024)
- Synopsys Launches New Offering for Comprehensive Software Supply Chain Security (Apr. 09, 2024)
- Intel Unleashes Enterprise AI with Gaudi 3, AI Open Systems Strategy and New Customer Wins (Apr. 09, 2024)
- Semiconductor design innovation: how EDA initiates the digitalization journey for a smarter, sustainable future. (Apr. 09, 2024)
- Xiphera Launches nQrux™ Family of Hardware Trust Engines for Hardware-Isolated Cryptographic Services and Computing Environments (Apr 09, 2024)
- Via LA Announces Extension of HEVC Patent Pool to Include VVC and Welcomes TCL Into Newly Formed Program (Apr. 08, 2024)
- RISC-V International Achieves Milestone with Ratification of 40 Specifications in Two Years (Apr. 08, 2024)
- MIPS Expands RISC-V Ecosystem Support to to Enable Early Software Development for Multi-threaded Cores (Apr. 08, 2024)
- Silicon-Proven 12-Bit 5Msps ADC IP Core for High-Speed Data Conversion, Now Available for Licensing (Apr. 08, 2024)
- Imagination's new Catapult CPU is driving RISC-V device adoption (Apr. 08, 2024)
- PCIe 7.0 specification reaches "half way point" (Apr 08, 2024)
- Sondrel CEO steps down as chip firm faces re-organization (Apr. 08, 2024)
- Secure-IC partners with COONTEC to help strengthen Embedded Cybersecurity in South Korea (Apr. 08, 2024)
- Enhancing Security with Securyzr™ iSE with integrated Hypervisor (Apr. 08, 2024)
- Ceva Launches Multi-Protocol Wireless Platform IP Family to Accelerate Enhanced Connectivity in MCUs and SOCs for IoT and Smart Edge AI Applications (Apr. 08, 2024)
- GUC Monthly Sales Report - March 2024 (Apr 08, 2024)
- IAR, Nuclei, and MachineWare Join Forces To Speed Up Innovation in RISC-V ASIL Compliant Automotive Solution (Apr. 08, 2024)
- UMC Reports Sales for March 2024 (Apr 08, 2024)
- Enhancing Security with Securyzr™ iSE with integrated Hypervisor (Apr 08, 2024)
- Industry Leading PPA EFPGA And DSP/AI In Development For TSMC N5/4/3 (Apr. 08, 2024)
- TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix (Apr. 08, 2024)
- Semidynamics announces All-In-One AI IP for super powerful, next generation AI chips (Apr. 05, 2024)
- It Is Time To Take Intel Seriously As A Chip Foundry (Apr. 05, 2024)
- Defacto now part of Arm's Partner Catalog (Apr 04, 2024)
- sureCore announces low power memory compiler for 16nm FinFET (Apr. 04, 2024)
- The Crucial Role Of Semiconductors In The Transition Toward A Greener World (Apr. 04, 2024)
- NeuReality Boosts AI Acelerator Utilization With NAPU (Apr. 04, 2024)
- Why have all broadcast powerhouses embraced intoPIX JPEG XS? Unraveling the secret behind industry leaders' unanimous adoption! (Apr. 04, 2024)
- Global Semiconductor Sales Increase 16.3% Year-to-Year in February (Apr 04, 2024)
- RED Semiconductor announces VISC™ licensable high performance processor architecture for RISC-V (Apr 04, 2024)
- New RISC-V microprocessor can run CPU, GPU, and NPU workloads simultaneously (Apr. 04, 2024)
- Why Schneider Electric Backs AI & Data to Power Net Zero (Apr. 04, 2024)
- Japan Approves $3.9 Billion Subsidy for Rapidus (Apr. 04, 2024)
- Think Silicon to Showcase its Latest Ultra-Low-Power 3D Graphics and AI in One IP Architecture at Embedded World 2024 (Apr. 03, 2024)
- Intel Outlines Financial Framework for Foundry Business, Sets Path to Margin Expansion (Apr. 03, 2024)
- Defacto part of Arms Partner Catalog (Apr. 03, 2024)
- Intel and Synopsys Reveal First Heterogeneous Chiplet Design Based on UCIe Does This Chip Hold the Future of the Semiconductor Industry? (Apr. 03, 2024)
- AI-generated Code: The Fourth Component of Software Development (Apr. 03, 2024)
- Electronic Waste Rising Five Times Faster than Documented E-waste Recycling: UN (Apr. 03, 2024)
- Chip production TSMC and United Microelectronics shut down after earthquake (Apr. 03, 2024)
- Proprietary Memories Are a High-Risk Endeavor (Apr 02, 2024)
- Ezurio and Packetcraft Introduce Talking Sensor Rapid Prototyping Kit with Bluetooth Auracast Broadcast Audio Capability (Apr. 02, 2024)
- NEDO Approves Rapidus' FY2024 Plan and Budget for "Research and Development of 2nm-generation semiconductor integration technology and short TAT manufacturing technology based on Japan-US collaboration" (Apr. 02, 2024)
- Hailo Closes New $120 Million Funding Round and Debuts Hailo-10, A New Powerful AI Accelerator Bringing Generative AI to Edge Devices (Apr. 02, 2024)
- Red Semiconductor announces VISC extension to RISC-V (Apr. 02, 2024)
- Microsoft-Funded Quantum Startup Plants Flags in Europe (Apr. 02, 2024)
- Battery passports for greater sustainability (Apr. 02, 2024)
- JESD204B & JESD204C Tx-Rx PHY & Controller IP Cores in 28nm are available for immediate licensing with Proven Automotive Compatibility (Apr. 01, 2024)
- Synopsys SNUG: AI driven EDA momentum, new tools for multi-die (Apr. 01, 2024)
- Codasip to exhibit CHERI security, HW/SW co-optimization (Apr. 01, 2024)
- French backing for Sequans ahead of Embedded World (Apr. 01, 2024)
- China's Intel, AMD Ban Helps Local Rivals, Analysts Say (Mar 29, 2024)
- First general-purpose 32-bit RISC-V MCUs with internally developed CPU core (Mar. 29, 2024)
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification (Mar. 28, 2024)
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support (Mar. 28, 2024)
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product (Mar. 28, 2024)
- STMicroelectronics Shrinks Microcontrollers to 20nm for Competitive Costs (Mar. 28, 2024)
- The Sustainability of AI (Mar. 28, 2024)
- T2M IP Unveils Cutting-Edge HDMI 2.0 Tx PHY & Controller IP Cores are available for immediate licensing for your advanced diverse applications (Mar. 27, 2024)
- Efinix Rolls Out Line of FPGAs to Accelerate and Adapt Automotive Designs and Applications (Mar. 27, 2024)
- SmartSoC Solutions Joins TSMC Design Center Alliance to Boost Semiconductor Innovation in India (Mar. 27, 2024)
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge (Mar. 27, 2024)
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP (Mar 27, 2024)
- New fabrication process, a major advance towards quantum computing (Mar. 27, 2024)
- Bright minds wanted for chip design in Europe (Mar. 27, 2024)
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips (Mar. 26, 2024)
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024 (Mar. 26, 2024)
- Faraday Partnered with SONIX to Create a New Product Featuring Its SONOS eFlash Solution (Mar. 26, 2024)
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement (Mar. 26, 2024)
- Renesas Introduces Industry's First General-Purpose 32-bit RISC-V MCUs with Internally Developed CPU Core (Mar. 26, 2024)
- Intel and Arm Team Up to Power Startups (Mar. 26, 2024)
- Achronix FPGAs Add Support for Bluespec's Linux-capable RISC-V Soft Processors to Enable Scalable Processing (Mar. 26, 2024)
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers (Mar. 26, 2024)
- Samsung Demonstrates New CXL Capabilities and Introduces New Memory Module for Scalable, Composable Disaggregated Infrastructure at Memcon 2024 (Mar. 26, 2024)
- Credo and Wistron to Demonstrate 800G Linear Receive Optics with 51.2Tbs Switch Platform at OFC 2024 (Mar. 26, 2024)
- TSMC's 3nm node will reportedly account for over 20% of its revenue in 2024, as Apple, AMD, and Intel adopt the technology (Mar. 26, 2024)
- Industry veteran Volker Politz joins Semidynamics as Chief Sales Officer (Mar. 25, 2024)
- StarIC and GlobalFoundries announce strategic partnership, release high-Speed TIA and drivers to advance silicon photonics ecosystem (Mar. 25, 2024)
- CoreHW, in Partnership with Unikie, Introduces a Novel RTLS Technology that Significantly Enhances Power Efficiency and Positioning Accuracy (Mar. 25, 2024)
- ScaleFlux To Integrate Arm Cortex-R82 Processors in Its Next-Generation Enterprise SSD Controllers (Mar. 25, 2024)
- Alpha Project: Secure-IC Leads the Cybersecurity Reinforcement in Baggage Transport (Mar. 25, 2024)
- Marvell Announces Industry's First 5nm Transmit-Only 800G PAM4 Optical DSP for AI and Cloud Interconnects (Mar 25, 2024)
- Edge Impulse Deploys its State-of-the-Art Edge AI Models to Arm Microcontrollers Tools (Mar 25, 2024)
- Arm Highlights Future of the Software-Defined Vehicle (Mar. 25, 2024)
- Ex-DoD Official Says Chinese-Made PCBs Plague U.S. Systems (Mar 25, 2024)
- Synopsys Adds AI-Driven Tools, Acquires PUF Security Firm (Mar. 25, 2024)
- Europe invests in NeuReality's AI technology (Mar. 25, 2024)
- StarFive's RISC-V based JH-7110 intelligent vision processing platform adopted VeriSilicon's Display Processor IP (Mar. 21, 2024)
- Seven Years of Uninterrupted Growth: Andes Technology Achieves Milestone Annual Revenue Exceeding NT$1 Billion (Mar. 21, 2024)
- indie Semiconductor Announces Strategic Investment in AI Processor Leader Expedera (Mar 21, 2024)
- Tommi Lampila Is Xiphera's New Chief Revenue Officer (Mar. 21, 2024)
- Smart Manufacturing Paves the Way for Greener Electronics (Mar. 21, 2024)
- Biden-Harris Administration Announces Preliminary Terms with Intel to Support Investment in U.S. Semiconductor Technology Leadership and Create Tens of Thousands of Jobs (Mar. 20, 2024)
- MIPS Expands Global Footprint with New Design Center and Talent for Systems Architects and AI Compute (Mar. 20, 2024)
- 300mm Fab Equipment Spending Forecast to Reach Record $137 Billion in 2027, SEMI Reports (Mar. 20, 2024)
- Synopsys Expands Semiconductor IP Portfolio With Acquisition of Intrinsic ID (Mar 20, 2024)
- Synopsys Announces New AI-Driven EDA, IP and Systems Design Solutions At SNUG Silicon Valley (Mar 20, 2024)
- Alibaba's research arm promises server-class RISC-V processor due this year (Mar. 20, 2024)
- Synopsys to sell Software Integrity business (Mar. 20, 2024)
- Credo Technology Group To Showcase Latest Optical Solutions at OFC 2024 (Mar. 20, 2024)
- Empowering Sustainability: 4 Strategies To Significantly Reduce the Semiconductor Industry's Carbon Footprint (Mar. 20, 2024)
- Europe Leaps Ahead in Global AI Arms Race, Joining $20 Million Investment in NeuReality to Advance Affordable, Carbon-Neutral AI Data Centers (Mar. 19, 2024)
- Kudelski IoT and Dolphin Design unite to accelerate secure ASIC and IP projects (Mar. 19, 2024)
- Spectral Releases Advanced Quality Assurance & Data Analytics tool to validate advanced node Memory Compilers (Mar. 19, 2024)
- TSMC and Synopsys Bring Breakthrough NVIDIA Computational Lithography Platform to Production (Mar. 19, 2024)
- Synopsys Showcases EDA Performance and Next-Gen Capabilities with NVIDIA Accelerated Computing, Generative AI and Omniverse (Mar. 19, 2024)
- Cycuity Sets New Standard for Semiconductor Chip Security Assurance with Next Generation of Radix Technology (Mar. 19, 2024)
- HCLTech and CAST expand partnership for custom chips (Mar. 19, 2024)
- STMicroelectronics breaks the 20nm barrier for cost-competitive next-generation microcontrollers (Mar. 19, 2024)
- Synopsys Strengthens Polaris Software Integrity Platform with New Dynamic Security Testing Capabilities (Mar. 19, 2024)
- Arm Unveils Its Largest Portfolio of Automotive Processors (Mar. 19, 2024)
- Credo Introduces HiWire AECS to Support 400G AI/ML Backend Networks (Mar. 19, 2024)
- A System On Module (SoM) developed by Electra IC: BitFlex-SPB-A7 FPGA SoM (Mar. 18, 2024)
- After TSMC fab in Japan, advanced packaging facility is next (Mar. 18, 2024)
- Weebit Nano to demo its ReRAM technology on GlobalFoundries' 22FDX® platform (Mar. 18, 2024)
- Revolutionary Cadence Reality Digital Twin Platform to Transform Data Center Design for the AI Era (Mar. 18, 2024)
- Siemens and NVIDIA expand collaboration on generative AI for immersive real-time visualization (Mar. 18, 2024)
- Cadence and NVIDIA Unveil Groundbreaking Generative AI and Accelerated Compute-Driven Innovations (Mar. 18, 2024)
- EU takes a step closer to regulating AI (Mar. 18, 2024)
- Intel will bring a performance-improving feature to its chips one year ahead of TSMC (Mar. 16, 2024)
- SoC Secure Boot Hardware Engine IP Core Now Available from CAST (Mar. 15, 2024)
- Canaan's RISC-V based edge AIoT SoC adopted VeriSilicon's ISP and GPU IPs (Mar. 14, 2024)
- Dolphin Design in Arm's Partner Catalog (Mar. 14, 2024)
- QuickLogic and Zero-Error Systems Partner to Deliver Radiation-Tolerant eFPGA IP for Commercial Space Applications (Mar. 14, 2024)
- embedded world 2024: Codasip demonstrates CHERI memory protection (Mar. 14, 2024)
- PrimisAI Unveils Premium Version of RapidGPT, Redefining Hardware Engineering (Mar. 14, 2024)
- Arasan proudly introduces the VESA VDC-M Encoder and Decoder IP (Mar. 13, 2024)
- Arasan proudly releases its Radiation Hardened NAND Flash IP (Mar. 13, 2024)
- Cadence Collaborates with Arm to Jumpstart the Automotive Chiplet Ecosystem (Mar. 13, 2024)
- HBM3 Initially Exclusively Supplied by SK Hynix, Samsung Rallies Fast After AMD Validation, Says TrendForce (Mar. 13, 2024)
- Arteris Expands Automotive Solutions for Armv9 Architecture CPUs (Mar. 13, 2024)
- Arm Announces New Automotive Technologies to Accelerate Development of AI-enabled Vehicles by up to Two Years (Mar. 13, 2024)
- Siemens to demonstrate first pre-silicon simulation environment for Arm Cortex-A720AE for Software Defined Vehicles (Mar. 13, 2024)
- Arteris Expands Ncore Cache Coherent Interconnect IP To Accelerate Leading-Edge Electronics Designs (Mar. 13, 2024)
- We'll Need Many More Fabs to Meet $1 Trillion by 2030 Goal (Mar. 13, 2024)
- Tenstorrent and MosChip Partner on High Performant RISC-V Design (Mar 13, 2024)
- Arm's Broadest Ever Automotive Enhanced IP Portfolio Designed for the Future of Computing in Vehicles (Mar 13, 2024)
- Ecosystem Collaborations Bring Full Stack Software Solutions to Develop Leading-edge Automotive Applications From Day One (Mar 13, 2024)
- University of Western Australia Latest to Join the BrainChip University AI Accelerator Program (Mar 13, 2024)
- New accelerated modeling for automotive development is here (Mar. 13, 2024)
- Agile Analog delivers first full always-on IP subsystem (Mar. 12, 2024)
- Tiempo Secure's TESIC RISC-V IP Secure Element successfully characterized on GlobalFoundries' 22FDX technology node (Mar. 12, 2024)
- Andes Technology: Cultivating Academic Collaboration for Over a Decade with Sustainable Spirit (Mar. 12, 2024)
- Global Top 10 Foundries Q4 Revenue Up 7.9%, Annual Total Hits US$111.54 Billion in 2023, Says TrendForce (Mar. 12, 2024)
- The Imminent Arrival of 2-Nanometer Advanced Process (Mar. 12, 2024)
- Cold Spin-Electronics for Quantum Technologies (Mar. 12, 2024)
- Pasqal aims for 10,000 qbit quantum computer in 2026 (Mar. 12, 2024)
- University of Western Australia Latest to Join the BrainChip University AI Accelerator Program (Mar. 12, 2024)
- TI Commits to 100% Renewable Energy Worldwide by 2030 (Mar. 12, 2024)
- OPENEDGES and SEMIFIVE Partnership Reinforce the SoC Platform (Mar. 11, 2024)
- Re-imagining Imagination Technologies (Mar. 11, 2024)
- Alphawave Semi Demonstrates 3nm Silicon-Proven 24Gbps Universal Chiplet Express (UCIe) Subsystem for High-Performance AI Infrastructure (Mar. 11, 2024)
- Omni Design Technologies Offers Swift™ Data Converters for Advanced Software Defined Radio (SDR) Solutions (Mar. 11, 2024)
- Elevate the performance of your Automotive Application by integrating the IP cores of a 14-bit wideband Time-Interleaved Pipeline Data Converters (Mar 11, 2024)
- Free configurator puts the power of full core customisation into hands of customers (Mar. 11, 2024)
- Former Moortec executives create chip monitor startup (Mar. 11, 2024)
- CAST Adds I3C Secondary Controller Core to MIPI IP Product Line (Mar. 08, 2024)
- Credo Launches 112G PAM4 SerDes IP for TSMC N3 Process Technology (Mar. 08, 2024)
- M31's Revenue Grew Against the Trend by 18.5% Last Year and Will Increase Investment in Advanced Processes This Year (Mar 08, 2024)
- TSMC February 2024 Revenue Report (Mar 08, 2024)
- SignatureIP announces PCIe Gen 6 Controller IP (Mar. 07, 2024)
- sureCore announces ultra-low power memory IP for AI applications (Mar. 07, 2024)
- Marvell Announces Industry's First 2nm Platform for Accelerated Infrastructure Silicon (Mar. 07, 2024)
- nepes corporation expands IC packaging capabilities for the 3D-IC era with advanced design flows from Siemens (Mar. 07, 2024)
- Samsung to use recycled neon gas in chip manufacturing (Mar. 07, 2024)
- UMC Reports Sales for February 2024 (Mar. 06, 2024)
- Taalas emerges from stealth with $50 million in funding and a groundbreaking silicon AI technology (Mar. 06, 2024)
- Nuclei System Technology collaborates with Siemens to deliver RISC-V Processor Trace Encoder solution (Mar. 06, 2024)
- Imsys develops RISC-V core, looks to AI in space (Mar. 06, 2024)
- JEDEC Publishes GDDR7 Graphics Memory Standard (Mar. 06, 2024)
- Ethernovia Unveils World's First Single and Quad Port, 10G to 1G Automotive PHY in 7nm (Mar. 06, 2024)
- Flex Logix Joins Intel Foundry USMAG Alliance (Mar. 06, 2024)
- Industry Leading PPA DSP Available For All Existing EFLX eFPGA (Mar 06, 2024)
- GUC Monthly Sales Report - February 2024 (Mar 06, 2024)
- Cadence to Acquire BETA CAE, Expanding into Structural Analysis (Mar. 06, 2024)
- Niobium and Veriest collaborate to develop the world's fastest complete FHE accelerator chip (Mar 06, 2024)
- BrainChip Adds Edge Box to Chip and IP Offerings (Mar 06, 2024)
- Synopsys Supports AI-Bogged Data Centers With First 1.6T Ethernet IP (Mar. 06, 2024)
- Revolutionizing Fuel Cell Production: Fraunhofer IPA and Partners Launch H2FastCell Robotics (Mar. 06, 2024)
- QuickLogic (QUIK) Secures Five-year Contract for Its eFPGA IP (Mar. 06, 2024)
- BrainChip Boosts Space Heritage with Launch of Akida into Low Earth Orbit (Mar. 05, 2024)
- Scalable Extreme-Speed IPsec Added to Xiphera's Security Protocols Portfolio (Mar. 05, 2024)
- Semidynamics puts the power of full core customisation into hands of customers (Mar. 05, 2024)
- QuickLogic Announces eFPGA IP Contract for TSMC N12e™ Process Technology (Mar. 05, 2024)
- The promise of OTS-only memories for next-gen compute (Mar. 05, 2024)
- Agile Analog's Christelle Faucon: "Diversity and Equality Are Critical" (Mar. 04, 2024)
- Interview: Mahesh Tirupattur, executive VP of Analog Bits - "Be Passionate, Fail Fast and Recover Quick" (Mar. 04, 2024)
- Unleash Next-Gen Speeds with Silicon-Proven USB 3.0 PHY IP Cores with Type-C Support in Multiple Process Nodes (Mar. 04, 2024)
- Intel Launches Altera, Its New Standalone FPGA Company (Mar. 04, 2024)
- VeriSilicon's industry-leading embedded GPU IP powers HPMicro's high-performance HPM6800 series RISC-V MCU (Mar. 04, 2024)
- Agnisys to Showcase Expertise at DVCon US with Exclusive Short Workshop and Tutorial Sessions (Mar. 04, 2024)
- Accellera Approves Verilog-AMS 2023 Standard for Release (Mar. 04, 2024)
- Scaleway launches its RISC-V servers in the cloud, a world first and a firm commitment to technological independence (Mar. 04, 2024)
- French cloud Scaleway starts renting Alibaba's RISC-V SoC (Mar. 04, 2024)
- Siemens Unveils EcoTech Label for Enhanced Product Sustainability Transparency (Mar. 04, 2024)
- Credo to Present at 36th Annual Roth Conference (Mar. 04, 2024)
- Sondrel announces two new design contract wins plus two existing Design Consultancy contracts extended (Mar. 01, 2024)
- ADTechnology and CoSignOn/CoreLink Sign MOU to Further Collaborate on High-Bandwidth Memory for Next-Generation HPC (Mar. 01, 2024)
- Partners Applaud Intel Foundry's Wider Ecosystem Approach (Mar 01, 2024)
- European Union Seeks Chip Sovereignty Using RISC-V (Mar 01, 2024)
- Rambus Initiates Accelerated Share Repurchase Program (Mar. 01, 2024)
- proteanTecs Joins Arm Total Design, Brings Lifecycle Health and Performance Monitoring to Arm-based Custom SoCs (Feb 29, 2024)
- Cadence Expands Tensilica Vision Family with Radar Accelerator and New DSPs Optimized for Automotive Applications (Feb 29, 2024)
- VeriSilicon NPU IP is shipped in over 100 million AI-enabled chips worldwide (Feb. 29, 2024)
- Synopsys Launches Industry's First Complete 1.6T Ethernet IP Solution to Meet High Bandwidth Needs of AI and Hyperscale Data Center Chips (Feb. 29, 2024)
- Cornell Tech Joins BrainChip University AI Accelerator Program (Feb. 28, 2024)
- RAAAM™ Memory Technologies Expands Leadership Team With the Addition of Eli Leizerovitz as Chief Business Officer (Feb 28, 2024)
- QuickLogic Signs 7-Figure eFPGA IP Contract for GlobalFoundries' 12LP Process (Feb. 28, 2024)
- Ceva Joins Arm Total Design to Accelerate Development of End-to-End 5G SoCs for Infrastructure and NTN Satellites (Feb. 28, 2024)
- Intel puts 1nm process (10A) on the roadmap for 2027 - also plans for fully AI-automated factories with 'Cobots' (Feb. 28, 2024)
- Alliance to drive AI into the radio network (Feb. 28, 2024)
- Cadence Expands Tensilica Vision Family with Radar Accelerator and New DSPs Optimized for Automotive Applications (Feb. 28, 2024)
- AI for saving lives in automotive (Feb. 28, 2024)
- FPT Corporation and Siemens Forge Partnership to Revolutionize Manufacturing and Digital Transformation (Feb. 28, 2024)
- Alliance aims to drive AI into the radio network (Feb. 28, 2024)
- Tenstorrent RISC-V and Chiplet Technology Selected to Build the Future of AI in Japan (Feb. 27, 2024)
- ASICFPGA releases new advanced Demosaicing core (Feb. 27, 2024)
- LX Semicon Enters Mass Production with OPENEDGES' 22nm LPDDR4 PHY IP (Feb. 27, 2024)
- Microchip's Low-Cost PolarFire® SoC Discovery Kit Makes RISC-V and FPGA Design More Accessible for a Wider Range of Embedded Engineers (Feb. 27, 2024)
- Andes and MachineWare Collaborate on Early RISC-V Software Development for AndesCore™ AX45MPV (Feb. 27, 2024)
- Xiphera and Missing Link Electronics Announce a Partnership for Encrypted Network Accelerator Solutions (ENAS) (Feb. 27, 2024)
- EU Consortium Developing Next-Gen Edge-AI Technologies Is Accepting Design Proposals (Feb. 27, 2024)
- Intel Core Ultra Extends AI PCs to the Enterprise with New Intel vPro Platform (Feb. 27, 2024)
- Bright minds wanted for chip design in Europe (Feb. 27, 2024)
- M31 Powers Intel's IFS Alliance to Promote Advanced SoC Development and Innovation (Feb. 26, 2024)
- Ceva Introduces its Next Generation Low Power Ultra-Wideband IP for FiRa 2.0 to Provide Highly Accurate and Reliable Wireless Ranging Capabilities for Consumer and Industrial IoT Applications (Feb. 26, 2024)
- Largest CHIPS Act Awards Seen Coming for U.S. Companies (Feb 26, 2024)
- PQShield showcases high-performance PQC on AMD Versal at Mobile World Congress (Feb. 26, 2024)
- Noesis Technologies releases its Ultra High Speed FFT/IFFT processor IP Core (Feb. 26, 2024)
- Sequans Provides Statement on Renesas Termination of MOU and Announces Conference Call to Review Fourth Quarter and Full Year 2023 Results and Outlook for Full Year 2024 (Feb. 26, 2024)
- Renesas Develops Embedded MRAM Macro that Achieves over 200MHz Fast Random-Read Access and a 10.4 MB/s Fast Write Throughput for High Performance MCUs (Feb. 26, 2024)
- Microchip Launches PolarFire RISC-V and FPGA Development Board (Feb. 26, 2024)
- New Wave Design and Verification Appoints Darlene Weiss as Director of Human Resources (Feb. 26, 2024)
- Crypto Quantique IoT security solutions expands to support cellular connectivity (Feb. 26, 2024)
- Quantum Computing Insights: Exploring the Latest Breakthroughs (Feb. 26, 2024)
- TSMC Celebrates the Opening of JASM in Kumamoto, Japan (Feb. 24, 2024)
- Renesas Announces Termination of Memorandum of Understanding and Tender Offer for Proposed Acquisition of Sequans (Feb. 23, 2024)
- Weebit Nano demonstrates performance of its ReRAM under extended automotive conditions (Feb. 22, 2024)
- Arm and Nuro Partner to Deliver AI-first Autonomous Technology for Commercial Scale (Feb. 22, 2024)
- Synopsys Posts Financial Results for First Quarter Fiscal Year 2024 (Feb. 22, 2024)
- M31 Promotes Advanced SoC Development and Innovation at Intel Foundry's Direct Connect Event (Feb. 22, 2024)
- Andes Technology and MetaSilicon Collaborate to Build the World's First Automotive-Grade CMOS Image Sensor Product Using RISC-V IP SoC (Feb. 22, 2024)
- Arm Updates CSS Designs for Hyperscalers' Custom Chips (Feb. 22, 2024)
- Faraday Reports Full-Year 2023 Results (Feb. 22, 2024)
- Intel Foundry Services Head Sees Advanced Packaging as "On Ramp" to Growth (Feb. 22, 2024)
- Arteris Announces Financial Results for the Fourth Quarter and Full Year 2023 and Estimated First Quarter and Full Year 2024 Guidance (Feb. 21, 2024)
- Intrinsic ID Joins Intel Foundry Accelerator IP Alliance to Secure Leading-Edge Semiconductors (Feb. 21, 2024)
- Synopsys and Intel Foundry Accelerate Advanced Chip Designs with Synopsys IP and Certified EDA Flows for Intel 18A Process (Feb. 21, 2024)
- Analog Bits Expands Engineering Presence by Opening a Design Center in Europe (Feb. 21, 2024)
- Siemens qualifies industry-leading IC design solutions for Intel Foundry processes (Feb. 21, 2024)
- Siemens' breakthrough Veloce CS transforms emulation and prototyping with three novel products (Feb. 21, 2024)
- Siemens collaborates with Intel Foundry to contribute 3D-IC technology leadership for Intel's EMIB reference flow (Feb. 21, 2024)
- BrainChip Begins Accepting Pre-Orders of the Akida Edge AI Box (Feb. 21, 2024)
- Tessolve's Ambitious Leap: Championing RISC-V's Global Surge from India (Feb. 21, 2024)
- Taiwan's 5-Bit Superconducting Quantum Computer Goes Online (Feb. 21, 2024)
- Intel Launches World's First Systems Foundry Designed for the AI Era (Feb. 21, 2024)
- CEA-Leti Develops Novel Architecture for Keyword-Spotting (KWS) In Always-On, Voice-Activated Edge-AI Systems (Feb. 21, 2024)
- How Semiconductor Companies Can Help Drive Net Zero by 2050 (Feb. 21, 2024)
- The Future of Sustainability: How Semiconductors Pave the Way for a Stable Economy (Feb. 21, 2024)
- Vervesemi launches Made-in-India semiconductor ASIC (Feb. 21, 2024)
- Rapid Silicon Leads the Way with First Complete Open-Source FPGA EDA Tool-Chain (Feb. 20, 2024)
- IAR unveils Functional Safety version of IAR Embedded Workbench for Arm equipped with certified static analysis capabilities (Feb. 20, 2024)
- Intel and Cadence Expand Partnership to Enable Best-in-Class SoC Design on Intel's Advanced Processes (Feb. 20, 2024)
- Samsung Electronics Collaborates With Arm on Optimized Next Gen Cortex-X CPU Using Samsung Foundry's Latest GAA Process Technology (Feb. 20, 2024)
- M31 Launches PCI-SIG Certified PCIe 5.0 PHY IP, Partnering with SSD Storage Chipmaker InnoGrit to Advance the Next-Generation PCIe 5.0 (Feb. 20, 2024)
- T2M-IP Unveils the 12-bit 4Gsps ADC Silicon-Proven IP Core with Cutting-Edge Features, Silicon Proven and Ready to License (Feb. 20, 2024)
- Imec pioneers unique, low-power UWB receiver chip: 10x more resilient against Wi-Fi and (beyond) 5G interference (Feb. 20, 2024)
- Xiphera Releases High-Speed ECC Accelerator (Feb. 20, 2024)
- US awards USD 1.5 bn to GlobalFoundries for semiconductor production (Feb. 20, 2024)
- What does Renesas acquisition of PCB toolmaker Altium mean? (Feb. 19, 2024)
- Logic Fruit's ARINC Innovation Journey: Delivering Diverse Products to DRDO Labs (Feb. 19, 2024)
- Imec launches the first design pathfinding process design kit for N2 node (Feb. 19, 2024)
- GlobalFoundries and Biden-Harris Administration Announce CHIPS and Science Act Funding for Essential Chip Manufacturing (Feb. 19, 2024)
- What does Renesas' acquisition of PCB toolmaker Altium mean? (Feb. 19, 2024)
- GlobalFoundries receives funding for essential chip manufacturing (Feb. 19, 2024)
- Openedges sees revenue from TSMC foundry jump (Feb. 19, 2024)
- Arm CSA and AMBA release provide boost for chiplet ecosystem (Feb. 16, 2024)
- Quantum Experts discuss next Digital Revolution (Feb. 16, 2024)
- Samsung wins first 2 nm AI chip order from Japans PFN; a snub to TSMC (Feb. 16, 2024)
- Arm shares jump 50% on AI, China boosts to results (Feb 15, 2024)
- RISC-V Processors Addressing Edge AI Devices to Reach 129 Million Shipments by 2030 (Feb 15, 2024)
- IP block secures FPGAs with one external IC (Feb. 15, 2024)
- Blumind Harnesses Analog for Ultra Low Power Intelligence (Feb. 15, 2024)
- New Report Suggests India Can Expand Role in Global Semiconductor Value Chains with the Right Policies (Feb. 15, 2024)
- AccelerComm® Joins Open Compute Project Foundation Focusing on Evenstar Modular Open RAN Radio Unit Reference Design (Feb. 15, 2024)
- Thalia releases AMALIA 24.1 with support for 12nm FinFET, porting simulation comparisons and streamlined technology analysis reporting (Feb. 15, 2024)
- Renesas to Acquire PCB Design Software Leader Altium to Make Electronics Design Accessible to Broader Market and Accelerate Innovation (Feb. 15, 2024)
- AccelerComm® Joins Open Compute Project Foundation Focusing on Evenstar Modular Open RAN Radio Unit Reference Design (Feb 15, 2024)
- Saankhya Labs receives approval under Semiconductor Design Linked Incentive (DLI) scheme for Development of a System-on-Chip (SoC) for 5G Telecom infrastructure equipment (Feb. 14, 2024)
- OpenTitan® Partnership Makes History as First Open-Source Silicon Project to Reach Commercial Availability (Feb. 14, 2024)
- Ceva, Inc. Announces Fourth Quarter and Full Year 2023 Financial Results (Feb. 14, 2024)
- zeroRISC, Nuvoton and Winbond Join Forces to Deliver the First Commercial Product Based on the OpenTitan® Open-Source Secure Silicon Platform (Feb. 14, 2024)
- OpenTitan® Partnership Makes History as First Open-Source Silicon Project to Reach Commercial Availability (Feb 14, 2024)
- Logic Fruit Welcomes Vishal Sinha as a People Management Consultant (Feb. 14, 2024)
- ARM bids for chiplet dominance (Feb. 14, 2024)
- Cadence Reports Fourth Quarter and Fiscal Year 2023 Financial Results (Feb. 13, 2024)
- Join Secure-IC at Mobile World Congress 2024 to discover our cutting-edge solutions for mobile and connectivity (Feb. 13, 2024)
- EdgeQ Deploys Arteris IP for its 5G+AI Base Station-on-a-Chip for Wireless Infrastructure (Feb. 13, 2024)
- What Role Will Open-Source Development Play in Quantum Computing? (Feb. 13, 2024)
- Biden-Harris Administration Announces Over $5 Billion from the CHIPS and Science Act for Research, Development, and Workforce (Feb. 12, 2024)
- Alphawave Semi Announces Appointment of Charlie Roach as Chief Revenue Officer (Feb. 12, 2024)
- Flex Logix Joins Intel Foundry Services Accelerator IP Alliance to Enable Fast, Low Power, Reconfigurable SoC's (Feb. 12, 2024)
- T2M is excited to announce the successful licensing of our partner's Silicon-Proven 1G Ethernet PHY IP Cores on a Tier-1 Foundry in Korea, using the advanced 14LPP process, in collaboration with a leading Tier-1 Korean customer (Feb. 12, 2024)
- Qualcomm asks Samsung Foundry and TSMC to each build 2nm Snapdragon 8 prototypes (Feb. 12, 2024)
- The next frontier in semiconductor innovation: Chiplets and the rise of 3D-ICs (Feb. 12, 2024)
- Cadence and Dassault Systemes Unveil the First Cloud-Enabled, Collaborative Experience to Transform the Development of Electromechanical Systems (Feb. 12, 2024)
- DesignEuropa Awards 2024: Celebrating Europe's Creativity, Innovation, and Sustainability (Feb. 12, 2024)
- Xiphera Receives Its First US Patent (Feb. 09, 2024)
- Fraunhofer IIS Director Albert Heuberger Defines Germany's Semiconductor Industry (Feb. 09, 2024)
- Arm shares jump 50% on AI, China boosts to results (Feb. 09, 2024)
- Dolphin Design announces the successful launch of its first silicon tape out in 12nm FinFet (Feb. 08, 2024)
- Kalray and Arm to collaborate to bring data intensive processing and AI acceleration DPU solutions to the global Arm ecosystem (Feb. 08, 2024)
- Innatera Productizes SNN Accelerator As "Neuromorphic Microcontroller" (Feb. 08, 2024)
- Post-Quantum Cryptography Alliance Launches to Advance Post-Quantum Cryptography (Feb. 08, 2024)
- Samsung Announces 2nm AI Chip Deal With HBM3 Memory (Feb. 08, 2024)
- SK hynix, TSMC Form AI Semiconductor Alliance: Challenge to Samsung Electronics? (Feb. 08, 2024)
- Worldwide Silicon Wafer Shipments and Revenue Fall in 2023, SEMI Reports (Feb 07, 2024)
- VeriSilicon and Innobase jointly launch a 5G RedCap/4G LTE dual-mode modem solution (Feb. 07, 2024)
- TSMC January 2024 Revenue Report (Feb 07, 2024)
- SMIC Reports 2023 Fourth Quarter Results (Feb 07, 2024)
- SK hynix shows roadmap for using recycled materials (Feb. 07, 2024)
- ESK-SIC and Kyocera to cooperate on sustainable production of silicon carbide (Feb. 07, 2024)
- UMC Reports Sales for January 2024 (Feb. 06, 2024)
- Movellus Recognized by Frost & Sullivan for Improving System Performance and Optimizing Power with Its Aeonic™ IP Portfolio (Feb. 06, 2024)
- SKAIChips License Ceva Bluetooth IP for Electronic Shelf Label IC (Feb. 06, 2024)
- Tenstorrent Selects Blue Cheetah Chiplet Interconnect IP For Its AI and RISC-V Solutions (Feb. 06, 2024)
- Arasan's 2nd Gen CAN IP achieves ISO26262 ASIL-C Certification (Feb. 06, 2024)
- Rambus Reports Fourth Quarter and Fiscal Year 2023 Financial Results (Feb. 06, 2024)
- Movellus Recognized by Frost & Sullivan for Improving System Performance and Optimizing Power with Its Aeonic™ IP Portfolio (Feb 06, 2024)
- Trilinear Technologies Accelerates Innovation in Automotive Display Connectivity with DisplayPort Automotive Extensions Standard (DP AE) (Feb 06, 2024)
- Socionext showcase cutting-edge SoC solutions at Embedded World 2024 (Feb 06, 2024)
- Intel Foundry Announces 18A Design Win for 64-Core Arm SoC (Feb. 06, 2024)
- Why China is betting big on chiplets (Feb. 06, 2024)
- Innatera Productizes SNN Accelerator As 'Neuromorphic Microcontroller' (Feb. 06, 2024)
- Bridges of Innovation: Fraunhofer IPMS and NY CREATES strengthen cooperation (Feb. 06, 2024)
- IMEC to site R&D fab in Malaga, Spain, say reports (Feb. 06, 2024)
- Siemens brings the power of multi-discipline simulation to axial flux motor development for next-generation EVs (Feb. 06, 2024)
- Nordic Semiconductor and Arm reaffirm partnership with licensing agreement for latest low power processor designs, software platforms, and security IP (Feb. 05, 2024)
- GUC Monthly Sales Report - January 2024 (Feb. 05, 2024)
- Elevate Your Display and Camera SOC Capabilities with our latest Silicon Proven MIPI C-D Combo Tx/Rx PHY and DSI Controller IP Cores (Feb. 05, 2024)
- Faraday Announces Plans to Develop Arm-based 64-core SoC on Intel 18A Technology (Feb. 05, 2024)
- Eliyan Sets New Standard for Chiplet Interconnect Performance with Latest PHY Delivering Data Rate of 64Gbps on 3nm Process Using Standard Packaging (Feb. 05, 2024)
- syn1588® IP Cores: Setting the Gold Standard in Precision for Clock Synchronization (Feb 05, 2024)
- YorChip announces partnership with Digitho for enabling Secure Chiplets (Feb. 05, 2024)
- Global Semiconductor Sales Decrease 8.2% in 2023; Market Rebounds Late in Year (Feb. 05, 2024)
- AccelerComm Launches PUSCH Channel Simulator for 5G L1 Performance Evaluation (Feb. 05, 2024)
- Samsung Receives Maiden 2nm AI Accelerator Order, Including HBM and Advanced Packaging (Feb. 05, 2024)
- NoC configuration tool takes makes complex SoC design easier (Feb. 05, 2024)
- Eliyan Breaks Chiplet Memory Wall With Standard Packaging (Feb. 05, 2024)
- Nordic Semiconductor signs multi-year deal to use Arm IP (Feb. 05, 2024)
- Both Samsung and TSMC will be keeping 2nm chip manufacturing in their home countries (Feb. 03, 2024)
- SignatureIP launches its new iNoCulator NoC configuration tool with a free trial offer (Feb. 02, 2024)
- Tenstorrent Engineers Talk Open-Sourced Bare-Metal Stack (Feb. 02, 2024)
- Cadence Unveils Millennium Platform - Industry's First Accelerated Digital Twin Delivering Unprecedented Performance and Energy Efficiency (Feb. 02, 2024)
- Codasip achieves certification for automotive functional safety and cybersecurity (Feb. 01, 2024)
- BellSoft releases Liberica JDK 21 for RISC-V with support (Feb. 01, 2024)
- Marquee Semiconductor Engages Industry Veteran Gideon Intrater as Strategic Advisor (Feb. 01, 2024)
- Wi-Fi Certified 7 Is Here. A Wave of Qualified Products Follow Suit (Feb. 01, 2024)
- Women in Electronics - Challenges Remain (Feb. 01, 2024)
- Nubis Communications and Alphawave Semi Showcase First Demonstration of Optical PCI Express 6.0 Technology (Jan. 31, 2024)
- Alphawave Semi and Teledyne LeCroy Unveil PCIe 7.0 Signal Generation and Measurement (Jan. 31, 2024)
- Navigating the RISC-V Revolution in Europe (Jan. 31, 2024)
- Satisfy Your Chiplet Craving at the Chiplet Summit (Jan. 31, 2024)
- Cadence Significantly Advances ECAD/MCAD Convergence for Electronic Systems with New Celsius Studio AI Thermal Platform (Jan. 31, 2024)
- Introduction to AccelerComm© PUSCH Channel End-to-End Simulator (Jan. 31, 2024)
- Europe's home-grown processor (Jan. 31, 2024)
- Synopsys Inaugurates Chip Design Center in Noida (Jan. 31, 2024)
- DCD celebrates 25 years (Jan. 30, 2024)
- Arteris Selected by Rain AI for Use in the Next Generation of AI (Jan. 30, 2024)
- Alphawave Semi and proteanTecs Collaborate to Provide System Insights and Analytics for Custom Silicon and Chiplets (Jan. 30, 2024)
- Device and Data Security in the Embedded Systems (Jan. 30, 2024)
- Intel Plans to Utilize TSMC's 2nm Technology in Its New Nova Lake Processor (Jan. 30, 2024)
- T2M-IP Unveils Best-Selling DVB-T2/T Demodulator IP Core with Cutting-Edge Features, Silicon Proven and Ready to License (Jan. 29, 2024)
- INTERCHIP achieves 3x faster verification for next-gen clocking oscillator with Siemens' advanced analog and mixed-signal EDA technology (Jan. 29, 2024)
- Silvaco Joins GaN Valley™, a Wide Bandgap Semiconductor Innovation Ecosystem in Europe (Jan. 29, 2024)
- TASKING Supports Arm Architecture for Automotive Development (Jan. 29, 2024)
- Strengthening the security of broadband 5G/6G communication networks (Jan. 29, 2024)
- AMIQ EDA Releases Major Customer-Focused Product Line Update (Jan 26, 2024)
- CEO Interview: Charlie Janac of Arteris -- "Pick a Viable Path, Don't Give Up" (Jan. 26, 2024)
- Beyond Silicon: New Sustainable Method for Creating Organic Semiconductors (Jan. 26, 2024)
- Siemens-Heineken Partnership & Digital Twin Decarbonisation (Jan. 26, 2024)
- eMemory's Security-Enhanced OTP Qualifies on TSMC N4P Process, Pushing Forward in High-Performance Leading Technology (Jan. 25, 2024)
- Solving the decarbonization equation (Jan. 25, 2024)
- Frontgrade Gaisler and RISC-V's Space Journey (Jan 25, 2024)
- Xylon's logicBRICKS HDR ISP IP Suite Gets an RGB-IR Image Processing Upgrade (Jan. 25, 2024)
- Qualinx partners with EU Space Agency to develop a GNSS receiver for a service to detect spoofing and boost resilience (Jan. 25, 2024)
- China ten years behind and staying there (Jan. 25, 2024)
- Logic Fruit Technologies Launches FlexRay RTL IP CORE (Jan. 25, 2024)
- Intel and UMC Announce New Foundry Collaboration (Jan. 25, 2024)
- Keysight Introduces Chiplet PHY Designer for Simulating D2D to D2D PHY IP Supporting the UCIe™ Standard (Jan. 24, 2024)
- Report: Apple will be first to receive TSMC's 2nm chips starting in 2025 (Jan. 24, 2024)
- SoC design: When a network-on-chip meets cache coherency (Jan. 24, 2024)
- Menta exhibits at Chiplet Summit and presents its new scalable chiplet platform, MOSAICS-LP (Jan. 23, 2024)
- Infineon and GlobalFoundries extend long-term agreement with focus on automotive microcontrollers (Jan. 23, 2024)
- Revolutionizing ProAV Networks: intoPIX Unveils TicoXS FIP for Unmatched 4K & 8K AVoIP Excellence at ISE 2024 (Jan. 23, 2024)
- Sondrel completes a multi-billion transistor chip design at 5nm (Jan. 23, 2024)
- Strengthening the security of broadband 5G/6G communication networks (Jan. 23, 2024)
- Phison Deploys Cadence Cerebrus AI-Driven Chip Optimization to Accelerate Product Development (Jan. 23, 2024)
- Siemens brings thermal digital twin technology to the electronics supply chain (Jan. 23, 2024)
- EU Commission readies establishment of AI Office (Jan. 23, 2024)
- Get Rolling: Automotive AI and ADAS Innovations (Jan. 23, 2024)
- Thales and Quantinuum Launch Starter Kit to help Enterprises prepare for Post-Quantum Cryptography Changes Ahead (Jan. 23, 2024)
- Canada Feeling Out Its Role in Global Chip Supply Chain (Jan. 23, 2024)
- Marquee Semiconductor Engages Industry Veteran Gideon Intrater as Strategic Advisor (Jan. 23, 2024)
- T2M Unveils ASIL B-Certified CAN and LIN IP Cores, Securing 11 Licenses in 2023 (Jan. 22, 2024)
- Alphawave Semi - Q4 2023 Trading and Business Update (Jan. 22, 2024)
- Samsung's 2nd-Gen 3nm Process, SF3, Has Begun Trial Production (Jan. 21, 2024)
- Cadence Unveils New Palladium Z2 Apps with Industry's First 4-State Emulation and Mixed-Signal Modeling to Accelerate SoC Verification (Jan. 19, 2024)
- TSMC Reports Fourth Quarter EPS of NT$9.21 (Jan. 19, 2024)
- AI to drive strong chip market growth in 2024, says TSMC (Jan. 19, 2024)
- Samsung and TSMC competing to dominate 2nd-gen 3nm at global foundry industry (Jan. 18, 2024)
- ITRI and TSMC Collaborate on Advancing High-Speed Computing with SOT-MRAM (Jan. 18, 2024)
- Frontgrade Gaisler and RISC-V's Space Journey (Jan. 18, 2024)
- NVM Express Announces the Release of the Computational Storage Feature (Jan. 17, 2024)
- BrainChip and MYWAI Partner to Deliver Next-Generation Edge AI Solutions (Jan. 17, 2024)
- POLYN Announces Agreement with SkyWater Technology to Produce its First Commercial Voice Processing Chip (Jan 17, 2024)
- Innatera unveils its groundbreaking ultra-low power neuromorphic microcontroller (Jan. 17, 2024)
- OIF Unveils CEI-112G-XSR+-PAM4 Extended Extra Short Reach Implementation Agreement, Paving the Way for Advanced Interconnectivity (Jan. 17, 2024)
- Innatera shows RISC-V neuromorphic edge AI microcontroller (Jan. 17, 2024)
- YorChip, Inc. announces its first Chiplet for Edge AI applications with IP licensed from Semidynamics, the leader in RISC-V IP based in Barcelona (Jan. 17, 2024)
- Brian Philofsky Joins Flex Logix As Senior Director Of Solutions Architecture (Jan. 17, 2024)
- How Synopsys' acquisition of Ansys could streamline design and simulation (Jan. 17, 2024)
- Soitec Implements Water Reuse in Wafer Fabs (Jan. 17, 2024)
- India's Electric Vehicle (EV) Ecosystem (Jan. 17, 2024)
- MIPS Aims to Give Back Control, for AI-Centric Compute (Jan. 16, 2024)
- Chiplet Makers Expect to Disrupt Incumbents (Jan. 16, 2024)
- Synopsys to Acquire Ansys, Creating a Leader in Silicon to Systems Design Solutions (Jan. 16, 2024)
- Gartner Says Worldwide Semiconductor Revenue Declined 11% in 2023 (Jan. 16, 2024)
- proteanTecs Launches Power Reduction Solution for High Performance Markets (Jan. 16, 2024)
- Video: Leveraging the RISC-V efficient trace (E-Trace) standard (Jan. 16, 2024)
- Digital Blocks AMBA Multi-Channel DMA Controller IP Core Family Extends Leadership with releases for core DMA Engines in RISC-V® & ARM® Systems and Peripherals to Memory Applications (Jan. 15, 2024)
- Unveiling a Cutting-Edge 12-bit 5Msps SAR ADC IP Core - Industry-Leading Features, Silicon Proven, and Available for Licensing Now (Jan. 15, 2024)
- Digital Blocks AMBA Multi-Channel DMA Controller IP Core Family Extends Leadership with releases for core DMA Engines in RISC-V® & ARM® Systems and Peripherals to Memory Applications (Jan 15, 2024)
- EdgeCortix Expands Leadership Team with Semiconductor Industry Veteran Tim Vehling as Executive Vice President of Global Sales (Jan. 15, 2024)
- EnSilica adds Post Quantum Cryptography support to eSi-Crypto IP library (Jan. 15, 2024)
- Crypto Quantique and iMQ to enable quantum secure chip-to-cloud connection (Jan. 15, 2024)
- Unveiling Sonata: Affordable CHERI Hardware for Embedded Systems (Jan. 15, 2024)
- High-bandwidth memory (HBM) options for demanding compute (Jan. 15, 2024)
- Davos: HCLTech CSO Jayaram on Need for Sustainability Speed (Jan. 15, 2024)
- Are Low Carbon Nanomaterials the Key to a Greener Tomorrow? (Jan. 15, 2024)
- Cadence Wins TCSA Top 10 Foreign Sustainable Model Companies Award (Jan. 15, 2024)
- Media Alert: Rambus to Announce Fourth Quarter and Fiscal Year 2023 Results (Jan. 15, 2024)
- Google to Samsung: Circular Tech Strategies Unveiled at CES (Jan. 14, 2024)
- Chip wars: How 'chiplets' are emerging as a core part of China's tech strategy (Jan. 13, 2024)
- Crypto Quantique joint venture with iMQ Technology to enable Quantum Secure Chip-to-cloud Connection (Jan. 12, 2024)
- [CES 2024] Samsung to continue investing in HBM in 2025 (Jan. 12, 2024)
- Edge-side AI audio processor now features RISC-V AndesCore D25F (Jan. 12, 2024)
- An Open Platform for Software-Defined Vehicles: Expectations vs. Reality (Jan. 12, 2024)
- Digital Core Design Presents D68000-CPU32+ for well-known 68k family (Jan. 11, 2024)
- Crypto Quantique partners with Blaitek to enable quantum secure chip-to-cloud connection (Jan. 11, 2024)
- EU quantum researchers set to give up IP rights in standard-setting race (Jan. 11, 2024)
- Atmosic Introduces the Multiprotocol ATM34/e Series Adding 802.15.4 Support for Thread and Matter to its Bluetooth LE Portfolio (Jan. 10, 2024)
- CEO interview: MIPS' Sameer Wasson on a RISC-V reboot (Jan. 10, 2024)
- Packetcraft and Synopsys Collaborate to Deliver Turnkey Bluetooth Qualified 5.4 PAwR and LE Audio Solutions (Jan. 10, 2024)
- Global Semiconductor Sales Increase 5.3% Year-to-Year in November (Jan. 10, 2024)
- TSMC December 2023 Revenue Report (Jan. 10, 2024)
- SCALINX, Leading Fabless Semiconductor in System-on-a-Chip Design, Secures €34 Million in Second Round Funding (Jan. 10, 2024)
- CXL Overcomes Hierarchical Routing Limits (Jan. 10, 2024)
- GUC Tapes Out Complex 3D Stacked Die Design on Advanced FinFET Node Using Cadence Integrity 3D-IC Platform (Jan. 10, 2024)
- Sunplus and Ceva Expand Collaboration to Bring Bluetooth Audio to the airlyra SoC Family for Wireless Speakers, Soundbars and other Wireless Audio Devices (Jan. 10, 2024)
- intoPIX Showcases Groundbreaking Sensorand Video Compression Technologies at CES 2024 (Jan. 10, 2024)
- Ceva and Actions Technology Commemorate Landmark Achievement, Surpassing 100 Million Ceva-Powered Wireless Audio and AIoT Processors Shipped (Jan. 10, 2024)
- SCALINX, Leading Fabless Semiconductor in System-on-a-Chip Design, Secures €34 Million in Second Round Funding (Jan 10, 2024)
- Intel, Samsung, TSMC 'Getting Serious' About CFET (Jan. 10, 2024)
- Intel buys Silicon Mobility alongside automotive chiplet push (Jan. 10, 2024)
- Crypto Quantique and iMQ to enable quantum secure ship-to-cloud connection (Jan. 10, 2024)
- NFC Forum Supports Emerging Regulatory Requirements for Sustainable Product Development (Jan. 10, 2024)
- VeriSilicon's 2nd generation automotive ISP series IP passed ISO 26262 ASIL B and ASIL D certifications (Jan. 09, 2024)
- Valens Semiconductor and Intel Foundry Services Announce Strategic Relationship for Next Generation A-PHY Product (Jan. 09, 2024)
- Comcores JESD204D IP core conforming to the Revision D of the JESD204 standard released in Dec'2023 now available (Jan. 09, 2024)
- MIPS Launches New Corporate Brand At CES 2024 (Jan. 09, 2024)
- Ceva and THX Ltd. Partner to Bring Premium Spatial Audio to Hearables, Consumer and Mobile Products (Jan. 09, 2024)
- Semiconductor Market: Rebound Expected in 2024, But Challenges Lie Ahead (Jan. 09, 2024)
- GUC Taped Out UCIe 32G IP using TSMC's 3nm and CoWoS Technology (Jan. 09, 2024)
- VeriSilicon extends watch GUI ecosystem in partnership with QDay Technology for enhanced user experience (Jan. 09, 2024)
- Thalia's AMALIA qualified on 12nm FinFET technology (Jan. 09, 2024)
- Andes Technology and Spacetouch Collaborate to Unveil High-Tech Edge-Side AI Audio Processor Featuring the Powerful RISC-V AndesCore™ D25F (Jan. 09, 2024)
- GlobalFoundries and Keppel sign Multi-Year Power Purchase Agreement (Jan. 09, 2024)
- The SHD Group Has Released a Complimentary Version of the 2024 RISC-V Market Analysis Report Containing Current Market Data and Future Projections (Jan. 08, 2024)
- DisplayPort v1.4 Tx PHY and Controller IP Cores which is Silicon proven in 12nm technology and also production proven is available for Worldwide instant licensing (Jan. 08, 2024)
- OPENEDGES Achieves ISO9001: 2015 Certification, Proving IP Quality for its Customers (Jan. 08, 2024)
- Cadence Acquires Invecas to Accelerate System Realization (Jan. 08, 2024)
- Creonic GmbH Joins the Science and Innovation Alliance Kaiserslautern (Jan. 08, 2024)
- VeriSilicon unveils the new VC9800 IP for next generation data centers (Jan. 08, 2024)
- Ceva Expands AI Ecosystem for its Class-Leading NPU IP with New Partnerships for Automotive and Edge AI (Jan. 08, 2024)
- Electronic System Design Industry Posts Record $4.7 Billion in Revenue in Q3 2023, ESD Alliance Reports (Jan. 08, 2024)
- Ceva and India's No. 1 Audio and Wearable Brand, boAt, Announce Strategic Partnership to Enhance the Wireless Audio Experience (Jan. 08, 2024)
- Comcores JESD204D IP core confirming to the Revision D of the JESD204 standard released in Dec'2023 now available (Jan. 08, 2024)
- BrainChip and NVISO Group Demonstrate AI-Enabled Human Behavioral Analysis at CES 2024 (Jan. 08, 2024)
- China Is All In on a RISC-V Future (Jan. 08, 2024)
- CES 2024: Siemens delivers innovations in immersive engineering and artificial intelligence to enable the industrial metaverse (Jan. 08, 2024)
- UMC Reports Sales for December 2023 (Jan. 05, 2024)
- Andes Announces General Availability of the New RISC-V Out-Of-Order Superscalar Multicore Processor, the AndesCore™ AX65 (Jan. 05, 2024)
- GUC Monthly Sales Report - December 2023 (Jan. 05, 2024)
- Omni Design Technologies Unveils Next-Gen LiDAR Solutions with Swift? Data Converters (Jan. 05, 2024)
- Socionext to Showcase Leading-Edge Technologies at CES 2024, Featuring Custom SoC Solutions, Low Power Sensors, Smart Display Controller, and Advanced Image Processor (Jan. 05, 2024)
- Omni Design Technologies Unveils Next-Gen LiDAR Solutions with Swift™ Data Converters (Jan 05, 2024)
- Sustainability is the future for industry (Jan. 05, 2024)
- MIPS Inc. (San Jose, Calif.) has recruited Drew Barbier and Brad Burgess to its leadership team, both formerly with RISC-V pioneer SiFive Inc. (Jan. 04, 2024)
- MIPS recruits former senior SiFive execs to boost RISC-V play (Jan. 04, 2024)
- German Court Fines Netflix €7.05 Million for Continued Infringement of Broadcom HEVC Patent (Jan 04, 2024)
- VESA Updates Adaptive-Sync Display Standard with New Dual-Mode Support (Jan. 04, 2024)
- Faraday Collaborates in Arm Total Design to Provide Arm Neoverse CSS-based Design Services (Jan. 04, 2024)
- BrainChip to Unveil Akida Neuromorphic Processor Enabled by Microchip's 32-bit MPU at CES 2024 (Jan. 04, 2024)
- MulticoreWare and Imagination collaboration accelerates automotive compute workloads (Jan. 04, 2024)
- Korea's AI chip companies gear up for CES 2024 (Jan. 04, 2024)
- Arm PCs Get a New Lease on Life (Jan. 03, 2024)
- Global Semiconductor Capacity Projected to Reach Record High 30 Million Wafers Per Month in 2024, SEMI Reports (Jan. 03, 2024)
- M31 Successfully Validates 12nm USB4 PHY IP Empowering Next-Generation High-Speed Data Transmission (Jan. 03, 2024)
- Ceva Extends its Connect IP Portfolio with Wi-Fi 7 Platform for High-End Consumer and Industrial IoT (Jan. 03, 2024)
- MIPS Welcomes New Executives as Part of Company's Growth and Expansion (Jan. 03, 2024)
- Intel and DigitalBridge Launch Articul8, an Enterprise Generative AI Company (Jan. 03, 2024)
- MIPS snags top SiFive brains to amp up RISC-V business (Jan. 03, 2024)
- Siemens EDA faces Chinese startup competitor (Jan. 02, 2024)
- Accelerate Innovation: Harnessing the Speed of Tomorrow with PCIe Gen 4 PHY and Controller IP Cores (Jan. 02, 2024)
- ELECTRA IC Marks a Decade of Design and Verification Excellence at CES 2024 (Jan. 02, 2024)
- Ventana Microsystems Drives India's Chiplet Innovation in 2024 (Jan. 02, 2024)
- 3 trends for 2024: AI drives more edge intelligence, RISC-V, & chiplets (Jan. 02, 2024)
- Taiwan Holds First 5G-ACIA General Assembly (Jan. 02, 2024)
- MEDIA ALERT: Rambus to Present at 26th Annual Needham Growth Conference (Jan. 02, 2024)
- Samsung, Korean conglomerates prioritize AI innovation, sustainability in 2024 (Jan. 02, 2024)
- Ventana Microsystems Drives India's Chiplet Innovation in 2024 (Jan. 02, 2024)
- Electromobility: second life for electric motors (Jan. 02, 2024)
- TSMC reaffirms path to 1-nm node by 2030 on track (Jan. 01, 2024)
- Quantum's threat to encryption is the new Y2K threat (Jan. 01, 2024)
- U.K. Conference Accelerates Post-Quantum Cryptography Standards Review Process (Dec. 29, 2023)
- BrainChip Awarded Latest Patent for Event-Based Pattern Detection (Dec. 29, 2023)
- Samsung Seen Stumbling at Silicon's Leading Edge (Dec. 29, 2023)
- PCIe 6.0 moves closer to arriving in the market in 2024: Alphawave demonstrates interoperability (Dec. 29, 2023)
- Fraunhofer IIS joins Sonical's Headphone 3.0 platform (Dec. 29, 2023)
- Led by automakers, 12 companies in Japan form Advanced SoC Research for Automotive (Dec. 29, 2023)
- Rambus Advances Data Center Server Performance with Industry-First Gen4 DDR5 RCD (Dec. 28, 2023)
- Can There Be Any Doubt? In Our Industry, 2023 Was 'The Year of AI' (Dec. 28, 2023)
- Established "Advanced SoC Research for Automotive" with 12 companies, led by automotive manufacturers (Dec. 28, 2023)
- Samsung Press Conference at CES 2024: Connectivity in the Age of AI (Dec. 28, 2023)
- Can There Be Any Doubt? In Our Industry, 2023 Was 'The Year of AI' (Dec. 27, 2023)
- Samsung, Intel Gear Up for Intense Competition in 2-NM Semiconductor Process, Chasing TSMC (Dec. 26, 2023)
- Europe Aims for Leadership Role in Quantum Computing (Dec. 26, 2023)
- Outlook 2024: 6 ways tech will play a role in sustainability (Dec. 26, 2023)
- The green revolution runs on chips - but there is no good way to make the fragile semiconductors ecosystem sustainable in the short term (Dec. 26, 2023)
- Synopsys plus Ansys: The making of an EDA giant? (Dec. 26, 2023)
- Samsung Delays Mass Production at New Texas Fab to 2025 (Dec. 26, 2023)
- Five Leading Semiconductor Industry Players Incorporate New Company, Quintauris, to Drive RISC-V Ecosystem Forward (Dec. 22, 2023)
- Tiempo Secure's Unique IP Expertise Required to Secure First Post Quantum Sovereignty Chip (Dec. 21, 2023)
- XYALIS unveils Hartroid: A Strategic Initiative to Counter Hardware Trojans in Defense Systems (Dec. 21, 2023)
- Synopsys Acquires RISC-V Processor Simulation Tools Firm (Dec. 21, 2023)
- Cadence AI-Driven Multiphysics System Analysis Solution Enables Wistron to Dramatically Accelerate Product Development (Dec. 21, 2023)
- Is Software and Hardware Ready for TinyML Tsunami? (Dec 21, 2023)
- Quantum predictions for 2024 (Dec. 21, 2023)
- Next Up: Internet of Energy (Dec. 21, 2023)
- Silvaco Successfully Concludes Its Global Users Event (SURGE) With Over 1000 End-Users and Prospects in Attendance (Dec. 21, 2023)
- Top Ten IC Design Houses Ride Wave of Seasonal Consumer Demand and Continued AI Boom to See 17.8% Increase in Quarterly Revenue in 3Q23, Says TrendForce (Dec. 20, 2023)
- GlobalLogic Announces Acquisition of Mobiveil (Dec. 20, 2023)
- TSMC Announces Dr. Mark Liu Not to Participate in Next Board of Directors Election (Dec. 20, 2023)
- Reed Solomon Encoder and Decoder FEC IP Core From Global IP Core (Dec. 20, 2023)
- Siemens collaborates with sureCore and Semiwise to pioneer quantum computing ready cryogenic semiconductor designs (Dec. 20, 2023)
- Samsung Seen Stumbling at Silicon's Leading Edge (Dec. 20, 2023)
- SensiML launches Data Studio - sensor data management for AI/ML (Dec. 20, 2023)
- Intel Announces the Company's Largest Architectural Change in 40 Years (Dec. 20, 2023)
- 2023 in Review: AI Takes Center Stage in the Eternal Quest for Innovation (Dec. 20, 2023)
- 2023 MRAM Forum Shows MRAM For Automotive And Other Applications (Dec. 20, 2023)
- VeriSilicon and Google Collaborate on the Open-Source Project Open Se Cura (Dec. 19, 2023)
- ST Engineering Acquires D'Crypt to Strengthen its Cyber Capabilities (Dec. 19, 2023)
- Takashi Yamada, Memory Industry Expert Joins OPENEDGES to Lead Japan Business (Dec. 19, 2023)
- Intrinsic ID to Showcase New Embedded Security Solutions at CES 2024 (Dec. 19, 2023)
- BrainChip and Unigen Partner to Deliver Powerful, Energy-Efficient Edge AI Server (Dec. 18, 2023)
- Infineon, POLYN to Collaborate on Advanced Tire Monitoring Products (Dec. 18, 2023)
- Igniting Innovation: Siemens EDA launches Cre8Ventures in support of the EU Chips Act (Dec. 18, 2023)
- Apple-TSMC-Amkor Pact Bolsters U.S. Chip Supply Chain (Dec. 18, 2023)
- World's first UCIe heterogeneous chiplet test chip (Dec. 18, 2023)
- Infineon commits to set a science-based target and expands its climate strategy towards the supply-chain (Dec. 18, 2023)
- Siemens to tap EU chip cash with Cre8Ventures (Dec. 18, 2023)
- BrainChip and Unigen Partner to Deliver Powerful, Energy-Efficient Edge AI Server (Dec. 17, 2023)
- Siemens honours its best Inventors of 2023 (Dec. 16, 2023)
- Alphawave Semi Partners with Keysight to Deliver Industry Leading Expertise and Interoperability for a Complete PCIe 6.0 Subsystem Solution (Dec. 15, 2023)
- BrainChip Previews Industry's First Edge Box Powered by Neuromorphic AI IP (Dec. 15, 2023)
- BSC presents Sargantana, the new generation of the first open-source chips designed in Spain (Dec. 15, 2023)
- CEA-Leti Reports Breakthrough 3D Sequential Integration (3DSI) Of CMOS Over CMOS with Advanced Metal Lines (Dec. 15, 2023)
- Creonic GmbH Introduces Advanced 5G LDPC Encoder IP core for Enhanced Mobile Broadband Connectivity (Dec. 14, 2023)
- PUFsecurity and Himax Prioritize User Security and Data Protection in Endpoint AI with PUF-based Root of Trust (Dec. 14, 2023)
- Imec's extremely scaled SOT-MRAM devices show record low switching energy and virtually unlimited endurance (Dec. 14, 2023)
- GigaDevice partners with SEGGER on Embedded Studio for RISC-V (Dec. 14, 2023)
- China and US Bolster Semiconductor Independence as Taiwan's Foundry Capacity Share Projected to Decline to 41% by 2027, Says TrendForce (Dec. 14, 2023)
- QC Design announces launch of fault-tolerance design automation tool Plaquette+ and first sale to QuiX Quantum (Dec. 14, 2023)
- Neurxcore leverages Aedvices VIPs for the verification of its neural processors (Dec. 14, 2023)
- Cadence Managed Cloud Service Drives Automotive Sensor Solutions for Murata Finland (Dec. 14, 2023)
- Renesas Launches Cloud-Based Environment to Accelerate Automotive AI Software Development and Evaluation (Dec. 14, 2023)
- Alchip Unveils AI 3DIC Design and IP Platform (Dec. 13, 2023)
- Xylon Offers ARTIEYE - a Complete Technology Suite for Customizable AI-based Driver Monitoring Systems (Dec. 13, 2023)
- Free development tools for Gigadevice RISC-V microcontrollers (Dec. 13, 2023)
- BrainChip Second-Gen Architecture: Transformers, TENNs and STDP (Dec. 13, 2023)
- ST announces Edge AI Suite for Arm Cortex-M microcontrollers, sensors, and so on (Dec. 13, 2023)
- Maximize uptime, capacity utilization, and energy efficiency with always-ready CFD models and data center digital twin technology (Dec. 13, 2023)
- Visit Quadric at CES to Discover the GPNPU that Solves The Biggest ML Inference Chip Design Challenges (Dec. 12, 2023)
- Andes Awards Imperas 2023 Partner of the Year (Dec. 12, 2023)
- Digital Core Design Presents DAES XTS Cryptographic CPU for Unparalleled Security (Dec. 12, 2023)
- Rambus Wins 2023 "Most Respected Emerging Public Semiconductor Company" Award from Global Semiconductor Alliance (Dec. 12, 2023)
- Continental and Synopsys Provide Vehicle Digital Twin Capabilities to Accelerate Software Development (Dec. 12, 2023)
- AccelerComm Expands LDPC Accelerator IP Licenses for 5G Cloud RAN High-Capacity Solutions (Dec. 12, 2023)
- SCALINX and Arteris Partner on Advanced Communications Innovation (Dec. 12, 2023)
- Logic Fruit Technologies Launches CAN Controller IP Core (Dec. 12, 2023)
- 12-bit 2GS/s high-speed ADC IP Core with Seamless Integration, Ultimate Precision is ready for Immediate Licensing (Dec. 11, 2023)
- NEO Semiconductor Releases Technology CAD (TCAD) Simulation Data for Ground-Breaking 3D X-DRAM (Dec 11, 2023)
- China Continues to Enhance AI Chip Self-Sufficiency, but High-End AI Chip Development Remains Constrained, Says TrendForce (Dec. 11, 2023)
- EnSilica enters strategic partners with design and custom module developer IndesmaTech (Dec. 11, 2023)
- Imec Presents Fundamentally New Way to Render Colors with Sub-micron Pixel Sizes that Revolutionizes Camera Performance (Dec. 11, 2023)
- Infineon is one of the most sustainable companies globally (Dec. 11, 2023)
- Getting Ready for IoT Security in the AI Era (Dec. 08, 2023)
- TSMC November 2023 Revenue Report (Dec 08, 2023)
- Layer transfer tech comes to high volume chiplet, 2nm manufacturing (Dec. 08, 2023)
- Siemens' new Calibre DesignEnhancer boosts Samsung Foundry design quality and speeds time to market (Dec. 07, 2023)
- Bluetooth Channel Sounding: Achieving 10cm Ranging Accuracy (Dec. 07, 2023)
- Access Advance Announces Major Additions to its HEVC and VVC Patent Pools (Dec. 07, 2023)
- NovaSparks Expands Its Operations in Asia-Pacific (Dec. 07, 2023)
- CEA-Leti Paper in Nature Communications Reports First Complete Memristor-Based Bayesian Neural Network Implementation For Real-World Task (Dec. 07, 2023)
- What Is Holding Back Neuromorphic Computing? (Dec. 07, 2023)
- Ceva Wins Product of the Year Award at Prestigious EE Awards Asia Event (Dec. 07, 2023)
- UMC Reports Sales for November 2023 (Dec. 06, 2023)
- Pragmatic Semiconductor secures £182m ($231m) investment led by M&G and UK Infrastructure Bank (Dec. 06, 2023)
- Global Semiconductor Sales Increase 3.9% Month-to-Month in October; Annual Sales Projected to Increase 13.1% in 2024 (Dec. 06, 2023)
- Lattice Collaborates with NVIDIA to Accelerate Edge AI (Dec. 06, 2023)
- Intrinsic ID Launches First Hardware Root-of-Trust Solution to Meet Functional Safety Standards for Automotive Market (Dec. 06, 2023)
- ProvenRun secures €15 million Series A to accelerate its growth in security-by-design for the Internet of Things (IoT) (Dec 06, 2023)
- Ceva Launches New Brand Identity Reflecting its Focus on Smart Edge IP Innovation (Dec 06, 2023)
- Top 10 Foundries Experience 7.9% QoQ Growth in 3Q23, with a Continued Upward Trend Predicted for Q4, Says TrendForce (Dec 06, 2023)
- Breker Verification Systems Appoints Andy Stein Vice President of Worldwide Sales as Company Scales New Business Opportunities (Dec 06, 2023)
- JEDEC Publishes New CAMM2 Memory Module Standard (Dec 06, 2023)
- Samsung Electronics Tense Over TSMC-Apple-Amkor 'Arizona Alliance' (Dec. 06, 2023)
- China's 'Big Fund' is investing $1 billion in another domestic foundry, to advance sub-10nm chip manufacturing (Dec. 06, 2023)
- Renesas Champions the RISC-V Cause With Its Own 32-bit RISC-V CPU (Dec. 06, 2023)
- Siemens And Intel To Collaborate On Advanced Semiconductor Manufacturing (Dec. 06, 2023)
- Using AI to find microplastics (Dec. 06, 2023)
- Tech Alert: BrainChip's "This is Our Mission" Podcast Discusses Trends in Edge AI with Arm Fellow Ian Bratt (Dec. 06, 2023)
- Pragmatic Semiconductor secures £182m ($231m) investment led by M&G and UK Infrastructure Bank (Dec 06, 2023)
- 3GPP to Officially Begin Development of the 6G Specification (Dec. 06, 2023)
- GUC Monthly Sales Report - November 2023 (Dec. 05, 2023)
- Rambus Protects Data Center Infrastructure with Quantum Safe Engine IP (Dec. 05, 2023)
- Xiphera Announces Support for Extreme-Speed IPsec (Dec. 05, 2023)
- Agile Analog partners with sureCore on CryoCMOS Innovate UK project (Dec. 05, 2023)
- Tenstorrent Strengthens Presence in Asia with Rapidus Partnership (Dec. 05, 2023)
- Applied Materials and CEA-Leti Unveil Joint Lab For Rapidly Growing Specialty Chip Markets (Dec. 05, 2023)
- Keeping It 100: RISC-V Reality Check (Dec. 05, 2023)
- ADTechnology is accelerating its performance and targeting infrastructure markets by joining Arm Total Design. (Dec. 04, 2023)
- Q3 2023 Global Semiconductor Equipment Billings Drop 11% Year-Over-Year, SEMI Reports (Dec 04, 2023)
- EMA Design Automation to Spin-Off IP & Services Group to Enable Digital Transformation for the Entire CAD Industry (Dec 04, 2023)
- Silicon Proven DisplayPort v1.4 Tx PHY IP Core in 12nm, Alongside Production-Ready Controller IP core available for Immediate Licensing (Dec 04, 2023)
- Gartner Forecasts Worldwide Semiconductor Revenue to Grow 17% in 2024 (Dec 04, 2023)
- USPTO announces Semiconductor Technology Pilot Program in support of CHIPS for America Program (Dec 04, 2023)
- Canonical joins the RISC-V Software Ecosystem (RISE) (Dec. 04, 2023)
- BrainChip Attracts Former Intel AI Sales Executive to Head Up Sales (Dec 04, 2023)
- Quantum effect technology breakthrough in analogue circuit design (Dec. 04, 2023)
- Cadence Powers Samsung Foundry's Breakthrough Success on 5G Chip Design (Dec. 04, 2023)
- Faraday Receives ISO/IEC 27001:2022 Certification for Information Security Management System (Dec. 01, 2023)
- Lockheed Martin Prepares First 5G.MIL® Payload for Orbit (Dec 01, 2023)
- Leadership Spotlight: Sanjeev Kumar Earns Global CEO Business Excellence Award (Dec 01, 2023)
- Energy Collaborative to Help Accelerate Installation of Greener Energy Sources in APAC (Dec. 01, 2023)
- Renesas Unveils the First Generation of Own 32-bit RISC-V CPU Core Ahead of Competition (Nov. 30, 2023)
- QuickLogic Secures New eFPGA IP Contract on UMC's 22nm Process (Nov. 30, 2023)
- Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2023 (Nov. 30, 2023)
- Agnisys Announces Wacom Selects IDesignSpec™ to Automate Its IP and Chip Development Flow from Executable Specifications (Nov 30, 2023)
- Credo Technology Group Holding Ltd Reports Second Quarter of Fiscal Year 2024 Financial Results (Nov. 30, 2023)
- Agile Analog's New VP Sales to Expand Ties With Foundries (Nov. 30, 2023)
- BrainChip Details Olfactory Capabilities of Identifying Bacteria in the Blood in New Research Report (Nov. 30, 2023)
- Cadence Signoff Solutions Empower Samsung Foundry's Breakthrough Success on 5G Networking SoC Design (Nov. 30, 2023)
- Logic Fruit Technologies Launches LIN Master Slave IP Core (Nov. 29, 2023)
- Intel to place US$14 billion orders with TSMC, says report (Nov. 29, 2023)
- Quantum Effect Technology Breakthrough in Analog Circuit Design (Nov. 29, 2023)
- Eliyan Appoints former head of Facebook/Meta AI infrastructure Dr. Jason Taylor to Board of Directors (Nov 29, 2023)
- Manufacturers Anticipate Completion of NVIDIA's HBM3e Verification by 1Q24; HBM4 Expected to Launch in 2026, Says TrendForce (Nov. 29, 2023)
- Untether AI Joins UCIe Consortium to Drive Chiplet Technology and Energy-Centric AI Acceleration (Nov. 29, 2023)
- M31 Completes Validation of 7nm ONFI 5.1 I/O IP - Targeting for the Global AI Big Data Storage Market (Nov. 29, 2023)
- Unleashing Edge AI Potential: Eta Compute's New Collaboration with NXP Semiconductors (Nov. 29, 2023)
- Omni Design Technologies Announces Expanded Silicon IP Solutions on Multiple TSMC Processes (Nov. 29, 2023)
- Crypto Quantique partners with Blaitek enabling quantum secure chip-to-cloud connection (Nov. 29, 2023)
- AI Puts the "Ability" in Sustainability (Nov. 29, 2023)
- European tech funding dropping but better than elsewhere (Nov. 29, 2023)
- Amidst export restrictions, RISC-V continues to advance (Nov. 29, 2023)
- Production Proven USB 3.2 Gen1/Gen2 IP Cores to ensure a seamless throughput for Next-Gen SoCs available for Immediate licensing (Nov. 28, 2023)
- Jayson Bethurem Joins Flex Logix as VP Marketing & Business Development (Nov. 28, 2023)
- Arteris Celebrates 3rd Year of Automotive ISO 26262 TCL1 Functional Safety Compliance for Magillem SoC Integration Automation (Nov. 28, 2023)
- Bridging the Talent Gap in Flanders' Semiconductor Industry (Nov. 28, 2023)
- Siemens revolutionizes engineering simulation with HEEDS AI Simulation Predictor and Simcenter Reduced Order Modeling (Nov. 28, 2023)
- Corporates embrace sustainability (Nov. 28, 2023)
- STMicroelectronics, ERG Sign Agreement for the Supply of Renewable Energy in Italy (Nov. 28, 2023)
- Secure-IC Among The 50 Most Promising SMEs (Nov. 28, 2023)
- Market Leaders Collaborate with Synopsys to Realize Gains of Generative AI Across Synopsys.ai Full EDA Stack (Nov. 27, 2023)
- Tenstorrent Gains Momentum in Asia With Rapidus Partnership (Nov. 27, 2023)
- "Sustainability is an important outcome of digital transformation" - Eryn Devola, Siemens Digital Industries (Nov. 24, 2023)
- ProteanTecs Awarded "Overall Connected Vehicle Innovation of the Year" in AutoTech Breakthrough Awards (Nov. 23, 2023)
- LeWiz Open Source LVDS Transceiver Design (Nov. 23, 2023)
- Broadcom Completes Acquisition of VMware (Nov 23, 2023)
- BrainChip Announces Dr. Tony Lewis as the New Chief Technology Officer (Nov. 23, 2023)
- LC3plus audio codec software licensed by major Audio OEM (Nov. 22, 2023)
- VeriSilicon's Vector Graphics GPU is selected by LG Electronics (Nov. 22, 2023)
- Agile Analog appoints former GUC Europe President as new VP of Sales (Nov. 22, 2023)
- Alchip Unveils Industry's First Automotive ASIC Design Platform (Nov. 22, 2023)
- Arm Extends Cortex-M Portfolio to Bring AI to the Smallest Endpoint Devices (Nov. 22, 2023)
- EIC-funded companies at Intel & Hugging Face Summit (Nov. 22, 2023)
- US puts $3bn into packaging development and manufacturing (Nov. 22, 2023)
- New RISC-V processors address demand for open source and performance (Nov. 21, 2023)
- Weebit Nano receives wafers manufactured in GlobalFoundries' 22FDX® process (Nov. 21, 2023)
- Secure-IC strengthens its innovation leadership in embedded cybersecurity with the acquisition of eShard patents portfolio (Nov. 21, 2023)
- Xiphera's Crypto Module Offers Customisable Offload and Acceleration Solutions (Nov. 21, 2023)
- Samsung Foundry aims to improve production of AI, high performance computing chips (Nov. 21, 2023)
- Axelera AI Platform Accelerates Edge Application Deployment (Nov. 21, 2023)
- Synopsys GenAI Capability Helps Accelerate Chip Design (Nov. 21, 2023)
- Weebit Nano's ReRAM IP achieves high temperature qualification in SkyWater Technology's S130 process (Nov. 20, 2023)
- Insyde Software Becomes the First Independent BIOS Vendor to Achieve Arm SystemReady SR-SIE Certification for the NVIDIA GH200 Grace Hopper Superchip Platform (Nov 20, 2023)
- Ventana Micro Systems Unveils Second Generation Veyron Family RISC-V Processor, Paving the Way for Data Center-Class Performance (Nov. 20, 2023)
- Red Bull Ford Powertrains pursues the sustainable future of motorsport with Siemens Xcelerator (Nov. 20, 2023)
- Lenovo commits to end-to-end product circular economy (Nov. 18, 2023)
- Rapidus and Tenstorrent Partner to Accelerate Development of AI Edge Device Domain Based on 2nm Logic (Nov. 17, 2023)
- Green Mountain Semiconductor Participates in Unveiling of Innovative AI processor (Nov. 17, 2023)
- Thalia's AMALIA (23.4a) qualified on Siemens AFS for increased analog design migration flexibility (Nov. 16, 2023)
- Secure-IC announces the integration of Securyzr™ technology in MediaTek's new flagship smartphone chip, Dimensity 9300 (Nov. 16, 2023)
- Siemens buys Insight EDA (Nov. 16, 2023)
- Faraday Unveils Enhanced Gigabit Ethernet PHY on UMCs 28HPC+ Process (Nov. 16, 2023)
- Mixel Celebrates 25 Years of Mixed-Signal Excellence (Nov. 16, 2023)
- Bringing Arm TCS23 to Life on Next-gen Flagship Smartphones with MediaTek and vivo (Nov. 16, 2023)
- Arm Collaborates with Microsoft on Custom Silicon to Unlock Sustainable, AI-Driven Infrastructure (Nov. 16, 2023)
- QuickLogic Announces New Aurora™ FPGA/eFPGA User Tools with Enhancements for Reconfigurable Computing (Nov 16, 2023)
- Siemens acquires Insight EDA to expand Calibre integrated circuit reliability verification offering (Nov. 16, 2023)
- Scale FD-SOI to 7nm? Yes, We Can (Nov. 16, 2023)
- SEMICON Europa: Building a Sustainable US$1 Trillion Semiconductor Industry (Nov. 16, 2023)
- Xiphera Announces a New Batch of CAVP Validated IP Cores (Nov. 15, 2023)
- QuickLogic Reports Third Quarter Fiscal 2023 Results Including Record Non-GAAP Net Income (Nov. 15, 2023)
- Synopsys Announces Synopsys.ai Copilot, Breakthrough GenAI Capability to Accelerate Chip Design (Nov. 15, 2023)
- M31 Q3 Profit Surged Over 50%, Accumulated EPS NT$9.34 (Nov. 15, 2023)
- Imec's Virtual Fab Goes Public to Speed IC Manufacturing Decarbonization (Nov. 15, 2023)
- Andes Technology Partners with WITTENSTEIN high integrity systems (WHIS) to Build Safety-Critical Solutions with RISC-V Processors (Nov. 14, 2023)
- Arm Announces Appointment of Ami Badani as Chief Marketing Officer (Nov. 14, 2023)
- Rambus Demonstrates CXL Platform Development Kit at SC23 (Nov. 14, 2023)
- CXL Consortium Announces Compute Express Link 3.1 Specification Release (Nov. 14, 2023)
- OEMs' Sourcing Strategies Need to Account for Node Sizes (Nov 14, 2023)
- Imagination to lay off 20% of staff (Nov. 14, 2023)
- Arteris Ncore Cache Coherent Interconnect IP Certified for ISO 26262 Automotive Functional Safety Standard (Nov. 14, 2023)
- Movellus Introduces Aeonic Insight™ Product Line for On-die Telemetry (Nov. 14, 2023)
- Siemens works with Arm and AWS to bring PAVE360 to the cloud and unlocks next generation automotive innovation (Nov. 14, 2023)
- Finnish consortium participating in Sustronics e-waste and materials project (Nov. 14, 2023)
- Japanese chipmaker Rapidus plans US sales office (Nov. 14, 2023)
- T2M-IP Presents Silicon Proven 22nm 1.5GHz Fractional-N PLL IP Core, with Dynamic Configuration for Wireless and Automotive SoCs - Licensing Now Available. (Nov. 13, 2023)
- Global Semiconductor Manufacturing Industry Set for Q4 2023 Recovery, SEMI Reports (Nov. 13, 2023)
- CEA-Leti unveils breakthroughs in 3D, RF, power, and quantum computing (Nov. 13, 2023)
- Cadence and Autodesk Collaborate on Smart Product Design (Nov. 13, 2023)
- Samsung to unveil 3D AI chip packaging tech SAINT to rival TSMC (Nov. 12, 2023)
- TSMC October 2023 Revenue Report (Nov. 10, 2023)
- Imagination launches brand new line of high-performance GPU IP with DirectX (Nov. 09, 2023)
- Alphawave Semi Named One of Canada's Enterprise-Industry Leaders Winners in Deloitte's Technology Fast 50™ Program (Nov. 09, 2023)
- RISC-V Pioneer SiFive Takes Stock, Realigns, Moves Forward (Nov. 09, 2023)
- SPARK Microsystems Revolutionizes Wireless Headsets with Ultra-Wideband Audio Technology (Nov. 09, 2023)
- Server Processors in the AI Era: Can They Go Greener? (Nov. 09, 2023)
- Accellera Announces IEEE 1666™-2023 Standard Available Through IEEE GET Program (Nov. 09, 2023)
- CEVA, Inc. Announces Expansion of Existing Share Repurchase Program (Nov. 09, 2023)
- Arm Holdings plc Reports Results for the Second Quarter of the Financial Year Ending 2024 (Nov. 09, 2023)
- SMIC Reports 2023 Third Quarter Results (Nov. 09, 2023)
- Alphawave Semi Named One of Canada's Enterprise-Industry Leaders Winners in Deloitte's Technology Fast 50™ Program (Nov 09, 2023)
- Cadence EMX 3D Planar Solver Certified for Samsung Foundry 8nm LPP Process Technology (Nov. 09, 2023)
- Accellera Announces IEEE 1666™-2023 Standard Available Through IEEE GET Program (Nov 09, 2023)
- Extinguishing Lithium-Ion Battery Liability With Green Packaging (Nov. 09, 2023)
- Ventana and Imagination Partner to Deliver World's Highest Performance RISC-V CPU & GPU Solutions (Nov. 08, 2023)
- OpenHW Group Announces CORE-V CVA6 Platform Project for RISC-V Software Development & Testing (Nov. 08, 2023)
- BeagleBoard.org Makes FPGA and RISC-V Accessible with New BeagleV-Fire Single Board Computer at $150 (Nov 08, 2023)
- Renesas Unveils Processor Roadmap for Next-Gen Automotive SoCs and MCUs (Nov. 08, 2023)
- Ventana Introduces Veyron V2 - World's Highest Performance Data Center-Class RISC-V Processor and Platform (Nov. 08, 2023)
- RISC-V International Marks Banner Year for RISC-V Adoption, Technical Momentum, and Community Engagement (Nov. 08, 2023)
- CEVA, Inc. Announces Third Quarter 2023 Financial Results (Nov 08, 2023)
- Arteris Announces Financial Results for the Third Quarter 2023 and Fourth Quarter and Full Year 2023 Guidance (Nov 08, 2023)
- Cadence open-source PDK and reference design now available for SkyWater's 130nm process (Nov. 08, 2023)
- China Deploys Massive RISC-V Server in Commercial Cloud (Nov. 08, 2023)
- Samsung AI Forum 2023 Day 2: Discussing Technological Trends and the Future of Generative AI (Nov. 08, 2023)
- Imagination launches brand new line of high-performance GPU IP with DirectX? (Nov. 07, 2023)
- Ubilite Licenses RISC-V Application Processor IP Core from CAST (Nov. 07, 2023)
- Andes and Vector Propel RISC-V AUTOSAR Software Innovations for the Automotive Industry (Nov. 07, 2023)
- European Processor Initiative partner SiPearl will provide its general purpose processor for Europe's first EuroHPC exascale supercomputer JUPITER (Nov. 07, 2023)
- Arteris Awarded ISO 9001 Certification for Semiconductor System IP Quality Management System (Nov. 07, 2023)
- Synopsys Expands Its ARC Processor IP Portfolio with New RISC-V Family (Nov. 07, 2023)
- Imagination launches brand new line of high-performance GPU IP with DirectX (Nov 07, 2023)
- Infineon Extends Microcontroller Portfolio with New PSoC Edge Family of Products (Nov. 07, 2023)
- AI, memory safety are real threats to IoT security (Nov. 07, 2023)
- Siemens digitalises the entire energy supply chain journey (Nov. 07, 2023)
- How the chip industry is tackling CO2 and the global mission to go green (Nov. 07, 2023)
- Reducing industrial CO2 emissions (Nov. 07, 2023)
- Hyperion Core Joins RISC-V International as a Strategic Member (Nov. 06, 2023)
- semify announces the upcoming launch of SmartWave: A tool providing instant connection to any device (Nov 06, 2023)
- TASKING, Andes, and MachineWare Team Up to Facilitate Rapid Development of RISC-V ASIL Compliant Automotive Silicon (Nov. 06, 2023)
- GUC Monthly Sales Report - October 2023 (Nov. 06, 2023)
- SkyWater Announces Availability of Cadence Open-Source PDK and Reference Design for SkyWater's 130 nm Process (Nov. 06, 2023)
- UMC Reports Sales for October 2023 (Nov. 06, 2023)
- Renesas Extends Tender Offer and Receives UK NSIA Clearance for Proposed Acquisition of Sequans (Nov. 06, 2023)
- OPENEDGES Proud to Announce the World's Only 7nm LPDDR5X PHY IP Operating at 8533 Mbps (Nov. 06, 2023)
- Cadence Announces Voltus InsightAI, Industry's First Generative AI Technology that Automatically Identifies and Addresses EM-IR Violations (Nov. 06, 2023)
- Weebit Nano receives first revenue (Nov. 06, 2023)
- Will 1.4-nm help Samsung catch up with TSMC, IFS? (Nov. 06, 2023)
- Semidynamics and Arteris to accelerate AI RISC-V SoC development (Nov. 06, 2023)
- Trio team up to drive RISC-V ASIL-compliant automotive silicon (Nov. 06, 2023)
- VSORA to Receive $13.18 Million in Funding from the European Innovation Council Accelerator Program (Nov. 03, 2023)
- Ansys medini Accelerates Andes' Development of Automotive-Grade IP (Nov. 03, 2023)
- First Generative AI tool for power integrity sign off (Nov. 03, 2023)
- STMicroelectronics sees its forte in sustainability to maintain lead in supply chain (Nov. 03, 2023)
- Synopsys Receives Multiple Partner of the Year Awards at TSMC 2023 OIP Ecosystem Forum (Nov. 03, 2023)
- Imperas RISC-V Solutions for Developers - Accelerating RISC-V (Nov. 02, 2023)
- Zero ASIC Democratizing Chip Making (Nov 02, 2023)
- Worldwide Silicon Wafer Shipments Fall in Q3 2023, SEMI Reports (Nov. 02, 2023)
- proteanTecs Enhances Astera Labs' Connectivity Solutions with Performance and Reliability Monitoring (Nov. 02, 2023)
- Sophgo Licenses SiFive RISC-V Processor Cores to Drive High-Performance AI Computing Innovation (Nov. 02, 2023)
- Semidynamics and Arteris Partner To Accelerate AI RISC-V System-on-Chip Development (Nov. 02, 2023)
- Raspberry Pi Receives Strategic Investment from Arm, Further Extending Long-Term Partnership (Nov 02, 2023)
- Global Semiconductor Sales Increase 1.9% Month-to-Month in September (Nov 02, 2023)
- Nvidia Trains LLM on Chip Design (Nov 02, 2023)
- Are We Ready for the 2nm Process Node? (Nov. 02, 2023)
- sureCore and Intrinsic announce collaboration to accelerate time to market for innovative ReRAM technology (Nov. 01, 2023)
- Xiphera Enhances the Performance of Its Portfolio with New Cryptographic IP Cores (Nov. 01, 2023)
- Arm Collaborates with Industry Leaders to Build AI Foundations of the Future (Nov. 01, 2023)
- A consortium led by Semiwise wins an Innovate UK grant to develop Virtual Reality Semiconductor Training Fab. (Nov. 01, 2023)
- Andes Technology to Exhibit Groundbreaking RISC-V Solutions for AI and Automotive at RISC-V Summit North America 2023 (Nov. 01, 2023)
- Axiomise Heads to Silicon Valley Next Week for RISC-V Summit North America (Nov. 01, 2023)
- New EU Rule Requires Proof of Sustainability (Nov. 01, 2023)
- Tenstorrent Teams with Imperas to Provide Model of the Tenstorrent Ascalon RISC-V Core (Oct. 31, 2023)
- UMC Launches W2W 3D IC Project with Partners, Targeting Growth in Edge AI (Oct. 31, 2023)
- Renesas' New Ultra-High Performance MCUs are Industry's First Based on Arm Cortex-M85 Processor (Oct. 31, 2023)
- Rambus Reports Third Quarter 2023 Financial Results (Oct. 31, 2023)
- lowRISC Announces New OpenTitan Project Partner, zeroRISC (Oct. 31, 2023)
- Synopsys Delivers Seamless Interoperability for Semiconductor Design Ecosystem with New Synopsys Cloud OpenLink Program (Oct. 31, 2023)
- Codasip delivers processor security to actively prevent the most common cyberattacks (Oct. 31, 2023)
- Quantum tunneling avoids thermal noise in analog circuits (Oct. 31, 2023)
- Details about Samsung Foundry's 1.4nm process node surface (Oct. 31, 2023)
- Realtek Deploys Cadence Tempus Timing Solution to Deliver Working Silicon on N12 Design (Oct. 31, 2023)
- From Connectivity to Intelligence: How Edge AI is Revolutionizing IoT Innovation (Oct. 31, 2023)
- Sustainability key to semiconductor roadmap for the chiplet era (Oct. 31, 2023)
- Weebit Nano signs Tier-1 licensing agreement; on track to generate first IP revenues in 2023 (Oct. 30, 2023)
- EnSilica to supply beamforming SatCom ICs to Germany's VITES to enable power- and cost-efficient flat panel terminals for NGSO-constellations (Oct. 30, 2023)
- Stephane Cordova joins Thalia as Director of Sales Europe (Oct. 30, 2023)
- Flex Logix adoption expands into datacenters (Oct. 30, 2023)
- Aniah simultaneously validates ISO9001 and ISO27001 certifications, reinforcing its commitment to Quality and Cybersecurity (Oct. 30, 2023)
- DSPs target sensor intelligence and edge AI inference needs (Oct. 30, 2023)
- Cadence Bags Four TSMC OIP Partner of the Year Awards (Oct. 30, 2023)
- RISC-V Releases Abound Ahead of 2023 RISC-V Summit (Oct. 28, 2023)
- MosChip Technologies announces its new Managing Director & CEO (Oct. 26, 2023)
- Global Silicon Wafer Shipment Growth to Bounce Back in 2024 After 2023 Decline, SEMI Reports (Oct 26, 2023)
- Weebit Nano's ReRAM IP Awarded "Embedded Solution Product of the Year" in the Electronic Industry Awards (Oct. 26, 2023)
- Synopsys Honored at TSMC 2023 OIP Ecosystem Forum with Multiple Partner of the Year Awards (Oct. 26, 2023)
- Multielement Ink is Promising for Sustainable Semiconductor Manufacturing (Oct. 26, 2023)
- Cadence Expands Tensilica IP Portfolio with New HiFi and Vision DSPs for Pervasive Intelligence and Edge AI Inference (Oct. 25, 2023)
- DVB-C2 LDPC/ BCH Decoder FEC IP Core From Global IP Core (Oct 25, 2023)
- NeuReality and Veriest Achieve Great Engineering Feat to Advance AI Chips for World's Largest Data Centers (Oct. 25, 2023)
- China's FD-SOI ecosystem needs more engagement to work as a leapfrogging strategy (Oct. 25, 2023)
- Rambus Boosts AI Performance with 9.6 Gbps HBM3 Memory Controller IP (Oct. 25, 2023)
- Stanley Electric Taps Siemens Platform for Latest MEMS IC Design (Oct. 25, 2023)
- Layoffs at SiFive as RISC-V upstart faces a crossroads (Oct 25, 2023)
- SEMICON Europa 2023 to Highlight Chip Industry Investments, Sustainability and Talent Strategies to Shape $1 Trillion Era (Oct. 25, 2023)
- SiFive lays off 20% of staff, re-aligns business (Oct. 25, 2023)
- Semidynamics launches first fully-coherent RISC-V Tensor unit to supercharge AI applications (Oct. 24, 2023)
- PCI-SIG® Announces Authorized Test Labs Now Available for PCI Express® Technology (Oct. 24, 2023)
- Faraday Reports Third Quarter 2023 Results (Oct. 24, 2023)
- PCI-SIG® Announces Authorized Test Labs Now Available for PCI Express® Technology (Oct. 24, 2023)
- Cadence Reports Third Quarter 2023 Financial Results (Oct 24, 2023)
- Sofics releases its ESD technology on TSMC 3nm process (Oct. 24, 2023)
- Intrinsic ID Looks Back on 15 Years of Building Digital Trust (Oct. 24, 2023)
- Codasip's New RISC-V Processor Family Dials In on Custom Compute (Oct. 24, 2023)
- Infineon to pilot new AI developer model to enhance sensor innovation (Oct. 24, 2023)
- Plastic Fischer Adopts Siemens Xcelerator to Reduce Plastic Waste in World Oceans (Oct. 24, 2023)
- How 'E-Waste Mining' Can Pay Off (Oct. 24, 2023)
- AI Silicon IP Provider Expedera Opens R&D Office in Singapore (Oct. 24, 2023)
- Modular mobile devices for less electronic waste (Oct. 24, 2023)
- Revolutionizing Automotive Connectivity: Cutting-Edge Silicon IP Cores Now Available with T2M (Oct. 23, 2023)
- Socionext Begins Development of SoCs for Advanced ADAS and AD Using 3nm Automotive Process (Oct. 23, 2023)
- Alphawave Semi Announces Appointment of Rahul Mathur as Chief Financial Officer (Oct. 23, 2023)
- Qualinx's Series A Financing for All-Digital GNSS IoT Wireless Technology Hits $20 Million (Oct 23, 2023)
- Green Mountain Semiconductor Inc. awarded a contract from NASA to Pave the Way for Space-Ready Neural Processors (Oct. 23, 2023)
- Renesas Extends Tender Offer for Proposed Acquisition of Sequans (Oct 23, 2023)
- lowRISC Announces Expansion of OpenTitan Project with New Hardware (Oct 23, 2023)
- Adopting IEC 62443 standards for infrastructure cybersecurity (Oct. 22, 2023)
- Cadence Wins Four 2023 TSMC OIP Partner of the Year Awards (Oct. 20, 2023)
- How Arm Total Design is built around 5 key building blocks (Oct 20, 2023)
- New POLYN Patent Covers Smart Tires, Industrial IoT Applications (Oct. 20, 2023)
- Orthogone Technologies Unveils FPGA-Based Lightning-Fast PCIe DMA Controller Solution (Oct. 20, 2023)
- Neurxcore Introduces Innovative NPU Product Line for AI Inference Applications, Powered by NVIDIA Deep Learning Accelerator Technology (Oct 20, 2023)
- Weebit Nano licenses ReRAM to DB HiTek, a global top-10 foundry (Oct. 19, 2023)
- US extends China chip ban (Oct. 19, 2023)
- Prophesee launches the world's smallest and most power-efficient event-based vision sensor, bringing more intelligence, privacy and safety than ever to consumer Edge-AI devices (Oct. 19, 2023)
- Ansys Semiconductor Simulation Solutions Certified for UMC's 3D Chip Technology (Oct. 19, 2023)
- Samsung Electronics Unveils Automotive Process Strategy at Samsung Foundry Forum 2023 EU (Oct. 19, 2023)
- SEMIFIVE Signs MOU with TeraPixel Technologies to Collaborate on Semiconductor Design (Oct. 19, 2023)
- CXL Gets Off the Drawing Board (Oct 19, 2023)
- Analysts Debate Latest U.S. Export Controls (Oct 19, 2023)
- Alphawave Semi Elevates Chiplet-Powered Silicon Platforms for AI Compute through Arm Total Design (Oct. 18, 2023)
- Andes Technology Unveils Andes D23 and N225 Cores Pioneering the Next Generation of Compact, Performant, and Secure RISC-V Processor Technology (Oct. 18, 2023)
- Arm and Synopsys Strengthen Partnership to Accelerate Custom Silicon on Advanced Nodes (Oct. 18, 2023)
- Harnessing the power of the ecosystem in the era of custom silicon on Arm (Oct. 18, 2023)
- Qualcomm to Bring RISC-V Based Wearable Platform to Wear OS by Google (Oct. 18, 2023)
- M31 Opens Bangalore R&D Design Center in India Expands Recruitment of Global Talent (Oct. 18, 2023)
- Cadence Joins Arm Total Design to Accelerate Development of Arm-Based Custom SoCs (Oct. 18, 2023)
- Socionext Announces Collaboration with Arm and TSMC on 2nm Multi-Core Leading CPU Chiplet Development (Oct. 18, 2023)
- ARM edges closer to full 2nm chip designs with Total Design (Oct. 18, 2023)
- Cadence Collaborates with Broadcom to Implement AI-Driven Solutions with Impressive Quality of Results (Oct. 18, 2023)
- Ensuring security legislation compliance in IoT applications (Oct. 18, 2023)
- Microelectronics for sustainability and technological sovereignty (Oct. 18, 2023)
- GlobalFoundries Awarded $35 Million Funding from U.S. Government to Accelerate Manufacturing of Next-Generation GaN Chips (Oct. 18, 2023)
- Synopsys Partners with Indian Institute of Technology Bombay to Develop Talent for Semiconductor Industry (Oct. 17, 2023)
- Fraunhofer IESE Partners With Arteris To Accelerate Advanced Network-on-chip Architecture Development for AI/ML Applications (Oct. 17, 2023)
- Silicon Creations Named 2023 TSMC OIP Partner of the Year for Analog / Mixed-Signal IP (Oct 17, 2023)
- Codasip announces next-generation RISC-V processor family for Custom Compute (Oct. 17, 2023)
- CEVA Joins Intel Foundry Services Accelerator IP Alliance Program to Empower Cutting-Edge SoCs (Oct. 17, 2023)
- CEA-Leti Launches R&D Program to Improve "Cooperation" Between Autonomous Vehicles Via V2X Communication (Oct. 17, 2023)
- TSMC abandons plans for 2nm chip plant after Taiwanese locals protest (Oct. 17, 2023)
- Chipmakers Fail to Meet Carbon-Emission Target, Experts Say (Oct. 17, 2023)
- GOWIN Semiconductor Expands its GW1NZ Series of Low-Cost, Small-Size, and Low-Power Devices (Oct. 16, 2023)
- OPENEDGES Extends Partnership with InnoGrit Corp for 6nm LPDDR5/4X/4 Memory Controller IP (Oct. 16, 2023)
- 14-bit, 4.32GSps Wide Band ADC with Time-Interleaved Pipeline Architecture, Now Available for WhiteBox Licensing - Unlimited Usage and Modification Rights Included (Oct 16, 2023)
- eMemory Won TSMC OIP Partner of the Year Award for the 14th Consecutive Year (Oct. 16, 2023)
- Access Advance Announces Newest VVC Advance Licensors and Licensees (Oct 16, 2023)
- Electronic System Design Industry Posts $4 Billion in Revenue in Q2 2023, ESD Alliance Reports (Oct 16, 2023)
- LeapMind's New AI Chip Paves the Way for Unprecedented Cost-Effective AI Computing (Oct 16, 2023)
- Fraunhofer-Roadmap: European Commission and expert community discuss a sustainable and competitive bioeconomy for the EU (Oct. 16, 2023)
- The Path to A Sustainable Semiconductor Industry (Oct. 16, 2023)
- Imagination Optimizes PPA and Speeds the Delivery of Low-Power GPUs Using AI-Driven Cadence Cerebrus in the OnCloud Platform (Oct. 13, 2023)
- Semiconductor startup, Enosemi, launches with a committed commercial license to key silicon photonics design IP created by Luminous Computing (Oct 13, 2023)
- Thalia appoints Sou Bennani-McCord as Global VP of Sales (Oct. 12, 2023)
- Credo Joins with Industry Players to Announce Effort to Standardize CXL Active Electrical Cables & Optics at OCP Global Summit 2023 (Oct. 12, 2023)
- Chips JU Consultation Workshop : "Sustainable and Greener Manufacturing of ECS" (Oct. 12, 2023)
- Workshop Sustainable and Greener Manufacturing of ECS (Oct. 12, 2023)
- Ericsson Antenna Technology Germany starts research project for 6G communication technologies (Oct. 12, 2023)
- European Innovation Award EARTO 2023 for sustainable and cost-effective manufacturing process of aerogels (Oct. 12, 2023)
- Denso invests $500 million in silicon carbide wafer company (Oct. 12, 2023)
- Arteris Interconnect IP Deployed in NeuReality Inference Server for Generative AI and Large Language Model Applications (Oct. 11, 2023)
- BrainChip and Circle8 Clean Technologies/AVID Group Work to Reduce and Recycle Waste Through Joint Development of Intelligent "Smart Bins" (Oct. 11, 2023)
- JEDEC and Open Compute Project Foundation Pave the Way for a New Era of Chiplet Innovation (Oct. 11, 2023)
- SiFive Announces Differentiated Solutions for Generative AI and ML Applications Leading RISC-V into a New Era of High-Performance Innovation (Oct. 11, 2023)
- Highly configurable 32-Bit MCU features embedded hardware security module (Oct. 11, 2023)
- Achronix Announces FPGA-Powered Accelerated Automatic Speech Recognition Solution (Oct. 11, 2023)
- Tasking, Synopsys team for safer automotive virtual ECUs (Oct. 11, 2023)
- Embedded Flash memory developer Floadia has raised 1.05 billion yen from INABATA and others (Oct 11, 2023)
- ADTechnology to start 3nm 2.5D ASIC design project for HPC application (Oct 11, 2023)
- Soitec inaugurates new plant for SmartSiC wafer production (Oct. 11, 2023)
- Artificial Intelligence (AI) Utilizing Deep Learning Techniques to Enhance ADAS (Oct. 11, 2023)
- Leti Innovation Days Tokyo 2023 (Oct. 10, 2023)
- Omni Design to Present Next Generation LiDAR Solutions at CadenceLIVE Europe (Oct. 10, 2023)
- Update on Israel situation; Weebit's operations unaffected (Oct. 10, 2023)
- Efabless Raises $6.3 Million in Series A-1 Extension, Featuring Investments from GlobalFoundries, Synopsys, and New North Ventures (Oct. 10, 2023)
- Accellera Releases Portable Test and Stimulus Standard 2.1 (Oct. 10, 2023)
- AMD to Acquire Open-Source AI Software Expert Nod.ai (Oct 10, 2023)
- Siemens launches Tessent tool for Verilog and RTL design for test (Oct. 10, 2023)
- RISC-V group says export ban on open-source chip standard would slow innovation (Oct. 10, 2023)
- New Synopsys Research Reveals Vast Majority of Organizations Report DevOps Delays Due to Critical Security Issues (Oct. 10, 2023)
- 1G Ethernet PHY IP Core is now available in 14nm LPP for Blackbox License and in 28FDSOI as Whitebox License for maximum flexibility (Oct 09, 2023)
- TSMC September 2023 Revenue Report (Oct 09, 2023)
- TSMC looks to standardise chiplet protocols in "world changing" move (Oct 09, 2023)
- Siemens extends leadership in EDA design-for-test with the launch of Tessent RTL Pro (Oct 09, 2023)
- EDGX Announces Collaboration with BrainChip to Develop Disruptive Data Processing Solutions for Space (Oct. 06, 2023)
- Arteris Wins Autonomous Vehicle Technology of the Year Award (Oct. 06, 2023)
- ADTechnology and Zaram Technology to develop the next-generation of telecommunications semiconductor chips (Oct. 06, 2023)
- Marquee Semiconductor Expands Presence in India with New Location at Veer Surendra Sai University of Technology Campus in Odisha (Oct. 06, 2023)
- UMC Reports Sales for September 2023 (Oct. 06, 2023)
- GUC Monthly Sales Report - September 2023 (Oct. 06, 2023)
- Samsung Electronics and TSMC Grapple with 3-Nano Yield Challenges (Oct. 06, 2023)
- Marquee Semiconductor Joins Singapore Semiconductor Industry Association to Catalyze Development of Singaporean Hub (Oct. 05, 2023)
- ELES and proteanTecs Partner to Enhance Reliability Testing with Deep Data Analytics (Oct 05, 2023)
- Cadence Completes Acquisition of Intrinsix (Oct 05, 2023)
- Tenstorrent Selects Samsung Foundry to Manufacture Next-Generation AI Chiplet (Oct 05, 2023)
- Renesas Extends Tender Offer and Receives CFIUS Clearance for Proposed Acquisition of Sequans (Oct. 05, 2023)
- MachineWare announces new ARM processor simulation and SystemC profiling products, adds Windows support (Oct. 05, 2023)
- SmartDV Rolls Out Multi-Phase Expansion Plan (Oct. 05, 2023)
- Swiss-Based Enclustra Announces US Operations in San Diego to Realize the Full Potential of Embedded Chip Technologies (Oct 05, 2023)
- Using Open-Source Hardware to Speed Product Development (Oct 05, 2023)
- Global Semiconductor Sales Increase 1.9% Month-to-Month in August (Oct 05, 2023)
- JUPITER Exascale Supercomputer, lead customer for SiPearl (Oct 05, 2023)
- Intel Announces Intent to Operate Programmable Solutions Group (PSG) as Standalone Business (Oct. 04, 2023)
- EdgeCortix Closes $20 Million in Additional Funding Round (Oct 04, 2023)
- TSMC selects IC'Alps for its Design Center Alliance (DCA) (Oct. 04, 2023)
- TSMC's 3Dblox 2.0 and 3DFabric Alliance Achievements Set the Stage for the Future of 3D IC (Oct. 04, 2023)
- Renesas partners with EdgeCortix to streamline AI/ML development (Oct. 04, 2023)
- imec looks to automotive chiplet programme (Oct. 04, 2023)
- Semidynamics and SignatureIP create a fully tested RISC-V multi-core environment and CHI interconnect (Oct. 03, 2023)
- CEA and Siemens collaborate on research to expand applications of Digital Twin for industry (Oct. 03, 2023)
- BrainChip Makes Second-Generation Akida Platform Available to Advance State of Edge AI Solutions (Oct. 03, 2023)
- Tachyum Books Purchase Order to Build System with 25,000x ChatGPT4 Capacity and 25x Faster than Current Supercomputers (Oct 03, 2023)
- Soitec Opens New Plant, Positioning SmartSiC™ as a Future EV Standard (Oct. 03, 2023)
- Alphawave Semi Earns Great Place to Work® Certification™ for 2023-24 (Oct. 02, 2023)
- TSMC Announces Breakthrough Set to Redefine the Future of 3D IC (Sept. 28, 2023)
- China Gears Up for Chip Dumping, Ex-DoC Official Says (Sept. 28, 2023)
- Percepio Enables Trace Observability for All RTOS, Middleware and Silicon Vendor APIs (Sep 28, 2023)
- Nanusens technology is key to enabling AI to be smarter (Sep 28, 2023)
- Microchip FPGAs Speed Intelligent Edge Designs and Reduce Development Cost and Risk with Tailored PolarFire® FPGA and SoC Solution Stacks (Sept. 28, 2023)
- M31 Announces Low-Power IP Solutions for TSMC's N12e Process (Sept. 28, 2023)
- EU Turns Rivals into Allies (Sep 28, 2023)
- Keysight, Synopsys, and Ansys Accelerate RFIC Semiconductor Design with New Reference Flow for TSMC's Advanced 4nm RF FinFET Process (Sept. 28, 2023)
- How the Worlds of Chiplets and Packaging Intertwine (Sep 28, 2023)
- Intrinsic ID Becomes World's First IP Vendor with PSA Certified Level 3 Root of Trust Component (Sept. 28, 2023)
- Capgemini boosts its semiconductor capabilities in Europe with acquisition of HDL Design House (Sept. 28, 2023)
- Circular Economy, a Path to a Sustainable Ecosystem: Infineon's Security Solutions Support the Industry, the Consumer, and the Environment Alike (Sept. 28, 2023)
- Cadence Digital and Custom/Analog Design Flows Achieve the Latest TSMC N2 Certification (Sept. 27, 2023)
- PrimisAI Forms to Revolutionize Hardware Design with Leading AI Solutions (Sep 27, 2023)
- Analog Bits to Demonstrate Automotive Grade IP's Including a Novel High Accuracy Sensor at TSMC 2023 North America Open Innovation Platform Ecosystem Forum (Sept. 27, 2023)
- Chips&Media Announces the Release of "WAVE-N," the New Neural Processor IP (Sept. 27, 2023)
- GlobalFoundries and Microchip Announce Microchip's 28nm SuperFlash® Embedded Flash Memory Solution in Production (Sept. 27, 2023)
- GlobalFoundries Unveils Power-Efficient Advancements to 22FDX® Platform at Annual Tech Summit (Sept. 27, 2023)
- Synopsys and TSMC Streamline Multi-Die System Complexity with Unified Exploration-to-Signoff Platform and Proven UCIe IP on TSMC N3E Process (Sep 27, 2023)
- Siemens and TSMC collaborate to help mutual customers optimize designs using foundry's newest advancements (Sept. 27, 2023)
- Cadence Expands Support for 3Dblox 2.0 Standard with New System Prototyping Flows (Sept. 27, 2023)
- Accelerating RISC-V development with network-on-chip IP (Sept. 27, 2023)
- AT&S conducts green electronics research for Europe (Sept. 27, 2023)
- GlobalFoundries Announces Opening of New Malaysia Office to Support Global Manufacturing Operations (Sept. 26, 2023)
- Kneron Announces $49M in Additional Funding, Bringing Total Series B to $97M (Sep 26, 2023)
- SambaNova Unveils New AI Chip, the SN40L, Powering its Full Stack AI Platform (Sept. 26, 2023)
- Introducing Tomi Jalonen - Xiphera's Sales Representative for Central European Markets (Sept. 26, 2023)
- Synopsys Unveils Industry's Broadest Portfolio of Automotive-Grade IP on TSMC's N5A Process Technology (Sept. 26, 2023)
- Codasip selects Verilock to provide secure hardware authentication technology (Sept. 26, 2023)
- Cadence Custom/Analog Design Migration Flow Accelerates Adoption of TSMC Advanced Process Technologies (Sept. 26, 2023)
- Ashling's RiscFree™ SDK Now Supports RISC-V® Processor Cores from CAST (Sept. 26, 2023)
- Unlocking IoT Security: Crypto Quantique Introduces QuarkLink Ignite - A Free IoT Security SaaS Platform (Sept. 26, 2023)
- Cadence AI-Powered Virtuoso Studio Supports RF and mmWave Design Reference Flows for TSMC N16RF, N6RF and N4PRF (Sept. 26, 2023)
- QuickLogic Announces New eFPGA Contract Targeting GlobalFoundries 22FDX® Platform (Sept. 26, 2023)
- Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs (Sept. 26, 2023)
- Infineon's Circular Economy Security Advancing Sustainability for All (Sept. 26, 2023)
- GlobalFoundries Submits Applications for U.S. CHIPS and Science Act Funding (Sep 25, 2023)
- proteanTecs Joins TSMC 3DFabric™ Alliance, Expanding Its Support of the 3D IC Ecosystem (Sep 25, 2023)
- Unlock the Power of DisplayPort v1.4 Tx/Rx PHY and Controller IP Cores: Maximize the Potential of Your Next-Generation Products (Sep 25, 2023)
- Flex Logix Expands Upon Industry-leading Embedded FPGA Customer Base (Sept. 25, 2023)
- proteanTecs Joins TSMC 3DFabric™ Alliance, Expanding Its Support of the 3D IC Ecosystem (Sept. 25, 2023)
- Synopsys and TSMC Advance Analog Design Migration with Reference Flow Across Advanced TSMC Processes (Sept. 25, 2023)
- Synopsys and TSMC Collaborate to Accelerate 2nm Innovation for Advanced SoC Design with Certified Digital and Analog Design Flows (Sept. 25, 2023)
- Arm shares return to offer price (Sept. 25, 2023)
- Alphawave Semi: Interim results for the six months ended 30 June 2023 (Sept. 25, 2023)
- Synopsys tools tape out 2nm chips at TSMC (Sept. 25, 2023)
- Efabless Launches 3rd AI-Generated Open-Source AI Contest to Extend the Caravel SoC Platform with AI-Generated Peripherals (Sept. 25, 2023)
- Rambus MACsec-IP-361 is Certified ASIL-B Ready (Sept. 22, 2023)
- Analog Bits to Join Intel Foundry Services Chip Design Ecosystem Expanding 3nm IP Offerings (Sept. 22, 2023)
- Sustainable Innovation Month - Fostering Innovation Action (Sept. 22, 2023)
- Q2 Revenue for Top 10 Global IC Houses Surges by 12.5% as Q3 on Pace to Set New Record, Says TrendForce (Sep 22, 2023)
- MEEP: An HPC Systems Development Platform for RISC-V Based HW/SW Co-Design (Sept. 22, 2023)
- Infineon heads European research project for advancing the circular economy and sustainability of the electronics industry (Sept. 21, 2023)
- Nordic combines Arm and RISC-V for "remarkable" EEMBC benchmarks (Sep 21, 2023)
- BrainChip Engages VVDN to Deliver Industry's First Commercial Edge Box Based on Neuromorphic Technology (Sept. 21, 2023)
- CEVA, Inc. Appoints Iri Trashanski as Chief Strategy Officer (Sept. 21, 2023)
- Cadence Advances Hyperscale SoC Design with Expanded IP Portfolio for TSMC N3E Process Featuring Next-Generation 224G-LR SerDes IP (Sept. 21, 2023)
- Global 200mm Fabs to Reach Record High Capacity by 2026, SEMI Reports (Sep 21, 2023)
- SMIC Well on Its Way to 5-nm Breakthrough, Observers Say (Sep 21, 2023)
- Alphacore Recognized for its TID Results of 22-nm FDSOI SRAM Published in IEEE Transactions on Nuclear Science journal (Sept. 21, 2023)
- Inuitive Adopts VeriSilicon's Advanced ISP IP for its Vision AI Processor (Sep 21, 2023)
- Kalray announces the availability of its new processor "Coolidge™2", the first DPU optimized for AI and data intensive processing (Sep 21, 2023)
- U.S. Government Awards GlobalFoundries New $3.1 Billion, 10-Year Contract for Secure Chip Manufacturing (Sep 21, 2023)
- Report: TSMC Could Push 2nm Node Back to 2026 (Sept. 21, 2023)
- ADTechnology and BOS Semiconductor Collaborate to develop 5nm automotive semiconductors (Sept. 20, 2023)
- Thalia expands footprint in China with appointment of Business Partner Fionn Liu (Sep 20, 2023)
- Cadence to Acquire Intrinsix Corporation from CEVA (Sept. 20, 2023)
- AiM Future Introduces Next-Generation NeuroMosAIc Processors, Expands Partnerships (Sep 20, 2023)
- UXL looks to standardise heterogeneous compute (Sept. 20, 2023)
- Nordic combines Arm and RISC-V for 'remarkable' EEMBC benchmarks (Sept. 20, 2023)
- Intel launches compact RISC-V Nios processor core (Sept. 20, 2023)
- AccelerComm, Radisys, RFDSP & TTP unveil LEO Regenerative 5G RAN solution (Sept. 20, 2023)
- SEMI Semiconductor Climate Consortium and BCG Issue First Insider Report of Semiconductor Value Chain's Carbon Emissions (Sept. 20, 2023)
- OpenHW Group Appoints Florian 'Flo' Wohlrab as New CEO to Spearhead Open-Source Ecosystem Advancement (Sept. 20, 2023)
- Arm Announces Closing of Initial Public Offering and Full Exercise of Underwriters' Option to Purchase Additional American Depositary Shares (Sept. 19, 2023)
- Rambus Added to PHLX Semiconductor Sector Index (SOX) (Sept. 19, 2023)
- OPENEDGES and VisioNexT Shapes the Future of Vision AI SoCs (Sept. 19, 2023)
- SandBox Semiconductor Adds Hybrid Metrology Capabilities to Industry's Leading Physics-based, AI-enabled Process Optimization Platform, Creating the First Software Solution to Holistically Address Process Development Challenges (Sep 19, 2023)
- Creonic Expands Satellite IP Core Portfolio with DVB-S2X Multi-Carrier Demodulator (Sept. 19, 2023)
- QuickLogic and Xiphera Partner to Pioneer Post-Quantum Cryptography on eFPGAs (Sept. 19, 2023)
- TSMC in talks about chiplet packaging in Arizona (Sept. 19, 2023)
- Cadence Accelerates On-Device and Edge AI Performance and Efficiency with New Neo NPU IP and NeuroWeave SDK for Silicon Design (Sept. 19, 2023)
- Intel Innovation 2023: Empowering Developers to Bring AI Everywhere (Sept. 19, 2023)
- Synopsys Aims to Advance IC Design Workforce in Vietnam (Sept. 19, 2023)
- New RISC-V Market Report Will Provide 5-year Growth Projections for Semiconductor Devices and Insights on the Enabling Ecosystem (Sept. 19, 2023)
- Panmesia Raises $12.5 Million in Seed Funding with a Valuation Exceeding $81.4 Million in the CXL Semiconductor Arena (Sep 18, 2023)
- LIN Controller IP Core, equipped with a Safety package (Safe LIN, ISO 26262: Safety manual, FMEDA), tailored specifically for High-End Automotive and Consumer Applications is available for immediate licensing (Sept. 18, 2023)
- Flex Logix Announces Reconfigurable Block RAM with ECC Option (Sept. 18, 2023)
- Quadric Announces Llama2 LLM Support Immediately Available for Chimera GPNPUs (Sep 18, 2023)
- TCL Joins Via Licensing Alliance's ATSC 3.0 Broadcasting Patent Pool (Sep 18, 2023)
- Driving Europe's Chip Renaissance: TSMC's Vision with ESMC (Sep 18, 2023)
- Synopsys Demonstrates Industry's First Interoperability of PCI Express 6.0 IP with Intel's PCIe 6.0 Test Chip (Sep 18, 2023)
- Continental and Ethernovia Announce Partnership to Develop Automotive Switch in 7nm (Sep 18, 2023)
- Arm Begins 2nd Term on Nasdaq, at $54.5 Billion Valuation (Sep 18, 2023)
- HighTec, Synopsys team for AI on Infineon's AURIX TC4x (Sept. 18, 2023)
- Driving Europes Chip Renaissance: TSMCs Vision with ESMC (Sept. 15, 2023)
- TSMC Accelerates Renewable Energy Adoption and Moves RE100 Target Forward to 2040 (Sept. 15, 2023)
- Fraunhofer IIS and IHSE announce their partnership for new JPEG XS implementations at IBC 2023 (Sept. 14, 2023)
- Arm Announces Pricing of Initial Public Offering (Sept. 14, 2023)
- X-Fab adds new passive integration technology for RF (Sept. 14, 2023)
- Realtek and V-Nova Announce Support for MPEG-5 Part 2 LCEVC on Set-Top-Box SoCs (Sep 14, 2023)
- Lawo and intoPIX Partner to Deliver Edge-Compute JPEG XS Support at IBC 2023 (Sep 14, 2023)
- TSMC Special Board of Directors Meeting Resolutions (Sep 13, 2023)
- Esperanto Technologies Introduces First Generative AI Appliance Based on RISC-V, Enabling Developers to Easily Create and Deploy Purpose-Built Vertical Applications (Sep 13, 2023)
- Fraunhofer IIS introduces Application Support Package to facilitate JPEG XS Integration (Sep 13, 2023)
- intoPIX and Cobalt unveil the future of content delivery with JPEG XS: Introducing the Sapphire mini-converters and Sapphire openGear card powered by intoPIX technology (Sep 13, 2023)
- Optima Design Automation Receives ISO 26262 ASIL D Ready Certification from SGS-TÜV Saar (Sept. 13, 2023)
- Marquee Semiconductor Achieves ISO 9001 Certification for Exemplary Management System (Sep 13, 2023)
- Alchip Collaborates With Arteris To Expand ASIC Design Services (Sept. 13, 2023)
- Optima Design Automation Receives ISO 26262 ASIL D Ready Certification from SGS-TÜV Saar (Sep 13, 2023)
- Efabless Design Challenge Winners Advance the Power of AI in Chip Design (Sept. 13, 2023)
- Cadence Accelerates On-Device and Edge AI Performance and Efficiency with New Neo NPU IP and NeuroWeave SDK for Silicon Design (Sept. 13, 2023)
- TSMC's semiconductor foundry in the United States will begin trial production in Q1 2024 (Sept. 13, 2023)
- Signature IP Extends Global Footprint to Israel with Local Sales and Application Engineering Presence (Sep 12, 2023)
- intoPIX showcases the new lightweight video compression standards and technologies driving automotive innovation at AutoSens 2023 (Sep 12, 2023)
- Hailo Selected VeriSilicon's ISP and Video IP for its AI Vision Processors Empowering Intelligent Surveillance Cameras (Sep 12, 2023)
- GlobalFoundries Officially Opens US$4 Billion Expansion Facility in Singapore, Creating 1,000 New Jobs (Sep 12, 2023)
- Meet T2M at IBC 2023 to explore High Performance, Cost-effective, and Innovative Semiconductor IP Cores for your next generation SoCs (Sep 12, 2023)
- Faraday Unveils 2.5D/3D Advanced Package Service for Chiplets (Sep 12, 2023)
- Allegro DVT Launches a New Generation of High-Performance Multi-Format Video Encoder IP for 4K/8K Video Resolutions (Sep 12, 2023)
- Tachyum Offers Its TPU Inference IP to Edge and Embedded Markets (Sep 12, 2023)
- Bluespec's Accelerate-HLS Leverages RISC-V to Simplify and Speed the Development of HLS Applications (Sep 12, 2023)
- 2024 Global Fab Equipment Spending Recovery Expected After 2023 Slowdown, SEMI Reports (Sep 12, 2023)
- Cadence Unveils Next-Generation AI-Driven OrCAD X Delivering Up to 5X Faster PCB Design and Enabled with Cadence OnCloud (Sept. 12, 2023)
- From Synopsys to Google, New EDA Tools Apply Advanced AI to IC Design (Sept. 12, 2023)
- TSMC August 2023 Revenue Report (Sep 11, 2023)
- Enhanced Artel SMART openGear® Leverages intoPIX JPEG XS Technology for Ultimate Low-Latency Transport Solutions (Sep 11, 2023)
- Semiconductor industry sees revenue increase for the first time since 2021 (Sep 11, 2023)
- CAST adds Ascon Lightweight Encryption Engine to Security IP Cores Line (Sep 11, 2023)
- NR-5G Polar Decoder and Encoder FEC IP Core Available For Licensing and Implementation from Global IP Core (Sep 11, 2023)
- Q2 2023 Global Semiconductor Equipment Billings Dip 2% Year-Over-Year, SEMI Reports (Sep 11, 2023)
- SK hynix's memory chips next in Huawei's 5G phone saga (Sep 11, 2023)
- Renesas Commences Tender Offer for All Outstanding Shares and ADSs of Sequans (Sep 11, 2023)
- Flex Logix Announces Upgraded Emulation Models For EFLX™ eFPGA (Sep 11, 2023)
- Blue Pearl Adds Design Verification and Methodology Services to its Product Portfolio (Sep 11, 2023)
- Getting to grips with RF design (Sept. 11, 2023)
- Is Quantum Computing The Key To a Greener AI Future? (Sept. 11, 2023)
- GBT Receives Patent Grant Notification Covering its Integrated Circuits Reliability Verification Analysis and Auto-Correction Technology (Sep 08, 2023)
- OneNav Closes $17 Million Round, Launches GNSS Augmentation Product (Sep 08, 2023)
- Andes Announces General Availability of the New AndesCore™ RISC-V Multicore Vector Processor AX45MPV (Sep 08, 2023)
- intoPIX to Celebrate Successful Collaboration with Bridge Technologies at IBC 2023 (Sep 08, 2023)
- Samsung Says It Will Beat TSMC's 4nm Production Capacity (Sept. 08, 2023)
- The Future Of Renewable Energy Is Built On Semiconductors (Sept. 08, 2023)
- Synopsys Extends Synopsys.ai EDA Suite with Industry's First Full-Stack Big Data Analytics Solution (Sept. 07, 2023)
- Flanders Semiconductors: The New Hub for Semiconductor Ecosystem at the Heart of Europe (Sep 07, 2023)
- Rambus Completes Sale of PHY IP Assets to Cadence (Sep 07, 2023)
- MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024 (Sep 07, 2023)
- BrainChip Showcases Foundation for next generation AI solutions at AI Hardware & Edge AI Summit (Sep 07, 2023)
- Comcores now offers standalone Reed Solomon Forward Error Correction (RSFEC) IP cores (Sep 07, 2023)
- Synopsys Extends Synopsys.ai EDA Suite with Industry's First Full-Stack Big Data Analytics Solution (Sep 07, 2023)
- Numem Announces Series A Funding Led by Cambium Capital to Propel Memory Solutions for AI and IoT (Sep 07, 2023)
- Arm IPO Likely to Lag Early Expectations, Observers Say (Sep 07, 2023)
- Global Semiconductor Sales Increase 2.3% Month-to-Month in July (Sep 07, 2023)
- Creonic Introduces NCR Processor IP Core for DVB-S2X/DVB-RCS2 Satellite Communication (Sep 07, 2023)
- UMC Reports Sales for August 2023 (Sep 06, 2023)
- VisualSim Secure Model Protector enables companies to collaborate in new product development (Sep 06, 2023)
- GUC Announced 5nm HBM3 PHY and Controller Silicon Proven at 8.4 Gbps (Sep 06, 2023)
- CEVA Bluetooth® 5.4 IP Achieves SIG Qualification, Includes New Features to Address Rapidly Growing Electronic Shelf Label (ESL) Market (Sept. 06, 2023)
- New MIPS CEO Sameer Wasson to Drive Company's RISC-V Market Penetration and Innovation (Sep 06, 2023)
- Intel and Tower Semiconductor announce new US foundry agreement (Sept. 06, 2023)
- Credo Introduces Industry's First Monolithically Integrated CMOS VCSEL Driver in an 800G DSP (Sept. 06, 2023)
- Neural Networks Can Help Keep Connected Vehicles Secure (Sept. 06, 2023)
- TSMC to decide this week whether to invest in Arm IPO (Sept. 06, 2023)
- GUC Monthly Sales Report - Aug 2023 (Sep 05, 2023)
- Cybertek Solution Wins Multiple Contracts in Asia (Sep 05, 2023)
- Arm Announces Launch of IPO Roadshow (Sep 05, 2023)
- Codasip collaborates with Siemens to deliver trace solution for custom processors (Sep 05, 2023)
- Agile Analog joins TSMC Open Innovation Platform IP Alliance Program (Sep 05, 2023)
- Intel Foundry Services and Tower Semiconductor Announce New US Foundry Agreement (Sep 05, 2023)
- Top Ten Semiconductor Foundries Report a 1.1% Quarterly Revenue Decline in 2Q23, Anticipated to Rebound in 3Q23, Says TrendForce (Sep 05, 2023)
- SEMI to License Server Certification Protocol to Help Combat Software Piracy (Sep 05, 2023)
- Toshiba sample software package expands microcontroller development tools ecosystem (Sept. 05, 2023)
- Codasip, Siemens to deliver trace for custom processors (Sept. 05, 2023)
- Samsung To Take Major Step in Revolutionizing the Road Ahead at IAA MOBILITY 2023 (Sept. 05, 2023)
- Arm prices IPO (Sep 04, 2023)
- OPENEDGES Highlights Advanced Memory Subsystem IPs at the AI Hardware & Edge AI Summit 2023 (Sep 04, 2023)
- Embrace the future of sensor communication in your SoC with proven MIPI I3C SMaster, Master, and Slave Controller IP Cores. Licensing opportunities are available for immediate implementation (Sep 04, 2023)
- Logic Fruit Technologies Elevates FPGA Innovation with AMD Xilinx Premier Partnership (Sep 04, 2023)
- Indie Semiconductor Expands Quality Operations (Sep 04, 2023)
- First 22nm FGPA with hardened RISC-V cores (Sept. 02, 2023)
- Nextera-Adeas ST 2110 IP cores are now available on Intel FPGAs (Sep 01, 2023)
- Alphawave Semi Announces Appointment of David Reeder to Board of Directors (Sep 01, 2023)
- Microchip's PolarFire® FPGA's Single-Chip Crypto Design Flow "Successfully Reviewed" By the United Kingdom Government's National Cyber Security Centre (Sep 01, 2023)
- Vital signs: Improving the safety and comfort of vehicles using AI algorithms (Sept. 01, 2023)
- Autonomous cargo drone with sustainable structures and intelligent battery systems (Sept. 01, 2023)
- Cadence Collaborates with Arm to Accelerate Neoverse V2 Data Center Design Success with Cadence AI-driven Flows (Aug. 31, 2023)
- Samsung Expands Semiconductor Foundry Services to Compete with TSMC and Intel (Aug. 31, 2023)
- Allegro DVT Fosters Adoption of MPEG-5 LCEVC Video Codec, Releases a Full Range of LCEVC Products (Aug 31, 2023)
- BorgWarner To Integrate STMicroelectronics Silicon-Carbide Technology (Aug. 31, 2023)
- TOSHIBA RELEASES 3RD GENERATION SILICON CARBIDE MOSFETS WITH REDUCED SWITCHING LOSSES (Aug. 31, 2023)
- GlobalFoundries Announces 9SW RFSOI Technology for Next-Generation Mobile and 5G Applications (Aug. 31, 2023)
- Flexibility, durability and trust - RISC-V conquers the processor market (Aug. 30, 2023)
- GlobalFoundries Announces 9SW RFSOI Technology for Next-Generation Mobile and 5G Applications (Aug. 30, 2023)
- GlobalFoundries Enhances Technology Platforms to Enable Critical Applications for Next Generation Electric and Autonomous Vehicles (Aug. 30, 2023)
- SiFive unveils P870 high-performance core, discusses future of RISC-V (Aug. 30, 2023)
- Exclusive Interview: ST's Muggeri Discusses Industrial Automation, WBG, and Sustainability (Aug. 30, 2023)
- Intel Reveals Two New Xeon Processor Lines at Hot Chips 2023 (Aug. 30, 2023)
- Cadence Collaborates with Arm to Accelerate Neoverse V2 Data Center Design Success with Cadence AI-driven Flows (Aug. 30, 2023)
- BOSCH STARTS PRODUCTION OF 800-VOLT SIC TECHNOLOGY FOR ELECTRIC VEHICLES (Aug. 30, 2023)
- BrainChip and Tata Elxsi Partner to Provide Intelligent, Ultralow-Power Solutions (Aug. 29, 2023)
- Cutting-edge 18-bit 100dB Stereo Audio ADC IP Core proven in 28nm Silicon, Offering Unmatched Audio Signal Processing Capabilities is available for immediate Licensing into Audio Chipsets, Digital Cameras, and Automotive Applications (Aug 29, 2023)
- Driving the Custom Silicon Revolution with Arm Neoverse Compute Subsystems (Aug. 29, 2023)
- GOWIN Semiconductor & Andes Technology Corp. Announce The First Ever RISC-V CPU and Subsystem Embedded 22nm SoC FPGA (Aug. 29, 2023)
- QuickLogic Unveils Customizable eFPGA IP on GlobalFoundries' 12LP Process (Aug. 29, 2023)
- Delivering 'open core surgery' (Aug. 29, 2023)
- Semiconductor Industry News: Recent IPOs, Acquisitions, and Fallen Deals (Aug. 29, 2023)
- REALIZING TIGHT-BINDING HAMILTONIANS USING SITE-CONTROLLED COUPLED CAVITY ARRAYS (Aug. 29, 2023)
- Delivering 'open core surgery' (Aug. 29, 2023)
- oneNav's Patented pureL5 GNSS Solution Proven in Silicon (Aug. 28, 2023)
- Racyics becomes Arm Approved Design Partner (Aug. 28, 2023)
- M31's EPS Soared 24.7% in H1, showing sequential growth (Aug. 28, 2023)
- Nuclei, the World's First RISC-V CPU IP Vendor, Accomplishes ISO 26262 ASIL-D Product Certificate (Aug. 28, 2023)
- T2M Unveils Top-Selling Gigabit Ethernet PHY IP Core with Unlimited Usage and Full Modification rights, available for licensing immediately (Aug. 28, 2023)
- QuickLogic and YorChip Partner to Develop Low-Power, Low-Cost UCIe FPGA Chiplets (Aug. 28, 2023)
- Eliyan Supports Latest Version of UCIe Chiplet Interconnect Standard, Continues to Drive Performance and Bandwidth Capabilities to 40Gbps and Beyond to Help Meet the Needs of the Multi-die Era (Aug. 28, 2023)
- Huawei and Ericsson Sign Long-Term Patent Cross-Licensing Agreement (Aug. 28, 2023)
- GlobalFoundries Unveils Key Innovations at Technology Summit 2023 (Aug 28, 2023)
- BrainChip Receives First Shipment of AKD1500 Chips in Silicon from Technology Partner GlobalFoundries (Aug 28, 2023)
- BrainChip Continues to Expand IP Portfolio with Latest Australian Patent Issuance (Aug. 25, 2023)
- Arm IPO Faces Serious Difficulties, Observers Say (Aug. 25, 2023)
- Intrinsic ID's Pim Tuyls Discusses Embedded Security (Aug. 25, 2023)
- Synopsys Completes Acquisition of PikeTec GmbH (Aug. 24, 2023)
- Synopsys to add generative AI to design tools (Aug. 24, 2023)
- GDDR Does Math, Big-Screen Explosions (Aug. 24, 2023)
- AMD Acquires Mipsology to Deepen AI Inference Software Capabilities (Aug. 24, 2023)
- NIST to Standardize Encryption Algorithms That Can Resist Attack by Quantum Computers (Aug. 24, 2023)
- PQSecure announces IPs for NIST recommended PQC algorithms under FIPS (Aug. 24, 2023)
- Nordic to acquire AI/ML technology in the US (Aug. 24, 2023)
- Weebit Nano appoints Ms Naomi Simson as Non-Executive Director (Aug. 24, 2023)
- sureCore-Led CryoCMOS IP: Toward Scalable Quantum Computers (Aug. 24, 2023)
- Groq Selects Samsung Foundry to Bring Next-gen LPU™ to the AI Acceleration Market (Aug. 24, 2023)
- 2 Startups Tackle Counterfeits, Including TI Chips (Aug 24, 2023)
- Huawei rumoured to be building secret fab stable (Aug 24, 2023)
- Groq Selects Samsung Foundry to Bring Next-gen LPU™ to the AI Acceleration Market (Aug 24, 2023)
- Rambus Safeguards Accelerated Computing with FPGA-targeted Security IP (Aug. 23, 2023)
- Esperanto Pivots to HPC and Generative AI (Aug. 23, 2023)
- Gartner Forecasts Worldwide AI Chips Revenue to Reach $53 Billion in 2023 (Aug. 23, 2023)
- Analysis: Arm IPO filing reveals depth of Chinese risk (Aug 23, 2023)
- A New Home For Europe's Semiconductor Metrology (Aug. 23, 2023)
- Milk-V Launches Milk-V Vega, the World's First RISC-V Open Source 10 Gigabit Ethernet Switch (Aug. 22, 2023)
- Arm Announces Public Filing of Registration Statement for Proposed Initial Public Offering (Aug. 22, 2023)
- China-owned Dream Chip tapes out 10TOPS SoC (Aug. 22, 2023)
- Synopsys Surpasses $500M/Year in AI Chip Revenue, Expects Further Rapid Growth (Aug. 22, 2023)
- Analysis: Arm IPO filing reveals depth of Chinese risk (Aug. 22, 2023)
- Empower Your Wi-Fi 6 and Wi-Fi 6E SoCs with 12-Bit 640Msps Dual Channel ADC and DAC IP Cores, Now Available for Immediate Licensing in Silicon Proven 22nm ULL and ULP Technology (Aug 21, 2023)
- Arm expected to file for IPO this week (Aug 21, 2023)
- Synopsys to add generative AI to design tools (Aug. 21, 2023)
- Samsung semiconductor facility in Texas will produce 4nm AI processors for Groq (Aug. 21, 2023)
- Balancing semiconductor innovation vs sustainability (Aug. 21, 2023)
- Secure RTOS enables high security for microcontroller systems (Aug. 20, 2023)
- Dream Chip Technologies tapes out a 10-TOPS SoC in 22nm with a novel AI Accelerator and an Automotive Functional Safety Processor (Aug. 18, 2023)
- TSMC Forms Task Force to Accelerate 2nm Chip Production (Aug. 18, 2023)
- Creonic Engages in Numerous Research Projects within the 6G Platform (Aug. 17, 2023)
- Silicon Motion Terminates Merger Agreement with MaxLinear and Intends to Pursue Substantial Damages in Excess of the Agreement's Termination Fee Due to MaxLinear's Willful and Material Breaches of the Merger Agreement (Aug. 17, 2023)
- Marvell Introduces Industry's First 5nm Multi-Gigabit PHY Platform (Aug. 17, 2023)
- Synopsys Announces Sassine Ghazi to Assume President and CEO Role Jan. 1, 2024 (Aug. 17, 2023)
- Faraday Announces Infineon's SONOS eFlash is Fully Qualified on UMC's 40ULP Process (Aug. 17, 2023)
- Sirius Wireless Partners with S2C on Wi-Fi6/BT RF IP Verification System for Finer Chip Design (Aug. 17, 2023)
- OpenHW Group Announces Tape Out of RISC-V-based CORE-V MCU Development Kit for IoT Built with Open-Source Hardware & Software (Aug. 17, 2023)
- Synopsys Posts Financial Results for Third Quarter Fiscal Year 2023 (Aug. 17, 2023)
- Metanoia Adopts Omni Design's Multi Giga Sample Data Converters in 5G products (Aug 17, 2023)
- Samsung Establishes R&D Organization in Silicon Valley (Aug. 17, 2023)
- OpenHW Group Delivering RISC-V CORE-V MCU Dev. Kits (Aug. 17, 2023)
- Rapid Silicon Announces RapidGPT's Official Availability (Aug. 16, 2023)
- GBT Technologies, Inc. & Bannix Acquisition Corp. Announce Execution of Patent Purchase Agreement (Aug. 16, 2023)
- NEUCHIPS Announces the Appointment of Ken Lau as Chief Executive Officer (Aug. 16, 2023)
- Tachyum Achieves 192-Core Chip After Switch to New EDA Tools (Aug. 16, 2023)
- DVCon India 2023 | Keynote: "Journeying Beyond AI: Unleashing the Art of Verification" by Sivakumar P R, Founder & CEO, Maven Silicon (Aug. 16, 2023)
- Eliyan Applauds Release of OCP's Latest Multi-die Open Interconnect Standard, BoW 2.0 (Aug. 16, 2023)
- Tower Announces Termination of Intel Acquisition Agreement (Aug. 16, 2023)
- Certus Semiconductor Partners with Pragma Design for Embedded ESD Detection Technology (Aug. 16, 2023)
- Kneron Unveils the KL730 AI Chip, Propelling Low-Energy GPT Solutions at Scale (Aug. 16, 2023)
- Intel Announces Termination of Tower Semiconductor Acquisition (Aug 16, 2023)
- Interview: Arm's SystemReady 2.0 to Secure IoT Devices (Aug. 16, 2023)
- Global Semiconductor Industry on Track for 2024 Recovery but Near-Term Headwinds Remain, SEMI Reports (Aug 16, 2023)
- Is RISC-V Worth the Risk? The Tools & Partners You Need to Know (Aug. 16, 2023)
- Nvidia, Cadence, and Ceva Keep Up With AI Processing Demands (Aug. 16, 2023)
- Intel and Synopsys Expand Partnership to Enable Leading IP on Intel Advanced Process Nodes (Aug. 15, 2023)
- Arteris Wins Gold Stevie® Award in the 2023 International Business Awards® for Technical Innovation of the Year (Aug. 15, 2023)
- Arteris Wins Gold Stevie® Award in the 2023 International Business Awards® for Technical Innovation of the Year (Aug 15, 2023)
- Imec integrates thin-film pinned photodiode into short-wave-infrared imaging sensors (Aug. 15, 2023)
- Collaboration looks to build AI Accelerator chip with analogue in-memory computing (Aug. 15, 2023)
- 21 generative AI startups to watch, according to investors (Aug. 15, 2023)
- Decarbonization Opens Pathway to a Sustainable Future (Aug. 15, 2023)
- Egide raises €2.6m, pulls sale of US business (Aug. 15, 2023)
- OPENEDGES and Telechips Collaborates for Automotive Applications (Aug. 14, 2023)
- CEVA Joins Samsung SAFE™ Foundry Program to Accelerate Chip Design for the Mobile, Consumer, Automotive, Wireless Infrastructure and IoT Markets (Aug. 14, 2023)
- Bluetooth Dual Mode v5.3 RF Transceiver IP Cores in 22nm, 40nm, 55nm is Available for Immediate Licensing for TWS, Audio Chipsets and Automotive Applications (Aug. 14, 2023)
- CEVA Joins Samsung SAFE™ Foundry Program to Accelerate Chip Design for the Mobile, Consumer, Automotive, Wireless Infrastructure and IoT Markets (Aug 14, 2023)
- Intense Competition in Advanced Semiconductor Processes for Automobiles (Aug. 14, 2023)
- Socionext opens Bangalore office (Aug. 14, 2023)
- TSMC allocates $6bn for 2nm capacity in Taiwan (Aug. 12, 2023)
- Andes Technology and TetraMem Collaborate to Build Groundbreaking AI Accelerator Chip with Analog In-Memory Computing (Aug. 11, 2023)
- Socionext Strengthens Design and Development Capabilities with New Office in Bangalore, India (Aug. 11, 2023)
- TSMC July 2023 Revenue Report (Aug 11, 2023)
- Rambus Initiates $100 Million Accelerated Share Repurchase Program (Aug. 11, 2023)
- Associations align around MIPI CSI-2 automotive camera interface (Aug. 11, 2023)
- Siemens teams for China battery technology centre (Aug. 11, 2023)
- UCIe™ (Universal Chiplet Interconnect Express™) Consortium Releases its 1.1 Specification (Aug 10, 2023)
- Intel CEO Voices Concerns About CHIPS Funds, Export Controls (Aug 10, 2023)
- BrainChip and Edge Impulse Offer a Neuromorphic Deep Dive into Next-Gen Edge AI Solutions (Aug. 10, 2023)
- SMIC Reports 2023 Second Quarter Results (Aug. 10, 2023)
- Understanding the Compute Hardware Behind Generative AI (Aug. 10, 2023)
- Blueshift Memory announces successful development of computer vision AI accelerator chip (Aug. 09, 2023)
- MIPI Alliance and Automotive SerDes Alliance Enter Liaison Agreement to Enable Native MIPI CSI-2 Implementation with ASA-ML PHY (Aug. 09, 2023)
- Allegro MicroSystems to Acquire Crocus Technology to Accelerate Innovation in TMR Sensing Technology (Aug. 09, 2023)
- CEVA, Inc. Announces Second Quarter 2023 Financial Results (Aug. 09, 2023)
- Thalia announces new additions to its senior management team and Board (Aug. 09, 2023)
- 3-nm Race to Start in Semiconductor Industry with Chip for Apple iPhone 15 (Aug. 09, 2023)
- Apple, Samsung, Intel, Nvidia to invest in record-breaking IPO of British chip maker Arm: Report (Aug. 09, 2023)
- CAN-XL IP integrated CANsec accelerator (Aug. 09, 2023)
- Leading Semiconductor Industry Players Join Forces to Accelerate RISC-V (Aug. 08, 2023)
- Synopsys Appoints Rob Painter to Board of Directors (Aug. 08, 2023)
- UMC Reports Sales for July 2023 (Aug. 08, 2023)
- TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe (Aug. 08, 2023)
- Synopsys Partners with NowSecure and Secure Code Warrior to Expand Industry-Leading Application Security Testing Solutions Portfolio (Aug. 08, 2023)
- Analog IP tackles side channel attacks (Aug. 08, 2023)
- UCIe™ (Universal Chiplet Interconnect Express™) Consortium Releases its 1.1 Specification (Aug. 08, 2023)
- Unlock seamless video transmission between graphics adapters and LCD displays with readily licensable, silicon-proven LVDS IP cores tailored for the advanced 22FDX process node (Aug. 07, 2023)
- Global Semiconductor Sales Increase 4.7% in Q2 Compared to Q1 (Aug. 07, 2023)
- GUC Monthly Sales Report - July 2023 (Aug. 07, 2023)
- Tenstorrent Raises a $100M Strategic Up-round Co-led by Hyundai Motor Group and the Samsung Catalyst Fund (Aug. 07, 2023)
- CEO Interview: Intrinsic ID's Pim Tuyls on Embedded Security (Aug. 07, 2023)
- DVB-C Demodulator IP Core Available For Immediate Implementation From Global IP Core (Aug. 07, 2023)
- Renesas to Acquire Cellular IoT Technology Leader Sequans Through Tender Offer (Aug. 07, 2023)
- CEVA Doubles Down on Generative AI with Enhanced NeuPro-M NPU IP Family (Aug. 07, 2023)
- Arteris Announces Financial Results for the Second Quarter 2023 and Estimated Third Quarter and Full Year 2023 Guidance (Aug. 07, 2023)
- CEVA Doubles Down on Generative AI with Enhanced NeuPro-M NPU IP Family (Aug. 07, 2023)
- CDAC, Arm partner to enable semiconductor startups in India through Arm Flexible Access for Startups (Aug. 03, 2023)
- Arasan announces its CAN-XL IP with seamlessly integrated CANsec Accelerator IP (Aug. 03, 2023)
- Cadence Advances Pervasive Intelligence at the Edge with Next-Generation Extensible Tensilica Processor Platform (Aug. 03, 2023)
- PCI-SIG® Exploring an Optical Interconnect to Enable Higher PCIe Technology Performance (Aug 03, 2023)
- Certifiably Secure - Xiphera Announces a First Batch of CAVP Validated IP Cores (Aug 03, 2023)
- JEDEC Publishes New Standard to Support CXL Memory Module Implementation (Aug. 02, 2023)
- Mobiveil and Winbond Partner to Deliver HYPERRAM IP Controller to SoC Designers (Aug. 02, 2023)
- University of Virginia Joins the BrainChip University AI Accelerator Program (Aug. 02, 2023)
- Siemens Helps SK hynix Achieve ASPICE Certification (Aug. 02, 2023)
- LeapMind's Ultra Low-Power AI accelerator IP "Efficiera" Achieved industry-leading power efficiency of 107.8 TOPS/W (Aug. 01, 2023)
- Rambus Reports Second Quarter 2023 Financial Results (Aug. 01, 2023)
- Weebit Nano qualifies its ReRAM module for automotive grade temperature (Aug. 01, 2023)
- Dolphin Design enables Orca's RF SoCs for direct-to-satellite communications (Aug. 01, 2023)
- Renesas adopts Visual Studio IDE across entire range (Aug. 01, 2023)
- Synopsys Launches Software Risk Manager to Simplify Enterprise-Scale Application Security Testing (Aug. 01, 2023)
- Terapines ZCC Toolchain Fully Supports Andes RISC-V Processors (Jul. 31, 2023)
- Production-proven CAN Controller IP Core, equipped with a Safety package (Safe DCAN-FD, ISO 26262: Safety manual, FMEDA), tailored specifically for High-End Automotive and Consumer Applications is available for immediate licensing (Jul. 31, 2023)
- PCIe Eyes Road Ahead with AI, Automotive (Jul. 31, 2023)
- Huawei planning on using SMIC to fab 7nm ICs this year (Jul. 31, 2023)
- Remi El-Ouazzane: "A Tsunami of TinyML Devices is Coming" (Jul 31, 2023)
- Weebit Nano: Q4 FY23 Quarterly Activities Report (Jul. 31, 2023)
- America Faces Significant Shortage of Tech Workers in Semiconductor Industry and Throughout U.S. Economy (Jul 31, 2023)
- Huawei plans to use SMIC's 'nearly-7nm' process (Jul. 31, 2023)
- Esperanto Merging HPC and ML in Upcoming RISC-V Processor (Jul. 31, 2023)
- PCIe Eyes Road Ahead with AI, Automotive (Jul. 30, 2023)
- TSMC opens global R&D centre for 1nm push (Jul. 28, 2023)
- Infineon Technologies Utilizes Recyclable PCBs for Sustainable Electronics (Jul. 28, 2023)
- IPCEI: Germany and France bet on joint EU platform for sustainable industry (Jul. 28, 2023)
- Intel Looks to Regain Semiconductor Chip Leadership from TSMC; Separates Manufacturing and Fabless Units (Jul. 27, 2023)
- A methodology for turning an SoC into chiplets (Jul 27, 2023)
- Creonic Unveils CCSDS 131.2 Wideband Modulator IP Core Achieving 1 GSymb/s (Jul. 27, 2023)
- Two IP announcements herald a new normal in chip world (Jul 26, 2023)
- Intrinsic ID Announces QuiddiKey 100 - Providing a Strong Root of Trust Solution for Internet Connected Devices (Jul. 26, 2023)
- Arm and industry leaders launch Semiconductor Education Alliance to address the skills shortage (Jul. 26, 2023)
- Worldwide Silicon Wafer Shipments Rise in Q2 2023, SEMI Reports (Jul. 26, 2023)
- GlobalFoundries Criticizes Germany's Subsidy of TSMC (Jul. 26, 2023)
- Faraday Reports Second Quarter 2023 Results (Jul. 25, 2023)
- Mobiveil and InPsytech Announce Successful Inter-Op Verification of Enterprise Flash Controller Design IP and ONFI 5.1 PHY IP (Jul. 25, 2023)
- YorChip launches UniPHY™️ - the first dual-use PHY for Chiplets (Jul. 25, 2023)
- A methodology for turning an SoC into chiplets (Jul. 25, 2023)
- ARMv8 boost for Tegrion security controller (Jul. 25, 2023)
- Soitec Reports FY'24 First Quarter Revenue (Jul. 25, 2023)
- Could AMD use IFS? (Jul 24, 2023)
- Has the electronics market bottomed out? (Jul 24, 2023)
- 12bit 640Msps Dual-Channel IQ ADC High-Speed/High-Performance IP Cores for WiFi RF SoC is available for immediate licensing (Jul. 24, 2023)
- Chip Experts See Talent Shortage as Main Growth Hurdle (Jul 24, 2023)
- Singapore opens US$2bn chiplet factory (Jul. 24, 2023)
- Cadence RTL design tool claims 5x faster RTL convergence (Jul. 24, 2023)
- RISC-V Moving Toward Open Server Specification (Jul. 24, 2023)
- Siemens launches assistive AI solution for IC design and verification (Jul. 24, 2023)
- Promising Returns For Synopsys.ai Suite Of AI Solutions (Jul. 24, 2023)
- Sustainability and Digitalization: The Road to Tech-Positive (Jul. 24, 2023)
- IoT security label planned for smart consumer IoT devices in U.S. (Jul. 22, 2023)
- Cadence to Acquire Rambus PHY IP Assets (Jul. 21, 2023)
- TSMC Reports Second Quarter EPS of NT$7.01 (Jul 21, 2023)
- The revolutionary potential of 3D IC technology in the semiconductor ecosystem (Jul. 21, 2023)
- Thalia raises $2.7m for IP reuse tool (Jul. 21, 2023)
- BrainChip's Latest US Patent Award Extends Intellectual Property Strength and its Leadership in Edge Learning (Jul. 20, 2023)
- Thalia Secures $2.7 Million Funding to Strengthen Position as Leading IP Reuse Partner for Semiconductor Industry (Jul. 20, 2023)
- Semidynamics announces fully customisable, 4-way, Atrevido 423 RISC-V core for big data applications (Jul. 20, 2023)
- Synopsys Accelerates Advanced Chip Design with First-Pass Silicon Success of IP Portfolio on TSMC 3nm Process (Jul. 20, 2023)
- Arm expands open-source partnerships to reinforce commitment to open collaboration (Jul. 20, 2023)
- SK hynix adopts Siemens' Polarion to help gain Korea's first ASPICE certification (Jul. 20, 2023)
- Schneider takes lead to decarbonise semiconductor value chain (Jul. 20, 2023)
- New Wave Design and Verification Appoints Ike Song to Advisory Committee (Jul. 19, 2023)
- Expedera Announces LittleNPU AI Processors for Always-Sensing Camera Applications (Jul. 19, 2023)
- Lightelligence Partners With ZeroPoint Technologies to Increase Data Center Connectivity Performance by Up to 50% (Jul. 19, 2023)
- Cadence, GlobalFoundries, Hoerzentrum Oldenburg and Leibniz University Hannover Collaborate to Advance Hearing Aid Technology (Jul. 19, 2023)
- VSORA reveals Jotunn generative AI processor (Jul. 19, 2023)
- Passport for a sustainable European electronics supply chain (Jul. 19, 2023)
- How semiconductor firms are chipping in on sustainability (Jul. 19, 2023)
- Schneider Electric Partners with Intel and Applied Materials to Decarbonize Semiconductor Value Chain (Jul. 19, 2023)
- How China is Building an Open National Chip Plan Around RISC-V (Jul. 19, 2023)
- VSORA Announces All-in-One Single Chip Architecture to Meet Generative AI Processing Challenges (Jul 19, 2023)
- HCL Technologies US$ 300 Million Bet on India's Semiconductor Industry (Jul. 19, 2023)
- Minimize Design Risk and Achieve First-Pass Silicon Success on TSMC's N3E Process (Jul. 19, 2023)
- DENSO Adopts Attopsemi's OTP to Upgrade Future Automotive Products (Jul. 18, 2023)
- Startups Help RISC-V Reshape Computer Architecture (Jul. 18, 2023)
- OmniSpeech, Cadence Tensilica team up on voice AI technology (Jul. 18, 2023)
- Samsung Shipping First GAAFET Silicon; 3nm and 4nm Yields Are Improving - Report (Jul. 18, 2023)
- Accelerate the verification process of your design IP by licensing the Verification IP Cores, which come equipped with a solid track record of automotive compatibility (Jul. 17, 2023)
- RED Semiconductor and Crypto Quantique agree MOU for Development of Chip with Advanced Processing Capability and Quantum-based Security (Jul. 17, 2023)
- GMAC Intelligence Goes Big with BrainChip Partnership (Jul 17, 2023)
- The industry's first RISC-V IoT security chip, "Towngas Chip", had sold over 1,000,000 pieces (Jul 17, 2023)
- Cadence Unveils Joules RTL Design Studio, Delivering Breakthrough Gains in RTL Productivity and Quality of Results (Jul. 17, 2023)
- Allegro DVT joins the DVB Project (Jul. 17, 2023)
- SMIC: Resignation of Chairman of the Board and Executive Director Appointment of Chairman of the Board and Change of Authorised Representative (Jul. 17, 2023)
- Cadence Joules RTL Design Studio delivers breakthrough gains (Jul. 17, 2023)
- DAC 2023: RISC-V is not in the future, it's now (Jul. 17, 2023)
- Radiofrequency & silicon photonics for high-performance, low-power, secure data transmission (Jul. 17, 2023)
- M31 Partners with Intel IFS Alliance to Present Latest IP Development Achievements (Jul. 14, 2023)
- The Future of Mobility: Fraunhofer IPMS drives the Revolution in Vehicle Architecture (Jul. 13, 2023)
- European Commission Approves Broadcom's Acquisition of VMware (Jul. 13, 2023)
- Truechip Announces First Customer Shipment Of USB4v2 Verification IP (Jul. 13, 2023)
- Global Semiconductor Equipment Sales Forecast: $87 Billion in 2023 With 2024 Rebound, SEMI Reports (Jul. 13, 2023)
- Rambus Delivers Quantum Safe IP Solutions with Next-Generation Root of Trust for Data Center Security (Jul. 13, 2023)
- Cycuity Achieves ISO/SAE 21434 Certification for Automotive Cybersecurity Compliance (Jul. 12, 2023)
- Crypto Quantique Selected for European Innovation Council (EIC) Grant Funding (Jul. 12, 2023)
- T2M Presents Silicon Proven MIPI D-PHY and DSI Controller IP Cores in 12FFC & 22ULL For Your Next Generation Display Products (Jul. 12, 2023)
- Cadence Digital, Custom/Analog Design Flows Certified and Design IP Available for Intel 16 FinFET Process (Jul. 12, 2023)
- Intelligent terminals applications given an innovation enhancement through AI acceleration (Jul 12, 2023)
- TSMC to construct second chip plant in Japan, aims to start production in 2026 (Jul. 11, 2023)
- proteanTecs and Teradyne Partner to Bring Machine Learning-driven Telemetry to SoC Testing (Jul. 11, 2023)
- Second contest for Generative AI chip design (Jul. 11, 2023)
- Imperas details verification of automotive AI RISC-V vector processor IP (Jul. 11, 2023)
- 'Correct by construction' tool for chip power layout down to 2nm (Jul. 11, 2023)
- Siemens' Calibre platform now certified for IFS' Intel 16 process technology (Jul. 11, 2023)
- Synopsys Delivers Certified EDA Flows and High-Quality IP for Intel 16 Process (Jul. 11, 2023)
- Spectral Design & Test Inc joins TSMC OIP IP Alliance (Jul. 11, 2023)
- Faraday's Launched SerDes Advanced Service to Accelerate ASICs into Production (Jul. 11, 2023)
- Arasan's MIPI CSI-2 IP achieves ISO26262 ASIL-C Certification for MIPI C-PHY Connectivity (Jul. 11, 2023)
- T2M invites Customers to explore High Performance, Cost-effective and Innovative IP Cores Solutions at DAC 2023 (Jul 10, 2023)
- Bespoke EDA Differentiates Silicon Chips (Jul 10, 2023)
- Samsung Reports Net Zero Progress, Pledges Over $5B by 2030 (Jul. 10, 2023)
- Siemens advances intelligent custom IC verification platform with new, AI-powered Solido Design Environment (Jul. 10, 2023)
- End-to-end design and verification for PCIe 6.0 (Jul. 10, 2023)
- Xpeedic Launches High-Speed Digital Signal Integrity, Power Integrity Suite at Design Automation Conference (Jul. 10, 2023)
- Alphawave Semi Spearheads Chiplet-Based Custom Silicon for Generative AI and Data Center Workloads with Successful 3nm Tapeouts of HBM3 and UCIe IP (Jul. 10, 2023)
- Siemens unveils Calibre DesignEnhancer for Calibre correct-by-construction IC layout optimization (Jul. 10, 2023)
- Cadence and Imperas Support NSITEXE in the Development of Advanced RISC V Vector Processor IP for Automotive AI Applications (Jul. 10, 2023)
- Electronic System Design Industry Logs $4 Billion in Revenue in Q1 2023, ESD Alliance Reports (Jul 10, 2023)
- Siemens advances intelligent custom IC verification platform with new, AI-powered Solido Design Environment (Jul. 10, 2023)
- Siemens expand collaboration with AWS to help IC and electronics design customers accelerate innovation (Jul. 10, 2023)
- TSMC June 2023 Revenue Report (Jul 10, 2023)
- Global Semiconductor Sales Increase 1.7% Month-to-Month in May (Jul 07, 2023)
- sureCore and Universal Quantum announce tape out of cryogenic IP demonstrator chip (Jul 07, 2023)
- Efabless Corporation Launches Its Second AI-Generated Chip Design Contest (Jul 07, 2023)
- New PNG Encoder IP Core Expands CAST's Lossless Compression Suite (Jul 06, 2023)
- True Circuits Attends 60th Design Automation Conference, Celebrates 25 Years of Timing Excellence (Jul 06, 2023)
- IC Manage GDP-XL Enterprise IP Catalog enables NXP to Improve IP Asset Management and Reuse (Jul 06, 2023)
- Despite Export Ban on Equipment, China's Semiconductor Expansion in Mature Processes Remains Strong, Says TrendForce (Jul 06, 2023)
- UMC Reports Sales for June 2023 (Jul 06, 2023)
- Imperas Helps Navigate the Journey to RISC-V Based Silicon at DAC 2023 (Jul 06, 2023)
- Codasip welcomes Axel Strotbek as new chairman of the board (Jul 06, 2023)
- SilTerra Leverages Silvaco's Library Characterization and Optimization Tools to Boost Efficiency in the Development of its Foundry Standard Cell IPs (Jul 06, 2023)
- Empowering Greener Future: Role Of Energy Storage Systems (Jul. 06, 2023)
- EUROPRACTICE starts offering access to Pragmatic's flexible integrated circuit foundry services through imec (Jul 05, 2023)
- Faraday to Exhibit FPGA-Go-ASIC, SONOS eFlash, and eFPGA Solutions at DAC 2023 (Jul 05, 2023)
- True Circuits Announces Availability of JSPICE™ Simulation and Design Environment (Jul 05, 2023)
- GUC Monthly Sales Report - June 2023 (Jul 05, 2023)
- Truechip: Exhibiting and Showcasing Latest Verification IPs and NOC IPs at Design Automation Conference (DAC) 2023 (Jul 05, 2023)
- imec looks to process flow for sub-nm stacked CFET transistors (Jul. 05, 2023)
- proteanTecs to Showcase the Future of Health and Performance Monitoring at DAC and SEMICON West 2023 (Jul. 05, 2023)
- AI Can't Design Chips Without People (Jul. 04, 2023)
- Imec Advances GaN-on-Si and InP-on-Si Technologies for Next-Gen Wireless Communication (Jul. 04, 2023)
- Samsung tapes out 2nm backside routing test chip (Jul. 04, 2023)
- Advanced Packaging, Performance, power, size, weight, cost... The choice is yours! (Jul. 04, 2023)
- Infineon and Kontrol join forces to improve the safety of autonomous vehicles (Jul. 04, 2023)
- Bluetooth Dual Mode V5.3 RF Transceiver IP Cores in 40nm ULP is Available for Immediate Licensing (Jul. 03, 2023)
- Single Carrier Modem Available For Immediate Licensing From Global IP Core (Jul. 03, 2023)
- Synopsys and Golden Electronics Collaborate to Expand Chip Design Talent in Jordan (Jul. 03, 2023)
- StarFive and Youyeetoo jointly delivered the official metal case for VisionFive 2 (Jul. 03, 2023)
- ADTechnology Joins Synopsys IP OEM Partner Program (Jul. 03, 2023)
- OPENEDGES Showcases Live Demo of PHY Vision at Design Automation Conference (DAC) 2023 (Jul. 03, 2023)
- AccelerComm Announces 5G PUSCH Channel Equalizer (Jul. 03, 2023)
- Tiempo Secure's new TESIC RISC-V IP successfully passes SERMA CC EAL5+ security assessment tests (Jul. 03, 2023)
- Rapidus CEO Chasing Single-Wafer-Processing Dream (Jul. 03, 2023)
- Canada's semiconductor industry seeks renaissance from AI, shifting geopolitics (Jul. 03, 2023)
- CAST Introduces New MACsec Protocol Engine IP Cores (Jun. 30, 2023)
- Bluespec Launches New MCUX RISC-V Processor That Enables Developers to Implement Custom Instructions and Add Accelerators (Jun. 29, 2023)
- Ansys and Synopsys Accelerate RFIC Semiconductor Design with New Reference Flow for Samsung Technology (Jun. 29, 2023)
- Vitesco Technologies And Rohm Have Signed A Long-Term Sic Supply Partnership (Jun. 29, 2023)
- Intel and Movellus Develop Different Fixes For IC Voltage Droop (Jun. 29, 2023)
- Quadric Joins the Silicon Catalyst In-Kind Partner Ecosystem (Jun. 29, 2023)
- Cadence Expands Collaboration with Samsung Foundry, Providing Differentiated Reference Flows Based on the Integrity 3D-IC Platform (Jun 29, 2023)
- Secure-IC's Securyzr achieves ISO 26262 ASIL-D certification, reinforcing its commitment to Automotive Safety and Security (Jun. 29, 2023)
- AMD Introduces World's Largest FPGA-Based Adaptive SoC for Emulation and Prototyping (Jun. 29, 2023)
- Weebit Nano's ReRAM IP now fully qualified in SkyWater Technology's S130 process (Jun. 29, 2023)
- Samsung Foundry Certifies Cadence Virtuoso Studio Flow to Automate Analog IP Migration on Advanced Process Technologies (Jun 29, 2023)
- Korean prosecutors name ex-Samsung exec who tried to set up copy-cat fab in China and the Taiwanese backer (Jun 29, 2023)
- Lightelligence Revolutionizes Big Data Interconnect with World's First Optical Network-on-Chip Processor (Jun. 29, 2023)
- OKI IDS adopts Siemens Catapult High-Level Synthesis platform for design and verification services (Jun. 29, 2023)
- Celestial AI, the Creator of the Photonic Fabric Optical Interconnect Technology Platform, Raises $100 Million in Series B Funding (Jun. 29, 2023)
- Worldwide Semiconductor Foundry Market Grew 27.9% YoY in 2022, Projected to Decrease by 6.5% YoY in 2023 due to Inventory Adjustments, IDC Finds (Jun. 29, 2023)
- Leti Innovation Days: Do More With Less (Jun. 29, 2023)
- M31 Announces New 12nm Digital PLL IP to Drive the Benefits of IoT Clock Technology (Jun. 28, 2023)
- CEVA Introduces Channel Sounding over Bluetooth to Enable High-Accuracy Secure Positioning for Automotive, Industrial and the IoT Ecosystem (Jun. 28, 2023)
- Synopsys and Samsung Foundry Deepen Collaboration to Accelerate Multi-Die System Design for Advanced Samsung Processes (Jun. 28, 2023)
- Synopsys and Samsung Foundry Boost Power, Performance and Area for Modern SoCs on Samsung's SF2 Process (Jun. 28, 2023)
- DCAN FD Full - a final step to CAN XL? (Jun. 28, 2023)
- Siemens extends support for Samsung Foundry's latest process technologies (Jun 28, 2023)
- Samsung Electronics Unveils Foundry Vision in the AI Era at Samsung Foundry Forum 2023 (Jun. 28, 2023)
- Cadence Digital and Custom/Analog Design Flows Certified for Samsung Foundry's SF2 and SF3 Process Technologies (Jun. 28, 2023)
- Cadence Delivers Certified, Innovative Backside Implementation Flow to Support Samsung Foundry SF2 Technology (Jun. 28, 2023)
- CEVA Introduces Channel Sounding over Bluetooth® to Enable High-Accuracy Secure Positioning for Automotive, Industrial and the IoT Ecosystem (Jun 28, 2023)
- The European Project Creating Extensible, Energy-Efficient RISC-V CPUs (Jun. 28, 2023)
- Leti details move to 10nm, 7nm FD-SOI process in Europe (Jun. 28, 2023)
- Andes Technology Unveils the Annual Andes RISC-V CON, Scheduled for June 27th at the San Jose Airport DoubleTree Hotel (Jun. 27, 2023)
- Arasan furthers the compliance of their I3C IP with its participation in the I3C Interop at MIPI Member Meeting (Jun. 27, 2023)
- Blue Pearl Software and NanoXplore SAS team to Accelerate Development and Verification of Radiation Hardened FPGA Designs (Jun. 27, 2023)
- Dolphin Design unveils an innovative IP for sound classification cutting down energy by 99% (Jun. 27, 2023)
- Comcores Unveils JESD204 IP Core Integration Guide to Streamline Customer PHY Integration Challenges (Jun. 27, 2023)
- Logic Fruit Technologies: Exhibiting and Showcasing Cutting-Edge Solutions at Design Automation Conference (DAC) 2023 (Jun. 27, 2023)
- MAXEYE License and Deploy CEVA Sensor Fusion Software in Digital Pen for Leading Global Mobile OEM (Jun. 27, 2023)
- YorChip and Siloxit Collaborate on Industry's First Secure Data Acquisition Chiplet for Mass Markets (Jun. 27, 2023)
- Cadence AI-Based Virtuoso Studio Certified for Samsung Foundry PDKs for Mature and Advanced Nodes (Jun. 27, 2023)
- Bluespec Launches New MCUX RISC-V Processor That Enables Developers to Implement Custom Instructions and Add Accelerators (Jun. 27, 2023)
- MAXEYE License and Deploy CEVA Sensor Fusion Software in Digital Pen for Leading Global Mobile OEM (Jun. 27, 2023)
- With NextGen, CEA is inventing the future generations of electronic chips to maintain France's competitiveness (Jun. 27, 2023)
- BrainChip Selects IPro Silicon IP to Serve Israel's high growth AI market (Jun. 26, 2023)
- DB GlobalChip Deploys Cadence's Spectre FX and AMS Designer, Accelerating IP Verification by 2X (Jun. 26, 2023)
- 12Bit ADC and DAC IP Cores with High-Speed, High-Performance for Wireless applications that requires RF are available for immediate licensing (Jun. 26, 2023)
- Rapidus CEO Chasing Single-Wafer-Processing Dream (Jun. 26, 2023)
- SEMIFIVE announces commercialization of its 5nm HPC SoC Platform with lead partner Rebellions, AI Chipmaker startup based in Korea (Jun. 26, 2023)
- How Will 5G Advanced Change RF Design? (Jun. 26, 2023)
- CXL: The key to memory capacity in next-gen data centers (Jun. 26, 2023)
- TSMC Plans Collaboration on 2nm Chips with Potential Clients (Jun. 26, 2023)
- Leti Innovation Days: From Lab to Fab and the Future of Semiconductors (Jun. 25, 2023)
- aiMotive achieves an industry first milestone with ISO26262 ASIL B certification for aiWare4 NPU IP (Jun 23, 2023)
- Synopsys: Blending AI Innovation With Robust IP For Semiconductor Dominance (Jun. 23, 2023)
- DRAM Alternative Spawns U.K. Startup (Jun 22, 2023)
- Intel Provides Update on Internal Foundry Model (Jun. 22, 2023)
- Codasip partners with SmartDV to accelerate chip design projects (Jun. 22, 2023)
- Do Startups Have a Place in the Semiconductor Supply Chain? (Jun. 22, 2023)
- Airbus and STMicroelectronics to develop silicon carbide power electronics for aircraft (Jun. 22, 2023)
- Quadric Announces Vision Transformer Support for Chimera GPNPUs (Jun. 21, 2023)
- OPENEDGES Achieves Tapeout of LPDDR5x/5/4x/4 PHY IP on 5nm SF5A Process Technology (Jun. 21, 2023)
- SiC and GaN Drive Vehicle Electrification (Jun. 21, 2023)
- Can Any Novel Architecture Topple the Mighty GPU? (Jun. 20, 2023)
- Global Top Ten IC Design Houses Break Even in Q1, Hope for Recovery in Q2 Bolstered by AI Demand, Says TrendForce (Jun 20, 2023)
- RISC-V Europe Summit Debuts Among Signs of Significant Growth in Advanced IoT Applications (Jun. 20, 2023)
- Jim Keller on AI, RISC-V, Tenstorrent's Move to Edge IP (Jun. 20, 2023)
- Concentrated competence in battery management: Vitesco Technologies France cooperates with CEA (Jun. 20, 2023)
- MosChip appoints Dr. Naveed Ahmed Sherwani to the Board of Directors (Jun. 20, 2023)
- Chips Acts' Role in Reshaping a Global Industry (Jun. 19, 2023)
- Introducing T2M's Key IP Cores Empowering AI Chipsets and unleashing the true AI Potential (Jun. 19, 2023)
- MosChip Announces the appointment of Semiconductor Industry Veteran Dr. Naveed Ahmed Sherwani to the Board of Directors (Jun. 19, 2023)
- Blueshift Memory and Crypta Labs to develop quantum-resilient cybersecurity memory module (Jun. 19, 2023)
- SEGGER adds Stack Overflow Prevention (STOP) technology to Embedded Studio for ARM (Jun. 19, 2023)
- Extending Moore's Law: CEA-Leti & Intel to Develop Atomically Thin 2D TMDs on 300mm Wafers Using Layer Transfer Technology for Future Transistor Scaling (Jun. 19, 2023)
- Samsung to apply AI, big data tech to entire chipmaking process (Jun. 19, 2023)
- Intel plans US$25 billion Israel wafer fab spend (Jun. 19, 2023)
- M31 Has Expanded MIPI IP Portfolio, Successfully Validated 7nm MIPI C/D PHY Combo IP (Jun. 16, 2023)
- DFSPI IP Core from DCD supports all serial memories available on the market. (Jun. 16, 2023)
- Creonic Releases Ultrafast BCH Decoder IP Core, Processing One Codeword per Clock Cycle (Jun. 16, 2023)
- Semiconductor Industry Sustainability Priorities - A Systems Engineering Opportunity (Jun. 16, 2023)
- Leveraging IBIS-AMI Models to Optimize PCIe 6.0 Designs (Jun. 15, 2023)
- Soitec reports full year results of fiscal year 2023 (Jun. 15, 2023)
- Secure-IC & NSITEXE extend strategic partnership to provide security solutions for Cyber-Physical Systems (CPS) (Jun. 15, 2023)
- Capturing Innovation: Logic Fruit Technologies Triumphs with ARINC 818 Video Processing and Switching Module Copyright (Jun. 15, 2023)
- Meeting the Major Challenges of Modern Memory Design (Jun. 15, 2023)
- Axiomose testimonial from AMD (Jun. 15, 2023)
- Simplifying the Analog and Mixed-Signal IC Design Process (Jun 15, 2023)
- Droop response system IP made available for SoC designs (Jun 15, 2023)
- MosChip's strategic initiatives in India's rising semiconductor market: acquisitions, collaborations, and innovations (Jun. 15, 2023)
- Global Semiconductor Materials Market Revenue Reaches Record $73 Billion in 2022, SEMI Reports (Jun 15, 2023)
- Samsung fab cobbling IP offerings for data-intensive SoCs (Jun 15, 2023)
- Nanusens secures first IP license for its revolutionary MEMS-in-ASICs™ sensor technology (Jun. 15, 2023)
- Cadence Announces $200 Million Accelerated Share Repurchase Agreement (Jun. 15, 2023)
- SK Powertech Adopts Silvaco's Victory TCAD Solution for the Development of Next Generation SiC Power Devices (Jun. 15, 2023)
- Arm approaches TSMC, Apple, Google, Microsoft and Samsung for anchor investments prior to IPO (Jun. 15, 2023)
- Global 300mm Fab Equipment Spending Forecast to Reach Record $119 Billion in 2026, SEMI Reports (Jun 14, 2023)
- Chiplets advancing one design breakthrough at a time (Jun 14, 2023)
- Synopsys and Samsung Collaborate to Deliver Broad IP Portfolio Across All Advanced Samsung Foundry Processes (Jun. 14, 2023)
- PCI-SIG® Announces New Research Projecting PCI Express® Technology TAM Expected to Reach $10 Billion by 2027 (Jun. 14, 2023)
- Exec tried to set up copy-cat Samsung fab in China (Jun 14, 2023)
- Alphawave Semi Expands Collaboration with Samsung, Adds 3nm Connectivity IP to Meet Accelerated AI and Data Center Demand (Jun. 14, 2023)
- Intel talking to Arm about becoming an anchor investor in Arm IPO (Jun 14, 2023)
- Signature IP chooses IPro for Sales Representation in Israel (Jun. 14, 2023)
- Cadence and Samsung Foundry Enter Multi-Year Agreement to Expand Design IP Portfolio (Jun. 14, 2023)
- proteanTecs Achieves ASIL-B Automotive Functional Safety Certification (Jun. 14, 2023)
- Samsung Electronics to hoist foundry IP portfolio to narrow gap with TSMC (Jun. 14, 2023)
- Cadence and Samsung Foundry to expand 5nm automotive IP (Jun. 14, 2023)
- Intel in cooler chips project (Jun. 14, 2023)
- PCI-SIG® Announces New Research Projecting PCI Express® Technology TAM Expected to Reach $10 Billion by 2027 (Jun 14, 2023)
- Samsung broadens IP portfolio to narrow gap with TSMC (Jun. 14, 2023)
- BittWare selects EdgeCortix's SAKURA-I AI Processors as its Edge Focused Artificial Intelligence Acceleration Solution (Jun. 13, 2023)
- AONDevices Introduces Breakthrough Super Low-Power, Low-Latency, Customizable Edge AI Speech Enhancement (Jun. 13, 2023)
- Lockheed Martin and GlobalFoundries Collaborate to Advance Innovation and Resiliency of Chips for National Security (Jun. 13, 2023)
- Achronix Pushes the Boundaries of Networking with 400 GbE and PCIe Gen 5.0 for SmartNICs (Jun. 13, 2023)
- Efabless Reveals Winners of AI-Generated Silicon Design Challenge (Jun. 13, 2023)
- First Generation SiMa.ai Edge AI Platform Enters Mass Production Amidst Surge in Company Momentum (Jun. 13, 2023)
- Tachyum Among Recipients of 8.1 Billion Euro IPCEI Grant (Jun 13, 2023)
- Movellus Announces Industry-First Integrated Droop Response System for SoCs (Jun. 13, 2023)
- Chiplets advancing one design breakthrough at a time (Jun. 13, 2023)
- TSMC's biggest chiplet backend fab opens for business (Jun. 13, 2023)
- Intel to anchor rival chip designer Arm's IPO? (Jun. 13, 2023)
- BrainChip Examines New Approach to Optimizing Time-series Data (Jun. 12, 2023)
- Jim Keller on AI, RISC-V, Tenstorrent's Move to Edge IP (Jun. 12, 2023)
- Top 10 Foundries Report Nearly 20% QoQ Revenue Decline in 1Q23, Continued Slide Expected in Q2, Says TrendForce (Jun 12, 2023)
- Securing Embedded Systems - Making it the Norm (Jun. 12, 2023)
- SynSense releases the Speck™ Demo kit, enabling users to rapidly deploy and validate event-based neuromorphic vision applications (Jun 12, 2023)
- Apple completes its ARM lineup with 5nm, 134billion transistor M2 Ultra (Jun. 12, 2023)
- Intel German fab in doubt (Jun. 12, 2023)
- The Semiconductor Industry's Most Important Tool Goes Green (Jun. 12, 2023)
- RISC-V Summit Europe 2023 ended in Barcelona but the #riscv revolution has only just begun (Jun. 10, 2023)
- TSMC May 2023 Revenue Report (Jun. 09, 2023)
- TSMC Announces the Opening of Advanced Backend Fab 6, Marking a Milestone in the Expansion of 3DFabric™ System Integration Technology (Jun. 09, 2023)
- D&R IP SoC Day China (Jun. 09, 2023)
- Arasan announces the Industry's First CAN FD Light Bus Controller IP (Jun. 08, 2023)
- Imec's process technology roadmap to 2036 (Jun. 08, 2023)
- Q1 2023 Global Semiconductor Equipment Billings Grow 9% Year-Over-Year, SEMI Reports (Jun. 08, 2023)
- Infineon's HYPERRAM™ 3.0 memory and Autotalks' 3rd generation chipset drive next-generation automotive V2X applications (Jun. 08, 2023)
- Computex 2023 Reveals Taiwan's Critical Role in AI (Jun. 08, 2023)
- Cortus Launches ULYSS automotive MCU family (Jun. 08, 2023)
- Leading Aerospace and Defense Company purchases Interlaken IP core from Comcores (Jun. 08, 2023)
- EU approves €21bn regional IPCEI microelectronics project (Jun. 08, 2023)
- Defacto will celebrate its 20th anniversary at DAC with customer presentations and major technical announcements (Jun. 07, 2023)
- Global Semiconductor Sales Increase 0.3% Month-to-Month in April (Jun. 07, 2023)
- Arm SystemReady surpasses 100 certifications, driving standardization where it matters (Jun. 07, 2023)
- Kalray Announces Production Launch of New "Coolidge™2" DPU Processor Optimized for AI and Intensive Data Processing (Jun. 07, 2023)
- S2C Accelerates Development Timeline of Bluetooth LE Audio SoC (Jun. 07, 2023)
- intoPIX and PlexusAV Pioneer IPMX Standard-Based AV-over-IP Solutions (Jun. 07, 2023)
- Green Hills Software adds support for production-ready RTOS and tools to Imagination Technologies' RISC-V CPUs (Jun. 07, 2023)
- Kalray Announces Production Launch of New "Coolidge™2" DPU Processor Optimized for AI and Intensive Data Processing (Jun 07, 2023)
- Cadence expands Arm agreement for EDA tool verification (Jun. 07, 2023)
- Renesas Completes Acquisition of Panthronics (Jun. 07, 2023)
- MIPI DevCon 2023 - Cancelled (Jun. 07, 2023)
- Actions Technology Partners with PUFsecurity to Secure Wireless Bluetooth and IoT Applications (Jun. 06, 2023)
- VeriSilicon Obtained Bluetooth 5.3 Certification for Its Complete Bluetooth Low Energy Solution (Jun. 06, 2023)
- UMC Reports Sales for May 2023 (Jun. 06, 2023)
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- Dolphin Design Selects Imperas for Processor Functional Design Verification (Jun. 05, 2023)
- Dolphin Design picks Imperas for processor functional verification (Jun. 05, 2023)
- Complete RISC-V analog IP subsystem targets IoT (Jun. 05, 2023)
INTERVIEW: 'Intel is committed to reaching net-zero greenhouse gas emissions by 2040, already runs operations globally by over 90% on renewable electricity': CSO
(Jun. 05, 2023)- Axiomise Launches Next-Generation formalISA App for RISC-V Processors (Jun. 02, 2023)
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- The Six Semiconductor of OPENEDGES Joins Canada's Semiconductor Council (Jun. 01, 2023)
- Semidynamics announces largest, fully customisable Vector Unit in the RISC-V market, delivering up to 2048b of computation per cycle for unprecedented data handling (Jun. 01, 2023)
- UltraRISC Selects Valtrix STING for Verification of RISC-V SoC Designs (Jun. 01, 2023)
- Tachyum Testing Applications on Prodigy FPGA (Jun. 01, 2023)
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- University of Oklahoma Joins the BrainChip University AI Accelerator Program (Jun. 01, 2023)
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- SDIC Licenses 8051 Microcontroller IP Cores from CAST (May. 30, 2023)
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- MIPS Leverages Siemens' Veloce proFPGA platform to Implement and Make Available Capabilities of its New High-Performance eVocore P8700 RISC-V Multiprocessor (May. 30, 2023)
- U.S. Government Accredits GlobalFoundries to Manufacture Trusted Semiconductors at New York Facility (May 30, 2023)
- Samsung's June 2023 Reveal: Enhanced 3nm & 4nm Chip Fabrication Process (May. 30, 2023)
- Arm tapes out Cortex X4 on TSMC N3E (May. 30, 2023)
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- Capgemini and Google Cloud expand long-standing partnership to create first-of-its-kind Generative AI Center of Excellence to accelerate client value (May. 30, 2023)
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- Synopsys and Arm Strengthen Collaboration for Faster Bring-Up of Next-Generation Mobile SoC Designs on the Most Advanced Nodes (May. 29, 2023)
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- MediaTek Partners With NVIDIA to Provide Full-Scale Product Roadmap to the Automotive Industry (May. 29, 2023)
- SK hynix Enters Industry's First Compatibility Validation Process for 1bnm DDR5 Server DRAM (May. 29, 2023)
- Environmental impact of AI: Pioneering solutions for a sustainable future (May. 29, 2023)
- Partnership enhances deep data analytics in SoCs (May. 26, 2023)
- Rambus's expectations on faster GDDR6 memory (May. 26, 2023)
- JEDEC Publishes Major Update to JEP30 PartModel Guidelines (May. 25, 2023)
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- DRAM Industry Q1 Revenues Decline 21.2% QoQ, Marking Third Consecutive Quarter of Downturn, Says TrendForce (May. 25, 2023)
- Alphawave Semi has published its audited results for the year ended 31 December 2022 (May. 25, 2023)
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- China bars Micron ICs destined for key infrastructure (May 25, 2023)
- CEA-Leti to Report New Integration & Packaging Gains for Next-Generation LiDAR Steering on Autonomous Vehicles at ECTC (May. 25, 2023)
- Apple Signs Multibillion-Dollar Deal with Broadcom for US-Made 5G RF Components (May. 25, 2023)
- BrainChip and CVEDIA Team to Advance State-of-the-Art Edge AI and Neuromorphic Computing (May. 24, 2023)
- Blue Cheetah Demonstrates Industry Leading Silicon-Proven Die-to-Die Interconnect Solution for Chiplets (May. 24, 2023)
- Apple announces multibillion-dollar deal with Broadcom for components made in the USA (May 24, 2023)
- Experts Weigh Impact of Intel-Arm Collaboration (May 24, 2023)
- 3nm AI chips and 6nm microcontrollers will be key to TSMC Dresden fab (May. 24, 2023)
- SiFive Gives WorldGuard to RISC-V International to Make this Robust Security Model More Accessible to the RISC-V Community (May. 24, 2023)
- Silex Technology Announces High-Performance 802.11ah Wi-Fi HaLow SDIO Module (May. 24, 2023)
- Intel Launches Agilex 7 FPGAs with R-Tile, First FPGA with PCIe 5.0 and CXL Capabilities (May. 23, 2023)
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- Imagination launches IMG CXM, the smallest GPU to bring effortless user interfaces into homes (May. 23, 2023)
- Sequans Introduces Taurus 5G NR: The World's First Chipset Specifically Optimized for 5G Broadband IoT Devices (May. 23, 2023)
- Chiplet interconnect handles 40 Gbps/bump (May. 23, 2023)
- Automotive Industry Looks Beyond EVs for Decarbonization (May. 23, 2023)
- Synopsys Named a Leader in the 2023 Gartner® Magic Quadrant™ for Application Security Testing for Seventh Consecutive Year (May. 23, 2023)
- New £1 billion strategy for UK's semiconductor sector (May 22, 2023)
- Syntiant's Deep Learning Computer Vision Models Deployed on Renesas RZ/V2L Microprocessor (May. 22, 2023)
- USB 4.0 Host and Device Controller IP Cores unleashing the Power of High-Speed Connectivity with tunnelling of Display Port and PCIe is now available for Licensing (May. 22, 2023)
- NVIDIA Grace Drives Wave of New Energy-Efficient Arm Supercomputers (May. 22, 2023)
- Fabless Semiconductor Innovator Stathera Announces US $15M Series A Funding Round (May. 22, 2023)
- CEVA and proteanTecs Announce Partnership to Optimize Reliability and Power of Complex SoCs (May. 22, 2023)
- Quadric's DevStudio Speeds Software Development with Industry's First Integrated ML + DSP Cloud-Based Code Development Platform (May 22, 2023)
- We don't compete with our customers - TSMC (May 22, 2023)
- Audio Pioneer xMEMS Announces General Availability of the World's Only All-Silicon, Solid-State Fidelity Micro Speakers (May 22, 2023)
- Axelera AI Raises $50M to Democratize Edge AI (May 22, 2023)
- Arm expands global engineering teams with two new primary sites (May. 22, 2023)
- Jean-Louis CHAMPSEIX, VP, Head of Corporate Sustainability, highlights " Sustainability has been a guiding principle in STMicroelectronics" and "How Semiconductors Contribute to Green and Low Carbon" (May. 22, 2023)
- Green, Digital Transformation: Infineon Launches EU Projects for Power Electronics and Artificial Intelligence (May. 22, 2023)
- Samsung To Officially Unveil Its 3nm, 4nm Technologies In June, With Up To 34 Percent Power Efficiency Improvements (May. 22, 2023)
- K-Best MIMO Decoder IP Core Available For Immediate Integration From Global IP Core (May. 19, 2023)
- Efabless Announces AI Generated Open-Source Silicon Design Challenge (May. 19, 2023)
- Arasan Announces immediate availability of its SUREBOOT™ Total xSPI PHY IP (May. 18, 2023)
- Synopsys Posts Financial Results for Second Quarter Fiscal Year 2023 (May. 18, 2023)
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- Rambus and Socionext Renew Patent License Agreement (May. 18, 2023)
- proteanTecs' Die-to Die Interconnect Monitoring IP Passes TSMC9000 Pre-Silicon Assessment (May. 18, 2023)
- SiliconAlly: GigaPHY Testchip is back from Fabrication and Packaging (May. 18, 2023)
- Arasan Announces immediate availability of its SUREBOOT™ Total xSPI PHY IP (May 18, 2023)
- China's semiconductor developers eye shift to RISC-V architecture amid growing chip demand in cars, data centres and AI, executive says (May. 18, 2023)
- Arasan announces the immediate availability of its 2nd Generation MIPI D-PHY for GlobalFoundries 22nm SoC Designs (May. 17, 2023)
- BrainChip and Teksun Demonstrate Rapid Adoption of AI Solutions at Embedded Vision Summit (May. 17, 2023)
- VESA Updates Adaptive-Sync Display Standard with Tighter Specifications (May. 17, 2023)
- Transitioning to a Circular Economy for Greener Electronic Systems (May. 17, 2023)
- Weebit Nano to present recent ReRAM-based developments at the International Memory Workshop (IMW) 2023 (May. 17, 2023)
- Semiconductor Manufacturing Monitor Points to Moderating Industry Contraction in Q2 2023, SEMI Reports (May 17, 2023)
- Ansys Signs Definitive Agreement to Acquire Diakopto, Expands Multiphysics Simulation Portfolio for Semiconductor Designers (May 17, 2023)
- MIPI DevCon Returns to Silicon Valley to Explore MIPI in Automotive, IoT and Mobile (May. 17, 2023)
- GlobalFoundries, Samsung Electronics, and TSMC Join Imec's "Sustainable Semiconductor Technologies & Systems" (SSTS) Program (May. 17, 2023)
- BrainChip and Quantum Ventura Partner to Develop Cyber Threat Detection (May. 16, 2023)
- NXP and TSMC to Deliver Industry's First Automotive 16 nm FinFET Embedded MRAM (May. 16, 2023)
- How Vehicle Design Is Influencing Processors (May. 16, 2023)
- Imec teams for US driverless car research lab and incubator (May. 16, 2023)
- Infineon to lead European research project on Industry 5.0 for more sustainability and resilience in European manufacturing (May. 16, 2023)
- Andes Technology Announces The New Product Line, AndesAIRE™, Ultimately Efficient AI/ML Solutions For Edge And End-Point Inference (May. 15, 2023)
- Upgrade Your Display and Camera SOC's with proven MIPI C-D Combo PHY and CSI / DSI Controller IP Cores for both Tx and Rx (May. 15, 2023)
- proteanTecs to Present in Open Compute Project (OCP) Webinar on Silent Data Errors for Resilient Data Centers (May. 15, 2023)
- Ethernovia Raises $64 Million to Accelerate the Revolution of Vehicle Networks (May. 15, 2023)
- Indian chip startups get seed funds from Sequoia Capital (May. 15, 2023)
- AccelerComm secures £21.5m funding to supercharge 5G radio performance (May. 15, 2023)
- Socionext Conducts Asset Management Demonstration experiment Using ZETA-compliant ZETag® IoT Tags (May. 15, 2023)
- Can AI solve its sustainability problem? (May. 15, 2023)
- Japanese foundry Rapidus is making cutting edge 2 nm nodes with IBM, plans to compete with TSMC and Samsung by 2027 (May. 12, 2023)
- Perforce survey reveals software has become central to automotive development (May. 12, 2023)
- Nordic teams for IoT software SIM (May. 12, 2023)
- TSMC says new chips to be world's most advanced (May. 12, 2023)
- Samsung Electronics Accelerating Foundry Facility Expansion While TSMC Slows Down (May. 12, 2023)
- CryoCMOS Consortium develops 4K & 77K transistor models to enable CryoIP development (May. 11, 2023)
- Alphawave Semi Update on Audit Process (May. 11, 2023)
- SMIC Reports 2023 First Quarter Results (May. 11, 2023)
- BrainChip Showcases Edge AI Technologies at 2023 Embedded Vision Summit (May. 11, 2023)
- Kalray, Arteris, Secure-IC, and Thales, Win the Call for Projects Related to the AI Acceleration Strategy of the "France Relance 2030 - Future Investments" Plan (May. 11, 2023)
- Arteris Selected by BOS Semiconductors for Next-Generation Automotive Chips (May. 11, 2023)
- Canonical enables Ubuntu on StarFive's VisionFive 2 RISC-V single board computer (May. 11, 2023)
- Upgrade To Solid Sands' Latest SuperTest Version Supports Andes To Its Ambitions For Further Growth In The Automotive Sector (May. 10, 2023)
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- StarIC appoints Redtree Solutions as Sales Representative in Pan-Europe (May 10, 2023)
- Creonic Introduces 25 Gbit/s LDPC IP Core Solution for ITU G.9804.2 PON Standard (May. 10, 2023)
- CEVA Acquires Spatial Audio Business from VisiSonics to Expand its Application Software Portfolio for Embedded Systems targeting Hearables and other Consumer IoT Markets (May. 10, 2023)
- CEVA, Inc. Announces First Quarter 2023 Financial Results (May. 10, 2023)
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- BrainChip Joins Arm Tech Talk to Discuss Cutting-Edge AI Solutions that Deliver Exceptional Performance and Efficiency (May. 08, 2023)
- GUC Monthly Sales Report - April 2023 (May. 08, 2023)
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- Arteris Announces Financial Results for the First Quarter 2023 and Estimated Second Quarter and Full Year 2023 Guidance (May. 08, 2023)
- LC3plus audio codec optimized for ARM®, RISC-V, HI-FI & Kalimba™ DSPs for Bluetooth® LE Audio are available for Immediate Licensing (May. 08, 2023)
- IC designers leave Graphcore for Meta (May 08, 2023)
- Samsung to Detail Second-Gen 3nm Node, But Admits It Is Behind TSMC (May. 08, 2023)
- UMC Reports Sales for April 2023 (May 05, 2023)
- Generative AI in factory automation and the edge (May. 05, 2023)
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- Alphawave IP Group Plc Announces CFO Transition (May. 04, 2023)
- NEO Semiconductor Launches Ground-Breaking 3D X-DRAM Technology, A Game Changer in the Memory Industry (May 04, 2023)
- AccelerComm's LEOphy Shortlisted at SCF Industry Awards 2023 (May. 03, 2023)
- UMC Announces 40nm RFSOI Platform to Accelerate 5G mmWave Applications (May. 03, 2023)
- Crypto Quantique Announces Robert Clyde as Chairman of the Board of Directors (May. 03, 2023)
- Via Licensing and MPEG LA Unite to Form Via Licensing Alliance, the Largest Patent Pool Administrator in the Consumer Electronics Industry (May. 03, 2023)
- Via Licensing Alliance Appoints Three New Members to its Board of Directors (May. 03, 2023)
- TSMC Teams Up With EDA Companies to Speed Up Design Flows (May. 03, 2023)
- Rambus Reports First Quarter 2023 Financial Results (May. 02, 2023)
- Global Semiconductor Sales Decrease 8.7% in First Quarter; March Sales Tick Up Month-to-Month for First Time Since May 2022 (May. 02, 2023)
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- Worldwide Silicon Wafer Shipments Decline in Q1 2023, SEMI Reports (May. 02, 2023)
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- TSMC upends 3-nm roadmap with three new nodes (May. 02, 2023)
- Alps Alpine uses Siemens Symphony to verify mixed-signal touch chip (May. 02, 2023)
- Menta, Codasip join RISC-V 3D neuromorphic AI project (May. 02, 2023)
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- Arm Announces Confidential Submission of Draft Registration Statement for Proposed Initial Public Offering (May. 01, 2023)
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- Cadence Reports First Quarter 2023 Financial Results (May. 01, 2023)
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- EC approves €7.4bn subsidy for ST-GloFo JV fab (May 01, 2023)
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- Alphawave Semi: Q1 2023 Trading and Business Update (Apr. 28, 2023)
- State aid: Commission approves French measure to support STMicroelectronics and GlobalFoundries to set up new microchips plant (Apr. 28, 2023)
- Signature IP Corporation Demonstrates Configurable NoC Products at Design & Reuse IP SoC Day (Apr. 27, 2023)
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- Creonic Introduces FEC IP Core Solution for SDA Free-Space Optical OCT V3.0 Standard (Apr. 27, 2023)
- HDL Design House develops its first full SoC from architecture definition to tapeout for an external customer (Apr. 27, 2023)
- Esperanto Technologies Launches New Cloud Access Program to Broaden Access to its Massively Parallel, Low Power RISC-V Solutions (Apr. 27, 2023)
- Weebit Nano ReRAM now commercially available; fab & customer agreements progressing (Apr. 27, 2023)
- Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dblox™ Standard (Apr. 27, 2023)
- Revenue Decline of Global Top 10 IC Design Houses Expanded to Nearly 10% in 4Q22, Decline Expected to Continue into 1Q23, Says TrendForce (Apr. 27, 2023)
- Cadence Digital and Custom/Analog Design Flows Certified for TSMC's Latest N3E and N2 Process Technologies (Apr 27, 2023)
- M31 demonstrates high-speed interface IP development achievements on TSMC's 7nm & 5nm process technologies (Apr. 27, 2023)
- Xiphera adds lightweight cryptography to its stream cipher portfolio (Apr. 27, 2023)
- Lattice Extends Low Power FPGA Portfolio with Launch of MachXO5T-NX Advanced System Control FPGAs (Apr. 27, 2023)
- Siemens announces certifications for TSMC's latest processes, celebrates recent achievements for Siemens and TSMC collaboration (Apr. 27, 2023)
- TSMC on track to roll out advanced 2nm chips by 2025 (Apr. 27, 2023)
- STMicroelectronics Publishes 2023 Sustainability Report (Apr. 27, 2023)
- Arteris IP Licensed by Axelera AI to Accelerate Computer Vision at the Edge (Apr. 26, 2023)
- Fraunhofer IIS/EAS Selects Achronix Embedded FPGAs (eFPGAs) to Build Heterogeneous Chiplet Demonstrator (Apr. 26, 2023)
- Weebit Nano successfully secures US$40 million to accelerate development and commercial roll-out of its ReRAM (Apr. 26, 2023)
- Synopsys, Ansys and Keysight Collaborate with TSMC to Boost Performance of Autonomous Systems with New mmWave Reference Flow (Apr. 26, 2023)
- Alphawave Semi Showcases 3nm Connectivity Solutions and Chiplet-Enabled Platforms for High Performance Data Center Applications (Apr. 26, 2023)
- Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies (Apr. 26, 2023)
- Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dblox™ Standard (Apr. 26, 2023)
- Xiphera joins Microchip Technology's FPGA Design Partner program (Apr. 26, 2023)
- High-precision microsensor technology for a wide application range (Apr. 26, 2023)
- CEA-Leti: a Top 5 global leader of semiconductor patents (Apr. 26, 2023)
- Attopsemi's Revolutionary I-fuse® OTP Silicon-Proven on FinFET Technology (Apr. 25, 2023)
- OPENEDGES' 12nm LPDDR5/4 Memory Subsystem IP that Drives Innovation Licensed by ASICLAND (Apr. 25, 2023)
- Andes Technology's N25F RISC-V Processor Enables Superior Performance And Low Power For Phison's X1 Enterprise SSD Controller (Apr. 25, 2023)
- Cadence Tapes Out 16G UCIe Advanced Package IP on TSMC's N3E Process Technology (Apr. 25, 2023)
- Analog Bits to Demonstrate Working Silicon on TSMC N3E Process at TSMC 2023 North America Technology Symposium (Apr. 25, 2023)
- Cadence Accelerates Hyperscale SoC Design with Next-Generation 112G Extended Long-Reach SerDes IP on TSMC's N4P Process (Apr. 25, 2023)
- Agile Analog launches innovative digitally wrapped analog IP subsystems (Apr. 25, 2023)
- Attopsemi's Revolutionary I-fuse® OTP Silicon-Proven on FinFET Technology (Apr 25, 2023)
- Rapid Silicon Launches Vega eFPGA IP for Programmable Solutions (Apr 25, 2023)
- Synopsys and TSMC Collaborate to Jumpstart Designs on TSMC's N2 Process with Optimized EDA Flows (Apr 25, 2023)
- Sondrel engages The SHD Group to assist in bringing Architecting the Future to the American market (Apr 25, 2023)
- Synopsys and TSMC Collaborate to Jumpstart Designs on TSMC's N2 Process with Optimized EDA Flows (Apr. 25, 2023)
- Cadence Custom Design Migration Flow Accelerates Adoption of TSMC N3E and N2 Process Technologies (Apr. 25, 2023)
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- Flex Logix Announces InferX™ High Performance IP for DSP and AI Inference (Apr 24, 2023)
- Arm reportedly developing 'advanced' test chip for customers (Apr. 24, 2023)
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- Omni Design's High Performance Analog Front Ends are Adopted in Socionext's Next Generation Communications SoCs (Apr. 23, 2023)
- The Six Semiconductor of OPENEDGES Receives Best International Business Award from ACCE (Apr. 20, 2023)
- Rambus Accelerates AI Performance with Industry-Leading 24 Gb/s GDDR6 PHY (Apr. 20, 2023)
- EdgeCortix Expands Delivery of its Industry Leading SAKURA-I AI Co-processor Devices and MERA Software Suite (Apr 20, 2023)
- EU agrees Chips Act terms (Apr 20, 2023)
- TSMC Reports First Quarter EPS of NT$7.98 (Apr 20, 2023)
- GlobalFoundries Files Lawsuit Against IBM to Protect its Intellectual Property and Trade Secrets (Apr 20, 2023)
- EdgeQ Closes $75M Series-B Investment and Ramps to Customers' Demand for Its Award-Winning 5G+AI Base Station-on-a-Chip for 5G Networks (Apr 20, 2023)
- Anchoring Trust to Enhance IoT Security (Apr. 20, 2023)
- The Need for Security is Everywhere. Intrinsic ID Showcases Expertise and PUF Innovations at Key Industry Events (Apr. 19, 2023)
- Silicon Interfaces enhances Functional Safety ISO 26262-Compliant ASIL C Services Solution for Automotive (Apr. 19, 2023)
- Europe consolidates quantum production and test (Apr. 19, 2023)
- Esperanto Technologies Announces RISC-V Industry Milestone of Generative AI Models Running on ET-SoC-1; Access to be Made Available to the RISC-V Research Community (Apr. 19, 2023)
- Rambus Accelerates AI Performance with Industry-Leading 24 Gb/s GDDR6 PHY (Apr. 19, 2023)
- Cadence Unleashes the Future of Analog, Custom and RFIC Design with Pioneering AI-Powered Virtuoso Studio (Apr. 19, 2023)
- Volkswagen wants to become more agile with new R&D centre in China (Apr. 19, 2023)
- The Need for Security is Everywhere. Intrinsic ID Showcases Expertise and PUF Innovations at Key Industry Events (Apr. 19, 2023)
- The Environmental Impact Of Using Plastic To Make Microchips (Apr. 19, 2023)
- Cadence Demonstrates Interoperability with SK hynix's Highest Speed LPDDR5T Mobile DRAM at 9600Mbps (Apr. 18, 2023)
- eMemory's Security-enhanced OTP Qualifies on TSMC N5 Process and Continues to Tackle Automotive Solutions (Apr. 18, 2023)
- Rapid Silicon Partners with Elastics.cloud on CXL 3.0 Dual Mode Controller IP to Enhance its Custom FPGA Solutions (Apr. 18, 2023)
- Mixel MIPI C-PHY/D-PHY Combo IP Integrated into Hercules Microelectronics HME-H3 FPGA (Apr. 18, 2023)
- Nordic Reveals "Revolution" of Wireless SoC Line: The nRF54 Series (Apr. 18, 2023)
- Arm liable for $8.5B SoftBank loan if IPO is a no-show (Apr. 18, 2023)
- Semidynamics launches world's first fully customisable RISC-V IP cores (Apr. 17, 2023)
- DVB-S2X LDPC/ BCH Encoder and Decoder IP Core Available For Integration From Global IP Core (Apr. 17, 2023)
- Arm could be on the hook for $8.5bn of Softbank debt (Apr. 17, 2023)
- Introducing the Cutting-Edge USB 3.0/ PCIe 3.0 Combo PHY IP Core in 28HPC+ for High-Performance SoC Designs (Apr 17, 2023)
- TSMC could partner with Bosch for 28nm fab in Germany (Apr. 17, 2023)
- Cadence Extends Collaboration with TSMC and Microsoft to Advance Giga-Scale Physical Verification in the Cloud (Apr. 17, 2023)
- Cadence extends TSMC deal for physical verification on Azure (Apr. 17, 2023)
- Process agnostic fully customisable RISC-V IP cores (Apr. 17, 2023)
- Spanish startup performs RISC-V open core surgery (Apr. 17, 2023)
- Strict Restrictions Imposed by US CHIPS Act Will Lower Willingness of Multinational Suppliers to Invest; Chinese Semiconductor Development Will Be Limited for Next Decade, Says TrendForce (Apr. 14, 2023)
- Cadence Introduces EMX Designer, Delivering More Than 10X Increased Performance for On-Chip Passive Component Synthesis (Apr. 14, 2023)
- Pragmatic Semiconductor Announces Appointment of Semiconductor Industry Veteran, David Moore, as CEO (Apr. 14, 2023)
- IAR Embedded Secure IP upgrades solutions portfolio with late-stage security (Apr. 14, 2023)
- Pine64 launches world's first RISC-V tablet device - PineTab-V for presale (Apr. 14, 2023)
- MainConcept and Fraunhofer IIS collaborate on MPEG-H Audio and xHE-AAC encoding for video and audio streaming services (Apr. 14, 2023)
- Experience the Future of Video Processing with intoPIX and Imagine Communications at the 2023 NAB Show (Apr. 14, 2023)
- CryptOne IP Core is ready for post-quantum reality (Apr. 14, 2023)
- Fraunhofer IIS partners with Avid to enable support of MPEG-H Audio in Pro Tools (Apr. 14, 2023)
- TSMC could partner with Bosch for 28nm fab in Germany (Apr. 14, 2023)
- The Future of LiDAR Lies in ADAS (Apr. 14, 2023)
- Softbank reduces Alibaba holding to 3.8% (Apr. 13, 2023)
- Synopsys Introduces the Industry's First Emulation System with Unmatched Capacity to Enable Electronics Digital Twins of Advanced SoCs (Apr. 13, 2023)
- EnSilica evaluation platform for EN62020 sensor interface ASIC speeds up development of wearable fitness and healthcare sensor devices (Apr. 13, 2023)
- On your Wrist and in Space; Intrinsic ID is Everywhere. Come Find us at Key Industry Tradeshows in April (Apr. 13, 2023)
- Ateme and Fraunhofer Join Forces to Deliver Next Generation Audio (Apr. 13, 2023)
- IC Manage Partners with Library Technologies to Accelerate Library Characterization by 100x in the Cloud (Apr 13, 2023)
- Global Semiconductor Equipment Billings Reach Industry Record $107.6 Billion in 2022, SEMI Reports (Apr. 13, 2023)
- Frontgrade Products Enable ESA's JUICE Mission (Apr. 13, 2023)
- Get Ready to be Amazed by the one-of-a-kind exhibit "JPEG XS in Action" by intoPIX at NAB2023 (Apr. 13, 2023)
- VeriSilicon Brings Super Resolution Technology to Smart Display (Apr. 13, 2023)
- JEDEC Expands CAMM Standardization to include Two Key Memory Technologies (Apr. 13, 2023)
- Battery recycling takes the driver's seat (Apr. 13, 2023)
- Lawo and intoPIX Partner to Deliver End-to-End JPEG XS Support! (Apr. 12, 2023)
- Cadence Strengthens Tensilica Vision and AI Software Partner Ecosystem for Advanced Automotive, Mobile, Consumer and IoT Applications (Apr. 12, 2023)
- Tiempo Secure and GreenWaves Technologies demonstrate Secure Element role as Master in an embedded system (Apr. 12, 2023)
- Arteris IP Selected By ASICLAND for Automotive, AI Enterprise and AI Edge SoCs (Apr. 12, 2023)
- Xylon Reveals Industry's First L5 Autonomy Ready Data Logger and HIL System (Apr. 12, 2023)
- Intel Foundry and Arm Announce Multigeneration Collaboration on Leading-Edge SoC Design (Apr. 12, 2023)
- APlabs Chooses CAST IP Cores for Next-Generation Automotive SoC (Apr. 12, 2023)
- DENSO adopts VisualSim Architect to improve in-vehicle network design. (Apr. 12, 2023)
- Rambus Joins the Intel Foundry Services (IFS) Accelerator IP Alliance to Enable State-of-the-Art SoCs (Apr. 12, 2023)
- Nordic Semi introduces fourth generation of multiprotocol SoCs (Apr. 12, 2023)
- Infineon Renames IPC Division to Green Industrial Power (Apr. 12, 2023)
- Village Island VICO-XI is Revolutionizing IP Video Conversion with Reduced Bandwidth and Microsecond Latency using intoPIX Technology (Apr. 11, 2023)
- UMC Reports Sales for March 2023 (Apr. 11, 2023)
- TSMC March 2023 Revenue Report (Apr. 11, 2023)
- Renesas Samples Its First 22-nm Microcontroller (Apr. 11, 2023)
- Rapid Silicon Launches Revolutionary RapidGPT for FPGA Designers (Apr. 11, 2023)
- UK wireless strategy aims to boost 5G/6G deployment (Apr. 11, 2023)
- Peripheral IP Cores targeting Automotive applications are instantly licensable for extremely reliable performance (Apr. 10, 2023)
- Semiconductor sustainability: Paving the way for a greener technology industry (Apr. 09, 2023)
- Global Semiconductor Sales Decrease 4% Month-to-Month in February (Apr. 07, 2023)
- ARM completes functional safety revamp of microcontrollers with Cortex-M23 update (Apr. 07, 2023)
- As Arm Eyes IPO and Higher Prices, RISC-V May Get a Boost (Apr. 06, 2023)
- GUC Taped Out 3nm 8.6Gbps HBM3 and 5Tbps/mm GLink-2.5D IP using TSMC Advanced Packaging Technology (Apr. 06, 2023)
- intoPIX Partners with Panasonic Connect to Enable new JPEG XS Cameras for Live Video Production (Apr. 06, 2023)
- AMD Launches First 5nm ASIC-based Media Accelerator Card to Power New Era of Interactive Media Services at Scale (Apr 06, 2023)
- Synopsys Accelerates First-Pass Silicon Success for Banias Labs' Networking SoC (Apr. 06, 2023)
- Samsung Electronics and AMD Extend Strategic IP Licensing Agreement To Bring AMD Radeon™ Graphics to Future Mobile Platforms (Apr 06, 2023)
- Post-Quantum Cryptography: Are You Ready? (Apr. 06, 2023)
- GUC Monthly Sales Report - March 2023 (Apr. 06, 2023)
- SiPearl: Initial closing of Series A with €90m financing to launch Rhea, the energy-efficient HPC-dedicated microprocessor (Apr 06, 2023)
- ChatGPT leaking Samsung chip secrets is iceberg's tip (Apr 06, 2023)
- CXL Testing Leverages PCIe Expertise (Apr. 06, 2023)
- Google extends license agreement for AAC codec range with Fraunhofer IIS (Apr. 05, 2023)
- Rambus and SK hynix Extend Comprehensive License Agreement (Apr. 05, 2023)
- Orthogone and Napatech collaborate to deliver state-of-the-art, ultra-low latency FPGA-based SmartNIC platform for high-frequency trading applications (Apr. 05, 2023)
- OPENEDGES' LPDDR5 Memory Subsystem IP Licensed by Aisin for Automotive Application (Apr. 05, 2023)
- Tiempo Secure appoints IPro as its Sales Representative in Israel (Apr. 05, 2023)
- Rapidus, Japan's newly founded chip manufacturer, joins imec's Core Partner Program (Apr. 05, 2023)
- Capgemini to coordinate next generation IoT project for european commission (Apr. 05, 2023)
- Post-Quantum Cryptography: Are You Ready? (Apr. 05, 2023)
- Sondrel signs EDA license extension with Siemens for three more years (Apr. 04, 2023)
- sureCore pushes the SRAM voltage envelope to below 0.5V for the first time (Apr. 04, 2023)
- Introducing STAGE RACER 2 with intoPIX JPEG XS: The Future of Fiber Transmission for Broadcast Events (Apr. 04, 2023)
- ULTRARAM™ universal computer memory to be commercialised (Apr 04, 2023)
- CEO interview: Paul Wells of SureCore on low power memory and China (Apr. 04, 2023)
- SEMIFIVE Achieves Mass Production Milestone of its SoC Platform (Apr. 04, 2023)
- Allegro DVT Announces the Industry's First MPEG-5 LCEVC Decoder Silicon IP (Apr. 04, 2023)
- Synopsys to Showcase Next Gen Polaris Software Integrity Platform at RSA Conference (Apr. 04, 2023)
- Unleashing the Full Potential of Your Display: eDisplayPort v1.4 PHY and Controller IP Cores are available for licensing for your Robust products (Apr. 03, 2023)
- XMOS announces xcore®-voice: the next generation intelligent solution for smart voice applications (Apr 03, 2023)
- TurboConcept and Lomicro Information Technology today celebrate two years of successful collaboration (Apr. 03, 2023)
- The Future of Semi Innovation from Disruptive Memory to Chiplets with Alphawave Semi (Apr. 03, 2023)
- Vtool appoints Wonderep to be its sales-channel partner in Israel (Apr. 03, 2023)
- SynSense closes strategic round to accelerate the development of their high-speed 3D neuromorphic processor DYNAP™-CNN2 (Apr 03, 2023)
- Making Formal Verification the New Normal in IoT with Ashish Darbari - Founder, Axiomise | The IoT Podcast (Apr. 03, 2023)
- Computing Hardware Expert Georgios Konstadinidis Joins proteanTecs Advisory Board (Mar. 30, 2023)
- Renesas Expands RISC-V Embedded Processing Portfolio with New Voice-Control ASSP Solution (Mar. 30, 2023)
- Interview: Aart de Geus on AI-driven EDA (Mar. 30, 2023)
- POLYN Introduces VibroSense, Industry-First Application-Specific Vibration Pre-Processing Chip Design (Mar 30, 2023)
- CXL Testing Leverages PCIe Expertise (Mar 30, 2023)
- Blue Ocean Smart System Unveils Chiplet-Based Products Powered by VeriSilicon's High-Performance Processors (Mar. 30, 2023)
- Report: Arm proposes change to IP royalty model (Mar. 29, 2023)
- Networking Chip Startup Enfabrica Emerges from Stealth Mode to Solve Scalability and Price-Performance Challenges for AI Growth in Cloud (Mar. 29, 2023)
- Tachyum To Use UCIe Interconnect Standards In Prodigy 2 (Mar. 29, 2023)
- Synopsys.ai Unveiled as Industry's First Full-Stack, AI-Driven EDA Suite for Chipmakers (Mar. 29, 2023)
- Veriest Solutions Promotes Dusica Glisic to Vice President of Frontend Engineering (Mar. 29, 2023)
- I hear you NOCing, But Can You Close Timing? (Mar. 29, 2023)
- Survey reveals software now central to automotive development (Mar. 29, 2023)
- 3D-IC: An Opportunity to Augment India's Semiconductor Ecosystem (Mar. 29, 2023)
- eMemory and UMC Expand Low-Power Memory Solutions for AIoT and Mobile Markets with 22nm RRAM Qualification (Mar. 28, 2023)
- Mobiveil's PSRAM Controller IP Lets SoC Designers Leverage AP Memory's Xccela x8/x16 250 MHz PSRAM Memory (Mar. 28, 2023)
- Bluetooth Dual Mode V5.3 RF Transceiver IP Cores in 22nm ULP is Available for Immediate Licensing for Smart Audio Chipsets (Mar. 27, 2023)
- MIPI A-PHY Specification Levels Up In-Vehicle Connectivity (Mar. 27, 2023)
- Sensor Fusion Explores AI to Prep for ADAS, AV Designs (Mar. 27, 2023)
- Designing MPUs/MCUs with Functional Safety (Mar. 27, 2023)
- 2026 All-Time High in Store for Global 300mm Semiconductor Fab Capacity After 2023 Slowdown, SEMI Reports (Mar 27, 2023)
- China forms its own chiplet standard amid isolation (Mar. 27, 2023)
- Chinese web giant Baidu backs RISC-V for the datacenter (Mar. 27, 2023)
- MIPI A-PHY Specification Levels Up In-Vehicle Connectivity (Mar. 27, 2023)
- Is RISC-V Poised to Benefit From Arm's Licensing Changes? (Mar. 27, 2023)
- Samsung Electronics Facing TSMC-Nvidia Alliance in Advanced Chip War (Mar. 27, 2023)
- Alphawave Semi Opens Pune Office, Continues Expansion into India (Mar. 24, 2023)
- OPENEDGES Completes the Tapeout of the 7nm HBM3 Memory Subsystem (PHY & Memory Controller) Test chip (Mar. 23, 2023)
- Andes Custom Extension™ (ACE) Supports AndesCore™ 45-Series Processors to Provide Flexible Acceleration (Mar. 23, 2023)
- CEO Interview: Ian Lankshear, EnSilica (Mar 23, 2023)
- Global Fab Equipment Spending on Track for 2024 Recovery After 2023 Slowdown, SEMI Reports (Mar 23, 2023)
- SynSense closes USD$10m Pre-B+round to bring their ultra-low-power vision processing SOC "Speck™" to mass production (Mar 23, 2023)
- SoftBank and EdgeCortix Partner to Jointly Realize Low-latency and Highly Energy-efficient 5G Wireless Accelerators (Mar. 22, 2023)
- BrainChip's Neuromorphic Technology Enables Intellisense Systems to Address Needs for Next-Generation Cognitive Radio Solutions (Mar. 22, 2023)
- The Impact Of Blockchain On IoT Data Privacy (Mar. 22, 2023)
- Renesas to Acquire Panthronics to Extend Connectivity Portfolio with Near-Field Communication Technology (Mar. 22, 2023)
- Infineon and UMC Extend Automotive Partnership (Mar. 22, 2023)
- IAR Delivers "Security Made Simple" (Mar. 22, 2023)
- Hidden impact of semiconductor manufacturing on climate change (Mar. 22, 2023)
- SkyWater Establishes Cryogenic Lab, Utilizes FormFactor's Leading Tool for RTS Noise Detection in Read-Out Integrated Circuit Applications (Mar. 21, 2023)
- Agile Analog joins Intel Foundry Services Accelerator IP Alliance Program to drive forward semiconductor design innovation (Mar. 21, 2023)
- Omni Design Opens Design Center in Hyderabad, India (Mar. 21, 2023)
- NVIDIA, ASML, TSMC and Synopsys Set Foundation for Next-Generation Chip Manufacturing (Mar. 21, 2023)
- Electronics Tech Hub Seeks to Set Example for Green Semi Manufacturing (Mar. 21, 2023)
- CEO Interview: Ian Lankshear, EnSilica (Mar. 21, 2023)
- TDK announces availability of automated ML Platform Integration for Arm® Keil® MDK (Mar. 20, 2023)
- Remote.It Simplifies Secure Access to Arm Virtual Devices (Mar. 20, 2023)
- 12bit 2Msps Silicon proven SAR ADC IP Core with Ultra-low power is available in different technology nodes for various applications that includes IoT, Medical, Consumer, etc (Mar 20, 2023)
- TDK announces availability of automated ML Platform Integration for Arm® Keil® MDK (Mar 20, 2023)
- Securing Memory will Take More than Cryptography Alone (Mar. 20, 2023)
- Sustainability In Semiconductors - Why Eco-Friendly Initiatives Are Important In The Tech Industry (Mar. 20, 2023)
- Perforce Joins AWS ISV Accelerate Program and Launches Turnkey Cloud Solution for Helix Core in AWS Marketplace (Mar. 20, 2023)
- M31 hit a record high of revenue and profit in last year, and it expects to sustain a double digit growth throughout the year (Mar. 17, 2023)
- CoreHW secures €4M investment to accelerate growth in indoor positioning solutions (Mar. 17, 2023)
- Samsung's Mega Investment Plan to Compete with TSMC (Mar. 17, 2023)
- intoPIX revolutionizes the gaming experience at GDC 2023: Image quality BEYOND reality (Mar. 16, 2023)
- VeriSilicon delivered multi-format hardware video decoder Hantro VC9000D supporting 8K@120FPS VVC/H.266 to customers (Mar. 15, 2023)
- Ashling and Imagination announce Ashling's RiscFree™ C/C++ SDK support for RISC-V-based Catapult family (Mar. 15, 2023)
- Telechips showcases Arm-based Dolphin5 automotive SoC at embedded world 2023 (Mar 15, 2023)
- proteanTecs Collaborates with BAE Systems to Enable a Zero Trust Supply Chain for Defense Applications (Mar. 15, 2023)
- Introducing Signature IP Corporation - Providing a Configurable And Flexible Platform for SoC Development (Mar. 15, 2023)
- Samsung to invest $230bn in ICs (Mar. 15, 2023)
- Codasip and IAR demonstrate dual-core lockstep for RISC-V (Mar. 14, 2023)
- VeriSilicon collaborates with Microsoft to deliver Windows 10 to the Edge (Mar. 14, 2023)
- At Embedded World 2023, Dolphin Design showcases AI-based vision applications at sub-mW level that fit in less than 1MB RAM (Mar. 14, 2023)
- SPARK Microsystems Announces CDN$48 Million Financing Led by Idealist Capital (Mar 14, 2023)
- ASUS IoT Announces Tinker V (Mar. 14, 2023)
- Imagination and Telechips drive automotive display diversity with hardware virtualization (Mar. 14, 2023)
- Creonic Today Revealed Its New CCSDS 131.2 Wideband Demodulator IP Core with Immediate Availability (Mar. 14, 2023)
- Imagination and CoreAVI partner for safety-critical automotive graphics applications (Mar. 14, 2023)
- The Key to IoT Security in Smart Homes (Mar. 14, 2023)
- BrainChip integrates Akida with Arm Cortex-M85 Processor, Unlocking AI Capabilities for Edge Devices (Mar. 13, 2023)
- Intrinsic ID Launches Software to Protect Billions of Smart, Connected Devices Addressing Worldwide Cybersecurity Challenges (Mar. 13, 2023)
- TSMC February 2023 Revenue Report (Mar. 13, 2023)
- Mythic Raises $13 Million to Bring Its Next-generation Analog Computing Solution to Market (Mar. 13, 2023)
- 1G Ethernet PHY IP Cores is now available with Blackbox licensing option in various technology nodes for advanced networking applications (Mar 13, 2023)
- Veriest Solutions and Neuronix AI Labs Collaborate for Neural Network Acceleration (Mar. 13, 2023)
- Total Revenue of Top 10 Foundries Fell by 4.7% QoQ for 4Q22 and Will Slide Further for 1Q23, Says TrendForce (Mar. 13, 2023)
- Imperas Collaborates with MIPS and Ashling to Accelerate RISC-V Application Software Development from SoC Concept to Deployment (Mar. 13, 2023)
- Intrinsic Semiconductor Technologies Secures £7m Investment to Solve the Memory Bottleneck for Data Hungry Applications (Mar. 13, 2023)
- Rambus Expands Industry-Leading Security IP Portfolio with Arm CryptoCell and CryptoIsland IP (Mar. 13, 2023)
- CEVA Wi-Fi 6 IP Powers ESWIN ECR6600 Smart Connectivity IC (Mar. 13, 2023)
- Create high-performance SoCs using network-on-chip IP (Mar. 13, 2023)
- Imperas in RISC-V three way deal (Mar. 13, 2023)
- ARM adds custom instructions to M85 controller in RISC-V AI fightback (Mar. 13, 2023)
- Best in Show Winners: Processing & IP (Mar. 13, 2023)
- Cadence Verisium AI-Driven Verification Platform Accelerates Debug Productivity for Renesas (Mar. 10, 2023)
- AmberSemi Announces Successful Tapeout of Silicon Chip for Patented AC Direct DC Power Delivery Technology (Mar. 10, 2023)
- EU Chips Act: Key Intellectual Property Considerations (Mar. 10, 2023)
- ASICFPGA releases new ISP core supporting AXI4-Lite, AXI4-Stream, new AE, and new AWB (Mar. 10, 2023)
- Arm and ecosystem leaders empower developers for a future built on Arm (Mar. 10, 2023)
- Renesas to Demonstrate First AI Implementations on the Arm Cortex-M85 Processor Featuring Helium Technology at Embedded World (Mar. 09, 2023)
- GF to commercialize AR glasses MicroLED solution with FD-SOI technology (Mar. 09, 2023)
- Defacto's SoC Compiler 10.0 is Released (Mar. 09, 2023)
- GOMACTech 2023: Menta, a major player in semiconductors for the defense industry (Mar. 09, 2023)
- ProvenRun and SiFive deliver RISC-V-based secure Trusted Execution Environment (TEE) (Mar. 09, 2023)
- TSMC's 3-nm progress report: Better than expected (Mar 09, 2023)
- IAR Enables Robust End-to-End Embedded Security Solution with the Launch of IAR Embedded Trust (Mar. 09, 2023)
- Imagination launches its first edge AI course (Mar. 09, 2023)
- QuantWare lands €6 million to roll out groundbreaking quantum processors (Mar 09, 2023)
- Blueshift Memory to use Codasip custom compute to develop new memory-efficient processor technology (Mar. 09, 2023)
- Think Silicon to Showcase its Latest Ultra-Low-Power Graphics and AI Solutions for Edge Computing at Embedded World 2023 (Mar. 09, 2023)
- CEVA to Showcase Latest Wireless Connectivity and Smart Sensing Solutions at embedded world 2023 (Mar. 09, 2023)
- Atlas Credit Partners Provides $85MM Investment in Coherent Logix (Mar 09, 2023)
- CEVA Introduces UWB Radar Platform for Automotive Child Presence Detection to Meet Emerging Safety Specifications (Mar. 09, 2023)
- Renesas to Demonstrate First AI Implementations on the Arm Cortex-M85 Processor Featuring Helium Technology at Embedded World (Mar. 09, 2023)
- Orca Launches ORC5000 Platform for Low-Power ASIC Designs (Mar. 08, 2023)
- proteanTecs Joins Intel Foundry Services (IFS) Accelerator IP Alliance Program (Mar. 08, 2023)
- Tiempo Secure announces TESIC RISC-V Secure Element IP and development kit (Mar. 08, 2023)
- sureCore announces range of off-the-shelf, ultra-low power memory IP to help fast-track power critical designs (Mar. 08, 2023)
- CAST Announces Very Versatile I2S-TDM Digital Audio Transceiver IP Core (Mar. 08, 2023)
- TSMC's 3-nm progress report: Better than expected (Mar. 08, 2023)
- Intel wants another €4-5bn to build German fab (Mar. 08, 2023)
- Andes Technology's N25F RISC-V Processor Enables Superior Immersive Scenarios for ASPEED Technology's Powerful Image Stitching SoC AST1230 (Mar. 07, 2023)
- Sondrel extends multi-year, multi-million dollar EDA license with Synopsys (Mar. 07, 2023)
- intoPIX showcases its innovative image processing and compression solutions for human & machine vision at Embedded World 2023 (Mar. 07, 2023)
- Attopsemi OTP IP embedded in Fingerprints™ biometric solution to facilitate biometric technology (Mar. 07, 2023)
- Weebit Nano partners with University of Florida's Nino Research Group to examine effects of radiation on Weebit ReRAM (Mar. 07, 2023)
- Infineon and UMC Extend Automotive Partnership with Long-Term Agreement for 40nm eNVM Microcontroller Production (Mar. 07, 2023)
- Attopsemi OTP IP embedded in Fingerprints™ biometric solution to facilitate biometric technology (Mar 07, 2023)
- Weebit Nano ReRAM IP now available in SkyWater Technology's S130 process (Mar. 07, 2023)
- DVB-T2 Demodulator + Decoder LDPC/ BCH IP Core Available For Immediate Implementation From Global IP Core (Mar 07, 2023)
- Samsung Foundry, Anaflash partner on embedded flash memory (Mar. 07, 2023)
- Understanding conditions for the single electron regime in 28 nm FD-SOI quantum dots: Interpretation of experimental data with 3D quantum TCAD simulations (Mar. 07, 2023)
- UMC Reports Sales for February 2023 (Mar. 06, 2023)
- OPENEDGES Announces LPDDR5X/5/4x/4 PHY Tapeout at 7nm process node (Mar. 06, 2023)
- Unlocking Lightning-Fast Data Transfer: USB 3.2 Gen2x2 total solution for Host and Device functionalities in 28nm HPC+ technology (Mar 06, 2023)
- Chevin Technology partners with Intel® (Mar. 06, 2023)
- Alphawave Semi Opens Ottawa Office, Expanding Canadian Presence and Technical Leadership (Mar. 06, 2023)
- Arm priced at $30-70bn (Mar. 06, 2023)
- Tata Consultancy Services and Renesas Partner to Open Innovation Center to Develop Next-Generation Semiconductor Solutions (Mar. 06, 2023)
- New controller IP core for secure data (Mar. 06, 2023)
- DCD Presents RISC-V, Automotive & Cyber during Embedded World 2023 (Mar. 06, 2023)
- GUC Monthly Sales Report - February 2023 (Mar 06, 2023)
- Global Semiconductor Sales Decrease 5.2% Month-to-Month in January (Mar 06, 2023)
- JEDEC Creates New Automotive Steering Subcommittee (Mar. 06, 2023)
- BrainChip Introduces Second-Generation Akida Platform (Mar. 06, 2023)
- Spectral Design & Test Announces AI/ML Based Breakthrough Technology to Do Fast and Accurate Characterization & Validate Memory Compilers (Mar 06, 2023)
- Intel Tapes Out Chips on 1.8nm and 2nm Production Nodes (Updated) (Mar. 06, 2023)
- 2023 a Breakout Year for RISC-V (Mar. 06, 2023)
- 6G Set to Primarily Be an Industrial IoT Network (Mar. 04, 2023)
- CAST Enhances RISC-V Processor Line for Low-Power and Functional Safety Applications (Mar. 03, 2023)
- Intel expands ecosystem with quantum computing SDK (Mar. 03, 2023)
- Floadia Completes eFlash IP Qualification on TSMC 130BCD plus Process and Achieves the World's Highest Data Retention for 10 Years at 200°C (Mar. 02, 2023)
- SiFive Adds Adam Dolinko as Chief Legal Officer and SVP of Corporate Development (Mar. 02, 2023)
- Arteris Announces Financial Results for the Fourth Quarter and Full Year 2022 and Estimated First Quarter and Full Year 2023 Guidance (Mar. 02, 2023)
- Arm to list in New York (Mar. 02, 2023)
- UMC Introduces New 28eHV+ Platform for Wireless, VR/AR, and IoT Display Applications (Mar. 02, 2023)
- New Wave Design and Verification Appoints Marti Nyman as President and CEO (Mar. 02, 2023)
- Safety element for automobiles, production or health can be implemented on the own microcontroller chip: RISC-V processor AIRISC-SAFETY from Fraunhofer Institute for Microelectronic Circuits and Systems IMS (Mar. 02, 2023)
- HDL Design House has opened New design center in Nis - Serbia (Mar. 02, 2023)
- Omni Design Technologies Awarded ISO 9001 Certification (Mar. 01, 2023)
- A transistor inspired by human synapses (Mar. 01, 2023)
- Area-efficient radiation-hardened 6 T SOI SRAM cell design using TDBC Transistors (Mar. 01, 2023)
- Vitruvius+: An Area-Efficient RISC-V Decoupled Vector Coprocessor for High Performance Computing Applications (Mar. 01, 2023)
- Investigation of Anomalous Degradation Tendency of Low-Frequency Noise in Irradiated SOI-NMOSFETs (Mar. 01, 2023)
- Xiphera announces collaboration with Spinnaker Systems for sales of cryptographic IP in Japan (Feb. 28, 2023)
- Arteris and SiFive Partner to Accelerate RISC-V SoC Design of Edge AI Applications (Feb. 28, 2023)
- Agile Analog announces first customisable, process agnostic, 12-bit ADC IP (Feb. 28, 2023)
- Truechip Announces Early Adopter Version of Sub-System Verification IP (Feb. 28, 2023)
- MIPI Alliance Welcomes Google as a Promoter Member (Feb. 28, 2023)
- Mixel MIPI D-PHY IP Integrated into Teledyne e2v's new Topaz CMOS Image Sensors (Feb. 28, 2023)
- Avery Design Debuts CXL Validation Suite (Feb. 28, 2023)
- 32bit RISC-V certified ISO 26262 ASIL-D ready by TÜV SGS (Feb. 28, 2023)
- BrainChip partners with emotion3D on AI-based driver safety (Feb. 28, 2023)
- Capgemini expands its 5G innovation program with new '5G Solutions Center's in San Francisco (Feb. 28, 2023)
- MIPI M-PHY 4.1 IP, UFS 3.1 Controller IP & Unipro 1.8 Controller IP Cores are available for instant licensing to support your total UFS applications (Feb. 27, 2023)
- Keysight Expands EDA Software Portfolio with the Acquisition of Cliosoft (Feb. 27, 2023)
- IC'ALPS announces successful physical implementation of a demo-chip designed for Weebit Nano's ReRAM technology (Feb. 27, 2023)
- Menta Reasserts the Key Role of eFPGAs for the European Semiconductor Industry (Feb. 27, 2023)
- India's Chip Designers To Get Access To State-Of-The-Art Tools At Newly Launched ChipIN Centre At C-DAC Bengaluru (Feb. 27, 2023)
- Imperas Collaborates with Synopsys on SystemVerilog based RISC-V Verification (Feb. 27, 2023)
- PUF update: New IP bypasses the need for ID enrollment (Feb. 27, 2023)
- AI Takes a Strong Supporting Role in Modern Chip Design (Feb. 27, 2023)
- How to Ensure Security for IoT Edge Device Processors (Feb. 27, 2023)
- Arm's Growing Cloud Server Momentum (Feb. 26, 2023)
- Intel and partners have introduced a "green PC" – it's 90% recyclable (Feb. 26, 2023)
- Eyes on Hera with Faintstar2 detector chip (Feb. 24, 2023)
- Secure-IC & Trasna are introducing a revolutionary PUF solution that eliminates the need of enrollment phase (Feb. 23, 2023)
- CEVA Announces its Most Powerful and Efficient DSP Architecture to Date, Addressing the Massive Compute Requirements of 5G-Advanced and Beyond (Feb. 23, 2023)
- Intrinsic ID to Showcase its Expanding Line of Security Solutions at Embedded World 2023 (Feb. 23, 2023)
- Startup AiM Future Set to Commercialize LG's AI IP (Feb. 23, 2023)
- Samsung Electronics' World-Class 5nm Technology Selected by Ambarella for New Automotive AI Central Domain Controller (Feb 23, 2023)
- M31 earned NT$12.16 per share in 2022 and approved dividend of NT$8 in cash and NT$1 equivalent in stock (Feb. 23, 2023)
- Ventana Micro Selects Imperas Solutions for RISC-V Processor Verification (Feb. 23, 2023)
- EQUALITY consortium selected by the EU's Horizon Europe Program to develop quantum algorithms for industrial applications (Feb. 23, 2023)
- Intel CEO Sees 'Green Shoots' Emerging (Feb. 23, 2023)
- Arteris Unveils Next-Generation FlexNoC 5 Physically Aware Network-on-Chip IP (Feb. 22, 2023)
- Pleora Scores a 10 with New High-Performance GigE Vision Embedded Interface (Feb. 22, 2023)
- Pushing the System-in-Package Concept Into the Future (Feb. 22, 2023)
- Renesas develops technologies for automotive gateway SoCs (Feb. 22, 2023)
- Socionext Introduces New 7nm ADC and DAC for 5G Direct RF Transmitters and Receivers (Feb. 22, 2023)
- Amid an Uncertain US Fab Market, TI Announces 300mm Wafer Fab in Utah (Feb. 22, 2023)
- Veriest Solutions to Present Two Verification Papers at DVCon US Conference (Feb. 22, 2023)
- Qualinx Raises €8 Million to Bring Game-Changing Digital RF Technology to Market (Feb. 21, 2023)
- Faraday Reports Record-High Revenue and Net Income for Full-Year 2022 (Feb. 21, 2023)
- Non-Volatile Memory: What Will 2023 Bring? (Feb. 21, 2023)
- Qualinx Raises €8 Million to Bring Game-Changing Digital RF Technology to Market (Feb 21, 2023)
- Low power PLL for short-range mmwave industrial radar (Feb. 21, 2023)
- Samsung Electronics' World-Class 5nm Technology Selected by Ambarella for New Automotive AI Central Domain Controller (Feb. 21, 2023)
- CEVA, Inc. Announces Inducement Award in Connection with Appointment of Amir Panush as Chief Executive Officer (Feb. 21, 2023)
- Samsung Electronics' World-Class 5nm Technology Selected by Ambarella for New Automotive AI Central Domain Controller (Feb. 21, 2023)
- China dominates semiconductor patent activity (Feb. 21, 2023)
- ESA and UK Space Agency back EnSilica to develop satellite broadband chip (Feb. 20, 2023)
- 12bit 5Gsps Current Steering DAC IP Core for Highspeed Communication and Automotive SoCs is available for immediate licensing (Feb. 20, 2023)
- Arm China profit falls 90% (Feb. 20, 2023)
- Amkor Technology and GlobalFoundries to Provide At-scale Semiconductor Test and Assembly Services in Europe (Feb. 20, 2023)
- Cadence Delivers 13 New VIP and Expands System VIP Portfolio to Accelerate Automotive, Hyperscale Data Center and Mobile SoC Verification (Feb. 20, 2023)
- Weebit Nano to demonstrate new silicon at Embedded World 2023 (Feb. 20, 2023)
- Arctic Semiconductor Ships Its First 5G RF Chipset, IceWings, for the 5G Market (Feb 20, 2023)
- Verification IP for chiplet designs (Feb. 18, 2023)
- Accurate Positioning Systems and Proximity Solutions with CoreHW Bluetooth® AoA and AoD Antenna Modules (Feb. 17, 2023)
- Infineon begins construction of new plant in Dresden (Feb. 17, 2023)
- The Six Semiconductor of OPENEDGES Technology Collaborates with imec.IC-link US to Tape-out Two 7nm Testchip (Feb. 16, 2023)
- NIST Selects "Lightweight Cryptography" Algorithms to Protect Small Devices (Feb 16, 2023)
- Cadence Reports Fourth Quarter and Fiscal Year 2022 Financial Results (Feb. 16, 2023)
- Tachyum Validates Prodigy Universal Processor with Kubernetes for High-Performance, High-Density Computing for Containers (Feb 16, 2023)
- embedded world 2023: Codasip presents on custom compute and RISC-V design (Feb. 16, 2023)
- Oculi Forms strategic partnership with GlobalFoundries to advance edge sensing technology (Feb. 16, 2023)
- Synopsys Posts Financial Results for First Quarter Fiscal Year 2023 (Feb. 16, 2023)
- Imec Digs Deeper Into Chipmakings Sustainability Issue (Feb. 16, 2023)
- Andes And IAR Systems Together Enable Leading Vendor ILITEK To Accelerate The Development Of Its ISO 26262 Ready TDDI SoC ILI6600A (Feb. 15, 2023)
- Intrinsic ID Protects 500,000,000 Devices Globally: Leading the Way in Secure and Authenticated Connected Devices (Feb. 15, 2023)
- CEVA, Inc. Announces Fourth Quarter and Full Year 2022 Financial Results (Feb. 15, 2023)
- intoPIX showcases its new JPEG XS solutions to simplify IP video production workflow at HPA Tech Retreat 2023 (Feb. 14, 2023)
- Xiphera and Muspark Technologies announce a partnership to enter the Indian technology market (Feb. 14, 2023)
- Arm China lays off 14% of staff (Feb. 14, 2023)
- Industry First PCI Express® 6.0 and CXL Interposer Improves Data Captures for Speeds up to 64 GT/s (Feb. 14, 2023)
- Würth Elektronik Partners with Crypto Quantique for IoT Security (Feb. 13, 2023)
- TSMC January 2023 Revenue Report (Feb. 13, 2023)
- Wi-Fi 6 (ax)/BLE/15.4 22nm Combo RF IP Core, for IoT Application Is Available for Immediate Licensing (Feb. 13, 2023)
- Bluetooth SIG Introduces Wireless Standard for Electronic Shelf Label Market (Feb. 13, 2023)
- A closer look at security verification for RISC-V processors (Feb. 13, 2023)
- AccelerComm to deliver cell service from space with 5G NTN LEO (Feb. 13, 2023)
- Secure Optical Data Communication Using Quantum Cryptography and Li-Fi (Feb. 12, 2023)
- GlobalFoundries and GM Announce Long-Term Direct Supply Agreement for U.S. Production of Semiconductor Chips (Feb. 10, 2023)
- indie to Acquire GEO Semiconductor (Feb. 10, 2023)
- Andes Technology: Stepping into the 18th Year with Perseverance and Proud Accomplishments (Feb. 10, 2023)
- Sharp, Motorola Mobility, and Kyocera Join Access Advance's HEVC Advance Patent Pool as Licensees (Feb 10, 2023)
- AI Must Be Secured at the Silicon Level (Feb. 10, 2023)
- GlobalFoundries Acquires Renesas' Non-Volatile Resistive RAM Technology to Proliferate IoT and 5G Applications (Feb. 09, 2023)
- Lorentz Solution Joins Intel Foundry Services (IFS) Accelerator EDA Alliance Program to Enable Peakview EM Platform and Accelerate IC and 3DIC Designs (Feb. 09, 2023)
- SMIC Reports 2022 Fourth Quarter Results (Feb. 09, 2023)
- Rambus Reports Fourth Quarter and Fiscal Year 2022 Financial Results (Feb. 09, 2023)
- The Value of Semiconductor Packaging Technology in the Era of Heterogeneous Integration (Feb. 09, 2023)
- ShortLink AB joins X-FAB's Design & Supply Chain Partner Network and IP Portal (Feb. 08, 2023)
- HARMAN and proteanTecs Collaborate to Advance Predictive and Preventive Maintenance for Automotive Electronics (Feb. 08, 2023)
- Samsung Electronics Establishes LCA Verification on Product Carbon Footprint of Its Semiconductor Business (Feb. 08, 2023)
- Could RISC-V become a force in high performance computing? (Feb. 08, 2023)
- BrainChip partners with Al Labs on application development (Feb. 08, 2023)
- Embedded World 2023: Logic Fruit Technologies to Unveil Cutting-Edge Technology Solutions (Feb 08, 2023)
- Could RISC-V become a force in high performance computing? (Feb. 08, 2023)
- Fixing security threat with post-quantum crypto on eFPGA (Feb. 08, 2023)
- Fabless FPGA/eFPGA Players Ramp up Their Innovations–a Roundup (Feb. 08, 2023)
- ZeroPoint Technologies raises EUR 3.2 million in seed funding to reduce energy consumption of data centers by more than 25% (Feb. 07, 2023)
- QuickLogic Drives eFPGA Innovation with New Aurora™ Development Tool Suite (Feb. 07, 2023)
- Arm Q3 FY22 financial results (Feb. 07, 2023)
- AI-designed Chips Reach Scale with First 100 Commercial Tape-outs Using Synopsys Technology (Feb. 07, 2023)
- Worldwide Silicon Wafer Shipments and Revenue Set New Records in 2022, SEMI Reports (Feb 07, 2023)
- Rambus Spins 6.4 GT/s DDR5 Registering Clock Driver for Speedier Servers (Feb. 07, 2023)
- Arm results shine bright in SoftBank mire (Feb. 07, 2023)
- Peripheral IPs with proven automotive compatibility are instantly licensable for extremely reliable performance. (Feb. 06, 2023)
- GUC Monthly Sales Report - January 2023 (Feb. 06, 2023)
- Gartner Says Top 10 Semiconductor Buyers Decreased Chip Spending by 7.6% in 2022 (Feb. 06, 2023)
- UMC Reports Sales for January 2023 (Feb. 06, 2023)
- GreenWaves Technologies announces a €20M financing (Feb 06, 2023)
- DVB-RCS2 Turbo Decoder and Encoder IP Core Available For Integration From Global IP Core (Feb. 06, 2023)
- Global Semiconductor Sales Increase 3.2% in 2022 Despite Second-Half Slowdown (Feb 06, 2023)
- U.S. Ban on Huawei Seen Widening China Chip War (Feb 06, 2023)
- Denying China IC Manufacturing Tools (Feb 06, 2023)
- Aldec Releases Automated Static Linting and CDC Analysis for Microchip FPGA and SoC FPGA Designs (Feb. 06, 2023)
- What will TSMC do next? (Feb. 06, 2023)
- Quantum-safe identities for a digital future (Feb. 06, 2023)
- TSMC opens up 7nm FINFET process to universities (Feb. 05, 2023)
- Rambus Delivers 6400 MT/s DDR5 Registering Clock Driver to Advance Server Memory Performance (Feb. 02, 2023)
- Xfuse, LLC Phoenix ISP Now Available as a Download for AMD Kria KV260 Vision AI Starter Kit (Feb. 02, 2023)
- GreenWaves Technologies announces a €20M financing (Feb. 02, 2023)
- Why embedded IoT benefits from software portability (Feb. 02, 2023)
- Gartner Highlights Top Trends Impacting Technology Providers Through 2025 (Feb. 02, 2023)
- Single-Event Transient Study of 28 nm UTBB-FDSOI Technology Using Pulsed Laser Mapping (Feb. 02, 2023)
- UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow (Feb. 01, 2023)
- Rambus ups DDR5 data rate and bandwidth by 33% (Feb. 01, 2023)
- 4 articles CIOs should read about open source in 2023 (Feb. 01, 2023)
- Perfecto by Perforce Releases 2023 State of Test Automation Report (Feb. 01, 2023)
- Faraday Announces Multi-site Manufacturing Support in ASIC (Jan. 31, 2023)
- Hardware Root of Trust: The Key to IoT Security in Smart Homes (Jan. 31, 2023)
- Chiplet Pioneer Eliyan Joins UCIe and JEDEC Industry Standardization Organizations, Expands Veteran Leadership Team to Accelerate Adoption of Breakthrough Die-to-Die Interconnect Solution (Jan. 31, 2023)
- Tachyum Successfully Runs UEFI on Prodigy FPGA (Jan. 31, 2023)
- Siemens advances integrated circuit verification with new, data-driven Questa Verification IQ software (Jan. 31, 2023)
- QuickLogic Partners with Andes Technology for eFPGA Joint Promotion (Jan. 31, 2023)
- TSMC Joins Hands with Apple and Sony to Keep Samsung in Check (Jan. 31, 2023)
- Intel Terminates RISC-V Development Project: What Happened? (Jan. 31, 2023)
- Weebit looks forward to first revenue in 2023 (Jan. 31, 2023)
- 10-bit 3Msps Ultra low power SAR ADC IP core for Wireless Communication and Automotive SoCs is available for immediate licensing (Jan. 30, 2023)
- Intel kills its RISC-V Pathfinder development kit programme (Jan. 30, 2023)
- BrainChip Tapes Out AKD1500 Chip in GlobalFoundries 22nm FD SOI Process (Jan. 30, 2023)
- Linaro to Acquire Arm Forge Software Tools Business (Jan. 30, 2023)
- EU Parliament Adopts Position on Chips Act (Jan 30, 2023)
- Q4 loss at Intel (Jan 30, 2023)
- Gidel introduces groundbreaking edge computer with NVIDIA Jetson Orin NX system-on-module and high-bandwidth camera frame grabber for real-time image acquisition compute and AI processing (Jan 30, 2023)
- U.S. and Japanese Chipmakers Join 2-nm War (Jan. 30, 2023)
- Achieving Unprecedented Power Savings with Analog ML (Jan. 30, 2023)
- NASA Recruits Microchip, SiFive, and RISC-V to Develop 12-Core Processor SoC for Autonomous Space Missions (Jan. 30, 2023)
- Cadence Quantus FS Solution, a 3D Field Solver, Achieves Certification for Samsung Foundry's SF4, SF3E and SF3 Process Technologies (Jan. 26, 2023)
- Sevya joins TSMC Design Center Alliance (Jan. 26, 2023)
- intoPIX to feature TicoXS FIP technology for premium 4K & 8K AVoIP wireless AV at ISE 2023 (Jan. 26, 2023)
- IAR Systems fully supports the brand-new Industrial-Grade PX5 RTOS (Jan 26, 2023)
- Axiomise Accelerates Formal Verification Adoption Across the Industry (Jan. 26, 2023)
- Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products (Jan. 26, 2023)
- BoW Strengthens Pathway to Chiplet Standardization (Jan. 26, 2023)
- Weebit Nano nears productisation, negotiating initial customer agreements (Jan. 25, 2023)
- Avery Design Systems and CoMira Announce Partnership To Enable UCIe-Compliant Chiplet Design (Jan. 25, 2023)
- Open Compute Project Foundation and JEDEC Announce a New Collaboration (Jan. 25, 2023)
- OpenLogic by Perforce and the Open Source Initiative Release 2023 State of Open Source Report (Jan. 25, 2023)
- CEA-Leti: innovation to fuel 6G wireless communications (Jan. 25, 2023)
- Japan chip venture Rapidus aims for 2-nm prototype line by 2025 (Jan. 25, 2023)
- Best FPGA (Field-Programmable Gate Arrays) Companies in 2023 (Jan. 25, 2023)
- Nexperia invests in sustainable alternatives to batteries (Jan. 24, 2023)
- VORAGO Technologies to Move All its Manufacturing Stateside in Strategic Partnership with SkyWater's Trusted Foundry (Jan 24, 2023)
- Startup raises funds to advance neutral atoms quantum computing (Jan. 24, 2023)
- AI Compute Company Banks on Chiplets for Future Processors (Jan. 24, 2023)
- Semiconductor Companies Create Building Block for Chiplet Design (Jan. 24, 2023)
- 6G-IA and ETSI to bridge research, standards and industry (Jan. 24, 2023)
- The latest ASIL-B,C,D, ISO26262 Certified Silicon Proven Interface IP Cores are ready for immediate licensing (Jan. 23, 2023)
- Accellera Announces the Formation of the Clock Domain Crossing Working Group (Jan. 23, 2023)
- Xiphera announces the first IP core for the quantum-secure xQlave™ product family (Jan. 23, 2023)
- OIF Marks 25th Anniversary, Launches New Physical & Link Layer Working Group Electrical Project and Adds 112G VSR Clause to CEI 5.0 IA at Q1 Technical and MA&E Committees Meeting (Jan 23, 2023)
- GUC Delivers its First TSMC N3 Chip and First AI-Optimized N5 Design Using Cadence Digital Solutions (Jan. 23, 2023)
- Accellera's Security Annotation for Electronic Design Integration Standard 1.0 Moves Toward IEEE Standardization (Jan. 23, 2023)
- CEO Interview: Stephen Fairbanks of Certus Semiconductor (Jan. 23, 2023)
- AI Must Be Secured at the Silicon Level (Jan 23, 2023)
- Electronic System Design Industry Reports Revenue of $3.8 Billion in Q3 2022, ESD Alliance Reports (Jan. 23, 2023)
- New Wave DV Releases Two New SOSA-Aligned 3U VPX ACAP (FPGA) Modules (Jan. 23, 2023)
- Scaling Up Quantum Computing by Interconnecting Quantum Processors (Jan. 23, 2023)
- Swedish quantum computer boost for industry (Jan. 23, 2023)
- Comcores TSN technology and 5G communication expertise to be deployed in a significant EU funded project with pan-European partners (Jan. 20, 2023)
- XConn Achieves First-Pass Silicon Success for CXL Switch SoC with Synopsys CXL and PCI Express IP Products (Jan. 19, 2023)
- Automotive-grade module marries Wi-Fi 6E, Bluetooth LE Audio (Jan. 19, 2023)
- Andes Technology Collaborates with LDRA to Deliver Integrated Tool Suite for Safety-Critical Software on Andes RISC-V CPU Solutions (Jan. 19, 2023)
- Foundry Revenue Is Forecasted to Drop by 4% YoY for 2023 Due to Slow Inventory Consumption and Falling Wafer Input from Customers, Says TrendForce (Jan. 19, 2023)
- Analog Bridges Digital Electronics in IoT Designs (Jan. 19, 2023)
- Electric vehicles: CEA and Renault Group develop a very high efficiency bidirectional on-board charger (Jan. 19, 2023)
- Analog Bits Awarded ISO 9001 and ASIL B Ready Certifications (Jan. 18, 2023)
- Seven trends for the security industry in 2023 (Jan. 18, 2023)
- Alphawave IP renames as it looks to 2nm (Jan. 18, 2023)
- Vsora Unveils AI Chip Family to Enable L2-L5 Autonomous Driving (Jan. 18, 2023)
- Gartner Says Worldwide Semiconductor Revenue Grew 1.1% in 2022 (Jan. 17, 2023)
- Settlement Reached in Lawsuit Brought by Tachyum Against Cadence (Jan 17, 2023)
- Risc-V MCUs have 8 to 20 pins (Jan. 17, 2023)
- Why Quantum Computing Capabilities Are Creating Security Vulnerabilities Today (Jan. 17, 2023)
- GA-ASI selects Siemens Xcelerator for digital transformation (Jan. 17, 2023)
- 5 top IoT sustainability trends for 2023 (Jan. 17, 2023)
- France to Invest €500M in Deeptech Startups by 2030 (Jan. 17, 2023)
- Stadia's Bluetooth controller tool now live so users can connect to other devices (Jan. 17, 2023)
- Imagination Technologies Reimagines GPUs With Ray Tracing (Jan. 17, 2023)
- Unveiling the Future of Home Entertainment: a truly immersive Multimedia experience through HDMI 1.4 Tx-Rx PHY and Controller IP Cores (Jan. 16, 2023)
- Analog IPs Automate Integration, Tune to Fab Nodes (Jan. 16, 2023)
- National Instruments up for sale (Jan. 16, 2023)
- TSMC weighs new plants in Japan and Europe (Jan. 16, 2023)
- Samsung 3nm process yield is 'perfect' (Jan. 16, 2023)
- Alphawave Semi: Q4 2022 Trading and Business Update (Jan. 13, 2023)
- Alphawave to outline long-term strategy and financial targets (Jan. 13, 2023)
- Imagination collaborates with Synopsys to accelerate 3D visualisation in mobile and data centre (Jan. 13, 2023)
- Certus Semiconductor releases ESD library in GlobalFoundries 12nm Finfet process (Jan. 13, 2023)
- Cadence Now Supports Dolby Atmos for Cars (Jan. 13, 2023)
- Alphawave IP Announces Appointments to its Executive Leadership team (Jan. 12, 2023)
- Creonic DVB-GSE Encapsulator and Decapsulator IP Cores Are Now Available with Data Rates of up to 4Gbit/s (Jan. 12, 2023)
- TSMC Reports Fourth Quarter EPS of NT$11.41 (Jan. 12, 2023)
- Chipletz selects Siemens' EDA solutions for its Smart Substrate IC packaging technology (Jan. 12, 2023)
- VSORA Secures $4.2 Million in Financing from Otium Capital, Angel Investors (Jan. 12, 2023)
- EDA Tools for Analog: Where Do I Go From Here? (Jan 12, 2023)
- Apple to replace Broadcom IC with in-house designed part (Jan 12, 2023)
- The Importance of 3D IC Ecosystem Collaboration (Jan. 12, 2023)
- Andes Unveils Details of its Entry Level D23 RISC-V Processor Core (Jan. 12, 2023)
- Imagination's IMG DXT GPU unlocks scalable, premium ray tracing for all mobile gamers (Jan. 11, 2023)
- PDF Solutions and proteanTecs Announce Collaboration to Deliver Combined Solutions for Semiconductor Analytics to Address the Needs of Data Centers and Automotive Makers (Jan. 11, 2023)
- Samsung and SK Hynix planing to procure fewer silicon wafers (Jan. 11, 2023)
- Quantum Computing–Top Questions Answered (Jan. 11, 2023)
- Bluespec collaborates with Synopsys to address growing verification demands for RISC-V design community (Jan. 11, 2023)
- ADAS Back in the Driver's Seat at CES 2023 (Jan. 11, 2023)
- Ceremorphic Introduces Custom Silicon Development for Advanced Nodes Using In-House Technology to Speed Customer HPC Chip Development (Jan. 10, 2023)
- Global Semiconductor Sales Decrease 2.9% Month-to-Month in November (Jan. 10, 2023)
- Preparing engineering students with technology skills for the industrial world (Jan. 10, 2023)
- Tachyum Closes DDR5 Timing at over 6400MT/s Providing Massive Bandwidth for Prodigy Chip (Jan 10, 2023)
- TSMC December 2022 Revenue Report (Jan. 10, 2023)
- RISC-V SBC VisionFive 2 Officially Shipped (Jan. 10, 2023)
- Arteris Acquires Semifore to Accelerate System-on-Chip Development (Jan. 10, 2023)
- Semiconductor and Embedded Systems Architecture Labs (SEAL) makes new technology available to everyone for learning and innovation (Jan. 10, 2023)
- Samsung Foundry Achieves "Perfect Level" 3nm Yield Rates, Levelling up to TSMC (Jan. 10, 2023)
- Intels Process Progress (Jan. 10, 2023)
- Quad-core Risc-V development board with 3D GPU in Pico-ITX (Jan. 10, 2023)
- Nvidia, Intel team up on energy efficient AI server (Jan. 10, 2023)
- Capgemini Reinforces Its Focus On Global Industries And Sustainability Services With Top Leadership Appointments (Jan. 10, 2023)
- Digital Blocks AMBA Peripherals I3C, I2C, eSPI, xSPI Controller IP Core Families Extend Leadership with enhancements containing feature-rich, system-level integration features. (Jan. 09, 2023)
- Display Port/eDisplay Port v.1.4 Tx-Rx PHY & Controller Silicon Proven IP Cores with high Bandwidth and 4K/8K Resolution is ready for immediate licensing (Jan. 09, 2023)
- CCSDS AR4JA LDPC Encoder and Decoder FEC IP Core Available For Licensing and Implementation from Global IP Core (Jan. 09, 2023)
- Rapid Silicon Announces $30M Series A Round (Jan 09, 2023)
- CEVA Audio Front End Software Solution Becomes Alexa Voice Service (AVS) Qualified (Jan. 09, 2023)
- MIPS Rolls Out Its First RISC-V Processor Core – It's a Big 'Un (Jan. 09, 2023)
- Supermicro launches Arm-powered servers (Jan. 09, 2023)
- All the PCIe 5.0 SSDs Coming Out in the Next Year or So (Jan. 09, 2023)
- UMC Reports Sales for December 2022 (Jan. 06, 2023)
- Cadence Tensilica HiFi DSP Enables Highly Energy-Efficient Audio Playback for Dolby Atmos for Cars (Jan. 06, 2023)
- Sino Wealth License and Deploy CEVA Bluetooth® Low Energy IP for its Connectivity MCUs (Jan. 06, 2023)
- Dolphin Design and Neovision joint forces to make AI processing viable for ambient computing electronics (Jan. 05, 2023)
- GUC Monthly Sales Report - December 2022 (Jan. 05, 2023)
- €270m for RISC-V chiplets to build European exascale supercomputers (Jan. 05, 2023)
- CEVA and Autotalks Expand Collaboration to Create World's First 5G-V2X Solution (Jan. 05, 2023)
- SpacemiT makes important breakthroughs in RISC-V High-Performance Cores (Jan. 05, 2023)
- Ventana Introduces CES Audience to World's Highest Performance RISC-V CPU, Veyron V1 (Jan. 05, 2023)
- Syntiant Unveils NDP115 Neural Decision Processor at CES 2023 (Jan. 05, 2023)
- SkyWater Technology Expands Borrowing Capacity by Closing New $100 Million Senior Secured Revolving Credit Facility (Jan 05, 2023)
- SNIA Spec Gets Data Moving in CXL Environment (Jan. 05, 2023)
- VESA Showcases Product Demos Supporting DisplayPort 2.1 and Other High-Performance Video Standards at CES 2023 (Jan. 05, 2023)
- CEVA and LG Partner to Bring Intelligent Vision Processing to Smart Home Appliances (Jan. 04, 2023)
- intoPIX shows the new lightweight video compression standards and technologies driving automotive at CES 2023 (Jan. 04, 2023)
- Google announces official Android RISC-V support (Jan. 04, 2023)
- CEVA and LG Partner to Bring Intelligent Vision Processing to Smart Home Appliances (Jan. 04, 2023)
- intoPIX shows the new lightweight video compression standards and technologies driving automotive at CES 2023 (Jan. 04, 2023)
- Weebit Nano tapes-out first 22nm demo chip (Jan. 03, 2023)
- Edge Impulse and BrainChip Partner to Further AI Development with Support for the Akida platform (Jan. 03, 2023)
- RISC-V Summit 2022: All Your CPUs Belong to Us (Jan. 03, 2023)
- Estimated Shipments of iPhone 14 Devices in 2022 Have Been Lowered to 78.1 Million Units Due to Impact of COVID-19 Lockdown on Foxconn's Base in Zhengzhou, Says TrendForce (Jan 03, 2023)
- RISC-V Summit 2022: All Your CPUs Belong to Us (Jan. 03, 2023)
- RISC-V chip to drive next generation app store of hearables (Jan. 03, 2023)
- Digital Blocks DMA Controller Verilog IP Core Family Extends Leadership with enhancements to AXI4 Memory Map and Streaming Interfaces (Jan. 02, 2023)
- eDisplay Port Tx PHY and Controller IP Cores in 12FFC and 40ULP for an immersive UHD experience at 8K (Jan. 02, 2023)
- USB 3.0 IP, MIPI D-PHY v1.2 IP, Display Port v1.4 IP, 1G Ethernet IP, the Best-Selling Interface IP Cores solutions through T2M in 2022 (Jan. 02, 2023)
- Octacore ARM SystemReady AI chip targets IoT (Jan. 02, 2023)
- Seven semiconductor trends for 2023 (Jan. 02, 2023)
- Should open source sniff the geopolitical wind and ban itself in China and Russia? (Jan. 01, 2023)
- Analysts Estimate TSMC's 3nm Yields Between 60% and 80% (Dec. 31, 2022)
- Prelude to the War of 3-nano Semiconductor... TSMC "Starting mass production" (Dec. 30, 2022)
- €270m for RISC-V chiplets to build European exascale supercomputers (Dec. 29, 2022)
- Taiwan Brings 96 Startups to Attend CES 2023 (Dec. 29, 2022)
- TSMC holds 3nm ceremony (Dec. 28, 2022)
- intoPIX Showcases Ultra-low Latency Wireless Display Concept at CES Las Vegas 2023 (Dec. 28, 2022)
- 6G project aims to connect cars and drones (Dec. 28, 2022)
- TSMC looks at Dresden for possible European plant (Dec. 28, 2022)
- Smarter Edge Equals Smarter Living Using AIoT (Dec. 28, 2022)
- Why firmware attacks are a top security threat (Dec. 27, 2022)
- TSMC in talks to build fab in Dresden (Dec. 26, 2022)
- Cadence Announces Industry Best-In-Class 8533Mbps LPDDR5X IP Solution for Next-Generation AI, Automotive and Mobile Applications (Dec. 26, 2022)
- TSMC will start the mass production of its next-gen cutting-edge chips this week (Dec. 26, 2022)
- Quantum Computing Brings New Error Correction Challenges (Dec. 26, 2022)
- Top IoT Products in 2022 (Dec. 26, 2022)
- Achronix Announces Speedster7t AC7t1500 FPGA General Availability (Dec. 23, 2022)
- Samsung loses Tesla's huge 4nm chip order to TSMC (Dec. 23, 2022)
- The Answer to Eco-Friendly Semiconductors Lies in Your Coffee (Dec. 23, 2022)
- Axelera AI Announces Metis AI Platform (Dec. 22, 2022)
- Stellantis Completes Acquisition of aiMotive to Accelerate Autonomous Driving Journey (Dec. 22, 2022)
- intoPIX TicoRAW technology empowers mobile devices, sensors, and cameras at CES 2023 (Dec. 22, 2022)
- BSC develops four open-source hardware components based on RISC-V, contributing to open, reliable and high-performance safety-critical systems for industry (Dec 22, 2022)
- proteanTecs Named the #1 Most Promising Startup in Israel (Dec. 21, 2022)
- PEZY Computing Selects proteanTecs to Monitor Die-to-Die Interconnects in Next-Generation Supercomputer Processors (Dec. 21, 2022)
- Dream Chip Technologies Licensed its Real-time Pixel Processor IP to Renesas (Dec. 21, 2022)
- Japan collaborates with IBM to produce 2nm chips (Dec. 21, 2022)
- IPrium releases 100 Gbps Polar Encoder and Decoder (Dec 21, 2022)
- Efinix® Releases Efinity® RISC-V Embedded Software IDE (Dec. 20, 2022)
- GbE (10/100/1000Base-T) PHY IP Core, a robust, low-power, fully featured IP Core along with MAC Controller IP Core is available for immediate licensing (Dec. 20, 2022)
- U.S. Blacklists YMTC, 21 Chinese Companies on AI Threat (Dec 20, 2022)
- Soitec Expands Singapore Fab to Boost Wafer Production Capacity (Dec. 20, 2022)
- European Night at CES 2023: innovation made in Europe for the world (Dec. 20, 2022)
- Synopsys Initiates $300 Million Accelerated Share Repurchase Agreement (Dec. 19, 2022)
- Low-Power Apps, Foundries Eye Emerging Memories (Dec 19, 2022)
- Startup PUFsecurity's PUF-based Crypto Coprocessor Receives Accolade at EE Awards Asia 2022 (Dec. 19, 2022)
- IP architect Tariq Kurd wins the RISC-V Contributor Award (Dec. 19, 2022)
- Top industries affected by AI trends in 2023 (Dec. 19, 2022)
- UK government to invest £110m in 5G and 6G research (Dec. 19, 2022)
- TSMC fab in Japan at center of Sony's image sensor kingdom (Dec. 17, 2022)
- Labwise by Allegro DVT Introduces StreamWise-ATSC Test Suites to Accelerate Conformance Testing of ATSC 3.0 Receivers (Dec. 16, 2022)
- Global Total Semiconductor Equipment Sales Forecast to Reach Record High in 2022, SEMI Reports (Dec 16, 2022)
- DDMA, multi-channel DMA Controller IP core from DCD-SEMI (Dec. 15, 2022)
- Arm declines to sell Neoverse V to Alibaba (Dec. 15, 2022)
- New CAES, IAR Systems Partnership Brings NOEL-V Support to IAR Embedded Workbench (Dec. 15, 2022)
- Imagination extends its commitment to RISC-V with an upgrade to Premier level membership (Dec. 15, 2022)
- Codasip Lead IP Architect chosen for the RISC-V Contributor Award (Dec. 15, 2022)
- Total Revenue of Global Top 10 IC Design Houses for 3Q22 Showed QoQ Drop of 5.3%; Broadcom Returned to No. 2 Spot in Revenue Ranking by Overtaking NVIDIA and AMD, Says TrendForce (Dec. 15, 2022)
- Ventana Introduces Veyron, World's First Data Center Class RISC-V CPU Product Family (Dec. 15, 2022)
- Quadric Announces Completion of Series B Funding (Dec 15, 2022)
- Solutions Disclosed at RISC-V Summit: Security, Verification, and More (Dec. 15, 2022)
- JEDEC Publishes Automotive Solid State Drive (SSD) Device Standard (Dec. 14, 2022)
- Examining the Top Five Fallacies About RISC-V (Dec. 14, 2022)
- SiFive Delivers Record Growth in 2022 with Fast-Growing Roster of New Customers and Products (Dec. 14, 2022)
- Latest aiWare4+ automotive NPU brings enhanced programmability, flexibility and scalability while retaining highest efficiency (Dec. 14, 2022)
- Pragmatic Semiconductor increases Series C funding to $125 million (Dec 14, 2022)
- M3 Technology Receives EE Awards for Simplifying Supercapacitor Designs (Dec. 14, 2022)
- XMOS announces software-defined SoC platform now compatible with RISC-V (Dec. 13, 2022)
- LeWiz released RISC-V with OmniXtend clustering technology to open source. (Dec. 13, 2022)
- Faraday Unveils SONOS eFlash Platform with Infineon on UMC 40uLP (Dec. 13, 2022)
- Breker Verification Systems Unveils Easy-To-Adopt Integrity FASTApps Targeting RISC-V Processor Core, SoC Verification Scenarios (Dec. 13, 2022)
- KI-FLEX AI chip tapes out with flexible videantis processor platform (Dec. 13, 2022)
- Cadence Wins Six 2022 TSMC OIP Partner of the Year Awards (Dec. 13, 2022)
- NSITEXE Qualifies Imperas RISC-V Reference Models for Akaria Processors NS72A, NS72VA, and NS31A (Dec. 13, 2022)
- Intrinsic ID to Showcase its Security Solutions at CES 2023 (Dec. 13, 2022)
- CEVA NeuPro-M Edge AI Processor Architecture Recognized at EE Awards Asia 2022 (Dec. 13, 2022)
- Siemens pioneers commercial grade Linux support for the RISC-V architecture (Dec. 13, 2022)
- CAES' Quad-Core LEON4FT on its Way to the Moon (Dec 13, 2022)
- RISC-V Sees Significant Growth and Technical Progress in 2022 with Billions of RISC-V Cores in Market (Dec 13, 2022)
- RISC-V arrives in data centre league (Dec. 13, 2022)
- Microchip Showcases RISC-V-Based FPGA and Space-Compute Solutions at RISC-V Summit (Dec. 12, 2022)
- BrainChip Joins Intel Foundry Services to Advance Neuromorphic AI at the Edge (Dec. 12, 2022)
- USB 3.2 OTG Controller and PHY IP Cores for ultra-high speed, lossless data and power delivery are available for immediate licensing (Dec. 12, 2022)
- Sofics joins the Intel Foundry Services (IFS) Accelerator IP Alliance program (Dec. 12, 2022)
- QuarkLink scalable IoT Security Platform Now Available on 30-Day Free Trial (Dec. 12, 2022)
- Imperas releases new updates, test suites, and functional coverage library to support the rapid growth in RISC-V Verification (Dec. 12, 2022)
- MIPS Partners With Mobileye to Accelerate Next Generation Autonomous Driving Technologies and Advanced Driver Assistance Systems (Dec. 12, 2022)
- Codasip launches SecuRISC5 initiative (Dec. 12, 2022)
- Global Chip Industry Projected to Invest More Than $500 Billion in New Factories by 2024, SEMI Reports (Dec. 12, 2022)
- Tata may make chips (Dec 12, 2022)
- MIPS Announces Availability of its first RISC-V IP core - the eVocore P8700 Multiprocessor (Dec. 12, 2022)
- Samsung fails to narrow gap with TSMC in foundry market (Dec. 12, 2022)
- Japan's New Semiconductor Foundry Rapidus Taps IBM For 2nm Process (Dec. 12, 2022)
- Quantum-driven IoT security platform available on free trial (Dec. 12, 2022)
- The sound of joy in your ear (Dec. 12, 2022)
- TSMC November 2022 Revenue Report (Dec. 09, 2022)
- Soitec CEO remains positive on semiconductor growth (Dec. 09, 2022)
- Allegro DVT and V-Nova announce strategic collaboration to accelerate development of LCEVC ecosystem (Dec. 08, 2022)
- Andes Announces RISC-V Multicore 1024-bit Vector Processor: AX45MPV (Dec. 08, 2022)
- Global Top 10 Foundries' Total Revenue Grew by 6% QoQ for 3Q22, but Foundry Industry's Revenue Performance Will Enter Correction Period in 4Q22, Says TrendForce (Dec. 08, 2022)
- Imagination PowerVR SDK wins Design Tool and Development Software Product of the Year (Dec. 08, 2022)
- Andes Technology Unveils the AndesCore™ D23, a Feature-Rich, Low-Power and Highly-Secured Entry-Level RISC-V Processor (Dec 08, 2022)
- Siquance: an avant-garde startup dedicated to quantum calculations (Dec 08, 2022)
- Imperas and Imagination collaborate on providing virtual platform models for the Catapult RISC-V CPU family (Dec. 08, 2022)
- Imec enables tight standard cell boundary scaling using a two-level semi-damascene integration scheme (Dec 08, 2022)
- Apple, AMD Back TSMC's Tripled Investment, Tech Upgrade in Arizona (Dec 08, 2022)
- Join Andes at RISC-V Summit; Learn the Only ISO 26262 Fully-Compliant RISC-V CPU, the Latest Multicore 4-Way Out-Of-Order Processor & the Multicore 1024-bit Vector Processor (Dec 08, 2022)
- TSMC Announces Updates for TSMC Arizona (Dec. 07, 2022)
- Codasip launches Codasip Labs to accelerate advanced technologies (Dec. 07, 2022)
- MIPS Selects Imperas for Advanced Verification of High-Performance RISC-V Application-class Processors (Dec. 07, 2022)
- Andes Technology and Parasoft Collaborate to Provide Seamless Software Testing Tools for Automotive Functional Safety Applications (Dec. 07, 2022)
- Japan's Rapidus signs up IMEC to support 2nm push (Dec. 07, 2022)
- Intel Pathfinder for RISC-V unifies platform, adds features (Dec. 07, 2022)
- Samsung and NAVER Collaborate on Chip Solutions for Hyperscale AI (Dec. 07, 2022)
- Intel Pathfinder for RISC-V: New Capabilities and A Growing Ecosystem (Dec. 06, 2022)
- UMC Reports Sales for November 2022 (Dec. 06, 2022)
- Lattice Extends Low Power Leadership with New Lattice Avant FPGA Platform (Dec. 06, 2022)
- IEEE802.11n/ac/ax Wi-Fi LDPC Encoder and Decoder FEC IP Core Available For Licensing and Implementation from Global IP Core (Dec. 06, 2022)
- Israeli AI startup NeuReality raises $35M Series A to bring its novel inferencing chip to the market (Dec. 06, 2022)
- QuickLogic Inks eFPGA IP Partnership Agreement with Yu-Hsin Layout Technology (Dec. 06, 2022)
- Arteris FlexNoC Interconnect Licensed by Telechips for Use in Advanced Automotive Applications (Dec. 06, 2022)
- Avery Design Systems Announces SimXACT-SA™ for Improved Sequential X-Verification (Dec. 06, 2022)
- Mixel Patented MIPI D-PHY RX+ IP Integrated into Lumissil Automotive Microcontroller (Dec. 06, 2022)
- Tachyum Signs MOU with Cologne Chip (Dec 06, 2022)
- Avery Design Systems Announces SimXACT-SA™ for Improved Sequential X-Verification (Dec 06, 2022)
- STMicroelectronics and Soitec Partner on SiC Substrate Manufacturing Technology (Dec. 06, 2022)
- France's Siquance startup targets 'European' quantum computing (Dec. 06, 2022)
- Finland connects a quantum computer to a supercomputer (Dec. 06, 2022)
- Imperas and Andes collaborate to support RISC-V innovations (Dec. 05, 2022)
- Innovative ASIC CPU Drives Record-Setting Server Performance (Dec. 05, 2022)
- Novatek Adopts CEVA's Latest Sensor Hub DSP for New Multi-sensor IP Camera SoC (Dec. 05, 2022)
- GUC Monthly Sales Report - November 2022 (Dec. 05, 2022)
- Implement seamless DRAM processing speeds utilizing Silicon Proven DDR4/LPDDR4/DDR3L Combo PHY IP Core in 12FFC process technology (Dec. 05, 2022)
- Global Semiconductor Sales Decrease 0.3% Month-to-Month in October (Dec 05, 2022)
- Eliyan eliminates silicon interposer to advance D2D chiplet connect for HPC (Dec 05, 2022)
- Simon Davidmann President & CEO of Imperas Software elected as Chair of the OpenHW Verification Task Group (Dec 05, 2022)
- Renesas tapes out spiking neural network chip (Dec 05, 2022)
- Ansys Announces GlobalFoundries Certification of Semiconductor Tools for GF 22FDX® Platform (Dec. 05, 2022)
- Bringing 20/20 Vision to the Edge with AI Inferencing (Dec. 05, 2022)
- Safety-Aware Chips Serve Automonous-Driving Apps (Dec. 05, 2022)
- Intel says it will squeeze 1 trillion transistors onto a chip package by 2030 (Dec. 04, 2022)
- USB IP Cores for the Intel Pathfinder for RISC-V Platform (Dec. 02, 2022)
- Codasip and Intel bring RISC-V development to higher-education (Dec. 02, 2022)
- Xiphera Launches xQlave™ Product Family of Quantum-Secure Cryptographic IP Cores (Dec. 01, 2022)
- Crypto Quantique Joins Silicon Catalyst In-Kind Partner Ecosystem Along with 2 Other UK-based Companies (Dec. 01, 2022)
- Siemens streamlines medical standards compliance for Linux OS based systems (Dec. 01, 2022)
- Global Semiconductor Equipment Billings Increase 9% in Q3 2022, SEMI Reports (Dec. 01, 2022)
- Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2022 (Dec. 01, 2022)
- Synopsys Appoints Shelagh Glaser Chief Financial Officer (Dec. 01, 2022)
- CEVA Joins Intel Pathfinder for RISC-V Program (Dec. 01, 2022)
- New Report Identifies Challenges to Continued U.S. Leadership in Semiconductor Design, Innovation (Dec. 01, 2022)
- The Worldwide Semiconductor Market is expected to slow to 4.4% growth in 2022, followed by a decline of 4.1% in 2023 (Dec. 01, 2022)
- CHIPS Alliance Announces Rapid Silicon as its Newest Member (Dec 01, 2022)
- ItoM is now part of the Bosch Group (Dec. 01, 2022)
- Samsung and TSMC Competing to Secure Foundry Customers (Dec. 01, 2022)
- Cadence and UMC Certified mmWave Reference Flow Delivers First-Pass Silicon Success (Nov. 30, 2022)
- Arm Announces Appointment of Paul E. Jacobs and Rosemary Schooler to its Board of Directors (Nov. 30, 2022)
- A 6G Tree Grows in Brooklyn? (Nov. 30, 2022)
- Truechip Announces First Customer Shipment of UCIe Verification IP (Nov. 29, 2022)
- Morse Micro Supercharges its Series B Funding Round with AU $30 Million Top-up from Major Superannuation Funds and Others (Nov. 29, 2022)
- After Record Sales in 2022, Semi Sales Forecast to Fall -5% in 2023 (Nov. 29, 2022)
- Tachyum Successfully Runs LINPACK on FPGA With IEEE 754-2019 Compliant FPU (Nov. 29, 2022)
- The MOSIS Service of the USC Information Sciences Institute and SkyWater Collaborate on Silicon IC Design Enablement and Manufacturing Service (Nov. 29, 2022)
- Home Appliance Company Chooses POLYN Technology's NeuroVoice Chip (Nov. 29, 2022)
- CAES Design Win of RISC-V/NOEL-V IP for Idaho Scientific Secure Processor for US Critical Infrastructure (Nov. 29, 2022)
- SiFive Expands Presence in India to Keep Up with the Company's Ultra-fast Growth (Nov. 29, 2022)
- QuantWare launches Foundry Services for superconducting quantum chips (Nov. 29, 2022)
- RISC-V Summit 2022: Codasip to showcase processor customization, and safety and security solutions (Nov. 29, 2022)
- TSMC to Make 3 nm Semiconductors at Arizona Fab, Looking to 1 nm (Nov. 29, 2022)
- 6G Cybersecurity Will Transform How We Deal with Cyberattacks (Nov. 29, 2022)
- DMP Launches "ZIA SV" Stereo Vision IP for AMD Xilinx Adaptive Computing Devices (Nov. 28, 2022)
- Tiempo Secure gears for further expansion with Mikael Dubreucq and Frederic Heitzmann hired in newly created key positions (Nov. 28, 2022)
- Gartner Forecasts Worldwide Semiconductor Revenue Growth to Decline 3.6% in 2023 (Nov. 28, 2022)
- CAN 2.0 and LIN 2.2 Controller IP Cores with ASIL B, C and D packages for High-End Automotive and Consumer Applications (Nov. 28, 2022)
- Cortus announces the launch of LOTUS family with two new RISC-V microcontrollers (MCUs) (Nov. 28, 2022)
- Electronic passport security for the quantum computer era (Nov. 28, 2022)
- Sweden opens advanced automotive cyber security centre (Nov. 28, 2022)
- China stretches its 6G lead with successful tests; U.S. turns to Nokia and Ericsson (Nov. 27, 2022)
- Leti, Intel look to quadruple hybrid bonding speeds (Nov. 25, 2022)
- Defacto's SoC Compiler Certified ISO26262 (Nov. 24, 2022)
- IPrium releases CCSDS TM Telemetry AR4JA LDPC Encoder and Decoder (Nov. 24, 2022)
- EU edges closer to Chips Act (Nov. 24, 2022)
- Global NAND Flash Revenue Fell by 24.3% QoQ for 3Q23 as Suppliers Made Large Price Concessions That in Turn Impacted Their Results, Says TrendForce (Nov. 24, 2022)
- GPU Q3'22 biggest quarter-to-quarter drop since the 2009 recession (Nov. 24, 2022)
- 2023 Semi Capex Forecast Sees Largest Decline Since 2008-09 (Nov. 23, 2022)
- SkyWater CEO Expands "Technology Foundry" Model (Nov. 23, 2022)
- Samsung's Latest Best-in-Class Technologies Take Center Stage at RSNA 2022 (Nov. 23, 2022)
- Aniah raises €6 million to speed up the deployment of its verification and design support software for semiconductors (Nov. 22, 2022)
- Faraday FPGA-Go-ASIC™ Succeeds in Penetrating the Market (Nov. 22, 2022)
- Intel foundry boss to leave (Nov. 22, 2022)
- Arm public offer likely to be postponed beyond Q123 (Nov. 22, 2022)
- Samsung Has Reportedly Secured 3nm Orders from NVIDIA, Qualcomm & More (Nov. 22, 2022)
- Ericsson to set up 6G research centre in UK (Nov. 22, 2022)
- BrainChip Names Former Arm Executive Nandan Nayampally as Chief Marketing Officer (Nov. 21, 2022)
- Embrace the new age of ultra-high-definition multimedia with HDMI 2.0 Rx PHY IP Cores in 12FFC process technology with matching controller (Nov. 21, 2022)
- CAES Supports NASA's Return to the Moon (Nov. 21, 2022)
- Imagination partners with MulticoreWare Inc. and demonstrates superior performance of its GPUs (Nov. 21, 2022)
- TSMC to produce 3-nanometer chips at its Arizona factory (Nov. 21, 2022)
- Wi-Fi 6 and 5G provide today's optimal wireless IoT connectivity (Nov. 21, 2022)
- Capgemini develops new AI solution to advance the treatment of River Blindness (Nov. 21, 2022)
- Tesla becomes TSMC's first EV client for 4nm chips with 3x faster self-driving calculations (Nov. 21, 2022)
- Synopsys Wins Six Partner of the Year Awards at TSMC 2022 OIP Ecosystem Forum (Nov. 18, 2022)
- RISC-V Is Far from Being an Alternative to x86 and Arm in HPC (Nov. 18, 2022)
- intoPIX enables JPEG XS high frame rates real-time encoding from 120fps to more than 1000fps with the TicoXS FPGA IP-cores (Nov. 17, 2022)
- Small code, high performance: Latest IAR Embedded Workbench for RISC-V leverages CoDense™ from Andes (Nov. 17, 2022)
- Synopsys To Play A Key Role In Enabling Intel Foundry Services For US DOD Chip Program (Nov. 17, 2022)
- Vidatronic Named to the 18th Annual Aggie 100™, Honored as Fastest-Growing Company (Nov. 17, 2022)
- Secure-IC and Unseenlabs Partner to Retrofit Satellites already in Mission Mode with the Capability to Secure and Authenticate Data using Post-Quantum Cryptography (Nov. 17, 2022)
- Alphawave IP announced as one of Deloitte's Technology Fast 50™ and North American Technology Fast 500™ 2022 award winners (Nov. 17, 2022)
- Stellantis Accelerates Autonomous Driving Journey with Acquisition of aiMotive, a Leading Artificial Intelligence and Autonomous Driving Start-up (Nov. 17, 2022)
- Truechip Announces First Customer Shipment of MIPI A-PHY Verification IP (Nov. 17, 2022)
- Are You Ready for PCIe 6.0? (Nov. 17, 2022)
- Why RISC-V Architecture Is the Future of Embedded Design (Nov. 17, 2022)
- How AI is Reshaping the Edge Computing Landscape (Nov. 17, 2022)
- intoPIX extends the FastTicoRAW SDK capabilities with lossless RAW coding for measurement and analysis (Nov. 16, 2022)
- eMemory Collaborates with Renesas on the Development of its Pure 5V OTP IP Using 130nm BCD Plus Process for Automotive Applications (Nov. 16, 2022)
- DSP Concepts and Analog Devices Collaborate on Solution for Rapid Design of In-Vehicle Audio Entertainment Systems (Nov. 16, 2022)
- Efinix Releases TinyML Platform for Highly Accelerated AI Workloads on Its Efficient FPGAs (Nov. 16, 2022)
- Cadence Introduces Industry's Leading-Performance, Silicon-Proven 22Gbps GDDR6 IP at TSMC N5 (Nov. 16, 2022)
- Silicon Frontline Accepted as Partner in Samsung Foundry SAFE™ Program (Nov 16, 2022)
- CAES GR712RC Microprocessor Selected by Argotec for Multiple Space Missions (Nov. 16, 2022)
- Infineon plans $5bn 300mm fab in Dresden (Nov 16, 2022)
- Singapore as a Base for French Investment and Expansion in ASEAN (Nov. 16, 2022)
- EASii IC announces first silicon for its DVB-S2X satellite Modem ASIC (Nov. 15, 2022)
- StarFive Releases StarFive StarStudio IDE, which supports both Linux and Baremetal Development (Nov. 15, 2022)
- TSMC Expansion in Arizona to Target 3-nm Node (Nov. 15, 2022)
- CEVA Introduces Voice User Interface Solution for TI SimpleLink™ Wi-Fi® Wireless MCUs (Nov. 15, 2022)
- NASA Uses RISC-V Vector Spec to Soup Up Space Computers (Nov. 15, 2022)
- AR/VR: Three predictions for 2023 (Nov. 15, 2022)
- Ultra-high-speed 14-bit at 4.32Gbps ADC IP Cores are available for licensing, with increased accuracy and high sampling rate for a variety of applications (Nov 14, 2022)
- QuickLogic Inks eFPGA Sales Rep Agreement with CHIP-gogo in Japan (Nov. 14, 2022)
- Marvell Announces Innovative CXL Development Platform for Multi-Host Memory Pooling (Nov. 14, 2022)
- Consortium forms Rapidus to get Japan back into chip race at 2nm (Nov. 14, 2022)
- JEDEC Announces Publication of the SPD5118 Hub and Serial Presence Detect Device and the DDR5 SPD Contents Specifications (Nov. 14, 2022)
- ZeroPoint Technologies can reduce data center energy consumption by 25% (Nov. 14, 2022)
- Nexperia invests in sustainable alternatives to batteries by acquiring Delft-based Nowi (Nov. 14, 2022)
- Arasan announces MIPI CSI IP for FPGA supporting full C-PHY 2.0 speeds (Nov. 14, 2022)
- Signing of a Large Contract with an Industry Leader for Kalray's DPU Processor (Nov. 14, 2022)
- Fraunhofer IPMS combines latest hardware in microsensor and actuator technology with artificial intelligence (Nov. 14, 2022)
- SiPearl and AMD collaborate to address exascale supercomputing in Europe (Nov 14, 2022)
- ShortLink AB and Dolphin Design partner to create a highly energy-efficient Sub-GHz ASIC design platform (Nov. 11, 2022)
- Bringing next-level 3D gaming to life with Arm Immortalis (Nov. 11, 2022)
- After 1Q23 Bottom, Expectations Increase for a 2Q23 IC Market Rebound (Nov. 11, 2022)
- Cryogenic CMOS design enabled by Semiwise (Nov. 11, 2022)
- Arm technology is defining the future of computing: Record royalties highlight increasing diversity of products and market segment growth (Nov. 11, 2022)
- Guerrilla RF Starts Sampling its Second Series of Digital Step Attenuators Based on Rapid Fire™ Technology (Nov. 11, 2022)
- Report says Apple, TSMC talk about moving 3nm chip production to U.S. (Nov. 11, 2022)
- Codasip to boost RISC-V security through Cerberus acquisition (Nov. 10, 2022)
- LC3plus certified for the Hi-Res Audio Wireless Logo (Nov. 10, 2022)
- Mythic strapped for cash (Nov. 10, 2022)
- SMIC Reports 2022 Third Quarter Results (Nov. 10, 2022)
- TSMC October 2022 Revenue Report (Nov. 10, 2022)
- Arteris Announces Financial Results for the Third Quarter 2022 and Estimated Fourth Quarter and Full Year 2022 Guidance (Nov. 10, 2022)
- Compact RISC-V Cores Bring the Power to Wearables, Consumer Devices (Nov. 10, 2022)
- UK, Canada, and Singapore join forces to secure IoT devices (Nov. 10, 2022)
- MEMS micro-mirrors improve Lidar sensing for vehicles (Nov. 10, 2022)
- Arteris Announces New Employment Inducement Grants (Nov. 09, 2022)
- DDR5/DDR4/LPDDR5 Combo PHY IP Cores which is Silicon Proven in 12FFC with Matching Controller IP Cores is available for license to accelerate your Memory Interfacing Speeds (Nov. 09, 2022)
- CEVA, Inc. Announces CEO Transition Plan (Nov. 09, 2022)
- Alphawave IP Receives 2022 TSMC OIP Partner of the Year Award for High-Speed SerDes IP Innovations (Nov. 09, 2022)
- CEVA, Inc. Announces Third Quarter 2022 Financial Results (Nov. 09, 2022)
- What's Driving the Latest Automotive Designs (Nov. 09, 2022)
- Arm integrates IoT development tools into GitHub, autoML platforms Qeexo, Nota.AI (Nov. 09, 2022)
- Silvaco Announces Appointment of Five Industry Veterans to Its Board of Directors (Nov. 08, 2022)
- Arasan announces MIPI DSI IP for FPGA supporting full C-PHY 2.0 speeds (Nov. 08, 2022)
- Weebit Nano receives from SkyWater Technology the first silicon wafers it manufactured with embedded Weebit ReRAM (Nov. 08, 2022)
- POLYN Technology, Edge Impulse Join Forces to Advance Tiny AI Products (Nov. 08, 2022)
- Christel Mauffet-Smith Joins Arteris as Executive Vice President of Global Sales (Nov. 08, 2022)
- Eliyan Closes $40M Series A Funding Round and Unveils Industry's Highest Performance Chiplet Interconnect Technologies (Nov 08, 2022)
- Chiplet Interconnect Technology Heads Toward Commercialization (Nov. 08, 2022)
- QuickLogic Taps MA Technology to Distribute eFPGA Technology in Taiwan (Nov. 08, 2022)
- UMC Reports Sales for October 2022 (Nov 07, 2022)
- eMemory Receives 2022 TSMC OIP Partner of the Year Award for Embedded Memory IP (Nov. 07, 2022)
- GUC Monthly Sales Report - October 2022 (Nov. 07, 2022)
- Market Dynamics, Technologies Drive Automotive Design (Nov. 07, 2022)
- MPEG LA Takes Measures to Assist VVC Adoption (Nov 07, 2022)
- Xiphera and Flex Logix Publish Joint White Paper on Solving the Quantum Threat with Post-Quantum Cryptography on eFPGA (Nov. 07, 2022)
- Global Silicon Wafer Shipments Projected to Set New Record in 2022, SEMI Reports (Nov. 07, 2022)
- Arm continues to accelerate IoT software development with new partnerships (Nov. 07, 2022)
- TSMC Grants a Sweep of EDA Certifications for New Process Nodes (Nov. 06, 2022)
- Arm Aims to Be at the Center of Increasingly Diverse Datacenter (Nov. 05, 2022)
- Creonic Participates in 6G Research Project Led by Deutsche Telekom (Nov. 04, 2022)
- NSITEXE develops "DR4100" General Purpose Accelerator for SoC (Nov. 04, 2022)
- Intel: Our Goal Is to Become Second Largest Foundry by 2030 (Nov. 04, 2022)
- SMIC: The Chinese company at the centre of US-China chip war (Nov. 04, 2022)
- AI needs automated testing, monitoring (Nov. 04, 2022)
- Silicon Creations Named 2022 TSMC OIP Partner of the Year for Analog and Mixed-Signal IP (Nov. 03, 2022)
- Secure-IC acquires Silex Insight's security business to accelerate its chip-to-cloud plan and develop the next-generation of embedded cybersecurity solutions (Nov. 03, 2022)
- SiMa.ai Welcomes Industry Leader Harald Kroeger to Scale its Business in the Automotive Market (Nov. 03, 2022)
- QuickLogic Partners with MA Technology to Distribute eFPGA Technology (Nov. 03, 2022)
- Sondrel appoints Thomas Flynn as VP Sales North America (Nov. 03, 2022)
- Tony Fadell Joins Arm Board of Directors (Nov. 03, 2022)
- Finding Talent to Run New Fabs Might Be Challenging (Nov 03, 2022)
- SiFive Awarded TSMC Open Innovation Platform Partner of the Year (Nov. 03, 2022)
- BrainChip Appoints Duy-Loan Le to its Board of Directors (Nov. 02, 2022)
- Rambus Reports Third Quarter 2022 Financial Results (Nov. 02, 2022)
- QuickLogic Announces Changes to its Board of Directors (Nov. 02, 2022)
- Arteris FlexNoC Interconnect Licensed by Microchip Technology for Microcontroller Development (Nov. 02, 2022)
- CEVA and ASR Micro Celebrate Milestone - 100 Million Wireless IoT Chips Shipped (Nov. 02, 2022)
- NextNav Announces Acquisition of Nestwave (Nov. 02, 2022)
- Surecore's Low Power Memory Delivers Improved Power Efficiency For BLE-Enabled Devices (Nov. 02, 2022)
- Codasip delivers custom RISC-V processing to SiliconArts ray-tracing GPUs (Nov. 02, 2022)
- Delay in Mass Production of New Intel Products a Boon for AMD, Proportion of AMD x86 Server CPUs Forecast to Exceed 22% in 2023, Says TrendForce (Nov 02, 2022)
- Siemens expands industry-leading integrated circuit verification portfolio with acquisition of Avery Design Systems (Nov. 02, 2022)
- Bitech Technologies Reports Completion of Its FPGA design and the Launch of Its ASIC Initiatives for Bitcoin Mining (Nov. 02, 2022)
- Andes Technology Unveils The AndesCore® AX60 Series, An Out-Of-Order Superscalar Multicore RISC-V Processor Family (Nov. 02, 2022)
- With its New RISC-V Processors, SiFive Bets on Compute Density (Nov. 02, 2022)
- Synopsys Expands Channel Partner Strategy into Australia and New Zealand (Nov. 02, 2022)
- Quadric's New Chimera GPNPU Processor IP Blends NPU and DSP into New Category of Hybrid SoC Processor (Nov. 01, 2022)
- SiFive's New High-Performance Processors Offer a Significant Upgrade for Wearable and Consumer Products (Nov. 01, 2022)
- NB IoT Temperature Tracking Sensors for Cold Chain (Nov. 01, 2022)
- Monthly Semiconductor Sales Decrease 0.5% Globally in September (Oct. 31, 2022)
- Floadia Announces MTP IP without extra Mask Available on 55nm (Oct. 31, 2022)
- EnSilica growth continues with new Bristol ASIC design office (Oct. 31, 2022)
- MIPI DSI and CSI Controllers IP Cores, for your High-Resolution Cameras, Display and Consumer Products, is available for immediate licensing (Oct. 31, 2022)
- Intel signs 7 out of top 10 fabless companies, sees 18A test chip (Oct 31, 2022)
- Rambus and Samsung Electronics Extend Comprehensive Agreement (Oct. 31, 2022)
- TSMC says no commitment made on 1nm foundry location (Oct. 31, 2022)
- Weebit qualifies ReRAM for production on 130nm process (Oct. 31, 2022)
- Nova Scotia Community College (NSCC) Joins CMC Microsystems (Oct. 31, 2022)
- Vidatronic Releases FlexSIMO™ DC-DC Converter Technology for Highly Efficient Power Delivery in IoT, AR/VR, and Metaverse SoCs (Oct. 28, 2022)
- Xiphera provides versatility and compact footprint with two new SHA-3 IP cores (Oct. 28, 2022)
- GUC GLink™ Chip Leverages proteanTecs' Die-to-Die Interconnect Monitoring (Oct. 27, 2022)
- Cadence's New Flow Automates Custom/Analog Design Migration on TSMC Advanced Technologies (Oct. 27, 2022)
- Synopsys Collaborates with TSMC to Unleash System Innovation with Most Comprehensive Multi-Die Design Solutions for TSMC's Advanced Technologies (Oct. 27, 2022)
- Cadence Integrity 3D-IC Platform Certified for TSMC 3DFabric Offerings (Oct. 27, 2022)
- Zynq® UltraScale+™ MPSoC FPGA: REFLEX CES adds a new FPGA version to its Zeus Zynq® UltraScale+™ MPSoC System-on-module (Oct. 27, 2022)
- Siemens partners with TSMC for 3nm product certifications and other technology milestones (Oct. 27, 2022)
- Report: TSMC stops work on Chinese AI chip amid sanctions confusion (Oct 27, 2022)
- TSMC Launches OIP 3DFabric Alliance to Shape the Future of Semiconductor and System Innovations (Oct. 27, 2022)
- Synopsys, Ansys and Keysight Accelerate 5G/6G SoC Designs with New mmWave Reference Flow for TSMC Process Technology (Oct. 27, 2022)
- Blueshift Memory Awarded Innovate UK Smart Grant to Develop AI Computer Vision Module (Oct. 27, 2022)
- Weebit Nano successfully qualifies its ReRAM module (Oct. 27, 2022)
- SiMa.ai Welcomes New Investor MSD Partners Bringing Total Investment to $187 Million - SiMa.ai extends oversubscribed series B1 funding to $67 Million (Oct. 27, 2022)
- Cadence Accelerates RF Design with Delivery of New TSMC N16 mmWave Reference Flow (Oct. 27, 2022)
- More than 50 members join SOAFEE to enable the software-defined vehicle of the future (Oct. 26, 2022)
- Cadence Digital and Custom/Analog Design Flows Achieve Certification for TSMC's Latest N4P and N3E Processes (Oct. 26, 2022)
- Worldwide Silicon Wafer Shipments Set a New Record in Q3 2022, SEMI Reports (Oct 26, 2022)
- IAR Systems' Functional Safety Certified Development Tools for RISC-V support latest SiFive Automotive Solutions (Oct. 26, 2022)
- GUC Unveils GLink 2.3LL, The World's Most Powerful D2D Interconnect IP Using 2.5D Technology (Oct. 26, 2022)
- Flex Logix EFLX4K eFPGA IP Core on TSMC 7nm Technology Now Available (Oct. 26, 2022)
- Siemens Tessent Multi Die Automates 2.5D and 3D Chip DFT (Oct. 26, 2022)
- Blueshift to demo high speed memory in RISC-V ASIC for computer vision (Oct. 26, 2022)
- Renesas warns on falling semiconductor markets (Oct. 26, 2022)
- Analog Bits to Demonstrate Pinless PLL and Sensor IP in TSMC N4 and N5 Processes at TSMC 2022 North America Open Innovation Platform® Ecosystem Forum (Oct. 25, 2022)
- SEGGER introduces streaming trace probe for SiFive RISC-V cores (Oct. 25, 2022)
- Faraday Reports Third Quarter 2022 Results (Oct. 25, 2022)
- Cadence Joins Intel Foundry Services USMAG Alliance to Accelerate Chip Design Development (Oct. 25, 2022)
- Cadence Reports Third Quarter 2022 Financial Results (Oct 25, 2022)
- Rambus Delivers PCIe 6.0 Interface Subsystem for High-Performance Data Center and AI SoCs (Oct. 25, 2022)
- Sondrel lists on London Stock Exchange's AIM market (Oct. 25, 2022)
- Flex Logix Opens Up Licensing to its InferX AI Technology (Oct. 25, 2022)
- Alphawave IP Achieves Its First Testchip Tapeout for TSMC N3E Process (Oct. 25, 2022)
- Avery Continues to Drive CXL Adoption with New Virtual Platform Features in Support of Version 3.0 (Oct. 25, 2022)
- SiFive and Synopsys Collaborate to Accelerate SoC Design (Oct. 25, 2022)
- Intel Foundry Services roadmap unveiled one deal at a time (Oct. 25, 2022)
- Samsung boosts AI in-memory processing with CXL (Oct. 25, 2022)
- Faraday Unveils Design Implementation Services for FinFET Technology Targeting all Foundries (Oct. 24, 2022)
- How the CHIPS Act Will Impact Engineers (Oct. 24, 2022)
- U.S. Chip Sanctions "Put Temporary Checkmate on China" (Oct. 24, 2022)
- RISC-V Celebrates Upstreaming of Android Open Source Project RISC-V Port (Oct. 24, 2022)
- Intel Foundry Services Forms Alliance to Enable National Security, Government Applications (Oct. 24, 2022)
- Socionext to present its Automotive Expertise at electronica 2022 (Oct. 24, 2022)
- Nextera Video and Adeas ST 2110 and NMOS FPGA Cores Receive Latest JT-NM Tested Badges (Oct. 24, 2022)
- Synopsys Advances Designs on TSMC N3E Process with Production-Proven EDA Flows and Broadest IP Portfolio for AI, Mobile and HPC Applications (Oct. 24, 2022)
- Samsung Electronics to Beef up Older Foundry Processes (Oct. 24, 2022)
- TSMC suspends production of powerful GPU chip for Chinese tech firm (Oct. 23, 2022)
- Everspin Signs Contract to Provide MRAM IP, Design and Manufacturing Services for Strategic Radiation Hardened FPGA Technology (Oct. 21, 2022)
- Agile Analog fast tracks IoT design with macros for analog functions (Oct. 21, 2022)
- WiLAN Subsidiaries Enter into License Agreement with Micron (Oct 21, 2022)
- Wi-Fi 6 and 5G provide today's optimal wireless IoT connectivity (Oct. 21, 2022)
- CoMira Solutions Expands Global Support (Oct. 20, 2022)
- Marvell Announces Industry's Most Comprehensive 3nm Data Infrastructure IP Portfolio (Oct. 20, 2022)
- USB-IF Announces Publication of New USB4® Specification to Enable USB 80Gbps Performance (Oct. 19, 2022)
- videantis and ADTechnology to build 5nm ADAS/AD SoCs (Oct. 19, 2022)
- NEUCHIPS Secures $20 Million in Series B2 Funding to Deliver AI Inference Platform for Deep Learning Recommendation (Oct. 19, 2022)
- SmartDV Achieves ISO 9001:2015 Certification (Oct. 19, 2022)
- Global 200mm Semiconductor Fab Capacity Projected to Surge 20% to Record High by 2025, SEMI Reports (Oct 19, 2022)
- Cadence Expands Collaboration with Samsung Foundry to Advance 3D-IC Design (Oct. 18, 2022)
- IAR Systems' Functional Safety Certified Development Tools for RISC-V support the latest SiFive Automotive Solutions (Oct. 18, 2022)
- VESA Releases DisplayPort 2.1 Specification (Oct. 18, 2022)
- Arasan Partners with Testmetrix on its 4.5 GSPS C-PHY / D-PHY HDK and Compliance Test Platform (Oct. 18, 2022)
- Intrinsic ID Presents Full Range of Chip Security Solutions at TSMC 2022 Open Innovation Platform® Ecosystem Forum (Oct. 18, 2022)
- Change drives innovation: New executive assignments at Arm will bring fresh perspectives, renewed focus and growth opportunities (Oct 18, 2022)
- TSMC heads below 1nm with 2D transistors at IEDM (Oct. 18, 2022)
- EnSilica looks to acquisitions, expands Bristol design centre (Oct. 18, 2022)
- ARM splits out its IoT business (Oct. 18, 2022)
- Alphawave IP: Q3 2022 Trading and Business Update (Oct. 17, 2022)
- Andes Announces the N25F-SE Processor, the World First RISC-V CPU IP with ISO 26262 Full Compliance (Oct. 17, 2022)
- MOSCHIP joins TSMC Design Center Alliance (Oct. 17, 2022)
- Introducing T2M's impressive collection of Silicon Proven, Automotive Grade Interface IP Cores (Oct. 17, 2022)
- First RISC-V laptop uses Alibaba TH1520 SoC (Oct. 17, 2022)
- TSMC Cuts Expansion Plan to $36B as Outlook Sours (Oct. 17, 2022)
- Electronic System Design Industry Hits Record Revenue of Nearly $3.8 Billion in Q2 2022, ESD Alliance Reports (Oct 17, 2022)
- eInfochips Partners with Taoglas to Offer RF Design Services to Add Wireless Connectivity to Products (Oct. 17, 2022)
- 'First' RISC-V CPU certified compliant with ISO 26262 (Oct. 17, 2022)
- TSMC Reduces Expansion Plan to $36B as Outlook Dims (Oct. 17, 2022)
- TSMC delays production of 3nm chips as Samsung Foundry takes process leadership (Oct. 16, 2022)
- Brite Semiconductor Provides MIPI IP Total Solution (Oct. 14, 2022)
- proteanTecs Edge™ Applications Now Available on the Advantest ACS Solution Store (Oct. 13, 2022)
- TCP/IP Hardware Stack IP Core now Available from CAST (Oct. 13, 2022)
- Alphawave IP Acquires Optical DSP Chip Developer Banias Labs, Advancing its Optical DSP Products for Data Centers (Oct. 13, 2022)
- BrainChip Fortifies Neuromorphic Patent Portfolio with New Awards and IP Acquisition (Oct. 13, 2022)
- Siliconarts signed a Ray-Tracing GPU IP 'Raycore' license agreement with Verisilicon. (Oct. 13, 2022)
- Weebit Nano advances its ReRAM selector development to fit embedded & discrete applications (Oct. 13, 2022)
- US restricts Sea Turtles in chip industry (Oct 13, 2022)
- POLYN Introduces Voice Processing Tiny AI Chip Delivering Industry-First Voice Extraction (Oct. 13, 2022)
- Foundries defy chip market downturn (Oct 13, 2022)
- Faraday Delivers SAFE™ IP Portfolio for Samsung Foundry 14LPP Process (Oct. 13, 2022)
- Quadric Appoints Former Cadence VP Dhanendra Jani as New VP of Engineering (Oct. 12, 2022)
- Achronix Appoints Mahesh Karanth as CFO (Oct. 12, 2022)
- Cadence and Google Cloud Collaborate to Advance the Electronic System and Semiconductor Design Ecosystem (Oct. 12, 2022)
- Global 300mm Semiconductor Fab Capacity Projected To Reach New High in 2025, SEMI Reports (Oct. 12, 2022)
- New Cadence Certus Delivers Up to 10X Faster Concurrent Full-Chip Optimization and Signoff (Oct. 12, 2022)
- US Government to Fund Expansion of IP Ecosystem for SkyWater's 90 nm Rad-Hard Platform (Oct 12, 2022)
- French secure element processor uses RISC-V (Oct. 12, 2022)
- Tiempo Secure becomes a Strategic Member of RISC-V International (Oct. 11, 2022)
- Andes Technology Announces Return of the Annual RISC-V CON on October 18th in the San Jose Airport DoubleTree Hotel (Oct. 11, 2022)
- SEMI ESD Alliance Adds Axiomise to Member Roster (Oct. 11, 2022)
- DCD-SEMI introduces multiprotocol combo: HDLC, UART, SPI... with bigger FIFO and... (Oct. 11, 2022)
- Intel plans 3nm chiplet for satellite terminal (Oct. 11, 2022)
- No Korean Company Included in World's Top 10 in Chip Packaging (Oct. 11, 2022)
- eFPGA expands the ecosystem footprint one deal at a time (Oct. 11, 2022)
- 8nm RFIC Flow Supports All Stages of RFIC Design Process (Oct. 11, 2022)
- Intel's Road to a Universal Quantum Computer Is Via Chiplets (Oct. 11, 2022)
- CEA & Schneider Electric Extend R&D Collaboration To Bring Secure and Resilient Digital Solutions To Energy Management and Industrial Automation (Oct. 11, 2022)
- Introducing PCIe 4.0 PHY IP Cores in 7nm for a reliable, Low area and High-Speed Interface Peripheral slot for all your High-End Devices (Oct. 10, 2022)
- TSMC September 2022 Revenue Report (Oct. 10, 2022)
- EnOcean accelerates its growth and breadth of energy-saving solutions through the acquisition of the assets of the edge computing solutions business from Renesas (Oct 10, 2022)
- Intel Horse Creek platform showcased with SiFive P550 RISC-V CPU, 8GB DDR5, PCIe Gen5 (Oct. 10, 2022)
- Sondrel announces its intention to list on London Stock Exchange's AIM market on 21 October 2022 (Oct. 07, 2022)
- Creonic Releases DVB-RCS2 Multi-carrier Satellite Receiver IP Core (Oct. 07, 2022)
- It's Time to Consider RISC-V (Oct. 07, 2022)
- Samsung unveils advanced-chipmaking roadmap, intensifying rivalry with TSMC (Oct. 06, 2022)
- GBT Filed a Non-Provisional Patent for Automatic Generation of Integrated Circuits Layout Blocks (Oct 06, 2022)
- Samsung Electronics Unveils Plans for 1.4nm Process Technology and Investment for Production Capacity at Samsung Foundry Forum 2022 (Oct. 06, 2022)
- GUC Monthly Sales Report - September 2022 (Oct. 06, 2022)
- No suggestion from Softbank about Samsung investing in Arm, say reports (Oct. 06, 2022)
- UMC Reports Sales for September 2022 (Oct 06, 2022)
- Arm chops staff (Oct 06, 2022)
- The Role of Semiconductors in the Renewable Energy Transition (Oct. 06, 2022)
- ARM details updated v9 architecture (Oct. 05, 2022)
- Credo Introduces Screaming Eagle 112G Retimer DSP with Industry Leading 1.6 Terabit Capacity (Oct. 05, 2022)
- Synopsys Unveils Breakthrough Golden Signoff ECO Solution, Delivering 10x Productivity Improvement (Oct. 05, 2022)
- Perforce Delivers Enhanced Support for Test Automation in Latest Helix ALM Release (Oct. 05, 2022)
- Cadence and Samsung Foundry Collaborate to Certify RFIC Design Reference Flow on 8nm Process Technology (Oct. 04, 2022)
- Samsung Foundry Certifies Cadence Voltus-XFi Custom Power Integrity Solution for 5LPE Process Technology (Oct. 04, 2022)
- EU chip plan would cost €500bn, says NXP CEO (Oct. 04, 2022)
- Global Semiconductor Sales Increase 0.1% Year-to-Year in August (Oct. 04, 2022)
- Siemens' Aprisa digital implementation solution certified for Samsung Foundry's advanced 4nm processes (Oct. 04, 2022)
- Synopsys Expands Code Sight Standard Edition with IntelliJ Support (Oct. 04, 2022)
- QuickLogic Partners with ChipMotion for eFPGA Implementations in SoC Designs (Oct. 04, 2022)
- Capgemini fuels collaboration with Panasonic Automotive Systems Company of America through transformative new data platform (Oct. 04, 2022)
- EuroHPC JU Selects 6 Sites Across the EU for Quantum Computers (Oct. 04, 2022)
- Nobel prize awarded for quantum entanglement (Oct. 04, 2022)
- SEGGER and Cadence team up to add native J-Link support for Cadence Tensilica cores (Oct. 04, 2022)
- Introducing superfast serial interfacing with JESD204B Tx - Rx PHY IP Cores in 12nm, 28nm and 40nm for all type of ADC/DAC and ASIC/FPGA connections (Oct. 03, 2022)
- Mobileye files for IPO, reveals data (Oct. 03, 2022)
- Siemens' Calibre platform now certified for Samsung's advanced 3nm process technology (Oct. 03, 2022)
- Synopsys and Samsung Foundry Enable 3nm Process Technology for Power- and Performance-Demanding Mobile, HPC and AI Designs (Oct. 03, 2022)
- Global Fab Equipment Spending Forecast to Reach All-Time High of Nearly $100 Billion in 2022, SEMI Reports (Oct. 03, 2022)
- SEMIFIVE Announces New 5nm HPC SoC Platform (Oct. 03, 2022)
- Synopsys Unified Platform Tackles Verification Requirements (Oct. 03, 2022)
- RF Module Eyes IoT Networking Using Satellite Comms (Oct. 02, 2022)
- Veridify Security Announces Commitment to Global Cybersecurity Success, Becomes a Cybersecurity Awareness Month 2022 Champion (Oct. 01, 2022)
- Vidatronic Unveils OmniPOWER™ Distributed Power Systems Available for Licensing in FinFET Technologies (Sept. 30, 2022)
- Wafer Makers Continue to Aggressively Expand Facilities (Sept. 30, 2022)
- Intel Tackles Next-gen Computing with Quantum and Neuromorphic Innovations (Sept. 30, 2022)
- Soitec Sees Big Opportunity in EVs with SmartSiC Wafers (Sept. 30, 2022)
- easics launches nearbAI™ IP cores for XR devices that will set the standard for extreme edge AI performance and immersive experiences (Sept. 29, 2022)
- Intel Foundry's "No. 1" Customer - U.S. DoD - Targets GAA (Sept. 29, 2022)
- Renesas Expands RZ/V Series with Built-in Vision AI Accelerator for Accurate Image Recognition and Multi-Camera Image Support (Sept. 29, 2022)
- AI "unicorn" Graphcore set to cut jobs (Sept. 29, 2022)
- SEGGER licenses C++ runtime library to SiFive for code size and performance efficiency (Sept. 29, 2022)
- Supply Chain Experts Weigh In on CHIPS Act (Sept. 29, 2022)
- Silicon Catalyst Announces POLYN Technology as Newest Company Admitted to Semiconductor Incubator (Sept. 29, 2022)
- S2C Releases Neuro™ - Advanced Prototype Resource Management Software (Sept. 29, 2022)
- Foundry data shows the cracks in the semiconductor market (Sept. 29, 2022)
- Valens Semiconductor Collaborates with Intel to Boost Automotive MIPI A-PHY Implementations (Sept. 28, 2022)
- Automotive IC Marketshare Seen Rising to 10% by 2026 (Sept. 28, 2022)
- Samsung, Intel, TSMC confirm alliance in next-gen "chiplet" technology (Sept. 28, 2022)
- Moving from SoCs to Chiplets Could Help Extend Moore's Law (Sept. 28, 2022)
- Peking University released the first open-source dataset for machine learning applications in fast chip design (Sept. 28, 2022)
- Intel Accelerates Developer Innovation with Open, Software-First Approach (Sept. 28, 2022)
- Auto and Industrial keep foundry revenue growing (Sept. 28, 2022)
- PUFsecurity's Crypto Coprocessor PUFcc is PSA Certified Level 2 Ready (Sept. 27, 2022)
- Chips&Media Expands to New Markets such as Autonomous Vehicles (Sept. 27, 2022)
- Renesas Launches Integrated Development Environment That Enables ECU-Level Automotive Software Development Without Hardware (Sept. 27, 2022)
- Arm announces new Board Members and new Chief Financial Officer (Sept. 27, 2022)
- Imagination and Baidu PaddlePaddle create open-source machine learning library for Model Zoo (Sept. 27, 2022)
- SiFive and ProvenRun Collaborate to deliver Best-in-Class Security for RISC-V Microprocessors (Sept. 27, 2022)
- U.S. Department of Defense Awards SkyWater up to $99M in Additional Funding to Advance Rad-Hard Technology to Productization and Qualification (Sept. 27, 2022)
- Synopsys Advances Silicon Lifecycle Management to Accelerate Data Transport and Significantly Reduce Test Time (Sept. 27, 2022)
- European plugfest for MIPI I3C spec (Sept. 27, 2022)
- Will Samsung join Arm's US listing process? (Sept. 27, 2022)
- QuiX Quantum wins €14 million contract with the German Aerospace Center to deliver a Universal Quantum Computer (Sept. 26, 2022)
- GOWIN Semiconductor New 22nm High-Performance FPGA family - Arora V (Sept. 26, 2022)
- CXL Spec Grows, Absorbs Others to Collate Ecosystem (Sept. 26, 2022)
- HDMI 2.0 Tx PHY and Controller IP Cores is available with Source Code license (Unlimited use with modification rights) (Sep 26, 2022)
- Siemens automates 2.5D and 3D IC design-for-test with new Tessent Multi die solution (Sept. 26, 2022)
- VinFast and Renesas Sign Strategic Partnership to Advance Automobile Technology (Sept. 26, 2022)
- CAES Wins Contracts for Development of Next-Generation, Octa-Core, user-selectable CPU for Space (Sept. 23, 2022)
- Functional Safety Certification Packages for Microchip FPGAs Speed Time to Market (Sept. 23, 2022)
- Bosch plans acquisition of Radio Frequency specialist ItoM (Sept. 23, 2022)
- ST, CAES team on octacore RISC-V space chip with selectable cores (Sept. 23, 2022)
- Inuitive launches NU4100, expanding its Edge-AI Vision-on-Chip IC portfolio (Sept. 22, 2022)
- Siemens collaborates with UMC to develop 3D integrated circuit hybrid-bonding workflow (Sept. 22, 2022)
- IPrium releases IEEE 802.11n/ac/ax LDPC Encoder and Decoder (Sept. 22, 2022)
- Vidatronic to Exhibit at Samsung Foundry Forum and SAFE™ Forum in San Jose in October (Sept. 22, 2022)
- Flex Logix Selects Semifore for Advanced Inference Chip Design (Sept. 22, 2022)
- Imec researchers at Ghent University and Nokia Bell Labs work to debut key building block for the deployment of 100G PON networks (Sept. 22, 2022)
- Split manufacturing for trustworthy electronics (Sept. 22, 2022)
- Arm Is The New RISC/Unix, RISC-V Is The New Arm (Sept. 22, 2022)
- DRAM Market Deflates, Cyclical Downturn Looms (Sep 21, 2022)
- QuickLogic Raises Approximately $3.2 Million with Strategic Investment by Institutional Investors (Sept. 21, 2022)
- Agile Analog launches new Digital Standard Cell Library (Sept. 21, 2022)
- Alphawave IP: Interim results for the six months ended 30 June 2022 (Sept. 21, 2022)
- CEO interview: Alphawave IP's Pialis on chiplets and custom silicon (Sept. 21, 2022)
- Codasip joins OpenHW Group to contribute to RISC-V verification (Sept. 21, 2022)
- CEVA Accelerates 5G Infrastructure Rollout with Industry's First Baseband Platform IP for 5G RAN ASICs (Sept. 21, 2022)
- Renesas Accelerates Deep Learning Development for ADAS and Automated Driving Applications (Sept. 21, 2022)
- IntelliProp First to Market with Memory Fabric Based on CXL; Driving Most Disruptive Technology to Hit Data Centers in Decades (Sep 21, 2022)
- Perforce Joins the Global Semiconductor Alliance and Debuts IP Maturity Model (Sept. 21, 2022)
- Achronix Acquires Key IP and Expertise from FPGA Networking Solutions Leader Accolade Technology (Sept. 20, 2022)
- Movellus Secures $23M in Series B Funding to Accelerate Growth (Sept. 20, 2022)
- Synopsys Unveils Industry's First Unified Emulation and Prototyping System Addressing Verification Requirements Across the Chip Development Cycle (Sept. 20, 2022)
- CAES' Quad-Core LEON4FT Processor Selected for European Next-Generation Star Sensors (Sept. 20, 2022)
- €16m project to secure the chiplet supply chain in Europe (Sept. 20, 2022)
- CEA RF Chip Enables Ultralow-Power IoT Connectivity For Remote Devices Via Astrocast's Nanosatellite Network (Sept. 20, 2022)
- Getting the right balance for ADAS architectures (Sept. 20, 2022)
- CEO interview: Alphawave IPs Pialis on chiplets and custom silicon (Sept. 20, 2022)
- VisionFive 2 will be made compatible with all mainstream Linux Operating Systems (Sept. 19, 2022)
- proteanTecs Joins UCIe™ (Universal Chiplet Interconnect Express™) Consortium to Advance 2.5D/3D Interconnect Monitoring (Sept. 19, 2022)
- Ultra-low power 5G Sub-6GHz RF Transceiver IP Cores at 22nm, available for immediate licensing for Cellular and Industrial IoT applications (Sept. 19, 2022)
- Samsung Widens Semiconductor Sales Gap with Intel in Q2 (Sept. 19, 2022)
- GlobalFoundries Joins the PHLX Semiconductor Sector Index (SOX) (Sept. 19, 2022)
- Expect to Find Some Thorns in 5G's Bed of Roses (Sept. 19, 2022)
- Arm execs: We respect RISC-V but it's not a rival in the datacenter (Sept. 17, 2022)
- NeuReality preps 7nm data centre AI chip (Sept. 16, 2022)
- CMOS Image Sensors Stall in "Perfect Storm" of 2022 (Sept. 16, 2022)
- QuantWare awarded subsidy from Quantum Delta NL for €1.1M project to develop the use of novel materials in superconducting quantum processors (Sept. 16, 2022)
- SkyWater to Provide Foundry Service for new NIST and Google Partnership to Create Supply of Chips for Researchers and Tech Startups (Sept. 16, 2022)
- QuantWare awarded subsidy from Quantum Delta NL for €1.1M project to develop the use of novel materials in superconducting quantum processors (Sep 16, 2022)
- Redefining the global computing infrastructure with next-generation Arm Neoverse platforms (Sept. 15, 2022)
- NIST and Google to Create New Supply of Chips for Researchers and Tech Startups (Sept. 15, 2022)
- Silicon Catalyst welcomes NXP Semiconductors as Newest Strategic Partner (Sept. 15, 2022)
- Ubilite Introduces a Wi-Fi Chip With Less-Than-Bluetooth Power Consumption (Sept. 15, 2022)
- Tachyum Enters QA Testing for Prodigy Universal Processor with New EDA Supplier (Sept. 15, 2022)
- Apple to use updated TSMC technology (Sept. 15, 2022)
- Shortage of Low-end Chips May Disrupt Global Chip Supply Chains (Sept. 15, 2022)
- VeriSilicon AI-ISP Delivers Innovative Image Quality Enhancement that Breaks the Limits of Computer Vision (Sept. 14, 2022)
- Chip industry in "hopeful denial" says Penn (Sept. 14, 2022)
- Funding round fuels videantis' growth (Sept. 14, 2022)
- Cadence Revolutionizes Verification Productivity with the Verisium AI-Driven Verification Platform (Sept. 14, 2022)
- New Cadence Joint Enterprise Data and AI Platform Dramatically Accelerates AI-Driven Chip Design Development (Sept. 14, 2022)
- VeriSilicon Announces the One-Stop VeriHealth Chip Design Platform for Smart Healthcare Applications (Sept. 14, 2022)
- Credo Targets Hyperscale Data Centers and 5G Networks with New Optical DSPs (Sept. 14, 2022)
- Flex Logix supports edge and embedded AI deployments with Mini-ITX system (Sept. 14, 2022)
- ARM shows Neoverse V2, plans V3 for 2023 (Sept. 14, 2022)
- Veriest supports the development of Mobileye's innovative automotive sensor products (Sep 14, 2022)
- Energy Autonomy Enables More Sustainable IoT Infrastructure (Sept. 14, 2022)
- CAST introduces the First CANsec IP Core for CAN XL Bus Security (Sept. 13, 2022)
- Avalanche Technology and UMC Announce 22nm Production of High-Density MRAM-Based Devices for Aerospace Applications (Sept. 13, 2022)
- Flex Logix Unveils First AI Integrated Mini-ITX System to Simplify Edge and Embedded AI Deployment (Sept. 13, 2022)
- SiFive Rolls Out Powerful New RISC-V Portfolio to Address Unmet Performance and Feature Needs of Rapidly Evolving Next-Gen Digital Automobiles (Sept. 13, 2022)
- Global IP Core Announces the Availability of The WiMAX IEEE802.16e Modem and FEC IP Core For Licensing and Integration (Sept. 13, 2022)
- TSMC says its next-gen 2nm mass production begins in 2025 (Sept. 13, 2022)
- Spreading the Quantum Knowledge (Sept. 13, 2022)
- SiFive rolls out automotive RISC-V roadmap (Sept. 13, 2022)
- How 5G Has Changed Engineering Design (Sept. 13, 2022)
- Synopsys To Seed Startup Innovation With AI-Powered Chip Design Tools In The Cloud (Sept. 13, 2022)
- 1G Ethernet PHY IP Cores solution for all your Gigabit network applications is available of immediate licensing!! (Sept. 12, 2022)
- Cortus Announces the Launch of its New Secure Low Power RISC-V Microcontrollers (Sept. 12, 2022)
- SoC.one and Imagination Technologies Partner to Enable Adoption of RISC-V for Automotive Design (Sept. 12, 2022)
- Hisense Selects Synaptics' DBM10L Processor For First AI-Enabled Always-On Voice Remote Control (Sept. 12, 2022)
- Expanded Partnership Between Arteris and Arm to Accelerate Automotive Electronics (Sept. 12, 2022)
- ARM, IBM team on low power analog AI chip (Sept. 12, 2022)
- Taiwan's TSMC 2nm chip fab ready for construction, to be operational by 2025 (Sept. 12, 2022)
- TSMC to mass produce chips on upgraded version of 3nm process in 2023 (Sept. 12, 2022)
- CEA & Partners Present 'Powerful Step Towards Industrialization' Of Linear Si Quantum Dot Arrays Using FDSOI Material at VLSI Symposium (Sept. 12, 2022)
- Flex Logix's Barrie Mullins To present at the 2022 AI Hardware Summit (Sept. 09, 2022)
- Brite Semiconductor Provides USB IP Total Solution (Sept. 09, 2022)
- intoPIX SDKs rev up performance to meet the rapidly increasing encoding and decoding demand of Software-based Production & Pro-AV (Sept. 09, 2022)
- Fraunhofer IIS and Astrodesign cooperate to offer JPEG XS solutions for video equipment manufacturer (Sept. 09, 2022)
- OPENEDGES Listing on KOSDAQ this September (Sept. 09, 2022)
- Andes Technology Corp. Announces Its RISC-V CPU IP Serves as the Computing Engine in the New Renesas R9A02G020 MCU ASSP (Sept. 09, 2022)
- TSMC becomes No.1 Chip Company (Sept. 08, 2022)
- Renesas Extends Leading RISC-V Embedded Processing Portfolio with New Motor Control ASSP Solution (Sept. 08, 2022)
- intoPIX unveils new FastTicoRAW & FastTicoXS codecs for Apple silicon and makes the switch to ARM-based technology simple (Sept. 08, 2022)
- Global Semiconductor Equipment Billings Increase 7% in Q2 2022, SEMI Reports (Sept. 08, 2022)
- TSMC August 2022 Revenue Report (Sept. 08, 2022)
- Samsung Sounds Alarm About '22 Chip Market Landing (Sept. 08, 2022)
- SiMa.ai Partners with GUC to Accelerate Time to Market for Industry's First Purpose-Built Machine Learning Platform for the Embedded Edge (Sept. 08, 2022)
- QuickLogic Awarded a $6.9 Million Base Contract to Develop Strategic Radiation Hardened FPGA Technology (Sept. 08, 2022)
- Chris Stevens, Industry Veteran Joins BrainChip to Lead WW Sales (Sept. 08, 2022)
- IPrium releases CCSDS 131.2 Turbo SCCC Modulator (Sept. 08, 2022)
- Memory Market Collapse to Lift TSMC to Top Spot in 3Q22 Ranking (Sep 08, 2022)
- Fraunhofer IIS announces its JPEG XS SDK 5.0 solutions achieving 25% higher speed for en- and decoding (Sept. 08, 2022)
- NASA Selects SiFive and Makes RISC-V the Go-to Ecosystem for Future Space Missions (Sept. 07, 2022)
- Global Semiconductor Sales Increase 7.3% Year-to-Year in July, but Growth Slows (Sept. 07, 2022)
- Morse Micro Raises $140M in Series B Funding to Accelerate IoT Connectivity and Revolutionize our Digital Future (Sept. 07, 2022)
- Global Top Ten IC Design House Revenue Spikes 32% in 2Q22, Ability to Destock Inventory to be Tested in 2H22, Says TrendForce (Sep 07, 2022)
- Sondrel complements its Architecting the Future IP platforms with pre-packaged supply chains for reduced risk (Sept. 06, 2022)
- DELTACAST announces low-bitrate SMPTE 2110-22 video streaming support in its IP Virtual Card with intoPIX JPEG XS Software (Sept. 06, 2022)
- SiMa.ai Develops the Industry's First Purpose-Built Machine Learning System-on-Chip with TSMC's Power Efficient Technology (Sept. 06, 2022)
- UMC Reports Sales for August 2022 (Sept. 06, 2022)
- Intrinsic ID Collaborates with Synopsys to Boost SoC Security and Accelerate Time to Market (Sept. 06, 2022)
- Alphawave Adopts Diakopto's PrimeX™ as Top-Level EM/IR Signoff Methodology for 5nm and 3nm Technologies (Sept. 06, 2022)
- Archer Materials partners with GlobalFoundries to advance 12CQ chip fabrication - Quantum Computing (Sept. 06, 2022)
- Making chip design easy (Sept. 06, 2022)
- GUC Monthly Sales Report - August 2022 (Sept. 05, 2022)
- Qualcomm hits back at ARM over lawsuit (Sept. 05, 2022)
- Sonical partners with Dolphin Design to build the future of hearables (Sept. 05, 2022)
- Elevate your High-speed data transmissions to the next level for all Display interfaces with the MIPI D-PHY/ LVDS Combo PHY IP Cores in 40nm (Sep 05, 2022)
- New U.S. Rule Could "Impair" China's AI Progress (Sept. 05, 2022)
- TSMC plans to mass produce 2nm chips in 2025 and adopts US EDA software: report (Sept. 05, 2022)
- From Presence Detection to Vital Sensing: How to Develop Your IoT Solution Quickly (Sept. 05, 2022)
- Why Automotive Cybersecurity Is Important (Sept. 03, 2022)
- Arasan achieves ISO 26262 ASIL B automotive safety certification for its Total eMMC IP Solution (Sept. 02, 2022)
- USB Promoter Group Announces USB4® Version 2.0 (Sept. 02, 2022)
- Imagination hires Michael Trzupek as new Chief Financial Officer (Sept. 02, 2022)
- Video IP integrated into MLSoC platform (Sept. 02, 2022)
- Alphawave IP Announces Completion of Acquisition of OpenFive (Sept. 01, 2022)
- Menta SAS is exhibiting at DVCon India 2022 and will offer a Technical Workshop (Sept. 01, 2022)
- Avant Technology Represents NSITEXE's RISC-V Processor IP Products in Taiwan and China (Sept. 01, 2022)
- Cadence Completes Acquisition of OpenEye Scientific (Sep 01, 2022)
- Intel Taps MIPS eVocore for Intel Pathfinder for RISC-V (Sept. 01, 2022)
- Synopsys Approves Stock Repurchase Program with Authorization Up to $1.5 Billion (Sept. 01, 2022)
- Allegro DVT Partners with SiMa.ai to Optimize Power Efficiency for Embedded Edge Applications (Aug. 31, 2022)
- Intel Pathfinder for RISC-V Delivers New Capabilities for Pre-Silicon Development (Aug. 31, 2022)
- Q2'22 saw a significant decline in GPU and PC shipments quarter to quarter (Aug. 31, 2022)
- Four Large Agreements Prop Up 2022 Semiconductor M&A Total (Aug. 31, 2022)
- Codasip joins Intel Pathfinder for RISC-V program (Aug. 31, 2022)
- Samsung Electronics to Produce Google's 3-nm Mobile Chips (Aug. 31, 2022)
- NSITEXE teams for RISC-V edge AI platform (Aug. 31, 2022)
- Renesas to Acquire Steradian to Expand Its Reach in the Radar Market (Aug. 31, 2022)
- CHIPS Act to Revitalize the U.S. Semiconductor Manufacturing Industry (Aug. 31, 2022)
- Rapid Silicon's Raptor Software Out-Performs All EDA Tools in the Industry (Aug 31, 2022)
- Arm Files Lawsuit Against Qualcomm and Nuvia for Breach of License Agreements and Trademark Infringement (Aug. 31, 2022)
- Intel puts more weight behind RISC-V with Pathfinder platform (Aug. 31, 2022)
- Renesas to acquire Steradian for ADAS radar expertise (Aug. 31, 2022)
- NSITEXE, OTSL, Kyoto Microcomputer, AXELL, Collaborate to develop RISC-V based Reliable Edge AI platform (Aug. 30, 2022)
- Imagination's PowerVR architecture marks its 30th anniversary (Aug. 30, 2022)
- SiMa.ai Ships First Industry Leading Purpose-built Machine Learning SoC Platform to Customers for Embedded Edge Applications (Aug. 30, 2022)
- Sequans Communications Closes Multi-Year Strategic 5G Partnership Agreement (Aug. 30, 2022)
- Arteris Collaborates with SiMa.ai to Optimize ML Implementation With Efficient Topology Interconnect IP for the Embedded Edge (Aug. 30, 2022)
- SiMa.ai Achieves First Silicon Success with Synopsys Solutions, Launching the Industry's Most Power-Efficient MLSoC Platform for the Embedded Edge (Aug. 30, 2022)
- Siemens introduces Questa Verification IP solution support for the new CXL 3.0 protocol (Aug. 30, 2022)
- Tachyum Signs Memorandum of Understanding with MatLogica (Aug 30, 2022)
- Imperas partners with Intel Pathfinder for RISC-V (Aug. 30, 2022)
- Andes Technology Corp. Announces Its Contribution To The Intel Pathfinder For RISC-V (Aug. 30, 2022)
- Crypto Quantique's quantum-driven silicon IP enables root-of-trust in the Intel Pathfinder for RISC-V environment (Aug. 30, 2022)
- China's top chipmaker SMIC just achieved an Intel-like breakthrough (Aug. 30, 2022)
- Quantum computing's threat to cybersecurity – winter is coming (Aug. 30, 2022)
- IoT security faces challenges but can be addressed (Aug. 30, 2022)
- StarFive Announced 2 High-Performance RISC-V Products: JH7110 SoC and VisionFive 2 SBC (Aug. 29, 2022)
- Enhance your Automotive Application with 14-bit wideband Time-Interleaved Pipeline Data converter's IP cores (Aug. 29, 2022)
- Credo Introduces 800Gbps and 400Gbps Optical Digital Signal Processors with Integrated Drivers (Aug. 29, 2022)
- Semico Research Concludes proteanTecs Deep Data Analytics Gives SoC Manufacturers a Six-Month Time-to-Market Advantage with Significant Savings (Aug. 29, 2022)
- Racyics wins new automotive customer for its GF 22FDX Adaptive-Body-Biasing solution (Aug. 29, 2022)
- Arm Chips Gaining in Data Centers, But Still in Single Digits (Aug. 29, 2022)
- DSP for 800G data centre networking (Aug. 29, 2022)
- There is TSMC and there's everybody else, can Samsung or Intel catch up? (Aug. 28, 2022)
- Software Solutions Aim to Accelerate AI, Quantum, and GPU Processing (Aug. 28, 2022)
- RISC-V Universe Grows with New GPUs, CPUs, and Development Kits (Aug. 28, 2022)
- Alphawave IP Acquisition of OpenFive Approved by All Regulators (Aug. 26, 2022)
- Amid Chip Shortages, Companies Bet on RISC-V (Aug. 25, 2022)
- China's RISC-V pioneer, Nuclei, raises funds for IoT, automotive push (Aug. 25, 2022)
- A closer look at TSMC's 3-nm node and FinFlex technology (Aug 25, 2022)
- Alibaba Cloud Unveils Chip Development Platform to Support Developers with RISC-V based High-performance SoCs (Aug. 25, 2022)
- Imagination's GPU and AI Accelerator Licensed for the latest AIoT RISC-V-based applications (Aug. 25, 2022)
- Synopsys Initiates $240 Million Accelerated Share Repurchase Agreement (Aug. 25, 2022)
- CEO Interview: Sammy Cheung: Filling the General-Purpose FPGA Void (Aug. 25, 2022)
- CXL™ Consortium and JEDEC® Sign MOU Agreement to Advance DRAM and Persistent Memory Technology (Aug. 25, 2022)
- Intel Introduces First-of-its-Kind Semiconductor Co-Investment Program (Aug. 24, 2022)
- UMC and Cadence Collaborate on Analog/Mixed-Signal Flow for 22ULP/ULL Process Technologies (Aug. 24, 2022)
- Verific's Rick Carlson Appointed Advisory Board Member for the College of Computing at Illinois Institute of Technology (Aug 24, 2022)
- Intel unveils semiconductor co-investment program (Aug. 24, 2022)
- Supercomputing center dataset aims to accelerate AI research into optimizing high-performance computing systems (Aug. 24, 2022)
- Semi Capex On Pace For 21% Growth to $185.5B This Year (Aug. 23, 2022)
- Imagination GPU selected by StarFive for next-generation VisionFive 2 single-board computer (Aug. 23, 2022)
- Composable Data Center Innovator, IntelliProp Names Tech Veteran John Spiers as CEO and President (Aug. 23, 2022)
- Intel's new 3D Foveros packaging tech: LEGO-like chiplets for CPUs (Aug. 23, 2022)
- Untether Unveils 2-PFLOPS AI Chip, Edge Roadmap (Aug. 23, 2022)
- Diakopto Unveils PrimeX™ - Revolutionary EDA Solution for Top-Hierarchy Power Grid and Signal Net EM/IR (Aug. 22, 2022)
- Pliops Secures $100M in Series D Funding as Data Center Professionals Continue to Rethink Storage Architectures (Aug. 22, 2022)
- Augment your Peripheral slot's performance with the Low Power and High Throughput PCIe 4.0 PHY IP Cores in 12FFC with matching PCIe 4.0 Controller IP Cores (Aug. 22, 2022)
- The Worldwide Semiconductor Market is expected to increase 13.9 percent in 2022, continuing to grow by 4.6 percent in 2023. (Aug. 22, 2022)
- A closer look at TSMC's 3-nm node and FinFlex technology (Aug. 22, 2022)
- Apple will be first to receive 3nm chips from TSMC, but not for the device you're thinking of (Aug. 21, 2022)
- Cadence and GlobalFoundries Collaborate on RF and mmWave Design Flow to Accelerate Mobile and 5G Innovation (Aug. 19, 2022)
- SiFive's RISC-V Leadership Strengthens with New Vector Solutions (Aug. 19, 2022)
- UK blocks Chinese purchase of EDA company Pulsic (Aug. 19, 2022)
- Samsung Electronics Breaks Ground on New Semiconductor R&D Complex in Giheung, Korea (Aug. 19, 2022)
- MediaTek Adds MPEG-H Audio to its Pentonic Series of Smart TV Chips and Boosts TV 3.0 Access for Brazilian TV Sets (Aug. 18, 2022)
- JEDEC Updates Universal Flash Storage (UFS) and Supporting Memory Interface Standard (Aug. 18, 2022)
- Thalia brings AMALIA IP reuse platform to Israel (Aug. 18, 2022)
- Synopsys Posts Financial Results for Third Quarter Fiscal Year 2022 (Aug. 18, 2022)
- RISC-V Processor IP Provider Nuclei Technology Secures New Funding (Aug. 18, 2022)
- Alphawave IP is officially 5.0 certified on the PCI-SIG Integrator's List (Aug 17, 2022)
- Efinix Low Power, Small Footprint FPGA Selected for SPRESENSE Development Platform (Aug 17, 2022)
- BrainChip Empowers Next Generation of Technology Innovators with Launch of the University AI Accelerator Program (Aug 17, 2022)
- QuickLogic Reports Fiscal 2022 Second Quarter Results (Aug 17, 2022)
- OPENEDGES Files Registration Statement for the Initial Public Offering (IPO) (Aug 17, 2022)
- Credo Launches Comprehensive Family of 112G PAM4 SerDes IP for TSMC N5 and N4 Process Technologies (Aug 17, 2022)
- Autotalks Enhances 5G C-V2X Chipsets with proteanTecs Deep Data Analytics (Aug 17, 2022)
- 48 core neuromorphic AI chip uses resistive memory (Aug. 17, 2022)
- MIPI D-PHY IP Cores along with MIPI DSI Controller IP Cores for both Tx & Rx is available for immediate licensing for high-performance, cost-optimized cameras and displays (Aug 16, 2022)
- Exclusive CEO Interview: Latest Funding Drives Ventana's First RISC-V Chiplets in Data Centers (Aug 16, 2022)
- Nordic Semiconductor announces its first Wi-Fi chip, the dual-band Wi-Fi 6 nRF7002 (Aug 16, 2022)
- Andes Technology and Green Hills Software Team Up to Deliver Advanced Automotive Safety Platform for RISC-V (Aug 16, 2022)
- Intel Elects Lip-Bu Tan to Its Board of Directors (Aug 15, 2022)
- Edgewater Wireless Expands Intellectual Property Monetization Initiatives (Aug 15, 2022)
- New US EDA Software Ban May Affect China's Advanced IC Design, Says TrendForce (Aug 15, 2022)
- 2022 RISC-V Taipei Day to be held in September to explore RISC-V driven developments in EV, smart vehicles (Aug. 15, 2022)
- Truechip Announces First Customer Shipment of CXL 3 Verification IP and CXL Switch Model (Aug. 12, 2022)
- Vidatronic Expands Portfolio of Power Management, Analog, and Security IP with Additional 180 nm to 22 nm Technologies for IoT Applications Available for Licensing (Aug. 12, 2022)
- Arasan refreshes its Total USB IP Solution with its next generation of USB 2.0 PHY IP (Aug. 11, 2022)
- Opinion: CHIPS Act Escalates Long-Standing U.S.-China Tech Rivalry (Aug. 11, 2022)
- SMIC Reports 2022 Second Quarter Results (Aug. 11, 2022)
- Tudor Brown resigns from SMIC (Aug 11, 2022)
- Neuromorphic Chip Gets $1 Million in Pre-Orders (Aug. 11, 2022)
- CEVA, Inc. Announces Second Quarter 2022 Financial Results (Aug. 10, 2022)
- Siemens selected by Microsoft for Rapid Assured Microelectronics Prototypes (RAMP) Program (Aug. 10, 2022)
- Arteris Announces Financial Results for the Second Quarter 2022 and Estimated Third Quarter and Full Year 2022 Guidance (Aug. 10, 2022)
- Logic Fruit appoints Vijay Pal Sharma as VP - Engineering (Aug. 09, 2022)
- CEVA Celebrates 15 Billionth CEVA-powered Chip Shipped (Aug. 09, 2022)
- GlobalFoundries CEO: Earnings benefited from balanced supply chain, diverse end markets (Aug. 09, 2022)
- Renesas looks to simplify industrial ethernet implementations (Aug. 09, 2022)
- Enhance your SD Card experience by integrating SD 4.1 UHS-II PHY IP Core to achieve Ultra High Speeds (Aug. 08, 2022)
- Arm achieves record revenue and shipments in Q1 FY 2022 (Aug. 08, 2022)
- Space Codesign Systems joins Siemens Digital Industries Software Solution Partner Program as a Software and Technology Partner (Aug. 08, 2022)
- GlobalFoundries and Qualcomm Announce Extension of Long-term Agreement to Secure U.S. Supply through 2028 (Aug. 08, 2022)
- SiFive Is Leading The Way For Innovation On RISC-V (Aug. 08, 2022)
- Cadence Accelerates Hyperscale SoC Design with Industry's First Verification IP and System VIP for CXL 3.0 (Aug. 05, 2022)
- GUC Monthly Sales Report - July 2022 (Aug. 05, 2022)
- Brite Semiconductor provides xSPI/Hyperbus™/Xcella™ controller and PHY total solution (Aug. 05, 2022)
- Brite Semiconductor provides xSPI/Hyperbus™/Xcella™ controller and PHY total solution (Aug 05, 2022)
- Nordic Semi sets up RISC-V design team (Aug. 05, 2022)
- Intel tGPU Setback Expected to Slow TSMC's 3 nm Ramp (Aug. 05, 2022)
- Cadence Library Characterization Solution Accelerates Delivery and Enhances Quality of Arm Memory Products (Aug. 04, 2022)
- Access Advance VVC Patent Pool Momentum Grows (Aug. 04, 2022)
- IPrium releases CCSDS TC Telecommand LDPC Encoder and Decoder (Aug. 04, 2022)
- Intel Orders Delayed, TSMC Slows Three-Nanometer Expansion, Says TrendForce (Aug. 04, 2022)
- UMC Reports Sales for July 2022 (Aug. 04, 2022)
- June Swoon - IC Sales Turn Negative as Economy Weighs on Market (Aug 04, 2022)
- Efinix® Extends Breakthrough Family of Titanium Products with Launch of the Titanium Ti180 FPGA (Aug. 04, 2022)
- Architect of CHIPS Act Speaks on Its Impact (Aug 04, 2022)
- Rambus Reports Second Quarter 2022 Financial Results (Aug. 04, 2022)
- Edge Impulse Releases Deployment Support for BrainChip Akida Neuromorphic IP (Aug 04, 2022)
- Neuromorphic Device with Low Power Consumption (Aug. 04, 2022)
- STMicroelectronics Supports the World Transitions to Digitalization and Decarbonization with its Pioneered FD-SOI Technology (Aug. 04, 2022)
- Accellera Announces Proposed Working Group to Explore Clock Domain Crossing Standard (Aug. 03, 2022)
- Alma Technologies Announces the Immediate Availability of an Ultra-High Throughput Image Scaler IP Core (Aug. 03, 2022)
- Imperas leads the RISC-V verification ecosystem as the first to release an open-source SystemVerilog RISC-V processor functional coverage library (Aug. 03, 2022)
- Global Semiconductor Sales Increase 13.3% in Q2 2022 Compared to Q2 2021 (Aug 03, 2022)
- CXL Consortium Releases Compute Express Link 3.0 Specification to Expand Fabric Capabilities and Management (Aug. 03, 2022)
- UCIe™ (Universal Chiplet Interconnect Express™) Consortium Announces Incorporation and New Board Members; Open for Membership (Aug. 03, 2022)
- UCIe™ (Universal Chiplet Interconnect Express™) Consortium Announces Incorporation and New Board Members; Open for Membership (Aug 03, 2022)
- PUFsecurity gains Riscure accreditation for its Anti-Tamper solution, PUFrt (Aug. 02, 2022)
- Avery Design Announces CXL 3.0 VIP (Aug. 02, 2022)
- CXL Consortium and OpenCAPI Consortium Sign Letter of Intent to Transfer OpenCAPI Specifications to CXL (Aug. 02, 2022)
- Rambus Appoints Desmond Lynch as Chief Financial Officer (Aug. 02, 2022)
- NSITEXE expands products lineup of RISC-V CPU supported functional safety (Aug. 02, 2022)
- OPENEDGES Passes the Eligibility Examination of the KOSDAQ listing (Aug. 02, 2022)
- Avery Announces 800G Ethernet VIP virtual network co-simulation platform, enabling SoC pre-silicon validation in real networked application environments (Aug. 02, 2022)
- Mobiveil and Avery Design Systems Extend Partnership to Accelerate Design and Verification of NVMe 2.0-Enabled SSD Development (Aug. 02, 2022)
- Soitec: Paul Boudre Hands Over CEO Role to Pierre Barnabé (Aug. 02, 2022)
- SD/eMMC Host and Device Controller IP Cores including matching PHYs with high performance, and high storage capacity available for license to secure your removable and embedded storage (Aug 01, 2022)
- U.S. Passes CHIPS Act, Increasing Restrictions on China Lead to Rising Geopolitical Risk, Says Trendforce (Aug. 01, 2022)
- Avery Design Systems Verification IP Helps Solid State Storage Controller Startup Validate its Designs and Get to Market Faster (Aug. 01, 2022)
- Open source chip programme expands to 90nm FDSOI (Aug. 01, 2022)
- Faraday Unveiled FPGA-Go-ASIC Prototyping Platform to Accelerate FPGA-to-ASIC Conversion (Jul. 28, 2022)
- Renesas Announces Consolidated Forecasts (Jul. 28, 2022)
- Arm announces appointment of Spencer Collins as Chief Legal Officer (Jul. 28, 2022)
- Worldwide Silicon Wafer Shipments Set New Record in Q2 2022, SEMI Reports (Jul. 28, 2022)
- Faraday Reports Second Quarter 2022 Results (Jul 28, 2022)
- NSITEXE product brand "Akaria", expand portfolio (Jul. 28, 2022)
- SkyWater Receives Funding from DOD, Partners with Google to Facilitate Open Source Design for its new 90 nm Technology Offering (Jul. 28, 2022)
- Xfuse, LLC Enters AI Vision Market with New Image Signal Processing (ISP) Technology (Jul. 27, 2022)
- MIPI UniPro v2.0 Doubles Peak Data Rate and Delivers Greater Throughput and Reduced Latency for Flash Memory Storage Applications (Jul. 27, 2022)
- Gartner Forecasts Worldwide Semiconductor Revenue Growth to Slow to 7% in 2022 (Jul 27, 2022)
- DCD-SEMI adds extra features to LIN IP Core and GuardKnox license the solution (Jul. 26, 2022)
- Samsung Foundry Achieves 2X Productivity on Large-Scale Analog and Mixed-Signal IP with the Spectre FX Simulator (Jul. 26, 2022)
- Intel to manufacture MediaTek Edge chips, instead of TSMC (Jul. 26, 2022)
- EnSilica turns to QLS to strengthen sales networks in North America (Jul. 26, 2022)
- CFX announces commercial availability of anti-fuse OTP technology on 55nm CIS process (Jul. 25, 2022)
- Creonic Offers High-throughput Single-chip DVB-S2X Satellite Modem for Zynq UltraScale+ RFSoC (Jul. 25, 2022)
- Silicon Labs Selects CoreHW Advanced Bluetooth AoA Switch for Dual Polarized Antenna Array Pro Kit (Jul. 25, 2022)
- CAES' Quad Core LEON4FT Processor Selected for Next-Generation On-orbit Servicing Spacecraft (Jul. 25, 2022)
- 5G Sub-6GHz RF Transceiver IP Cores, available for immediate licensing to the customers for Cellular and Industrial IoT applications (Jul. 25, 2022)
- CIX Technology joins Linaro's Windows on Arm Group (Jul 25, 2022)
- SMIC shipping 7nm ICs (Jul. 25, 2022)
- eMMC Holds Its Own Against UFS (Jul 25, 2022)
- Cadence Expands into Molecular Simulation with Acquisition of OpenEye Scientific, a Pioneering Leader in Computational Molecular Design (Jul. 25, 2022)
- Intel and MediaTek Form Foundry Partnership (Jul 25, 2022)
- History is made! Samsung beats out TSMC and starts shipping 3nm GAA chipsets (Jul. 25, 2022)
- Wi-Fi Alliance® claims Wi-Fi® delivers strong IoT advantage (Jul. 24, 2022)
- STMicroelectronics and GlobalFoundries agreed to build a steel factory in France for production of chips on 300-mm FDSOI substrates (Jul. 23, 2022)
- SkyWater Plans to Build Advanced $1.8B Semiconductor Manufacturing Facility in Partnership with the State of Indiana and Purdue University (Jul. 21, 2022)
- Alma Technologies Scales-up the Performance of the JPEG-LS Image Compression IP Core by Employing its Ultra High Throughput - UHT™ Architecture (Jul. 21, 2022)
- Arm, Cruise and the driverless road ahead (Jul. 21, 2022)
- Big Fish Semiconductor's U2 5.2 Audio SoC enters mass production with Dolphin Design's Audio IPs (Jul. 21, 2022)
- Americas' Chip Suppliers Continue to Dominate R&D Spending (Jul. 21, 2022)
- Arm IPO on hold (Jul. 21, 2022)
- iWave unveils the implementation of ARINC 818-2 IP Core in next-generation Combat Aircraft, designed by the Aeronautical Development Agency (ADA), Bangalore, India (Jul. 21, 2022)
- GlobalFoundries Statement Following Senate Procedural Vote on Legislation To Bolster U.S. Competitiveness (Jul. 20, 2022)
- Renesas Completes Acquisition of Reality AI (Jul. 20, 2022)
- Imagination and Khronos celebrate graphics innovation and open API standards with joint event (Jul. 20, 2022)
- QuantWare selected to deliver Quantum Processing Units for Israel's first functional quantum computer (Jul. 20, 2022)
- Alphawave IP: Q2 2022 Trading and Business Update (Jul. 20, 2022)
- Andes Technology RISC-V Processors Reveal Outstanding Performance and Efficiency in MLPerf Tiny (Jul. 20, 2022)
- Quantum Computing Industry Updates (Jul. 20, 2022)
- Flex Logix Partners With Intrinsic ID to Secure eFPGA Platform (Jul. 19, 2022)
- In-house software team provides Sondrel with a key advantage for its turnkey ASIC service of turning concept into silicon (Jul. 19, 2022)
- Rambus Expands Portfolio of DDR5 Memory Interface Chips for Data Centers and PCs (Jul. 19, 2022)
- Accelercomm Launches LEOphy for Low-Earth Orbit 5G Satellites (Jul. 19, 2022)
- Vidatronic Expands FinFET Portfolio with 7 nm to 4 nm FlexGUARD™ and Power Quencher® Intellectual Properties (IPs) Available for Licensing (Jul. 19, 2022)
- 10Gbps！The fastest LPDDR5/5X IP deliver production ! (Jul. 18, 2022)
- MIPI RFFE Master & Slave Controller IP Cores to control your complex RF-Front End Interfaces (Jul. 18, 2022)
- Agile Analog to move into iconic Radio House office block in Cambridge, UK to enable significant increase in engineering staff (Jul. 18, 2022)
- TSMC Trims Expansion Plans as Outlook Dims (Jul. 18, 2022)
- 10Gbps！The fastest LPDDR5/5X IP deliver production ! (Jul 18, 2022)
- Global Total Semiconductor Equipment Sales On Track to Record $118 Billion in 2022, SEMI Reports (Jul 18, 2022)
- Socionext Introduces ISO26262 Certified Smart Graphic Display Controllers (Jul 18, 2022)
- TSMC 28nm Chips Are Still Profitable After 10 Years (Jul. 18, 2022)
- From FinFETs to CFETs: imec's Plan for Continued Transistor Scaling (Jul. 16, 2022)
- Cadence Completes Acquisition of Future Facilities (Jul 15, 2022)
- Over 10 billion RISC-V cores are in use, but where are they? (Jul. 15, 2022)
- Alphawave IP Expands Canadian Presence with New Ottawa Office (Jul. 14, 2022)
- Are Micron and the Taiwanese Semi Suppliers the Canaries in the Coal Mine? (Jul 14, 2022)
- Arm Neoverse Adopted by Google Cloud (Jul. 14, 2022)
- Tower Semiconductor and Cadence Expand Collaboration to Accelerate Automotive IC Development (Jul. 14, 2022)
- TSMC Reports Second Quarter EPS of NT$9.14 (Jul. 14, 2022)
- Kudelski IoT empowers hardware security for semiconductor manufacturers with new Secure IP portfolio (Jul 13, 2022)
- Flex Logix working with Microsoft to build secure chips (Jul. 13, 2022)
- France Invests Over €5B in Semiconductors (Jul. 13, 2022)
- Siemens' Calibre platform expands early design verification solutions (Jul. 13, 2022)
- Soitec boosts customer yield of Silicon Carbide semiconductor manufacturing with KLA inspection technology (Jul. 13, 2022)
- Is It Finally Time for Silicon Photonics to Shine? (Jul. 13, 2022)
- US Department of Defense Awards SkyWater a $27M Option to Facilitate American-Made Semiconductors Critical to National Security and Domestic Supply Chains (Jul. 12, 2022)
- Truechip Introduces Automation Products - NoC Verification and NoC Performance - for Revolutionizing the Verification Spectrum (Jul. 12, 2022)
- Intrinsic ID Signs Representation Agreement for South Korea with Progate Technology to Further Extend Commercial Reach of its PUF-Based Security Solutions in the Asia Pacific Region (Jul. 12, 2022)
- Codasip expands design team to Greece (Jul. 12, 2022)
- RISC-V TEE "Penglai Enclave" officially entered StarFive chip platform (Jul 12, 2022)
- Dutch Startup on the Way to Make Quantum Photonic Processors Real (Jul. 12, 2022)
- Taiwan's TSMC still leads chipmaking sector despite achievements by Samsung (Jul. 12, 2022)
- US Government funding enables SkyWater to further develop IP for its 90 nm rad-hard FDSOI platform to be used in strategic defense and space applications (Jul. 12, 2022)
- Flex Logix Collaborating with Microsoft to Help Build Secure State-of-the-Art Chips for US Department of Defense (DoD) (Jul. 11, 2022)
- STMicroelectronics and GlobalFoundries to advance FD-SOI ecosystem with new 300mm manufacturing facility in France (Jul. 11, 2022)
- Creonic Introduces Microchip FPGAs as Supported Technologies (Jul. 11, 2022)
- Agile Analog announces IR Drop Sensor IP (Jul. 11, 2022)
- Experience DDR5/DDR4/LPDDR5 Combo PHY and matching Controller IP Cores seamless RAM interfacing speeds, with Silicon Proven 12FFC technology (Jul 11, 2022)
- Agile Analog announces RC Oscillator IP (Jul. 11, 2022)
- Breker Verification Systems and Codasip Announce Cooperation to Drive Open, Commercial-Grade RISC-V SoC Verification Processes (Jul. 11, 2022)
- Cadence to Acquire Future Facilities, A Pioneer in Data Center Digital Twins (Jul. 11, 2022)
- Siemens' state-of-the-art Symphony Pro platform expands mixed signal IC verification capabilities (Jul. 11, 2022)
- Inuitive Partners With Arteris IP for the Next Generation of Vision Processing for Edge Devices (Jul. 11, 2022)
- Synopsys Delivers Higher Productivity and Quality for Advanced-Node 5G/6G SoCs on Samsung Foundry's Low-Power Process (Jul. 11, 2022)
- Crypto Quantique announces first post-quantum computing IoT security platform compliant with new NIST standards (Jul. 11, 2022)
- Imperas announces the latest updates to RVVI and welcomes the adoption by many leading RISC-V processor developers (Jul. 11, 2022)
- Electronic System Design Industry Logs 12.1% Year-Over-Year Revenue Growth in Q1 2022, ESD Alliance Reports (Jul 11, 2022)
- Samsung Electronics Places Big Bet on 3-nm Foundry Technology (Jul. 11, 2022)
- proteanTecs Welcomes Anurag Mittal to Executive Team (Jul. 11, 2022)
- True Circuits Attends Design Automation Conference (Jul. 08, 2022)
- Fabless Suppliers Hold Record 34.8% Share of Global IC Sales (Jul 08, 2022)
- Nordic Semiconductor to acquire U.S. memory specialist Mobile Semiconductor (Jul. 08, 2022)
- Cadence Introduces the Voltus-XFi Custom Power Integrity Solution, Delivering over 3X Productivity Gains (Jul. 08, 2022)
- TSMC June 2022 Revenue Report (Jul. 08, 2022)
- GUC Demonstrate World's First HBM3 PHY, Controller, and CoWoS Platform at 7.2 Gbps (Jul 07, 2022)
- Order Cancellations Strike, 8-inch Fab Capacity Utilization Rate Declines Most in 2H22, Says TrendForce (Jul. 07, 2022)
- Brite Semiconductor Introduces Two Innovative Technologies For DDR PHY (Jul. 07, 2022)
- Innolink - The advanced Chiplet solution complies with the Universal Chiplet Interconnect Express (UCIe) standard (Jul. 07, 2022)
- QuiX Quantum lands €5.5 million for development of world's most powerful photonic quantum computer (Jul 07, 2022)
- Imperas Announces Partnership with Breker to Drive Rigorous Processor-to-System Level Verification for RISC-V (Jul. 07, 2022)
- First RISC-V-Based SoC FPGA Enters Mass Production (Jul. 07, 2022)
- RISC-V Opens the Door on 48-bit Computing (Jul. 07, 2022)
- Global Semiconductor Sales Increase 18.0% Year-to-Year, 1.8% Month-to-Month in May (Jul. 06, 2022)
- Outsourcing Supply Chain Management for chip manufacture can increase yields and quality (Jul. 06, 2022)
- UMC Reports Sales for June 2022 (Jul. 06, 2022)
- WiLAN Signs Second Wireless License in Automotive Industry (Jul. 06, 2022)
- Nestwave Announces that Renesas has Adopted its IoT Geolocation Technology for Forthcoming LTE-M/NB-IoT Module (Jul. 06, 2022)
- proteanTecs to Showcase Deep Data Analytics at DAC and SEMICON West 2022 (Jul. 06, 2022)
- Digital Core Design and Resquant are ready for quantum computing-resistant cryptography (Jul 06, 2022)
- Imperas announce the latest RISC-V test suites are now available free with riscvOVPsimPlus (Jul 06, 2022)
- GUC Monthly Sales Report - June 2022 (Jul. 05, 2022)
- Infineon to strengthen its leading expertise as IoT solution provider by acquiring verification expert NoBug in Romania and Serbia (Jul. 05, 2022)
- Multiport Memory With Analog Port Patent Issued (Jul. 05, 2022)
- Ludicrous Low Power (L2P) by SILICONGATE (Jul. 05, 2022)
- Faraday to Showcase FPGA-Go-ASIC Service at DAC in San Francisco (Jul. 05, 2022)
- Ultra-low power memory targets the metaverse (Jul. 05, 2022)
- Europe Needs 2-nm Manufacturing Process by 2030, says Soitec's CEO (Jul. 05, 2022)
- Automotive Cybersecurity: More Than In-Vehicle and Cloud (Jul. 05, 2022)
- Veriest Joins the Global Semiconductor Alliance (Jul. 04, 2022)
- Cadence Advances Radar, Lidar and Communications Processing for Automotive, Consumer and Industrial Markets (Jul. 04, 2022)
- Enhance your High-Density data processing capabilities to new heights with the USB 3.2/ PCIe 3.1/ SATA 3.2 Combo PHY IP Core interface in 28HPC+/HPC process technology (Jul. 04, 2022)
- SEGGER's product line fully supports Arm Cortex-M85 (Jul. 04, 2022)
- Optima Launches New IC Security Verification Solution (Jul. 04, 2022)
- Accenture Completes Acquisition of XtremeEDA to Expand Silicon Design Capabilities in Canada and US (Jul. 01, 2022)
- Sondrel appoints Gareth Jones as VP ASIC (Jul. 01, 2022)
- Samsung Leads Chip Industry with Nanochip Production (Jul. 01, 2022)
- The First RISC-V Laptop Announced With Quad-Core CPU, 16GB RAM, Linux Support (Jul. 01, 2022)
- Samsung Begins Chip Production Using 3nm Process Technology With GAA Architecture (Jun. 30, 2022)
- Truechip Adds USB 4 Hub Model & USB 4 Retimer Model to its Verification IP Portfolio (Jun. 30, 2022)
- SiFive expands global operations, opening UK R&D Centre in Cambridge (Jun. 30, 2022)
- New S2C Multi-FPGA Prototyping Software Eases the Pain (Jun. 30, 2022)
- Top Five MPU Suppliers Expand Share of Sales to 86% in 2021 (Jun 30, 2022)
- New Cadence Xcelium Apps Accelerate Simulation-Based Verification for Automotive, Mobile and Hyperscale Designs (Jun. 30, 2022)
- Intel Foundry Services Forms Alliance to Enable Design in the Cloud (Jun. 30, 2022)
- Xiphera's first financing round successfully completed (Jun. 30, 2022)
- ETSI and MIPI Alliance Announce Incorporation of MIPI I3C Basic into ETSI Smart Secure Platform (Jun. 30, 2022)
- Breker Verification Systems Joins RISC-V International as a Strategic Member to Drive Cache Coherency and SoC Integration Verification Methodologies (Jun. 30, 2022)
- Alphacore Joins Forces with Quantum Leap Solutions to Bring World-Class Design IP to the North American Commercial Market (Jun. 30, 2022)
- The Role of Hardware Root of Trust in Edge Devices (Jun 30, 2022)
- 2022 a Focus for 12-inch Capacity Expansion, 20% Annual Growth Expected in Mature Process Capacity, Says TrendForce (Jun 30, 2022)
- Multiport Memory With Analog Port Patent Issued (Jun. 30, 2022)
- Arm Total Compute Solutions redefine visual experiences and supercharge mobile gaming (Jun. 29, 2022)
- Synopsys and Arm Strengthen Partnership to Advance Next-Gen Mobile SoCs for Arm's Total Compute Solutions (Jun. 29, 2022)
- Vidatronic Announces Power Management IP Now Certified on Globalfoundries' 22FDX® Platform for IoT Applications (Jun. 29, 2022)
- Cadence Expands Collaboration with Arm to Accelerate Mobile Device Silicon Success (Jun. 29, 2022)
- Cadence and Intel Foundry Services Collaborate to Accelerate Innovation with Scalable and Proven Cadence Cloud Solutions (Jun. 29, 2022)
- EnSilica chassis control ASIC for premium automotive brand enters mass production (Jun. 29, 2022)
- Weebit Nano tapes out ReRAM demo chip to SkyWater foundry (Jun 29, 2022)
- Siemens launches Siemens Xcelerator - an open digital business platform to accelerate digital transformation (Jun. 29, 2022)
- ARM launches ray tracing GPU core for smartphone chips (Jun. 29, 2022)
- Siemens and NVIDIA to enable industrial metaverse (Jun. 29, 2022)
- GlobalFoundries marks milestone in new Singapore fab to open 2023 (Jun. 29, 2022)
- TSMC: N2 To Start With Just GAAFETs, Add Backside Power Delivery Later (Jun. 29, 2022)
- Accenture Announces Intent to Acquire XtremeEDA to Expand Silicon Design Capabilities in Canada and US (Jun. 28, 2022)
- Flex Logix Hires Barrie Mullins as Vice President of Product Management (Jun. 28, 2022)
- Vayyar Selects proteanTecs to Advance Vehicle Safety with Predictive Analytics (Jun. 28, 2022)
- UMC, eMemory, and PUFsecurity Announce Successful Silicon-Proven Secure Embedded Flash IP (Jun. 28, 2022)
- Enhanced Serial Peripheral Interface (eSPI) Master/Slave Controller (Jun. 28, 2022)
- SiFive Expands Global Operations, Opens UK R&D Center in Cambridge (Jun. 28, 2022)
- Synaptics Selects Allegro DVT's VVC Compliance Streams (Jun. 28, 2022)
- New startup MachineWare enables ultra-fast RISC-V simulation (Jun. 28, 2022)
- Meet Axiomise's Ashish Darbari at DAC to Learn about Benefits of Formal Verification (Jun 28, 2022)
- Intel boosts cloud EDA for its foundry business (Jun. 28, 2022)
- GbE (10/100/1000 Base-T) PHY IP licensed by 3 different customers in Q2 alone for Worldwide Use (Jun. 27, 2022)
- TSMC Japan 3DIC R＆D Center Completes Clean Room Construction in AIST Tsukuba Center (Jun. 27, 2022)
- IAR Systems enable Visual Studio Code extensions to meet developer demands (Jun. 27, 2022)
- Ansys and TSMC Collaborate to Deliver Multiphysics Design Methodology for Wireless Chips (Jun. 27, 2022)
- sureCore's ultra-low memory technologies enable designers to create the reality of the metaverse (Jun. 27, 2022)
- Flex Logix and CEVA Announce First Working Silicon of a DSP with Embedded FPGA to Allow a Flexible/Changeable ISA (Jun. 27, 2022)
- Ansys Multiphysics Solutions Achieve Certification for TSMC's N3E and N4P Process Technologies (Jun. 27, 2022)
- TSMC Japan 3DIC R&D Center Completes Clean Room Construction in AIST Tsukuba Center (Jun 27, 2022)
- Xiphera receives Business Finland's Young Innovative Company funding (Jun. 23, 2022)
- Brite Launches High-Precision 16 bit SAR ADC (Jun. 23, 2022)
- Tortuga Logic Rebrands as Cycuity as It Addresses Evolving Needs in Product Security (Jun. 23, 2022)
- GlobalFoundries Celebrates New Singapore Fab with Arrival of First Tool (Jun. 23, 2022)
- Weebit Nano to publicly demonstrate its ReRAM IP module for the first time (Jun 23, 2022)
- Pulsic Enhances Unity Chip Planning Technology with Incremental Floor-planning Capability to Speed IP block Placement, Planning (Jun 23, 2022)
- Synopsys Completes Acquisition of WhiteHat Security (Jun. 23, 2022)
- IPrium releases 4-channel ATSC 8VSB Modulator (Jun 23, 2022)
- CFX announces commercial availability of anti-fuse OTP technology on 90nm CIS process (Jun. 23, 2022)
- XtremeEDA to enable IoT security deployment with Crypto Quantique's solution using Codasip's RISC-V processor (Jun. 22, 2022)
- PCI-SIG Announces PCI Express 7.0 Specification to Reach 128 GT/s (Jun 22, 2022)
- M31 Technology has Developed and Validated the Ultra-Low Power 12nm PCIe 5.0 High-Speed Interface IP (Jun. 22, 2022)
- CEVA Extends its RivieraWaves UWB IP to Support CCC's Digital Key 3.0 Standard for Keyless Access to Vehicles (Jun. 22, 2022)
- Codasip adds Veridify secure boot to RISC-V processors (Jun. 22, 2022)
- MosChip Technologies Appoints Semiconductor Industry Veteran, DVR Murthy As "Vice President of Strategic Initiatives" to Implement and Execute Expanded Solution Offerings (Jun 22, 2022)
- Intento Design Secures Third Round of Investment to Accelerate Its Commercial Deployment (Jun 22, 2022)
- TSMC Creates Design Options for New 3nm Node (Jun. 22, 2022)
- RISC-V International emits more open CPU specs (Jun. 22, 2022)
- Foundry Output Value Up 8% in 1Q22 (Jun. 22, 2022)
- PCI-SIG® Announces PCI Express® 7.0 Specification to Reach 128 GT/s (Jun 22, 2022)
- OpenHW Group Announces RISC-V-based CORE-V MCU Development Kit for IoT Built with Open-Source Hardware & Software (Jun. 21, 2022)
- Imagination launches IMG RTXM-2200 - its first real-time embedded RISC-V CPU (Jun. 21, 2022)
- OPENEDGES to Demonstrate Latest NPU IP, ENLIGHT at CVPR 2022 (Jun. 21, 2022)
- RISC-V Announces First New Specifications of 2022, Adding to 16 Ratified in 2021 (Jun. 21, 2022)
- CV32E40P Core From OpenHW Group Sets the RISC-V Quality Standard For Open-Source Hardware IP (Jun. 21, 2022)
- Codasip L31 customizable RISC-V core is an Embedded World Best in Show (Jun. 21, 2022)
- Codasip Studio Mac extends potential to design for differentiation with RISC-V (Jun. 21, 2022)
- SiFive Enhances Popular X280 Processor IP to Meet Accelerated Demand for Vector Processing (Jun. 21, 2022)
- Avery Design Systems PCI Express VIP Enables eTopus SerDes IP and Next-Generation ASIC and Chiplet applications to Achieve Compliance and High-Speed Connectivity (Jun. 21, 2022)
- Expedera Expands Global Reach with New Regional Design Centers and Chinese Langauge Website (Jun. 21, 2022)
- Cadence Achieves PCIe 5.0 Specification Compliance for PHY and Controller IP in TSMC Advanced Technologies (Jun 21, 2022)
- Cadence Announces $100 Million Accelerated Share Repurchase Agreement (Jun 21, 2022)
- Dolphin Design wins an Embedded Award for Tiny Raptor, its Energy-Efficient Neural Network AI Accelerator (Jun. 21, 2022)
- Samsung Ventures invests in Israeli AI systems and semiconductor company NeuReality (Jun 20, 2022)
- Complete UFS 3.1 Controller solution (Analog / Digital IP Cores) licensed to China's leading Smartphone Company (Jun 20, 2022)
- World's First AV1 Decoder Silicon IP with support for 12-bit pixel size and 4:4:4 Chroma Sub-Sampling Released by Allegro DVT (Jun. 20, 2022)
- Huawei and Nordic cellular IoT licensing deal takes a big step towards industry-wide component-level licensing (Jun. 20, 2022)
- Fraunhofer IPMS develops CANsec Controller IP-Core CAN-SEC (Jun. 20, 2022)
- World's first end-to-end integration of ZKP with FPGAs. (Jun. 20, 2022)
- VisualSim Antenna System Designer enables simulation of Antenna and Communication Systems (Jun 20, 2022)
- Silicon Topology Joins TSMC Design Center Alliance (DCA) (Jun. 20, 2022)
- Synopsys Boosts 5G SoC Development Productivity with New RF Design Flow for TSMC N6RF Process (Jun. 17, 2022)
- Cadence RFIC Solutions Support TSMC N6RF Design Reference Flow (Jun. 17, 2022)
- TSMC FINFLEX™, N2 Process Innovations Debut at 2022 North American Technology Symposium (Jun. 17, 2022)
- Embedded World fair: Menta will unveil an unprecedented collaboration with Everspin Technologies (Jun 17, 2022)
- SmartDV Charts Course Toward Chiplets, Joins Universal Chiplet Interconnect Express (UCIe) (Jun. 16, 2022)
- CAST and Fraunhofer IPMS Mark 20-Year Partnership with Product of the Year Win (Jun. 16, 2022)
- Cadence Design IP portfolio in TSMC's N5 Process Gains Broad Adoption Among Leading Semiconductor and System Companies (Jun. 16, 2022)
- Renesas Develops Circuit Technologies for 22-nm Embedded STT-MRAM with Faster Read and Write Performance for MCUs in IoT Applications (Jun 16, 2022)
- Alchip Technologies Offers 3nm ASIC Design Services (Jun. 16, 2022)
- OpenFive Joins Universal Chiplet Interconnect Express (UCIe) Consortium (Jun. 16, 2022)
- QuickLogic and eTopus Announce Disaggregated, Flexible eFPGA Chiplet Template (Jun. 16, 2022)
- Avery Design Systems Announces Verification Support for New UCIe standard, Accelerating Adoption of Chiplet Interconnect Protocol (Jun. 16, 2022)
- Siemens extends support of multiple IC design solutions for TSMC's latest processes (Jun. 16, 2022)
- The Five Biggest MCU Suppliers Accounted for 82% of 2021 Sales (Jun. 15, 2022)
- Veriest expands Embedded Software team to provide full engineering services (Jun. 15, 2022)
- Think Silicon to Unveil Industry's First RISC-V 3D GPU at Embedded World 2022 (Jun. 15, 2022)
- Japan targeting 2025-7 for 2nm process (Jun. 15, 2022)
- Finwave targeting 5G with 3DGaN FinFET technology (Jun. 15, 2022)
- Renesas Launches Cellular-to-Cloud IoT Development Platforms Powered by RA and RX MCU Families (Jun. 15, 2022)
- ST looks at joint European wafer fab with GlobalFoundries (Jun. 15, 2022)
- intoPIX takes part in Major VSF Interoperability Demonstrations at VidTrans 2022 (Jun. 14, 2022)
- Codasip appoints Mike Eftimakis as VP of Strategy and Ecosystem (Jun. 14, 2022)
- Renesas Announces Investment in Popular Open-Source Company Arduino to Access Huge Developer Community (Jun. 14, 2022)
- Intrinsic ID Signs Representation Agreement with Kaviaz Technology to Extend the Commercial Reach of its Physical Unclonable Function (PUF) Security IP Solutions in Taiwan (Jun. 14, 2022)
- Real Intent Advances Meridian CDC with Multimode Coverage & Unprecedented 10X Efficiency (Jun. 14, 2022)
- Allegro DVT Acquires Labwise Ltd. to Extend its Compliance Stream Business Line and Enrich its Products & Service Portfolio (Jun. 14, 2022)
- Imagination GPU approved by HORIBA MIRA Certification Limited for functionally safe ADAS and HMI applications (Jun. 14, 2022)
- GaN Systems & TSMC Showcase Latest Power Electronics Advances at 2022 TSMC Technology Symposium (Jun. 14, 2022)
- TSMC May 2022 Revenue Report (Jun. 13, 2022)
- Analog Bits to Demonstrate Pinless PLL and Sensor IP's in TSMC N5 Process at TSMC 2022 North America Technology Symposium (Jun. 13, 2022)
- Alphawave IP Announces Availability of Two New Interconnect IP Products in TSMC Advanced Processes (Jun. 13, 2022)
- Wi-Fi 6 (AX)/BLE/15.4 22nm Combo RF IP Core, Licensed to a leading Chinese Semiconductor Company for IoT Chipset (Jun. 13, 2022)
- SkyWater Announces Availability of SRAM Memory Compiler for 90 nm Strategic Rad Hard by Process Offering (Jun. 13, 2022)
- Cadence Digital and Custom/Analog Design Flows Certified by TSMC for Latest N3E and N4P Processes (Jun. 13, 2022)
- Synopsys Drives Chip Innovation for Next-Generation Mobile and HPC Designs on TSMC N3E and N4P Processes (Jun. 13, 2022)
- IAR Systems accelerates innovation for solutions based on Arm Cortex-M85 processor (Jun. 13, 2022)
- Altair Expands Electronic System Design Technology with Acquisition of Concept Engineering (Jun. 13, 2022)
- Cadence Extends Cloud Leadership with Transformational Cadence OnCloud SaaS and e-Commerce Platform (Jun 13, 2022)
- Global Fab Equipment Spending Expected to Reach Record $109 Billion in 2022, SEMI Reports (Jun 13, 2022)
- BrainChip, Edge Impulse Team to Develop Low-Cost Embedded ML Systems (Jun. 13, 2022)
- CAES announces Space Grade Qualification of Quad Core LEON4FT Microprocessor (Jun. 10, 2022)
- Mark Potter and Christian Klingler Join proteanTecs Advisory Board (Jun. 10, 2022)
- Mosaid Acquires Major Semiconductor Process Portfolio (Jun. 10, 2022)
- Cadence Cerebrus AI-Based Solution Delivers Transformative Results on Next-Generation Customer Designs (Jun. 10, 2022)
- Mosaid Announces Semiconductor Process License Agreement (Jun. 10, 2022)
- SkyWater adds FDSOI SRAM IP (Jun. 10, 2022)
- First RISC-V-Based System-on-Chip (SoC) FPGA Enters Mass Production (Jun. 09, 2022)
- Fraunhofer IPMS RISC-V processor core supported by debugging tool from Lauterbach (Jun. 09, 2022)
- Renesas to Acquire Reality AI to Bring Advanced Signal Processing and Intelligence to the Endpoint (Jun. 09, 2022)
- CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection (Jun. 09, 2022)
- Soitec reports full year results of fiscal year 2022 (Jun. 09, 2022)
- TEMPO AI chip tapes out with videantis processor platform (Jun. 09, 2022)
- Texas Instruments Keeps A Firm Grip As World's Top Analog IC Supplier (Jun 09, 2022)
- Toshiba and Japan Semiconductor Develop Highly Reliable Versatile Analog Platform with Floadia's G1 technology for Automotive Applications (Jun. 09, 2022)
- BSC and Intel announce a joint laboratory for the development of future zettascale supercomputers (Jun 09, 2022)
- OIF Releases Common Electrical I/O 5.0 Implementation Agreement (Jun 09, 2022)
- World's Top Ten IC Design Company Revenue Reached US$39.43 billion in 1Q22, Marvell Growth Rate Tops List, Says TrendForce (Jun 09, 2022)
- Cadence Extends Cloud Leadership with Transformational Cadence OnCloud SaaS and e‑Commerce Platform (Jun 09, 2022)
- Cadence Revolutionizes System Design with Optimality Explorer for AI-Driven Optimization of Electronic Systems (Jun 09, 2022)
- 14-bit, 4.32Gsps Ultra high speed Wideband, Time-Interleaved Pipeline ADC IP Cores available for license to customers for wide range of applications (Jun. 08, 2022)
- Agile Analog signs first Chinese licensee for its analog IP (Jun. 08, 2022)
- The Automotive Industry is driving down acceptable chip defect levels (Jun. 08, 2022)
- Spectronite introduces a high-performance 5G wireless solution for mobile operators (Jun. 08, 2022)
- Intrinsic ID Announces Embedded SRAM PUF Security IP for Military-Grade IP protection in Intel FPGAs (Jun. 08, 2022)
- Arm introduces new image signal processor to advance vision systems for IoT and embedded markets (Jun. 08, 2022)
- Agile Analog signs first Chinese licensee for its analog IP (Jun 08, 2022)
- QuantWare awarded €7.5M from the European Innovation Council to rapidly scale superconducting quantum processors (Jun. 08, 2022)
- QuantWare awarded €7.5M from the European Innovation Council to rapidly scale superconducting quantum processors (Jun 08, 2022)
- CEVA Bluetooth® 5.3 Platform IP Supports New Auracast™ Broadcast Audio, Transforming the Shared Audio Experience (Jun. 08, 2022)
- CEVA Bluetooth® 5.3 Platform IP Supports New Auracast™ Broadcast Audio, Transforming the Shared Audio Experience (Jun 08, 2022)
- €140m 3D chip research centre opens in Dresden (Jun. 08, 2022)
- UMC Reports Sales for May 2022 (Jun. 07, 2022)
- TSMC Commits to Nanosheet Technology at 2 nm Node (Jun. 07, 2022)
- Global Semiconductor Sales Increase 21.1% Year-to-Year, 0.7% Month-to-Month in April (Jun. 07, 2022)
- Real Intent Extends Meridian RDC's Low Noise Reporting & Debug Technology Leadership (Jun. 07, 2022)
- Imagination expands with new UK office in Manchester (Jun. 07, 2022)
- IntoPIX teams up with Nextera and Adeas to participate in live IPMX interoperability demonstrations at InfoComm 2022 (Jun. 07, 2022)
- proteanTecs Raises $45M to Enable Deep Data Analytics for Electronics Monitoring (Jun. 07, 2022)
- Silicon qualified, Ultra-low power Analog Data-Convertors IP Cores (ADCs) available for license to the customers for wide range of IoT applications (Jun. 06, 2022)
- AP Memory launches brand-new product series of 512Mb Ultra-High-Speed (UHS) and 32Mb Ultra-Low-Swing (ULS) PSRAM (Jun. 06, 2022)
- GUC Monthly Sales Report - May 2022 (Jun. 06, 2022)
- GBT is Researching the Development of a Unified, Machine Learning-driven, Automated IC Design Environment (Jun. 06, 2022)
- Flex Logix Launches EasyVision - Turnkey AI/ML Solution with Ready-to-Use Models and AI Acceleration Hardware (Jun. 06, 2022)
- Cyient to Acquire Portugal-Based Celfinet to Strengthen its Wireless Communications Offerings (Jun. 06, 2022)
- Taiwan talks show EU urgency on chips (Jun. 06, 2022)
- aiMotive ships first aiWare4 NPU production RTL (Jun. 02, 2022)
- NEUCHIPS' Purpose-Built Accelerator Designed to Be Industry's Most Efficient Recommendation Inference Engine (Jun. 02, 2022)
- Intrinsic ID to Attend Multiple Industry Events in June Addressing Increasing Need for Device-Level Security (Jun. 02, 2022)
- Trusted Objects adds Crypto Quantique's QuarkLink Platform to its Software Root-of-Trust for End-to-End IoT Device Security (Jun. 02, 2022)
- Riviera-PRO Supports OpenCPI for Heterogeneous Embedded Computing of Mission-Critical Applications (Jun. 02, 2022)
- Global Semiconductor Equipment Billings Grow 5% Year-Over-Year in Q1 2022, SEMI Reports (Jun. 02, 2022)
- CEA-Leti & Intel Report Die-to-Wafer Self-Assembly Breakthrough Targeting High Alignment Accuracy and Throughput (Jun. 02, 2022)
- Credo Introduces Industry Leading 40Gbps PAM3 SerDes Technology To Address New Markets Requiring High-speed, Low-Power Connectivity (Jun. 02, 2022)
- Semiconductor Growth Still Seen at 11% Despite 2022 Headwinds (Jun. 02, 2022)
- CAES and Ashling announce Ashling's RiscFree C/C++ Toolchain for CAES' NOEL-V Processors (Jun. 02, 2022)
- Cadence Accelerates Industrial, Automotive, Hyperscale Data Center, and Mobile SoC Verification with Expanded VIP and System VIP Portfolio (Jun. 02, 2022)
- u-blox releases full-featured platform to test and validate IoT solutions (Jun. 02, 2022)
- Jose Cano Joins Alphawave IP as Global Head of Investor Relations (Jun. 01, 2022)
- VeriSilicon Image Signal Processor IP Achieved IEC 61508 Industrial Functional Safety Certification (Jun. 01, 2022)
- QuickLogic Awarded New $3.0 Million eFPGA Contract (Jun. 01, 2022)
- Synopsys Launches the Era of Smarter SoC Design with ML-Driven Big Data Analytics Technology (Jun. 01, 2022)
- Barry Paterson is the new Agile Analog CEO (May. 31, 2022)
- Imagination launches Open Access program, providing scale-ups with a low-cost path to differentiated silicon (May. 31, 2022)
- Faraday Launches Soteria! Security IP Subsystem for IoT ASIC (May. 31, 2022)
- PNG Image Decoder IP Core Available from CAST and IObundle (May. 31, 2022)
- imec Leads Semiconductor Value Chain in Joint Effort Toward Net-zero Emissions for Chip Manufacturing (May. 31, 2022)
- Renesas Unveils Industry's First I3C Intelligent Switch Family for Next Generation Server, Storage and Communications Systems (May. 31, 2022)
- Socionext starts to ship HD-PLC LSI compliant with IEEE 1901-2020 (May. 31, 2022)
- Heads of Samsung and Intel Discuss Korea-U.S. Semiconductor Alliance (May. 31, 2022)
- Samsung's huge investment plan seen unlikely to unseat TSMC (May. 31, 2022)
- GBT Filed a Continuation Patent Application for its Long-Range Radio System (May. 30, 2022)
- Hewlett Packard Enterprise and SiPearl Partner to Develop HPC Solutions with European Processors and Accelerate Europe's Adoption of Exascale Supercomputers (May. 30, 2022)
- SiPearl Collaborates with NVIDIA on Enabling Accelerated Computing Solutions with European Microprocessor (May. 30, 2022)
- Elevate your Video and Display applications with the Multi-Stream Transport of DisplayPort/eDisplayPort v1.4 Rx PHY IP Cores in 22nm, 28nm and 40nm with Matching Controllers (May. 30, 2022)
- ARM battles RISC-V at Renesas (May. 30, 2022)
- Will Broadcom milk VMware dry or become a full stack company? (May. 30, 2022)
- ADTechnology to launch its 5nm A53-based Platform, ADP500 based on Samsung Foundry (May 30, 2022)
- Capgemini opens new centers specialized in Cybersecurity and Cloud services in Malaga, Spain (May. 30, 2022)
- Broadcom to Acquire VMware for Approximately $61 Billion in Cash and Stock (May. 27, 2022)
- Semiconductor superpower: Will Samsung beat TSMC with the world's first 3nm chip? (May. 27, 2022)
- Ex-Intel Global Senior VP Jim Finnegan joins Corigine (May. 26, 2022)
- New Crypto Quantique device management service streamlines IoT security lifecycle with key integration of the Microchip Trust Platform Design Suite (May. 26, 2022)
- The Value of Small M&A Deals for Chipmakers (May 26, 2022)
- Samsung's 3nm technology: what do we know? (May. 26, 2022)
- LeapMind announces "Efficiera Anomaly Detection model" (May. 25, 2022)
- ADTechnology to launch its 5nm A53-based Platform, ADP500™ based on Samsung Foundry (May. 25, 2022)
- London Stock Exchange welcomes EnSilica plc to AIM (May. 25, 2022)
- Siemens streamlines, secures embedded RISC-V development with latest Nucleus ReadyStart solution (May. 25, 2022)
- Synopsys Appoints Two New Directors (May. 25, 2022)
- Spain Approves €12.25b Semiconductor Investment Plan (May. 25, 2022)
- Renesas Will Demonstrate the First Working Silicon Based on the Recently Debuted Arm Cortex-M85 Processor (May. 24, 2022)
- PUFsecurity's secure crypto coprocessor PUFcc wins COMPUTEX 2022 Best Choice Award (May. 24, 2022)
- X-FAB Adopts Cadence EMX Solver's Electromagnetic Simulation Technology to Support Innovative RF Designs Targeted at Communication and Automotive Markets (May. 24, 2022)
- Top Three Suppliers Held 94% of 2021 DRAM Marketshare (May 24, 2022)
- Rambus Completes Acquisition of Hardent (May. 24, 2022)
- NSITEXE Selects ImperasDV for Automotive Quality RISC-V Processor Functional Design Verification (May. 24, 2022)
- Samsung seeks foundry supremacy with 3nm chips (May. 24, 2022)
- Silex Insight & Intrinsic ID Join Forces (May. 24, 2022)
- Capgemini positioned as a Leader in the IDC MarketScape Worldwide Cloud Professional Services Vendor Assessment (May. 24, 2022)
- mioty® ̶ The all-around talent for industrial IoT applications handles 3.5 million messages per day (May. 24, 2022)
- Samsung commits to $356 billion of investment over 5 years (May. 24, 2022)
- EnSilica to list on London Stock Exchange's AIM market, expected to begin trading from 24th May (May. 23, 2022)
- Silicon Catalyst welcomes Flex Logix as an In-Kind Partner (May. 23, 2022)
- BrainChip Joins Arm AI Partner Program (May. 23, 2022)
- MediaTek Launches First mmWave Chipset for Seamless 5G Smartphone Connectivity (May. 23, 2022)
- Foundry's 31% Growth in 2021 Outpaced Overall Chip Industry (May. 23, 2022)
- Wireless RF Transceiver IP Cores for IoT applications, available for immediate licensing (May. 23, 2022)
- Synopsys and Analog Devices Collaborate to Accelerate Power System Design (May. 23, 2022)
- Foundry's 2021 Revenue Growth Overtakes Overall Chip Industry (May. 23, 2022)
- MediaTek Enters 5G mmWave Market (May. 23, 2022)
- Imec Presents Sub-1nm Process and Transistor Roadmap Until 2036: From Nanometers to the Angstrom Era (May. 21, 2022)
- GlobalFoundries Advances RF Leadership with GF Connex™ Portfolio and Customer Collaborations (May. 20, 2022)
- GlobalFoundries Unveils GF Labs to Accelerate Technology Innovation (May. 20, 2022)
- VeriSilicon's Chip Design Process Obtains ISO 26262 Automotive Functional Safety Management System Certification (May. 20, 2022)
- Arasan announces its 2'nd Generation of CAN IP (May. 20, 2022)
- Cortus joins the Alliance for Internet of Things Innovation (AIOTI) (May. 20, 2022)
- Fujikura collaborates with GlobalFoundries to accelerate large-scale commercialization of 5G mmWave Technologies (May. 20, 2022)
- Imagination Joins Baidu PaddlePaddle (May. 20, 2022)
- GlobalFoundries Advances RF Leadership with GF Connex? Portfolio and Customer Collaborations (May. 20, 2022)
- ReRAM Proves Resistant To Invasive Attacks (May 20, 2022)
- QOI Image Compression IP Cores available from CAST and Ocean Logic (May. 20, 2022)
- Imagination Joins Baidu PaddlePaddle (May. 20, 2022)
- GlobalFoundries Advances RF Leadership with GF Connex™ Portfolio and Customer Collaborations (May 20, 2022)
- Imagination Joins Baidu PaddlePaddle "Hardware Ecosystem Co-Creation Program" (May 20, 2022)
- TSMC expected to announce plans for its 1.4 nm production nodes next month (May. 20, 2022)
- How real is TSMC's bid for conversion to 1.4-nm process node? (May. 19, 2022)
- China-Based IC Production to Represent 21.2% of China IC Market in 2026 (May 19, 2022)
- SMIC Revenue Soars as Chinese Market Sours (May. 19, 2022)
- Xiphera's new IP cores complement the existing ECC portfolio (May. 19, 2022)
- Cadence Digital Full Flow Achieves Certification for GlobalFoundries 12LP/12LP+ Process Platforms (May. 19, 2022)
- Intrinsic ID Taps Former Arm Executive to Lead Business Development Efforts as Need for Embedded Security Soars (May. 19, 2022)
- oneNav Announces Competitive pureL5 Field Test Performance Using its Latest Customer Evaluation System (CES) (May. 19, 2022)
- GlobalFoundries and Motorola Solutions Announce Strategic Agreement for Chip Supply (May. 19, 2022)
- Synopsys Posts Financial Results for Second Quarter Fiscal Year 2022 (May. 19, 2022)
- The world's first RISC-V laptop could arrive sooner than you think (May. 19, 2022)
- RFicient chips for a sustainable Internet of Things: Fraunhofer IIS research team wins Joseph von Fraunhofer Prize 2022 (May. 19, 2022)
- TMC has released "TM7050 Visibility Improver" which improves the visibility of unclear video images (May. 19, 2022)
- Arasan Announces its latest MIPI RFFE(SM) IP compliant to MIPI RFFE(SM) v3.0 Version (May. 18, 2022)
- Imagination and Visidon partner for deep-learning-based super resolution technology IMG Series4 NNA enables advanced AI-based software to efficiently upscale images and videos (May. 18, 2022)
- proteanTecs Secures $45M Investment from Addition (May. 18, 2022)
- SEMI Cancels SEMICON China and FPD China, Schedules Special Edition for October 2022 (May. 18, 2022)
- Flex Logix Partners With Roboflow to Enable Specialized AI Models For Computer Vision Applications (May. 17, 2022)
- Andes Technology and Crypto Quantique in Global Partnership to Deliver the Ultimate RISC-V IoT Device Security (May. 17, 2022)
- Siemens collaborates with GlobalFoundries to provide trusted silicon photonics verification (May. 17, 2022)
- Quadric and MegaChips Form Partnership to Bring IP Products to ASIC and SoC Market (May. 17, 2022)
- The 'substantial contributions' Intel has promised to boost RISC-V adoption (May. 17, 2022)
- Vietnam's Viettel Partners with Qualcomm on 5G Infrastructure Development (May. 17, 2022)
- Sustainability in semiconductor operations: Toward net-zero production (May. 17, 2022)
- Introducing the largest portfolio of Verification IP Cores for all types of Testbench verifications of different protocols and interfaces for your advanced Design IPs which are now available for immediate licensing (May. 16, 2022)
- sureCore appoints Shanghai LoMicro Information Technology Co. Ltd to boost presence in Chinese market (May. 16, 2022)
- Samsung raising foundry prices (May. 16, 2022)
- Quadric Appoints Former Arm Vice President Steve Roddy as Chief Marketing Officer and Accelerates the Licensing of Its GPNPU Architecture (May. 16, 2022)
- Roviero joins Arm AI Partner Program to future-proof AI-based IoT solutions (May. 16, 2022)
- Xiphera joins BittWare Partner Program to enable fast security implementation (May. 16, 2022)
- Major milestones for Arm SystemReady in driving ecosystem standards (May 16, 2022)
- Algae-powered computing: scientists create reliable and renewable biological photovoltaic cell (May 16, 2022)
- First ARM SystemReady certification for the data centre (May. 16, 2022)
- Where's Europe in the exascale race? (May. 16, 2022)
- Mindtree And Finastra Partner To Deliver Managed Services Payments Solutions In The Nordics, The UK And Ireland (May. 16, 2022)
- OMNIVISION Announces Patent Litigation Victory Against ID Image Sensing LLC (May. 13, 2022)
- OPENEDGES To Exhibit its 4-/8-bit mixed-quantization NPU IP at Embedded Vision Summit 2022 (May. 12, 2022)
- ADTechnology Receives Samsung Foundry 2022 Best Engineering Award for Design Service Collaboration (May. 12, 2022)
- Arm delivers record revenues and record profits in FY21 (May. 12, 2022)
- 2023 IC market to fall 22%, says Penn (May 12, 2022)
- India Prepares to Build Nation's First Chip Fab (May 12, 2022)
- QuickLogic Partners with Intrinsic ID to Provide eFPGA Security Solutions (May. 12, 2022)
- Faraday Continues Expanding Its Ethernet Solutions for Networking Demands in ASIC (May. 12, 2022)
- Arteris Announces Financial Results for the First Quarter 2022 and Estimated Second Quarter and Full Year 2022 Guidance (May. 11, 2022)
- Alphawave Launches US Presence with New Silicon Valley Office (May. 11, 2022)
- Silicon Creations and Achronix Semiconductor Partner to Drive More Performance, Flexibility into High-Speed Trading (May. 11, 2022)
- Samsung Launches Industry's First 512GB CXL Memory Module (May. 11, 2022)
- Latest Attopsemi I-fuse OTP Memories Based on Ground-Breaking New Architecture Now Available on X-FAB's 180 nm Technology (May. 10, 2022)
- Exegy Acquires Enyx, Expands Global FPGA Leadership (May. 10, 2022)
- Creonic GmbH joins NewSpace Initiative (May. 10, 2022)
- Codasip appoints SH Lee to deliver RISC-V innovations to Korean OEMs (May. 10, 2022)
- CEVA, Inc. Announces First Quarter 2022 Financial Results (May. 10, 2022)
- MIPS Pivots to RISC-V with Best-In-Class Performance and Scalability (May. 10, 2022)
- Closing the Communication Chasms in the SoC design and manufacturing supply chain (May 10, 2022)
- proteanTecs Secures $45 Million Investment from Addition (May. 10, 2022)
- TSMC to move forward with the 1.4nm process next month to get a lead on its competitors (May. 10, 2022)
- TSMC Board of Directors Meeting Resolutions (May 10, 2022)
- Capgemini has been selected by Airbus to implement a large-scale cloud transformation program driving innovation and sustainability (May. 10, 2022)
- Silicon wafer manufacturer Okmetic invests nearly 400 million euros to build a new fab in Finland with aims to more than double the production capacity and business (May. 10, 2022)
- intoPIX to showcase its lightweight compression IP at Embedded Vision Summit 2022 on Lattice Booth (May. 09, 2022)
- USB 3.0 PHY IP Cores in 16FFC process technology with High-performance backplane interconnect licensed to a Chinese company for Multimedia SoC application (May. 09, 2022)
- intoPIX, Adeas, and Nextera to showcase Reference design on IPMX at ISE 2022 on Xilinx Booth (May. 09, 2022)
- Tower Semiconductor Expands its Leading-Edge Power Management Platforms Supporting Higher Power and Higher Voltage ICs (May 09, 2022)
- BrainChip & MosChip to Demonstrate Capabilities of Neural Processor IP & ASICs for Smart Edge Devices at IESA AI Summit (May. 09, 2022)
- OMNIVISION and Valens Semiconductor Partner to Offer Automotive OEMs a MIPI A-PHY-Compliant Camera Solution for Advanced Driver-Assistance Systems Applications (May 09, 2022)
- ARM returns to losing IP market share (May. 09, 2022)
- Is 2022 the year of the semiconductor fab industry makeover? (May. 09, 2022)
- Industry R&D Spending To Rise 9% After Hitting Record in 2021 (May. 06, 2022)
- UMC Reports Sales for April 2022 (May 06, 2022)
- Intel may be changing Meteor Lake CPUs to compete with Apple (May. 06, 2022)
- Rambus to Acquire Hardent, Accelerating Roadmap for Next-Generation Data Center Solutions (May. 05, 2022)
- Tachyum Integrates IP From World's Leading Vendors for Tape-Out In 2022 (May. 05, 2022)
- Using Agile Analog's process-agnostic Analog IPs can help solve current Semiconductor capacity challenges (May. 05, 2022)
- GUC Monthly Sales Report - Apr 2022 (May. 05, 2022)
- CMC Delivers Over 400 Semiconductor Prototypes in Past Year (May. 05, 2022)
- Steven Laub Joins Rambus Board of Directors (May. 05, 2022)
- intoPIX introduces the new TicoXS FIP for 4K & 8K AVoIP & WiFi-6 during ISE 2022 (May. 04, 2022)
- Apple sues processor startup for theft of trade secrets (May. 04, 2022)
- ARM China staff post open letter pledging loyalty to Allen Wu (May. 04, 2022)
- Safer "Listen Through" earbuds create headaches for developers due to increased processing demands (May. 04, 2022)
- Intento Design Appoints Stephane Cordova as New CEO (May. 04, 2022)
- CoreHW Announces mmWave GF 22FDX PLL IP (May. 04, 2022)
- European Processor Initiative will have ZeroPoint IP in their chip (May. 04, 2022)
- U.S. Department of Defense and GlobalFoundries Partner to Secure Supply of Chips Critical to National Security Systems (May. 03, 2022)
- Silex Insight's eSecure Root of Trust is now supporting ZAYA microcontainers for enhanced security (May. 03, 2022)
- Sondrel Deploys Arteris IP for Next-Generation Multi-Channel Automotive SoC (May. 03, 2022)
- Codasip adopts Siemens' OneSpin tools for formal verification (May. 03, 2022)
- E4 Computer Engineering joins RISC-V International (May. 03, 2022)
- "Onshoring" chip production is a red herring: the UK should double down on its competitive advantage in R&D and IP to create a secure semiconductor supply chain (May. 03, 2022)
- AMD Might Have to Wait Behind Intel and Apple for TSMC's 3nm Wafers (May. 03, 2022)
- Codasip hits out at RISC-V processor verification (May. 03, 2022)
- Renesas equips vehicle computer with optical broadband interface (May. 03, 2022)
- ARM China restructures ahead of IPO (May. 02, 2022)
- VLAB Works enables Embedded Applications with VLAB VDMs (May. 02, 2022)
- Alphawave IP: Full Year 2021 Results and Q1 2022 Trading Update (May. 02, 2022)
- Arm China majority shareholders announce the company's corporate governance issue has been resolved (May. 02, 2022)
- Weebit Nano moves closer to productisation (May 02, 2022)
- Faraday Reports First Quarter 2022 Results (May. 02, 2022)
- VESA Launches Industry's First Open Standard and Logo Program for PC Monitor and Laptop Display Variable Refresh Rate Performance for Gaming and Media Playback (May. 02, 2022)
- Tackling the challenges of RISC-V (May. 02, 2022)
- How eFPGA IP suppliers are all set to raise the SoC design game (May. 02, 2022)
- GbE (10/100/1000Base-T) PHY IP Cores with matching 1G Ethernet MAC, PCS and TSN MAC Controller IP Cores for all your high-speed Ethernet Networking applications is available for immediate licensing (May. 02, 2022)
- Global Semiconductor Sales Increase 23% in Q1 2022 Compared to Q1 2021 (May. 02, 2022)
- Rubio, Colleagues Urge CFIUS Review of Alphawave Acquisition of U.S. Semiconductor IP Company (May. 02, 2022)
- Worldwide Silicon Wafer Shipments Edge Higher to New Record in First Quarter 2022, SEMI Reports (May. 02, 2022)
- India set for fab (May 02, 2022)
- Samsung 3nm Process may be put into production before TSMC (May. 02, 2022)
- How eFPGA IP suppliers are all set to raise the SoC design game (May. 02, 2022)
- DoD Announces $117 Million Defense Production Act Title III Agreement With GlobalFoundries to Strengthen the Domestic Microelectronics Industrial Base (May. 02, 2022)
- The software-defined vehicle needs hardware that goes the distance (Apr. 29, 2022)
- Agile Analog to establish an engineering team in Scotland (Apr. 29, 2022)
- Chip tech company Alphawave says trading was strong in Q1 (Apr. 29, 2022)
- Arasan Announces its eMMC 5.1 Total IP Solution for 5nm SoC Designs (Apr. 28, 2022)
- Synopsys to Acquire WhiteHat Security from NTT (Apr. 28, 2022)
- Intel's foundry foray and its influence on the EDA, IP industries (Apr. 28, 2022)
- (R)evolution in I3C? (Apr. 28, 2022)
- Intel's foundry foray and its influence on the EDA, IP industries (Apr. 28, 2022)
- Global sectoral demand encourages Agile Analog to locate in Scotland (Apr. 27, 2022)
- Top 10 Companies Hold 57% of Global Semi Marketshare (Apr. 27, 2022)
- India launches Digital India RISC-V (DIR-V) program for next generation Microprocessors to achieve commercial silicon & Design wins by December'2023 (Apr. 27, 2022)
- Soitec reports FY'22 fourth quarter revenue (Apr. 27, 2022)
- Cadence Reports First Quarter 2022 Financial Results (Apr 26, 2022)
- Arm expands Total Solutions for IoT portfolio to continue delivering transformative innovation to ecosystem (Apr. 26, 2022)
- ZAYA and Andes Technology Offer Certifiable TEE Security for RISC-V Based Systems (Apr. 26, 2022)
- Mixel Silicon-Proven MIPI IP Integrated Into ams OSRAM Mira Image Sensor Family Products Enabling Rapid Development of New Systems (Apr 26, 2022)
- Renesas Debuts Automotive ECU Virtualization Solution Platform to Enable Secure Integration of Multiple Applications for Zone ECU (Apr. 26, 2022)
- Alibaba Cloud Announced Progress in Porting Android Functions onto RISC-V (Apr. 25, 2022)
- Indian startup Calligo leverages POSIT with RISC-V for high-performance computing (Apr. 25, 2022)
- Wafer Capacity Forecast to Climb 8.7% As 10 New Fabs Enter Production (Apr. 25, 2022)
- 16G Multiprotocol Serdes IP Core with different Interface protocols for your High-Speed interconnect requirements in 28HPC+ process technology is available for immediate licensing (Apr. 25, 2022)
- Imagination and Ambarella partner on autonomous vehicle human-machine interface visualisations with ASIL functional safety (Apr. 25, 2022)
- Localization of Chip Manufacturing Rising. Taiwan to Control 48% of Global Foundry Capacity in 2022, Says TrendForce (Apr. 25, 2022)
- Edgecortix Announces Sakura AI Co-processor Delivering Industry Leading Low-Latency and Energy-Efficiency (Apr. 25, 2022)
- Menta will attend ChipEx2022 to present Soft IP to the Israeli market for the first time (Apr. 25, 2022)
- MosChip Announces Appointment of Rajeev Krishnamoorthy to its Board of Directors (Apr. 25, 2022)
- Mindtree and Sapiens Announce Partnership to Digitally Transform the Insurance Industry (Apr. 25, 2022)
- TSMC Roadmap Update: N3E in 2024, N2 in 2026, Major Changes Incoming (Apr. 22, 2022)
- Mobile Semiconductor's 22FDX Register File Memory Compiler Receives Globalfoundries Platinum Status (Apr. 21, 2022)
- Dayang D³-Edit 5 integrates intoPIX JPEG XS technology for ultimate performances (Apr. 21, 2022)
- Dayang D3-Edit 5 integrates intoPIX JPEG XS technology for ultimate performances (Apr 21, 2022)
- BittWare Announces Partner Program to De-Risk Innovation and Reduce Time-to-Market for FPGA-Based Solutions (Apr. 21, 2022)
- Esperanto Technologies' Massively Parallel RISC-V AI Inferencing Solution Now in Initial Evaluations (Apr. 21, 2022)
- CoreHW Announces 5A DCDC IP Availability with Unique Advantages (Apr. 21, 2022)
- Xylon reveals new lossless MJPEG Encoder and Decoder IP Cores (Apr. 21, 2022)
- Codasip appoints Jaime Broome as its Automotive VP (Apr. 21, 2022)
- Fraunhofer IIS introduces its JPEG XS ultra-low-latency software implementation at NAB 2022 (Apr. 21, 2022)
- Semiconductor Industry: US and Taiwan Leading Semicon Process Technology (Apr. 21, 2022)
- BrainChip and NVISO partner on human behavioural analytics in AI devices (Apr. 21, 2022)
- BrainChip and NVISO Partner on Human Behavioral Analytics in Automotive and Edge AI Devices (Apr 20, 2022)
- Rapid Silicon Licenses AndesCore D45 with DSP/SIMD extensions and Andes Custom Extension Framework (Apr 20, 2022)
- Prevas acquiring BitSim NOW AB (Apr 20, 2022)
- RISC-V Startup Esperanto Technologies Samples First AI Silicon (Apr. 20, 2022)
- JESD204B Tx & Rx SerDes IP Core (12.5Gbps & 16Gbps) in 28HPC+ and 40LL process technologies for High-Speed Serial Interface with Matching Controller IP Core is available for immediate licensing (Apr. 19, 2022)
- OPENEDGES Prepares for Initial Public Offering (Apr. 19, 2022)
- Flex Logix Appoints Chris Passier as Vice President, Platform Software and Vancouver, Canada Site Executive (Apr. 19, 2022)
- Agnisys Announces ISO 26262 and IEC 61508 Qualification for Entire IDesignSpec Suite - SoC Specification Automation Flow (Apr. 19, 2022)
- Synopsys Introduces Industry's Highest Performance Neural Processor IP (Apr. 19, 2022)
- Hon Hai acquires arQana's Wireless Telecommunications Business (Apr 19, 2022)
- Intel: Our fabs can mass produce silicon qubit devices (Apr. 19, 2022)
- TSMC Dwarfs Samsung Electronics in Foundry Business (Apr. 19, 2022)
- Intel: Our fabs can mass produce silicon qubit devices (Apr. 19, 2022)
- Report: Russia to develop its own semiconductors (Apr. 19, 2022)
- MOSCHIP Announces High Speed Serial Trace Probe (HSSTP) PHY With Link Layer in 6nm (Apr. 18, 2022)
- TSMC's 2025 timeline for 2nm chips suggests Intel gaining steam (Apr. 18, 2022)
- Synopsys Study Highlights Challenges with Managing Open Source Risk in Software Supply Chains (Apr. 14, 2022)
- Renesas Introduces Industry's First PCIe Gen6 Clock Buffers and Multiplexers (Apr. 14, 2022)
- Total IC Unit Shipments Forecast to Climb 9% This Year (Apr. 14, 2022)
- Gartner Says Worldwide Semiconductor Revenue Grew 26% in 2021 (Apr. 14, 2022)
- SEGGER and Renesas deliver Device Lifecycle Management (DLM) for RA MCUs (Apr. 14, 2022)
- TSMC Reports First Quarter EPS of NT$7.82 (Apr 14, 2022)
- QuickLogic Adds GlobalFoundries 22FDX Process to its Growing List of Australis IP Generator-Based eFPGA IP (Apr. 14, 2022)
- Automotive Functional Safety with DCD's CAN ALL IP Core (Apr. 14, 2022)
- Mirabilis Design announces Meraki Tech-Sol as their official sales & marketing partner in India for the VisualSim product-line (Apr. 14, 2022)
- Siemens' new mPower Digital solution now certified for GlobalFoundries' platforms (Apr 14, 2022)
- How Investments in Manufacturing will Benefit the Semiconductor Ecosystem (Apr 14, 2022)
- 2021 Global Semiconductor Equipment Sales Surge 44% to Industry Record $102.6 Billion, SEMI Reports (Apr. 13, 2022)
- POLYN Technology Delivers NASP Test Chip for Tiny AI (Apr. 13, 2022)
- Virtual development environment for fast automotive application software development (Apr. 13, 2022)
- New Fujitsu cloud service is based Arm chips used in the world's fastest supercomputer (Apr. 13, 2022)
- Siemens' New mPower Digital Solution Now Certified for GlobalFoundries' Platforms (Apr. 13, 2022)
- Siemens New mPower Digital Solution Now Certified for GlobalFoundries Platforms (Apr. 13, 2022)
- Andes Enters RISC-V CPU IP Market in India with Partner Excelmax (Apr. 12, 2022)
- Orthogone Technologies joins forces with Desjardins Capital to support its international growth plan (Apr. 12, 2022)
- New Cadence High-Speed Ethernet Controller IP Family Enables Silicon-Proven Ethernet Subsystem Solutions up to 800Gbps (Apr. 12, 2022)
- Photonic quantum computer made in Germany (Apr. 12, 2022)
- Siemens' SynthAI Revolutionizes Machine Vision Training with Artificial Intelligence (Apr. 12, 2022)
- TSMC March 2022 Revenue Report (Apr. 11, 2022)
- Chiplets Get a Formal Standard with UCIe 1.0 (Apr. 11, 2022)
- Top Five Leaders Continue Expanding Share of Global IC Fab Capacity (Apr. 11, 2022)
- CFX announces commercial availability of anti-fuse OTP technology on 28HV process (Apr. 11, 2022)
- Cadence Spectre FX FastSPICE Simulator Is Adopted by SK Hynix to Accelerate DRAM Design (Apr. 11, 2022)
- MIPI CSI-2 Tx and Rx Controller IP Cores for Highly modular and configurable Camera Interfaces is available for immediate licensing (Apr. 11, 2022)
- Taipei Puts Case for Being Close to Core of Semiconductor Ecosystem (Apr. 11, 2022)
- 200mm Semiconductor Fab Capacity Set to Surge 21% to Mitigate Supply-Demand Imbalance, SEMI Reports (Apr. 11, 2022)
- Chiplets Get a Formal Standard with UCIe 1.0 (Apr. 11, 2022)
- China opens new research institute to develop RISC-V processor project (Apr. 11, 2022)
- Intel Says It'll Deliver 2025 Chip Tech a Half Year Early (Apr. 11, 2022)
- TSMC Q1 Revenue Record: 35.5% Increase Year-Over-Year (Apr. 10, 2022)
- Leading Semiconductor Players to Advance Next Generation FD-SOI Roadmap for Automotive, IoT and Mobile Applications (Apr. 08, 2022)
- UMC Reports Sales for March 2022 (Apr. 08, 2022)
- The Art of Predictability : How Axiomise is Making Formal Verification Mainstream (Apr 08, 2022)
- MACsec solution for 5G transport network security is available (Apr 08, 2022)
- Sondrel warns that packaging lead time have dramatically increased from 8 to more than 50 weeks (Apr. 07, 2022)
- Andes Releases AndeSight IDE v5.1 to Simplify Software Development for RISC-V Heterogeneous Multiprocessor and AI (Apr. 07, 2022)
- RISC-V startup recruits former Agile Analog CEO Ramsdale (Apr. 07, 2022)
- SK hynix Looking to Buy Arm (Apr. 07, 2022)
- Claudia Fan Munce Joins Arteris IP Board of Directors (Apr 07, 2022)
- Weebit Nano demo chips integrating its embedded ReRAM module successfully complete functional testing phase (Apr. 07, 2022)
- Synopsys and Juniper Networks Invest in New Company to Pursue Fast-Growing Silicon Photonics Market (Apr. 07, 2022)
- SmartDV Expands Executive Team With McKenzie Ross as Vice President of Marketing (Apr. 07, 2022)
- Intel, Micron, and Analog Devices Join MITRE Engenuity's Semiconductor Alliance to Define Principles for Joint Research and Collaboration for a More Resilient U.S. Semiconductor Industry (Apr. 07, 2022)
- Silicon Creations' Engineering Team Completes Training for Automotive Quality Certification (Apr. 06, 2022)
- Trilinear Technologies Announces the sixth generation of DisplayPort Link Controller Cores (Apr. 06, 2022)
- GUC Monthly Sales Report - March 2022 (Apr. 06, 2022)
- Global Semiconductor Sales Increase 32.4% Year-to-Year, 3.4% Month-to-Month in February (Apr. 06, 2022)
- Codasip appoints Japan EDA veteran (Apr. 06, 2022)
- Hirose and eTopus Technology Develop Combined PCIe Gen6 64Gbps PAM4 Interconnect Solution for AI Training Applications (Apr. 06, 2022)
- Sondrel warns that packaging lead times have jumped to more than 50 weeks (Apr. 06, 2022)
- What Drives Autonomous Vehicles? (Apr. 06, 2022)
- Eurosmart publishes PP-0117 Secure Sub-System SoC Protection Profile: Tiempo Secure IP products are ready (Apr. 05, 2022)
- MIPI UFS Controller, MIPI Unipro Controller and MIPI M-PHY IP Cores available in different Fabs and Nodes for all High-density Flash Storage applications in advanced SoCs (Apr. 05, 2022)
- New Arm-based cloud services from Microsoft highlight the power of choice in computing (Apr. 05, 2022)
- BrainChip and SiFive Partner to Deploy AI/ML Technology at the Edge (Apr. 05, 2022)
- Arteris IP FlexNoC Interconnect and Resilience Package Licensed in Neural Network Accelerator Chip Project Led by BMW Group (Apr. 05, 2022)
- Flex Logix Leads eFPGA Market with more than 17 Licensed Customers (Apr. 05, 2022)
- Chinese Companies Hold Only 4% of Global IC Marketshare (Apr 05, 2022)
- Can SiFive thrive? Chip designer needs a strong RISC-V ecosystem to succeed (Apr. 05, 2022)
- Automation for the automators of things (Apr. 05, 2022)
- VeriSilicon Joins the Universal Chiplet Interconnect Express Industry Consortium (Apr. 04, 2022)
- SMIC Announces 2021 Annual Results (Apr. 04, 2022)
- Hynix mulling a bid for Arm (Apr. 04, 2022)
- Electronic System Design Industry Logs 14.4% Year-Over-Year Revenue Growth in Q4 2021, ESD Alliance Reports (Apr. 04, 2022)
- Nvidia to Use TSMC's 4-nm Process to Produce H100 GPUs (Apr. 04, 2022)
- Samsung and Western Digital begin far-reaching collaboration (Apr. 04, 2022)
- Forget the metaverse – Labster raises $47m to build the 'eduverse' (Apr. 04, 2022)
- Why Did Intel x86 Beat RISC Processors in the 1990s? (Apr. 02, 2022)
- RISC-V takes steps to minimize fragmentation (Apr. 01, 2022)
- WiLAN and Kyocera Enter New Wireless License (Mar. 31, 2022)
- SiFive Appoints Nicole Singer as Chief Human Resources Officer to Drive SiFive Growth and Hiring (Mar. 31, 2022)
- intoPIX announces TicoRAW integration into the new Novitec industrial camera portfolio (Mar. 31, 2022)
- ARIES Embedded Presents New MCXL Reference IP Design (Mar. 31, 2022)
- SEGGER Embedded Studio for Arm now with hard real-time C++ support (Mar. 31, 2022)
- Faraday Launches Cortex-A53-based Platform to Accelerate FinFET SoC Development (Mar. 31, 2022)
- M31 Speeds Delivery of Silicon IP by 5X Using the Cadence Library Characterization Solution in the Cloud (Mar. 31, 2022)
- Arm transfers most of its Arm China shareholding to Softbank (Mar 31, 2022)
- Chip demand is slowing says TSMC chairman (Mar 31, 2022)
- Samsung Foundry Adopts Leading Voltage-Timing Signoff Solution from Synopsys and Ansys for Advanced-Node, Energy-Efficient Chips (Mar. 31, 2022)
- Microcontrollers Get a Lift from Automotive After 2021 Rebound (Mar. 30, 2022)
- IAR Systems enables powerful AI/ML applications based on Alif Semiconductor's microcontrollers and fusion processors (Mar. 30, 2022)
- QuickLogic Announces a New $1.5 Million eFPGA Contract (Mar. 30, 2022)
- Flex Logix Announces Production Availability of InferX X1M Boards for Edge AI Vision Systems (Mar. 30, 2022)
- CAST Receives ISO 9001:2015 Certification (Mar. 30, 2022)
- Alma Technologies Launches Scalable Encoder and Decoder Semiconductor IP for VESA DSC 1.2b Visually Lossless Compression (Mar. 30, 2022)
- Synopsys Launches Industry's First Broad-Scale Cloud SaaS Solution to Transform Chip Development Landscape (Mar. 30, 2022)
- Alena Shiltova becomes Marketing Communications Manager at Menta (Mar 30, 2022)
- AMD may be looking towards RISC-V in future CPUs (Mar. 30, 2022)
- Arm plans transfer of shares in China JV to speed up U.S. IPO - FT (Mar. 30, 2022)
- Samsung, TSMC Appeal For The $52 Billion US Chip Program (Mar. 30, 2022)
- TSMC says demand for smartphones, PCs starting to slow (Mar. 30, 2022)
- Advancing VHDL's Verification Capabilities with VHDL-2019 Protected Types (Mar. 29, 2022)
- Wacom, STMicroelectronics, and CEVA Collaborate to Enhance the Digital Pen Experience (Mar. 29, 2022)
- Movellus to Provide Intelligent Clock Network IP to BAE Systems (Mar. 29, 2022)
- ARM-based Server Penetration Rate to Reach 22% by 2025 with Cloud Data Centers Leading the Way, Says TrendForce (Mar. 29, 2022)
- Edgewater Wireless selects CMC Microsystems as fabrication services Partner (Mar. 29, 2022)
- ElectraIC is now a Partner of Xilinx (Mar 29, 2022)
- eTopus Announces PCIe IP Gen 1-6 and 800G Support For 7/6nm With Support For SoC & Chiplet Clients (Mar. 29, 2022)
- Ashling to supply toolchain for MIPS RISC-V cores (Mar. 29, 2022)
- Arm to command 22 percent of servers in 2025 (Mar. 29, 2022)
- Samsung retains top spot in Q4 2021 (Mar. 29, 2022)
- Samsung retains top spot in Omdia Q4 2021 semiconductor market analysis (Mar. 28, 2022)
- MIPS Chooses Ashling's RiscFree Toolchain for its RISC-V ISA Compatible IP Cores (Mar. 28, 2022)
- AI Chip Company Syntiant Raises $55 Million to Accelerate Growth (Mar. 28, 2022)
- Introducing DDR5/DDR4/LPDDR5 Combo PHY IP Core, Silicon Proven in 12FFC for Next-Gen High performance SoCs is available for immediate licensing (Mar. 28, 2022)
- Samsung Sued for Infringement of HEVC Essential Patents (Mar. 28, 2022)
- Gidel FPGA boards used for next generation wireless communication research (Mar. 28, 2022)
- RISC-V is coming to the internet of things (Mar. 28, 2022)
- TSMC to Boost 4nm & 5nm Output by 25%: Ada Lovelace, Hopper, RDNA 3, Zen 4 (Mar. 24, 2022)
- In-Memory Computing, AI Draws Research Interest (Mar. 24, 2022)
- O-RAN Fronthaul Transport Subsystem is now available (Mar. 24, 2022)
- Imagination launches next-gen mobile gaming at GDC 2022 (Mar. 24, 2022)
- CEA and Startup C12 Join Forces to Develop Next-Generation Quantum Computers with Multi-Qubit Chips at Wafer Scale (Mar. 24, 2022)
- Cadence Selected by Microsoft for RAMP Phase II Program (Mar. 24, 2022)
- The Semiwise's Flat Field Transistor enables the continuation of DRAM scaling (Mar 24, 2022)
- Amid Rising Volume and Pricing, Top 10 IC Design Companies Post 2021 Revenue Topping US$100 Billion (Mar. 24, 2022)
- Analog Market Momentum to Continue Throughout 2022 (Mar 24, 2022)
- Cadence Collaborates with GlobalFoundries to Deliver Complete Digital Solution on Amazon Web Services (Mar. 24, 2022)
- SmartDV More Than Doubles Sales From 2020 to 2021 (Mar. 23, 2022)
- Intrinsic ID PUF Technology Now Fully Compatible with OpenTitan Root of Trust to Strengthen Device Level Security (Mar. 23, 2022)
- Silex Insight introduces Network Security Crypto Accelerator (Mar. 23, 2022)
- Analog IP offerings a hot commodity in semiconductor M&A (Mar 23, 2022)
- Nvidia could use Intel foundry services, CEO Jensen Huang reveals (Mar. 23, 2022)
- €3mn grant to develop insect inspired memory devices (Mar. 23, 2022)
- Top 6 IoT Trends in 2022 (Mar. 23, 2022)
- Avalanche Technology and Efabless Partner for System-On-Chip Development using Google's Open-Source Program (Mar. 22, 2022)
- Andes and IAR Systems Enable Leading Automotive-Focused IC Design Companies to Accelerate Time to Market (Mar. 22, 2022)
- IObundle and CAST Partner on Audio and Graphics IP Cores (Mar. 22, 2022)
- Michal Siwinski Joins Arteris IP as Chief Marketing Officer (Mar. 22, 2022)
- SEMIFIVE Acquires Analog Bits (Mar. 22, 2022)
- Imec.xpand secures additional funding (Mar. 22, 2022)
- MICLEDI Microdisplays Announces Agreement with GlobalFoundries to Collaborate on MicroLED Displays for AR Glasses (Mar. 22, 2022)
- Menta Announces Joint Partnership with Trusted Semiconductor Solutions (Mar. 21, 2022)
- Global Semiconductor Materials Market Revenue Tops $64 Billion in 2021 to Set New Record, SEMI Reports (Mar 21, 2022)
- CAES Introduces Family of Radiation Hardened NOR Flash Memories for Space FPGAs (Mar. 21, 2022)
- China's chip champion SMIC appoints new chairman amid intensifying US scrutiny (Mar. 21, 2022)
- South Korea Slow in 5G Convergence (Mar. 21, 2022)
- QuickLogic Delivers eFPGA IP for TSMC 22nm Process from Australis IP Generator (Mar. 21, 2022)
- RISC-V Processor Core of Fraunhofer IPMS now ready for Edge AI (Mar. 17, 2022)
- Intrinsic ID optimises SRAM PUF security technology (Mar. 17, 2022)
- Arm Plans 15% Workforce Reduction as it Prepares for Life Beyond Nvidia (Mar. 17, 2022)
- Intel to Further Increase Foundry Investment (Mar. 17, 2022)
- Imagination announces ambitious global recruitment drive (Mar. 17, 2022)
- Intrinsic ID Optimizes SRAM PUF Security Technology for Advanced Process Nodes with QuiddiKey 4.x (Mar. 17, 2022)
- Xylon Demonstrates Hot Swapping of Programmable FPGA/SoC Chip Parts (Mar. 17, 2022)
- Quadric Announces $21M to Advance Its Disruptive Edge AI Platform (Mar. 17, 2022)
- Top 10 Foundries Post Record 4Q21 Performance for 10th Consecutive Quarter at US$29.55B, Says TrendForce (Mar 17, 2022)
- MPEG LA Expands AVC License to Include Complete MVC Coverage (Mar. 17, 2022)
- SEGGER releases new Embedded Studio for RISC-V with hard real-time C++ support (Mar 17, 2022)
- Arm to lay-off up to 1,000 workers as it preps for IPO (Mar. 16, 2022)
- SiFive Leadership in RISC-V Powers $2.5B+ Company Valuation (Mar. 16, 2022)
- 2022 Flash Memory CapEx Expected to Reach $29.9B; Set New High (Mar. 16, 2022)
- Siemens' Analog FastSPICE certified for UMC's 28nm HPCᵁ+ process technology (Mar 16, 2022)
- Siemens' Analog FastSPICE certified for UMC's 28nm HPCᵁ+ process technology (Mar. 16, 2022)
- Weebit scaling down its ReRAM technology to 22nm (Mar. 15, 2022)
- PCIe 6.0 Designed to Meet Automotive, AI Bandwidth Demands (Mar. 15, 2022)
- Synopsys Improves Interoperability Between CODE V and LightTools (Mar. 15, 2022)
- Samsung's foundry market share rises in Q4, narrowing down gap with TSMC: report (Mar. 15, 2022)
- Top 10 Foundries Post Record 4Q21 Performance for 10th Consecutive Quarter (Mar. 15, 2022)
- Alphawave IP Announces Definitive Agreement to Acquire Entire OpenFive Business Unit from SiFive for US$210m in cash (Mar. 14, 2022)
- Codasip University Program spurs innovation and boosts curriculums (Mar. 14, 2022)
- IAR Systems extends powerful RISC-V solutions with 64-bit support (Mar. 14, 2022)
- Rambus Announces James Mitarotonda to Become Board Advisor (Mar. 14, 2022)
- HDMI 2.0 Tx PHY in 12FFC along with Controller IP Core with high lossless Audio/Video data transfer, licensed for a 4KTV SoC (Mar. 14, 2022)
- SEGGER announces that Renesas has licensed emWin for all RX microcontrollers (Mar. 14, 2022)
- Russia and The 5G Cold War (Mar. 14, 2022)
- New process to help tech firms develop safer AI (Mar. 14, 2022)
- Grenoble INP - Phelma, UGA and Soitec sign their first partnership agreement (Mar. 14, 2022)
- China's foundry growth to remain slow for next 5 years (Mar. 11, 2022)
- GUC Announces 2.5D and 3D Multi-Die APT Platform for AI, HPC, Networking ASICs (Mar. 10, 2022)
- SEGGER collaborates with HPMicro making Embedded Studio for RISC-V available at no cost (Mar. 10, 2022)
- Rambus Accelerates Automotive SoC Design with ASIL-B Certified Embedded Hardware Security Module (Mar. 10, 2022)
- OPENEDGES Announces Silicon Proven 12nm LPDDR54 PHY IP (Mar. 10, 2022)
- TSMC February 2022 Revenue Report (Mar. 10, 2022)
- Zepp Health signs licence agreement for sureCore's EverOn ultra-low voltage memory IP (Mar. 10, 2022)
- QuantWare releases 25-qubit Contralto QPU (Mar. 10, 2022)
- PragmatIC Semiconductor leads project to digitise reusable packaging (Mar. 10, 2022)
- AlphaICs welcomes IEEE Fellow Michael Shebanow as Chief Technology Officer (Mar 10, 2022)
- QuickLogic Announces a New Approximately $1M eFPGA Contract (Mar. 10, 2022)
- Imagination and Realtek launch world-first image compression DTV SoC (Mar. 10, 2022)
- Ubiscale announces new customer for Cobalt, its low-power GNSS IP core (Mar. 09, 2022)
- Arasan announces the immediate availability of its MIPI D-PHY IP as Tx Only or Rx Only for the GlobalFoundries 12nm FinFET process node (Mar. 09, 2022)
- UK startup is raising funds for Open Power processor (Mar. 09, 2022)
- 2022 to Mark the Third Year in a Row of ≥20% Growth for the Foundry Market (Mar. 09, 2022)
- 2022 to Mark the Third Year in a Row of ≥20% Growth for the Foundry Market (Mar 09, 2022)
- Securing the Future with Trusted Traceability and Blockchain (Mar. 09, 2022)
- The Future of Automotive Connectivity (Mar. 09, 2022)
- QuickLogic Announces First Rad-Hard eFPGA IP for SkyWater RH90 Process (Mar. 08, 2022)
- Andes Technology Announces over 10 Billion Cumulative Shipments of Andes-Embedded SoCs and Records All-Time High Annual and Monthly Revenue in 2021 (Mar. 08, 2022)
- Reshoring Chip Industry Risks Failure With Just More Fabs (Mar. 08, 2022)
- Vidatronic Announces the 5nm FinFET Power Management IP Series for Ultra-Low-Power, System-on-a-Chip (SoC) Integration (Mar. 08, 2022)
- Next-gen edge AI accelerator SoC in development (Mar. 08, 2022)
- Secure-IC in the FT 1000: the sixth annual list of Europes fastest-growing companies (Mar. 08, 2022)
- Semiconductor Sales Up 27% in January (Mar. 08, 2022)
- PCIe 5.0 SerDes PHY and Controller IP Cores for all High-End Serial connect Interfaces in advanced SoCs is available for immediate licensing (Mar. 07, 2022)
- sureCore appoints Taiwan Dream Services Company to spearhead its growth into the APAC wearables market (Mar. 07, 2022)
- OpenFive and EdgeCortix Collaborate on an AI Accelerator Custom SoC (Mar. 07, 2022)
- Ambient Scientific Announces Beta Release of Software Compilers for its Programmable AI Processor GPX-10 (Mar. 07, 2022)
- Flex Logix and the Air Force Research Laboratory Expand their License to Include any Flex Logix Technology for Research and Chip Prototyping in all Available Processes including Radhard (Mar. 07, 2022)
- GUC Monthly Sales Report - February 2022 (Mar 07, 2022)
- ZeroPoint Technologies signs Memory Encryption contract (Mar. 07, 2022)
- Synopsys Extends OptoCompiler Support for New GF Fotonix Platform (Mar. 07, 2022)
- GlobalFoundries Announces Next Generation in Silicon Photonics Solutions and Collaborates with Industry Leaders to Advance a New Era of More in the Data Center (Mar. 07, 2022)
- GlobalFoundries Announces Next-Gen Silicon Photonics Solutions (Mar. 07, 2022)
- Renesas expands options with Andes-based RISC-V MPU (Mar. 07, 2022)
- TSMC's enhanced 3nm process node (N3e) to start production a quarter ahead of schedule (Mar. 05, 2022)
- Global Semiconductor Sales Increase 26.8% Year-to-Year in January (Mar 04, 2022)
- UMC Reports Sales for February 2022 (Mar 04, 2022)
- Arteris Announces Financial Results for the Fourth Quarter and Full Year 2021 and Estimated First Quarter and Full Year 2022 Guidance (Mar. 04, 2022)
- Credo Expands High Performance Seagull Family With Integrated 50Gbps PAM4 VCSEL and EML Drivers (Mar. 04, 2022)
- Agile Analog's Approach to Analog IP Design and Quality — Why "Silicon Proven" is NOT What You Think (Mar. 04, 2022)
- TSMC joins Intel-led chiplet alliance as founding member (Mar. 04, 2022)
- Dolphin Design chooses DEFACTO's SoC Compiler 9.0: a turnkey methodology to reduce project costs and increase team efficiency (Mar. 03, 2022)
- Dolphin Design chooses DEFACTO's SoC Compiler 9.0: a turnkey methodology to reduce project costs and increase team efficiency (Mar 03, 2022)
- Microsoft Executive Bobby Yerramilli-Rao Joins GlobalFoundries Board of Directors (Mar. 03, 2022)
- Leaders in Semiconductors, Packaging, IP Suppliers, Foundries, and Cloud Service Providers Join Forces to Standardize Chiplet Ecosystem (Mar. 03, 2022)
- oneNav Announces pureL5 GNSS Digital IP Core and Customer Evaluation System - World's First Single Frequency L5 GNSS Receiver (Mar 03, 2022)
- Codasip steps up its focus on Europe and appoints Till-Vattier as EMEA VP (Mar. 03, 2022)
- Graphcore Supercharges IPU with Wafer-on-Wafer (Mar 03, 2022)
- Open standard for RISC-V verification is announced at DVCon (Mar. 03, 2022)
- Imperas unifies new RISC-V verification ecosystem with RVVI (Mar. 02, 2022)
- Cadence Recognized with TSMC OIP Ecosystem Forum Customers' Choice Award for 3D-IC Design (Mar. 02, 2022)
- Semi Industry Capex Forecast to Jump 24% and Reach Over $190 Billion This Year (Mar. 02, 2022)
- Sondrel explains the 10 steps to model and design a complex SoC (Mar. 02, 2022)
- Khronos Releases Vulkan SC 1.0 Open Standard for Safety-Critical Accelerated Graphics and Compute (Mar. 02, 2022)
- Pankaj Mayor Joins Arteris IP as Executive Vice President of Global Sales (Mar. 02, 2022)
- Small Prime Divisors Attack and Countermeasure against the RSA-OTP Algorithm (Mar. 02, 2022)
- RISC-V AI Chips Are Joining GPU Race for AI Processing (Mar. 02, 2022)
- CEA and Spectronite develop software radio for spectrally efficient backhaul solutions (Mar. 02, 2022)
- How to Mitigate IoT Security Threats in 2022 (Mar. 02, 2022)
- intoPIX and Fraunhofer IIS team with Vectis to offer JPEG XS patent pool license (Mar. 01, 2022)
- Axiomise Celebrates Fourth Anniversary with Executive Appointments, Move to New Office (Mar. 01, 2022)
- Arm clears out top management (Mar. 01, 2022)
- VESA Readies DisplayPort UHBR (Ultra-High Bit Rate) Device Certification and Begins Certification of UHBR Cables (Mar. 01, 2022)
- Expedera Announces First Production Shipments of Its Deep Learning Accelerator IP in a Consumer Device (Mar. 01, 2022)
- Renesas Pioneers RISC-V Technology With RZ/Five General-Purpose MPUs Based on 64-Bit RISC-V CPU Core (Mar. 01, 2022)
- Computing-in-Memory Innovator Solves Speech Processing Challenges at the Edge Using Microchip's Analog Embedded SuperFlash Technology (Mar. 01, 2022)
- CAST and Achronix Expand Partnership to Deliver Secure FPGA Solutions (Mar. 01, 2022)
- CEVA Announces Milestone of 100 Million CEVA-powered Cellular IoT Chips Shipped (Mar. 01, 2022)
- Silex Insight launches DDR encrypter for High-Performing Systems (ASIC/FPGA) (Mar. 01, 2022)
- AP Memory Partners with Synopsys on Scalable IoT RAM Memory Solutions (Mar. 01, 2022)
- ZeroPoint Technologies signs Memory Booster contract (Feb. 28, 2022)
- PCI Express VIP from Avery Design Systems Selected by Fungible for Ensuring Compliance, Connectivity in Hyperscale Data Centers (Feb. 28, 2022)
- OIF Members Demonstrate How Interoperability Accelerates Solutions for Today's and Future Global Networks at OFC 2022 (Feb. 28, 2022)
- CEVA Extends Wi-Fi Portfolio with Wi-Fi 6/6E IP for the Access Point Market (Feb. 28, 2022)
- USB 3.1 Device & Host Controller IP Cores with highly configurable design for Superspeed data transfers in all kinds of advanced SoCs is available for immediate licensing (Feb. 28, 2022)
- Taking a RISC: Expanding Chip Options (Feb. 28, 2022)
- Imperas announces RISC-V Physical Memory Protection (PMP) Architectural Validation test suite for high quality security applications (Feb. 28, 2022)
- U.S. Chops Russia's Access to Integrated Circuits (Feb. 28, 2022)
- Breker Verification Systems Unleashes the SystemUVM Initiative to Empower UVM Engineering (Feb 28, 2022)
- Samsung Joins Forces with Industry Leaders to Advance 5G vRAN Ecosystem (Feb. 28, 2022)
- eFPGA LUTs Will Outship FPGA LUTs Later This Decade (Feb. 28, 2022)
- The age of end-to-end 5G networks built on Arm is now (Feb. 25, 2022)
- TSMC R&D Chief: There's Light at the End of the Chip Shortage (Feb. 25, 2022)
- Secure-IC Launches a Unique Cybersecurity Lifecycle Management Platform for Connected Objects (Feb. 24, 2022)
- Cadence and Dassault Systemes Partner to Transform Electronic Systems Development (Feb. 24, 2022)
- Raising the Bar on Autonomous Vehicle Safety (Feb. 24, 2022)
- CEVA Streamlines 5G New Radio Modem Design with PentaG2, the Industry's Most Comprehensive 5G Baseband Platform IP for Mobile Broadband and IoT (Feb. 24, 2022)
- Codasip's latest RISC-V embedded cores enable AI/ML edge customization (Feb. 24, 2022)
- UMC announces new 22nm wafer fab in Singapore (Feb. 24, 2022)
- Microprocessor Growth Will Slow in 2022 after Cellphone MPU Surge (Feb. 24, 2022)
- Cadence Reports Fourth Quarter and Fiscal Year 2021 Financial Results (Feb 24, 2022)
- Codasip's latest RISC-V embedded cores enable AI/ML edge customization (Feb 24, 2022)
- Renesas Develops Bluetooth Low Energy RF Transceiver Technologies that Simplify Board Design, Reduce Circuit Size and Increase Power Efficiency (Feb. 24, 2022)
- Weebit delivers significant technical and commercial progress in H1 FY22 (Feb 24, 2022)
- RISC-V AI Chips Will Be Everywhere (Feb. 24, 2022)
- Qualcomm to give all its 3nm AP foundry work to TSMC instead of Samsung (Feb. 23, 2022)
- Synopsys Joins IFS Ecosystem Alliance (Feb. 22, 2022)
- Faraday Reports 2021 Revenue at NT$8,085 Million, the Second-Best Record (Feb. 22, 2022)
- Intel open to joining consortium to buy Arm (Feb. 22, 2022)
- LeapMind announces license agreement for AI accelerator "Efficiera" with Maxell Frontier (Feb 22, 2022)
- Imec, KU Leuven and PragmatIC Semiconductor demonstrate fastest 8-bit flexible microprocessor for low-power applications (Feb. 22, 2022)
- imec details flexible 6502 plastic processor (Feb. 22, 2022)
- Audi is bringing 5G connectivity to its vehicles in 2024 (Feb. 22, 2022)
- China's share of global wafer capacity continues to climb (Feb. 21, 2022)
- Intel Will Rely on TSMC for its Rebound (Feb. 21, 2022)
- CHIPS Alliance Forms F4PGA Workgroup to Accelerate Adoption of Open Source FPGA Tooling (Feb. 21, 2022)
- We are now AS 9100D certified! - Logic Fruit Technologies (Feb. 21, 2022)
- MIPI D-PHY Tx IP Core in 22nm along with MIPI DSI-2 Tx Controller IP Core for your High-End Camera and Display needs is available for immediate licensing (Feb. 21, 2022)
- With Tower acquisition, Intel will take over industry's ninth largest foundry (Feb. 21, 2022)
- Openedges touts mixed-precision NPU for double growth outlook (Feb. 21, 2022)
- Rapid Silicon Chooses Verific's Industry-Standard Parser Platform (Feb. 21, 2022)
- Arm Advances Adoption of ADAS, Automation Technologies (Feb. 21, 2022)
- China's StarFive Technology to invest RM250m to set up design centre in Penang (Feb. 19, 2022)
- Fujikura and IntoPIX Jointly Exhibit at MWC Barcelona 2022 (Feb. 18, 2022)
- Arm introduces new automotive image signal processor to advance adoption of driver assistance and automation technologies (Feb. 18, 2022)
- Siemens Joins Intel Foundry Services' EDA Alliance Program (Feb. 18, 2022)
- Intel Will Rely on TSMC for its Rebound (Feb. 18, 2022)
- Intel to buy Israel firm as part of plan to take on TSMC (Feb. 17, 2022)
- Veriest expands to Physical Design and opens UK design center (Feb. 17, 2022)
- Faraday Succeeds in Factory Automation ASIC (Feb. 17, 2022)
- Berkeley Lab Unveils ASIC Chip Failure Bypass System (Feb. 17, 2022)
- SEMIFIVE Raises $109 Million in Series B Funding (Feb. 17, 2022)
- Synopsys Posts Financial Results for First Quarter Fiscal Year 2022 (Feb. 17, 2022)
- DCD-SEMI introduces secure & comprehensive CAN-ALL solutions for automotive (Feb. 17, 2022)
- Orca Systems Announces World's First Fully Integrated SoC Solution for Direct-to-Satellite IoT Connectivity (Feb. 17, 2022)
- The EU's AI rules will likely take over a year to be agreed (Feb. 17, 2022)
- Tektronix Delivers Industry-First PCI-Express 6.0 Test Solution (Feb. 16, 2022)
- From the Beginning, Arm IPO Was Plan A (Feb. 16, 2022)
- Qorvo Selects Cadence Design Systems for US Government SHIP-RF Program (Feb 16, 2022)
- Toshiba to Build 300mm Wafer Fab Facility to Expand Power Semiconductor Production (Feb. 16, 2022)
- EU allocates 6bn euros to satellite communication plan (Feb. 16, 2022)
- Ericsson launches IoT Accelerator Connect to simplify deployments (Feb. 16, 2022)
- Aspinity unveils the first analog machine learning chip (Feb. 16, 2022)
- Silicon Catalyst welcomes Imagination Technologies as an In-Kind Partner (Feb. 15, 2022)
- Intel to Acquire Tower Semiconductor for $5.4 Billion (Feb. 15, 2022)
- CEVA, Inc. Announces Fourth Quarter 2021 Financial Results (Feb. 15, 2022)
- Intrinsic ID Partners with Jupiter Semi to Expand its Physical Unclonable Function (PUF) Security IP into China (Feb. 15, 2022)
- Andes Technology Is the First RISC-V Vendor to Accomplish ISO 26262 Functional Safety ASIL D Development Process Certification with SGS-TÜV Saar (Feb. 15, 2022)
- Andes Technology Is the First RISC-V Vendor to Accomplish ISO 26262 Functional Safety ASIL D Development Process Certification with SGS-TÜV Saar (Feb 15, 2022)
- The cellular IoT market will exceed $61B by 2026 (Feb. 15, 2022)
- AlphaICs Begins Global Sampling of (Feb. 14, 2022)
- AMD Completes Acquisition of Xilinx (Feb. 14, 2022)
- GbE (10/100/1000Base-T) PHY IP is available for immediate licensing for Superfast and Low Power Ethernet interface (Feb. 14, 2022)
- A Big Week for RISC-V (Feb. 14, 2022)
- AlphaICs Begins Global Sampling of (Feb. 14, 2022)
- Global Semiconductor Sales, Units Shipped Reach All-Time Highs in 2021 as Industry Ramps Up Production Amid Shortage (Feb. 14, 2022)
- SMIC Outpaces Rivals on Strong Local Demand (Feb. 14, 2022)
- Space Codesign Systems obtains ESA/NAVISP funding to support the design of a new generation of spaceborne GNSS receiver (Feb 14, 2022)
- AlphaICs Begins Global Sampling of "Gluon - Deep Learning Co-Processor" (Feb 14, 2022)
- Intel's plan to license x86 cores for chips with Arm, RISC-V and more inside (Feb. 14, 2022)
- Synopsys to enable secure software development (Feb. 14, 2022)
- SMIC Outpaces Rivals on Strong Local Demand (Feb. 13, 2022)
- Semiconductor Sales To Rise at 7.1% CAGR Through 2026 (Feb. 11, 2022)
- AMD Receives All Necessary Approvals for Proposed Acquisition of Xilinx (Feb. 11, 2022)
- Worldwide Silicon Wafer Shipments and Revenue Set New Records in 2021, SEMI Reports (Feb. 11, 2022)
- UMC Reports Sales for January 2022 (Feb. 11, 2022)
- Secure-IC listed among the Champions of Growth 2022 (Feb. 11, 2022)
- OPENEDGES LPDDR54 PHY IP Licensed by Novachips (Feb. 10, 2022)
- Samsung Posts Highest Semiconductor Sales, While TSMC Enjoys Highest Operating Margin (Feb. 10, 2022)
- Microsoft joins Linaro, Arm and Qualcomm Technologies to advance Windows on Arm (Feb. 10, 2022)
- Intel Invests in Foundry Ecosystem, Embraces RISC-V (Feb. 10, 2022)
- CXL Consortium Signs Agreement with Gen-Z Consortium to Accept Transfer of Gen-Z Specifications and Assets (Feb 10, 2022)
- SMIC Reports 2021 Fourth Quarter Results (Feb 10, 2022)
- TSMC January 2022 Revenue Report (Feb. 10, 2022)
- GlobalFoundries Reports Fourth Quarter and Fiscal Year 2021 Financial Results (Feb. 10, 2022)
- Rambus Reports Fourth Quarter and Fiscal Year 2021 Financial Results (Feb. 10, 2022)
- Nvidia Abandons Arm Deal, Segars Steps Aside for IPO (Feb. 09, 2022)
- Sondrel's IP platforms prevent operational chip errors as Functional Safety is built in (Feb. 09, 2022)
- Synopsys Introduces Code Sight Standard Edition to Enable Secure Software Development (Feb. 09, 2022)
- videantis focuses on growth by hiring Chief Financial Officer (Feb. 09, 2022)
- Intel Announces Billion-Dollar Development Fund, Boosts RISC-V Processors (Feb. 09, 2022)
- GlobalFoundries closed 2021 with a 36% revenue increase (Feb. 09, 2022)
- Intel Partners with Top EDA Vendors to Further Foundry Ambitions (Feb. 09, 2022)
- Arm appoints Rene Haas as Chief Executive Officer (Feb. 08, 2022)
- Vidatronic Partners with Intel Foundry Services as an IP Alliance Member (Feb. 08, 2022)
- Andes Technology Corp. and Intel Foundry Services Bring RISC-V Solutions to Build an Open Ecosystem (Feb. 08, 2022)
- Cadence Joins Intel Foundry Services Ecosystem Alliance to Advance Chip Design Innovation (Feb 08, 2022)
- Intel Foundry Services Launches Ecosystem Alliance to Accelerate Customer Innovation (Feb. 08, 2022)
- NVIDIA and SoftBank Group Announce Termination of NVIDIA's Acquisition of Arm Limited (Feb. 08, 2022)
- Intel Launches $1 Billion Fund to Build a Foundry Innovation Ecosystem (Feb 08, 2022)
- Silicon Creations Joins Intel Foundry Services Accelerator - IP Alliance Program Aiming to Reducing Design Barriers, Accelerating Time-to-Market (Feb. 08, 2022)
- sureCore announces technology for in-memory computing (Feb. 08, 2022)
- Intel and Alphawave Announce Partnership for Intel Foundry Services (Feb. 08, 2022)
- Ventana Micro Systems Inc. Announces Strategic Partnership With Intel for Broader Commercialization of Its High-Performance RISC-V Cores and Chiplets (Feb 08, 2022)
- Flex Logix Expands Management Team To Meet Growing Demand For Its AI Inference and eFPGA Solutions (Feb. 08, 2022)
- Major Update to MIPI CSI-2 Camera Specification Enables Next Generation of Always On, Low Power, Machine Vision Applications (Feb 08, 2022)
- Wi-Fi 7, Data Rates, and Latency: Understanding the IEEE 802.11be Standard (Feb. 08, 2022)
- PUFsecurity and eMemory Launch Next-Gen PUF-based Hardware Root of Trust IP for Future Computing (Feb. 07, 2022)
- GUC Monthly Sales Report - January 2022 (Feb. 07, 2022)
- Looking Back on 2021: Strong Growth Momentum of RISC-V Market (Feb. 07, 2022)
- USB 3.0/ PCIe 3.0/ SATA 3.0 Combo PHY IP in 12nm, 16nm and 22nm process nodes with simple integration and flexible customization is ready for immediate licencing for your advanced SoC design (Feb. 07, 2022)
- SiFive Partners with Intel to Spark Innovation in High-Performance RISC-V Platforms (Feb. 07, 2022)
- US Court of Appeals for Federal Circuit Confirms Finding that Apple Infringes WiLAN Patents (Feb 07, 2022)
- Siemens joins Intel Foundry Services' EDA Alliance program (Feb. 07, 2022)
- Intel Corporation Makes Deep Investment in RISC-V Community to Accelerate Innovation in Open Computing (Feb. 07, 2022)
- eMemory Partners with Intel Foundry Services to Boost Security in Leading-Edge Chips (Feb. 07, 2022)
- Synopsys Joins New Intel Foundry Services Ecosystem Alliance to Propel Development of Next-Generation Semiconductor Designs (Feb. 07, 2022)
- Analog Bits Partners with Intel Foundry Services as IP Alliance Partner (Feb. 07, 2022)
- Andes Technology Corp. Announces Joining the Intel Foundry Service Accelerator - IP Alliance Program (Feb. 07, 2022)
- India goes RISC-V with VEGA processors (Feb. 04, 2022)
- How to Interpret Chip Supply Chain Data (Feb 03, 2022)
- Rain Neuromorphics Raises $25M Series A to Transform AI Hardware Landscape (Feb. 03, 2022)
- Synaptics Launches Industry's First Matter-Compliant Triple Combo SoC with Integrated Wi-Fi 6/6E, Bluetooth 5.2, and 802.15.4/Thread for Seamless IoT Connectivity (Feb. 03, 2022)
- BrainChip Awarded US Patent for Accessing Learned Functions in an Intelligent Target Device (Feb. 02, 2022)
- NSCore, Inc. Introduces its Automotive Grade-1 Qualified Non-Volatile Memory solution to help address the increasing need for Low Cost Semiconductor Chips (Feb. 02, 2022)
- eDisplay Port / Display Port v1.4 Tx PHY and Controller IP in 40ULP and 12FFC process nodes for lagless and pure UHD Displays is available for immediate licensing (Feb. 02, 2022)
- DSP Concepts Secures $28M in Series C Funding to Fuel Rapid Growth (Feb. 02, 2022)
- Codasip appoints Functional Safety VP (Feb. 02, 2022)
- France: EIB lends €7.5 million to Menta to speed up its development (Feb. 02, 2022)
- eTopus Announces Collaborative IP Platform for Rapid and Economical Deployment of Chiplets (Feb. 02, 2022)
- France: EIB lends €7.5 million to Menta to speed up its development (Feb 02, 2022)
- Synopsys Announces Earnings Release Date for First Quarter Fiscal Year 2022 (Feb. 02, 2022)
- u-blox launches scalable IoT digital certificate management system (Feb. 02, 2022)
- Mixel MIPI C-PHY/D-PHY Combo IC Integrated in isMedia Frame Grabber Family of Products for Sensor Applications (Feb. 01, 2022)
- Can anything stop TSMC? (Feb. 01, 2022)
- GOWIN Semiconductor USB 2.0 PHY Interface and Device Controller IPs Achieve USB-IF Certification (Jan. 31, 2022)
- LeapMind Announces AI Image processing model which operates on edge devices (Jan. 31, 2022)
- Arasan expands Total MIPI Display IP with seamlessly integrated VESA DSC IP (Jan. 31, 2022)
- Samsung Readies Gate-All-Around Ramp (Jan 31, 2022)
- AMD Acquisition of Xilinx Heats Up Competition with Intel (Jan. 31, 2022)
- CAES Collaborates with Lattice Semiconductor to Provide Radiation-Tolerant FPGAs for Distributed Satellite Computing Applications (Jan. 31, 2022)
- Helping to lead the RISC-V revolution (Jan. 31, 2022)
- Top 5 predictions for eFPGA in 2022 (Jan. 30, 2022)
- Blue Danube Systems Enters Agreement to Be Acquired by NEC Corporation (Jan 28, 2022)
- Logic Design Solutions Launches NVME Host IP on Xilinx Ultrascale & Ultrascale Plus FPGA (Jan. 28, 2022)
- Intel can't even grow profits during a global chip shortage – where did it all go wrong? (Jan. 28, 2022)
- Key IoT predictions in 2022 – The year enterprises take control (Jan. 28, 2022)
- SmartDV and NSITEXE Sign Agreement to Deploy NSITEXE's RISC-V 32bit CPU Core throughout North America, China, India, Taiwan (Jan. 27, 2022)
- Xilinx Reports Record Revenue of $1.01 Billion in Fiscal Third Quarter (Jan. 27, 2022)
- Taiwan's Intellectual Property and Commercial Court Announced Its Ruling on UMC and Other Defendants with Respect to Micron Case (Jan 27, 2022)
- Frame Buffer Compression IP Subsystem for TCON IC Manufacturers Launched by Hardent (Jan. 27, 2022)
- The Real Reason Behind the Automotive Industry IC Shortage - A Step-Function Surge in Demand! (Jan. 27, 2022)
- Pearl Semi selects Siemens' Symphony AMS platform for its novel low-noise digital PLL design (Jan. 27, 2022)
- Alphawave Welcomes Tony Chan Carusone as Chief Technology Officer (Jan. 27, 2022)
- North American Semiconductor Equipment Industry Posts December 2021 Billings (Jan 27, 2022)
- Kinetic Technologies Adopts Diakopto's ParagonX Platform for High-Performance Power Management and Video/Audio Interface ICs (Jan. 27, 2022)
- JEDEC Publishes HBM3 Update to High Bandwidth Memory (HBM) Standard (Jan. 27, 2022)
- TSMC's biggest threat isn't a resurgent Intel (Jan. 27, 2022)
- Imagination GPU cleared for RISC-V CPU compatibility, licensed to chip designers (Jan. 27, 2022)
- Report: Nvidia prepares to abandon Arm deal (Jan. 26, 2022)
- Analog IP supplier Agile Analog builds footprint in Asia-Pacific with new sales and engineering operation based in Taiwan (Jan. 26, 2022)
- Jerome Nadel Joins BrainChip as Chief Marketing Officer (Jan. 26, 2022)
- Thalia launches next generation IP reuse tools for smarter, more agile semiconductor product development (Jan. 26, 2022)
- CEVA Introduces Security IP for Die-to-Die Communication Between Chiplets (Jan. 26, 2022)
- Ceremorphic Exits Stealth Mode; Unveils Technology Plans to Deliver a New Architecture Specifically Designed for Reliable Performance Computing (Jan 26, 2022)
- DVB-S2X/S2/S/T2/T/C Combo Demodulator & Decoder IP Core licensed to - Asia's leading TV Semiconductor Company (Jan. 26, 2022)
- Soitec CEO Succession Causing Serious Dissension (Jan. 26, 2022)
- UMC Reports 30.5% YoY Jump in Q4 2021 Revenue (Jan. 26, 2022)
- Rambus Delivers PCIe 6.0 Controller for Next-Generation Data Centers (Jan. 26, 2022)
- CFX announces commercial availability of anti-fuse OTP technology on 55nm Logic process (Jan. 25, 2022)
- NucleiSys Adopts Breker's System Coherency TrekApp (Jan. 25, 2022)
- The Future of Embedded FPGAs – eFPGA: The Proof is in the Tape Out (Jan. 25, 2022)
- Wi-Fi ax + BLE v5.3 + 15.4, 2.4GHz RF Transceiver IP core in 22nm, licensed to a Chinese customer for IoT chipset (Jan. 24, 2022)
- AI expands HBM footprint (Jan. 24, 2022)
- Real Wireless Research Shows One Third Reduction for Private Network Infrastructure Cost Using AccelerComm 5G physical layer IP solution (Jan. 24, 2022)
- MPEG LA Offers One-Stop License for ATSC 3.0 (Jan 24, 2022)
- Cadence Announces Full DRAM Verification Solution for Automotive, Data Center, and Mobile Applications (Jan. 24, 2022)
- Prepare for chip recession says analyst (Jan. 24, 2022)
- Weebit Nano demonstrates its first crossbar ReRAM arrays (Jan. 24, 2022)
- BrainChip Reflects on a Successful 2021, with Move to Market Readiness Behind Next-Generation Edge-Based AI Solutions (Jan. 24, 2022)
- Forecasters Foresee a $600B Chip Industry (Jan 24, 2022)
- Imagination wins Linley Group 2021 Analysts' Choice Award (Jan. 24, 2022)
- Kalray Enters into Exclusive Negotiations for the Acquisition of Arcapix Holdings Ltd, a Leading Provider of Software-defined Storage Solutions for Data-intensive Applications (Jan 24, 2022)
- A Quantum Computer with 5,000+ Qubits Now in Europe (Jan. 24, 2022)
- NSITEXE taps Green Hills for RISC-V safety software (Jan. 24, 2022)
- Four Important Wi-Fi Design Trends Worth Watching in 2022 (Jan. 24, 2022)
- Access Advance Welcomes HONOR to the HEVC Advance Patent Pool (Jan. 21, 2022)
- Kalray Enters into Exclusive Negotiations for the Acquisition of Arcapix Holdings Ltd, a Leading Provider of Software-defined Storage Solutions for Data-intensive Applications (Jan. 21, 2022)
- Wi-Fi Alliance 2022 Wi-Fi trends (Jan. 20, 2022)
- Morello research program hits major milestone with hardware now available for testing (Jan. 20, 2022)
- Secure-IC Raises €20 Million to Accelerate the Deployment of its Cybersecurity Solutions for Connected Objects (Jan. 20, 2022)
- Seeing Machines Might Be the Next Arm (Jan 20, 2022)
- Cadence Palladium Z2 Enterprise Emulation Platform Accelerates Microchip's Data Center Solutions SoC Development (Jan. 20, 2022)
- Amcor announces strategic investment in PragmatIC Semiconductor (Jan. 20, 2022)
- Siemens collaborates with UMC on design kits for automotive and power applications (Jan. 20, 2022)
- Arm Predicts Stagnation if Nvidia Deal Fails (Jan. 19, 2022)
- Gartner Says Worldwide Semiconductor Revenue Grew 25.1% in 2021, Exceeding $500 Billion For the First Time (Jan. 19, 2022)
- Silex Insight integrates cryptographic coprocessor with Mbed TLS 3.x (Jan. 19, 2022)
- MediaTek Shows The World's First Live Demos of Wi-Fi 7 Technology to Customers and Industry Leaders (Jan. 19, 2022)
- NSITEXE and Green Hills Software Partner on RISC-V Solutions (Jan. 19, 2022)
- Atmosic Announces $72 Million in Additional Funding and Launches New Bluetooth 5.3 SoC Family with Energy Harvesting Technology (Jan. 19, 2022)
- Samsung Reportedly Aims to Overtake TSMC's Foundry Business by 2030 (Jan. 19, 2022)
- TSMC price hike expected to impact CPUs and graphics cards this year (Jan. 19, 2022)
- Chip designer Alphawave gets 225% sales boost following IPO woes (Jan. 19, 2022)
- Soitec Board Announces CEO Succession Plan - Pierre Barnabe To Succeed Ceo Paul Boudre At The Close Of The July 2022 Shareholders Meeting (Jan. 19, 2022)
- IC Sales Seen Growing by Double-Digits for Third Year in a Row (Jan. 18, 2022)
- BrainChip Achieves Full Commercialization of its AKD1000 AIoT Chip with availability of Mini PCIe Boards in high volume (Jan. 18, 2022)
- Faraday IP Solutions Certified by SGS-TUV for ISO 26262 ASIL-D Ready (Jan. 18, 2022)
- Successful Transmission of High-Quality, Ultra-Low-Latency Video over 60 GHz Wireless Communications System (Jan. 18, 2022)
- L&T Technology Services wins USD45 million EV deal from U.S. Auto Tier-1 (Jan. 18, 2022)
- QuickLogic Announces Large Display Bridge Purchase Order and Provides Preliminary Selected Fourth Quarter Fiscal 2021 Financial Results (Jan 18, 2022)
- MIPI Alliance Releases A-PHY v1.1, Doubling Maximum Data Rate and Adding New Implementation Options to Automotive SerDes Interface (Jan. 18, 2022)
- Imagination and Andes jointly validate GPU with RISC-V CPU IP (Jan. 18, 2022)
- EnSilica and Omni Design Collaborating on Multiple SoCs (Jan. 18, 2022)
- Airbus Selects Siemens Capital Software for E/E Systems Development (Jan. 18, 2022)
- Mercedes Applies Neuromorphic Computing in EV Concept Car (Jan. 18, 2022)
- MPEG-H Audio selected as sole mandatory audio system for Brazil's next-generation TV 3.0 broadcast service (Jan. 18, 2022)
- Alphawave IP: Q4 2021 Trading and Business Update (Jan. 17, 2022)
- Baikal Electronics allies with IP-cores domestic developer (Jan. 17, 2022)
- Light Leverages Cadence Tensilica Vision Q7 DSP for Enhanced Depth Perception in Next-Generation ADAS Systems (Jan. 17, 2022)
- MIPI UFS 3.1, M-PHY 4.1, Unipro 1.8, ONFi 4.1 and many more IP Cores are available for immediate licensing for your advanced UFS Device Applications as a complete bundled solution (Jan. 17, 2022)
- TSMC's 2022 Expansion Budget Exceeds $40 Billion (Jan. 17, 2022)
- Deep Vision Adopts SiFive RISC-V to Add OpenCV-Enabled AI Support (Jan. 17, 2022)
- Electronic System Design Industry Logs 17% Year-Over-Year Revenue Growth in Q3 2021, ESD Alliance Reports (Jan. 17, 2022)
- Fraunhofer's MPEG-H Audio selected as the sole mandatory audio system for Brazil's next-generation TV 3.0 broadcast service (Jan. 17, 2022)
- SmartDV Joins Open RF Association (Jan. 14, 2022)
- Ceva Adds Homogenous AI Acceleration to Third-Gen Engine (Jan. 14, 2022)
- intoPIX TicoRAW improves RAW image workflows and camera designs (Jan. 13, 2022)
- Five AI Inference Trends for 2022 (Jan. 13, 2022)
- TSMC Reports Fourth Quarter EPS of NT$6.41 (Jan. 13, 2022)
- Efabless Series A-1 Round Led by New North Ventures Drives Open-Source-Enabled Chip Design (Jan. 13, 2022)
- Access Advance Announces the Initial Group of VVC/H.266 Video Patent Pool Licensors (Jan. 13, 2022)
- PCI-SIG Releases PCIe 6.0 Specification Delivering Record Performance to Power Big Data Applications (Jan. 12, 2022)
- Industry's First use of TLM for the At-Speed Verification of a PCIe-Based Avionics Design Requiring DO-254 Compliance (Jan. 12, 2022)
- Kyocera Selects Rambus for IoT Security (Jan. 12, 2022)
- Semi Content in Electronic Systems Reached Record High in 2021 (Jan. 12, 2022)
- Rambus Root of Trust Delivers FIPS 140-2 CMVP Security in Kyocera Multifunction Products (Jan. 12, 2022)
- Intilop Partners with IBM in Extreme Networking to deliver one thousand TCP & UDP connections on IBM's Big Data servers (Jan. 12, 2022)
- Nvidia-Arm plays (Jan. 12, 2022)
- Aptiv Announces the Acquisition of Wind River, A Leading Provider of Intelligent Edge Software Solutions, From TPG (Jan. 12, 2022)
- VSORA Introduces Tyr Chip Family Enabling L2-L5 Autonomous Driving (Jan. 12, 2022)
- Nvidia-Arm plays "strong-Intel" card in UK deal probe (Jan 12, 2022)
- Xylon releases a new version of its MPSoC IP Framework for Multi-Camera Vision Applications (Jan 12, 2022)
- Reinventing Traceability: Adding domain intelligence with Arteris Harmony Trace (Jan. 12, 2022)
- Why Qualcomm won't built its own foundry (Jan. 12, 2022)
- 5G Predictions for 2022 (Jan. 12, 2022)
- Sondrel explains the vital coordinating role of Systems Architects (Jan. 11, 2022)
- Alphawave Collaborates with Microchip on AlphaCore 112Gbps IP for 800G and 1.6T Ethernet Applications (Jan. 11, 2022)
- Chip shortage in 2022 and beyond: What you need to know (Jan. 11, 2022)
- Intel Agilex I-Series FPGA: REFLEX CES launches a brand new board with 400 Gigabit Ethernet capability (Jan 11, 2022)
- Processor architecture for edge AI/ML inference workloads (Jan. 11, 2022)
- Expedera Joins Global Semiconductor Alliance (Jan. 11, 2022)
- IoT Spending in APAC to Reach $437B in 2025 (Jan. 11, 2022)
- eDisplay Port/Display Port v1.4 Tx PHY and Controller IP Cores in 12FFC and 40LP for cutting edge display applications is available for immediate licensing (Jan. 10, 2022)
- TSMC December 2021 Revenue Report (Jan. 10, 2022)
- proteanTecs and Alchip Bring Production Visibility to Advanced ASICs (Jan. 10, 2022)
- Mauna Kea Semiconductors (MKSemi) Raises $12.8 Million Pre-A+ Round, Launches Breakthrough Low Power Ultra-Wideband Product (Jan. 10, 2022)
- Syntiant Announces Voice-Enabled Ultra-Low-Power Reference Design for TWS Earbud Applications (Jan. 10, 2022)
- 2022 Semiconductor Sales to Grow 11% After Surging 25% in 2021 (Jan. 10, 2022)
- HEVC Advance Patent Pool Momentum Grows (Jan. 10, 2022)
- OPENEDGES Announces the Industry First 4-/8-bit Mixed-Precision Neural Network Processing Unit IP (Jan. 10, 2022)
- A*STAR's Institute of Microelectronics and Soitec to develop next-generation silicon carbide semiconductors (Jan. 10, 2022)
- CEVA's Bluetooth Dual Mode 5.3 SIG Qualified Platform Offers Improved Security, Less Interference and Better Power Consumption for Wireless Audio (Jan. 07, 2022)
- Arteris IP Added to Russell 2000 Index (Jan. 06, 2022)
- Convey 4K & 8K over Gigabit Network, Cat5E cables and Wifi-6 Using intoPIX TicoXS FIP Codec, the smart path is here (Jan. 06, 2022)
- Wi-Fi CERTIFIED 6 Release 2 adds new features for advanced Wi-Fi applications (Jan. 06, 2022)
- UMC Reports Sales for December 2021 (Jan 06, 2022)
- CEVA Redefines High Performance AI/ML Processing for Edge AI and Edge Compute Devices with its NeuPro-M Heterogeneous and Secure Processor Architecture (Jan 06, 2022)
- SK hynix completes the First Phase of Intel NAND and SSD Business Acquisition (Jan 06, 2022)
- Lattice FPGAs Power Next Generation Lenovo Edge/AI Experiences (Jan. 06, 2022)
- Analog Compute is Key to The Next Era of AI Innovation (Jan 06, 2022)
- Nestwave and Samea Unveil Ultra-Low-Power Super-Thin, Re-Usable GPS Tracker (Jan. 06, 2022)
- Dolphin Design, a leader in Edge Computing and AI platforms for the Internet of Things (IoT), is expanding into Asia and opens a processing center in Singapore (Jan. 05, 2022)
- Winner Micro Licenses CEVA's Bluetooth and Wi-Fi IP Platforms for IoT Connectivity SoC (Jan. 05, 2022)
- GUC Monthly Sales Report - December 2021 (Jan 05, 2022)
- Wi-Fi CERTIFIED 6™ Release 2 adds new features for advanced Wi-Fi® applications (Jan. 05, 2022)
- Cadence boss takes on Credo chair (Jan. 05, 2022)
- Global Semiconductor Sales Increase 23.5% Year-to-Year in November; Industry Establishes Annual Record for Number of Semiconductors Sold (Jan. 04, 2022)
- Synapse Design, a QuEST Global Company, joins TSMC Design Center Alliance (DCA) (Jan 04, 2022)
- CEVA Bluebud Platform Takes Center Stage for a Differentiated, Premium Wireless Audio Experience in TWS Earbuds, Gaming Headsets, Hearables, Wearables and More (Jan. 04, 2022)
- Credo Appoints Lip-Bu Tan as Chairman and Bolsters Board with the Addition of Industry Veterans Sylvia Acevedo and Manpreet Khaira (Jan. 04, 2022)
- RISC-V CTO: We won't dictate chip design like Arm and x86 (Jan. 04, 2022)
- Ceva boosts Bluetooth wireless audio IP (Jan. 04, 2022)
- French and Italian startups pitch at CES 2022 (Jan. 04, 2022)
- Samsung Overtakes Intel for Lead Spot in 2021 Semiconductor Sales (Jan. 04, 2022)
- Samsung and SK to Make Massive Investments in System Semiconductors (Jan. 03, 2022)
- WiLAN Subsidiary Polaris Signs License Agreement with Marvell (Jan. 03, 2022)
- ASPEED and CEVA Collaborate to Enable Superior Voice Experience on 2nd Generation Cupola360 SoC for Smart Cameras and Video Conferencing Systems (Jan. 03, 2022)
- USB 4.0, MIPI DSI/CSI 2.0, Display Port 1.4, HDMI 2.1, DDR5, PCIe5.0, 1G Ethernet IP Cores and many more Wired Interface IP Cores available for immediate licensing (Jan. 03, 2022)
- Axiomise Unveils Intelligent Debug Solution for Formal Verification of RISC-V Cores (Jan. 03, 2022)
- Intel's technology trends (Jan. 03, 2022)
- CES 2022: IoT and AI Set to Take Center Stage (Jan. 03, 2022)
- AMD and Xilinx Provide Update Regarding Expected Timing of Acquisition Close (Dec. 31, 2021)
- Securing the IoT: Technical Approaches to Defend and Protect IoT Nodes (Dec. 31, 2021)
- 2022 tech themes: A look ahead (Dec. 30, 2021)
- TSMC reportedly getting everything lined up for 2nm production in 2025 (Dec. 29, 2021)
- Siemens mPower Solution Now Certified for TSMC's N7 and N5 Nodes (Dec. 29, 2021)
- 3Q21 Revenue of Global Top 10 Fabless Companies Hits $33.7B (Dec. 29, 2021)
- Leti proposes FD-SOI spin qubit platform for quantum computing (Dec. 28, 2021)
- Edge Computing, AI, and the Cloud (Dec. 28, 2021)
- GlobalFoundries Announces Extension of AMD Wafer Supply Agreement to Guarantee Supply (Dec. 27, 2021)
- Access Advance Welcomes Microsoft as a Licensor and Licensee of the HEVC Advance Patent Pool (Dec. 27, 2021)
- Arm CPUs Make Gains in Data Centers (Dec. 27, 2021)
- Despite Withdrawals, CES Organizers Push on With 2022 Show (Dec. 23, 2021)
- Kneron Announces $25 Million Funding To Advance Smart City Technology For Auto (Dec. 22, 2021)
- The European Space Agency (ESA) has awarded a contract to CAES, in the frame of the ARTES Competitiveness & Growth programme, to develop System-on-Chip for space applications (Dec. 22, 2021)
- Weebit Nano receives first silicon demonstration wafers integrating its embedded ReRAM module (Dec. 22, 2021)
- First Open Wi-Fi 'HaLow' development platform (Dec. 22, 2021)
- Successful conclusion of European Processor Initiative Phase One (Dec. 22, 2021)
- Synopsys Chosen by Juniper Networks to Accelerate Development of Photonic ICs for Next-Gen Data Centers (Dec. 22, 2021)
- CAES developing 16-core RISC-V based microprocessor for space (Dec. 22, 2021)
- A Novel Machine-Learning based SoC Performance Monitoring Methodology under Wide-Range PVT Variations with Unknown Critical Paths (Dec. 22, 2021)
- North American Semiconductor Equipment Industry Posts November 2021 Billings (Dec. 21, 2021)
- Real Intent Joins DARPA Toolbox Initiative to Provide Mil/Aero/Defense Grade Static Sign-Off (Dec. 21, 2021)
- 17 Semiconductor Companies Forecast to Have >$10.0 Billion in Sales This Year (Dec. 21, 2021)
- Renesas Completes Acquisition of Celeno (Dec. 21, 2021)
- Interview with the CEO at Silex Insight - Michel Van Maercke (Dec. 21, 2021)
- 17 Semiconductor Companies Forecast to Have >$10B Sales in 2021 (Dec. 21, 2021)
- PCIe 5.0 & PCIe 4.0 PHYs and Controller IP Cores are available for immediate licensing to maximize your Interface speed for complex SoCs (Dec. 20, 2021)
- Hardent VESA DSC IP Cores Licensed by Teledyne LeCroy for DisplayPort Test Solution (Dec. 20, 2021)
- Imagination appoints Carol Chesney to board as non-executive director (Dec. 20, 2021)
- SiPearl awarded a ?17.5M funding from the EIC Accelerator program (Dec. 20, 2021)
- Creonic GmbH is Heavily Invested in the Expansion and Research of 6G Technologies (Dec. 20, 2021)
- Teledatics Introduces World's First Open Wi-Fi (Dec. 20, 2021)
- Imagination's Series3NX neural network accelerator helps UNISOC to create 5G smartphone platform (Dec. 20, 2021)
- Teledatics Introduces World's First Open Wi-Fi "HaLow" Development Platform (Dec 20, 2021)
- Taiwan approves TSMC fab investment plan in Japan (Dec. 20, 2021)
- UK doubles venture capital investment in tech (Dec. 20, 2021)
- Intel CEO Says Chip Shortage To Last Until 2023 (Dec. 20, 2021)
- SiPearl awarded a €17.5M funding from the EIC Accelerator program (Dec 20, 2021)
- TSMC Introduces N4X Process (Dec. 17, 2021)
- Gowin Automotive-grade FPGAs Pass SAIC's 2500h Heat Resistance Tests (Dec. 17, 2021)
- Kandou Closes $75 Million in Series D Funding (Dec. 17, 2021)
- TSMC Newest N4X Process Targets HPC Products (Dec. 16, 2021)
- Industry's fastest TLS accelerator ready to boost Xilinx Versal platform (Dec. 16, 2021)
- MediaTek Dimensity 9000 uses Armv9 technology for unparalleled performance (Dec. 16, 2021)
- Secure Thingz and Intrinsic ID Partner to Ensure Supply Chains of Trust for the Embedded Industry (Dec. 16, 2021)
- Cliosoft Selected for Rapid Assured Microelectronics Prototypes (RAMP) Program (Dec 16, 2021)
- Atomic Rules introduces the world's highest performance PCIe host interface for Intel Agilex F-Series FPGAs (Dec. 16, 2021)
- Lattice Expands Automate Solution Stack and Propel Design Tool Capabilities to Accelerate Industrial Application Development (Dec. 16, 2021)
- 3Q21 Revenue of Global Top 10 IC Design (Fabless) Companies Reach US$33.7 billion, Four Taiwanese Companies Make List, Says TrendForce (Dec. 16, 2021)
- Synopsys SiliconSmart Library Characterization Solution Achieves Certification for TSMC N5, N4 and N3 Advanced Processes (Dec. 16, 2021)
- Synopsys Initiates $200 Million Accelerated Share Repurchase Agreement (Dec. 16, 2021)
- TSMC Presents 2021 Excellent Performance Award to Outstanding Suppliers (Dec. 16, 2021)
- Kandou Delivers USB-C Multiprotocol Retimer Product Family for USB4 Support (Dec 16, 2021)
- StarFive Released Open-Sourced Dubhe Linux SDK in RVspace Community (Dec. 16, 2021)
- Samsung and IBM reveal plans to make next-generation CPU with 5 nm process (Dec. 16, 2021)
- Ultra-Low power GNSS Multi-Constellation Digital IP core available for Battery powered IoT devices and Smart Wearables SoC application (Dec. 15, 2021)
- FPGA Development Opens Up (Dec. 15, 2021)
- IBM, Samsung Unveil VTFET to Extend Moore's Law (Dec. 15, 2021)
- Maven Silicon - ARM Approved Training Partner (Dec. 15, 2021)
- Phase-change memory comes to 18nm FDSOI (Dec. 15, 2021)
- Benchmarking Neuromorphic Computing: Devil Is in the Details (Dec. 15, 2021)
- Intel CEO trip to Taiwan seeks to secure TSMC 3nm supply: analyst (Dec. 15, 2021)
- IC Manage Launches Holodeck on AWS Marketplace for Instant Cloud Bursting (Dec 14, 2021)
- Semi Capex on Pace for 34% Growth in 2021 to Record $152.0 Billion (Dec. 14, 2021)
- SEMIFIVE Acquires Hanatec (Dec 14, 2021)
- MIPI M-PHY Update Doubles Peak Data Rate for Next-Generation Flash Memory Storage Applications (Dec 14, 2021)
- New RISC-V verification product changes the fabric of processor DV (Dec. 14, 2021)
- The Status of AI at the Edge? It's Complicated (Dec. 14, 2021)
- Security Standards Are a Must for Consumer IoT (Dec. 14, 2021)
- Arasan announces the immediate availability of its ultra-low power MIPI D-PHY IP for the GlobalFoundries 12nm FinFET process node (Dec. 13, 2021)
- MoSys Partners with Silicom to Provide Stellar Packet Classification IP Optimized for Intel FPGA-Based SmartNICs and Infrastructure Processing Units (Dec. 13, 2021)
- 10/100/1000M Ethernet PHY IP Core in ST 28FDSOI technology licensed to a leading Chinese Semiconductor company for Broadband Access Networks Application (Dec. 13, 2021)
- CEVA and Mimi Hearing Technologies Partner to Democratize Assistive Hearing for the True Wireless Earbuds Market (Dec. 13, 2021)
- CXL Put Through Its Paces (Dec 13, 2021)
- Siemens' new mPower solution gains certification for TSMC's N7 and N5 technologies (Dec 13, 2021)
- Hisense Enters Into MPEG LA's AVC Patent Portfolio License (Dec 13, 2021)
- Silex Insight to divest their video business to Audinate (Dec. 13, 2021)
- Imec demonstrates successful monolithic integration of Schottky diodes and depletion-mode HEMTs with 200 V GaN-IC (Dec. 13, 2021)
- TSMC November 2021 Revenue Report (Dec. 10, 2021)
- Floadia Develops Memory Technology That Retains Ultra-high-precision Analog Data for Extended Periods (Dec. 10, 2021)
- AST SpaceMobile Selects EnSilica to Support the Development of its Next Generation Advanced Cellular ASIC Chip (Dec. 10, 2021)
- Synopsys Approves Stock Repurchase Program with Authorization Up to $1 Billion (Dec. 10, 2021)
- TSMC in spat with Intel (Dec. 09, 2021)
- EU stops the clock on Nvidia-Arm investigation (Dec. 09, 2021)
- Expedera Raises $18M Series A Funding to Advance Its Deep Learning Accelerator IP (Dec. 09, 2021)
- Intel Announces Intent to Take Mobileye Public (Dec 09, 2021)
- SEGGER adds 64-bit RISC-V support to Embedded Studio (Dec. 09, 2021)
- BMW Group Signs Agreement with Inova Semiconductor and GlobalFoundries to Secure Supply (Dec. 09, 2021)
- proteanTecs Expands into Mobile and Boosts Management to Accommodate Growth (Dec. 09, 2021)
- StarFive VisionFive Single Board Computer Officially for Sale, Accelerating RISC-V Ecosystem Development (Dec. 09, 2021)
- RISC-V Celebrates Incredible Year of Growth and Progress, Ratifying Multiple Technical Specifications, Launching New Education Programs, and Accelerating Broad Industry Adoption (Dec. 09, 2021)
- Siemens collaborates with PDF Solutions to boost IC yield and speed time to market (Dec. 09, 2021)
- IC Market Direction Indicator Points to 11% Growth in 2022 (Dec 09, 2021)
- sureCore delivers ultra-low power register files with more than 50% less power than off-the-shelf versions (Dec. 09, 2021)
- With CHIPS Act, US Risks Building a White Elephant (Dec 09, 2021)
- China's road to homegrown chip glory looks to be going for a RISC-V future (Dec. 09, 2021)
- NextChip Selects Rambus Security IP to Secure Apache6 Automotive Processor (Dec. 08, 2021)
- GUC Optimizes Quality of Results and Accelerates Time to Tapeout Using the Cadence Digital Full Flow (Dec. 08, 2021)
- 5G New Radio Release-15 gNodeB reference design (includes L1-L2-L3) Stack for 5G Private Enterprise Networks, available for immediate licensing (Dec. 08, 2021)
- Avery Design Systems Offers Comprehensive Verification Support for the New HBM3 Interface Standard (Dec 08, 2021)
- Webinar : USB 3.1 Gen2 Device Controller IP Core usage in Intel Quartus Prime Pro (Dec 08, 2021)
- StarFive Starts Delivery of High Performance RISC-V CPU Core IP "Dubhe" (Dec 08, 2021)
- AMD may use Samsung's 4nm node for Chromebook processors (Dec. 08, 2021)
- BMW, GloFo sign chip supply agreement (Dec. 08, 2021)
- CES 2022: Intrinsic ID Demonstrates Strength and Versatility of PUF Technology for Identification and Security Applications at World's Biggest Tech Show (Dec. 07, 2021)
- intoPIX TicoRAW technology added with High-Efficiency RAW recording of Nikon Z 9 flagship mirrorless camera (Dec. 07, 2021)
- Sondrel's modules accelerate implementation of new ASIC designs (Dec. 07, 2021)
- Menta Introduces the Industry's First eFPGA Soft IP at the Design Automation Conference (Dec. 07, 2021)
- SiFive Expands and Improves Industry-Leading RISC-V Processor Portfolio (Dec. 07, 2021)
- Avery Design Partners with S2C to Bring PCIe 6.0 and LPDDR5 and HBM3 Speed Adapters to FPGA prototyping solutions for Data Center and AI/ML SoC Validation (Dec. 07, 2021)
- SoC design for AI-based applications using RISC-V Vector processors (Dec. 07, 2021)
- Chip Shortages Continue: Top Trends for 2022 (Dec. 07, 2021)
- True Circuits Attends Design Automation Conference (Dec 06, 2021)
- Global Semiconductor Sales Increase 24% Year-to-Year in October (Dec 06, 2021)
- SDIO Host and Device Controller IP Cores with superfast I/O interlink and support for massive storage capacities is ready for immediate licencing (Dec 06, 2021)
- UMC Reports Sales for November 2021 (Dec 06, 2021)
- Fraunhofer IPMS and CAST Announce a RISC-V Embedded Processor for Edge AI (Dec 06, 2021)
- True Circuits Introduces New Synthesizable Precision PLL and Synthesizable Micro PLLs and DLLs and Demonstrates Silicon Proven DDR PHY (Dec 06, 2021)
- GUC Monthly Sales Report - November 2021 (Dec 06, 2021)
- Ashling RiscFree now supports Andes Technology RISC-V CPUs (Dec 06, 2021)
- Codeplay Software partners with Andes Technology to achieve Software First SoC Design for AI-based applications using RISC-V Vector Processors (Dec 06, 2021)
- Imperas releases new RISC-V verification product that changes the fabric of processor DV (Dec. 06, 2021)
- Breker Verification Systems Unveils System Coherency Synthesis TrekApp Building on Its Successful Cache Coherency Test Solution (Dec 06, 2021)
- FortifyIQ Sets the Stage at the Design Automation Conference for Revolutionizing Chip Design with Pre-silicon Security Verification (Dec 06, 2021)
- Imagination launches RISC-V CPU family (Dec. 06, 2021)
- Imagination announces GPU licensing deal with YADRO (Dec. 06, 2021)
- What is Sensor Fusion? (Dec. 06, 2021)
- Fraunhofer extends RISC-V embedded processor for edge AI (Dec. 06, 2021)
- Mirabilis releases VisualSim AI Processor Designer (Dec. 06, 2021)
- Imagination B-Series GPU IP selected for Innosilicon graphics card (Dec. 03, 2021)
- CAST Introduces 8K Video Codecs and Advanced Image Signal Processing IP Cores (Dec. 03, 2021)
- FTC Sues to Block $40 Billion Semiconductor Chip Merger (Dec 03, 2021)
- Intel Looking to Deepen Ties with TSMC in Hopes of Securing 3nm Supply (Dec. 03, 2021)
- Foundry Revenue Jumps 12% QoQ in 3Q2021 (Dec. 03, 2021)
- Ford, GlobalFoundries Aim to Boost Domestic IC Supplies (Dec. 03, 2021)
- Synopsys Extends Industry Leadership as Customers Surpass 500 Tapeouts Using Flagship Fusion Compiler Solution (Dec. 02, 2021)
- HPMicro Semiconductor Announces the Release of the HPM6000 series of Microcontrollers with AndesCore™ dual D45 cores (Dec. 02, 2021)
- Alphawave IP: Acquisition of Precise-ITC and completion of major milestones for China Product Partnership (Dec. 02, 2021)
- Andes RISC-V Superscalar Multicore A(X)45MP and Vector Processor NX27V Upgrade Their Spec. and Performance (Dec. 02, 2021)
- RISC-V International Ratifies 15 New Specifications, Opening Up New Possibilities for RISC-V Designs (Dec. 02, 2021)
- Codasip appoints Ron Black as CEO (Dec. 02, 2021)
- SiFive Raises RISC-V performance bar with New Best-in-Class SiFive Performance P650 Processor (Dec. 02, 2021)
- HPMicro Semiconductor Announces the Release of the HPM6000 Series of Microcontrollers with AndesCore Dual D45 Cores (Dec. 02, 2021)
- Soitec acquires NovaSiC, strengthens SiC wafer technology (Dec. 02, 2021)
- Arasan Chip Systems announces Immediate availability of MIPI I3C PHY I/O IP (Dec 01, 2021)
- LeapMind Announces Efficiera v2 Ultra-Low Power AI Inference Accelerator IP (Dec. 01, 2021)
- Flex Logix Joins the Edge AI and Vision Alliance (Dec. 01, 2021)
- First SoC ever to pass CC EAL5+ certification thanks to Tiempo Secure TESIC Secure Element IP (Dec. 01, 2021)
- Agnisys Delivers Novel AI Technology and FPGA Support for IP and SoC Specification Automation (Dec. 01, 2021)
- Arteris Announces Financial Results for the Third Quarter 2021 and Estimated Fourth Quarter and Full Year 2021 Guidance (Dec. 01, 2021)
- Cadence Expands Collaboration with TSMC and Microsoft to Accelerate Timing Signoff for Giga-Scale Designs on the Cloud (Dec 01, 2021)
- videantis achieves Automotive SPICE Level 2 certification (Dec. 01, 2021)
- MIPS selects Imperas Reference Models for RISC-V Processor Verification (Nov. 30, 2021)
- USB 3.0/ PCIe 2.0/ SATA 3.0 Combo PHY IP cores with Superfast speed and High-power efficiency for lag-less data processing is Silicon Proven and available in 8nm LPP for licensing (Nov 30, 2021)
- CEO interview: Minima's Tuomas Hollman on why static timing sign-off is over (Nov. 30, 2021)
- Micron and UMC Announce Global Settlement (Nov. 30, 2021)
- Key ASIC Signed LOI to Acquire Wafer FAB in The US (Nov. 30, 2021)
- IAR Systems and Codasip collaborate to enable low-power RISC-V based applications (Nov. 30, 2021)
- Nvidia reportedly using TSMC N5 node for GeForce RTX 4000 Series (Nov. 30, 2021)
- Soitec and Mersen announce strategic partnership to develop new silicon carbide (SiC) substrates for the electric vehicle market (Nov. 30, 2021)
- Siemens Expands Collaboration with AWS to Facilitate Cloud-Based Digital Transformation for Industry (Nov. 30, 2021)
- Siemens Bags Three TSMC OIP Partner of the Year Awards for Next-gen Design Enablement (Nov. 30, 2021)
- Profile of a traceability tool promising automation in SoC designs (Nov 29, 2021)
- intoPIX Unveils "TicoXS FIP" During its ProAV Virtual Event This Week (Nov 29, 2021)
- Synopsys Expands Use of AI to Optimize Samsung's Latest Mobile Designs (Nov. 29, 2021)
- Silicon Catalyst Partners with Sony Semiconductor Solutions to Accelerate Semiconductor Startups (Nov 29, 2021)
- First RISC-V smartphones could launch in 2022 (Nov. 26, 2021)
- AMIQ EDA Joins OpenHW Group and Contributes Linting Capabilities for CORE-V Open-Source RISC-V Cores and Testbenches (Nov 25, 2021)
- The Democratization of Chip Design (Nov 25, 2021)
- Siemens receives three 2021 TSMC OIP Partner of the Year awards for next-generation design enablement (Nov 25, 2021)
- Samsung Selects Texas as Site for $17 Billion Fab (Nov 25, 2021)
- SynSense and Prophesee partner to combine neuromorphic engineering expertise for developing one-chip event-based smart sensing solution for ultra-low power edge-AI (Nov 25, 2021)
- GPU shipments increase year-over-year in Q3 (Nov 25, 2021)
- North American Semiconductor Equipment Industry Posts October 2021 Billings (Nov 25, 2021)
- WiLAN Subsidiary Acquires Wired Connectivity Patent Portfolio (Nov 25, 2021)
- VeriSilicon Image Signal Processor IP Achieved ISO 26262 Automotive Functional Safety Certification (Nov. 24, 2021)
- Samsung choses Austin for $17bn 3nm fab (Nov. 24, 2021)
- Do We Need 6G? (Nov. 24, 2021)
- Samsung set to compete against TSMC with new foundry in US (Nov. 24, 2021)
- SC21: Chinese Supercomputer Approaches Quantum Performance (Nov. 24, 2021)
- Grovf Inc. Releases Low Latency RDMA RoCE V2 FPGA IP Core for Smart NICs (Nov. 23, 2021)
- CEVA SensPro Sensor Hub DSP Achieves Automotive Safety Compliant Certification for ASIL B (Random) and ASIL D (Systematic) (Nov. 23, 2021)
- Microchip Adds Second Development Tool Offering for Designers Using Its Low-Power PolarFire RISC-V SoC FPGA for Embedded Vision Applications at the Edge (Nov. 23, 2021)
- Project to reduce energy use of 5G video streaming (Nov. 23, 2021)
- BrainChip Partners with MegaChips to Develop Next-Generation Edge-Based AI Solutions (Nov. 22, 2021)
- Announcing superfast, HD Audio & Video through HDMI 2.0 Tx & Rx PHY & Controller IP Cores uncompressed data transfer in 28HPC+ and 12FFC! (Nov. 22, 2021)
- MediaTek and TSMC Unveil the World's First 7nm 8K Resolution Digital TV System-on-Chip (Nov 22, 2021)
- Codasip Adopts Imperas for RISC-V Processor Verification (Nov. 22, 2021)
- CEA-Leti Spinoff Weaves RFID Chips, Raises €15m in Funding (Nov. 22, 2021)
- 5 Trends Shaping the Automotive Perception Market (Nov. 21, 2021)
- Elmos adopts Arm Cortex-M IP for its next-generation automotive MCU based product family (Nov. 19, 2021)
- CXL Consortium Showcases First Public Demonstrations of Compute Express Link Technology at SC21 (Nov. 19, 2021)
- Access Advance Welcomes ZTE as a Licensor and Licensee of the HEVC Advance Patent Pool (Nov 18, 2021)
- UK Widens Probe of Nvidia-Arm Deal (Nov. 18, 2021)
- Samsung Foundry Adopts New Tempus SPICE-Accurate Aging Analysis for High-Reliability Applications (Nov. 18, 2021)
- sureCore designs special high performance multi-port memory for Semidynamics AI chip (Nov. 18, 2021)
- Samsung and Its Foundry Partners Reveal Solutions for a Strong Design Infrastructure at 3rd SAFE Forum 2021 (Nov. 18, 2021)
- Synopsys Research Finds Vulnerabilities in 97% of Applications (Nov. 18, 2021)
- Imagination Technologies picks advisers for IPO in London or New York (Nov. 18, 2021)
- DCD-SEMI joins CAN in Automation, a leading CAN manufacturers' group (Nov. 18, 2021)
- Imperas Models - reference for the newly ratified RISC-V Specifications (Nov. 18, 2021)
- Annual Revenue Growth to Skyrocket Among Top 25 (Nov 18, 2021)
- GlobalFoundries, Ford to Address Auto Chip Supply and Meet Growing Demand (Nov. 18, 2021)
- DVB-S2X/S2/S/T2/T/C Combo Demodulator/Decoder IP Cores licensed to America's leading TV Semiconductor Company (Nov 18, 2021)
- Samsung Foundry Adopts Cadence Liberate Trio Characterization Suite for 3nm Production Library (Nov. 18, 2021)
- Reference models for newly ratified RISC-V Specifications (Nov. 18, 2021)
- Renesas Enters FPGA Market with the First Ultra-Low-Power, Low-Cost Family Addressing Low-Density, High-Volume Applications (Nov. 17, 2021)
- RISC-V Low-Power Embedded Processor IP Core Now Available from CAST (Nov. 17, 2021)
- Synopsys Full EDA Flow First to Achieve Samsung Foundry 4LPP Process Certification (Nov. 17, 2021)
- Synopsys 3DIC Compiler Qualified for Samsung Foundry's Multi-Die Integration Flow, Accelerating 2.5D and 3D Designs (Nov. 17, 2021)
- Siemens extends support of multiple IC design solutions for Samsung Foundry's latest process technologies (Nov. 17, 2021)
- Cadence Characterization Suite Enables Samsung Foundry to Get to Market Faster (Nov. 17, 2021)
- A Testament of IP Leadership (Nov. 17, 2021)
- Samsung's pick for 2nd foundry fab in US seems imminent (Nov. 17, 2021)
- Analog Bits to Demonstrates Low Latency PCIe/CXL Gen 5 on Samsung 8nm at SAFE Forum 2021 (Nov. 16, 2021)
- Faraday Announces Proven MIPI D-PHY for Samsung Foundry 14LPC Process (Nov. 16, 2021)
- BBright UHD Media Gateway integrates intoPIX JPEG XS technology (Nov. 16, 2021)
- Arteris IP Helps Automate System-on-Chip Semiconductor Design Traceability with Harmony Trace Design Data (Nov. 16, 2021)
- Intrinsic ID and Rambus Raise the Bar for Hardware Security with Integration of PUF Technology and Rambus Root of Trust (Nov. 16, 2021)
- SMIC Vows to Triple 300-mm Production Capacity Despite U.S. Sanctions (Nov. 16, 2021)
- BrainChip appoints Sean Hehir as New Chief Executive Officer (Nov. 15, 2021)
- SMIC Management Shakeup Continues (Nov. 15, 2021)
- SMIC Reports 2021 Third Quarter Results (Nov. 15, 2021)
- Floadia Announces eNVM of 150 degree C retention on HHGrace 180BCD (Nov. 15, 2021)
- Lattice Acquires Mirametrix (Nov. 15, 2021)
- eDisplay Port / Display Port v1.4 Tx PHY and Controller IP Cores is available in 40nm ULP and 12nm FFC for your picture perfect UHD, 8K, 4K Display Applications (Nov. 15, 2021)
- Xilinx Launches Alveo U55C, Its Most Powerful Accelerator Card Ever, Purpose-Built for HPC and Big Data Workloads (Nov. 15, 2021)
- IAR Systems enables next generation automotive applications with NXP's S32K3 MCU family (Nov. 15, 2021)
- Soitec's quality focus on RF-SOI wafers wins UMC's "Outstanding Supplier Award" (Nov. 15, 2021)
- Is the Spec for Vehicle Automation Levels a Dead End? (Nov. 15, 2021)
- VeriSilicon's Neural Network Processor IP Embedded in Over 100 AI Chips (Nov. 12, 2021)
- Net Insight teams up with intoPIX to develop next-generation JPEG XS compliant solutions (Nov. 12, 2021)
- New Lattice sensAI Solution Stack Accelerates Next-Generation Client Devices (Nov. 11, 2021)
- Samsung Announces Availability of Its Leading-Edge 2.5D Integration 'H-Cube' Solution for High Performance Applications (Nov. 11, 2021)
- TSMC to double its capacity expansion (Nov. 11, 2021)
- Cerebras Systems Raises $250M in Funding for Over $4B Valuation to Advance the Future of Artificial Intelligence Compute (Nov. 11, 2021)
- After Strong Gains, DRAM Prices Expected To Retreat in 4Q21 (Nov 11, 2021)
- TSMC October 2021 Revenue Report (Nov. 10, 2021)
- Is Digital Radar the Answer to ADAS Interference? (Nov. 10, 2021)
- TSMC gives details on new Japanese fab (Nov. 10, 2021)
- Menta and Secure-IC Partnership Expands to Provide the Most Secure eFPGA IP Available (Nov. 10, 2021)
- Weebit undertakes capital raising to support accelerated growth; introduces major Israeli institutional investors onto the register (Nov. 10, 2021)
- Introducing JESD204B Controllers and matching PHYs for high-speed, high-resolution device interconnection for high density systems! (Nov. 10, 2021)
- Synopsys' PrimeShield Recognized by 2021 World Electronics Achievement Awards (Nov. 10, 2021)
- NSITEXE unveils A New Product AI accelerator "ML041", realizes high power efficiency (Nov 10, 2021)
- Cooperation for semiconductors among US, Japan, and Taiwan accelerates (Nov. 10, 2021)
- Digital Blocks DB9000 TFT LCD and OLED Display Controller & Processor IP Application Leadership Advancements (Nov 09, 2021)
- NSITEXE DR1000C, a RISC-V based parallel processor IP with vector extension (DFP: Data Flow Processor) has been licensed for Renesas' new RH850/U2B Automotive MCUs (Nov. 09, 2021)
- BrainChip Completes Testing Production Version of the Akida Chip (Nov. 09, 2021)
- Diakopto's ParagonX Platform Selected by The Six Semi for High-Speed Memory PHYs (Nov. 09, 2021)
- Imagination and Mobica partner to create virtualized automotive environment (Nov. 09, 2021)
- CEVA, Inc. Announces Third Quarter 2021 Financial Results (Nov. 09, 2021)
- TSMC to Build Specialty Technology Fab in Japan with Sony Semiconductor Solutions as Minority Shareholder (Nov. 09, 2021)
- Kneron Edge AI SoC Powered by Andes RISC-V Processor Core D25F (Nov. 09, 2021)
- Flex Logix Accelerates Growth With New Office In Austin; Prepares For Global Expansion Of Its Edge AI Inference Product Line (Nov. 09, 2021)
- France to Invest €2.2b in AI by 2025 (Nov. 09, 2021)
- IAR Systems enables early technology adoption of the AI-capable Arm Cortex-M55 core (Nov. 08, 2021)
- Bluetooth Dual Mode v5.3 RF Transceiver IP Cores in 40nm ULP is available for immediate licensing for Audio SoC applications. (Nov. 08, 2021)
- GUC Monthly Sales Report - Oct 2021 (Nov. 08, 2021)
- Mythic Adds Two Silicon Valley Veterans to Its Leadership Team (Nov 08, 2021)
- Corigine Brings Prototyping And Emulation Acceleration To The Desktop With MimicTurbo GT Card (Nov. 08, 2021)
- Heterogeneous Computing Is About Optimizing Resources (Nov. 08, 2021)
- U.S. Looks to Coordinate Global Cybersecurity (Nov. 08, 2021)
- sureCore-led consortium wins £6.5M Innovate UK grant to develop cryogenic CMOS IP to accelerate Quantum Computing scalability (Nov. 05, 2021)
- Siemens Named A 'Leader' in Industrial Internet-of-Things Software Platforms Q3 2021 Report (Nov. 05, 2021)
- Embedded FPGA (eFPGA) technology: Past, present, and future (Nov. 04, 2021)
- eMemory and UMC Bring New ReRAM Intellectual Property to Market (Nov. 04, 2021)
- SECURE-IC exhibits and gives conferences at the european cyber week (Nov. 04, 2021)
- Samsung and Alphawave IP Announce Acceleration of Deep Partnership with Flagship Global Hyperscaler Design Win at 4nm (Nov. 04, 2021)
- Imagination launches the most advanced ray tracing GPU (Nov. 04, 2021)
- UMC Reports Sales for October 2021 (Nov 04, 2021)
- Worldwide Silicon Wafer Shipments Reach Record High in Third Quarter of 2021, SEMI Reports (Nov. 04, 2021)
- Codasip expands ecosystem with XtremeEDA (Nov. 04, 2021)
- proteanTecs UCT Supports TSMC 3nm Process Technology to Accelerate Lifecycle Health Monitoring (Nov. 03, 2021)
- Sondrel develops Performance Verification Environment to fast-track ASIC creation (Nov. 03, 2021)
- TSMC Recognizes Long-Standing Collaboration with Synopsys on Semiconductor Innovation with Multiple OIP Partner of the Year Awards (Nov. 03, 2021)
- Tessolve Joins GlobalFoundries' Design Enablement Network Program as a Design Partner to Bring Advanced Design Solutions to Accelerate Customer Product Development (Nov. 03, 2021)
- Nextchip licenses aiMotive's aiWare4 for their Apache6 automotive domain processor (Nov. 03, 2021)
- Silicon Creations Named 2021 TSMC Partner of the Year for Analog / Mixed-Signal IP (Nov. 03, 2021)
- Four automotive functional safety mistakes that must be avoided (Nov. 03, 2021)
- Weebit delivers its most successful quarter, achieving key business and technical milestones (Nov 02, 2021)
- Synopsys Acquires AI-Powered, Real-Time Performance Optimization Leader Concertio (Nov. 02, 2021)
- GlobalFoundries Announces Closing of Initial Public Offering (Nov. 02, 2021)
- DDR5 Ecosystem Ramps Up (Nov 02, 2021)
- Rambus Reports Third Quarter 2021 Financial Results (Nov. 02, 2021)
- IBM and NeuReality team up to build the next generation of AI inference platforms (Nov. 02, 2021)
- USB 3.0/ PCIe 3.0/ SATA 3.0 Combo PHY IP Cores for High Bandwidth, Low Power data communication in PCs, Mobiles, SSDs, and other Multimedia Devices. (Nov. 02, 2021)
- Wi-Fi CERTIFIED HaLow delivers long range, low power Wi-Fi (Nov. 02, 2021)
- Morse Micro Unveils Wi-Fi CERTIFIED HaLow Platform and Industry's First 8MHz Reference Design (Nov. 02, 2021)
- Codasip appoints Brett Cline to drive company growth worldwide (Nov. 02, 2021)
- M31 Technology Receives 2021 TSMC OIP Partner of the Year Award (Nov. 01, 2021)
- Andes Technology Issues GDR to Be Listed on Luxembourg Stock Exchange for Expansion Plan (Nov. 01, 2021)
- Alphawave IP Receives Prestigious 2021 TSMC OIP Partner of the Year Award for High-Speed SERDES IP (Nov. 01, 2021)
- Siemens Collaborates with TSMC on Design Tool Certifications for Advanced Technologies (Nov. 01, 2021)
- GlobalFoundries CEO: We're sold out of semiconductor chip capacity through 2023 (Oct. 30, 2021)
- eMemory Receives 2021 TSMC OIP Partner of the Year Award for Embedded Memory IP (Oct. 29, 2021)
- proteanTecs Receives 2021 TSMC OIP Partner of the Year Award (Oct. 29, 2021)
- Truechip Introduces Silicon IP For Network on Chip (NoC) Focussed For Tilelink RISC-V Chips (Oct. 29, 2021)
- Cadence Extends Battery Life and Improves User Experience for Next-Generation Hearables, Wearables and Always-On Devices (Oct. 29, 2021)
- Annual Foundry Revenue Expected to Reach Historical High in 2022 (Oct. 29, 2021)
- Blue Cheetah Bunch-of-Wires (BoW) Chiplet Interface Solution Targets Rapid Flexibility, Scalability, and Low Overhead (Oct. 29, 2021)
- VESA Publishes Embedded DisplayPort Standard Version 1.5 (Oct. 28, 2021)
- Achronix Demonstrates Speedster7t High-Performance Interfaces (Oct. 28, 2021)
- GlobalFoundries Announces Pricing of Initial Public Offering (Oct. 28, 2021)
- SiFive has briefly pulled back the curtains on its most powerful Risc-V processor yet. (Oct. 28, 2021)
- Europe opens extended investigation into ARM-Nvidia deal (Oct. 28, 2021)
- Annual Foundry Revenue Expected to Reach Historical High Once Again in 2022 with 13% YoY Increase with Chip Shortage Showing Sign of Easing (Oct. 28, 2021)
- Codasip Founder Karel Masarik elected to RISC-V Technical Steering Committee (Oct. 28, 2021)
- AccelerComm Announces 5G IP with O-RAN Acceleration Abstraction Layer (AAL) Interface (Oct. 28, 2021)
- Samsung to triple foundry capacity (Oct 28, 2021)
- Rapid Silicon Announces Seed Funding of $15M (Oct 28, 2021)
- Morris Chang says domestic US chip supply chain is impossible (Oct 28, 2021)
- S2C Delivers VU19P FPGA-based Logic Matrix LX2 - a New Benchmark in High-performance & High-density Prototyping (Oct 28, 2021)
- Semiconductor Sector Shows Signs of Cooling (Oct 28, 2021)
- Faraday Reports Third Quarter 2021 Revenues at NT$2,218 Million, Up 31% QoQ (Oct. 28, 2021)
- SiPearl: collaboration with Intel to accelerate exascale supercomputing deployment in Europe (Oct 28, 2021)
- Samsung plans to triple foundry chip production capacity by 2026 (Oct. 28, 2021)
- Siemens collaborates with TSMC on design tool certifications for TSMC's advanced technologies and other industry milestones (Oct. 27, 2021)
- Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric Technologies for Advanced Multi-Chiplet Designs (Oct. 27, 2021)
- Arteris IP Announces Pricing of Initial Public Offering (Oct. 27, 2021)
- Omni Design Announces Availability of LiDAR Receiver Subsystem (Oct. 27, 2021)
- Achronix and MoSys Partner to Target 5G Wireless and Broadband Networking Acceleration (Oct. 27, 2021)
- Xilinx and Leading Broadcast and AV System and IP Integrators Deliver Complete, Production-Ready Multimedia Streaming End-Point Solutions (Oct. 27, 2021)
- TSMC Recognizes Partners of the Year at 2021 OIP Ecosystem Forum (Oct. 27, 2021)
- JEDEC Publishes Update to DDR5 SDRAM Standard Used in High-Performance Computing Applications (Oct. 27, 2021)
- TSMC Details The Benefits of Its N3 Node (Oct. 27, 2021)
- Samsung to finalise US fab investment (Oct. 27, 2021)
- Siemens collaborates with TSMC on design tool certifications (Oct. 27, 2021)
- Renesas and wolfSSL Enable Ready-to-Use IoT Security Solutions Based on Embedded TLS Stack (Oct. 27, 2021)
- 5GCroCo Project Advances Cross-border Connectivity for Cars (Oct. 27, 2021)
- SD 5.1/eMMC 5.1 Host and Device Controllers with Matching PHYs for all kind of Portable Memory Storage Devices, making it easy to integrate a wide range of Applications in your products (Oct. 27, 2021)
- Synopsys and TSMC Drive Chip Innovation with Development of Broadest IP Portfolio on TSMC N4P Process (Oct. 27, 2021)
- Analog Bits to Present Papers, Demo of N5 Working Silicon, and Roadmap on IPs for TSMC N4 and N3 Processes (Oct. 26, 2021)
- TSMC Expands Advanced Technology Leadership with N4P Process (Oct. 26, 2021)
- QuickLogic Announces First eFPGA IP From Australis IP Generator on UMC 22nm Process (Oct. 26, 2021)
- Codasip boosts Studio processor design tools with AXI automation (Oct. 26, 2021)
- Agile Analog broadens analogue IP portfolio (Oct. 26, 2021)
- Codasip boosts custom RISC-V performance in latest tool (Oct. 26, 2021)
- New Allwinner RISC-V Chip Uncovered on Tiny Board (Oct. 26, 2021)
- GlobalData: China Emerges as Powerhouse for AI Unicorns (Oct. 26, 2021)
- Xiphera expands its AEAD portfolio (Oct 25, 2021)
- ISDB-S3 Demodulator IP Core is now available for licensing to STB & TV SoC Manufacturers (Oct 25, 2021)
- videantis processing platform reduces cost, increases flexibility of fail-operational systems (Oct 25, 2021)
- Crypto Quantique partners with Macronix to add ArmorFlash support to its IoT security management platform (Oct 25, 2021)
- North American Semiconductor Equipment Industry Posts September 2021 Billings (Oct 25, 2021)
- IAR Systems extends functional safety offering for RISC-V with leading build tools for Linux (Oct 25, 2021)
- Functional safety tools certified on RISC-V (Oct. 25, 2021)
- Vidatronic Joins the Silicon Catalyst Semiconductor Ecosystem as an In-Kind Partner (Oct. 22, 2021)
- BrainChip Begins Taking Orders of Akida AI Processor Development Kits (Oct. 21, 2021)
- Flex Logix Announces Production Availability Of InferX X1 PCIe Boards for Edge AI Systems (Oct. 21, 2021)
- Green Hills Software Creates Clear Path for Arm Cortex-A78AE Early Adopters in High-Performance Critical Embedded Systems (Oct. 21, 2021)
- Silex Insight offers low-power embedded video solution for manufacturing and automotive (Oct. 21, 2021)
- Siemens accelerates IP validation by 1,000X at Arm using ML-powered Solido Variation Designer on AWS Graviton2 (Oct. 21, 2021)
- Alphawave IP Group plc Q3 Trading Statement (Oct. 21, 2021)
- Cadence Demonstrates IP Test Silicon for PCI Express 6.0 Specification on TSMC N5 Process (Oct. 21, 2021)
- Cadence Digital and Custom/Analog Flows Achieve the Latest TSMC N3 and N4 Certifications (Oct. 21, 2021)
- De-RISC, the H2020 project which will create the first RISC-V fully European platform for aerospace, celebrates its second anniversary (Oct. 20, 2021)
- NSCore, Inc. introduces its OTP+ solution to address the IoT market need for an Ultra-Low-Power OTP NVM IP Solution in 40nm (Oct. 20, 2021)
- Enyx releases nxFramework version 5.4 for subscribers which includes new ULL IP cores and 40G support (Oct 20, 2021)
- Precise-ITC to Exhibit at CEATEC 2021 ONLINE (Oct 20, 2021)
- Synopsys Expands Strategic Technology Collaboration with TSMC to Extend 3D-System Integration Solutions for Next-Generation High-Performance Computing Designs (Oct. 20, 2021)
- TSMC's Japan Expansion Puts Profit at Risk (Oct. 20, 2021)
- Synopsys Digital and Custom Design Platforms Achieve Certification for TSMC N3 Process (Oct. 20, 2021)
- Renesas rolls out a global network of technology partners (Oct. 20, 2021)
- Cadence Introduces Comprehensive Safety Solution for Faster Certification of Automotive and Industrial Designs (Oct. 19, 2021)
- MegaChips Deploys Omni Design's Silicon-Validated Data Converters (Oct 19, 2021)
- Alibaba Cloud Unveils New Server Chips to Optimize Cloud Computing Services (Oct 19, 2021)
- Arm transforms the economics of IoT with Virtual Hardware and a new solutions-led offering (Oct. 19, 2021)
- eTopus introduces 400G(4x100G) LR IP solution incorporating new FEC & ePHY with combined latency of sub 10ns (Oct. 19, 2021)
- Enabling end-to-end 5G networks on Arm (Oct 19, 2021)
- GlobalFoundries Announces Launch of Initial Public Offering (Oct. 19, 2021)
- MIPI RFFE (RF Front-End Control Interface) v3.0 Master and Slave Controller IP Cores for ultimate control of your RF Front-end Cellular or Base station SoC's with Low Power Consumption and Reduced Latencies (Oct 19, 2021)
- Arteris IP FlexNoC Interconnect Licensed by Eyenix for AI-Enabled Imaging/Digital Camera SoC (Oct. 19, 2021)
- Omni Design Announces Silicon Validated Data Converters on TSMC 16nm Process (Oct 19, 2021)
- Synopsys, Dassault Systèmes team for lighting digital twin (Oct. 19, 2021)
- Imec licenses Covid detection technology (Oct. 19, 2021)
- proteanTecs to Present at the TSMC 2021 Open Innovation Platform® (OIP) Ecosystem Forum (Oct. 19, 2021)
- GlobalFoundries seeks $25 bln valuation in U.S. IPO as chip demand soars (Oct. 19, 2021)
- PragmatIC Semiconductor Secures $80 Million Funding (Oct 18, 2021)
- Imperas Models for Arm Processors now available in TESSY by Razorcat (Oct. 18, 2021)
- Defacto enables ETRI to Automate IP Integration and Build Complex AI Chips (Oct 18, 2021)
- Global Silicon Wafer Shipments Projected to Log Robust Growth Through 2024, SEMI Reports (Oct 18, 2021)
- TSMC Roadmap Update: 3nm in Q1 2023, 3nm Enhanced in 2024, 2nm in 2025 (Oct. 18, 2021)
- Semiconductor Industry Veteran Doug Ridge Has Joined CAST, Inc. (Oct. 15, 2021)
- Samsung Foundry Promises Gate All-Around in '22 (Oct. 14, 2021)
- Rambus Announces Departure of Chief Financial Officer (Oct. 14, 2021)
- Samsung Foundry Promises Gate All-Around in '22 (Oct 14, 2021)
- intoPIX delivers new JPEG XS 4K60 HDMI evaluation design on Intel Cyclone 10 GX Development Platform (Oct. 14, 2021)
- IC Industry at Heart of Possible China Takeover of Taiwan (Oct. 14, 2021)
- Electronic System Design Industry Logs Double-Digit Q2 2021 Year-Over-Year Revenue Growth, ESD Alliance Reports (Oct 14, 2021)
- TSMC Reports Third Quarter EPS of NT$6.03 (Oct 14, 2021)
- CrossBar Announces New ReRAM Use for FTP and OTP Memory Applications (Oct 14, 2021)
- New Siemens Aprisa IC place-and-route software version targets faster time-to-market with performance improvements (Oct 14, 2021)
- SmartDV Announces Reusable Plug-and-Play Validation Solution to Test Prototype Silicon (Oct 14, 2021)
- TechInsights Acquires The Linley Group to Further Expand Its Platform of Semiconductor Content (Oct 14, 2021)
- Agile Analog Names In-Q-Tel as Newest Investor, Demonstrating Endorsement in Company's disruptive analog IP offering (Oct. 13, 2021)
- Wi-Fi 802.11 ax + Bluetooth LE v5.3 + 15.4 2.4GHz RF Transceiver IP Core in 22nm ULL, available for immediate licensing for IoT applications. (Oct. 13, 2021)
- Alphawave IP announces production availability of new PCIe-CXL solution on TSMC N5 process for storage and broader chiplet market (Oct. 13, 2021)
- Rambus Advances Server Memory Performance with the Industry's First 5600 MT/s DDR5 Registering Clock Driver (Oct. 13, 2021)
- Europe to extend investigation of Nvidia-ARM deal (Oct. 13, 2021)
- RISC-V player announces expansion of US operation (Oct. 13, 2021)
- GlobalFoundries' IPO will not soothe semiconductor shortage, says GlobalData (Oct. 13, 2021)
- Silex Insight announces record-breaking speed for their ChaCha20-Poly1305 solution - 800Gbps (ASIC) / 100Gbps (FPGA) (Oct. 12, 2021)
- MosChip Announces Multi-Protocol Long Range 8G SerDes PHY in 28nm (Oct. 12, 2021)
- Just how impactful will TSMC and Sony's semiconductor factory be? (Oct. 12, 2021)
- Samsung Starts Mass Production of Most Advanced 14nm EUV DDR5 DRAM (Oct. 12, 2021)
- China's 14th Five Year Plan and what it means for data centers (Oct. 12, 2021)
- France in €6bn boost for semiconductors (Oct. 12, 2021)
- What's driving the acquisitions in the analog design realm? (Oct 11, 2021)
- Softbank Leads $50M Series C Funding for Cornami to Bring Real-Time Fully Homomorphic Encryption (FHE) to Market (Oct. 11, 2021)
- Thalia's IP reuse platform joins Cadence Connections EDA Program (Oct. 11, 2021)
- Andes Technology USA Corp. Announces Major Expansion of Its U.S. Operation (Oct. 11, 2021)
- CFX announces commercial availability of anti-fuse OTP technology on 40nm Logic process (Oct. 11, 2021)
- 10/100/1000 Gigabit Ethernet PHY IP Cores including MAC Controller is available for immediate licensing for your advanced SOC to drive Data faster and farther (Oct 11, 2021)
- MIPI Alliance Completes Development of A-PHY v1.1, Doubling Maximum Data Rate and Adding New Options to Automotive SerDes Interface (Oct. 11, 2021)
- intoPIX releases RTP Packetization IP-cores for JPEG XS Video Encapsulation over SMPTE 2110-22 (Oct. 08, 2021)
- TSMC September 2021 Revenue Report (Oct 08, 2021)
- Victoria Hull Is The Independent Non-Executive Director of Alphawave IP Group plc (LON:AWE) And They Just Picked Up 322% More Shares (Oct. 08, 2021)
- Green Hills Software Expands INTEGRITY Support to Include RISC-V Architecture (Oct. 07, 2021)
- Interlaken IP Core for high-speed chip-to-chip applications is now available (Oct. 07, 2021)
- Cadence Accelerates System Innovation with Breakthrough Integrity 3D-IC Platform (Oct. 07, 2021)
- Intel backs RISC-V for Nios FPGA processor (Oct. 07, 2021)
- Samsung Foundry Innovations Power the Future of Big Data, AI/ML and Smart, Connected Devices (Oct. 07, 2021)
- Synopsys Accelerates Multi-Die Designs with Industry's First Complete HBM3 IP and Verification Solutions (Oct. 07, 2021)
- How a Global Foundry Is Losing Money in a Chip Boom (Oct. 06, 2021)
- Addressing the growing threat of firmware attacks on enterprise edge computing platforms (Oct. 06, 2021)
- Rambus Delivers CXL 2.0 Controller with Industry-leading Zero-Latency IDE (Oct. 06, 2021)
- UMC Reports Sales for September 2021 (Oct 06, 2021)
- Marvell Completes Acquisition of Innovium (Oct. 06, 2021)
- Logic Fruit handed over ARINC818 based Single Board Computer to Hon'able RM at DRDO Directors' Conclave (Oct 06, 2021)
- OPENEDGES and The Six Semi Announce Silicon Proven LPDDR5/4/4x PHY in Samsung Foundry 14LPP Technology Operating at 6400Mbps (Oct. 06, 2021)
- Marvell Extends Data Infrastructure Leadership with TSMC 3nm Platform (Oct. 06, 2021)
- NeuroBlade Raises $83 Million in Series B Funding to Massively Accelerate Data Analytics (Oct 06, 2021)
- Invia partners with Running Springs Technology (Oct. 06, 2021)
- LeapMind Announces the Beta Release of their Ultra-low Power Consumption AI Inference Accelerator IP (Oct. 05, 2021)
- EdgeCortix Acquires Multiple Patents for Dynamic Neural Accelerator AI Processor Technology (Oct. 05, 2021)
- GlobalFoundries Files Registration Statement for Proposed Initial Public Offering (Oct. 05, 2021)
- Global Semiconductor Sales Increase 29.7% Year-to-Year, 3.3% Month-to-Month in August (Oct. 05, 2021)
- Next generation intelligent wearables enabled by sureCore's ultra-low power memory (Oct. 05, 2021)
- intoPIX and Lattice to Showcase Latest FPGA-based Lossless Compression Solutions at Vision 2021 (Oct. 05, 2021)
- GUC Monthly Sales Report - September 2021 (Oct 05, 2021)
- Thalia announces new CEO and board structure to support continued growth (Oct. 05, 2021)
- Renesas expands MCU family with Arm Cortex-M33-based devices (Oct. 05, 2021)
- Codasip Announces UK Hiring for RISC-V Development (Oct. 05, 2021)
- Israeli Startup Democratizes Hyperspectral Imaging (Oct. 05, 2021)
- Renesas acquisition of Dialog strengthens Farnell's semiconductor portfolio (Oct. 05, 2021)
- Alphacore Inc.: We're partners in the GF FDX Network (Oct. 04, 2021)
- Weebit demonstrates successful scaling of its ReRAM technology to 28nm (Oct. 04, 2021)
- Sondrel India staff numbers to double to handle new business (Oct. 04, 2021)
- Arteris IP Announces Filing of Registration Statement for Proposal Initial Public Offering (Oct. 04, 2021)
- Can SMIC lead China's semiconductor self-reliance dream? (Oct. 04, 2021)
- Weebit scale ReRAM to 28nm (Oct. 04, 2021)
- Arm CEO Simon Segars On The Chip Crisis, A New Computing Era And Nvidia's $54 Billion Bid For His Company (Oct. 04, 2021)
- QuickLogic Announces Strategic Investment by Current Shareholders; Enhances Outlook for the Third Quarter (Oct. 01, 2021)
- Arasan announces its Total MIPI Soundwire IP Solution with the launch of its Soundwire PHY IP (Oct. 01, 2021)
- WiLAN Signs Wireless License with Motorola (Oct 01, 2021)
- Is It Too Late To Consider Buying Soitec S.A. (EPA:SOI)? (Oct. 01, 2021)
- FortifyIQ Revolutionizes Hardware Security Analysis with Pre-silicon Security Verification (Sept. 30, 2021)
- CEVA, Beken and VisiSonics Announce Reference Design for 3D Spatial Audio in Headsets and TWS Earbuds (Sept. 30, 2021)
- GBT is Developing an EDA Technology For Automatic Generation of Integrated Circuits Layout IPs (Sep 30, 2021)
- Moore's Law Could Ride EUV for 10 More Years (Sep 30, 2021)
- A Feasible Alternative to FDSOI and FinFET: Optimization of W/La2O3/Si Planar PMOS with 14 nm Gate-Length (Sept. 30, 2021)
- Comparison of One and Two Stage RF Rectifiers Designed in FDSOI 28 nm and BiCMOS 55 nm (Sept. 30, 2021)
- Lights, Camera, Action: Xilinx Powers Sony's New-Gen Live Production Video Switcher (Sept. 29, 2021)
- Arteris IP Announces 4D LiDAR Pioneer Aeva as its 200th Customer (Sept. 29, 2021)
- Chip M&A Deals Reach $22 Billion in First Eight Months of 2021 (Sep 29, 2021)
- Chiplet Strategy is Key to Addressing Compute Density Challenges (Sept. 29, 2021)
- Samsung raises foundry chip prices for Qualcomm, Tesla (Sept. 29, 2021)
- Fraunhofer IPMS presents a scalable TSN multiport switch at the TSN/A conference (Sept. 29, 2021)
- SoC-e Announces 10G Multiport TSN Switch Release (Sep 29, 2021)
- Faraday Announces the Success of Its ARM-based SoCs in Wide Ranging Applications (Sept. 28, 2021)
- intoPIX extends its range of TICO-RAW IP-cores with smaller architectures supporting a wider range of image sensors and cameras (Sept. 28, 2021)
- Intrinsic ID Announces NIST-Certified Software Random Number Generator (Zign RNG) for IoT Devices (Sept. 28, 2021)
- Tiempo Secure in collaboration with CEA makes the Internet of Things more resilient with French Government support (Sept. 28, 2021)
- Siemens introduces mPower power integrity solution for analog, digital and mixed-signal IC designs (Sep 28, 2021)
- Bluespec, Inc. Releases Ultra-Low Footprint RISC-V Processor Family for Xilinx FPGAs, Offers Free Quick-Start Evaluation. (Sep 28, 2021)
- 6,000 RISC-V Cores on a Xilinx FPGA Break the CoreScore World Record (Sept. 28, 2021)
- CMC Microsystems helps launch 250 Canadian tech start-ups over 25-years (Sept. 28, 2021)
- Imagination and Tencent WeTest carry out in-depth cooperation to help developers obtain key report on GPU (Sept. 27, 2021)
- Spin-Orbit-Torque Tackles MRAM Constraints (Sep 27, 2021)
- Intel Breaks Ground on Two New Leading-Edge Chip Factories in Arizona (Sept. 27, 2021)
- Synopsys Achieves AIM Photonics Certification (Sept. 27, 2021)
- Mercury Systems to acquire Avalex Technologies Corporation (Sep 27, 2021)
- Building a foundation for our digital future: Say hello to Xcelerator as a Service (Sep 27, 2021)
- Innatera's Neuromorphic AI Chip to Accelerate Spiking Neural Networks (Sept. 27, 2021)
- SiPearl opens design centre in Grenoble, looks for 50 engineers (Sept. 27, 2021)
- Samsung: Real foundry competitor could be Intel (Sept. 27, 2021)
- Symphonie aims high in EC call for satellite connectivity (Sept. 27, 2021)
- Semiconductor Manufacturing International Corp (SMIC) gears up to double its production by 2025 (Sept. 25, 2021)
- Daejin semiconductor, takes over the distribution of Dolphin Design in Korea (Sept. 24, 2021)
- Rambus and Kioxia Renew Patent License Agreement (Sept. 23, 2021)
- Lattice mVision Solution Stack Enables 4K Video Processing at Low Power for Embedded Vision Applications (Sep 23, 2021)
- Cadence Accelerates Development of Mobile, Automotive and Hyperscale Systems with the Helium Virtual and Hybrid Studio (Sep 23, 2021)
- Xilinx and NEC Accelerate Next-Generation 5G Radio Units for Global Deployment (Sept. 23, 2021)
- Syntiant Unveils NDP200 Neural Decision Processor for Always-On Vision Edge AI Applications (Sep 23, 2021)
- Strategic Investment in proteanTecs from Industry Leaders MediaTek and Advantest Joined by Porsche Automobil Holding SE to Advance Electronics Health Monitoring (Sept. 23, 2021)
- Allegro DVT and Beamr Announce the World's First Content-Adaptive Silicon IP Video Encoder (Sept. 23, 2021)
- NEWRACOM Introduces First Wi-Fi HaLow Sensor Solution (Sep 23, 2021)
- Foundry Market Tracking Toward Record-tying 23% Growth in 2021 (Sep 23, 2021)
- Cloud Net Partnership Eyes Military IoT (Sept. 23, 2021)
- Four automotive functional safety mistakes that must be avoided (Sept. 23, 2021)
- Alphawave IP: Interim results for the 6 months to 30 June 2021 (Sept. 22, 2021)
- EPI EPAC1.0 RISC-V Test Chip Samples Delivered (Sept. 22, 2021)
- Samsung Foundry Certifies Synopsys PrimeLib Unified Library Characterization and Validation Solution at 5nm, 4nm and 3nm Process Nodes (Sept. 22, 2021)
- Taiwan's TSMC tapped by Intel to produce GPUs (Sept. 22, 2021)
- Foundry sales set for 23% increase (Sept. 22, 2021)
- Xiphera expands its Advanced Encryption Standard portfolio (Sept. 22, 2021)
- Enabling Cryogenic Chip Design and the Scaling of Quantum Computers (Sept. 21, 2021)
- 100G MAC and 100G PCS IP Cores for high performance applications are now available (Sept. 21, 2021)
- DCD-SEMI introduces octa SPI IP Core for smart wear, audio and mobile (Sep 21, 2021)
- Codasip Opens UK Design Center led by Simon Bewick (Sept. 21, 2021)
- Update to Royalty-Free MIPI I3C Basic Utility and Control Bus Specification Boosts Speed and Flexibility (Sept. 21, 2021)
- Movellus launches global distribution partners to accelerate adoption of its Intelligent Clock Network IP (Sept. 21, 2021)
- Collaboration validates 12G interconnect for high-speed IP (Sept. 21, 2021)
- RISC-V to Shake Up $8.6B Semiconductor IP Market (Sept. 21, 2021)
- Renesas looks to accelerate deep learning development for ADAS applications (Sept. 21, 2021)
- Revenue of Top 10 IC Design (Fabless) Companies Reaches US$29.8 Billion for 2Q21, Though Growth May Potentially Slow in 2H21, Says TrendForce (Sept. 20, 2021)
- Synopsys Advances Processor IP Leadership with New ARC DSP IP Solutions for Low-Power Embedded SoCs (Sept. 20, 2021)
- SkyWater Technology Joins CHIPS Alliance to Further Efforts to Make Chip Design and Production More Accessible (Sep 20, 2021)
- Global Fab Equipment Spending Projected to Reach New High of Nearly $100 Billion in 2022, SEMI Reports (Sept. 20, 2021)
- AI Processor Chipmaker Deep Vision Raises $35 Million in Series B Funding (Sep 20, 2021)
- RISC-V Launches the Open Hardware Diversity Alliance (Sept. 20, 2021)
- CMC and Edgewater Wireless Accelerate Commercialization of Game-Changing Technology (Sept. 20, 2021)
- Building a quantum future (Sept. 20, 2021)
- SMIC and TSMC respond to the semiconductor shortage (Sept. 17, 2021)
- US chipmaker GlobalFoundries to double auto chip output for 2021 (Sept. 16, 2021)
- intoPIX Releases a New Range of Compact Encoders and Decoders for JPEG XS (Sept. 16, 2021)
- GlobalFoundries Unveils Innovative Solutions that Deliver a New Era of More in Semiconductor Manufacturing (Sept. 16, 2021)
- GlobalFoundries and Qualcomm Sign Agreement to Deliver Advanced 5G RF Front-End Products (Sep 16, 2021)
- MoSys and Peraso Technologies Announce Definitive Agreement for Business Combination (Sep 16, 2021)
- Elissa Murphy Joins GlobalFoundries Board (Sep 16, 2021)
- Ken Potts joins the Alphacore team as Chief Operating Officer (Sep 16, 2021)
- Visit Alphacore Interactive Virtual booth at the 2021 GlobalFoundries Technology Summit (GTS) Virtual Conference beginning Sept. 15, 2021 (Sep 16, 2021)
- Xiphera launches solutions for encrypted data storage (Sept. 16, 2021)
- GUC supports TSMC's 3nm technology at 0.75V (Sept. 16, 2021)
- Movellus Hires Semiconductor Industry Veteran Matthew Raggett as VP of Growth (Sept. 15, 2021)
- Amphenol ICC Develops 112Gb/s Interconnect Technology with eTopus Products for High Speed IP Solutions (Sep 15, 2021)
- Siemens' Aprisa place-and-route solution now certified for GlobalFoundries' 22FDX platform (Sept. 15, 2021)
- New Arm Technologies to Transform the Software-defined Future for the Automotive Industry (Sept. 15, 2021)
- TSMC forecast to post 24% revenue growth in 2021, says IC Insights (Sept. 15, 2021)
- The analog side of the embedded security in SoC designs (Sept. 15, 2021)
- Apple A15 Bionic processor features 15 billion transistors manufactured at 5nm (Sept. 15, 2021)
- Cadence Collaborates with GlobalFoundries to Qualify Pegasus Verification System for 12LP/12LP+ and 22FDX™ Technologies (Sept. 15, 2021)
- GF and Synopsys Deliver New Reference Flows for GF 22FDX Process: Cloud-Qualified and First Automotive Flow for ASIL-D Designs (Sept. 15, 2021)
- EU must offer €20bn if it wants more chip production, says Soitec chief (Sept. 15, 2021)
- What happens when foundries ramp up prices for semiconductor chips? (Sept. 15, 2021)
- Dutch AI Semiconductor Startup Axelera AI Launches With $12 Million Seed Round (Sept. 15, 2021)
- Synopsys Accelerates Most Stringent Functional Safety Certification of NSITEXE RISC-V Parallel Processor IP (Sept. 14, 2021)
- Analog Circuit Works Adopts Diakopto's ParagonX Platform for High-Performance Analog Circuit IP (Sep 14, 2021)
- Synopsys Appoints Sassine Ghazi as President and Chief Operating Officer; Chi-Foon Chan to Transition from co-CEO Role (Sep 14, 2021)
- Renesas and OmniVision Deliver Integrated Reference Design For Automotive Camera Systems (Sept. 14, 2021)
- SmartDV Provides Broad Portfolio of Memory Modeling, Design and Verification Solutions (Sep 14, 2021)
- Mixel Announces Immediate Availability of MIPI C-PHY/D-PHY Combo IP on TSMC N5 Process (Sept. 14, 2021)
- Extending battery lifespans for IoT devices (Sept. 14, 2021)
- Intel Set to Chase Samsung Electronics in Foundry Business (Sept. 14, 2021)
- NXP teams for Tensilica's latest AI cores (Sept. 14, 2021)
- Leti combines nine research tracks for sustainable electronics (Sept. 14, 2021)
- 3Q21 Earnings Outlooks Bode Well for Most Leading Semi Suppliers (Sept. 13, 2021)
- Imagination looking at IPO or sale (Sept. 13, 2021)
- Synopsys PrimeSim Reliability Analysis Solution Accelerates Design of Hyper-Convergent ICs for Mission-Critical Applications (Sept. 13, 2021)
- Cadence Accelerates Intelligent SoC Development with Comprehensive On-Device Tensilica AI Platform (Sept. 13, 2021)
- MIPI UFS v3.1 Ctrl., MIPI UniPro v1.8 Ctrl. & MIPI M-PHY v4.1 IP Cores in 12nm & 28nm available for immediate licensing for high performance serial interface applications (Sep 13, 2021)
- CMC appoints new executive (Sept. 11, 2021)
- TSMC August 2021 Revenue Report (Sep 10, 2021)
- Codasip Strengthens Senior Leadership Team (Sept. 09, 2021)
- eMemory's Security-Enhanced OTP IP Qualified on TSMC N6 Process (Sep 09, 2021)
- System Level Solutions's eUSB 3.1 Gen2 Device Controller (eUSB31SF) IP core now available with Isochronous transfer support (Sep 09, 2021)
- Attopsemi's I-fuse OTP IP Embedded into NJR's Products (Sep 09, 2021)
- Weebit and SkyWater Announce Agreement to take ReRAM Technology to Volume Production (Sep 09, 2021)
- Aviva Technology Holding Raises $26.5M Series A Financing to Accelerate Automotive Connectivity (Sept. 09, 2021)
- Efinix Announces AEC-Q100 Qualification and Automotive Product Line Initiative (Sep 09, 2021)
- Intel to invest $95bn in Europe over 10 years, says CEO (Sep 09, 2021)
- EnSilica opens new design centre, starts recruitment drive (Sept. 08, 2021)
- Credo Introduces Seagull 110 and Seagull XR8 PAM4 DSPs for High-Density Datacenters (Sept. 08, 2021)
- QuickLogic Announces Australis eFPGA IP Generator (Sep 08, 2021)
- Flex Logix to speak at the 2021 AI Hardware Summit on Optimizing AI Inference Performance (Sept. 08, 2021)
- Andes Technology Corp. Brings Its Broad Family of RISC-V CPU IP to the Silicon Catalyst Semiconductor Incubator (Sept. 08, 2021)
- ZeroPoint Technologies raises EUR 2.5 million in seed funding (Sep 08, 2021)
- Cadence and Samsung Accelerate 3nm Mixed-Signal Silicon (Sept. 08, 2021)
- AMD and Arm Form the Backbone of EU's 400 Petaflops "EuroExa" Supercomputer (Sept. 08, 2021)
- S.Korea kicks off AI strategy talks with Naver, Kakao, Samsung, telcos (Sept. 08, 2021)
- UMC and Chipbond to Establish Strategic Cooperation (Sept. 07, 2021)
- VisualSim Cloud brings popular System-Level Modeling Solution to the Browser (Sep 07, 2021)
- Global Semiconductor Sales in July Up 29.0% Year-to-Year, 2.1% Month-to-Month (Sep 07, 2021)
- Second Quarter 2021 Global Semiconductor Equipment Billings Surge 48% Year-Over-Year to Record High of $24 Billion, SEMI Reports (Sep 07, 2021)
- Semiconductors: a strategic industry ripe for UK leadership (Sep 07, 2021)
- Omni Design Opens Design Center in Fort Collins, Colorado (Sep 07, 2021)
- Arteris IP FlexNoC Interconnect Licensed for Use in SK Telecom SAPEON AI Chips (Sep 07, 2021)
- Agile Analog and Silex Insight form partnership to offer combined analog and digital IP solutions to provide advanced security and protection against side-channel attacks (SCA) for chip manufacturers (Sept. 07, 2021)
- Sondrel's IP platform provides powerful computing at the Edge with integrated Arm security subsystem (Sep 07, 2021)
- Omni Design and LeddarTech Collaborate to Accelerate Mass Market Deployment of LiDAR for ADAS and Autonomous Vehicles (Sept. 07, 2021)
- Nvidia CUDA Software Gets Ported to Open-Source RISC-V GPGPU Project (Sept. 07, 2021)
- Credo Expands AEC (Active Electrical Cable) Family with Second Generation HiWire™ Low Power SPAN AEC (Sept. 07, 2021)
- Auto LiDAR set for 111% CAGR 2020-26 (Sept. 06, 2021)
- Samsung considering Taylor for Texas fab (Sept. 06, 2021)
- UMC Reports Sales for August 2021 (Sept. 06, 2021)
- GUC Monthly Sales Report - Aug 2021 (Sept. 06, 2021)
- Quantum-driven semiconductor IP for IoT security verified as PSA Certified Level 2 Ready (Sept. 06, 2021)
- Quantum security IP certified to PSA level 2 (Sept. 06, 2021)
- 40 GHz VCO and Frequency Divider in 28 nm FD-SOI CMOS Technology for Automotive Radar Sensors (Sept. 06, 2021)
- Renesas, Dialog tie-up yields new 'Winning Combinations' (Sept. 06, 2021)
- Soitec inaugurates new logistics center and receives "Vitrine Industrie du Futur" award (Sept. 06, 2021)
- VESA Introduces New DisplayHDR True Black 600 Performance Tier Targeting Higher Luminance HDR Levels for OLED and other Emissive Display Technologies (Sep 03, 2021)
- Synopsys Completes the Acquisition of the Semiconductor and Flat Panel Display Solutions from BISTel (Sep 03, 2021)
- Silvaco Announces Resignation of CEO (Sep 03, 2021)
- MIPI D-PHY v3.0 Doubles Data Rate of Physical Layer Interface While Extending Power Efficiency (Sep 03, 2021)
- Apple exploring open-source RISC-V chips, but almost certainly not instead of ARM (Sept. 03, 2021)
- AccelerComm announces 5G O-RAN standards-compliant base station accelerator based on Silicom's N5010 platform (Sep 02, 2021)
- Ventana Micro Systems Inc., the RISC-V Performance Leader, Raises $38 Million in Series B Funding (Sep 02, 2021)
- SEMI Anti-Piracy Server Certification Protocol for Software License Management Reaches Key Milestone (Sep 02, 2021)
- BSC executes, for the first time, big encrypted neural networks using Intel Optane Persistent Memory and Intel Xeon Scalable Processors (Sep 02, 2021)
- Emerging Memories Look to Displace NOR, SRAM (Sep 02, 2021)
- TSMC hikes prices (Sep 02, 2021)
- Foundry Revenue Hits Record Anew with 6% QoQ Growth in 2Q 2021 (Sept. 01, 2021)
- Taiwan's TSMC asking suppliers to reduce prices by 15% (Sept. 01, 2021)
- Viewpoint: How AI is changing the way we think about memory (Sept. 01, 2021)
- Reports: ARM China makes independent move in autonomous driving (Sep 01, 2021)
- sureCore announces development of cryo-CMOS IP that will unlock Quantum Computing's potential (Sep 01, 2021)
- Weebit Nano broadens its technology portfolio to further bolster its ReRAM capability and expand commercialisation opportunities (Sep 01, 2021)
- Achronix and Signoff Semiconductors Partner for AI/ML FPGA and eFPGA IP Design Services (Sep 01, 2021)
- Tachyum Boots Linux on Prodigy FPGA (Sep 01, 2021)
- Semiconductor veterans gather to design customizable, chiplet-based RISC-V server processors (Sept. 01, 2021)
- QuickLogic Announces New eFPGA Contract (Sept. 01, 2021)
- Renesas completes Dialog acquisition with IoT/Industrial designs (Aug. 31, 2021)
- EPFL launches quantum computing and technology centre (Aug. 31, 2021)
- Photonic Chips for Fault-Tolerance Quantum Computing (Aug. 31, 2021)
- Xilinx and Motovis Introduce Complete Hardware and Software Solution to Further Automotive Forward Camera Innovation (Aug. 31, 2021)
- Renesas Completes Acquisition of Dialog Semiconductor (Aug 31, 2021)
- GUC Announces Industry Highest Bandwidth and Power Efficient Die-to-Die (GLink 2.0) Total Solution (Aug 31, 2021)
- Haawking licenses SEGGER's emRun for RISC-V (Aug 31, 2021)
- Foundry Revenue for 2Q21 Reaches Historical High Once Again with 6% QoQ Growth Thanks to Increased ASP and Persistent Demand, Says TrendForce (Aug 31, 2021)
- Rambus Demonstrates Industry-first PCIe 5.0 Digital Controller IP for FPGAs (Aug 31, 2021)
- Synaptics to Acquire DSP Group, Expanding Leadership in Low Power AI Technology (Aug 31, 2021)
- Soitec and Grenoble Alpes University's IUT1 join forces to develop skills in microelectronics (Aug. 31, 2021)
- Microprocessor Sales Will Continue Double-Digit Growth in 2021 (Aug 30, 2021)
- TSMC price rise to drive global equipment costs (Aug. 30, 2021)
- Imagination Technologies to design RISC-V cores (Aug. 28, 2021)
- Xenergic joins GlobalFoundries FDX Network (Aug 27, 2021)
- Can AI Design a Better Chip Than a Human? (Aug 27, 2021)
- Microprocessor market to top $100bn in 2021 (Aug. 27, 2021)
- Lattice Semi Tunes its FPGA For Auto Apps (Aug. 26, 2021)
- Espressif Systems Announces an IEEE 802.15.4 + Bluetooth 5 (LE) RISC-V SoC (Aug 26, 2021)
- Synopsys Initiates $175 Million Accelerated Share Repurchase Agreement (Aug 26, 2021)
- Lattice Certus-NX FPGAs Optimized for Automotive Applications (Aug 26, 2021)
- Cerebras Systems Announces World's First Brain-Scale Artificial Intelligence Solution (Aug 26, 2021)
- North American Semiconductor Equipment Industry Posts July 2021 Billings (Aug 26, 2021)
- UK Regulator Says Nvidia-Arm Deal Could Stifle Innovation (Aug 26, 2021)
- JEDEC Publishes XFM Embedded and Removable Memory Device Standard to Expand Storage Solutions in Embedded and Automotive Applications (Aug 26, 2021)
- Can AI Design a Better Chip Than a Human? (Aug. 26, 2021)
- TSMC shares up on price increase; company declines to comment (Aug. 25, 2021)
- Brainchip looks at transfer and incremental learning - which is more efficient? (Aug. 25, 2021)
- Esperanto Technologies Unveils Energy-Efficient RISC-V-Based Machine Learning Accelerator Chip (Aug 25, 2021)
- Intel Wins US Government Project to Develop Leading-Edge Foundry Ecosystem (Aug 25, 2021)
- Flex Logix Appoints Lee Leibig As Vice President Of Sales For AI Inference (Aug 25, 2021)
- CAES to Enable Critical Infrastructure for Next Generation Lunar Landers (Aug 25, 2021)
- Rambus Preps for HBM3 (Aug. 24, 2021)
- Samsung HBM-PIM AI accelerator converges logic and memory (Aug. 24, 2021)
- eTopus Selects Diakopto's ParagonX Platform for Ultra-High Speed SerDes IP (Aug 24, 2021)
- Engineering recruitment stepped up by surge in demand for ultra-low power memory solutions (Aug 24, 2021)
- Imagination, update on 2021 progress (Aug 24, 2021)
- PragmatIC Semiconductor re-invents the iconic processor that changed the world (Aug 24, 2021)
- TSMC Confirms 3nm Delay (Aug. 24, 2021)
- IBM claims its new processor can detect fraud in real time (Aug. 24, 2021)
- Rambus Preps for HBM3 (Aug. 24, 2021)
- Synopsys Enables First-Pass Silicon Success for Achronix's New FPGA for Data and AI Acceleration Applications (Aug 24, 2021)
- Quantum Computing Technologies Highlight CMC Microsystems' Plan to Accelerate High Tech Manufacturing in Canada (Aug. 24, 2021)
- MIPI DSI-2 boosts user-experience in mobile/automotive displays (Aug. 24, 2021)
- Rambus HBM3-Ready Memory Subsystem Advances AI/ML Performance (Aug. 23, 2021)
- BAE Systems collaborates with GlobalFoundries to produce radiation-hardened single board computers for space (Aug 23, 2021)
- Samsung Passes Intel to Become World's Largest Semi Supplier in 2Q21 (Aug 23, 2021)
- ARM Nvidia deal goes to full investigation in the UK (Aug 23, 2021)
- Intel Foundry Services Wins US Defense Contract for Chips with 18A Node (Aug. 23, 2021)
- Diakopto Unveils PrimeX™ - Revolutionary EDA Solution for Top-Hierarchy Power Grid and Signal Net EM/IR (Aug 22, 2022)
- Samsung Overtakes Intel to Become World's Largest Semi Supplier in 2Q 2021 (Aug. 20, 2021)
- Renesas-Dialog deal: MCUs evolving into powerful SoCs (Aug. 20, 2021)
- Nvidia-Arm merger would substantially lessen competition says U.K. government report (Aug. 20, 2021)
- Samsung re-takes No.1 spot (Aug. 20, 2021)
- Dialog launches new family of auto buck converters (Aug. 19, 2021)
- Andes Technology and Cyberon Collaborate to Provide Edge-Computing Voice Recognition Solution on DSP-capable RISC-V Processors (Aug 19, 2021)
- Synopsys Posts Financial Results for Third Quarter Fiscal Year 2021 (Aug 19, 2021)
- Edge-computing voice recognition on DSP-capable RISC-V processors (Aug. 19, 2021)
- Prodapt Acquires Innovative Logic, will Expand to Silicon Valley, and Serve Global Digital Platform Companies (Aug. 19, 2021)
- Hirose and eTopus Technology Develop Combined 112Gbps Interconnect Solution for AI Training Applications (Aug 18, 2021)
- Arasan Chip Systems announces its 2'nd Generation Sureboot QSPI IP (Aug 18, 2021)
- Rambus Completes Acquisition of PLDA (Aug 18, 2021)
- Imec and Xanadu engage in SiN (Aug. 18, 2021)
- Picocom Accelerates 5G Communications SoC Development with Cadence Palladium Emulation (Aug. 18, 2021)
- Cadence and Tower release RF SOI process (Aug. 17, 2021)
- AV Safety-Report Scorecard Reveals Gaps in Information (Aug. 17, 2021)
- Xpeedic EDA Cloud Platform on Microsoft Azure (Aug 17, 2021)
- Major Update to MIPI DSI-2 Specification Enables Advancements in Mobile Displays (Aug 17, 2021)
- BrainChip Receives Akida Chips from Socionext America (Aug. 17, 2021)
- Rambus Advances AI/ML Performance with 8.4 Gbps HBM3-Ready Memory Subsystem (Aug 17, 2021)
- CSEM and USJC team up to develop an ultra-low-power chip (Aug 17, 2021)
- RISC-V wireless chip with Adaptive Body Bias reaches pW power (Aug. 17, 2021)
- AV Safety-Report Scorecard Reveals Gaps in Information (Aug. 17, 2021)
- Tech Investors Remain Bullish on AI Startups (Aug. 17, 2021)
- Intel, Synopsys set for trademark battle (Aug. 17, 2021)
- Motivo, Inc. Raises $12 Million Series A to Accelerate AI-Enabled Chip Design and Improve Manufacturing Yields (Aug 16, 2021)
- Tower Semiconductor and Cadence Announce New Reference Flow for Advanced 5G Communications and Automotive IC Development (Aug 16, 2021)
- Palma Ceia SemiDesign Named to EE Times "Silicon 100 Startups Worth Watching In 2021" (Aug 16, 2021)
- Renesas and Dialog Semiconductor Announce Conclusion of Final Regulatory Review and the Expected Closing Date for Renesas' Proposed Acquisition of Dialog Semiconductor (Aug 16, 2021)
- The Worldwide Semiconductor Market is expected to show an outstanding growth-rate of 25.1 percent in 2021 (Aug 16, 2021)
- Rambus HBM subsystem more than doubles HBM2E speed (Aug. 16, 2021)
- CrossBar Aims to Secure Computing with ReRAM (Aug 16, 2021)
- Cobham to buy Ultra Electronics for £2.57bn (Aug. 16, 2021)
- NVIDIA and the $40bn acquisition of Arm: Will the UK government block it - and should it? (Aug. 16, 2021)
- RISC-V CEO: Biggest opportunity to change computing since the 1980s (Aug. 16, 2021)
- Automotive MCU Market to Surge 23% in 2021 Despite Shortages (Aug. 12, 2021)
- Automotive MCU Sales to Surge 23% in 2021 Despite Shortages (Aug 12, 2021)
- Facebook Open Sources Time Appliance For Data Center Networks (Aug 12, 2021)
- Mid-Range FPGAs Reach the Next Power and Performance Milestone for Edge Compute Systems (Aug 12, 2021)
- Avnu Alliance Announces Silicon Validation Task Group (Aug 12, 2021)
- Precise-ITC FlexO/OTUw IP Core - Optimized Optical Networks (Aug 12, 2021)
- Everybody Wants a Piece of TSMC's 3nm Process Node (Aug. 12, 2021)
- Why Sensor Technology is the Key to Autonomous Vehicles (Aug. 11, 2021)
- Pixilica Signs Development Agreement with SiliconArts for RayCore GPU Core (Aug 10, 2021)
- SiliconArts releases Ray Tracing IP Core to Intel Solutions Marketplace, open source ray tracing APIs on Github (Aug 10, 2021)
- Faraday Accelerates Software Development for IIoT ASIC with SoReal! 2.0 Virtual Platform (Aug 10, 2021)
- Sondrel creates unique modelling flow software to cut ASIC modelling time from months to a few days (Aug 10, 2021)
- TSMC July 2021 Revenue Report (Aug 10, 2021)
- Samsung Introduces the Industry's First 5nm Processor Powering the Next Generation of Wearables (Aug 10, 2021)
- Mythic Licenses Codasip's L30 RISC-V Core for Next-Generation AI Processor (Aug 10, 2021)
- Researchers Develop RISC-V Chip for Quantum-Resistant Encryption (Aug. 10, 2021)
- Mixel Achieves ISO 26262 for Automotive Functional Safety and ISO 9001 Certification for IP Quality Management System (Aug 10, 2021)
- Data Movement Depends on PCIe (Aug. 10, 2021)
- Semiconductor Industry 2.0 (Aug. 10, 2021)
- Securing UART communication interface in embedded IoT devices (Aug. 09, 2021)
- CEVA, Inc. Announces Second Quarter 2021 Financial Results (Aug 09, 2021)
- Chips&Media Announces 1 billion Cumulative Shipments of Multimedia IP (Aug 09, 2021)
- Imec Spinoff Wants to Turn Every Phone into a Spectrometer (Aug. 09, 2021)
- SMIC Q2 revenues up 43% y-o-y (Aug. 06, 2021)
- Global Cloud Market Hits $42B in Q2 (Aug. 05, 2021)
- Chips&Media Expects a Supercycle in Semiconductors This Year (Aug. 05, 2021)
- UMC Reports Sales for July 2021 (Aug 05, 2021)
- SMIC Reports 2021 Second Quarter Results (Aug 05, 2021)
- Robust Growth Rates Expected For Nearly All IC Products in 2021 (Aug 05, 2021)
- AccelerComm joins DARPA Toolbox initiative for advanced communications research projects (Aug 05, 2021)
- GUC Monthly Sales Report - July 2021 (Aug 05, 2021)
- CAST IP Helps Socionext Develop Advanced Autonomous Driving Systems (Aug 05, 2021)
- IBM and the University of Tokyo unveil quantum computer (Aug. 05, 2021)
- UK communications IP provider in US DARPA deal (Aug. 05, 2021)
- TSMC 5nm and 3nm chip production reportedly all booked up (Aug. 05, 2021)
- Intel Outlines Roadmap to Recapture Process Technology Crown by 2025 (Aug. 05, 2021)
- Samsung, TSMC in heated race for industry's smallest 3 nm process node (Aug. 04, 2021)
- StarFive to release open source single board platform Q3 2021 (Aug 04, 2021)
- Arasan Announces the Industry's First ONFI v5.0 Compliant NAND Flash IP (Aug 04, 2021)
- UK government considering blocking Nvidia's $40bn Arm takeover (Aug. 04, 2021)
- Printed Electronics to Enhance both Exteriors and Interiors in EVs (Aug. 03, 2021)
- Marvell to acquire Innovium for $1.1 Billion (Aug 03, 2021)
- Global Semiconductor Sales Increase 29.2% Year-to-Year in June; Q2 Sales Up 8.3% Over Q1 (Aug 03, 2021)
- DVB-S2X/S2/S Demodulator IP Core licensed to a Major Chinese Semiconductor company for integration into an 8K TV SOC (Aug 03, 2021)
- CEO interview: Globalfoundries' Tom Caulfield on the European project (Aug 03, 2021)
- Intrinsic ID Partners with DARPA to Provide Streamlined Access to Industry-Leading PUF Technology (Aug 03, 2021)
- Rambus Reports Second Quarter 2021 Financial Results (Aug 03, 2021)
- Omni Design Announces Silicon Validated Gigasample+ Low Power ADC and DAC on TSMC 28nm Technology (Aug 03, 2021)
- QuickLogic and Zifisense launch TinyML development kit (Aug. 03, 2021)
- IMEC hyperspectral spin-off raises $16 million (Aug. 03, 2021)
- SiFive speeds up RISC-V U74 cores as Canaan unveils a 3-TOPS Kendryte K510 (Aug. 03, 2021)
- New Device Helps Reduce Frequent Charging of Wireless Electronics (Aug. 03, 2021)
- IoE: A New Era in Hyperconnectivity, Opportunities, and Development Challenges (Aug. 03, 2021)
- Breakthrough in AI Cloud systems (Aug. 02, 2021)
- Collaboration looks to accelerate functional safety development for RISC-V (Aug. 02, 2021)
- NSITEXE Announces a RISC-V 32bit CPU supporting ISO26262 ASIL D (Aug 02, 2021)
- IAR Systems collaborates with NSITEXE to accelerate functional safety development for RISC-V (Aug 02, 2021)
- Efabless & OpenROAD Advance Commercial Open Source Chip Design (Aug 02, 2021)
- Imagination opens Cambridge office (Aug 02, 2021)
- NSITEXE achieves world's first RISC-V processor with vector extension certified for ISO 26262 ASIL D ready product (Aug 02, 2021)
- AI blockchain platform makes smart contracts intelligent (Aug. 02, 2021)
- Apple may adopt IPD (Integrated Passive Device), a disruptive miniaturization technology, in 3nm 2022 iDevices (Aug. 02, 2021)
- Akida spiking neural processor could head to FDSOI (Aug. 02, 2021)
- The Nanosheet Transistor Is The Next (And Maybe Last) Step In Moore's Law (Jul. 30, 2021)
- Samsung Electronics in Dilemma between TSMC and Intel (Jul. 30, 2021)
- EU starts quantum network rollout as Ireland signs deal (Jul. 30, 2021)
- Silicon Wafer Shipments Reach New High in Second Quarter 2021, SEMI Reports (Jul 29, 2021)
- Ampere to Acquire OnSpecta to Accelerate AI Inference on Cloud-Native Applications (Jul 29, 2021)
- Optima Design Automation Announces TUV Certification of its Entire Safety Platform for ISO 26262 ASIL-D Functional Safety Verification (Jul 29, 2021)
- SmartDV Leads Industry with Greatest Number of Design and Verification MIPI Protocol Standards Solutions for Mobile Applications (Jul 29, 2021)
- IC Insights Forecasts a 21% Surge in IC Unit Shipments This Year (Jul 29, 2021)
- Tensilica Xtensa processors address stringent automotive safety requirements (Jul. 29, 2021)
- What matters most in Samsung's foundry business? (Jul. 28, 2021)
- Arm's Startup Day Shows its Support for Future Hardware Startups (Jul. 28, 2021)
- Cadence Tensilica Xtensa Processors Address Most Stringent Automotive Functional Safety Requirements with Full ISO 26262 Compliance to ASIL-D (Jul 28, 2021)
- JEDEC Publishes New and Updated Standards for Low Power Memory Devices Used in 5G and AI Applications (Jul 28, 2021)
- DDR Combo PHY & Controller IP Core Silicon Proven in 12nm & 28nm available for immediate licensing (Jul 28, 2021)
- PUFsecurity's PUFiot Helps IoT Devices Meet FIDO Device Onboard Specification (Jul 28, 2021)
- Mercury introduces industry-first heterogeneous processing module with integrated artificial intelligence functionality (Jul. 28, 2021)
- Semiconductor Industry: Foundry Competition Intensifies (Jul. 28, 2021)
- The 2021 RISC-V Summit to Co-Locate with the 58th Design Automation Conference (DAC) in San Francisco (Jul. 28, 2021)
- Taiwan gives TSMC green light for most advanced chip plant (Jul. 28, 2021)
- IoT Pioneer Wiliot Secures $200 Million Investment Round Led by SoftBank Vision Fund 2 (Jul 27, 2021)
- Cadence Announces Anirudh Devgan to Become CEO in December 2021; Lip-Bu Tan to Transition to Role of Executive Chairman at That Time (Jul 27, 2021)
- CAST And Avery Design Systems Expand IP Partnership to Support Next Generation High-Bandwidth Automotive Networking And Control Systems (Jul 27, 2021)
- TU Dresden, University of Manchester and GlobalFoundries Announce SpiNNaker2, a Breakthrough in AI Cloud Systems, Bringing Real-Time AI with below Millisecond Latency and high Energy Efficiency to Cloud Scale (Jul 27, 2021)
- Blaize, leading AI Solution for Edge Computing, Announces $71M Series D Financing to Further Accelerate Growth (Jul 27, 2021)
- Is RISC-V the Future? (Jul. 27, 2021)
- Intel charts path to 1nm - video (Jul. 27, 2021)
- Manchester, Dresden, Globalfoundries produce SpiNNaker2 chip (Jul. 27, 2021)
- Soitec Aims to Triple Revenues by 2026, Joins EU Chip Alliance (Jul. 27, 2021)
- TSMC Shareholders Elect Board of Directors; Board of Directors Unanimously Re-elects Dr. Mark Liu as Chairman and Dr. C.C. Wei as CEO and Vice Chairman (Jul 26, 2021)
- TSMC considers German fab (Jul 26, 2021)
- Bankrupt Tsinghua Unigroup advertises for investors (Jul 26, 2021)
- DDR Combo PHY & Controller IP Core Silicon Proven in 12nm & 28nm available for immediate licencing (Jul 26, 2021)
- BrainChip Discusses AI's Positive Impact on the Human Condition with Public Interest Technology Advocate Katina Michael (Jul. 26, 2021)
- Cadence Extends Digital Design Leadership with Revolutionary ML-based Cerebrus, Delivering Best-in-class Productivity and Quality of Results (Jul 23, 2021)
- Tessent boosts simultaneous analysis of hardware and software in SoC designs (Jul. 23, 2021)
- Agile Analog brings analog IP to RISC-V International (Jul 22, 2021)
- Is TSMC-Sony A Sign Of Things To Come? (Jul 22, 2021)
- NovaSparks Unveil the First FPGA Market Data Aggregator (Jul 22, 2021)
- CEVA Continues to Lead the Way in Wireless Connectivity with Bluetooth 5.3 IP (Jul 22, 2021)
- Achronix Announces Record Second Quarter 2021 Financial Results and Business Highlights (Jul 22, 2021)
- Kameleon Security Adds Investment from Xilinx to Deliver Hardware Cybersecurity for Servers (Jul 22, 2021)
- Moschip Continues to Soar Consecutively for the 6th Quarter (Jul 22, 2021)
- DVB-S2X Wideband Demodulator IP Core from Creonic Now Available with Time-Slicing Support (Annex M) (Jul 22, 2021)
- Winbond's Successful Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Memory Solution (Jul 22, 2021)
- Fraunhofer IIS successfully tests terrestrial IoT technology mioty® via GEO satellite (Jul. 22, 2021)
- U.K. Government to Co-invest £375m in Breakthrough Tech Firms (Jul. 22, 2021)
- Attopsemi's I-fuse OTP IP Now Qualified on a Japanese Wafer Fab's 130nm BCD and Embedded into ABLIC's IC Product (Jul 21, 2021)
- Intel's foundry ambitions could be slowed by lack of deal targets (Jul. 21, 2021)
- ARM shows first plastic M0+ microcontroller (Jul. 21, 2021)
- Mercury teams up with CoreAVI to provide safety-certified solutions (Jul. 21, 2021)
- Adding Intelligence to the Grid (Jul. 21, 2021)
- A natively flexible 32-bit Arm microprocessor (Jul. 21, 2021)
- After 3D printing now comes 4D printing (Jul. 21, 2021)
- GlobalFoundries Plans to Build New Fab in Upstate New York in Private-Public Partnership to Support U.S. Semiconductor Manufacturing (Jul 20, 2021)
- CAES Receives Contract from Vinnova to Advance High Performance RISC-V Space Computing (Jul 20, 2021)
- GOWIN Semiconductor Announces their ISP (Image Signal Processor) IP Core and Solution (Jul 20, 2021)
- CrossBar Announces ReRAM Based PUF Keys (Jul 20, 2021)
- European Commission forms processor, semiconductor alliance (Jul. 20, 2021)
- A surprising new job for RERAM technology (Jul. 20, 2021)
- Agile Analog joins RISC-V International as a strategic member (Jul. 20, 2021)
- Where Will TSMC Be in 5 Years? (Jul. 20, 2021)
- Dolphin Design and CEA-List join forces for a new embedded AI computing platform (Jul 19, 2021)
- Intel in talks to buy Globalfoundries (Jul 19, 2021)
- TSMC in "Due Diligence" on Possible Japan Fab (Jul 19, 2021)
- Samsung Foundry and Synopsys Collaborate to Accelerate Time to ISO 26262 Compliance for Automotive SoCs (Jul. 19, 2021)
- Imperas updates Free reference model riscvOVPsimPlus with new RISC-V P (SIMD/DSP) extension and Architectural Validation Test Suites (Jul 19, 2021)
- Secure-IC establishes new references to secure the Internet of Things (Jul 19, 2021)
- Precise-ITC 1.6T/800G/400G IP Product Series for Datacentre Application (Jul 19, 2021)
- CXL Product Pipeline Gets Flowing (Jul 19, 2021)
- Chip Shortages May Persist Until 2023, Analysts Say (Jul 19, 2021)
- TSMC in 'Due Diligence' on Possible Japan Fab (Jul. 19, 2021)
- $10m for French quantum carbon nanotube startup (Jul. 19, 2021)
- Realtek selects Imagination GPU for use in DTV (Jul 15, 2021)
- Weebit completes design and tape-out of embedded ReRAM module (Jul 15, 2021)
- Xilinx Versal HBM Series with Integrated High Bandwidth Memory Tackles Big Data Compute Challenges in the Network and Cloud (Jul 15, 2021)
- Quantware Launches the World's First Commercially Available Superconducting Quantum Processors, Accelerating the Advent of the Quantum Computer. (Jul 15, 2021)
- Taiwan Maintains Edge as Largest Base for IC Wafer Capacity (Jul 15, 2021)
- Xenergic Raises 40 MSEK In New Share Issue (Jul 15, 2021)
- Accellera Board Approves Security Annotation for Electronic Design Integration Standard 1.0 for Release (Jul 15, 2021)
- Is analog IC fab renaissance in the works? (Jul. 15, 2021)
- TSMC Reports Second Quarter EPS of NT$5.18 (Jul 15, 2021)
- Electronic System Design Industry Logs Record First-Quarter Revenue Growth, ESD Alliance Reports (Jul 15, 2021)
- Samsung Electronics May Apply 3-nm Process to Its Own Chips First (Jul. 14, 2021)
- Russia To Build RISC-V Processors for Laptops: 8-core, 2 GHz, 12nm, 2025 (Jul. 14, 2021)
- Innatera Unveils Neuromorphic AI Chip to Accelerate Spiking Networks (Jul. 14, 2021)
- Rethinking Automotive Electronics Networks (Jul. 14, 2021)
- Taiwan Maintains Lead in IC Wafer Capacity (Jul. 14, 2021)
- Neuromorphic processor leader Innatera appoints Prof. Alberto Sangiovanni-Vincentelli Chairman of Board (Jul 14, 2021)
- Achronix and ACE Convergence Acquisition Corp Mutually Agree to Terminate Merger Agreement (Jul 13, 2021)
- Cadence and UMC Collaborate on 22ULP/ULL Reference Flow Certification for Advanced Consumer, 5G and Automotive Designs (Jul 13, 2021)
- IQ-Analog Adopts Diakopto's ParagonX Platform for Next-Generation 5G Wireless Communications ICs (Jul 13, 2021)
- TTTech Aerospace releases the world's first 1 Gbit/s A664 End System IP certified to the highest civil aviation standards (Jul 13, 2021)
- TSMC looks to 12nm Dresden fab (Jul. 13, 2021)
- China set to achieve 14 nm breakthrough in 2022 (Jul. 13, 2021)
- European startup ships first commercial quantum processor (Jul. 13, 2021)
- RISC-V based XiangShan processor poses another threat to Intel (Jul. 13, 2021)
- IEEE Adopts MIPI A-PHY, First Industry-Standard, Long-Reach SerDes Physical Layer Interface for Automotive Applications (Jul 13, 2021)
- Flexible fab could slash chip shortage (Jul 12, 2021)
- Andes certifies Imperas RISC-V Reference Models for the new RISC-V P (SIMD/DSP) extension (Jul 12, 2021)
- Algolux Closes $18.4 Million Series B Round for Robust Computer Vision (Jul 12, 2021)
- "Insolvent" Tsinghua Unigroup Aims to Restructure (Jul 12, 2021)
- Fraunhofer IPMS RISC-V processor core for functional safety supported by development tools from IAR Systems (Jul 09, 2021)
- Pim Tuyls: IoT Security, Technology Scaling, and Quantum Threats (Jul 09, 2021)
- TSMC June 2021 Revenue Report (Jul 09, 2021)
- TSMC to benefit from change in chip industry (Jul. 09, 2021)
- PUFsecurity Provides Free Access to its Root of Trust and Security Co-Processor Solutions (Jul 08, 2021)
- Faraday Succeeds in 5G NR mmWave ASIC (Jul 08, 2021)
- Another Industry first: Extreme Networking- 1K TCP & UDP Session on intel/Xilinx FPGAs, high availability application performance - 2U Accelerator box with Linux iWARP/RoCE (Jul 08, 2021)
- Liverpool 5G Create and Blu Wireless develop industry-boosting IP (Jul 08, 2021)
- Secure-IC receives the Cybersecurity Made in Europe label (Jul 08, 2021)
- Corigine Delivers a Next-Generation Prototyping System for ASIC and Pre-Silicon Software Development (Jul 07, 2021)
- Another Industry first: Extreme Networking- 1K TCP & UDP Session on intel/Xilinx FPGAs, high availability application performance – 2U Accelerator box with Linux iWARP/RoCE (Jul 07, 2021)
- Solid-State LiDAR Empowers ADAS, Autonomous Driving (Jul. 07, 2021)
- Renesas releases modular IoT development platform (Jul. 07, 2021)
- Aldec launches its first RISC-V PolarFire FPGA emulation board (Jul. 07, 2021)
- Tech's Effects Are Not Always Clear. Here Are 10 Examples That Provides Clarity (Jul. 07, 2021)
- 14nm FinFET production USB3.0/PCIe3.0/SATA3.0/SGMII Combo PHY IP Core, available for immediate licencing. (Jul 07, 2021)
- Winbond, Renesas accelerate building of embedded AI (Jul. 07, 2021)
- Think Silicon and the Aristotle University of Thessaloniki Create a Research Team to Solve Engineering Challenges of Next-Generation Graphics and AI Processors (Jul 06, 2021)
- Global Semiconductor Sales in May Up 26.2% Year-to-Year, 4.1% Month-to-Month (Jul 06, 2021)
- WiLAN Subsidiaries Sign License Agreement with PSMC (Jul 06, 2021)
- Rambus Completes Acquisition of AnalogX (Jul 06, 2021)
- Imec tackles interconnect heating at 1nm (Jul. 06, 2021)
- Andes Technology Announces Over 2 Billion Shipments Of Andes-Embedded SoCs In 2020 (Jul 05, 2021)
- Apple and Intel first to use TSMC 3nm (Jul 05, 2021)
- GUC Monthly Sales Report - June 2021 (Jul 05, 2021)
- Sondrel's SFA 100 IP platform for intelligence gathering chips at the Edge (Jul 05, 2021)
- UMC Reports Sales for June 2021 (Jul 05, 2021)
- Apple and Intel to get first 3nm chips from TSMC (Jul. 05, 2021)
- Open source XiangShan RISC-V processor could eventually challenge ARM Cotex-A76 (Jul. 05, 2021)
- Globalfoundries looks to Dresden fab expansion (Jul. 02, 2021)
- CEA-Leti Appoints New CEO (Jul. 02, 2021)
- Wi-Fi Alliance furthers Automated Frequency Coordination specification and compliance development to accelerate Wi-Fi 6E (Jul 01, 2021)
- BSC, Codeplay and SiFive help accelerate applications on RISC-V thanks to V-extension support in LLVM (Jul 01, 2021)
- Allegro DVT Launches the World's First Hardware-Based VVC/H.266 Decoder Silicon IP (Jul 01, 2021)
- IPrium releases 32-channel J.83B Modulator (Jul 01, 2021)
- PathPartner Collaborates with Intel to Deliver AI-based Weld Defect Detection to the Manufacturing Industry (Jul 01, 2021)
- Plans start for TSMC 2nm fab (Jul 01, 2021)
- Access Advance Launches VVC/H.266 Video Patent Pool (Jul 01, 2021)
- NVMe Gets Refactored (Jul 01, 2021)
- Arteris IP FlexNoC Interconnect Again Licensed by AutoChips for Automotive SoC Product Line (Jun 30, 2021)
- System Level Solutions's USB 2.0 Device Controller IP core is now available for Lattice Semiconductor FPGA platform (Jun 30, 2021)
- Worldwide IC Market Forecast to Top $500 Billion in 2021 (Jun 30, 2021)
- Silicon Creations Selects Diakopto's ParagonX IC Debugging Platform (Jun 30, 2021)
- AnalogX Accelerates Time-to-Market with Diakopto's ParagonX Debugging Platform and Methodology (Jun 30, 2021)
- The wars at the leading edge have begun (Jun. 30, 2021)
- Imperas Expands Partnership with Valtrix to Address Growing RISC-V Verification Market (Jun 30, 2021)
- Enabling the dynamic 5G infrastructure with Arm-based solutions (Jun 30, 2021)
- SiFive Deepens RISC-V Core Lineup (Jun. 30, 2021)
- Simulation of FDSOI-ISFET with Tunable Sensitivity by Temperature and Dual-Gate Structure (Jun. 30, 2021)
- Ultra Low Power Oscillator Design Considerations (<70nW) (Jun. 30, 2021)
- GOWIN Semiconductor Announces Their GoBridge ASSP Product Line with USB Peripheral Bridges (Jun 29, 2021)
- Faraday Announces LPDDR4/4X in Samsung 14LPC Process (Jun 29, 2021)
- QuEST Global acquires Synapse Design to Enhance Expertise in Semiconductor and Connected Engineering (Jun 29, 2021)
- Marvell Extends OCTEON Leadership with Industry's First 5nm DPUs (Jun 29, 2021)
- Quantum-tunnelling semiconductor IP verified as secure against all known IoT attacks (Jun 29, 2021)
- SiFive Collaborates with Imperas on Models of SiFive's RISC-V Core IP Portfolio (Jun 29, 2021)
- Arm-powered Fugaku supercomputer claims #1 spot on Top500 third time in a row (Jun 29, 2021)
- Dialog Semiconductor Expands AC/DC Portfolio, Targeting High Power Density PSUs with Zero Voltage Switching Technology (Jun. 29, 2021)
- Automobile In-Vehicle Networks–Ethernet, SERDES, or Both? (Jun. 29, 2021)
- Driverless Car Group Eyes AV Safety Standard (Jun. 29, 2021)
- Gowin Removed From CCMC List, Withdrawing Lawsuit (Jun 28, 2021)
- Synopsys Strategic Partnership with Samsung Foundry Accelerates Access to Transformative 3nm GAA Technology (Jun 28, 2021)
- BrainChip Taps Former ARM Executive Antonio J. Viana as Non-Executive Director (Jun 28, 2021)
- Intel Shuffles Networking Groups, Product Mix (Jun 28, 2021)
- New Semiconductor Fabs to Spur Surge in Equipment Spending, SEMI Reports (Jun 28, 2021)
- AMIQ EDA Updates UVM Rule Checks for Latest Release of the Universal Verification Methodology Standard (Jun 28, 2021)
- Neurala Raises $12 Million to Scale Artificial Intelligence for Industrial Manufacturing (Jun 28, 2021)
- NVIDIA Aerial 5G Platform Extends Support for Arm (Jun 28, 2021)
- Samsung Foundry tapes out 3nm GAA chip (Jun. 28, 2021)
- Siemens looks to digital twin, IoT to drive growth (Jun. 28, 2021)
- Nvidia's takeover of Arm gets support from Broadcom and other chip heavyweights (Jun. 28, 2021)
- EU launches its €13bn integrated space programme (Jun. 28, 2021)
- Weebit Nano successfully demonstrates integration of selector with ReRAM cell for the stand-alone memory market (Jun 25, 2021)
- New Lattice CertusPro-NX General Purpose FPGAs Deliver Advanced System Bandwidth and Memory Capabilities to Edge Applications (Jun 24, 2021)
- Synopsys PrimeShield Selected by Samsung Electronics to Maximize Energy Efficiency and Performance for Next-Generation Process Node Designs (Jun 24, 2021)
- GUC and Omni Design Tape Out 16nm LiDAR SoC (Jun 24, 2021)
- CEVA Expands Its Market-Leading Wireless Connectivity Portfolio with New Ultra-Wideband Platform IP (Jun 24, 2021)
- AST & Science Selects Omni Design to Provide High Performance Data Converter Solutions for its Cellular Broadband Network (Jun 24, 2021)
- Xilinx Brings Breakthrough to Vivado Design Tools with State-of-the-Art Machine-Learning Optimization for Accelerated Designs (Jun 24, 2021)
- GLOBALFOUNDRIES Breaks Ground on New Fab in Singapore (Jun 24, 2021)
- Advanced driver-assistance systems (ADAS) (Jun. 23, 2021)
- SEGGER and Codasip Announce Cooperation on RISC-V (Jun 23, 2021)
- LeapMind Acquires Patents for Extremely Low Bit Quantization Technology (Jun 23, 2021)
- IAR Systems extends development tools performance capabilities for Andes RISC-V cores (Jun 23, 2021)
- StarFive Adopts Valtrix STING for Verification of Next-generation RISC-V Processors (Jun 23, 2021)
- GlobalFoundries Building New Fab in Singapore (Jun. 23, 2021)
- Intel to offer RISC-V core in 7nm foundry (Jun. 23, 2021)
- GUC Tapes Out AI/HPC/Networking Platform on TSMC CoWoS Technology (Jun. 23, 2021)
- U.S. Blocks Chinese Deal for Magnachip (Jun 23, 2021)
- Arm CCA will put confidential compute in the hands of every developer (Jun 23, 2021)
- Silvaco Names Greg Swyt as Chief Financial Officer (Jun 23, 2021)
- The CertusPro-NX: Lattice Leverages FD-SOI for New Low Power FPGAs (Jun. 23, 2021)
- CMC Microsystems Strategy Aims to Leverage High Tech Manufacturing in Canada (Jun. 23, 2021)
- Intrinsic ID QuiddiKey Hardware IP is Now CAVP Certified by NIST (Jun 22, 2021)
- GLOBALFOUNDRIES Breaks Ground on New Fab in Singapore (Jun 22, 2021)
- SiFive Performance P550 Core Sets New Standard as Highest Performance RISC-V Processor IP (Jun 22, 2021)
- Codasip Announces A71X RISC-V Application Core with Dual-Issue Capability (Jun 22, 2021)
- Alphawave IP Adopts Diakopto's ParagonX EDA Platform and Methodology (Jun 22, 2021)
- Diakopto Unleashes Breakthrough ParagonX EDA Tool, Platform and Methodology to Dramatically Accelerate IC Design Debugging and Optimization (Jun 22, 2021)
- TSMC to prioritize Apple and automaker silicon orders as global semiconductor shortage continues (Jun. 22, 2021)
- Arm Strengthens Framework For IoT Microcontroller Applications (Jun. 22, 2021)
- Synopsys to Acquire Semiconductor and Flat Panel Display Solutions from BISTel (Jun 21, 2021)
- Rebooting Imagination: A Heterogeneous Compute Strategy (Jun 21, 2021)
- Socionext Licenses Flex Logix's Embedded FPGA (eFPGA) for 5G Wireless Base Station Platform (Jun 21, 2021)
- GlobalFoundries Is A Leading-Edge Foundry Despite Claims Otherwise (Jun. 21, 2021)
- New Cadence Tensilica FloatingPoint DSP Family Delivers Scalable Performance for a Broad Range of Compute-Intensive Applications (Jun 18, 2021)
- First Full-fledged Side Channel Attack on HMAC-SHA-2 (Jun 18, 2021)
- Quantum Processors: Pasqal Raises €25m, C12 Quantum Electronics €8.2m (Jun. 18, 2021)
- €8m project for Europe's first RISC-V supercomputer chip (Jun. 18, 2021)
- Inverse-designed ultra-compact high efficiency and low crosstalk optical interconnect based on waveguide crossing and wavelength demultiplexer (Jun. 18, 2021)
- Imec demoes integrated forksheet FETs for 2nm processes (Jun. 17, 2021)
- Market-Optimized 3nm Physical IP for Armv9-based CPUs (Jun 17, 2021)
- CEA-Leti Collaborates with Siemens to Launch Process Design Kit that Supports Multiple Technologies, Simplifies Creation of Optical Circuits (Jun 17, 2021)
- Rambus to Acquire AnalogX, Accelerating Next-Generation Data Center Interface Solutions (Jun 17, 2021)
- Presto Engineering and Cadence Collaborate on IC Packaging for Automotive and IoT Markets (Jun 17, 2021)
- Silicon IP Provider Chips&Media Launches AV1 Video Encoder Hardware IP for 4K/UHD Video Resolutions and Beyond (Jun 17, 2021)
- Advantest Developing Innovative Methodologies for High-Speed Scan and Software-Based Functional Testing (Jun 17, 2021)
- What Are the Quantum Computing Threats to Security? (Jun. 17, 2021)
- SmartDV Joins the Xilinx Partner Program (Jun 17, 2021)
- Synopsys Replenishes Repurchase Authorization up to $500 Million (Jun 17, 2021)
- Qualcomm, MediaTek Fill Vacuum HiSilicon Left in Smartphones (Jun 17, 2021)
- eFabless Joins the Open Source FPGA Foundation as Corporate Member (Jun 17, 2021)
- Silex Insight's TRNG selected for MiG-V from HENSOLDT Cyber (Jun. 17, 2021)
- Spain Outlines Vision for Industrial AI (Jun. 17, 2021)
- ST's Technological Innovations will Shape the Sustainable Future (Jun. 17, 2021)
- TSMC FINFLEX™, N2 Process Innovations Debut at 2022 North American Technology Symposium (Jun 17, 2022)
- IC Insights Raises Its 2021 Worldwide IC Market Forecast to +24% (Jun 16, 2021)
- Kalray Unveils its K200-LP Latest Acceleration Card for Data Centers (Jun 16, 2021)
- Thalia Design Automation partners with Sofics to enhance offering for analog circuit and IP reuse (Jun 16, 2021)
- Semiconductor R&D scorecard shows Europe, China up, Japan down (Jun. 16, 2021)
- Rambus Advances New Era of Data Center Architecture with CXL Memory Interconnect Initiative (Jun 16, 2021)
- Rambus to Acquire PLDA, Extending Leadership with Cutting -Edge CXL and PCI Express Digital IP (Jun 16, 2021)
- STMicroelectronics Delivers First Stellar Advanced Automotive Microcontrollers for New Road-Car Projects (Jun. 16, 2021)
- Pre- to Post-AI Transition to Be "Bigger Than the Internet" (Jun. 16, 2021)
- Nonvolatile programmable silicon photonics using an ultralow-loss Sb2Se3 phase change material (Jun. 16, 2021)
- Linearization Technique of Low Power Opamps in CMOS FD-SOI Technologies (Jun. 16, 2021)
- Graphcore and SiPearl: strategic partnership to combine artificial intelligence and high performance computing (Jun 15, 2021)
- Precise-ITC 800G_AX Ethernet IP Core Optimized for AI Application (Jun 15, 2021)
- TSMC plans to build new semiconductor plant in Japan, creates headaches for its rival Samsung Electronics (Jun. 15, 2021)
- Germany Leads the Autonomous Vehicle Regulation Race (Jun. 15, 2021)
- Updated: Toshiba Claims Breakthrough in Quantum Communication (Jun. 15, 2021)
- GPU Market Headed for a Fall? (Jun 14, 2021)
- SambaNova CEO: Pre- to Post-AI Transition Will Be "Bigger Than the Internet" (Jun 14, 2021)
- DisplayPort (DP, eDP) v1.4 Transmitter & Receiver PHY & Controller IP Cores for advanced SOC supporting 8K resolutions! (Jun 14, 2021)
- Cortus Develops Next Generation High-End RISC-V CPU Core for HPC (Jun 14, 2021)
- IPO Arm, says Qualcomm boss, and we'll buy in (Jun 14, 2021)
- IBM Versus GlobalFoundries: A Lawsuit Instead Of The Power Chips Planned (Jun. 14, 2021)
- Cortus hopes to stake early RISC-V HPC claim (Jun. 14, 2021)
- Semiconductor Industry: Interest Strengthening in RISC-V (Jun. 14, 2021)
- LiDAR solution looks to address transportation infrastructure monitoring (Jun. 14, 2021)
- Why Video Stabilization Needs to be More Flexible (Jun. 12, 2021)
- sureCore & Intrinsic Announce Collaboration to Bring Novel RRAM Technology to Market (Jun 11, 2021)
- Lattice and Infineon Technologies Collaborate to Deliver New Pictor Reference Design Kit (Jun 11, 2021)
- Intel said to have offered $2bn for SiFive (Jun 11, 2021)
- Truechip Announces Customer Shipment of PCIe Gen 6 Verification IP (Jun 11, 2021)
- Sequans Communications Adopts Cadence RF Solution to Develop Next-Generation 5G IoT Platform (Jun 11, 2021)
- Siemens Enhances Nucleus ReadyStart for Arm Platforms (Jun. 10, 2021)
- TSMC approves expansion budget of more than US$9 billion (Jun. 10, 2021)
- Silex Insight launches the all-new VIPER (4K60 4:4:4 AV over IP transmitter/receiver board), ideal for collaboration featuring seamless switching between multiple inputs (2xHDMI/1xUSB-C) (Jun 10, 2021)
- Creonic to Offer End-to-end IP-over-Satellite Solutions (Jun 10, 2021)
- Global Semiconductor Sales Increase 1.9% Month-to-Month in April; Annual Sales Projected to Increase 19.7% in 2021, 8.8% in 2022 (Jun 10, 2021)
- Samsung Successfully Completes 8nm RF Solution Development to Strengthen 5G Communications Chip Solutions (Jun 10, 2021)
- Hardent VESA DSC and FEC IP Cores Licensed by Kinetic Technologies (Jun 10, 2021)
- Bosch opens wafer fab of the future in Dresden (Jun 10, 2021)
- Xilinx Acquires Silexica to Broaden its Developer Base (Jun 10, 2021)
- TSMC May 2021 Revenue Report (Jun 10, 2021)
- Xilinx Extends Edge Compute Leadership with World's Highest AI Performance-per-Watt (Jun 10, 2021)
- Soitec unveils its strategy for 2026 and its target to triple its revenue (Jun. 10, 2021)
- SOI-Based Multi-Channel AWG with Fiber Bragg Grating Sensing Interrogation System (Jun. 10, 2021)
- AndesBoardFarm Enables SoC Designers to Explore RISC-V Processors in Online FPGA Board Collection (Jun 09, 2021)
- New Cadence Allegro X Design Platform Revolutionizes System Design (Jun 09, 2021)
- IBM, GlobalFoundries in Breach-of-Contract Spat (Jun 09, 2021)
- Automotive IC Marketshare Slips in 2020 After Steady Gains Since 1998 (Jun 09, 2021)
- TSMC's Chip Scaling Efforts Reach Crossroads at 2nm (Jun 09, 2021)
- OPENEDGES and The Six Semi Announce Silicon Proven GDDR6 PHY in 12nm Process Technology (Jun 09, 2021)
- Mythic Expands Product Lineup with New Scalable, Power-Efficient Analog Matrix Processor for Edge AI Applications (Jun 08, 2021)
- Arteris IP FlexNoC Interconnect & Resilience Package Again Licensed by Black Sesame for ISO 26262-Compliant Automotive ADAS Chips (Jun 08, 2021)
- GLOBALFOUNDRIES and GlobalWafers Partnering to Expand Semiconductor Wafer Supply (Jun 08, 2021)
- eMemory and PUFsecurity Join DARPA Toolbox Initiative (Jun 08, 2021)
- Xylon Releases a Complete Multi-Channel HDR ISP IP Suite (Jun 08, 2021)
- Synopsys Acquires Code Dx to Extend Application Security Portfolio (Jun 08, 2021)
- GUC Tapes Out AI/HPC/Networking Platform on TSMC CoWoS Technology Validating 7.2 Gbps HBM3 Controller and PHY, GLink-2.5D and 112G-LR SerDes IPs (Jun 08, 2021)
- Siemens acquires proFPGA product family from PRO DESIGN to expand industry-leading IC verification portfolio (Jun 08, 2021)
- TSMC's 3DFabric Technology is the next big wave in Chip Design that Apple will take advantage of in the not-too-distant Future (Jun. 08, 2021)
- RISC-V FPGA SoM module starts production (Jun. 08, 2021)
- Nvidia asks Chinese regulators to approve US$40b Arm deal: FT (Jun. 08, 2021)
- GUC Monthly Sales Report - May 2021 (Jun 07, 2021)
- Palma Ceia SemiDesign Announces New Wi-Fi HaLow Chips, PCS2100 and PCS2500 - Ideal for Industry 4.0 (Jun 07, 2021)
- NVM Express Announces the Rearchitected NVMe 2.0 Library of Specifications (Jun 07, 2021)
- UMC Reports Sales for May 2021 (Jun 07, 2021)
- Siemens EDA Tools Now Qualified on TSMC's N3, N4 Processes (Jun. 07, 2021)
- Cryptography Innovations in Hardware Processors (Jun. 07, 2021)
- Automotive Software & Cybersecurity (Jun. 07, 2021)
- Sondrel launches the fourth IP platform – SFA 350A – that delivers faster time to market for ADAS ASICs (Jun. 03, 2021)
- Sondrel launches the fourth IP platform - SFA 350A - that delivers faster time to market for ADAS ASICs (Jun 03, 2021)
- Brite Semiconductor Releases ONFI 4.2 IO and Physical Layer IP based on SMIC 14nm FinFET Process (Jun 03, 2021)
- Texas Instruments Continues As World's Top Analog IC Supplier (Jun 03, 2021)
- EdgeCortix Collaborates with Cadence to Accelerate AI Chip Design (Jun 03, 2021)
- intoPIX delivers JPEG XS Compressed Solutions for Low Latency Video Streaming with NVIDIA GPUs (Jun 03, 2021)
- Siemens enhances Nucleus ReadyStart for Arm platforms with enhanced debug, security and stability features (Jun 03, 2021)
- SmartDV Announces Support for ARINC Standards with Design and Verification IP (Jun 03, 2021)
- Synopsys Expands Multi-Die Solution Leadership with Industry's Lowest Latency Die-to-Die Controller IP (Jun 03, 2021)
- TSMC's Zhang: Automotive is Going HPC (Jun 03, 2021)
- PLDA and AnalogX Announce Market-leading CXL 2.0 Solution featuring Ultra-low Latency and Power (Jun 02, 2021)
- Aldec Launches HES-DVM Proto "Cloud Edition" - Giving Engineers Easier Access to FPGA-based ASIC & SoC Prototyping (Jun 02, 2021)
- Arm empowers MCU software developers to capitalize on IoT potential (Jun 02, 2021)
- NXP Ramps Automotive Processing Innovation with Two Processors on TSMC 16nm FinFET Technology (Jun 02, 2021)
- PUFsecurity and Andes Technology Cooperate to Integrate Crypto Coprocessor PUFiot into RISC-V AIoT Security Platform (Jun 02, 2021)
- TSMC Unveils Innovations at 2021 Online Technology Symposium (Jun 02, 2021)
- First step in its Multi-Codec HEVC and VVC Platform Initiative (Jun 02, 2021)
- TSMC's 4nm process coming ahead of schedule (Jun. 02, 2021)
- Record Q1 foundry revenues (Jun. 02, 2021)
- TSMC Technology Symposium: Siemens verification for TSMC 4nm and 3nm (Jun. 02, 2021)
- Socionext's Advanced New Sensor Technology Ideal for A Wide Range of Applications (Jun. 02, 2021)
- Majority of Top 20 APAC Tech Firms Managed to Post Growth in 2020 (Jun. 02, 2021)
- TSMC Widens Its Gap with Samsung in Foundry Business (Jun. 02, 2021)
- TSMC to Build Semiconductor R&D Center in Japan (Jun. 02, 2021)
- Analog Bits to Demonstrate 5nm IP Silicon at TSMC 2021 Online Technology Symposium (Jun 01, 2021)
- EPI EPAC1.0 RISC-V Test Chip Taped-out (Jun 01, 2021)
- Sequans Licenses CEVA 5G Modem IP for Broadband IoT Platform (Jun 01, 2021)
- Siemens announces EDA milestones and tool certifications for TSMC's latest process technologies (Jun 01, 2021)
- Synopsys DesignWare IP Achieves Broad Industry Adoption with Multiple First-Pass Customer Silicon Successes on TSMC's N5 Process (Jun 01, 2021)
- European Processor Initiative Announces EPAC1.0 RISC-V Test Chip Taped-out (Jun. 01, 2021)
- Intel Unveils New Additions to 11th Gen Processor Portfolio (Jun. 01, 2021)
- Cadence Collaborates with TSMC to Accelerate Mobile, AI and Hyperscale Computing Application Development on N3 and N4 Processes (May 31, 2021)
- Join Innosilicon at TSMC 2021 Online Technology Symposium (May 31, 2021)
- Arm Upgrades Its Entire PC And Mobile Portfolio (May 31, 2021)
- SEGGER's emRun Runtime Library Licensed by SiFive for Superior Code Size and Performance Improvements (May 31, 2021)
- Dolphin Design joins Arm Approved Design Partner Program (May 31, 2021)
- Quarterly Revenue of Top 10 Foundries Breaks Records in 1Q21 Owing to Price Hikes Caused by Tight Foundry Capacities, Says TrendForce (May 31, 2021)
- Synopsys ports Moortec PVT sensor to 3nm (May. 28, 2021)
- CEA-Leti Introduces Plastic mmWave System for Applications Requiring Ultra-Low Latency and Ultra-High-Speed Connectivity (May. 28, 2021)
- Edge AI Inferencing Opens Up New World of Opportunities (May. 28, 2021)
- AImotive launches aiWare4, featuring advanced wavefront processing, upgraded safety and low-power features (May 27, 2021)
- Silex Insight launches high performance (2Tbps) SM4-GCM Multi-booster (May 27, 2021)
- Precise-ITC launches 10G-1.6T Ethernet/FiberChannel/FlexO IP Core (May 27, 2021)
- DCD-SEMI accelerates AES security with the latest IP Core (May 27, 2021)
- USB Promoter Group Announces USB Power Delivery Specification Revision 3.1 (May 27, 2021)
- Arm battens down the spending hatches (May 27, 2021)
- Siemens launches PCI Express 6.0 Questa Verification IP solution (May 27, 2021)
- Mirabilis Design and E-Elements Technology team up to provide concept-to-implementation design flow for AI applications (May. 27, 2021)
- Synopsys DesignWare PVT Subsystem Drives Performance, Power and Silicon Lifecycle Management on TSMC's N3 Process Technology (May 27, 2021)
- Hardent Joins Samsung SAFE IP Partner Program & Launches New Display IP Subsystem Solution in Collaboration with Rambus (May 26, 2021)
- Lattice sensAI Solution Stack Simplifies Deployment of AI/ML Models on Smart Edge Devices (May 26, 2021)
- Synopsys Digital and Custom Design Platforms Certified for TSMC's Latest 3nm Process Technology (May 26, 2021)
- Oracle adds Arm Neoverse-based cloud instances with OCI Ampere A1 (May 26, 2021)
- eYs3D Microelectronics, Co. Raises $7 Million Series A from Leading Industry Strategic Investors for Vision/AI Chips (May 26, 2021)
- Cadence Collaboration with Arm Enables Customers to Successfully Tape out Next-Generation Arm Mobile Designs (May 26, 2021)
- Siemens expands Simcenter with AI-driven generative engineering for systems architectures (May 26, 2021)
- proteanTecs' UCT to be Exhibited at the TSMC 2021 Online Technology Symposiums for North America, Europe and Taiwan (May 26, 2021)
- TSMC accounts for 70% of global contract MCU production (May. 26, 2021)
- Cadence Unleashes Clarity 3D Solver on the Cloud for Straightforward, Secure and Scalable Electromagnetic Analysis of Complex Systems on AWS (May. 26, 2021)
- Autonomous imager for smartphones, home appliances and automobiles (May. 26, 2021)
- Intel hangs on to No.1 rank in Q1 (May. 26, 2021)
- Imperas Simulation Reference Models selected by IAR Systems for Arm 64bit (May 26, 2021)
- 5G Ethernet Subsystem to reduce development time is now available (May 26, 2021)
- Arm Total Compute solutions bring performance, security and Armv9 to the broadest range of Client devices (May 25, 2021)
- PLDA Announces XpressRICH PCI Express 6.0 Controller IP for Next Generation SoC Designs (May 25, 2021)
- Avery Design Launches PCI Express 6.0 Verification IP to Enable Early Development, Compliance Checking for New Version of Standard (May 25, 2021)
- Synopsys Enables First-Pass Silicon Success for Early Adopters of Next-Generation Armv9 Architecture-based SoCs (May 25, 2021)
- Top-15 Semi Companies Log Year-Over-Year Growth of 21% in 1Q21 (May 25, 2021)
- Global 200mm Fab Capacity on Pace to Record Growth to Meet Surging Demand and Address Chip Shortage, SEMI Reports (May 25, 2021)
- Arm invests in edge vision startup (May. 25, 2021)
- AI Driving Renewed Interest in Processing-in-Memory (May. 25, 2021)
- 10 Key Drivers to Transform 5G Adoption (May. 25, 2021)
- BrainChip highlights its Akida Neural Processor at AI Field Day 2 (May. 25, 2021)
- Cadence Introduces the Spectre FX FastSPICE Simulator Delivering up to 3X Performance Gains with Superior Accuracy (May 24, 2021)
- Siemens receives three Samsung Foundry SAFE EDA awards (May 24, 2021)
- JVCKENWOOD Deploys Cadence Spectre FX Simulator and Comprehensive Design Flows to Improve Productivity (May 24, 2021)
- RISC-V Functional Safety Processor IP Core Introduced by CAST and Fraunhofer IPMS (May 24, 2021)
- Logic Fruit Technologies Launches ARINC 818 RTL IP Core for Avionics applications (May 24, 2021)
- Arm partners are shipping more than 900 Arm-based chips per second based on latest results (May 24, 2021)
- GUC Announces GLink-3D Die-on-Die Interface IP using TSMC N5 and N6 Process for 3DFabric Advanced Packaging Technology (May 24, 2021)
- U.S. Chip Makers Embrace Collaboration (May 24, 2021)
- Cadence Accelerates Cloud Hyperscale Infrastructure with Third-Generation 112G-LR SerDes IP on TSMC's N5 Process (May 24, 2021)
- Cadence Announces New Low-Power IP for PCI Express 5.0 Specification on TSMC N5 Process (May 24, 2021)
- GF foundry deal for 6G RF GaN (May. 24, 2021)
- Think Silicon and Ambiq enable IoT devices (May. 23, 2021)
- Now Your Car is a Cybersecurity Risk, Too (May. 21, 2021)
- SEMIFIVE collaborates with Arm to accelerate its custom SoC designs (May 20, 2021)
- Chips&Media Making its Presence at the 2021 Embedded Vision Summit as an Exhibitor (May 20, 2021)
- Sony Senior VP & Playstation LSI Leader, Takayasu Muto Joins Secure-IC's Strategic Committee (May 20, 2021)
- Avery Design Systems and Rambus Extend Memory Model and PCIe VIP Collaboration (May 20, 2021)
- Intrinsic ID Wins InfoSec Award for ‘Next Gen in Embedded Security' - Announced at RSA Conference by Cyber Defense Magazine (May 20, 2021)
- Memory Upswing Returns, New Record High Expected in 2022 (May 20, 2021)
- Lattice Propel Design Environment Supports New RISC-V Processor and IP Cores (May 20, 2021)
- Synopsys Posts Financial Results for Second Quarter Fiscal Year 2021 (May 20, 2021)
- Credo Announces 3.2Tbps XSR-Enabled High-Speed Connectivity Chiplet with 112Gbps Lane Rates (May 20, 2021)
- Silvaco Announces Appointment of Industry Veteran Ernest E. Maddock to Board of Directors (May 20, 2021)
- Efabless Launches chipIgnite with SkyWater to Bring Chip Creation to the Masses (May 20, 2021)
- LeapMind's "Efficiera" Ultra-low Power AI Inference Accelerator IP Was Verified RTL Design for ASIC/ASSP Conversion (May 20, 2021)
- TSMC's tech advance builds pressure on Samsung (May. 20, 2021)
- Gyrfalcon Showcases AI-X at 2021 Embedded Vision Summit (May. 20, 2021)
- Think Silicon and Ambiq Enable Ultra-Low Power IoT Devices with Smartphone-Class, 3D-Like Graphics (May 19, 2021)
- Taiwan's TSMC claims breakthrough on 1nm chips (May. 19, 2021)
- Quantum Software: What's Next? (May. 19, 2021)
- Shift from 8'' Wafer Fabs to 12'' Could Ease IC Shortages (May 19, 2021)
- Raytheon Technologies and GLOBALFOUNDRIES Partner to Accelerate 5G Wireless Connectivity (May 19, 2021)
- Unisantis unveils Dynamic Flash Memory as DRAM alternative (May 19, 2021)
- Global Chip Shortage Expected to Persist Until Q2 2022 (May. 19, 2021)
- Siemens accelerates digital marketplace strategy with acquisition of Supplyframe (May 18, 2021)
- Aphawave shares remain below offer price (May 18, 2021)
- Riviera-PRO Enables VHDL-2019 Users to Unleash the Power of the Language's New Additions (May 18, 2021)
- MoSys Announces Optimized P4 Pipeline Support for Stellar Packet Classification Platform IP for FPGAs (May 18, 2021)
- Thalia's AMALIA Technology Analyzer de-risks Analog IP reuse for major IP houses and IC manufacturers (May 18, 2021)
- Intrinsic ID's SRAM PUF Deployed by Avnet ASIC Solutions to Secure Advanced SoCs (May 18, 2021)
- Synopsys unveils breakthrough in emulation performance (May. 18, 2021)
- The timeline for quantum computing is getting shorter (May. 18, 2021)
- Arm and Jülich Sign Multi-Year HPC Collaboration Agreement (May. 18, 2021)
- Nvidia's ownership of ARM could drive customers to RISC-V, says Xilinx CEO. (May. 18, 2021)
- 48-V Power Architecture for Next-Gen AI Processors (May. 18, 2021)
- Siemens Acquires Supplyframe (May. 18, 2021)
- Ambiq shows interest in FinFET, FDSOI and an IPO (May. 18, 2021)
- AI Startups Plateau, AI SoCs Soar, and the Edge Diverges (May 17, 2021)
- Vidatronic Appoints Jiangsu JITRI Intelligent Integrated Circuit Design as Its Representative for China (May 17, 2021)
- Agile Analog closes new funding round to go global with revolutionary analog IP technology (May 17, 2021)
- SMIC Reports 2021 First Quarter Results (May 17, 2021)
- GOWIN Releases USB 2.0 PHY and Device Controller IP for Their FPGA Products (May 17, 2021)
- Xpeedic On-Chip Passive EM Simulation Suite Certified for Samsung Foundry 8LPP Process Technology (May 17, 2021)
- South Korea plans US$450 billion semiconductor spend (May 17, 2021)
- Fab Expansions in South Korea (May. 17, 2021)
- Foundry Freedom: AMD Loosens Wafer Agreement With GlobalFoundries (May. 14, 2021)
- Foundry Freedom: AMD Loosens Wafer Agreement With GlobalFoundries (May. 14, 2021)
- Top China chipmaker SMIC says sales to grow despite US sanctions (May. 14, 2021)
- TSMC is considering a 3 nm foundry in Arizona (May. 14, 2021)
- Siemens Digital buys Fractal Technologies (May. 13, 2021)
- Faraday Announces 16G Programmable SerDes in UMC 28HPC+ (May. 13, 2021)
- Siemens expands industry-leading IC verification portfolio with acquisition of Fractal Technologies (May 13, 2021)
- Bluespec, Inc. Joins the Xilinx Partner Program, Offering Drop-in Ready RISC-V Processors for Xilinx FPGAs (May 13, 2021)
- New Fab Plans: the Plot Thickens (May 13, 2021)
- Synopsys Extends Verification Hardware Market Leadership with Breakthrough Emulation Performance (May 13, 2021)
- Equal1 Laboratories Announces Major Breakthrough with Fully Integrated Quantum Processor Operating at 3.7 K Using Commercially Available Technology (May. 13, 2021)
- Imagination announces major updates to PowerVR SDK and Toolkit, including ray tracing code examples. (May 12, 2021)
- Real Intent Expands ISO 26262 Functional Safety Compliance for Static Sign-Off Products (May 12, 2021)
- MIPI CSI 3, DSI 2 Tx & Rx Advanced Controller & PHY IP Cores available in major Fabs & Nodes for SOC Designs for Imaging and Display Applications (May 12, 2021)
- Vastai Technologies Closes US$75 Million Series A+ Financing (May 12, 2021)
- Dialog Semiconductor Adds AI, Data Analytics Partners to SmartServer Ecosystem (May. 12, 2021)
- Bluespec, Inc. Joins the Xilinx® Partner Program, Offering Drop-in Ready RISC-V Processors for Xilinx FPGAs. (May. 12, 2021)
- Dissecting the New Fab Plans (May. 12, 2021)
- Dialog Semiconductor Adds AI, Data Analytics Partners to SmartServer Ecosystem (May. 12, 2021)
- Dialog Semiconductor Selected as SiFive Preferred Power Management Partner for RISC-V Development Platforms (May 11, 2021)
- Silex Insight extends their AES-GCM Crypto Engine offering by introducing an ultra-low latency version for PCI Express 5.0 and Compute Express Link 2.0 (May 11, 2021)
- Mythic Raises $70 Million in Series C Funding Led by BlackRock and Hewlett Packard Enterprise (May 11, 2021)
- BrainChip Demonstrates Akida Neuromorphic Processor as Part of Data Science Week (May 11, 2021)
- Shaping the Scene for Vision Standardization (May. 11, 2021)
- South Korea Losing Competitiveness in Semiconductor Industry (May. 11, 2021)
- Semiconductor Market Forecast to Reach $522B in 2021 (May. 11, 2021)
- UMC to Expand 300mm Fab Capacity in Tainan (May. 11, 2021)
- Achronix Goes Head-to-Head (May. 11, 2021)
- IBM Unveils World's First 2 nm Chip (May 10, 2021)
- Sondrel's latest reference IP platform enables ultra-powerful signal and data processing SoCs to be created faster for lower costs (May 10, 2021)
- CEVA to Acquire Intrinsix Corp, Expanding its Offering to Include Full Turnkey IP Platforms (May 10, 2021)
- CEVA, Inc. Announces First Quarter 2021 Financial Results (May 10, 2021)
- TSMC April 2021 Revenue Report (May 10, 2021)
- AEDVICES Consulting set up a new organization to boost its growth (May 10, 2021)
- Synopsys ZeBu Server 4 Adopted by Xsight Labs for Intelligent Networking Switch Processor (May 10, 2021)
- NeuReality unveils novel AI-centric platform to empower the growth of real-life AI applications (May 10, 2021)
- OpenPOWER Foundation announces LibreBMC, a POWER-based, fully open-source BMC (May 10, 2021)
- Lattice and Rambus to Partner on Next-gen Security Solutions (May. 10, 2021)
- MIPI Alliance releases automotive specifications (May. 10, 2021)
- TSMC April sales down over 13% from March (May. 10, 2021)
- SensiML Launches Open Source Initiative to Drive TinyML Implementations for Smart IoT Applications (May. 10, 2021)
- GlobalFoundries Sharpens Photonics Edge for Quantum Manufacturing (May. 07, 2021)
- CEVA's Bluetooth Dual Mode 5.2 Platform Achieves SIG Qualification, Expedites IC Design for TWS Earbuds and More (May 06, 2021)
- UMC Reports Sales for April 2021 (May 06, 2021)
- CCSDS 231.0-B-3 LDPC Encoder and Decoder IP Core from Creonic Now Available (May 06, 2021)
- GUC Monthly Sales Report - Apr 2021 (May 05, 2021)
- OmniVision Reduces Automotive Camera Design Complexity with the New, High-Performance OAX4000 ASIC Image Signal Processor (May 05, 2021)
- Xilinx Reports Fiscal Fourth Quarter and Fiscal Year 2021 Results (May 05, 2021)
- Lattice Semiconductor Reports First Quarter 2021 Results (May 05, 2021)
- Karen Rogge Joins Rambus Board of Directors (May 05, 2021)
- Synopsys Completes Acquisition of MorethanIP (May 05, 2021)
- Achronix Announces First Quarter 2021 Financial Results and Business Highlights (May 05, 2021)
- Cadence Wins Four 2020 Samsung Foundry SAFE EDA Awards (May 05, 2021)
- Synopsys Delivers Enhanced Memory Design Productivity to Nanya Technology (May 05, 2021)
- PsiQuantum and GLOBALFOUNDRIES to Build the World's First Full-scale Quantum Computer (May 05, 2021)
- TSMC prioritizes automotive chip supply to ease shortage (May. 05, 2021)
- SmartDV Unveils Automation Tool Suite for Use with Its Extensive Verification IP Portfolio (May 04, 2021)
- Samsung Expected to Recapture #1 Semi Supplier Ranking in 2Q21 (May 04, 2021)
- Rambus Reports First Quarter 2021 Financial Results (May 04, 2021)
- Esperanto Technologies Adopts Movellus Maestro AI, Intelligent Clock Networks for Its ET-SoC-1 Chip (May 04, 2021)
- Synopsys to Showcase New Application Security Orchestration Solution at RSA Conference (May 04, 2021)
- MIPI Alliance Releases Specifications to Streamline Integration of In-Vehicle Displays, Add Functional Safety to Display Data Streams (May 04, 2021)
- Arm v9, the Next 10 Years (May. 04, 2021)
- NovaceneAI and CMC Microsystems deliver quantum computing to biz users (May. 04, 2021)
- Intel to put $3.5bn into packaging (May. 04, 2021)
- FPGAs in the Storm (May 03, 2021)
- Flex Logix And The Air Force Research Laboratory Sign A Broad License To Use EFLX Embedded FPGA IP In GLOBALFOUNDRIES' 12LP And 12LP+ Processes (May 03, 2021)
- Q1 Global Semiconductor Sales Increase 3.6% Over Previous Quarter (May 03, 2021)
- BLE/15.4 2.4GHz+Sub-GHz Multi-Protocol RF Transceiver Phy KGD & IP for adding wireless Connectivity to "any MCU/SoC" (May 03, 2021)
- PathPartner Joins BlackBerry QNX Channel Partner Program to Deliver Safety-Critical and Secure Software Solutions for Automotive Industry (May 03, 2021)
- Faraday Reports First Quarter 2021 Revenues at NT$1,535 Million (May 03, 2021)
- Silicon Wafer Shipments Edge Higher in First Quarter 2021 to Set New Record, SEMI Reports (May 03, 2021)
- The Future of FPGAs (May. 03, 2021)
- UMC taps customers for $3.5bn fab expansion (May. 03, 2021)
- Scaleable RISC-V module for distributed AI processing (May. 03, 2021)
- Thalia Design Automation successfully delivers voltage regulator in a 22nm process node with 45% reduction in design time using its AMALIA software (Apr 30, 2021)
- China on way to self reliance in 28-nm chips; to attain maturity in 14-mm category as well (Apr. 30, 2021)
- Intel CEO Pat Gelsinger Seeks Support for EU Foundries (Apr. 30, 2021)
- Global Unichip Corporation Deploys Cadence Clarity 3D Solver to Achieve 5X Speedup of Systems Analysis for 112G Long-Reach Network Switch (Apr 29, 2021)
- Fabless Suppliers Held a Record 33% of the 2020 IC Market (Apr 29, 2021)
- CEVA Lauded by Frost & Sullivan for Addressing the Challenges of Connected Devices with Its Smart Sensing MotionEngine Software (Apr 29, 2021)
- SiFive and Samsung Foundry Extend Partnership to Accelerate AI SoC Development (Apr 29, 2021)
- RISC-V International Welcomes Chengwei Capital as a Premier Member (Apr 29, 2021)
- EnSilica Mixed Signal ASIC is PPAP Approved for Luxury Hybrid Car (Apr. 29, 2021)
- ARM pushes chiplets and 3D packaging for Neoverse chips (Apr 28, 2021)
- Achronix Adopts eMemory IP for FPGA Hardware Root of Trust (Apr 28, 2021)
- Alphawave IP aims for 100 engineers in UK design center (Apr 28, 2021)
- Arm Leverages Synopsys Fusion Compiler to Enable Best PPA for Latest Neoverse Platforms (Apr 28, 2021)
- Achronix and Napatech Partner to Target Data Center Networking (Apr 28, 2021)
- Skyworks to Acquire the Infrastructure & Automotive Business of Silicon Labs (Apr 28, 2021)
- ACL Digital Partners with Mobiveil, High-Speed Silicon IP Platform Leader (Apr 28, 2021)
- Vidatronic Announces Series of Integrated Power Management Unit (PMU) IP Cores Optimized for Augmented/Virtual Reality Applications (Apr 28, 2021)
- Valens Announces Successful Tapeout of First MIPI A-PHY Compliant Chipsets for Long-Reach, Ultra-High-Speed Automotive Connectivity (Apr 28, 2021)
- Astera Labs and Avery Design Partner on CXL 2.0 Verification for Smart Retimer Portfolio to Improve Performance in Data-Centric Applications (Apr 28, 2021)
- "KI-PREDICT" – Intelligent process monitoring with on-sensor signal preprocessing (Apr. 28, 2021)
- Cadence collaborates with Arm to accelerate SoC development (Apr. 28, 2021)
- Silicon Catalyst Announces Six Newly Admitted Companies to Semiconductor Incubator (Apr 27, 2021)
- Tiempo Secure Selects IC'Alps to Accelerate Silicon Implementation of Secure Element IP for IoT Applications (Apr 27, 2021)
- BitSim and NOW Electronics joins forces BitSim (Apr 27, 2021)
- Lattice and Rambus to Partner on Next-Generation Security Solutions (Apr 27, 2021)
- Synopsys and Arm Deliver Comprehensive Solutions to Increase Performance and Accelerate Time-to-Market for High-Performance Computing, Data Center and AI SoCs (Apr 27, 2021)
- Transforming compute for next-generation infrastructure (Apr 27, 2021)
- SiPearl launches the recruitment of 10 engineers per month in France & Germany (Apr 27, 2021)
- Automotive Ethernet PHY addresses next-gen connected cars (Apr. 27, 2021)
- Soitec wins two awards for its employee share ownership schemes Paris Stock Exchange:SOI (Apr. 27, 2021)
- Anritsu Corporation Selects PLDA's PCIe Solution for its Next Generation of Handheld Spectrum Analyzers (Apr 26, 2021)
- videantis and Continental sign strategic supplier contract and announce SOPs with videantis-enabled camera system (Apr 26, 2021)
- Nvidia-ARM deal runs into security issues in the UK (Apr 26, 2021)
- Defacto Technologies Announces SoC Compiler, v9 (Apr 26, 2021)
- Flex Logix Appoints CFO and VP of Inference Hardware to Senior Management Team; Announces Expansion to Austin, TX (Apr 26, 2021)
- TSMC Update: 2nm in Development, 3nm and 4nm on Track for 2022 (Apr. 26, 2021)
- Domain specific accelerators for RISC-V (Apr. 26, 2021)
- Dialog adds low power Flash devices to IoT Portfolio (Apr. 26, 2021)
- PCI Express Gen5 PHY & Controller IP Cores available in major Fabs & Foundries for Graphics, Memory and Storage Applications (Apr 23, 2021)
- Seamless Microsystems Announces Highest-Performance ADC for Automotive RADAR (Apr 23, 2021)
- Vidatronic Appoints Mike Holland as VP of IP Licensing Sales, Positioning Company to Drive Continued Growth (Apr 23, 2021)
- Cadence Extends Popular Tensilica Vision and AI DSP IP Product Line with New DSPs Targeting High-End and Always-On Applications (Apr 23, 2021)
- Alphawave IP plans move to UK for $4.5bn IPO (Apr 23, 2021)
- Andes Announces the New Upgrade of AndeSight IDE v5.0: a comprehensive software solution to accelerate RISC-V AI and IoT developments (Apr 23, 2021)
- Siemens Place-and-route Solution Now Qualified on TSMC's N6 Technology (Apr. 23, 2021)
- proteanTecs Joins Open Compute Project, Unveils UCT Monitoring System (Apr. 23, 2021)
- Automakers to Blame for Semiconductor Shortage (Apr. 23, 2021)
- Rambus Expands High-Performance Memory Subsystem Offerings with HBM2E Solution on Samsung 14/11nm (Apr 22, 2021)
- EnSilica completes PPAP on safety-critical automotive ASIC design (Apr 22, 2021)
- BrainChip Simplifies Deep Learning with Launch of MetaTF (Apr 22, 2021)
- Tenstorrent Selects SiFive Intelligence X280 for Next-Generation AI Processors (Apr 22, 2021)
- GF Working with High Profile Universities on 6G Technology (Apr. 22, 2021)
- Renesas and SiFive Partner to Jointly-Develop Next-Generation High-End RISC-V Solutions for Automotive Applications (Apr 21, 2021)
- Pinnacle Imaging Systems Announces Denali 3.0 Soft ISP & HDR Sensor Module for New Xilinx Kria SOM Platform and Vision AI Starter Kit (Apr 21, 2021)
- CAES Gaisler Signs Contract with the European Space Agency for New Advanced Space Processor (Apr 21, 2021)
- Marvell Completes Acquisition of Inphi (Apr 21, 2021)
- Synopsys Introduces PrimeLib Unified Library Characterization and Validation Solution for Accelerated Access to Advanced Process Nodes (Apr 21, 2021)
- Codasip Announces FPGA Evaluation Platforms for RISC-V Processor Cores (Apr 21, 2021)
- Hardent Selected as Design Services Provider for New Xilinx Kria SOMs (Apr 21, 2021)
- Adaptive Power/Performance Management for FD-SOI (Apr. 21, 2021)
- Rambus Joins DARPA Toolbox Initiative with State-of-the-Art Security and Interface IP (Apr 20, 2021)
- Movellus Launches Maestro Intelligent Clock Network Platform for SoC Designs (Apr 20, 2021)
- TSMC certifies Aprisa place-and-route solution from Siemens on TSMC's N6 process (Apr 20, 2021)
- Xilinx Introduces Kria Portfolio of Adaptive System-on-Modules for Accelerating Innovation and AI Applications at the Edge (Apr 20, 2021)
- Synopsys Unleashes PrimeSim Continuum Solution to Accelerate the Design of Hyper-Convergent ICs for Memory, AI, Automotive and 5G Applications (Apr 20, 2021)
- proteanTecs Joins TSMC IP Alliance Program (Apr. 20, 2021)
- Logic Design Solutions Introduces the first NVMe HOST IP on POLARFIRE SoC FPGA (Apr 19, 2021)
- DSP Concepts Enables Audio Weaver for the Cadence Tensilica HiFi 5 DSP (Apr 19, 2021)
- TSMC Boosts Capital Budget Again, to $30B (Apr 19, 2021)
- 2020 Global Semiconductor Equipment Sales Surge 19% to Industry Record $71.2 Billion, SEMI Reports (Apr 19, 2021)
- Expedera Introduces Its Origin Neural Engine IP With Unrivaled Energy-Efficiency and Performance (Apr 19, 2021)
- Cadence Pegasus Verification System Certified for Samsung Foundry 5nm and 7nm Process Technologies (Apr 19, 2021)
- PLDA Introduces a Complete Line of PCIe IP for USB4, Enabling PCIe Support in USB4 Hubs, Hosts and Devices (Apr 19, 2021)
- Aspinity Expands into Audio Event Detection (Apr. 16, 2021)
- Arm and NVIDIA: Fueling Innovation for the Next Era of Compute (Apr 15, 2021)
- Silex Insight and Andes Technology extend strategic partnership to deliver flexible and scalable Root-of-Trust security IP solution (Apr. 15, 2021)
- Groq Closes $300 Million Fundraise (Apr 15, 2021)
- Mosaid Technologies Returns to its Roots - Conversant is once again Mosaid (Apr 15, 2021)
- TSMC Reports First Quarter EPS of NT$5.39 (Apr 15, 2021)
- Nestwave Secures Additional Capital to Accelerate Deployment of Low-Power Geolocation Solutions for the IoT (Apr 15, 2021)
- Synopsys AI-Driven Design System Enables Renesas to Achieve Breakthrough in Productivity (Apr 15, 2021)
- Allwinner launches the first RISC-V application processor (Apr 15, 2021)
- S2C Announces Next-Gen Prodigy MDM Pro to Simplify and Speed Up FPGA Prototyping Debug Process (Apr 15, 2021)
- Avery Design Debuts CXL 2.0 System-level VIP Simulation Solution (Apr 15, 2021)
- Siemens expands industry-leading IC verification portfolio through acquisition of OneSpin Solutions (Apr 15, 2021)
- AnalogX Announces 40G Sub 2pJ/bit Ultra Low Power SerDes in 22nm Platform (Apr 14, 2021)
- Synopsys Extends DesignWare Security, Processor IP Solutions to Address Safety and Security Requirements of Automotive Designs (Apr 14, 2021)
- Chinese Companies Hold Only 5% of Global IC Marketshare (Apr 14, 2021)
- Arteris IP Welcomes Back Veteran Laurent Moll as Chief Operating Officer (Apr 14, 2021)
- Xylon logiRECORDER Automotive HIL Video Logger Now Compatible with NVIDIA DRIVE AGX Scalable AI Platform for Autonomous Driving (Apr 14, 2021)
- Imagination appoints Didier Lamouche to board as non-executive director (Apr 14, 2021)
- BrainChip Begins Volume Production of Akida AI Processor (Apr 14, 2021)
- Semiconductor Energy Laboratory and Silvaco Jointly Develop SPICE Model of Oxide Semiconductor FETs (Apr. 14, 2021)
- Nvidia Officially Enters CPU Market (Apr. 14, 2021)
- SambaNova Systems Raises $676M in Series D, Surpasses $5B Valuation and Becomes World's Best-Funded AI Startup (Apr 13, 2021)
- Silex Insight and Andes Technology extend strategic partnership to deliver flexible and scalable Root-of-Trust security IP solution (Apr 13, 2021)
- Synopsys To Expand DesignWare Ethernet IP Portfolio with Acquisition of MorethanIP (Apr 13, 2021)
- Codasip Releases a Major Upgrade of Its Studio Processor Design Toolset with a Tutorial RISC-V core (Apr 13, 2021)
- OpenFive Tapes Out SoC for Advanced HPC/AI Solutions on TSMC 5nm Technology (Apr 13, 2021)
- ESD Alliance Reports Strong Electronic System Design Industry Revenue Growth for Q4 2020 (Apr 13, 2021)
- RISC-V vs. ARM vs. x86 – What's the difference? (Apr. 13, 2021)
- Cloudera collaborates with NVIDIA to accelerate data analytics and AI in the cloud (Apr. 13, 2021)
- OPEN Alliance Incorporation Advances Ethernet Connectivity in Vehicles (Apr. 13, 2021)
- TSMC participates in White House semiconductor, supply chain summit (Apr. 13, 2021)
- Attopsemi's I-fuse OTP IP Qualified and Available on GLOBALFOUNDRIES 22FDX FD-SOI Platform (Apr 12, 2021)
- Dialog Shareholders Approve Resolutions related to the Acquisition by Renesas Electronics Corporation of Dialog Semiconductor Plc (Apr 12, 2021)
- DVB-S2X/S2/S/T2/T/C Combo Demodulator/Decoder IP Core licensed to an Asia's leading TV Semiconductor Company (Apr 12, 2021)
- Gartner Says Worldwide Semiconductor Revenue Grew 10.4% in 2020 (Apr 12, 2021)
- China lawsuits threaten Nvidia-Arm deal (Apr 12, 2021)
- Globalfoundries to IPO at a $20bn valuation (Apr 12, 2021)
- Globalfoundries CEO Caulfield Stands Up for the 70% (Apr 12, 2021)
- TSMC March 2021 Revenue Report (Apr 09, 2021)
- Cadence Collaborates with Samsung Foundry to Accelerate Hyperscale Computing SoC Design for Process Nodes Down to 4nm (Apr 09, 2021)
- proteanTecs Joins the Open Compute Project (OCP), and Introduces First-Ever UCT Monitoring System for Field-Deployed Electronics (Apr 09, 2021)
- Atmosic Technologies' New Reference Designs Bring the Power of Photovoltaic-harvested Energy to IoT Manufacturers (Apr 09, 2021)
- Cadence Delivers Automotive Reference Flow for Samsung Foundry 14LPU Process Technology (Apr 09, 2021)
- Achronix Now Shipping Industry's Highest Performance Speedster7t FPGA Devices (Apr 09, 2021)
- SiFive Intelligence for Modern ML Architectures Presentation at Linley Spring Processor Conference (Apr 09, 2021)
- HDL Design House selects Silicon Frontline's P2P Software for Fast, Easy IR Drop and Resistance Mapping (Apr 09, 2021)
- DCD-SEMI gains new strength in the Virtual Reality World with their latest IrDA DIRDA IP Core (Apr 09, 2021)
- ADAS Features to Propel Global Hardware-in-the-Loop Testing Market by 2026 (Apr. 09, 2021)
- Intel Launches Ice Lake–First CPU Family on 10nm Process (Apr. 09, 2021)
- Next-generation ZETA communication standard (Apr. 09, 2021)
- Weebit Nano continues ReRAM innovation: Files new patents optimising programming of ReRAM (Apr 08, 2021)
- Intrinsic closes GBP 1.35m seed funding round to prototype next generation memory devices (Apr 08, 2021)
- Algolux Brings Atlas Camera ISP Optimization for Computer Vision to Arm ISP Users (Apr 08, 2021)
- AMD and Xilinx Stockholders Overwhelmingly Approve AMD's Acquisition of Xilinx (Apr 08, 2021)
- Startup Transforms Compute-In-Memory (Apr 08, 2021)
- 10 Best Microcontrollers on the Market for 2021 (Apr. 08, 2021)
- UMC Reports Sales for March 2021 (Apr 07, 2021)
- Semiconductor Units Forecast To Exceed 1 Trillion Devices Again in 2021 (Apr 07, 2021)
- ZiFiSense, Socionext and Techsor Complete Development of Next-Generation ZETA Communication Standard (Apr 07, 2021)
- Efinix Announces Expansion of High-Performance Titanium FPGA Product Line (Apr 07, 2021)
- UK memory startup raises €1.5m, looks to imec (Apr. 07, 2021)
- RISC-V Star Rises Among Chip Developers Worldwide (Apr. 07, 2021)
- Samsung and Marvell Developing Combined 4G and 5G SoCs (Apr. 07, 2021)
- Intel Launches Its Most Advanced Performance Data Center Platform (Apr 07, 2021)
- Global Semiconductor Sales Up 14.7% Year-to-Year in February (Apr 06, 2021)
- Cadence Unveils Next-Generation Palladium Z2 and Protium X2 Systems to Dramatically Accelerate Pre Silicon Hardware Debug and Software Validation (Apr 06, 2021)
- BrainChip Research Enter into a Research Collaboration with Biotome for SARS-CoV-2 antibody detection (Apr 06, 2021)
- GUC Monthly Sales Report - March 2021 (Apr 06, 2021)
- Siemens introduces PCBflow, a secure, cloud-based solution for accelerating design-to-manufacturing handoff for printed circuit boards (Apr 06, 2021)
- First Google-Sponsored MPW Shuttle Launched at SkyWater with 40 Open Source Community Submitted Designs (Apr 06, 2021)
- USB, MIPI, Ethernet, DisplayPort, PCIe, DDR, HDMI, ONFi Analog Phy IP Cores silicon proven in UMC 28nm & UMC 40nm Process (Apr 06, 2021)
- Aragio Solutions Achieves ISO 9001:2015 Certification (Apr 06, 2021)
- Synopsys and Samsung Foundry Collaboration Delivers High-Performance Physical Signoff on Samsung SAFE Cloud Design Platform (Apr 06, 2021)
- Synopsys Extends Market Leadership in Verification Hardware with Performance and Enterprise Scalability Innovations (Apr 05, 2021)
- OpenFive Launches Die-to-Die Interface Solution for Chiplet Ecosystem (Apr 05, 2021)
- What Arm's new architecture says about the future of computer (Apr. 05, 2021)
- Boost for semiconductor production in Austria (Apr. 05, 2021)
- TSMC calls EU semiconductor boost 'unrealistic' (Apr. 05, 2021)
- Siemens Emulation and Prototyping Tools Tackle SoC Design Challenges (Apr. 04, 2021)
- Key Driving Forces Changing Automotive Electronics System (Apr. 02, 2021)
- CAVP – NIST ACVTS – Are you still with me? (Apr. 01, 2021)
- SiFive and DARPA collaborate to bring the power of RISC-V to Technology Innovation (Apr 01, 2021)
- Truechip Adds New Customer Shipments Of Verification IPs For DDR, LPDDR And I3C v1.1 (Apr 01, 2021)
- SMIC Announces audited 2020 Annual Results (Apr 01, 2021)
- SMIC Profit Up 43.3% In 2020 But Growth Uncertainty Lingers (Apr. 01, 2021)
- Optimizing Package System Integration Maximizes System Performance (Apr. 01, 2021)
- Lattice Brings Best-in-Class Embedded Vision Optimized FPGA to Automotive Applications (Mar. 31, 2021)
- Huawei will negotiate with Apple and Samsung to use 5G patents (Mar. 31, 2021)
- Codasip to Offer Secure Boot Solutions with Veridify Tools (Mar 31, 2021)
- Arm's solution to the future needs of AI, security and specialized computing is v9 (Mar 31, 2021)
- Magnachip Enters into Definitive Agreement with Wise Road Capital in a Take Private Transaction Valued at $1.4 Billion (Mar 30, 2021)
- Xylon's New Wireless Vehicle Router Enables Remotely Supervised Test Data Harvesting on Roads Around the World (Mar 30, 2021)
- Intel 2.0 (Mar 30, 2021)
- TSMC head says drive to onshore chip supply chain is 'unrealistic' (Mar. 30, 2021)
- Arm processors: Everything you need to know now (Mar. 30, 2021)
- SEMI Promoting Cybersecurity Adoption (Mar. 30, 2021)
- ReRAM Machine Learning Embraces Variability (Mar. 30, 2021)
- UK standard for self-driving car safety oversight (Mar. 30, 2021)
- Driver's Responsibility Must Be a Yes-or-No Question (Mar. 30, 2021)
- 5 Emerging IoT Technologies You Need To Know In 2021 (Mar. 30, 2021)
- Intel Drops a Bomb, Not the Ball (Mar 29, 2021)
- Intel Surprises with $20B Expansion of Foundry Business (Mar 29, 2021)
- Imperas releases free ISS for RISC-V CORE-V developers in the OpenHW ecosystem (Mar 29, 2021)
- GUC Enlists AWS Partner proteanTecs to Increase ASIC Reliability and Quality at Scale (Mar 29, 2021)
- Insights on Intel's Standalone Foundry Business (Mar. 29, 2021)
- Will Voice Control Become the Dominant User Interface? (Mar. 29, 2021)
- Strong Growth for 5G Mobile Devices (Mar. 29, 2021)
- Siemens delivers next-generation, comprehensive hardware-assisted verification system (Mar 26, 2021)
- GUC and Ansys Expedite Advanced-IC Designs for Next-Generation Applications with State-of-the-Art Simulation Workflow (Mar 26, 2021)
- Mitacs and OpenHW Group partner on $22.5M first-of-its-kind open-source research program (Mar 25, 2021)
- Intel CEO Pat Gelsinger Announces "IDM 2.0" Strategy for Manufacturing, Innovation and Product Leadership (Mar 25, 2021)
- Imagination launches IMG Labs to create breakthrough technologies (Mar 25, 2021)
- Revenue of Top 10 IC Design (Fabless) Companies for 2020 Undergoes 26.4% Increase YoY Due to High Demand for Notebooks and Networking Products, Says TrendForce (Mar 25, 2021)
- PLDA Joins ETP4HPC to share its expertise in High Speed Interconnect Solution IP with the European High Performance Computing Ecosystem (Mar 25, 2021)
- North American Semiconductor Equipment Industry Posts February 2021 Billings, Surpassing $3 Billion for Second Consecutive Month (Mar 25, 2021)
- CEA-Leti Goes For Optical Phased Arrays to Cut LiDAR Cost (Mar. 25, 2021)
- Intel Investing $20B in Building Foundry Business (Mar. 25, 2021)
- Cadence Successfully Tapes Out Tensilica SoC on GLOBALFOUNDRIES 22FDX Platform Using Adaptive Body Bias Feature (Mar 24, 2021)
- Synopsys Collaborates with Keysight Technologies to Deliver Integrated Custom Design Flow for 5G Designs (Mar 24, 2021)
- Achronix Adopts Movellus Maestro Clock Network for Its Speedster7t FPGAs (Mar 24, 2021)
- WISeKey Partners with Cortus to Secure Automated Vehicles Capable of Controlling All Aspects of Driving Without Human Intervention (Mar 24, 2021)
- GLOBALFOUNDRIES and Cadence Add Machine Learning Capabilities to DFM Signoff for GF's Most Advanced FinFET Solutions (Mar 24, 2021)
- CEVA Unveils MotionEngine Scout, a Highly-Accurate Dead Reckoning Software Solution for Indoor Autonomous Robots (Mar 24, 2021)
- More resilient cybersecurity for IoT devices (Mar. 24, 2021)
- (Re)Shoring Up Semiconductor Manufacturing (Mar 23, 2021)
- Valtrix and Codasip Cooperate on Verification of RISC-V Systems (Mar 23, 2021)
- Intel's tilt to foundry opens a door to upstart RISC-V technology (Mar. 23, 2021)
- Europe Aiming for Manufacturing Capacities for 2nm (Mar. 23, 2021)
- Software Driving Changes in Automotive Industry (Mar. 23, 2021)
- One-Way Data Transfer Secures Industry 4.0 Networks (Mar. 23, 2021)
- Chip Makers Must Learn New Ways to Play "D" (Mar 22, 2021)
- Flex Logix raises $55M to accelerate market adoption of AI inference and eFPGA solutions (Mar 22, 2021)
- Global Semiconductor Materials Market Sets New High With 5% Expansion in 2020, SEMI Reports (Mar 22, 2021)
- OpenPOWER Foundation Provides Microwatt for Fabrication on Skywater Open PDK Shuttle (Mar 22, 2021)
- Apple to Build New Mobile Wireless Design Center in Munich (Mar. 22, 2021)
- Will Fan-Out Wafer-Level Packaging Keep Moore's Law Valid? (Mar. 22, 2021)
- sureCore Unveils New Low Voltage Register Files (Mar. 20, 2021)
- Samsung, TSMC Spending to Dominate Advanced IC Technology Nodes (Mar. 19, 2021)
- Advanced Nodes Boosting Foundry Revenues (Mar. 18, 2021)
- Smart Lighting Platform "end to end" Management Solution licensed by leading European Lighting Company (Mar 18, 2021)
- Global Fab Equipment Spending Poised to Log Three Straight Years of Record Highs, SEMI Reports (Mar 18, 2021)
- SiFive and ArchiTek Enable Secure, Private, Flexible Edge AI Computing With AiOnIc Processor (Mar 18, 2021)
- More than Chiplets | Facebook Enters the Fray (Mar 18, 2021)
- Siemens' Veloce Virtual Network App Certified for IxVerify 3.0 (Mar 18, 2021)
- Sondrel designs its first Radiation-Hard chip (Mar 18, 2021)
- SMIC and Shenzhen government to invest $2.35 billion to build new foundry in China (Mar. 18, 2021)
- Japanese AI processor firm picks Risc-V for partner CPU (Mar. 18, 2021)
- Synopsys Launches Industry's First Complete IP Solution for PCI Express 6.0 (Mar 17, 2021)
- Cadence Unveils Next-Generation Sigrity X for Up to 10X Faster System Analysis (Mar 17, 2021)
- Samsung and TSMC Seeking to Spend Their Way to Worldwide Domination of Advanced IC Technology (Mar 17, 2021)
- Panasonic Starts Licensing IP Core for Semiconductors Complying with the IEEE 1901-2020 International Standard (Mar 17, 2021)
- Arasan announces its next generation of C-PHY/ D-PHY Combo IP Core compliant with the latest MIPI Specifications (Mar 17, 2021)
- US$150 billion needed in 5 years to catch up with TSMC: IC Insights (Mar. 17, 2021)
- South Korea and China Increase Patent Applications in Europe (Mar. 17, 2021)
- Alphawave IP and EnSilica Announce Partnership for Expansion in the United Kingdom and Europe (Mar 16, 2021)
- Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute (Mar 16, 2021)
- QuickLogic Joins DARPA Toolbox Initiative to Provide Mil/Aero/Defense Grade Programmable Logic (Mar 16, 2021)
- Secure-IC Announces Partnership With U.S. DARPA To Foster Security Technology Innovation (Mar 16, 2021)
- Socionext's latest generation of smart display controllers uses APIX3 technology from Inova Semiconductors (Mar 16, 2021)
- Ron Black Joins Codasip as Executive Chairman (Mar 16, 2021)
- Lattice Partners with DARPA Toolbox Initiative to Accelerate Technology Innovation (Mar 16, 2021)
- Qualcomm Completes Acquisition of NUVIA (Mar 16, 2021)
- James Mitarotonda Joins Rambus Board of Directors (Mar 16, 2021)
- NUVIA Selects Avery Design for Next Generation PCIe Verification (Mar 15, 2021)
- Rockley Selects Synopsys for Silicon Photonics Design Solutions (Mar 15, 2021)
- A high-performance and optimized Video IP: Chips&Media at the Semiconductor360 Live 2021 (Mar 15, 2021)
- MIPS, China's Loongson CPU Are Both Going All-in on RISC-V (Mar. 15, 2021)
- 2 charts show how much the world depends on Taiwan for semiconductors (Mar. 15, 2021)
- Open RF Association and MIPI Alliance Sign Cooperation Framework (Liaison) Agreement (Mar 12, 2021)
- Cornami Partners with Inpher, Pioneer in Secret Computing, to Deliver Quantum-Secure Privacy-Preserving Computing on Encrypted Data (Mar 12, 2021)
- First software-defined 5G New Radio demonstration over GEO satellite (Mar. 12, 2021)
- Vtool Appoints EmergeTek as Cogita Sales Representative (Mar. 11, 2021)
- Mixel, Rambus and Hardent Collaborate to Deliver State-of-the-Art Integrated MIPI Display Subsystem Solution (Mar 11, 2021)
- Allegro DVT Releases New Versions of its Encoder and Decoder IPs with Support for 12-bit sample size and 4:4:4 Chroma Format (Mar 11, 2021)
- SiPearl passes a key milestone for Rhea's launch by moving into an accelerated simulation phase with Siemens' Veloce platform (Mar 11, 2021)
- Tortuga Logic Announces Expansion of Product Portfolio with Development of New Security Governance Platform (Mar 11, 2021)
- OpenHW Group and Mitacs announce OpenHW Accelerate (Mar 11, 2021)
- https://www.eetimes.com/ai-drives-memory-interconnect-evolution (Mar. 11, 2021)
- AI Drives Memory Interconnect Evolution (Mar. 11, 2021)
- 10 Millionth Achronix Speedcore eFPGA IP Core Shipped (Mar 10, 2021)
- IC Insights Raises Its 2021 IC Market Forecast from 12% to 19% Growth (Mar 10, 2021)
- TSMC February 2021 Revenue Report (Mar 10, 2021)
- Compound Photonics Partners with GLOBALFOUNDRIES to Manufacture World's First Monolithic Microdisplay for Real-Time AR (Mar 10, 2021)
- USB 4.0, USB 3.2, USB 3.1, USB 3.0, USB 2.0, Device, Hub, Host & Dual Mode proven Interface IP Controllers are available immediately to License (Mar 10, 2021)
- Eta Compute's Low Power AI Vision Board Accelerates Design, Test, and Deployment of Transformative Embedded Vision Solutions (Mar 10, 2021)
- QuickLogic, SparkFun and Crowd Supply Launch the SparkFun Thing Plus - QuickLogic EOS S3 Development Kit (Mar 10, 2021)
- Codasip Announces Commercial Add-ons to SWeRV Core EH1 (Mar 09, 2021)
- GLOBALFOUNDRIES 22FDX RF Solution Provides the Basis for Next-Gen mmWave Automotive Radar (Mar 09, 2021)
- EPI EPAC1.0 RISC-V core boots Linux on FPGA (Mar 09, 2021)
- Synopsys ARC EV Processor Enables Kyocera Document Solutions to Launch AI-enabled Multifunctional Printer SoC (Mar 09, 2021)
- AMD and Xilinx Special Meetings of Stockholders to be Held on April 7, 2021 (Mar 09, 2021)
- Alphawave and PLDA Announce a Collaboration to Create Tightly-Integrated Controller and PHY IP Solutions for Interconnects Including PCIe 5.0, CXL and PCIe 6.0 (Mar 09, 2021)
- TSMC together with Apple are developing 2nm process technology (Mar. 09, 2021)
- Hsinchu Baoshan R&D center to work on 3nm process: TSMC (Mar. 09, 2021)
- GUC Monthly Sales Report - February 2021 (Mar 08, 2021)
- Automakers Will Go Fabless (Mar 08, 2021)
- UMC Reports Sales for February 2021 (Mar 08, 2021)
- Intel to Collaborate with Microsoft on DARPA Program (Mar 08, 2021)
- Intel stung for $2bn in Waco judgment (Mar 08, 2021)
- Progress in Importation of US Equipment Dispels Doubts on SMIC's Capacity Expansion for Mature Nodes for Now, Says TrendForce (Mar 08, 2021)
- Wait, What? MIPS Becomes RISC-V (Mar. 08, 2021)
- IAR unveils certified edition of its development toolchain for RISC-V (Mar. 05, 2021)
- GPU shipments soar once more in Q4 (Mar 04, 2021)
- Revenue per Wafer Climbs As Demand Surges for 5nm/7nm IC Processes (Mar 04, 2021)
- Thalia successfully completes 20th 22nm analog IP reuse engagement (Mar 04, 2021)
- IAR Systems announces availability of RISC-V development tools with certification for IEC 61508 and ISO 26262 (Mar 04, 2021)
- Leopard Imaging Collaborates with Socionext, Hailo, and AWS to Launch EdgeTuring (Mar 04, 2021)
- Airborne System Design Assurance: Aldec Adds 60+ New HDL Rules to ALINT-PRO's DO-254 Plug-In (Mar 04, 2021)
- BrainChip's Success in 2020 Advances Fields of On-Chip Learning and Ultra-Low Power Edge AI (Mar 04, 2021)
- Wanxiang Blockchain Forms RISC-V International Blockchain SIG with Ecosystem Partners (Mar 04, 2021)
- Silex Insight unleashes their new video codec (Colibri), that will shape the future of AV over IP distribution over 1GbE (Mar 04, 2021)
- Synopsys Announces Euclide to Accelerate Design and Verification Productivity (Mar 03, 2021)
- Achronix and Mobiveil Announce Partnership to Deliver High-Speed Controller IP and FPGA Engineering Services (Mar 03, 2021)
- TSMC Ramping Up Production of 5-nm Chips (Mar. 03, 2021)
- proteanTecs Joins the TSMC IP Alliance Program (Mar. 03, 2021)
- 28nm FD-SOI i.MX8 targets low power (Mar. 03, 2021)
- BrainChip's Success in 2020 Advances Fields of On-Chip Learning and Ultra-Low Power Edge AI (Mar. 03, 2021)
- GlobalFoundries to invest $1.4 bn to increase output at three units (Mar. 03, 2021)
- TSMC Ranks in Top-10 For Capacity in Three Wafer Size Categories (Mar. 03, 2021)
- FD-SOI Boosts Operating Frequency And Reduces Power Consumption (Mar. 03, 2021)
- Wave Goodbye, Hello MIPS as Chapter 11 Resolved (Mar 02, 2021)
- Global Semiconductor Sales Increase 13.2% year-to-year in January (Mar 02, 2021)
- RISC-V Fast Tracks Simpler Extensions (Mar. 02, 2021)
- Samsung Invests in Quantum Computing (Mar. 02, 2021)
- Flex Logix and DARPA Expand Partnership with the Addition of Silicon Proven EFLX eFPGA in 12 and 16 nm Process Technologies for DARPA's Toolbox Initiative (Mar 01, 2021)
- Arasan announces the immediate availability of its MIPI C-PHY / D-PHY Combo IP for SoC Designs on TSMC 22nm Process (Mar 01, 2021)
- Velodyne Lidar Licenses TSN IP Core from CAST (Mar 01, 2021)
- Imperas Donates Latest RV32/64K Crypto (scalar) Architectural Validation Test Suites to the RISC-V Verification Ecosystem (Mar 01, 2021)
- Introducing Dolphin Design's new Audio CODEC for TWS devices with ANC capabilities (Mar 01, 2021)
- Metrics Announces an EDA as a Service Partnership Program with Semiconductor Intellectual Property Vendors (Mar 01, 2021)
- Verisilicon High-Performance and High-Quality AI Video Processor Powers Leading Datacenters (Mar 01, 2021)
- AMD, TSMC & Imec Show Their Chiplet Playbooks at ISSCC (Mar 01, 2021)
- China's most important chipmaker SMIC could be a big winner from the global semiconductor shortage (Mar. 01, 2021)
- Automotive smart camera development with open platform turnkey solutions (Mar. 01, 2021)
- SCALINX takes strides in 5G communication infrastructures and radar markets with 10.5 million euro funding (Feb. 27, 2021)
- Is Taiwan a Ticking Time Bomb in the Semiconductor Supply Chain? (Feb. 27, 2021)
- Alphawave IP and Verisilicon Expand Partnership with $54M Multi-Year Exclusive Subscription Reseller Agreement for China Market (Feb 26, 2021)
- Rambus and AMD Extend Patent License Agreement (Feb 25, 2021)
- Palma Ceia SemiDesign Announces Nicky Wilkinson as Director IC Engineering (Feb 25, 2021)
- Samsung's foundry biz market share to increase in Q1 2021 (Feb. 25, 2021)
- BrainChip Inc. and NaNose Medical Successfully Detect COVID-19 in Exhaled Breath with Fast High-Accuracy Results (Feb 25, 2021)
- MulticoreWare Inc. Becomes CEVA's Trusted Partner for Imaging & Computer Vision (Feb 25, 2021)
- TSMC Ranks in Top-10 For Capacity in Three Wafer Size Categories (Feb 25, 2021)
- Achronix Announces 2020 Financial Results and Business Highlights (Feb 24, 2021)
- North American Semiconductor Equipment Industry Posts January 2021 Billings, Topping $3 Billion for First Time (Feb 24, 2021)
- Tianyihexin Licenses Codasip's L30 for Powering Intelligent Wearable Device Solutions (Feb 24, 2021)
- RISC-V International Unveils Fast Track Architecture Extension Process and Ratifies ZiHintPause Extension (Feb 24, 2021)
- AccelerComm Unveils Fully Integrated PUSCH Decoder to Supercharge 5G NR for Performance-Critical Channels (Feb 24, 2021)
- Xilinx Revolutionizes the Modern Data Center with Software-Defined, Hardware Accelerated Alveo SmartNICs (Feb 24, 2021)
- Andes Technology and Rambus Collaborate to offer Secure Solution for MCU and IoT Applications (Feb 24, 2021)
- Top 10 foundries expected to increase revenues by 20% (Feb. 24, 2021)
- IoT Product Development Market Challenges and Opportunities 2021-2025 (Feb. 24, 2021)
- CMC Microsystems and Deeplite seek to advance AI R&D (Feb. 24, 2021)
- Cadence Completes Acquisition of NUMECA (Feb 24, 2021)
- CEVA's MotionEngine Smart TV Software Comes to More Smart TV brands via LG webOS (Feb 24, 2021)
- Synopsys Delivers Breakthrough Performance with New ZeBu Empower Emulation System for Hardware-Software Power Verification (Feb 24, 2021)
- Eureka Technology IP Core Supports NASA's MARS 2020 Perseverance Rover Mission (Feb 23, 2021)
- Tiempo Secure is a winner of the French Government's Great Cybersecurity Challenge to make smart objects more resilient to cyberattacks (Feb 23, 2021)
- Nations' Latest BLE 5 IC Powered By CEVA Bluetooth Low Energy IP (Feb 23, 2021)
- SiPearl and Open-Silicon Research Collaborate to Accelerate Custom Silicon for High Performance Computing (HPC) Applications (Feb 23, 2021)
- TSMC's 3nm Process On Track For 2 Year, 2X Performance Improvement – Chairman (Feb. 23, 2021)
- Secure-IC and MosChip Announce Strategic Partnership to Provide Turnkey ASIC Solutions With Embedded Security for Edge Applications (Feb 22, 2021)
- Chipus Joins FDXcelerator Program Bringing Ultra-Low-Power and Compact Power Management Solution for Hearables and Wearables (Feb 22, 2021)
- CEA-Leti & Dolphin Design Report FD-SOI Breakthrough that Boosts Operating Frequency by 450% and Reduces Power Consumption by 30% (Feb 22, 2021)
- IAR Systems introduces 64-bit Arm core support in leading embedded development tools (Feb 22, 2021)
- Samsung Foundry Certifies Synopsys IC Validator for 5nm and 4nm Advanced Process Technologies (Feb 22, 2021)
- CEVA Moves to Standardize DSP-enabled Bluetooth Audio IP with New Bluebud Wireless Audio Platform for TWS Earbuds, Smartwatches and Wearables (Feb 22, 2021)
- Syntiant Adopts Movellus' Clock Network for its Low-Power NDP120 Deep Learning Processor (Feb. 22, 2021)
- Imagination's GPU selected by StarFive to create high-performance, small and low-cost BeagleV RISC-V AI single board computer (Feb 22, 2021)
- China chases semiconductor self-sufficiency (Feb. 22, 2021)
- Khronos and EMVA Collaborate to Gather Requirements for Embedded Camera and Sensor API Standards (Feb. 22, 2021)
- Achronix and Logic Fruit Introduce IP Solutions for Test and Measurement Applications (Feb 19, 2021)
- aicas and SiFive Bridge Flexibility and Performance with RISC-V, JamaicaVM Integration (Feb 19, 2021)
- Sales of Logic ICs Account for Largest Share of China's IC Market in 2020 (Feb 19, 2021)
- Moschip Unveils Focused Strategy For Turn-Key ASIC Solutions (Feb 19, 2021)
- ADAS and Its Unintended Consequences (Feb. 19, 2021)
- Enabling AI Vision at the Edge (Feb. 18, 2021)
- TSMC Will Raise to Expand Capacity Amid Chip Shortages (Feb. 18, 2021)
- New Website Dedicated to Advancing PUF Security Technology (Feb. 18, 2021)
- Micro Magic, Inc. Delivers Ultra Low Power 64-Bit RISC-V Core (Feb 18, 2021)
- Synopsys Posts Financial Results for First Quarter Fiscal Year 2021 (Feb 18, 2021)
- JEDEC Publishes DDR4 NVDIMM-P Bus Protocol Standard (Feb 18, 2021)
- PLDA Announces a Unique CXL Verification IP Ecosystem, Delivering Robust Verification That Reduces Time-to-Design for CXL 2.0 Applications (Feb 18, 2021)
- SPARK Microsystems Announces CDN$17.5 Million Financing (Feb 18, 2021)
- Mark Redford Named Vice President, Operations & Supply Chain for Palma Ceia SemiDesign - Former Arm Executive (Feb 18, 2021)
- Proposed Arm Buyout: Huang on So Many Levels (Feb 18, 2021)
- CEVA Appoints Jaclyn Liu to its Board of Directors; Bruce A. Mann Retires (Feb 17, 2021)
- Arteris IP Adds a Record 28 New Licensees in 2020 (Feb 17, 2021)
- Renesas Develops Automotive SoC Functional Safety Technologies for CNN Accelerator Cores and ASIL D Control Combining World-Class Performance and Power Efficiency (Feb 17, 2021)
- Veriest Solutions and CEVA develop functional safety verification methodology for automotive devices (Feb 17, 2021)
- The Promise & Pitfalls of Open Hardware Development (Feb. 17, 2021)
- Samsung Develops Industry's First High Bandwidth Memory with AI Processing Power (Feb. 17, 2021)
- New Automotive SoCs Provide a Window to ADAS Trends (Feb. 17, 2021)
- Tech: Why TSMC is the world's most underestimated tech giant (Feb. 17, 2021)
- Imec Showcases World's First Sub-5mW, IEEE 802.15.4z Ultra-Wideband Transmitter Chip (Feb 16, 2021)
- Objections grow to Nvidia-ARM deal (Feb 16, 2021)
- Flex Logix EFLX eFPGA in design for GLOBALFOUNDRIES 22FDX (Feb 16, 2021)
- CEVA, Inc. Announces Fourth Quarter and Year End 2020 Financial Results (Feb 16, 2021)
- CHIPS Alliance Welcomes Antmicro and VeriSilicon to the Platinum Membership Level (Feb 16, 2021)
- ISSCC Plenary: A Bright Foundry Future (Feb 16, 2021)
- Globalfoundries to manufacture secure chips for US DoD (Feb. 16, 2021)
- New SMUs to optimize battery life in IoT and semiconductors (Feb. 16, 2021)
- La French Tech Unveils 2021 Startup Cohort (Feb. 16, 2021)
- SMIC unable to keep up with demand amid shortage and sanctions (Feb. 16, 2021)
- Semiconductor Industry: TSMC Invests in Japan for 3D SoIC (Feb. 16, 2021)
- High Performance Computing Demand Puts Premium on Backend Engineering Expertise (Feb 15, 2021)
- U.S. Department of Defense Partners with GLOBALFOUNDRIES to Manufacture Secure Chips at Fab 8 in Upstate New York (Feb 15, 2021)
- videantis passes milestone of enabling 10 million production vehicles (Feb 15, 2021)
- 5GNR L1/L2/L3 Phy+SW Stack IP available for SoC & FPGA Ue & gNodeB development (Feb 15, 2021)
- Silex Insight partners with Crypto Quantique to deliver end-to-end IoT security (Feb 15, 2021)
- Comcores sells wireless assets to Analog Devices (Feb 12, 2021)
- The Arm ecosystem ships a record 6.7 billion Arm-based chips in a single quarter (Feb 12, 2021)
- Israeli AI Chip Startup Raises Seed Funding (Feb 11, 2021)
- Lattice FPGAs with High I/O Density Bring Low Power Signal Bridging and Interface Management to Edge Devices (Feb 11, 2021)
- Fraunhofer IIS and intoPIX announce joint licensing program for JPEG XS (Feb 11, 2021)
- TSMC to Raise $9 Billion for Expansion Amid Shortages (Feb 11, 2021)
- Siemens and ADS deliver HDAP enablement solutions (Feb. 11, 2021)
- Top Five Wafer Capacity Leaders Raise Share of Global Capacity to 54% (Feb 10, 2021)
- Tiempo Secure announces the availability of its Secure Element IP core on GF 22 FDX and TSMC 16 FFC (Feb 10, 2021)
- eTopus Technology Announces Innovative SerDes Technology for Data Center, Cloud, Edge, and 5G Base Stations (Feb 10, 2021)
- QuickLogic Launches Qomu - an Open Source SoC Dev Kit That Fits in Your USB Port (Feb 10, 2021)
- Cloud-Native Processors for a Cloud-Native World (Feb. 10, 2021)
- Integrated solution for vehicle ethernet audio video bridging (Feb. 10, 2021)
- Arteris IP Adds Two Veteran Executives to its Board of Directors (Feb 10, 2021)
- Gartner Says Apple and Samsung Extended Their Lead as Top Semiconductor Customers in 2020 (Feb 09, 2021)
- Palma Ceia SemiDesign Expands Asia Team, Names Bo Liu Senior Director of Engineering in China (Feb 09, 2021)
- TSMC January 2021 Revenue Report (Feb 09, 2021)
- CHIPS Alliance Brings on Rob Mains as New Executive Director (Feb 09, 2021)
- Fraunhofer IPMS presents TSN IP core designs with low latency for automotive on-board networks (Feb 09, 2021)
- Synopsys Receives Customers' Choice Award for Paper Presented at TSMC 2020 Open Innovation Platform Ecosystem Forum (Feb 09, 2021)
- Device Authority, EPS Global and Intrinsic ID Announce Strategic Partnership (Feb 09, 2021)
- UK government helps NWF develop GaN foundry process (Feb. 09, 2021)
- TSMC to set up 3DIC material R&D center in Japan (Feb. 09, 2021)
- Time sensitive networking is supporting Ethernet applications (Feb. 09, 2021)
- Renesas updates R-Car V3H with improved deep learning performance (Feb. 09, 2021)
- CEA-Leti Announces EU Project to Create Dynamically Programmable Wireless 6G Environments (Feb. 09, 2021)
- European Semiconductor Sales Fell by 6% in 2020 (Feb. 09, 2021)
- UMC Reports Sales for January 2021 (Feb 08, 2021)
- Renesas to adopt Crypto Quantique's QuarkLink security platform as part of its microcontroller ecosystem for the IoT (Feb 08, 2021)
- DVB-S2X Narrowband Demodulator / Decoder IP Core licensed to a leading US TV Semiconductor Company (Feb 08, 2021)
- Rianta Releases 800G Optimized Single Channel Ethernet Controller IP Core (Feb 08, 2021)
- GUC Monthly Sales Report - Jan 2021 (Feb 08, 2021)
- Global Unichip Corporation and Flex Logix Achieve First-Time Working Silicon on Joint ASIC Development Using EFLX Embedded FPGA (eFPGA) IP (Feb 08, 2021)
- Renesas and Dialog Semiconductor to Join Forces to Advance Global Leadership in Embedded Solutions (Feb 08, 2021)
- Synopsys Selected for Rapid Assured Microelectronics Prototypes Program (Feb 08, 2021)
- 2021 Auto Industry Outlook: What Can We Expect from BEVs, Connected Cars & Software? (Feb. 08, 2021)
- Preconfigured platforms connect IoT applications through the cloud (Feb. 08, 2021)
- Xanadu and CMC Microsystems to collaborate on quantum computing (Feb. 07, 2021)
- Open Source: It's Not Just for Software Anymore (Feb 04, 2021)
- Crypto Quantique Opens IoT Security Platform to Multiple RoTs (Feb 04, 2021)
- Can Open Source Hardware Emulate Linux? (Feb 04, 2021)
- Pulsic Delivers Real-Time, Accurate, Layout Previews to Analog Circuits Designers with the new Animate Preview (Feb 04, 2021)
- Arteris IP FlexNoC Interconnect and Resilience Package Supports Socionext's 5nm Automotive Chip Production (Feb 04, 2021)
- SMIC Reports 2020 Fourth Quarter Results (Feb 04, 2021)
- Socionext Adopts TSMC's 5-nanometer Technology for Custom SoCs Targeting Next-Generation Automotive Applications (Feb 04, 2021)
- IoT security platform delivers fast, comprehensive connectivity and device management for any root-of-trust (Feb 04, 2021)
- SiTune Introduces World's First 5G Infrastructure Transceiver Solutions (Feb 04, 2021)
- Sondrel builds on 7nm design work to offer 5nm (Feb 04, 2021)
- RISC-V Processor Designs Emerge (Feb 04, 2021)
- AWS and Arm Demonstrate Production-Scale Electronic Design Automation in the Cloud (Feb 04, 2021)
- Xilinx Collaborates with Fujitsu to Support 5G Deployments in the US (Feb 04, 2021)
- Total MPU Sales Surprise With Strong Gains in 2020, More Upside in 2021 (Feb 04, 2021)
- Samsung to expand MRAM applications (Feb. 04, 2021)
- French Team on Route Towards an Interposer Prototype for Quantum And Control Chips Integration at Very Low Temperature (Feb. 04, 2021)
- SCALINX, Semiconductor Fabless Focusing on Signal Conversion Chips Secures 10.5 Million Euros Funding (Feb 03, 2021)
- Sondrel supports 5nm Samsung and TSMC nodes (Feb. 03, 2021)
- Italian startup for 3D chiplet package co-design (Feb. 03, 2021)
- European project for commercial silicon quantum processor (Feb. 03, 2021)
- CEA Is the First Research Center to Acquire A Cryogenic Prober for Testing Quantum Bits (Feb. 03, 2021)
- NXP Launches Flexible IoT Cloud Platform to Securely Manage and Connect Edge Devices (Feb. 03, 2021)
- Renesas Expands Low-Power Industrial and IoT Applications Reach With New RA4M2 MCU Group in Arm Cortex-Based MCU Family (Feb. 03, 2021)
- Palo Alto Networks expands IoT security to healthcare (Feb. 03, 2021)
- SCALINX, Semiconductor Fabless Focusing on Signal Conversion Chips Secures 10.5 Million Euros Funding (Feb. 03, 2021)
- SmartDV 2020 Revenue Increases by 51% (Feb. 03, 2021)
- Xylon Announces Availability of Its 2.3 MP HDR Automotive Video Camera (Feb 03, 2021)
- Top 10 IC Growth Categories Target Emerging Applications in 2021 (Feb. 03, 2021)
- RISC-V Processor Designs Emerge (Feb. 03, 2021)
- Rambus Reports Fourth Quarter and Fiscal Year 2020 Financial Results (Feb 02, 2021)
- Intrinsic ID Reports Strong Growth in 2020 for Its Semiconductor Security Solution as COVID Accelerates Shift to Online Working and Learning (Feb 02, 2021)
- This is How Intel Gets Out of Manufacturing (Feb 02, 2021)
- LeapMind Announces Participation in Alliance Program of Xilinx, a Major US FPGA Innovator (Feb 02, 2021)
- 2020 Global Silicon Revenue Remains Stable as Wafer Area Shipments Edge Up Despite COVID-19 Disruption (Feb 02, 2021)
- Custom graphics extensions boost RISC-V (Feb. 02, 2021)
- Open Source: It's Not Just for Software Anymore (Feb. 02, 2021)
- Siemens and MaRS partner to accelerate innovation for startups in development of autonomous and connected vehicles (Feb. 02, 2021)
- ASIL-D DAQ system for automotive battery systems (Feb. 02, 2021)
- AnalogX Announces World's Lowest Power SERDES IP in 7nm and 6nm and Expansion Plan (Feb 01, 2021)
- Advanced DDR Memory Interface PHY's and Controllers IP Cores available in advanced process nodes including TSMC 7FFC (Feb 01, 2021)
- Top-10 IC Growth Categories Target Emerging Applications in 2021 (Feb 01, 2021)
- Imagination and PaddlePaddle announce collaboration to grow the ecosystem for artificial intelligence (AI) for developers worldwide (Feb 01, 2021)
- Synapse Design and Flex Logix Tape Out Mutual Customer ASIC on a New Process in Less Than a Year Using Embedded FPGA (eFPGA) Technology (Feb 01, 2021)
- Siemens Digital Industries Software appoints new Senior Vice President and Managing Director for Asia Pacific region (Feb 01, 2021)
- Global Semiconductor Sales Increase 6.5% to $439 billion in 2020 (Feb 01, 2021)
- Jieli joins TempowOS Chipset Partner Program (Feb 01, 2021)
- PUFsecurity Crypto Co-processor PUFiot Passed NIST CAVP Certification (Feb 01, 2021)
- Reports: NXP, Infineon top Samsung's shopping list (Feb 01, 2021)
- Imagination IP in Chinese AI integration (Feb. 01, 2021)
- Samsung Electronics Interested in Acquiring Automotive Semiconductor Companies (Feb. 01, 2021)
- China aims to strengthen its semiconductor supply chain with new standards group that includes Huawei, SMIC (Jan. 29, 2021)
- UMC profit surges on robust semiconductor demand (Jan. 28, 2021)
- Adopt the intoPIX JPEG XS Plugin for Adobe Premiere and ease your live video workflow (Jan 28, 2021)
- RV64X: A Free, Open Source GPU for RISC-V (Jan 28, 2021)
- Amber Solutions Closes 2020 With Series B Funding Totaling More Than $8.5 Million (Jan 28, 2021)
- Palma Ceia SemiDesign Announces PCS1100 Wi-Fi 6E 4×4:4 Transceiver (Jan 28, 2021)
- Intrinsic ID's QuiddiKey PUF Selected by Fungible in Drive to Secure Next Gen Data Centers (Jan 28, 2021)
- EdgeQ Adds Former Qualcomm CEO Paul Jacobs & CTO Matt Grob as Advisors to Disrupt the Current Closed RAN Ecosystem with RISC-V based Highly Programmable 5G and AI Platform (Jan 28, 2021)
- Faraday Reports Fourth Quarter 2020 Revenues at NT$1,430 Million, 2020 Annual Revenues NT$5,495 Million, Mass Production Up 18% YoY (Jan 28, 2021)
- Xilinx Reports Third Quarter Fiscal Year 2021 Results (Jan 28, 2021)
- MPEG LA Announces Development of VVC (Versatile Video Coding) Pool License (Jan 28, 2021)
- Synopsys Demonstrates Silicon Proof of DesignWare 112G Ethernet PHY IP in 5nm Process for High-Performance Computing SoCs (Jan 28, 2021)
- Palma Ceia SemiDesign Announces PCS1100 Wi-Fi 6E 4x4:4 Transceiver (Jan 28, 2021)
- IoT Everywhere (Jan. 28, 2021)
- Flex Logix Pairs its InferX X1 AI Inference Accelerator with the High-Bandwidth Winbond 4Gb LPDDR4X Chip to Set a New Benchmark in Edge AI Performance (Jan 27, 2021)
- Andes Technology Corp. Announces EdgeQ to Deliver Converged 5G and AI Silicon Platform with AndesCore RISC-V License for the 5G Open Radio Access Network (Jan 27, 2021)
- IC Insights Releases the New 2021 Edition of The McClean Report (Jan 27, 2021)
- Palma Ceia SemiDesign Names Robert Young Chief Technology Officer (Jan 27, 2021)
- Korea's Presence in Automotive Semiconductor Market Hardly Noticeable (Jan. 27, 2021)
- Edge AI SoC for smart tiny devices (Jan. 27, 2021)
- Patent report highlights AI boom (Jan. 27, 2021)
- Mirabilis Design integrates Fast Functional Processors into VisualSim Architect to close the software design, development and validation loop (Jan 27, 2021)
- Synopsys Delivers Industry's First Integrity and Data Encryption Security IP Modules for PCI Express 5.0 and Compute Express Link 2.0 Specifications (Jan 27, 2021)
- EvoNexus partners with Arm to Accelerate Launch of New Semiconductor Startups (Jan 27, 2021)
- Gowin Semiconductor Announces AEC-Q100 Automotive Grade FPGA Availability (Jan 27, 2021)
- North American Semiconductor Equipment Industry Posts December 2020 Billings (Jan 27, 2021)
- HDL Design House Partners with Marketing Platform AnySilicon (Jan. 27, 2021)
- PathPartner Announces PT605 System on Module (SoM) & Smart Camera Reference Design Kit based on Qualcomm® QCS605 SoC (Jan. 27, 2021)
- CXL gathers speed with 2.0 spec (Jan 26, 2021)
- USB 4.0, USB 3.2, USB 3.0, USB 2.0 Silicon Proven PHYs in TSMC, UMC & SMIC Foundries available from T2MIP (Jan 26, 2021)
- Edge AI company AlphaICs raises $8 million in funding round led by Emerald Technology Ventures and Endiya Partners (Jan 26, 2021)
- Imperas extends RISC-V processor verification ecosystem (Jan. 26, 2021)
- CEA-Leti Reports Breakthrough High-Performance Gyroscope For Automotive, Aeronautic and Industrial Applications (Jan. 26, 2021)
- U-blox Integrates Cellular and GNSS in a Single SiP (Jan. 26, 2021)
- 5G Mixes, Matches Memories (Jan. 26, 2021)
- The world is dangerously dependent on Taiwan for semiconductors (Jan. 26, 2021)
- 2020 Activities, Outlook for 2021 & Update of the Financial Objectives: Kalray Aims to Become a European Champion in Intelligent Processors (Jan 25, 2021)
- Avery Design Announces CXL 2.0 VIP (Jan 25, 2021)
- KeyASIC Inked Technologies and IP Deal of RM21Mil (Jan 25, 2021)
- Imperas Leads The RISC-V Processor Verification Ecosystem (Jan 25, 2021)
- SMIC urges China's chipmakers to embrace advanced packaging as Moore's Law slows nanometre node progress and US sanctions bite (Jan. 25, 2021)
- VSORA AD1028 Named "Best Processor IP" by The Linley Group (Jan. 25, 2021)
- eInfochips Wins Design Services Company of the Year Award from IESA (Jan 22, 2021)
- MediaTek Launches 6nm Dimensity 1200 Flagship 5G SoC with Unrivaled AI and Multimedia for Powerful 5G Experiences (Jan 21, 2021)
- Faraday Unveils Complete Imaging and Display High-Speed Interface IP Set on UMC 28nm and 40nm Processes (Jan 21, 2021)
- Arasan announces its Total eMMC IP solution for TSMC 22nm process (Jan 21, 2021)
- Silvaco Acquires Physical Verification Solution Provider POLYTEDA CLOUD LLC (Jan 21, 2021)
- Foxconn and Winbond Make Strategic Investment in Kneron (Jan 21, 2021)
- Samsung Foundry Certifies Analog FastSPICE Platform from Siemens for Early Design Starts on 3nm GAA Process Technology (Jan 21, 2021)
- It's Time to Look at FD-SOI (Again) (Jan. 21, 2021)
- Samsung wins Intel foundry order; TSMC takes GPU deal (Jan. 21, 2021)
- Attopsemi Released White Paper "I-fuse - Most Reliable and Fully Testable OTP" (Jan 20, 2021)
- Cadence to Acquire NUMECA to Expand System Analysis Capabilities with Computational Fluid Dynamics (Jan 20, 2021)
- Industry R&D Spending To Rise 4% After Hitting Record in 2020 (Jan 20, 2021)
- Powerful FPGA Design Creation and Simulation IDE Adds VHDL-2019 Support & OSVVM Enhancements (Jan 20, 2021)
- Nordic Development Kit provides easy access to AI and ML (Jan. 20, 2021)
- Dual Mode Bluetooth v5.2 SW Link Layer, Protocol Stack SW, Profiles licensed for ultra-low power 22nm True Wireless (TWS) Earbuds SoC (Jan 19, 2021)
- Renesas Launches New General-Purpose 64-Bit RZ/G2L Group of MPUs with Latest Arm Cortex-A55 for Improved AI Processing (Jan 19, 2021)
- Sondrel Selects Synopsys Fusion Design and Verification Platforms to Displace Legacy Design Tools (Jan 19, 2021)
- CEA-Leti Reports Machine-Learning Breakthrough That Opens Way to Edge Learning (Jan. 19, 2021)
- What's next for FPGA maker Achronix post-IPO? (Jan. 19, 2021)
- DCD With EBBM in USA & Greece (Jan 18, 2021)
- TSMC Boosts Capital Expenditure Budget on Strong Outlook (Jan 18, 2021)
- PLDA Announces XpressLINK-SOC CXL Controller IP with Support for the AMBA CXS Issue B Protocol (Jan 18, 2021)
- Intel outsources Core i3 to TSMC's 5nm process (Jan. 18, 2021)
- TSMC's Massive Investment Plan Gives Samsung Electronics Plenty to Ponder on (Jan. 18, 2021)
- Protocol and Interface Agnostic Universal D2D Controller for HPC and Chiplets (Jan. 18, 2021)
- USB 3.2: A USB Type-C Challenge for SoC Designers (Jan. 15, 2021)
- Arasan Announces the Immediate Availability of its 2nd Generation MIPI D-PHY v1.1 IP for TSMC 22nm Process Technology (Jan 14, 2021)
- SOI Industry Consortium Joins SEMI as Strategic Association Partner (Jan. 14, 2021)
- Semiconductor Industry: Continuous Semiconductor Supply Shortage (Jan. 14, 2021)
- Ginger Lee Named Chief Financial Officer for Palma Ceia SemiDesign (Jan 14, 2021)
- Intel Appoints Tech Industry Leader Pat Gelsinger as New CEO (Jan 14, 2021)
- BeagleBoard.org and Seeed Introduce the First Affordable RISC-V Board Designed to Run Linux (Jan 14, 2021)
- TSMC Reports Fourth Quarter EPS of NT$5.51 (Jan 14, 2021)
- Chips&Media Adds Extraordinary Features in the Next-Generation Video Codec IPs, introducing the WAVE6 Series (Jan 14, 2021)
- Gartner Says Worldwide Semiconductor Revenue Grew 7.3% in 2020 (Jan 14, 2021)
- Andes Technology and Rafael Microelectronics Announce a Strategic Partnership to Provide High Power Efficiency Wireless IP Solutions for IoT Devices (Jan 14, 2021)
- TSMC to Kick off Mass Production of Intel CPUs in 2H21 as Intel Shifts its CPU Manufacturing Strategies, Says TrendForce (Jan 14, 2021)
- Qualcomm to Acquire NUVIA (Jan 14, 2021)
- Jim Keller joins Tenstorrent as President and CTO. (Jan 14, 2021)
- China tech firm releases the world's first RISC-V structured PC (Jan. 14, 2021)
- Value of Semiconductor Industry M&A Agreements Sets Record in 2020 (Jan 13, 2021)
- Arm's powerful compute and graphics platform at the heart of the new Samsung Exynos 2100 (Jan 13, 2021)
- Netflix Now Streaming xHE-AAC Audio on Android Mobile (Jan 13, 2021)
- Syntiant Surpasses Milestone of 10 Million Processors Shipped (Jan 13, 2021)
- AMD's Xilinx Acquisition Moves Forward As Regulatory Waiting Period Expires (Jan. 13, 2021)
- Alibaba, Tencent and Baidu spared from US investor blacklist (Jan. 13, 2021)
- Synopsys and Socionext Expand Collaboration to Deploy HBM2E IP for 5-Nanometer Process in AI and High-Performance Computing SoCs (Jan 12, 2021)
- Arteris IP FlexNoc Interconnect and Resilience Package Licensed by Hailo for Artificial Intelligence (AI) Chip (Jan 12, 2021)
- Secure-IC And Menta Co-Develop Solution To Optimize Embedded Cybersecurity (Jan 12, 2021)
- CEVA Extends its Leadership in High Performance Scalable Sensor Hub DSPs with 2nd Generation SensPro Family (Jan 12, 2021)
- SEGGER introduces new Open Flashloader for direct programming of any RISC-V system (Jan 12, 2021)
- Flex Logix Appoints Dana McCarty as Vice President of Sales and Marketing for AI Inference Products (Jan 11, 2021)
- ESD Alliance Reports Strong Electronic Design Automation Industry Revenue Growth for Q3 2020 (Jan 11, 2021)
- Official Commercial Launch of Efficiera Ultra-Low Power AI Inference Accelerator IP Core (Jan 11, 2021)
- DSP Concepts and Cambridge Consultants work to accelerate audio and voice innovation (Jan 11, 2021)
- Wi-Fi Alliance Wi-Fi predictions for 2021 (Jan 11, 2021)
- Ambarella introduces CV5 high performance AI vision processor for single 8K and multi-imager AI cameras (Jan 11, 2021)
- UMC Reports Sales for December 2020 (Jan 08, 2021)
- Achronix to List on Nasdaq Through Merger with ACE Convergence (Jan 08, 2021)
- TSMC December 2020 Revenue Report (Jan 08, 2021)
- 6GHz for Wi-Fi or 5G? And the Winner is... (Jan. 07, 2021)
- China Forecast to Fall Far Short of its "Made in China 2025" Goals for ICs (Jan 07, 2021)
- Andes Technology Provides RISC-V CPU Core to SK Telecom (Jan 07, 2021)
- Syntiant Introduces Second Generation NDP120 Deep Learning Processor for Audio and Sensor Apps (Jan 07, 2021)
- DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor (Jan 07, 2021)
- Kevin Steptoe Joins Palma Ceia SemiDesign as EVP Program Management (Jan 07, 2021)
- GUC Monthly Sales Report - Dec 2020 (Jan 06, 2021)
- More HDMI 2.1 Enabled Products Reach The Market Bringing Advanced Consumer Entertainment Features To a Wide Audience (Jan 06, 2021)
- Achronix in talks to IPO (Jan 06, 2021)
- Industry Veterans Cathal Phelan, John Kent, and Michael Reiha Join Silvaco Technical Advisory Board (Jan 06, 2021)
- Edgewater Announces New Funding and Organizational Changes (Jan 06, 2021)
- Sequans Introduces Calliope 2: A New Generation of LTE Cat 1 Technology for IoT Applications Requiring Higher Than LTE-M Speed (Jan 06, 2021)
- Imagination, update on 2020 progress (Jan 06, 2021)
- CFX announces commercial availability of anti-fuse OTP technology on 90nm BCD process (Jan 06, 2021)
- Semiconductor Industry: Expect Record-high Foundry Investment in 2021 (Jan. 06, 2021)
- IQ-Analog Antenna Processor ASIC Powers Lockheed Martin Phased Array Sensors (Jan. 06, 2021)
- UK competition authority to investigate Arm-Nvidia deal (Jan. 06, 2021)
- CEVA and DARPA Establish Partnership for Technology Innovation (Jan 05, 2021)
- Arteris IP FlexNoC Interconnect and Resilience Package Licensed by MegaChips for Automotive Ethernet TSN Switch Chip (Jan 05, 2021)
- Global Smartphone Production Expected to Reach 1.36 Billion Units in 2021 as Huawei Drops Out of Top-Six Ranking, Says TrendForce (Jan 05, 2021)
- EPS Global and Intrinsic-ID Announce Strategic Partnership (Jan 05, 2021)
- Where Are GPUs Headed in 2021? (Jan. 05, 2021)
- EU Hexa-X Project Gets €12m to Develop 6G Vision (Jan. 05, 2021)
- SMIC gains a rise in their share value (Jan. 05, 2021)
- Greek IP company Adveos bought by Shanghai-based Beken (Jan 04, 2021)
- OmniVision Announces World's First Dedicated Driver Monitoring System ASIC With Integrated AI Neural Processing Unit, Image Signal Processor and DDR3 Memory (Jan 04, 2021)
- Global Semiconductor Sales Increase 7 Percent Year-to-Year in November (Jan 04, 2021)
- Edge AI: Energy-saving "building blocks" for smart end devices (Jan. 04, 2021)
- 4D Imaging Radar Looks to Advance ADAS and Level 5 Automation (Jan. 04, 2021)
- GaN Devices in LiDAR System Design (Jan. 04, 2021)
- TSMC and Samsung to face major issues in the development of 3nm (Jan. 02, 2021)
- TSMC, other foundries' revenue expected to reach new high in 2021 (Dec. 31, 2020)
- Foundry Revenue Expected to Reach New High in 2021 (Dec. 30, 2020)
- Prospects for the Semiconductor Industry in the Post-COVID Era (Dec. 30, 2020)
- Fabless Company Share of IC Sales to Set New Record in 2020 at 32.9% (Dec 29, 2020)
- Foundry Revenue Expected to Reach New High in 2021 with Close to 6% YoY Growth as Capacities Remain Scarce Across Industry, Says TrendForce (Dec 29, 2020)
- Graphcore raises $222 million in Series E Funding Round (Dec 29, 2020)
- Why the next 10 years may belong to ARM (Dec. 29, 2020)
- Advanced Packaging For More-than-Moore Era (Dec. 28, 2020)
- Wave Computing and MIPS Technologies Reach Agreement to Exit Bankruptcy (Dec. 28, 2020)
- United States, Europe and China Leading AI Development (Dec. 24, 2020)
- Chip Startups are Gaining Traction in Auto Industry (Dec. 24, 2020)
- New iPhone Models Become Key to Qualcomm's Top Spot in 3Q20 Revenue Ranking of Global Top 10 IC Design (Fabless) Companies, Says TrendForce (Dec 23, 2020)
- North American Semiconductor Equipment Industry Posts November 2020 Billings (Dec 23, 2020)
- WiLAN Subsidiary Acquires Substantial Patent Portfolio from MediaTek (Dec 23, 2020)
- iWave Unveils the Implementation of ARINC 818-2 IP Core On Microsemi PolarFire FPGA (Dec 23, 2020)
- Top deals in 2020 (Dec. 22, 2020)
- Creonic Participates in Horizon 2020 EPIC Research Project (Dec 21, 2020)
- MosChip Technologies Achieves ISO 9001:2015 Certification (Dec 21, 2020)
- Retune DSP's Wake Word Engine Now Available for CEVA Audio/Voice DSPs (Dec 21, 2020)
- Rianta Releases AES Crypto and HMAC Acceleration ASIC IP Cores (Dec 21, 2020)
- Secure-IC announces the availability of its protection technologies in the cloud (Dec 18, 2020)
- Latest Release of Lattice sensAI Solutions Stack Delivers up to 6X Performance Boost on Award-Winning CrossLink-NX FPGAs (Dec 18, 2020)
- What To Expect From the IC Industry in 2021 (Dec 18, 2020)
- SMIC Undergoes Management Team Shakeup – Again (Dec. 18, 2020)
- CEA-Leti Scientists Present In-Memory Computing Pathways for Edge-AI & Neural Networks with 3D Architectures & Resistive-RAM (Dec. 18, 2020)
- Global semiconductor shortage puts pressure on tech supply chain (Dec. 18, 2020)
- Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs (Dec 17, 2020)
- Probing the Apple M1's Hidden Depths (Dec 17, 2020)
- SMIC Management Team Undergoes Shakeup - Yet Again (Dec 17, 2020)
- AccelerComm join the O-RAN ALLIANCE to improve interoperability and maximize spectral efficiency (Dec 17, 2020)
- Nimbix Announces First Multi-cloud HPC Platform With Support For Arm (Dec 17, 2020)
- Mentor Finally Becomes Siemens EDA From January 2021 (Dec 17, 2020)
- Andes Technology Passes DUNS Registered Certificate (Dec 17, 2020)
- Xiphera contributes to Linux kernel (Dec 17, 2020)
- AWS Deploys Synopsys VCS on Arm-based AWS Graviton2 to Accelerate SoC Development (Dec 17, 2020)
- IAR Systems enables Linux-based Continuous Integration and automated workflows for RISC-V (Dec 17, 2020)
- SK Hynix's Foundry in China Starts Volume Production (Dec. 17, 2020)
- France awards Soitec-led European consortium for semiconductor innovation (Dec. 17, 2020)
- 5 Companies Owned by Nvidia (Dec. 17, 2020)
- Sofics and Hardent join Mixel's MIPI ecosystem to provide designers a complete MIPI solution (Dec 16, 2020)
- UVM Reference Implementation Aligned with IEEE 1800.2-2020 Standard (Dec 16, 2020)
- Vulkan SDK, Tools and Drivers are Ray Tracing Ready (Dec 16, 2020)
- AIStorm Raises $16M in Oversubscribed Series B Funding to Commercialize AI-in-Sensor Chips (Dec 16, 2020)
- The Electric Vehicles Are Coming! (Dec. 16, 2020)
- China's No 1 chipmaker SMIC gives ex-TSMC veteran top role, highlighting need for pragmatism amid push for home-grown tech (Dec. 16, 2020)
- Eta Compute Closes $12.5 Million Series C Funding Led By Synaptics (Dec 15, 2020)
- Xenergic's SRAM For Next Generation Of Ultra-Low Power Products (Dec 15, 2020)
- CEA Combines 3D Integration Technologies & Manycore Architectures to Enable High-Performance Processors for Exascale (Dec. 15, 2020)
- Platform combines low-power SoC with energy-efficient AI software (Dec. 15, 2020)
- SensiML Introduces Free Community Edition of Analytics Toolkit (Dec. 15, 2020)
- Telechips selects the latest Arm IP for its next-generation automotive SoC (Dec 14, 2020)
- Blaize Delivers First Open and Code-free AI Software Platform Spanning the Entire Edge AI Application Lifecycle (Dec 14, 2020)
- Lattice Propel Accelerates Time-to-Market for Embedded Processor-based Designs on Latest Nexus Platform FPGAs (Dec 14, 2020)
- Nextera Video and Adeas Announce SDI Core, SMPTE ST 2022-8, and NMOS IS-09 as the Latest Additions to their Industry-Leading SMPTE ST 2110 Video over IP FPGA Core Set (Dec 14, 2020)
- Cartesiam Transforms Edge AI Development for Industrial IoT (Dec 14, 2020)
- Synthara targets breakthrough edge-AI chips with support from a global coalition of investors and R&D partners (Dec 14, 2020)
- CORE-v CVE4 RTL Freeze Milestone Achieved (Dec 14, 2020)
- Mass production of CoreHW RF Switch has started (Dec 14, 2020)
- Omni Design Augments Partnership to Accelerate Product Development (Dec 14, 2020)
- Time holds the key to 6G (Dec. 14, 2020)
- Mentor changes its name to Siemens EDA (Dec. 14, 2020)
- RISC-V And Marvell Technologies Advances Enable Storage Solutions (Dec. 14, 2020)
- Redtree Solutions offers Agile Analog IP across Europe (Dec. 14, 2020)
- CAST JPEG IP Cores Deliver Outstanding Results in the New High Resolution LXT Cameras by Baumer (Dec 11, 2020)
- Daiteq Selected as the First ESA NOEL-V User (Dec 11, 2020)
- The DDR5 Revolution: Promise & Challenges Ahead (Dec. 11, 2020)
- Can China Become Self-reliant in Semiconductors? (Dec. 11, 2020)
- Renesas Strengthens IP License Portfolio with IP Utilities to Facilitate Device Development (Dec 10, 2020)
- Green Hills Software Adds RTOS Support to Its Extensive Product Portfolio for RISC-V-based SoCs (Dec 10, 2020)
- eMemory & PUFsecurity Announce with UMC the World's First PUF-based Secure Embedded Flash Solution (Dec 10, 2020)
- Foundry Capex to Account for 34% of Total Semi Capex in 2020 (Dec 10, 2020)
- Imperas releases new RISC-V Processor Verification IP to drive RISC-V adoption forward with a flexible methodology for all SoC adopters (Dec 10, 2020)
- Achronix Announces Appointment of Mark Voll as New Chief Financial Officer (Dec 10, 2020)
- TSMC November 2020 Revenue Report (Dec 10, 2020)
- Cobham Advanced Electronic Solutions Introduces Support for Wind River VxWorks RTOS for NOEL-V Processor (Dec 10, 2020)
- JEDEC Advances Universal Flash Storage (UFS) Removable Card Standard 3.0 (Dec 09, 2020)
- BrainChip Ships Akida Evaluation Boards (Dec 09, 2020)
- CHIPS Alliance to Collaborate with RISC-V to Standardize an Open Unified Memory Leveraging OmniXtend (Dec 09, 2020)
- Silicon Labs selects Imperas RISC-V Reference Model for verification (Dec 09, 2020)
- Cobham Advanced Electronic Solutions Offers RISC-V Support for Microchip Technology's PolarFire FPGA Devices (Dec 09, 2020)
- Lattice Launches 2nd Generation Security Solution with New Mach-NX FPGA for Next Generation, Cyber-Resilient Systems (Dec 09, 2020)
- Seagate Designs RISC-V Cores to Power Data Mobility and Trustworthiness (Dec 09, 2020)
- Attopsemi Achieves ISO 9001 Certification for IP Quality Management System (Dec 09, 2020)
- Veriest and Kudelski IoT collaborate to accelerate the integration of highly robust silicon security features in IC designs (Dec 09, 2020)
- Silvaco and OPENEDGES Announce Availability of Integrated DDR Controller and PHY IP Solutions (Dec 09, 2020)
- Renesas Extends Arm Cortex-Based MCU Family with RA4M3 MCU Group for Industrial and IoT Applications (Dec 09, 2020)
- AImotive Deploys Synopsys VCS to Verify Next-Generation Automated Driving Technologies (Dec 09, 2020)
- Think Silicon Announces a New Scalable Multi-Core GPU Product Suite with Extended Graphics and Video Functionality (Dec 09, 2020)
- RISC-V International Reports Another Strong Year of Growth with New Technical Milestones, Educational Programs, RISC-V Adoption and More (Dec 09, 2020)
- TSMC wins 2021 IEEE Corporate Innovation Award (Dec. 09, 2020)
- SmartDV Announces New Line of Design IP Controllers for High-Speed Communications (Dec 09, 2020)
- Cobham Gaisler and fentISS Deepen Collaboration around RISC-V (Dec 09, 2020)
- Nvidia has one surprising new rival: the world's largest storage vendor (Dec. 09, 2020)
- Neoverse expands further into cloud with new network-optimized instances at AWS re:Invent (Dec 08, 2020)
- Menta eFPGA and Codasip Announce Technology Partnership (Dec 08, 2020)
- C-DAC Selects Valtrix STING For Design Verification Of RISC-V Based Microprocessors (Dec 08, 2020)
- 100G Lambda MSA Announces Release of New Specifications for Longer Reach 100 GbE over Single-Mode Fiber (Dec 08, 2020)
- OneSpin Contributes to the OpenHW Ecosystem to Achieve Processor Integrity for the CORE-V CVE4 Open-Source RISC-V Cores (Dec 08, 2020)
- Menta and Andes Announce Partnership Enabling Hardware Reconfiguring for ISA Extension (Dec 08, 2020)
- UMC Reports Sales for November 2020 (Dec 08, 2020)
- Codasip announces three new RISC-V Application Processor Cores providing Multi-core and SIMD capability (Dec 08, 2020)
- Vidatronic Appoints Carnyx Consulting as Its Representative for European Markets (Dec 08, 2020)
- Samsung Foundry Adopts Spectre X Simulator for 5nm Design (Dec. 08, 2020)
- UMC to become world's No. 3 foundry: researcher (Dec. 08, 2020)
- Top 10 Foundry Revenues Expected to Increase by 18% YoY in 4Q20 (Dec. 08, 2020)
- TSMC's market cap rises to 9th highest in world (Dec. 08, 2020)
- Announcement of SMIC (Dec 07, 2020)
- Porting PikeOS to NOEL-V and LEON: SYSGO and Cobham Gaisler Extend Cooperation around RISC-V (Dec 07, 2020)
- DRAM Leads in Revenue, NAND With Top Percentage Growth in 2020 (Dec 07, 2020)
- GUC Monthly Sales Report - Nov 2020 (Dec 07, 2020)
- Dolphin Design unveil a new and improved version of its Power Controller IP - MAESTRO - to speed-up energy-efficient SoC design (Dec 07, 2020)
- OpenFive Licenses Flex Logix's eFPGA to Develop a Low Power Communications SoC Requiring a Large eFPGA (Dec 07, 2020)
- China's Semiconductor Progress to Be Impacted Once Again as SMIC Becomes Sanctioned by U.S. Department of Defense, Says TrendForce (Dec 07, 2020)
- Total Revenue of Top 10 Foundries Expected to Increase by 18% YoY in 4Q20 While UMC Overtakes GlobalFoundries for Third Place, Says TrendForce (Dec 07, 2020)
- Imperas Extends free riscvOVPsimPlus Simulator for RISC-V (Dec 07, 2020)
- U.S. Blacklisting SMIC of China Expected to Reverberate around Korean Foundry Industry (Dec. 07, 2020)
- Codasip announces three new RISC‑V Application Processor Cores providing Multi-core and SIMD capability (Dec 04, 2020)
- intoPIX delivers its new full stack of TICO-RAW solutions improving RAW image workflows and camera designs (Dec 04, 2020)
- CFX announces commercial availability of anti-fuse OTP technology on Silterra I11L process (Dec 04, 2020)
- Chip Startups are Succeeding with Silicon Catalyst and Partners Like Arm (Dec. 04, 2020)
- Alibaba-Backed Media AI Firm Finds Innovative Applications (Dec. 03, 2020)
- Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2020 (Dec 03, 2020)
- BrainChip Confirms Completion of the Akida Production Design (Dec 03, 2020)
- Embeetle and GigaDevice collaborate to bring a new powerful and simple IDE to ARM and RISC-V based MCUs (Dec 03, 2020)
- Andes RISC-V Vector Processor NX27V Is Upgraded to RVV 1.0 (Dec 03, 2020)
- Imec Demonstrates Capacitor-less IGZO-Based DRAM Cell With >400s Retention Time (Dec 03, 2020)
- Rockley Photonics Collaborates with Cadence to Create a High-Performance System for Hyperscale Data Centers (Dec 03, 2020)
- Faster, Smaller and More Accurate Edge AI Using Deeplite and Andes Technology Software + Hardware (Dec 03, 2020)
- Imperas Simulator Supports Andes Custom Extension to Accelerate Software Development in Domain Specific Applications (Dec 03, 2020)
- Can IBM Ecosystem Advance AI Chip Performance 1000x? (Dec 03, 2020)
- Third-Quarter 2020 Global Semiconductor Equipment Billings Surge 30% Year-Over-Year, SEMI Reports (Dec 03, 2020)
- Esperanto Technologies to Reveal Chip with 1000+ Cores at RISC-V Summit (Dec 03, 2020)
- IAR Systems and GigaDevice extend partnership with powerful Arm solutions (Dec 03, 2020)
- Synopsys and Samsung Foundry Collaborate to Deliver Fastest Design Closure and Signoff for Process Nodes Down to 3nm (Dec 03, 2020)
- RISC-V for ultra-low power processing and AI on the edge (Dec. 03, 2020)
- PCIe Gen5 & PCIe Gen4 Phy IP available in TSMC 12FFC (Dec 02, 2020)
- Mobiveil Announces Compute Express Link (CXL) 2.0 Design IP, Successful Completion of CXL 1.1 Validation with Intel's CXL Host Platform (Dec 02, 2020)
- 64-bit RISC-V Core Claims to Outperform Apple M1 SoC (Dec. 02, 2020)
- Xilinx Acquires Assets of Falcon Computing Solutions to Advance Software Programmability and Expand Developer Community (Dec 01, 2020)
- Faraday Leads Industry to Adopt TCFD Framework for Corporate Sustainability (Dec 01, 2020)
- PLDA Announces the Successful CXL Interoperability with pre-production Intel Xeon CPU, Code Named Sapphire Rapids (Dec 01, 2020)
- Secure-IC Announces U.S. Subsidiary Opening (Dec 01, 2020)
- Bluetooth RF Transceiver Phy KGD for adding Bluetooth Connectivity to "any SoC" (Dec 01, 2020)
- Imagination hires Tim Whitfield as new Chief of Engineering (Dec 01, 2020)
- Infineon to set up global AI hub in Singapore (Dec. 01, 2020)
- China a step closer to microchip independence (Dec. 01, 2020)
- China's AI unicorns reveal fatal flaw in rush to go public (Dec. 01, 2020)
- Arteris IP Completes Acquisition of Magillem Design Services Assets, Creating World's Premier System-on-Chip Integration Company (Nov 30, 2020)
- BrainChip Appoints Geoffrey Carrick as Non-Executive Director (Nov 30, 2020)
- Xiphera announces FPGA-based TLS 1.3 IP core for mission-critical applications (Nov 30, 2020)
- Nordic Semiconductor expands into Wi-Fi by acquiring the entire Wi-Fi development team, core Wi-Fi expertise, and Wi-Fi IP tech assets of Imagination Technologies Group (Nov 30, 2020)
- Imagination sells Ensigma Wi-Fi technology to Nordic Semiconductor (Nov 30, 2020)
- Broadcom Debuts Industry's First 5nm ASIC for Data Center and Cloud Infrastructure (Nov 30, 2020)
- Andes Announces New RISC-V Processors: Superscalar 45-Series with Multi-core Support and 27-Series with Level-2 Cache Controller (Nov 30, 2020)
- TSMC To Fall Behind Both Intel, Samsung By 2024 (Nov. 30, 2020)
- RF-SOI Engineered Substrates at the Heart of Modern RF mmWave Front-ends (Nov. 30, 2020)
- Samsung Electronics Squaring Off with TSMC in Packaging Technology (Nov. 30, 2020)
- IO and multiprotocol processing in highly demanding embedded architectures (Nov. 30, 2020)
- TSMC confirms 3nm tech for 2022, could enable epic 80 billion transistor GPUs (Nov. 27, 2020)
- China moves closer to self-reliance in 7nm chip production (Nov. 27, 2020)
- The Growing Market for Specialized Artificial Intelligence IP in SoCs (Nov. 26, 2020)
- Innatera raises EUR 5M to bring neuromorphic intelligence to the sensor-edge (Nov 26, 2020)
- Faraday Supplies 28eHV Memory Compilers for Mobile OLED Display Driver IC (Nov 26, 2020)
- intoPIX demos newest compression technologies shaping the future of lossless quality wired/wireless transmission : 4K/8K JPEG XS, TICO-RAW and FlinQ - lowest latency & power, highest quality (Nov 26, 2020)
- IAR Systems delivers extended optimization and trace capabilities for RISC-V development (Nov 26, 2020)
- intoPIX demos newest compression technologies shaping the future of lossless quality wired/wireless transmission: 4K/8K JPEG XS, TICO-RAW and FlinQ - lowest latency & power, highest quality (Nov 26, 2020)
- SMIC gets massive orders- customer demand is strong (Nov. 26, 2020)
- Gyrfalcon Launches AI-X: Full-Stack Solution for Edge-AI Development (Nov 25, 2020)
- TSMC's 3 nm plant in southern Taiwan reaches construction milestone (Nov. 25, 2020)
- China to spend $165bn on 5G (Nov. 25, 2020)
- proteanTecs CEO to present Universal Chip Telemetry™ at the Taiwan Semiconductor Executive Summit (TSES) (Nov. 25, 2020)
- SK Telecom develops AI processor (Nov. 25, 2020)
- TSMC adopts 3D stacking tech for chips along with Google and AMD (Nov. 25, 2020)
- Intel to Keep Its Number One Semiconductor Supplier Ranking in 2020 (Nov 24, 2020)
- Taiwan Semiconductor Research Institute signs access deal with Arm (Nov. 24, 2020)
- 3 Basic Facts About Automotive Sensor Degradation (Nov. 24, 2020)
- 5G and eSIM technologies will help grow industrial IoT connections to 37b by 2025 (Nov. 24, 2020)
- IRIS Switzerland Adopts Silvaco TCAD Software for the Development of Photodiodes for Autonomous Driving Applications (Nov. 24, 2020)
- CEVA's Bluetooth Low Energy 5.2 Platform is First IP to Receive Bluetooth SIG Qualification (Nov 23, 2020)
- China TSMC Rival HSMC Runs Out of Cash, Ex-CEO Says (Nov 23, 2020)
- Audio Weaver + TalkTo reference design now available on Qualcomm QCS400 series of audio System-on-Chips (SoCs) (Nov 23, 2020)
- North American Semiconductor Equipment Industry Posts October 2020 Billings (Nov 23, 2020)
- Mythic launches industry-first AI analog matrix processor (Nov 23, 2020)
- Beyond 5G – Is it time to start thinking about 6G? (Nov. 23, 2020)
- AI Accelerator Targets Video Analytics at the Edge (Nov. 23, 2020)
- U.S.-Taiwan dialogue prioritizes cooperation in semiconductor sector (Nov. 22, 2020)
- Wi-Fi HaLow Reference Platform Available from Palma Ceia SemiDesign (Nov 20, 2020)
- Coventor and CMC Microsystems expand collaboration to further enable innovation in semiconductor and microsystem technology development (Nov. 20, 2020)
- Mentor joins Nano 2022 R&D program to foster innovation in semiconductor design and verification (Nov 19, 2020)
- Secure Thingz supports next-generation Secure Install technologies for IP Protection and malware prevention (Nov 19, 2020)
- Ferroelectric Memory GmbH (FMC) Raises $20 Million to Accelerate Next-Generation Memory for AI, IoT, Edge Computing, and Data Center Applications (Nov 19, 2020)
- AI Startup Deep Vision Powers AI Innovation at the Edge (Nov 19, 2020)
- Xilinx Collaborates With Texas Instruments to Develop Energy Efficient 5G Radio Solutions (Nov 19, 2020)
- Arm Expands microNPU IP for Application Processors (Nov. 19, 2020)
- Synopsys Acquires Precision Optical Measurements Provider LIGHT TEC (Nov. 19, 2020)
- BrainChip Appoints Todd Vierra Director of Technical Sales (Nov 18, 2020)
- Bouffalo Lab Standardizes on SiFive RISC-V Embedded CPU Core IP for New IoT Products (Nov 18, 2020)
- Wafer Capacity by Feature Size Shows Strongest Growth at <10nm (Nov 18, 2020)
- First Intel Structured ASIC for 5G, AI, Cloud and Edge Announced (Nov 18, 2020)
- Fugaku Tops Supercomputer Rankings Again as Arm HPC Ecosystem Expands (Nov 18, 2020)
- Foundry Revenue Expected to Increase by 23.8% YoY in 2020, with Advanced Nodes and 8-Inch Capacities Being Key to Industry Competitiveness in 2021, Says TrendForce (Nov 18, 2020)
- Dialog launches partner programme for its open industrial IoT edge server (Nov. 18, 2020)
- Introducing new Arm Roadmap Guarantee and other Arm IoT initiatives for accelerating Endpoint AI (Nov. 18, 2020)
- SiMa.ai Adopts Arm Technology to Deliver a Purpose-built Heterogeneous Machine Learning Compute Platform for the Embedded Edge (Nov. 18, 2020)
- 18 New AI Startups in France in 2020 vs. 120 in 2019 (Nov. 18, 2020)
- Marvell Announces Industry's First 112G 5nm SerDes Solution for Scaling Cloud Data Center Infrastructure (Nov 17, 2020)
- Ultra-low power GNSS Multi-Constellation Digital IP Core licensed to a European Semiconductor company for battery powered IOT & Wearable applications (Nov 17, 2020)
- GUC Die-to-Die (D2D) Total Solution Opening the New Era of Flagship SoC (Nov 17, 2020)
- Kandou Raises $92.3 Million in Series C Funding (Nov 17, 2020)
- Arteris IP Achieves Major Milestone: 150th Licensee (Nov 17, 2020)
- NXP, AWS create cloud platform for vehicle data services (Nov. 17, 2020)
- Kandou can do more with $92.3 million (Nov. 17, 2020)
- NTLab joined Samsung Foundry IP Ecosystem (Nov. 17, 2020)
- Dialog Semiconductor Introduces SmartServer™ IoT Partner Ecosystem for Edge Solutions in Smart Buildings and Factories (Nov. 17, 2020)
- Lattice Expands Radiant Software Tool Capabilities (Nov 16, 2020)
- BrainChip Demonstrates How Its Akida Technology Is Delivering the Next-Generation of AI at the Edge at First-Ever AI Field Day (Nov 16, 2020)
- SimpleMachines, Inc. Debuts First-of-its-Kind High Performance Chip (Nov 16, 2020)
- Apple M1 Processor, Passing on the Chiplets (Nov 16, 2020)
- Alibaba's Ultra High-Performance Superscalar Processor - XuanTie910 (Nov. 16, 2020)
- First steps to European multicore RISC-V chip for space (Nov. 16, 2020)
- CEA-Leti, Intel Expand Collaboration on 3D Packaging (Nov. 12, 2020)
- Hyundai Embraces Nvidia for Future Fleet AI, IVI Services (Nov. 12, 2020)
- Solving the problem of growing ASIC respins (Nov. 12, 2020)
- Time-Sensitive Networking Market is Projected to Reach USD 1 Billion by 2026 (Nov. 12, 2020)
- Imagination launches multi-core IMG Series4 NNA - the ultimate AI accelerator delivering industry-disruptive performance for ADAS and autonomous driving (Nov 12, 2020)
- Faraday's 22nm Fundamental IP Adopted for Intelligent IoT Devices (Nov 12, 2020)
- Vidatronic Achieves up to 10X Speedup Using the Cadence Spectre X Simulator (Nov 12, 2020)
- Synopsys Acquires In-chip Monitoring Solutions Leader Moortec (Nov 12, 2020)
- CEVA's High-Performance DSP Solution to Power Renesas' Next-Generation Automotive SoC (Nov 12, 2020)
- Efinix Announces Trion Titanium Tapeout at TSMC 16 nm Process Node (Nov 12, 2020)
- De-RISC first anniversary, a H2020 project which will create the first RISC-V, fully European platform for space (Nov 12, 2020)
- Lattice Accelerates Development of Low Power FPGA-Based Custom Solutions with Lattice Design Group (Nov 12, 2020)
- CXL Consortium Releases Compute Express Link 2.0 Specification (Nov 12, 2020)
- Xilinx and Samsung Deliver Industry's First Adaptable Computational Storage Drives (Nov 12, 2020)
- Silvaco Acquires Memory Compiler Technology of Dolphin Design SAS (Nov 12, 2020)
- Google Partners with SkyWater and Efabless to Enable Open Source Manufacturing of Custom ASICs (Nov 12, 2020)
- Nestwave Recognized for IoT Innovation in 2020 Mobile Breakthrough Awards Program (Nov. 12, 2020)
- Advanced Packaging: Interview with Intel's Ramune Nagisetty (Nov. 11, 2020)
- TSMC October 2020 Revenue Report (Nov 11, 2020)
- Sound United Adds MPEG-H 3D Audio format to Denon & Marantz Home Theater Components (Nov. 11, 2020)
- CAST Releases MIPI I3C Basic Slave Controller IP Core (Nov 10, 2020)
- Silex Insight delivers state-of-the-art security features to the award-winning Secure Vault technology from Silicon Labs (Nov 10, 2020)
- Pinnacle Imaging Systems Announces Denali 3.0 ISP (Nov 10, 2020)
- Synopsys Announces Industry's First CXL 2.0 VIP Solution for Breakthrough SoC Performance (Nov 10, 2020)
- Graphcore leverages multiple Mentor technologies for its massive, second-generation AI platform (Nov 10, 2020)
- PLDA Announces CXL 2.0 Support in their XpressLINK Family of CXL Controller IP (Nov 10, 2020)
- Avery Design Debuts QEMU Virtual Host to SystemVerilog PCIe VIP HW-SW Co-simulation Solution for Pre-silicon System-level Simulation of NVMe SSD and PCIe Designs (Nov 10, 2020)
- Kameleon Security and Xilinx Collaborate on New Cybersecurity Solution for Servers, Cloud Computing and Data Centers (Nov. 10, 2020)
- TSMC to spend US$3.5b on Arizona subsidiary (Nov. 10, 2020)
- Korea's Semiconductor Exports to China Increasing (Nov. 10, 2020)
- European Processor Initiative: Second year of activities (Nov 09, 2020)
- UMC Reports Sales for October 2020 (Nov 09, 2020)
- Cadence Achieves Industry-First ASIL B(D) Compliance Certification for Automotive Radar, Lidar and V2X DSP IP (Nov 09, 2020)
- MosChip Technologies appoints Semiconductor Business Veteran, Swamy Irrinki As "Vice President of Marketing and Business Development" to Oversee and Drive Continued Business Growth (Nov 09, 2020)
- Learn the Latest on RISC-V and Vector Processing at All Six Andes Technology Corporation's Presentations at the 2020 RISC-V Summit (Nov 06, 2020)
- Driven by Accelerating Demand for Leading 5G RF Solutions, GLOBALFOUNDRIES and Soitec Announce RF-SOI Wafer Supply Agreement (Nov 06, 2020)
- CEVA SenslinQ Platform Wins 2020 ASPENCORE World Electronics Achievement Award (Nov 06, 2020)
- Open-Source RISC-V ISA Offers More (Nov. 06, 2020)
- 5G and Interconnect Are Pushing Innovations in Wireless (Nov. 05, 2020)
- CEVA, Inc. Announces Third Quarter 2020 Financial Results (Nov 05, 2020)
- eMemory NeoFuse IP Qualified on GLOBALFOUNDRIES Advanced High Voltage Platform for OLED Applications (Nov 05, 2020)
- PLDA XpressSWITCH IP for PCIe technology first ever switch soft IP to pass PCI-SIG's PCIe 4.0 compliance tests (Nov 05, 2020)
- New Wave Design and Verification Appoints New President (Nov 05, 2020)
- GUC Monthly Sales Report - Oct 2020 (Nov 05, 2020)
- Advanced packaging to have 31% CAGR 2019-25 (Nov. 05, 2020)
- 55 BCDLite Solution Positions GLOBALFOUNDRIES for Continued Leadership in Audio Amplifiers for Mobile Devices (Nov 04, 2020)
- Imagination's new BXS GPU enables automotive graphics in Texas Instruments processor family (Nov 04, 2020)
- Arteris IP FlexNoC Interconnect Products Licensed by Bosch for Multiple Automotive Chips (Nov 04, 2020)
- 28FDSOI "SoC White Box" SERDES & Controller IPs' are available for immediate licensing (Nov 04, 2020)
- Samsung Elec to fully employ 5-nano process to make own phones and others (Nov. 04, 2020)
- CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design. (Nov. 04, 2020)
- Telink TLSR9 Wireless Audio & IoT RISC-V SoC integrates RISC-V DSP/SIMD P-extension (Nov. 04, 2020)
- Arm has launched a CPU monster that will get Intel and AMD very worried (Nov. 04, 2020)
- How AI Impacts Memory & Interconnect Technology (Nov. 04, 2020)
- Virtual electronica: Focus on Technical Trends and Innovations (Nov. 04, 2020)
- Taiwan's TSMC begins hiring drive for its US foundry (Nov. 04, 2020)
- China to Expand Its Semiconductor Industry (Nov. 04, 2020)
- 300mm Fab Spending to Boom Through 2023 With Two Record Highs, SEMI Reports (Nov 04, 2020)
- Aldec Introduces Hardware Assisted RTL Simulation Acceleration for Microchip FPGA Designs (Nov 03, 2020)
- Inaccel announces record-breaking speed on facial detection test using an FPGA cluster (Nov 03, 2020)
- NeuLinker Licenses Codasip Bk5 and Studio for Powering Innovative AI and Blockchain Solutions (Nov 03, 2020)
- Rambus Reports Third Quarter 2020 Financial Results (Nov 03, 2020)
- Movellus Joins GLOBALFOUNDRIES Ecosystem Program, as Partner Providing Application-Optimized PLLs, DLLs, & Comprehensive Clocking Solutions (Nov 03, 2020)
- Xylon Announces a New Version of logiVIEW Multiview 3D Video Transformation Engine IP Core (Nov 03, 2020)
- Cadence Wins Four 2020 TSMC OIP Partner of the Year Awards (Nov 03, 2020)
- Rambus Announces New Stock Repurchase Program (Nov 03, 2020)
- Sondrel announces tape-out of its largest chip design (Nov 02, 2020)
- Q3 Global Semiconductor Sales Increase 11 Percent Compared to Q2 (Nov 02, 2020)
- Silicon Wafer Shipments Slip in Third Quarter 2020 but Strong for Year (Nov 02, 2020)
- Telink and Andes Announce the TLSR9 SoC with RISC-V Processor (Nov 02, 2020)
- SDR RF IP, 100MHz-2.6GHz, for ultra-low power applications from IoT, M2M to 5G available from T2MIP (Oct 29, 2020)
- Realtek Semiconductor Selects Allegro DVT's H.266/VVC Compliance Streams (Oct 29, 2020)
- Cadence Custom/AMS Flow Certified for the Samsung Foundry 3nm Advanced Process Technology for Early Design Starts (Oct 29, 2020)
- intoPIX releases a new range of 8K TICO-XS IP-cores supporting the JPEG XS standard (Oct 29, 2020)
- Mentor's High Density Advanced Packaging solution certified for Samsung Foundry's most advanced packaging process (Oct 29, 2020)
- Marvell to Acquire Inphi - Accelerating Growth and Leadership in Cloud and 5G Infrastructure (Oct 29, 2020)
- QuickLogic Joins Samsung SAFE IP Partner Program (Oct 29, 2020)
- Xilinx Introduces Breakthrough Zynq RFSoC DFE for Mass 5G Radio Deployments (Oct 28, 2020)
- Synopsys and Samsung Foundry Collaboration Delivers Optimized Reference Methodology for High-Performance Compute Designs (Oct 28, 2020)
- Flex Logix Announces Availability and Roadmap of InferX X1 Boards and Software Tools (Oct 28, 2020)
- Synopsys and Samsung Release Certified 3nm Gate-All-Around AMS Design Reference Flow for Early Design Starts (Oct 28, 2020)
- DRAM Price Erosion Expected Through the End of 2020 (Oct 28, 2020)
- Truechip Adds New Customer Shipments of Verification IPs For RISC-V Family Including TileLink (Oct 28, 2020)
- QuickLogic Announces the ArcticPro 3 eFPGA IP for Samsung 28FDS Process (Oct 28, 2020)
- Analog Bits Announces Analog IP Availability on Samsung Technologies (Oct 28, 2020)
- Floadia Raises 1.2 Billion Yen to Develop New Memory Technology That Can Be Disruptor in AI Edge Computing (Oct 28, 2020)
- Rambus IPsec Packet Engine Secures 5G Networking at 10 Gbps (Oct 28, 2020)
- Samsung Foundry Adopts Real Intent Meridian CDC for Clock Domain Crossing Sign-off (Oct. 28, 2020)
- World's fastest 64bit RISC-V core claims 5GHz speed (Oct. 28, 2020)
- Samsung and VeriSilicon Enable Blaize to Meet Aggressive Time-to-Market Goals for New AI Edge Processor (Oct. 28, 2020)
- What Can Taiwan's Semiconductor Industry Learn From Japan? (Oct. 28, 2020)
- AMD to Acquire Xilinx, Creating the Industry's High Performance Computing Leader (Oct 27, 2020)
- Cortus Announces the Opening of another New Design Centre in Meyreuil (France) (Oct 27, 2020)
- Mixel MIPI D-PHY IP Integrated Into Hercules Microelectronics Award-Winning FPGA/Processor (Oct 27, 2020)
- Synopsys Expands Portfolio of Automotive VDKs with Support for Infineon's AURIX TC4xx 32-bit Microcontroller Family (Oct 27, 2020)
- TSMC top patent applicant in Taiwan for sixth straight quarter (Oct. 27, 2020)
- Micro Magic, Inc. Unleashes World's Fastest RISC-V Core (Oct 26, 2020)
- Mentor receives 2020 TSMC OIP Partner of the Year awards for EDA solutions (Oct 26, 2020)
- Visit Vidatronic at the Virtual Samsung SAFE Forum on October 28th (Oct 26, 2020)
- Aldec's TySOM Family of Embedded System Development Solutions Now Supports Xilinx PYNQ (Python Productivity for Zynq) (Oct 26, 2020)
- EvoNexus and GLOBALFOUNDRIES Team to Accelerate Growth of Wireless and IoT Startups (Oct 26, 2020)
- Orthogone Technologies Reveals New Brand Identity, Sets 25% Growth Target for 2021 (Oct 26, 2020)
- Synopsys and Samsung Foundry Collaboration Delivers Portfolio of Optimized iPDKs and Methodologies for Advanced Custom Design (Oct 26, 2020)
- North American Semiconductor Equipment Industry Posts September 2020 Billings (Oct 26, 2020)
- GlobalFoundries Details Ambitious Technology Roadmap (Oct. 26, 2020)
- China Forecast to Represent 22% of the Foundry Market in 2020 (Oct. 26, 2020)
- Nvidia-Arm Deal a Boon for RISC-V? (Oct. 26, 2020)
- EvoNexus and GLOBALFOUNDRIES Team to Accelerate Growth of Wireless and IoT Startups (Oct. 26, 2020)
- Movellus Delivers Clock Generation Module on TSMC 3nm Process (Oct. 24, 2020)
- TSMC Bets on HPC for Future Growth (Oct. 22, 2020)
- Synopsys Helps Advance IBM's Vision of 1,000 Times Improvement in AI Compute Performance during the Coming Decade (Oct 22, 2020)
- eMemory Receives 2020 TSMC OIP Partner of the Year Award for Embedded Memory IP (Oct 22, 2020)
- SmartDV Appoints Karthik Gopal as Asia General Manager (Oct 22, 2020)
- SmartDV to Exhibit at Virtual Samsung SAFE Forum 2020 with Portfolio of Design and Verification IP (Oct 22, 2020)
- M31 Technology Receives 2020 TSMC OIP Partner of the Year Award for Specialty Process IP (Oct 22, 2020)
- Arm partners with Mentor to offer complete verification service (Oct 22, 2020)
- PLDA demonstrates successful PCIe 5.0 Link Training at 32 GT/s with its PCIe 5.0 controller and Broadcom PHY (Oct 22, 2020)
- TSMC Sees HPC As Next Inflection Point (Oct 22, 2020)
- GlobalFoundries Offers Ambitious Tech Plans, While Eying an IPO (Oct 22, 2020)
- Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications (Oct 22, 2020)
- 6 Considerations for Integrating Sensors in Vehicles (Oct. 22, 2020)
- Silicon Creations Named 2020 TSMC OIP Partner of the Year for Analog / Mixed-Signal IP (Oct 21, 2020)
- Microchip Acquires High-Level Synthesis Tool Provider LegUp to Simplify Development of PolarFire FPGA-based Edge Compute Solutions (Oct 21, 2020)
- Faraday Brings Advanced Audio ASIC Solutions to the Music Entertainment Industry (Oct 21, 2020)
- IAR Systems brings functional safety tools to RISC-V with certification for IEC 61508 and ISO 26262 (Oct 21, 2020)
- TSMC Recognizes Synopsys Collaboration with Four OIP Partner of the Year Awards for IP and EDA Solutions (Oct 21, 2020)
- Arm Awarded TSMC OIP Partner of the Year Award for Processor IP for Six Years in a Row (Oct 21, 2020)
- Alphawave IP Receives Prestigious 2020 TSMC OIP Partner of the Year Award for High-Speed SerDes IP (Oct 21, 2020)
- Tenstorrent achieves best-in-class PPA and First-Pass Silicon Success for Datacenter AI Processor SoC with INVECAS advanced ASIC engineering capabilities (Oct. 21, 2020)
- Soitec reports FY'21 second quarter revenues (Oct. 21, 2020)
- SK hynix to Acquire Intel NAND Memory Business (Oct 20, 2020)
- TSMC Announces 2020 OIP Partner of the Year Awards for Excellence in Accelerating Silicon Innovation (Oct 20, 2020)
- Breakthrough Synopsys IC Validator Technologies Deliver Faster Physical Signoff Convergence (Oct 20, 2020)
- Flex Logix Announces Working Silicon Of Fastest And Most Efficient AI Edge Inference Chip (Oct 20, 2020)
- TSMC 12FFC silicon proven SERDES Phy IPs' for HDMI 2.1, PCIe Gen5, DDR4, USB 4 & MIPI Interfaces available immediately for your next SoC (Oct 20, 2020)
- Cadence Reports Third Quarter 2020 Financial Results (Oct 20, 2020)
- Codasip Announces a New Design Center in France (Oct 20, 2020)
- Taiwan Semiconductor's Technology Dominance And Its Impact On Customers And Suppliers (Oct. 20, 2020)
- Veridify Security Welcomes Happiest Minds as Systems Integrator Partner (Oct. 20, 2020)
- Chips&Media showcase at Samsung Foundry SAFE FORUM 2020 as an IP partner (Oct. 20, 2020)
- Sequitur Labs Joins NVIDIA Partner Network to Protect Critical IP at the Edge (Oct. 20, 2020)
- Latest NPU adds to Arm's AI Platform performance, applicability, and efficiency (Oct 19, 2020)
- Wipro to acquire Eximius Design, strengthens leadership in VLSI and systems design services (Oct 19, 2020)
- Synopsys Accelerates Power Electronics System Design with Virtual Prototyping Solution (Oct 19, 2020)
- Dialog Semiconductor Licenses its Non-Volatile Resistive RAM Technology to GLOBALFOUNDRIES for 22FDX Platform, Targeting IoT and AI (Oct 19, 2020)
- Dolphin Design's SPEED platforms receive the "Solar Impulse Efficient Solution" Label, rewarding profitable solutions that protect the environment. (Oct 19, 2020)
- Perforce Software Accelerates SoC Development With Methodics IPLM 3.0 Launch (Oct 19, 2020)
- GreenWaves Technologies Announces Next Generation GAP9 Hearables Platform Using GLOBALFOUNDRIES 22FDX Solution (Oct 19, 2020)
- 'Samsung set to win over TSMC in the end' (Oct. 19, 2020)
- riscvOVPsim gets Risc-V vector instructions (Oct. 19, 2020)
- Hardware Is Back, Says CEA-Leti's CEO (Oct. 19, 2020)
- TSMC revenue for 2020 to rise by 30% despite losing Huawei (Oct. 19, 2020)
- China is catching up: SMIC foundry is now able to produce 7 nm chips (Oct. 16, 2020)
- Industry's first security microcontrollers for a complete IoT lifecycle management solution (Oct. 15, 2020)
- JEDEC Announces Publication of JEDEC Module Sideband Bus (Oct 15, 2020)
- CSEM joins forces with GLOBALFOUNDRIES to deliver best-in-class Bluetooth Dual-Mode silicon IP for next generation portable audio (Oct 15, 2020)
- Xilinx and Spline.AI Develop X-Ray Classification Deep-Learning Model and Reference Design on AWS (Oct 15, 2020)
- GreenWaves Technologies Announces Next Generation GAP9 Hearables Platform Using GLOBALFOUNDRIES 22FDX Solution (Oct 15, 2020)
- GLOBALFOUNDRIES Accelerating Innovation in IoT and Wearables with Adaptive Body Bias Feature on 22FDX Platform (Oct 15, 2020)
- TSMC Reports Third Quarter EPS of NT$5.30 (Oct 15, 2020)
- Global Silicon Wafer Shipments on Track for 2020 Recovery and 2022 Record High, SEMI Reports (Oct 15, 2020)
- TriEye Shortens Time to Market for Next-Generation CMOS-Based SWIR Image Sensors with the Cadence Spectre X Simulator (Oct 14, 2020)
- China Forecast to Represent 22% of the Foundry Market in 2020 (Oct 14, 2020)
- Chinese chipmaker SMIC makes breakthrough in '7nm-like process' (Oct. 14, 2020)
- Lattice Semiconductor Wins Two Medals at 2020 LEAP Awards (Oct. 14, 2020)
- How will artificial intelligence impact automotive IP protection strategies? (Oct. 14, 2020)
- Synopsys and SiMa.ai Collaborate to Bring Machine Learning Inference at Scale to the Embedded Edge (Oct 14, 2020)
- Synopsys and Samsung Foundry Announce Reference Flow for Predictable Execution of ASIL D-Compliant SoC Design for Automotive Applications (Oct 14, 2020)
- Synopsys Names Shankar Krishnamoorthy General Manager of the Digital Design Group (Oct 13, 2020)
- OPENEDGES AI Accelerator (NPU) & Memory Subsystem IP licensed for Eyenix AI-powered surveillance camera chipset (Oct 13, 2020)
- MIPI Alliance and IEEE Sign Agreement to Bring Automotive SerDes Standard to Broader Ecosystem (Oct 13, 2020)
- Synopsys to Enable New Levels of Insight into SoC Designs and Systems with Industry's First Silicon Lifecycle Management Platform (Oct 13, 2020)
- New Cadence Clarity 3D Transient Solver Delivers Up to 10X Faster System-Level EMI Simulation (Oct 13, 2020)
- Cadence Brings Verification IP to the Chip Level with New System VIP Solution (Oct 13, 2020)
- Imagination launches IMG B-Series: Doing more with multi-core (Oct 13, 2020)
- Innosilicon selects Imagination's new BXT Multi-Core GPU IP for cloud computing (Oct 13, 2020)
- Innosilicon Achieves World-First Tapeout Success on SMIC N+1 Process (Oct 13, 2020)
- Synopsys Demonstrates Industry's First PCI Express 5.0 IP Interoperability with Intel's Future Xeon Scalable Processor (Oct 13, 2020)
- Arteris IP FlexNoC Interconnect Again Licensed by KYOCERA for Enterprise Printing and Imaging Solutions (Oct 13, 2020)
- NVIDIA Reportedly Moving Ampere to 7 nm TSMC in 2021 (Oct. 13, 2020)
- Imagination extends mobile GPUs to automotive and data centres with 6Tflop B-Series (Oct. 13, 2020)
- South Korea pushes for AI semiconductors as global demand grows (Oct. 13, 2020)
- intoPIX Ships v2.0 of FastTICO-XS SDK for x86-64 CPU platforms to speed up JPEG-XS workflows (Oct 12, 2020)
- AMD Reported to Be Negotiating Purchase of Xilinx (Oct 12, 2020)
- Synopsys IC Compiler II Delivers First-Pass Silicon Success for Graphcore's Multi-Billion Gate AI Processor (Oct 12, 2020)
- AMD-Xilinx Deal: Bringing The Fight To The Data Center (Oct 12, 2020)
- Cadence Pegasus Verification System Certified for TSMC N16, N12 and N7 Process Technologies (Oct 12, 2020)
- Numem Selected by NASA for 'DNN Radiation Hardened Co-Processor Companion Chip to NASA's Upcoming High-Performance Spaceflight Computing Processor' (Oct 12, 2020)
- Visit Vidatronic at the Virtual GLOBALFOUNDRIES Technology Conference (GTC) - EMEA on October 16th (Oct 12, 2020)
- Attend Andes Technology's Presentation "A RISC-V Out-of-Order Processor" at the Linley Processor Conference (Oct 12, 2020)
- AMD and Xilinx: A Match Made in Silicon Valley? (Oct 12, 2020)
- Menta Appoints ETSI as United States East Coast Representative (Oct 12, 2020)
- Arm co-founder: Nvidia takeover would create another US tech monopoly (Oct. 12, 2020)
- Imec presents alternative metals in advanced interconnect and contact schemes as a path to 2nm technology nodes (Oct. 09, 2020)
- Cadence Announces Complete DDR5/LPDDR5 IP Solution for TSMC N5 Process Technology (Oct 08, 2020)
- Think Silicon to introduce a new Inference Micro GPU Architecture based on RISC-V at Linley Fall Virtual Processor Conference (Oct 08, 2020)
- Pushing the boundaries of performance and security to unleash the power of 64-bit computing (Oct 08, 2020)
- Intento Design Expands Analog Automation with IDX-PVT, Eliminating the Need for Design-by-Verification (Oct 08, 2020)
- UMC Reports Sales for September 2020 (Oct 08, 2020)
- TSMC September 2020 Revenue Report (Oct 08, 2020)
- Attopsemi's I-fuse Memory Solution Now Qualified and Available on X-FAB's 130nm RF-SOI Technology (Oct 08, 2020)
- Huang "Confident" Nvidia-Arm Deal Will Get Past Regulators (Oct 08, 2020)
- Instrumentation Technology Systems adds intoPIX TICO-XS to their upcoming NetVIDxs (Oct 08, 2020)
- Synopsys DesignWare CXL IP Supports AMBA CXS Protocol Targeting High-Performance Computing SoCs (Oct 08, 2020)
- proteanTecs Announces Market and Regional Expansions (Oct 08, 2020)
- Everactive Adopts Movellus Sub-Microwatt Clocking Solution for its Batteryless IIoT System (Oct 07, 2020)
- VSORA Introduces Small Footprint, Low-Power PetaFLOPS Platform Enabling L4/L5 Autonomous Driving (Oct 07, 2020)
- CAST Introduces Ultra-Low Latency TSN Ethernet Switch IP Core (Oct 07, 2020)
- SmartDV Unveils SmartConf Testbench Generator (Oct 07, 2020)
- Arm CEO Simon Segars discusses AI, data centers, getting acquired by Nvidia and more (Oct. 07, 2020)
- Renesas Launches Arm Cortex-M33-based RA6M4 MCU Group with Superior Performance and Advanced Security for IoT Applications (Oct 06, 2020)
- Eximius Design Joins TSMC Design Center Alliance Program (Oct 06, 2020)
- Efinix® Announces Availability of Reconfigurable Acceleration Platform (Oct. 06, 2020)
- 'Samsung AI Forum 2020' Explores the Future of Artificial Intelligence (Oct. 06, 2020)
- Top 10 Tech Industry Trends for 2021 (Oct. 06, 2020)
- European Semiconductor Sales Drop, Global Sales Rise (Oct. 06, 2020)
- AI Requires Tailored DRAM Solutions: Part 3 (Oct. 06, 2020)
- OpenFive and AnalogX to Provide Optimized Chip-to-Chip Interface IP Solutions (Oct 05, 2020)
- GUC Monthly Sales Report - September 2020 (Oct 05, 2020)
- Global Semiconductor Sales Increase 4.9 Percent Year-to-Year in August (Oct 05, 2020)
- China's Semiconductor Industry to Brace for Impact as SMIC Assesses Export Restrictions Placed by U.S., Says TrendForce (Oct 05, 2020)
- Toshiba Information Systems Adopts Blue Pearl Software Visual Verification Suite by to Improve Quality and Accelerate FPGA and ASIC Development (Oct 05, 2020)
- Arm Spins-out Cerfe Labs to Advance Development of CeRAM Memory Technology (Oct 05, 2020)
- Intel's Roadmap: A Closer Look at Process Technologies and Production Plans (Oct 05, 2020)
- Imagination Technologies Group Ltd. Announces new CEO Simon Beresford-Wylie (Oct 05, 2020)
- TurboConcepts successfully completes research project FlexDEC-5G for designing FEC decoders for 5G (Oct 05, 2020)
- ESD Alliance Reports Strong Electronic Design Automation Industry Revenue Growth for Q2 2020 (Oct 05, 2020)
- China's Chip Sector Faces Possible Impact as SMIC Assesses Export Restrictions Placed by U.S. (Oct. 05, 2020)
- Nvidia Presents the DPU, a New Type of Data Center Processor (Oct. 05, 2020)
- EU chip plan would cost €500bn, says NXP CEO (Oct 04, 2022)
- Renesas Selects Andes RISC-V 32-Bit CPU Cores for its First RISC-V Implementation of ASSPs (Oct 01, 2020)
- New MIPI Debug and Trace Solution Available for Mobile, IoT and Automotive (Oct 01, 2020)
- Efinix Announces Availability of Reconfigurable Acceleration Platform (Oct 01, 2020)
- Efabless Extends Partnerships for Rapid Development Solution of Custom ICs (Oct. 01, 2020)
- Arteris IP to Acquire Assets of Magillem Design Services, Creating World's Premier System-on-Chip Assembly Company (Oct 01, 2020)
- Arm Mali-C71AE: High performance Image Signal Processing with Advanced Safety (Oct. 01, 2020)
- Talking Sense with Moortec... 5G, Hyperscaling and the Resurgence of Consumer Silicon (Oct. 01, 2020)
- Wi-Fi CERTIFIED Vantage adds support for latest Wi-Fi advancements (Sep 30, 2020)
- Moortec's In-Chip Sensing Fabric Enables Deeply Embedded Monitoring of Dynamic Conditions for Picocom's Baseband SoC for 5G Small Cells (Sep 30, 2020)
- Tetrivis tapes out prototype Transmit and Receive Phased-Array Silicon Chipsets for Low-Cost Terminals for Emerging Low-Earth Orbit Satellite (LEOSAT) Market (Sep 30, 2020)
- Two Acquisitions Make 2020 Second-Highest Year for Semi M&As (Sep 30, 2020)
- Fraunhofer IPMS develops TSN Switch IP Core (Sep 30, 2020)
- Arteris IP FlexNoC Interconnect Products Again Licensed by Samsung Foundry for Worldwide Use (Sep 30, 2020)
- Nordic Semiconductor to ship its billionth Arm Cortex-M based wireless SoC in October (Sep 30, 2020)
- Synopsys Delivers Industry's First Processor IP Certified for Full ISO 26262 ASIL D Compliance (Sep 30, 2020)
- Is RISC-V Processor Hardware or Software? (Sept. 30, 2020)
- 2020 is second highest year for semi M&A (Sept. 30, 2020)
- Megh Computing Selected by 5G Open Innovation Lab to Help Drive Early Adoption and Innovation of 5G Technology (Sep 29, 2020)
- New Arm technologies enable safety-capable computing solutions for an autonomous future (Sep 29, 2020)
- Globalfoundries Global Technology Conference 2020 Sets The Stage For Growth (Sept. 29, 2020)
- US trade restrictions on SMIC may set back China's efforts to develop a domestic alternative to Samsung and TSMC (Sept. 29, 2020)
- New Neoverse Platforms Take on the Cloud, HPC, and the Edge (Sept. 29, 2020)
- New Arm technologies enable safety-capable computing solutions for an autonomous future (Sept. 29, 2020)
- GLOBALFOUNDRIES Announces Industry-Leading GF SHIELD Program to Further Safeguard Customer Data and IP (Sep 28, 2020)
- 28HV Solution Accelerates GLOBALFOUNDRIES Leadership in OLED Display Drivers for Mobile Devices (Sep 28, 2020)
- Bluetooth Dual Mode v5.2 Protocol Stack SW, Profiles & LC3 codec licensed to leading Tier 1 Company for ultra-low power TWS Hearable Audio SoC (Sep 28, 2020)
- Cadence Announces Broad IP Collaboration with GLOBALFOUNDRIES on 12LP/12LP+ Solutions (Sep 28, 2020)
- NUVIA Raises $240M Series B Funding as it Accelerates Plans to Deliver Industry Leading CPU Performance to the Data Center (Sep 28, 2020)
- GLOBALFOUNDRIES Collaborates with Cadence on Availability of Mixed-Signal OpenAccess PDK for 22FDX Platform to Enable Advanced Mixed-Signal and mmWave Design (Sep 28, 2020)
- GLOBALFOUNDRIES and Mentor Collaborate to Launch New Semiconductor Verification Solution Embedded with Advanced Machine Learning Capabilities (Sep 28, 2020)
- GLOBALFOUNDRIES and Movano Inc. Partner to Advance Needle-Free Continuous Glucose Monitoring Technology (Sep 28, 2020)
- GLOBALFOUNDRIES Announces New 22FDX+ Platform, Extending FDX Leadership with Specialty Solutions for IoT and 5G Mobility (Sep 28, 2020)
- Efabless Expands support for Cloud-based Design Platform (Sep 28, 2020)
- Newly Released Versions of DMTF Redfish and SNIA Swordfish Specifications Include NVMe and NVMe-oF Specification Enhancements (Sep 28, 2020)
- Washington clamps down on SMIC (Sep 28, 2020)
- Globalfoundries extends 22nm FDSOI, holds 12nm (Sept. 28, 2020)
- Creating Domain Specific Processors Using Custom RISC-V ISA Instructions (Sept. 28, 2020)
- SMIC: Clarification Announcement (Sept. 28, 2020)
- Semiconductor/equipment: Structural Growth of Foundries (Sept. 28, 2020)
- China's Geely to Feature Mobileye SuperVision for Scalable ADAS (Sept. 28, 2020)
- Chipus Annouces new power management IP for hearables and wearables (Sep 24, 2020)
- Analog Bits Announces Foundation Analog IP Availability on GLOBALFOUNDRIES 12LP FinFET Platform (Sep 24, 2020)
- Xilinx and Continental Collaborate to Create Auto Industry's First Production-Ready 4D Imaging Radar for Autonomous Driving (Sep 24, 2020)
- BrainChip Confirms Validation of the Akida Neural Processor (Sep 24, 2020)
- Vidatronic Launches New 22 nm Analog IP For Ultra-Low-Power, System-On-Chip Physical Attack Mitigation In Internet Of Things (IoT) Applications (Sep 24, 2020)
- Allegro DVT Extends Leadership in 8K Video Decoding IP (Sep 24, 2020)
- Everything to Know about Dedicated Foundries (Sept. 24, 2020)
- NSITEXE selects Imperas RISC-V and Vectors Reference Model (Sep 24, 2020)
- Opinion: Nvidia's bad deal is not yet done (Sep 24, 2020)
- Synopsys and GLOBALFOUNDRIES Collaborate to Develop Broad Portfolio of DesignWare IP for 12LP+ FinFET Solution (Sep 24, 2020)
- Synopsys and GLOBALFOUNDRIES Collaborate to Expand Fusion Compiler Benefits for Latest Platforms (Sep 24, 2020)
- PLDA announce the 2nd topic of their Webinar Series: "Building Smart Scalable Storage SoC With Embedded PCIe Switching" (Sep 24, 2020)
- Why you should care about Bluetooth Low Energy Audio (Sept. 24, 2020)
- CEVA and VisiSonics Bring 3D Spatial Audio to True Wireless Earbuds and Headphones for the Ultimate Hearing Experience (Sep 23, 2020)
- Silex Insight's Public Key Cryptography Selected for Fungible's Groundbreaking DPU (Sep 23, 2020)
- Spectral Design & Test Inc. Announces 3rd Generation 45RFSOI Low Power SRAM Targeted at the 5G Mobile Device SoC Market (Sep 23, 2020)
- TSMC plans to establish foundries all over Taiwan (Sept. 23, 2020)
- Gyrfalcon White Paper Examines New AI Chipsets for Edge-Vision Computing (Sept. 23, 2020)
- Foundries to grow 19% this year (Sept. 23, 2020)
- PUFsecurity Opens North American Office to Tap Chip Security Market (Sep 22, 2020)
- Imagination launches Ray Tracing Levels System (Sep 22, 2020)
- Toshiba Information Systems (Japan) Integrates Verimatrix's Whitebox Cryptographic Key Technology Into Customer's Main Control Function to Safeguard Consumer Printers (Sep 22, 2020)
- Pure-Play Foundry Market On Pace For Strongest Growth Since 2014 (Sep 22, 2020)
- ARC: from 3D Game Chips to Licensable RISC Processor (Sep 22, 2020)
- CEVA Enhances the User Experience and Extends the Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software (Sep 22, 2020)
- Accelerating the next generation cloud-to-edge infrastructure (Sep 22, 2020)
- SmartDV Delivers First-to-Market MIPI A-PHY v1.0 Verification IP (Sep 22, 2020)
- Rianta Releases 400G/800G Optimized Single Channel PCS/FEC IP Core for Ethernet ASICs and SoCs (Sep 22, 2020)
- Arteris IP FlexNoC & Resilience Package Support SemiDrive ISO 26262-Compliant Chip Production (Sep 22, 2020)
- Potential US ban on SMIC could choke China's semiconductor supply chain (Sept. 22, 2020)
- Accelerating the next generation cloud-to-edge infrastructure (Sept. 22, 2020)
- New Moortec Webinar - Addressing the Challenges of Hyper-scaling within Data Centers with Advanced Node Embedded Sensing Fabrics (Sep 21, 2020)
- RISC-V embedded variant RV32E now fully supported by SEGGER's Floating-Point library (Sep 21, 2020)
- Visit Vidatronic at the Virtual GLOBALFOUNDRIES Technology Conference (GTC) - North America on September 24th (Sep 21, 2020)
- North American Semiconductor Equipment Industry Posts August 2020 Billings (Sep 21, 2020)
- Gowin Semiconductor Launches GOAI 2.0 For Embedded Machine Learning Inference (Sep 21, 2020)
- AccelerComm secures $7.5m Series A funding from IQ Capital, Bloc Ventures and IP Group (Sep 21, 2020)
- Arm A-Profile Architecture Developments 2020 (Sept. 21, 2020)
- Understanding Color Space Conversions in Display (Sept. 21, 2020)
- Analog Bits Provides Enabling IP for Graphcore IPU-Machine M2000 (Sep 18, 2020)
- Interview with Nestwave CEO: low power geolocation without positioning chipset (Sept. 18, 2020)
- Cobham Gaisler Awarded ESA Contract for Development and Validation of New LEON3FT Microcontroller for Space Applications (Sep 17, 2020)
- NSITEXE Successfully Develops Multiple Custom Processors for Automotive Applications in Half the Time with Synopsys ASIP Designer Tool (Sep 17, 2020)
- SOT-MRAM Pioneer Antaios Secures 11 Million Dollars in Funding (Sep 17, 2020)
- Lattice Extends Industry-leading Security and System Control to Automotive Applications (Sep 17, 2020)
- Imagination and Packetcraft announce partnership for low energy audio (Sep 17, 2020)
- SiFive Appoints Patrick Little as President and Chief Executive Officer (Sep 17, 2020)
- Nvidia's $40 Billion ARM Purchase Will Test Current M&A "Ceiling" (Sep 17, 2020)
- Why Was Samsung Not Interested in Taking over ARM? (Sept. 17, 2020)
- videantis appoints Stephan Janouch as marketing director (Sep 17, 2020)
- Xylon Announces Rebranding in Celebration of Its 25-Year Anniversary (Sep 17, 2020)
- Cool AI chips are green (Sept. 17, 2020)
- The Incredible Opportunity For SiFive (Sept. 17, 2020)
- proteanTecs Granted US Patent for High Bandwidth Memory (HBM) Signal Quality and Reliability Monitoring (Sep 16, 2020)
- CEVA Partners with Fluent.ai to Offer Multilingual Speech Understanding Solutions for Intelligent Edge Devices (Sep 16, 2020)
- MIPI Alliance Releases A-PHY SerDes Interface for Automotive (Sep 16, 2020)
- Xilinx Ships Multi-Function Telco Accelerator Card for Growing 5G O-RAN Virtual Baseband Unit Markets (Sep 16, 2020)
- Gyrfalcon Showcases New Tech at 2020 Embedded Vision Summit (Sep 16, 2020)
- The Industry's First SoC FPGA Development Kit Based on the RISC-V Instruction Set Architecture is Now Available (Sep 16, 2020)
- SensiML Integrates Google's TensorFlow Lite for Microcontrollers (Sept. 16, 2020)
- Australia Introduces Code of Practice for IoT Devices (Sept. 16, 2020)
- Taiwan shares rise on TSMC rally (Sept. 16, 2020)
- Secure-IC is ready for ASIL B or ASIL D levels projects with its Securyzr integrated Secure Element (Sept. 16, 2020)
- HDMI 2.1 Rx PHY (TSMC 12FFC) & Controller Semiconductor IP licensed to a Tier1 Chinese Semiconductor company for integration into a TV SOC by T2MIP (Sep 15, 2020)
- New IP for wearables and hearables at IP SoC Shanghai 2020 (Sep 15, 2020)
- Nvidia Begins Campaign to Close Arm Acquisition (Sep 15, 2020)
- Mixel Announces Availability of the World's First MIPI C-PHY/D-PHY Combo IP Supporting 30 Gbps (Sep 15, 2020)
- Arteris IP FlexNoC Interconnect Licensed by VITEC for High Resolution Video Encoder and Decoder Chips (Sep 15, 2020)
- Taiwan Semiconductor And Samsung Electronics Foundry Business Post-SMIC Blockade (Sept. 15, 2020)
- SMIC asks for US permission to continue supplying Huawei (Sept. 15, 2020)
- SiFive To Introduce New RISC-V Processor Architecture and RISC-V PC at Linley Fall Virtual Processor Conference (Sep 14, 2020)
- Technology Analyzer transforms analog IP reuse (Sep 14, 2020)
- NVIDIA to Acquire Arm for $40 Billion, Creating World's Premier Computing Company for the Age of AI (Sep 14, 2020)
- Qeexo AutoML Enables Machine Learning on Arm Cortex-M0 and Cortex-M0+ (Sep 14, 2020)
- Total Microprocessor Sales to Edge Slightly Higher in 2020 (Sep 14, 2020)
- Imagination appoints Sir Peter Bonfield to board as non-executive director (Sep 14, 2020)
- SIMCom claims NB-IoT Will Accelerate the Expansion of IoT (Sept. 14, 2020)
- Nvidia Must Now Convince Multiple Stakeholders to Close Arm Purchase (Sept. 14, 2020)
- TSMC and Intel, 5nm node will be built in Foundry after Xe-HPG (Sept. 11, 2020)
- Lattice Shrinks Design Footprint and Cost, Boosts Reliability in Embedded Systems with Single Wire Aggregation IP Solution (Sep 10, 2020)
- Kushagra Vaid Joins Flex Logix's Board of Directors (Sep 10, 2020)
- BrainChip Demonstrates Company's Event-Based AI Neural Processor at Embedded Vision Summit (Sep 10, 2020)
- Rambus Advances HBM2E Performance to 4.0 Gbps for AI/ML Training Applications (Sep 10, 2020)
- TSMC August 2020 Revenue Report (Sep 10, 2020)
- SkyWater Begins Domestic Fab Expansion Tool Installation to Support DOD Investment of up to $170M (Sep 10, 2020)
- DSP Group Selects Synopsys' ARC EM Processor IP for Adaptive Processing Smart Codecs (Sep 10, 2020)
- Silex Insight and Faraday Extend Strategic Partnership to Deliver Secure IoT and AI Solutions (Sep 10, 2020)
- Germany Taking the Autobahn to Autonomy (Sept. 10, 2020)
- Silvaco Acquires the Assets of Coupling Wave Solutions S.A. (Sep 09, 2020)
- UMC Reports Sales for August 2020 (Sep 09, 2020)
- Analog Bits at TSMC OIP – A Complete On-Die Clock Subsystem for PCIe Gen 5 (Sept. 09, 2020)
- Highlights of the TSMC Technology Symposium – Part 3 (Sept. 09, 2020)
- Synopsys Introduces the Industry's First Unified Electronic and Photonic Design Platform (Sept. 09, 2020)
- Blue Cheetah Technology Catalyzes Chiplet Ecosystem (Sept. 09, 2020)
- Aspinity Raises $5.3M to Deploy Neuromorphic Analog Processing IC (Sept. 09, 2020)
- Pandemic Accelerates MIT Machine Learning Initiative (Sept. 09, 2020)
- Renesas Introduces DDR5 Data Buffer for High-Performance Server and Cloud Service Applications (Sept. 09, 2020)
- Global Semiconductor Sales Up 4.9% YoY in July (Sept. 09, 2020)
- IAR Systems supports ultra-low-power Renesas RE MCU Family in industry-leading Arm tools (Sep 08, 2020)
- Chips&Media to Exhibit at the 2020 Embedded Vision Summit (Sep 08, 2020)
- CAST and Fraunhofer IPMS Introduce CAN XL Bus Controller IP Core (Sep 08, 2020)
- Socionext starts providing high-speed, high-quality H.264 video encoder available on Amazon Web Services (Sep 08, 2020)
- Second Quarter 2020 Global Semiconductor Equipment Billings Up 26% Year-Over-Year, SEMI Reports (Sep 08, 2020)
- Fraunhofer IIS presents 8k video over IP transmission with JPEG XS at the virtual IBC 2020 (Sep 08, 2020)
- Credo Introduces Seagull 50 PAM4 DSP to Drive Front- and Mid-Haul 5G Wireless Networks (Sep 08, 2020)
- UMC soars as US eyes SMIC ban (Sept. 08, 2020)
- Arm Targets Computational Storage with 64-bit Processor Running Linux (Sept. 08, 2020)
- 2H20 Growth Expectations Vary Among Leading IC Suppliers (Sep 07, 2020)
- Global Semiconductor Sales Increase 4.9 Percent Year-to-Year in July (Sep 07, 2020)
- Thalia and Dolphin Design announce partnership to transform analog IP re-use economics and to accelerate time to market (Sep 07, 2020)
- GUC Monthly Sales Report - Aug 2020 (Sep 07, 2020)
- Semiconductor Manufacturing International Corporation Responses to Media on the U.S. Government's Consideration to Add the Company to a Trade Blacklist (Sep 07, 2020)
- Arasan Announces MIPI I3C IP Cores compliant to the MIPI I3C Specifications v1.1 (Sep 07, 2020)
- S2C Announces 300 Million Gate Prototyping System with Intel Stratix 10 GX 10M FPGAs (Sep 07, 2020)
- Semiconductor Industry: US Government Considering Sanctions against SMIC (Sept. 07, 2020)
- Automotive Software: Where Are We Going? (Sept. 07, 2020)
- New PicoRio SBC To Feature RISC-V Open-Source Processor (Sept. 06, 2020)
- electronica 2020 goes completely digital (Sept. 05, 2020)
- BrainChip and VORAGO Technologies Agree to Collaborate through the Akida Early Access Program (Sep 03, 2020)
- Arm announces Cortex-R82: powering the future of computational storage (Sep 03, 2020)
- Chips&Media Announces Making the First License Deal of Upscaling HW IP, c.WAVE120 (Sep 03, 2020)
- Lattice Expands CrossLink-NX FPGA Family of Best-in-Class Low Power FPGAs for Smart and Embedded Vision Systems (Sep 03, 2020)
- Blockchain Hardware Accelerator from Silex Insight is now available on AWS Marketplace (Sep 03, 2020)
- Aspinity Raises $5.3 Million Series A Funding to Stop Battery Drain in Always-on Smart Sensing Products (Sep 03, 2020)
- Kneron Boosts On-Device Edge AI Computing Performance with Cadence Tensilica IP (Sep 03, 2020)
- SiOx ReRAMs Promise to Accelerate AI Self-Learning (Sept. 03, 2020)
- Rambus and Micron Extend Patent License Agreement (Sep 03, 2020)
- SiFive and Barcelona Supercomputing Center Advance Industry Adoption of RISC-V Vector Extension (Sep 03, 2020)
- Mentor achieves certifications for TSMC's leading-edge 3nm process technology (Sep 03, 2020)
- Synopsys and Nestwave Collaborate to Develop a Low-Power Geolocation IP Solution for IoT Modems (Sep 03, 2020)
- Imagination announces the first RISC-V computer architecture course (Sep 02, 2020)
- Secure-IC and NSITEXE form a global partnership to jointly provide cutting-edge security solutions for Cyber-Physical Systems (CPS) (Sep 02, 2020)
- How AI Propels Medicine Development (Sept. 02, 2020)
- Nokia launching professional 5G training and certification (Sept. 02, 2020)
- Synopsys Appoints Jeannine Sargent to Board of Directors (Sep 02, 2020)
- SensiML Joins Arm AI Partner Program (Sep 02, 2020)
- PUFsecurity Unveils PUFiot, PUF-based Secure Crypto Coprocessor (Sep 01, 2020)
- Synopsys and Elektrobit Announce Availability of EB tresos Classic AUTOSAR Software for ARC Functional Safety Processor IP (Sep 01, 2020)
- The biggest IoT mistakes businesses make (Sept. 01, 2020)
- The Latest Iteration of 5G Standards Nailed Down (Sept. 01, 2020)
- Flex Logix Announces nnMAX AI Inference IP In Development On GLOBALFOUNDRIES 12LP Platform (Aug 31, 2020)
- Broadcom Overtakes Qualcomm for First Place While Nvidia Scores Highest YoY Growth in 2Q20 Revenue Ranking of Global Top Ten IC Design Companies, Says TrendForce (Aug 31, 2020)
- Mobiveil's 25xN RapidIO 4.1 compliant controller IP achives production status (Aug 31, 2020)
- Kneron's Next-Gen AI SoC Processes Video and Audio at the Edge (Aug 31, 2020)
- The future of leading-edge chips according to TSMC: 5nm, 4nm, 3nm and beyond (Aug. 31, 2020)
- ProteanTecs, which provides an AI platform to monitor chip reliability, raises $45 million (Aug. 30, 2020)
- TSMC's Super-gap Approach Puts Samsung Electronics on Alert (Aug. 28, 2020)
- Alibaba's new 16-core CPU will challenge Intel Xeon in datacenters (Aug. 28, 2020)
- Bluespec, Inc. Releases RISC-V Explorer: A Fast, Free, Accurate Way to Evaluate RISC-V (Aug 27, 2020)
- SiliconArts Joins the Khronos Group to Support Standardization of Vulkan Ray Tracing (Aug 27, 2020)
- Mentor's Questa and Veloce platforms help SimpleMachines dramatically speed development of its first AI processor (Aug 27, 2020)
- Chips&Media Publicize the Collaboration on SiFive's OpenFive, a Custom Silicon Business Unit. (Aug. 27, 2020)
- China chip imports still at $300bn (Aug 27, 2020)
- Chelsio Adopts Synopsys DesignWare 56G Ethernet PHY IP to Accelerate Development of High-Performance Computing SoC (Aug 27, 2020)
- proteanTecs Closes $45M Growth Equity Round Led by Koch Disruptive Technologies (KDT) (Aug 27, 2020)
- MIPS lands up in China (Aug 27, 2020)
- Chips&Media Publicizes the Collaboration on SiFive's OpenFive, a Custom Silicon Business Unit (Aug 27, 2020)
- Cadence IC Packaging Reference Flow Certified for the Latest TSMC Advanced Packaging Solutions (Aug 26, 2020)
- Nvidia Data Center Growth: Could Buying Arm Be an Ideal Match? (Aug 26, 2020)
- Samsung Display Demonstrates Most Advanced Display Hole for Smartphone Cameras (Aug. 26, 2020)
- WISeKey to Establish WISeAI, a Joint Venture with German Artificial Intelligence Leader arago, Blending AI, IoT and Cybersecurity into a Trusted European Platform (Aug. 26, 2020)
- Optical Processor Targets to Accelerate Compute for Next-Gen AI (Aug. 26, 2020)
- White House announces $1B investment for AI and quantum computing hubs (Aug. 26, 2020)
- Synopsys and TSMC Accelerate 2.5D/3DIC Designs with Chip-on-Wafer-on-Substrate and Integrated Fan-Out Certified Design Flows (Aug 25, 2020)
- TSMC Showcases Leading Technologies at Online Technology Symposium and OIP Ecosystem Forum (Aug 25, 2020)
- TSMC Plots the Process Course to Its Next "Generational Node" (Aug 25, 2020)
- Analog Bits to Present Papers on Wafer-Scale Sensors and PCIe Clock Systems at TSMC 2020 Open Innovation Platform Ecosystem Forums (Aug 25, 2020)
- Synopsys Collaborates with TSMC to Accelerate 3nm Innovation, Enabling Next-Generation SoC Design (Aug 25, 2020)
- Marvell and TSMC Collaborate to Deliver Industry's Most Advanced Data Infrastructure Portfolio on 5nm Technology (Aug 25, 2020)
- Cadence Announces Availability of UltraLink D2D PHY IP on TSMC N7, N6 and N5 Processes (Aug 25, 2020)
- GigaDevice launches the New GD32E5 Series of MCU's, marking a new milestone for high-performance computing based on the Arm Cortex-M33 core. (Aug 25, 2020)
- Huawei is hurrying to build a wafer fab (Aug 25, 2020)
- Automotive Software Platforms: Current Status (Aug. 25, 2020)
- CXL™ Consortium and JEDEC® Sign MOU Agreement to Advance DRAM and Persistent Memory Technology (Aug 25, 2022)
- Foundry Revenue Projected to Grow by 14% YoY in 3Q20 as Downstream Clients Exhibit Strong Demand, Says TrendForce (Aug 24, 2020)
- Dolphin Design Releases its First Development Platform on TSMC 22ULL Process for Smart Home Applications (Aug 24, 2020)
- Sofics releases Analog I/O's and ESD clamps for TSMC N5 process (Aug 24, 2020)
- North American Semiconductor Equipment Industry Posts July 2020 Billings (Aug 24, 2020)
- Silicon Creations' Achieves ISO 9001 Certification for World-Class Silicon IP Development Process (Aug 24, 2020)
- Socionext and Osaka University Develop New Deep Learning Method for Object Detection in Low-Light Conditions (Aug 24, 2020)
- TrendForce Analyzes Impacts of Expanded U.S. Sanctions Against Huawei on Five Major Tech Industries (Aug 24, 2020)
- Visit Moortec at the Virtual TSMC Technology Symposium & Open Innovation Platform Ecosystem Forum (Aug 24, 2020)
- Foundry Revenue Projected to Grow by 14% YoY in 3Q20 (Aug. 24, 2020)
- Arm Flexible Access one year later: Accelerating innovation for more than 60 partners and counting (Aug. 24, 2020)
- prpl Foundation Releases prplWRT Open-Source CPE Software (Aug 20, 2020)
- Synopsys Appoints Sassine Ghazi as Chief Operating Officer (Aug 20, 2020)
- DRAM Capex Spending Expected to Decline 20% in 2020 (Aug 20, 2020)
- Clue Technologies adopts OneSpin's verification solution for avionic computing systems (Aug 20, 2020)
- Electronics Supply Chains Splitting Between China and U.S. (Aug 20, 2020)
- Synopsys Posts Financial Results for Third Quarter Fiscal Year 2020 (Aug 20, 2020)
- Subaru Selects Xilinx to Power New-Generation EyeSight System (Aug 20, 2020)
- OpenFive Enhances Differentiated IP Portfolio with Die-to-Die Interface Controllers for HPC and Chiplet Markets (Aug 20, 2020)
- Synopsys IC Validator, Running on AMD EPYC Processor Powered Azure Virtual Machines, Verifies AMD Radeon Pro VII GPU Design in Under Nine Hours (Aug 20, 2020)
- Arm and DARPA Sign Partnership Agreement to Accelerate Technological Innovation (Aug 20, 2020)
- Intel Looks to Regain Innovation Lead (Aug 19, 2020)
- CEVA's Wi-Fi 6 Solution Becomes World's First IP to Achieve Wi-Fi CERTIFIED 6 Status from the Wi-Fi Alliance (Aug 19, 2020)
- US Tightens Chip Export Screws on Huawei (Aug 19, 2020)
- RIOS Laboratory and Imagination announce partnership to grow the RISC-V ecosystem (Aug 19, 2020)
- Moortec Provides In-Chip Sensing Fabrics on TSMC N6 Process Technology (Aug 19, 2020)
- NSITEXE Adopts Synopsys HAPS Prototyping to Validate Data Flow Processor IP (Aug. 19, 2020)
- Alibaba XT910 RISC-V Core Faster Than Kirin 970 SoC; Threat To ARM? (Aug. 19, 2020)
- Proof of concept security platform protects IoT and 5G private networks (Aug. 19, 2020)
- Nuvoton Accelerates the Development of its MCU Designs with the Cadence Palladium Z1 Enterprise Emulation Platform (Aug 18, 2020)
- The Landmark IPO of VeriSilicon (688521.SH) on Shanghai STAR Market (Aug 18, 2020)
- S2C and Mirabilis Design Teamup to Deliver a Heterogeneous Solution for SoC Architecture Exploration and Verification (Aug 18, 2020)
- Semiconductor Industry Luminary Fred Weber Joins Movellus as Corporate Advisor (Aug 18, 2020)
- Rianta Releases 800G MACsec ASIC/SoC IP Core for Next-Gen Data Center and 5G Backhaul Applications (Aug 18, 2020)
- SiFive and Innovium Announce Collaboration to Accelerate Innovation in Data Center Networking (Aug 18, 2020)
- Mixel's Patented D-PHY RX+ IP Extends Market Share with Automotive Microcontrollers (Aug 18, 2020)
- Samsung ramps up foundry business as manufacturer of IBM's 7nm CPU (Aug. 18, 2020)
- Movellus Named to EETimes' Silicon 100 Emerging Startups to Watch List (Aug 17, 2020)
- BrainChip Inc and Magik Eye Inc. Partner to Combine Best of AI with 3D Sensing for Total 3D Vision Solution (Aug 17, 2020)
- SiFive Announces OpenFive, an Industry-Leading Custom Silicon Business Unit (Aug 17, 2020)
- Silicon Creations' SerDes Technology Designed into Novatek 8K TV SoC on TSMC 12nm Process (Aug 17, 2020)
- eInfochips provides SOC engineering services to Astera Labs in developing industry's first PCIe 4.0 & 5.0 Smart Retimer SoC. (Aug 17, 2020)
- IBM Reveals Next-Generation IBM POWER10 Processor (Aug 17, 2020)
- SiFive founds business unit to mix Risc-V and Arm cores on silicon (Aug. 17, 2020)
- Arm co-founder: Nvidia sale is because Softbank over-invested in firm (Aug. 17, 2020)
- Blaize Delivers Breakthrough for AI Edge Computing (Aug 14, 2020)
- Cadence Delivers Machine Learning-Optimized Xcelium Logic Simulation with up to 5X Faster Regressions (Aug 13, 2020)
- Startup Claims Low-power IoT Geolocation Without a Positioning Chipset (Aug 13, 2020)
- BrainChip Inc Appoints Vice President of Worldwide Sales (Aug 13, 2020)
- Cobham Advanced Electronic Solutions' RadHard Microelectronics Assist in Study of Sun and Earth Connection (Aug 13, 2020)
- Synopsys Introduces Integrated Electric Vehicle Virtual Prototyping Solution (Aug 13, 2020)
- Samsung Announces Availability of its Silicon-Proven 3D IC Technology for High-Performance Applications (Aug. 13, 2020)
- CHIPS Act Targets Post-Globalized Industry (Aug 13, 2020)
- Alchip Technologies Opens 5nm ASIC Design Capabilities (Aug 13, 2020)
- Spin Memory Unveils New Method of Designing Memory to Shake Up $100B Chip Market (Aug 13, 2020)
- SMIC says it has improved the yield rate of its 14nm manufacturing node (Aug. 13, 2020)
- Tachyum Demo Shows Prodigy will be Faster than NVIDIA and Intel Chips (Aug 12, 2020)
- CEVA NB-IoT IP Achieves Monumental Milestone; Awarded Full Certification from Deutsche Telekom (Aug 12, 2020)
- Qualcomm's licensing model declared legal (Aug 12, 2020)
- China-Based HiSilicon's Time in the Top-10 Ranking May be Short Lived (Aug 12, 2020)
- Gowin Semiconductor Adds Korea Certification For Their Bluetooth Low Energy Enabled MSoC FPGA Modules (Aug 12, 2020)
- Brain simulator AI platform processes 3 billion synapses/s (Aug. 12, 2020)
- Demand for Edge AI Chips to Surpass Cloud AI by 2025 (Aug. 12, 2020)
- Dialog Semiconductor's FusionHD™ NOR Flash Memory Compatible and Qualified with its SmartBond™ Bluetooth Low Energy Wireless MCUs (Aug. 12, 2020)
- SiFive Secures $61 Million in Series E Funding (Aug 11, 2020)
- QuickLogic Joins CHIPS Alliance to Expand Open Source FPGA Efforts (Aug 11, 2020)
- Lack of ADAS Benchmarks Is Haunting Car Industry (Aug. 11, 2020)
- Covid-19 Expected to Limit Growth Rates For Many IC Products in 2020 (Aug 10, 2020)
- Truechip Announces Customer Shipment Of USB4 And eUSB Verification IPs (Aug 10, 2020)
- Mentor extends industry-leading EDA software support for Samsung Foundry's 5/4nm process technologies (Aug 10, 2020)
- TSMC July 2020 Revenue Report (Aug 10, 2020)
- UMC Reports Sales for July 2020 (Aug 10, 2020)
- One on One with RISC-V CTO Mark Himelstein (Aug 10, 2020)
- Imec presents low-power 60 GHz radar chip for contactless health tracking in battery-powered devices (Aug 10, 2020)
- Huawei to end production of leading edge mobile chipsets (Aug 10, 2020)
- CEVA, Inc. Announces Second Quarter 2020 Financial Results (Aug 10, 2020)
- CAST HDLC/SDLC IP Core Now Ready for DO-254 Compliance in Airborne Systems (Aug 06, 2020)
- MediaTek and Intel Advance Partnership to Bring 5G to Next Generation of PCs (Aug 06, 2020)
- Lattice FPGA Brings High-Performance MIPI Bridging to Ambarella's CVflow Architecture for Automotive and Machine Vision Applications (Aug 06, 2020)
- Aldec's TySOM Embedded Development Kits are Now Qualified for AWS IoT Greengrass (Aug 06, 2020)
- SMIC Reports 2020 Second Quarter Results. (Aug 06, 2020)
- GUC Monthly Sales Report - July 2020 (Aug 05, 2020)
- Rambus Reports Second Quarter 2020 Financial Results (Aug 05, 2020)
- Global Semiconductor Sales Increase 5.1 Percent Year-to-Year in June; Q2 Sales Down Slightly Compared to Q1 (Aug 05, 2020)
- Pliops Storage Processor Proven to Boost Flash Performance (Aug 05, 2020)
- HiWire Consortium Publishes first Active Electrical Cable (AEC) Specification (Aug 05, 2020)
- Samsung said to have lost Qualcomm's 5nm chip orders to TSMC (Aug. 05, 2020)
- SMIC Founder: Next-gen semiconductors don't need big investment, talent is key. (Aug. 05, 2020)
- x86, ARM, and RISC-V software running on Tachyum Prodigy (Aug. 05, 2020)
- GlobalWafers' net profit drops on logistics costs (Aug. 05, 2020)
- Arm, Vodafone Demo Virtual Telco Platform (Aug. 05, 2020)
- Lattice FPGA Brings High-Performance MIPI Bridging to Ambarella's CVflow Architecture for Automotive and Machine Vision Applications (Aug. 05, 2020)
- Codasip and Metrics Design Automation Announce the Integration of the Metrics Cloud Simulation Platform in Codasip's RISC-V SweRV CORE Support Package Pro (Aug 05, 2020)
- Syntiant Surpasses 1 Million Units Shipped; Raises $35M in Series C Led by M12 and Applied Ventures (Aug 05, 2020)
- PUFsecurity Launches Unique Quantum-Tunneling PUF-based Root-of-Trust (Aug 04, 2020)
- Picocom Embeds 32 Andes N25F RISC-V Cores into Its 5G NR Small Cell Baseband SoC (Aug 04, 2020)
- Infineon looking for €8.5bn revenues this year (Aug. 04, 2020)
- Nvidia Is Likely To Make A Strategic Investment In ARM Instead Of Buying It Outright (Aug. 04, 2020)
- Nvidia Buying Arm Would be Reckless (Aug 03, 2020)
- Nvidia in pole position to buy Arm (Aug 03, 2020)
- Nvidia-Arm Deal Would Be a Technology "Disaster" (Aug 03, 2020)
- Greg Lang Joins Rambus Board of Directors (Aug 03, 2020)
- NAND Flash, DRAM Forecast to Remain Largest IC Markets in 2020 (Aug 03, 2020)
- Goodix Closes Acquisition of Dream Chip Technologies (Aug 03, 2020)
- Intento Design announces the launch of ID-Calibre, an ID-Substrate extension for behavioural TCAD simulation on a complete AMS chip (Jul 30, 2020)
- Gen-Z Seeks to Share Memory, Lower Latencies (Jul 30, 2020)
- Analog Devices Acquires HDMI Business From INVECAS, Expanding High Performance Audiovisual Capabilities (Jul 30, 2020)
- Intel Outside ... Just Like all the Others (Jul 30, 2020)
- Will Intel lose its position as a semiconductor market leader? (Jul. 29, 2020)
- DB HiTek: Opportunity for Rapid Growth of Foundry Market (Jul. 29, 2020)
- Avanci Launches 5G Licensing Platform for the Internet of Things (Jul. 29, 2020)
- Media Links moves to intoPIX TICO-XS for its MDP3020 IP Media Gateway (Jul 29, 2020)
- Arm China asks Beijing government to intervene in row with Arm UK (Jul 29, 2020)
- Intel is a Potentially Great Foundry (Jul 29, 2020)
- Fraunhofer IIS licenses MPEG-H Audio patents to Samsung (Jul 29, 2020)
- IoT Growth Demands Rethink of Long-Term Storage Strategies (Jul. 29, 2020)
- CES 2021 to be virtual (Jul. 29, 2020)
- ON Semiconductor Provides BLE Solution with Veridify (Jul. 29, 2020)
- Dolby MS12 Multistream Decoder Now Supported and Approved on CEVA's Audio DSP (Jul 28, 2020)
- Marvell Unveils the Industry's Most Comprehensive Custom ASIC Offering (Jul 28, 2020)
- Peninsular Capital Acquires NovaSparks (Jul 28, 2020)
- TSMC remains top applicant for invention patents in Taiwan (Jul. 28, 2020)
- Automotive Design Needs Efficient Verification to Survive (Jul. 28, 2020)
- How to get started with AI inferencing on the edge (Jul. 28, 2020)
- Verimatrix WhiteBox Offers Unmatched Control and Protection Against Cyberattacks for Mobile Apps, IoT Devices and OEM Partner Integrations (Jul. 28, 2020)
- Second Quarter 2020 Silicon Wafer Shipments Up Over First-Quarter and Year-Ago Volumes (Jul 27, 2020)
- Exostiv Labs achieves 50 Gbps interoperability tests with Avnet ONIX board. (Jul 27, 2020)
- Innovium Secures $170M in New Funding to Accelerate Product and Customer Momentum Worldwide (Jul 27, 2020)
- Fraunhofer IIS announces licensing program for the new MPEG-H 3D Audio Baseline Profile (Jul 27, 2020)
- North American Semiconductor Equipment Industry Posts June 2020 Billings (Jul 24, 2020)
- Faraday Reports Second Quarter 2020 Revenues at NT$1,306 Million with an EPS of NT$0.58 (Jul 24, 2020)
- M31 Completes the Comprehensive Physical IP Platform on TSMC 22nm Process (Jul 24, 2020)
- Speculation Arises over Samsung's Possible Acquisition of ARM (Jul. 23, 2020)
- SiFive Elevates Custom SoC Design With Enhanced Processor IP Portfolio (Jul 23, 2020)
- European Space Agency, Blue Pearl Software and ADIUVO Engineering Partner Contract to Improve the usability of ESA Soft-Cores (Jul 23, 2020)
- Carlos Mazure, EVP of Soitec and Chairman of the SOI Industry Consortium, Joins Silvaco Board of Directors (Jul 23, 2020)
- Aldec Provides Static Verification for RISC-V Designs with the latest release of ALINT-PRO (Jul 23, 2020)
- Brite Semiconductor Provides Total Solution for NVDIMM OEM (Jul 23, 2020)
- Cadence and UMC Certify mmWave Reference Flow on 28HPC+ Process for Advanced RF Designs (Jul 23, 2020)
- Mobile Semiconductor's Enhanced Memory Compilers Dramatically Improve Power On Edge AI Devices (Jul 23, 2020)
- AI Edge Inference is Totally Different to Data Center (Jul. 23, 2020)
- Softbank talks to Apple and Nvidia about Arm sale (Jul 23, 2020)
- Village Island creates a new breakthrough in the Broadcast market by offering JPEG-XS technology on its VICO series (Jul 23, 2020)
- GLOBALFOUNDRIES Partners with Synopsys, Mentor, and Keysight on Interoperable Process Design Kit (iPDK) Support for 22FDX (Jul 22, 2020)
- Samsung Electronics and TSMC Planning on More Investments (Jul. 22, 2020)
- OpenHW Ecosystem Implements Imperas RISC-V reference models for Coverage Driven Verification of Open Source CORE-V processor IP cores (Jul 22, 2020)
- Alchip Technologies 7nm ASIC Capabilities Set Advanced Technology Pace (Jul 22, 2020)
- Flex Logix Announces EFLX eFPGA And nnMAX AI Inference IP Model Support For The Veloce Strato Emulation Platform From Mentor (Jul 21, 2020)
- Cadence Reports Second Quarter 2020 Financial Results (Jul 21, 2020)
- New Analog FastSPICE eXTreme technology boosts verification performance by up to 10X (Jul 21, 2020)
- Synaptics to Acquire DisplayLink, Extending Video Interface Market Leadership (Jul 21, 2020)
- Codasip Releases the First Linux-Capable RISC-V Core Bk7 Optimized for Domain-Specific Applications (Jul 21, 2020)
- Moore's Law Isn't Slowing down - Just Ask System Companies (Jul 21, 2020)
- CFI funding fuels new services for researchers from CMC and CNDN (Jul. 21, 2020)
- Hua Hong Semiconductor Continues to Build a Superior eNVM Process Platform (Jul 20, 2020)
- SMIC: Advanced Process Technologies and Gov't Funding (Part 2) (Jul 20, 2020)
- PLDA Announces Robust Verification Toolset, Increasing Design Accuracy and Reducing Time-to-Production for Next Generation SoCs with CXL, PCIe 6.0 or Gen-Z Interconnect (Jul 20, 2020)
- Perforce Software Acquires Methodics, Expanding DevOps Portfolio (Jul 20, 2020)
- Synopsys VCS Used by Graphcore to Verify Next-Generation Colossus GC200 IPU (Jul 20, 2020)
- SmartDV, Aldec Partner to Link SmartDV's Verification IP with Aldec's Riviera-PRO Simulator (Jul 20, 2020)
- Mentor introduces Calibre nmLVS-Recon technology to dramatically streamline overall IC circuit verification (Jul 20, 2020)
- STMicroelectronics makes acquisitions to further strengthen the wireless connectivity capabilities of STM32 microcontrollers (Jul 20, 2020)
- True Circuits Participates in First Virtual DAC! Showcases Silicon Proven PLLs, DLLs and DDR 4/3 PHYs (Jul 20, 2020)
- CFX announces commercial availability of anti-fuse OTP technology on SMIC 40HV process (Jul 20, 2020)
- TSMC open to possibility of building plants in Japan (Jul. 20, 2020)
- How SMIC Can Keep Up With Advanced Process Technologies (Jul. 20, 2020)
- Long-Range Wireless Power Transfer for Industrial IoT (Jul. 20, 2020)
- Antitrust: the European Commission launches sector inquiry into the consumer Internet of Things (IoT) (Jul. 20, 2020)
- Long-Range Wireless Power Transfer for Industrial IoT (Jul. 20, 2020)
- Spin Memory Announces Extension of Series B Funding (Jul 17, 2020)
- TSMC Raises Capital Expenditure Plan on Improved Outlook (Jul 17, 2020)
- CHIPS Alliance Announces AIB 2.0 Draft Specification to Accelerate Design of Open Source Chiplets (Jul 17, 2020)
- USB-IF Publishes USB Device Class Specification for MIDI Devices v2.0 (Jul 17, 2020)
- Innovative Advantage upgrades streams from HD to 4K in business jets with the intoPIX TICO RDD35 Technology (Jul 17, 2020)
- Nestwave wins Must Award in the category Most Innovative Startup (Jul. 17, 2020)
- TSMC Reports Second Quarter EPS of NT$4.66 (Jul 16, 2020)
- Axiomise Announces the Release of the Next-Generation RISC-V App (Jul 16, 2020)
- Customisable wireless medical sensor chip with machine learning accelerator enables mass market advanced medical and vital-sign monitors (Jul 16, 2020)
- Faraday Launches Ariel SoC Platform with Infineon's SONOS eFlash to Drive IoT Development (Jul 16, 2020)
- 1Q/4Q "Direction Indicator" Signals Rebound in the 2020 IC Market (Jul 16, 2020)
- Siemens acquires Avatar, expands EDA footprint with innovative Place and Route technology (Jul 16, 2020)
- EasyIC Design celebrates its 10th anniversary (Jul. 16, 2020)
- Buying Avatar, Siemens Revives Legendary Place & Route Tool (Jul 16, 2020)
- Menta Announces New Software Version and New Adaptive DSP at DAC 2020 (Jul 16, 2020)
- Kandou Appoints Jeff Winzeler CFO (Jul 16, 2020)
- Synopsys Announces Industry's First JEDEC DDR5 Verification IP for Next-Generation DRAM/DIMM Designs (Jul 15, 2020)
- Dr. Walden Rhines Joins Cornami as President and CEO (Jul 15, 2020)
- JEDEC Publishes New DDR5 Standard for Advancing Next-Generation High Performance Computing Systems (Jul 15, 2020)
- SMIC: Advanced Process Technologies and Gov't Funding (Jul 15, 2020)
- Efinix Announces Trion Titanium Family (Jul 15, 2020)
- Softbank Said to Have a Buyout Offer for Arm (Jul 15, 2020)
- How SMIC Can Keep Up With Advanced Process Technologies (Jul. 15, 2020)
- SATA-IO Increases Interoperability Features with Revision 3.5 Specification (Jul. 15, 2020)
- British chip designer Graphcore unveils new AI processor more complex than Nvidia's (Jul. 15, 2020)
- Tenstorrent Achieves First-Pass Silicon Success for High-Performance AI Processor SoC Using Synopsys' Broad DesignWare IP Portfolio (Jul 15, 2020)
- Maxim Integrated Deal Cements Analog Devices at No 2 in Analog (Jul 15, 2020)
- VITEC Licenses Codasip Bk5 Core for Multi-Purpose Use in Video Products (Jul 14, 2020)
- Mixel MIPI D-PHY IP Integrated into the Perceive Ergo Edge Inference Processor (Jul 14, 2020)
- TSMC pushing to produce advanced chips using experimental design by 2023, 2024 (Jul. 14, 2020)
- Axiomise Announces the Release of the Next-Generation RISC-V® App (Jul. 14, 2020)
- ESD Alliance Reports Electronic Design Automation Industry Revenue Growth for Q1 2020 (Jul 13, 2020)
- Mentor collaborates with Samsung Foundry to boost product yield and streamline in-fab memory testing (Jul 13, 2020)
- Flex Logix Announces EFLX eFPGA Emulation Models For The Cadence Palladium Z1 Platform (Jul 13, 2020)
- DMP releases IP Core "ZIA ISP" (Jul 13, 2020)
- Analog Devices Announces Combination with Maxim Integrated, Strengthening Analog Semiconductor Leadership (Jul 13, 2020)
- DMP releases AI Processor IP Core "ZIA DV740" (Jul 13, 2020)
- TSMC June 2020 Revenue Report (Jul 13, 2020)
- Arm Research Selected for DARPA Secure Silicon Program (Jul. 13, 2020)
- TSMC's market cap continues record upswing after June sales report (Jul. 13, 2020)
- UMC Reports Sales for June 2020 (Jul 09, 2020)
- Mirabilis Design announces the first Application-Specific University Program (Jul. 09, 2020)
- Synaptics to Acquire Rights to Broadcom's Wireless IoT Connectivity Business (Jul 08, 2020)
- High Performance Channel Coding Solutions on Xilinx Zynq UltraScale+ RFSoC Devices (Jul 08, 2020)
- Soitec announces POI substrates business agreement with Qualcomm Technologies for 5G RF filters (Jul 08, 2020)
- SmartDV Broadens Support for Arm AMBA Protocol with Verification IP Solutions for AMBA CHI, CXS, LPI (Jul 08, 2020)
- Imagination announces XS, the automotive industry's most advanced GPU IP (Jul 08, 2020)
- SiFive looks to foster worldwide network of RISC-V startups (Jul. 08, 2020)
- Imec and GLOBALFOUNDRIES Announce Breakthrough in AI Chip, Bringing Deep Neural Network Calculations to IoT Edge Devices (Jul. 08, 2020)
- Wi-Fi 6 is Set to Change the Future of IoT–Here's Why (Jul. 08, 2020)
- Low-Power FD-SOI FPGA Melds AI and Bridging (Jul. 08, 2020)
- Imagination announces latest licensing deal with NXP (Jul 07, 2020)
- Apple to Start Mass Producing Self-Designed Mac SoC, Projected to Cost under US$100, in 1H21, Says TrendForce (Jul 07, 2020)
- videantis processor platform adopted for TEMPO neuromorphic edge AI chip (Jul 07, 2020)
- JLQ Technology Selects Synopsys DesignWare IP to Accelerate Development of Next-Generation SoCs (Jul 07, 2020)
- Arm intends to strengthen focus on core semiconductor IP business growth (Jul 07, 2020)
- Arm intends to strengthen focus on core semiconductor IP business growth (Jul 07, 2020)
- The Value of Intellectual Capital (Jul. 07, 2020)
- Global Semiconductor Sales Increase 5.8 Percent Year-to-Year in May; Annual Sales Projected to Increase 3.3 Percent in 2020, 6.2 Percent in 2021 (Jul 06, 2020)
- Phison appoints T2M-IP for global marketing, representation, and business development (Jul 06, 2020)
- Ingenic Semiconductor integrates Allegro DVT Encoding IP into Next-Generation Smart-Video System-On-Chip Solutions (Jul 06, 2020)
- Dolphin Design unveils the final piece of their platform offer with BAT, an audio solution for high quality AIoT applications (Jul 06, 2020)
- Creonic joins partnership with the University of Bremen to expand the development of Artificial Intelligence (Jul 06, 2020)
- GUC Monthly Sales Report - June 2020 (Jul 06, 2020)
- TSMC rebuffs Samsung challenge to chip foundry dominance (Jul. 05, 2020)
- China chipmaker SMIC to raise $6.55 billion in Shanghai share sale (Jul. 05, 2020)
- New GAA Nanosheet Architecture to Drive Silicon Performance (Jul. 03, 2020)
- Innosilicon IP helps Ingenic T20 win "China Chip" Excellent Market Performance Product Award (Jul 02, 2020)
- Innosilicon multiple high-speed interface IPs, based on the SMIC 14nm process, R&D and mass production proven (Jul 02, 2020)
- Appear TV introduces Zero-latency intoPIX JPEG XS technology in the X Platform (Jul 02, 2020)
- Aldec Adds Customizable Tool Qualification Data Package to ALINT-PRO for DO-254 Projects (Jul 02, 2020)
- TSMC secures US govt subsidies and picks site for US$12b Arizona plant (Jul. 02, 2020)
- Green Hills Software Extends Multicore Interference Mitigation to Arm Cortex-A72 for DO-178C Level A Applications (Jul 02, 2020)
- MediaTek Introduces Helio G35 & G25 Gaming Series Chipsets (Jul 02, 2020)
- Sigasi Introduces Software Development Kit for Electronic Design Automation Tools (Jul 02, 2020)
- OPENEDGES Network-on-Chip Interconnect IP and DDR Controller Licensed for GCT Semiconductor LTE Category 19 Chip (Jul 01, 2020)
- Basemark and DMP Partner to Develop Smart Mirrors for commercial vehicles (Jul 01, 2020)
- Hardent and PLC2 Announce New IP Partnership to Support German Semiconductor Companies (Jul 01, 2020)
- HiSilicon & Nowi Introduce Energy Autonomous NB-IoT Platform: a Power-free Solution in the Smallest Size Possible (Jul 01, 2020)
- GloFo qualifies 12LP+ finfet process (Jul. 01, 2020)
- How your automotive display can meet ASIL-B, cold-crank specifications (Jul. 01, 2020)
- Optimized for AI Accelerator Applications, GLOBALFOUNDRIES 12LP+ FinFET Solution Ready for Production (Jun 30, 2020)
- FPGAs to Replace GPUs in AI Accelerators (Jun. 30, 2020)
- Dialog Semiconductor Announces Completion of its Acquisition of Adesto Technologies (Jun 29, 2020)
- Palma Ceia SemiDesign Announces Sampling for PCS11ax28, New 802.11ax Transceiver (Jun 29, 2020)
- Synopsys and Arm Extend Strategic Partnership to Deliver Superior Full-Flow Quality-of-Results and Time-to-Results (Jun 29, 2020)
- Dolphin unveils two break-through DSP and AI digital platforms dedicated to edge computing applications (Jun 29, 2020)
- Huawei makes new chip supply deals with SMIC and Shanghai Microelectronics (Jun. 29, 2020)
- US approved 99% of TSMC's patents (Jun. 29, 2020)
- Synopsys Broadens Collaboration with EPFL (Jun 26, 2020)
- Intilop Delivers a Ready to Deploy, Four Thousand TCP/UDP Session 2U-Hardware Accelerator Box with Linux Kernel Bypass Drivers for Extreme-Performance Networking (Jun 26, 2020)
- Rockchip selects Ensigma iEW200 low-power Wi-Fi (Jun 26, 2020)
- Solving a Problem like Reuse - an FD-SOI Analog IP Perspective from Thalia (Jun. 26, 2020)
- Elephant in Automated Vehicle Room (Jun. 26, 2020)
- SMIC to come out stronger after pandemic–Sy-Coson (Jun. 25, 2020)
- Lattice Reinvents the Low Power, General-Purpose FPGA with New Certus-NX (Jun 25, 2020)
- Taiwan Edges South Korea as Largest Base for IC Wafer Capacity (Jun 25, 2020)
- Apple Moving Macs from Intel to Arm (Jun 25, 2020)
- Percepio Closes Series A Funding Round with Fairpoint Capital (Jun 25, 2020)
- Synopsys Awarded DARPA Contract for Automatic Implementation of Secure Silicon Program (Jun 25, 2020)
- Bamboo Systems Launches Next Generation Server (Jun 25, 2020)
- Macnica adopts intoPIX TICO-XS for its 4K ProAV OEM solutions (Jun 25, 2020)
- VeriSilicon: FD-SOI & Design-Lite - A Beautiful Combination (CEO Interview) (Jun. 25, 2020)
- Analysts believe that SMIC will not develop a process below 7/5nm (Jun. 25, 2020)
- T2M announces Industry's first Ultra Low-Power Bluetooth Dual Mode RF IP on TSMC 22nm. (Jun 24, 2020)
- TSMC has reportedly begun production of the Snapdragon 875 SoC using the 5nm process (Jun. 24, 2020)
- UMC Recognized for Excellence by Texas Instruments (Jun. 24, 2020)
- TSMC invested 300 R&D teams to assist Apple in developing Mac chips (Jun. 24, 2020)
- AI-based cybersecurity: Hype or reality? (Jun. 24, 2020)
- Xilinx Selects Mipsology Zebra Software to Accelerate Alveo U50 FPGA (Jun 24, 2020)
- IAR Systems delivers advanced trace for RISC-V based applications (Jun 24, 2020)
- Rianta Releases 200G/400G Single Channel MAC IP Core (Jun 23, 2020)
- Siemens acquires UltraSoC to drive design for silicon lifecycle management (Jun 23, 2020)
- Arm Technology Powers the World's Fastest Supercomputer (Jun 23, 2020)
- Adesto Announces Completion of CFIUS Review for Proposed Acquisition of Adesto by Dialog Semiconductor (Jun 23, 2020)
- AIoT Chip Slashes Power Consumption for Person Detection (Jun. 23, 2020)
- intoPIX releases the FastTICO-XS SDK v1.2.4 for Nvidia GPU (Jun 22, 2020)
- QuickLogic Announces Pricing of $8.75 Million Public Offering of Common Stock (Jun 22, 2020)
- Synopsys Replenishes Repurchase Authorization to $500 Million (Jun 22, 2020)
- Silicon Catalyst Announces Four Newly Admitted Companies to Semiconductor Incubator (Jun 22, 2020)
- GLOBALFOUNDRIES to Acquire Land in Malta, NY, Positioning its Advanced Manufacturing Facility for Future Growth (Jun 22, 2020)
- North American Semiconductor Equipment Industry Posts May 2020 Billings (Jun 19, 2020)
- GLOBALFOUNDRIES and SkyWater Technology Sign MOU for Technology Development to Strengthen Domestic Supply Assurance for U.S. Government (Jun 19, 2020)
- Time to Think About the How and Where of Cryptography (Jun. 19, 2020)
- Where Innovation Is Happening in Geolocation: Signal Processing (Jun. 18, 2020)
- NXP Teams with TSMC on 5nm for Next-Gen Auto Platform (Jun. 18, 2020)
- Rambus Delivers 112G XSR/USR PHY on TSMC 7nm Process for Chiplets and Co-Packaged Optics in Networking and Data Center (Jun 18, 2020)
- Synopsys Collaboration with Samsung Foundry Enables Rollout of Samsung SAFE Cloud Design Platform (Jun 18, 2020)
- Distributed In-Chip Thermal Sensors Improve Multicore CPU Monitoring (Jun 18, 2020)
- Awaiting a Deal, TSMC Chairman Reiterates Support for Arizona Fab (Jun 18, 2020)
- Samsung Provides One-Stop Foundry Design Environment with the Launch of "SAFE Cloud Design Platform" (Jun 18, 2020)
- Intel's 10nm Node: Past, Present, and Future - Part 2 (Jun 18, 2020)
- Silex Insight Extends Their Crypto Coprocessor Offering by Introducing 2 New Variants (Compact & Premium) (Jun 18, 2020)
- U.S. Chip Revival Gains Traction (Jun 18, 2020)
- Automotive IC Market Forecast With Strongest CAGR Through 2024 (Jun 18, 2020)
- Intel's 10nm Node: Past, Present, and Future (Jun 18, 2020)
- Powering next-generation in-vehicle experiences with Arm Mali GPU virtualization (Jun 18, 2020)
- Picocom selects UltraSoC in-system analytics and monitoring IP for 5G New Radio small cell SoC (Jun 17, 2020)
- CREDO Announces Close of $100 Million Series D Preferred Financing as it Continues to Lead in High Performance Networking Connectivity Solutions (Jun 17, 2020)
- Autonomous Vehicles in Covid Economy (Jun. 17, 2020)
- Siemens extends Xcelerator portfolio to help transform electrical/electronic systems development (Jun. 17, 2020)
- Samsung Provides One-Stop Foundry Design Environment with the Launch of 'SAFE™ Cloud Design Platform' (Jun. 17, 2020)
- Agile Analog and EnSilica Collaborate to Improve Quality and Reliability of Microchips (Jun 16, 2020)
- Cadence Collaborates with TSMC and Microsoft to Reduce Semiconductor Design Timing Signoff Schedules with the Cloud (Jun 16, 2020)
- QuickLogic Announces Open Reconfigurable Computing Initiative (Jun 16, 2020)
- Xilinx Announces Real-Time Server Appliances for High-Quality, Low-Cost Live Video Streaming (Jun 16, 2020)
- IAR Systems enables secure code with updated MISRA C compliance in leading development tools (Jun 15, 2020)
- Embedded Hardware Security Heads to the Edge (Jun 15, 2020)
- BrainChip Successfully Launches the Akida Early Access Program (Jun 15, 2020)
- Dolphin Design unveils CHAMELEON, a revolutionary event-based MCU subsystem (Jun 15, 2020)
- Synopsys, TSMC and Microsoft Azure Deliver Highly Scalable Timing Signoff Flow in the Cloud (Jun 15, 2020)
- Intel's 10nm Node: Past, Present, and Future (Jun. 15, 2020)
- NXP Selects TSMC 5nm Process for Next Generation High Performance Automotive Platform (Jun 12, 2020)
- A guide to accelerating applications with just-right RISC-V custom instructions (Jun. 12, 2020)
- DSP Group Strengthens its Position in Rapidly Growing Headset Market with Acquisition of SoundChip SA (Jun 11, 2020)
- Truechip Announces Shipping of Performance Analyzer Tool Kit to Aaroh Labs (Jun 11, 2020)
- Arm falls out with Arm China (Jun 11, 2020)
- Silex Insight Announces Record-breaking 1.5Tb MACsec Solution To Boost Data Center and 5G Infrastructure (Jun 11, 2020)
- Total Foundry Revenue Increases by 20% YoY in 2Q20, While Market Uncertainties Remain in 2H20, Says TrendForce (Jun 11, 2020)
- Real Intent Announces Verix Multimode DFT Static Sign-Off Tool (Jun 11, 2020)
- Semiconductor Fabs to Log Record Spending of Nearly $68 Billion in 2021 After 2020 Lull, SEMI Reports (Jun 11, 2020)
- Qualcomm Retakes Market Leadership in 1Q20 Revenue Ranking of Global Top 10 IC Design Companies, Says TrendForce (Jun 11, 2020)
- SkyWater Licenses Key FDSOI Technology from MIT Lincoln Laboratory, Moves Up Availability of its 90 nm Strategic Rad-Hard by Process Offering (Jun 11, 2020)
- Efinix Completes Trion FPGA Family for Edge Computing, AI/ML and Vision Processing Applications Using Cadence Digital Full Flow Solution (Jun 11, 2020)
- Synopsys Delivers the Industry's Only Complete Workflow for Automotive Lighting Design and Visualization in CATIA (Jun 10, 2020)
- TSMC May 2020 Revenue Report (Jun 10, 2020)
- Synopsys Acquires Semiconductor Analytics Innovator Qualtera (Jun 11, 2020)
- Moortec Launches New In-Chip Technology for Highly Distributed, Real-Time Thermal Analysis on TSMC N5 Process (Jun 10, 2020)
- Arm China CEO: Good or Gone? (Jun 10, 2020)
- TSMC to Face Inventory Glut Caused by US-China Trade War (Jun. 10, 2020)
- RISC-V crypto core is qualified to ASIL-D for automotive designs (Jun. 10, 2020)
- Soitec reports full year'20 results (Jun. 10, 2020)
- Semiconductor fab spending to roar back in 2021 (Jun. 10, 2020)
- RISC-V crypto core is qualified to ASIL-D for automotive designs (Jun. 10, 2020)
- TSMC Discloses "Secret" 4nm Node (Jun 09, 2020)
- Arteris IP Advances onto List of Top 15 Semiconductor IP Vendors (Jun 09, 2020)
- SmartDV's Design and Verification Solutions Portfolio Surpasses 600 Offerings (Jun 09, 2020)
- IAR Systems and GigaDevice collaborate to bring powerful RISC-V solutions to the market (Jun 09, 2020)
- Smart and Secure Embedded Solutions for IoT Design (Jun. 09, 2020)
- Mentor joins the O-RAN ALLIANCE to help drive interoperability requirements for 5G network silicon (Jun 08, 2020)
- Andes Technology Steps Up to Premier Membership in RISC-V International; Greatly Expanding its U.S. R&D and Field Application Engineering Staffing (Jun 08, 2020)
- UMC Reports Sales for May 2020 (Jun 08, 2020)
- Sampling of 2Q Semiconductor Sales Guidance Now At -5% (Jun 08, 2020)
- GUC Monthly Sales Report - May 2020 (Jun 08, 2020)
- Configuring Processors In The Field (Jun. 08, 2020)
- The aspects of 6G that will matter to wireless design engineers (Jun. 08, 2020)
- Auto Sector Stuck in Neutral as a Few IC Makers Recover (Jun. 06, 2020)
- Huawei's proposal to replace TCP/IP is going nowhere fast (Jun. 05, 2020)
- Synopsys Accelerates FIPS 140-3 Certification with NIST-Validated True Random Number Generator IP (Jun 04, 2020)
- SmartDV Delivers New Design IP for Video, Imaging, Entertainment System Protocols (Jun 04, 2020)
- IAR Systems launches support for the RISC-V P extension for Packed-SIMD instructions (Jun 04, 2020)
- Nolam Embedded Systems discloses the MIL-STD1553 solution integrated on REFLEX CES Arria 10 SoC Module (Jun 04, 2020)
- SMIC plans to raise $2.8 billion as the US tries to hamper China's Semiconductor growth (Jun. 03, 2020)
- MediaTek Will Not Illegally Supply TSMC Chips To Huawei (Jun. 03, 2020)
- Securing the Internet of Things in a Quantum World (Jun. 03, 2020)
- Enyx launches an ultra-low latency development framework for building standardized, FPGA-based trading systems (Jun 03, 2020)
- MIPI Alliance Completes Development of A-PHY v1.0, an Industry-Standard Long-Reach SerDes Physical Layer Interface for Automotive Applications (Jun 03, 2020)
- Synopsys Introduces Industry's First Complete USB4 IP Solution (Jun 03, 2020)
- Efinix Announces Availability of Three RISC-V SoCs (Jun 03, 2020)
- Cadence Achieves Digital and Custom/Analog EDA Flow Certification for TSMC N6 and N5 Process Technologies (Jun 03, 2020)
- Green Hills Software Adds Industry-Leading Advanced Software Development Tools Support for RISC-V (Jun 03, 2020)
- GPU Market Provides a Ray (Tracing) of Hope (Jun. 03, 2020)
- The Increasingly Ordinary Task Of Verifying RISC-V (Jun. 03, 2020)
- Lattice Accelerates FPGA-Based Processor Design With New IP Ecosystem and Design Environment (Jun. 03, 2020)
- Former General Manager of GlobalFoundries China joins SMIC (Jun. 03, 2020)
- Imagination announces next-generation IEEE 802.11ax/Wi-Fi 6 IP for low-power applications (Jun 02, 2020)
- GigaDevice GD32 MCU and Amazon AWS Launch New Embedded Cloud Platform (Jun 02, 2020)
- Codasip Extends SweRV Support Package to Include Western Digital SweRV EH2 & EL2 RISC-V Cores (Jun 02, 2020)
- UltraSoC enables ultra-high-speed closed-chassis analytics and debug over Synopsys USB3 (Jun 02, 2020)
- First-Quarter 2020 Global Semiconductor Equipment Billings Up 13 Percent Year-Over-Year (Jun 02, 2020)
- NEUCHIPS Announces World's First Deep Learning Recommendation Model (DLRM) Accelerator: RecAccel (Jun 02, 2020)
- PUFsecurity IP Open Source Program: Bridging the Gap in Chip Security (Jun 02, 2020)
- Collaboration focuses on development tools for RISC-V-based MCUs (Jun. 02, 2020)
- Samsung Foundry Certifies Synopsys Design Compiler NXT for 5/4nm FinFET Process Technologies (Jun 01, 2020)
- Seamless Microsystems announces a major design-win (Jun 01, 2020)
- Cloud Computing Is Changing Everything About Electronic Design (Jun 01, 2020)
- Ambarella Adopts Cadence Clarity 3D Solver for AI Vision Processor Development (Jun 01, 2020)
- Synopsys Fusion Design Platform and DesignWare IP Selected by Baikal Electronics to Deliver Latest High-Performance Computing SoC (Jun 01, 2020)
- Global Semiconductor Sales Decrease 1.2 Percent Month-to-Month in April (Jun 01, 2020)
- Dolphin Design unveils SPIDER, a turnkey platform to accelerate the design of energy efficient power management systems (Jun 01, 2020)
- DARPA Marries IC Security with System-Level Synthesis (Jun. 01, 2020)
- Don't Let Baggage Hinder Innovation: RISC-V Lets Us Start with a Clean Slate (Jun. 01, 2020)
- Texas Instruments Maintains Firm Grip As World's Top Analog IC Supplier (May 29, 2020)
- Imagination's GPU selected by SemiDrive for automotive chip (May 29, 2020)
- eInfochips collaborates with EchoNous Inc. to develop the recently FDA-cleared KOSMOS platform (May. 29, 2020)
- TSMC to move 5nm Plus process to volume production in 4Q20 (May. 28, 2020)
- TSMC Delivers World-first 7nm Automotive Design Enablement Platform (May 28, 2020)
- Chip Equipment Becomes Trade War's Latest Battlefield (May 28, 2020)
- Khronos Group Releases OpenVG 1.1 Lite to Bring High-Quality Vector Graphics to OpenGL ES 2.0-Compatible GPUs (May 28, 2020)
- Synopsys' Silicon-Proven DesignWare DDR IP for High-Performance Cloud Computing Networking Chips Selected by NVIDIA (May 28, 2020)
- DARPA Looks to Automate Security for IC Design (May 28, 2020)
- How On-Premises Enhances your Chances of IoT Success (May. 28, 2020)
- Domain-Specific Processors Enable More Than Moore (May. 28, 2020)
- What's So Important About Processor Extensibility? (May. 28, 2020)
- Cadence to Optimize Digital Full Flow and Verification Suite for Arm Cortex-A78 and Cortex-X1 CPU Mobile Device Development (May 27, 2020)
- GOWIN Semiconductor Integrates their latest HDMI/DVI RX and TX IP into GOWIN EDA IP Generator (May 27, 2020)
- Synopsys Announces Support of TensorFlow Lite for Microcontrollers on Energy-Efficient ARC EM and ARC HS Processor IP (May 27, 2020)
- Menta joins PROMISE Consortium under the Horizon 2020 Initiative of the European Commission (May 27, 2020)
- UltraSoC and Canis Labs partner to secure the CAN bus (May 27, 2020)
- Domain Specific Accelerators Will Drive Vector Processing on RISC-V (May 27, 2020)
- Lattice and Etron Deliver Small, Low Power Reference Design for Edge AI and Video Processing Applications (May. 27, 2020)
- 5G? Wait 'Til Next Year (May. 27, 2020)
- SI semi forecast is -6% in 2020; +10-15% in 2021 (May. 27, 2020)
- CEVA to Host Online Seminar Series for Wireless Connectivity and Smart Sensing Technologies (May 26, 2020)
- GlobalFoundries Abandons Chengdu Wafer Fab (May 26, 2020)
- Synopsys Enables Tapeout Success for Early Adopters of Arm's Next Generation of Mobile IP (May 26, 2020)
- New Arm IP delivers true digital immersion for the 5G era (May 26, 2020)
- CEO Interview: Dolphin Design - FD-SOI IP Platform for Energy Efficient SoC Design for IoT, Automotive and More (May. 26, 2020)
- SMIC makes major move to complete its 7nm & 8nm processes (May. 26, 2020)
- Arm replaces CPU and GPU flagships, and more (May. 26, 2020)
- Can AI Turn Your Data Center Green? (May. 26, 2020)
- Verizon Teams Up with Movandi, NXP, Qualcomm for 5G (May. 26, 2020)
- The TSMC and Huawei Announcements Are Not as Linked as You May Think (May 25, 2020)
- Lattice sensAI 3.0 Solutions Stack Doubles Performance, Cuts Power Consumption in Half for Edge AI Applications (May 25, 2020)
- Senators Seek Suspension of TSMC US Fab Project (May 25, 2020)
- China to Fall Far Short of its "Made-in-China 2025" Goal for IC Devices (May 25, 2020)
- Do more with less energy! What's behind Dolphin Design's Energy Efficient Platforms? (May 25, 2020)
- North American Semiconductor Equipment Industry Posts April 2020 Billings (May 22, 2020)
- Panasonic Adopts Synopsys Custom Design Platform to Accelerate Next-Generation Automotive and Industrial Products (May 22, 2020)
- Gyrfalcon is Named as a Top 10 Processor for AI Acceleration at the Endpoint in 2020 by EE Times (May 22, 2020)
- China chipmaker SMIC receives $2bn state help amid Huawei ban (May. 22, 2020)
- Cobham Advanced Electronic Solutions Radiation Hardened Microelectronics Support New Xilinx XQRKU060 FPGA (May 21, 2020)
- S2C Announces New Prodigy Cloud System for Next Generation SoC Prototyping (May 21, 2020)
- Imec combines advanced machine learning algorithms and innovations in chip design to achieve cm accuracy and low-power ultra wideband localization (May 21, 2020)
- CEO interview: The importance of being agile (May 21, 2020)
- eMemory Provides Intellectual Property for Secure NB-IoT Products (May 21, 2020)
- SimpleMachines selects UltraSoC embedded analytics to support next-generation compute platform (May 21, 2020)
- Fuji Xerox Adopts Synopsys ZeBu Server for Multi-Function Printer SoC (May 21, 2020)
- Faraday Succeeds in Next-Gen Display ASIC with Display IP Solutions (May 21, 2020)
- Mirabilis Design creates the first RISC-V system-level architecture exploration solution (May. 20, 2020)
- Mirabilis Design creates the first RISC-V system-level architecture exploration solution (May 20, 2020)
- Politics Haunts TSMC's US Fab Plan (May 20, 2020)
- Imagination receives ISO 26262 statement of process conformance from HORIBA MIRA (May 20, 2020)
- GLOBALFOUNDRIES to Implement ITAR and Strict Security Assurances at its Advanced U.S. Semiconductor Manufacturing Facility (May. 20, 2020)
- TSMC US plant raises national security and competition questions, say senators (May. 20, 2020)
- SMIC Caught Between Huawei And A Hard Place (May. 20, 2020)
- Arrow Electronics, Panasonic Industry, and STMicroelectronics Join Forces to Deliver IoT Modules for Smart Applications (May. 20, 2020)
- Global IoT market to grow to $1.5trn annual revenue by 2030 (May. 20, 2020)
- Design For Narrowband IoT (May. 20, 2020)
- CEA-Leti Demos D-band RF Architecture for 6G Roadmap (May. 20, 2020)
- Synopsys Posts Financial Results for Second Quarter Fiscal Year 2020 (May. 20, 2020)
- Xilinx "Lifts Off" with Launch of Industry's First 20nm Space-Grade FPGA for Satellite and Space Applications (May 19, 2020)
- Microchip Reveals Software Development Kit and Neural Network IP for Easily Creating Low-Power FPGA Smart Embedded Vision Solutions (May 19, 2020)
- Arteris IP FlexNoC Interconnect and AI Package Licensed by Blue Ocean Smart System for AI Chips (May 19, 2020)
- CXL Protocol Adds Capabilities over PCIe (May 19, 2020)
- SiFive Partners With Coherent Logix for Mission-Critical Processor Solutions (May 19, 2020)
- Cadence Delivers 10 New Verification IP Targeting Automotive, Hyperscale Data Center and Mobile Applications (May 19, 2020)
- Microsoft announces definitive agreement to acquire Metaswitch Networks, expanding approach to empower operators and partner with network equipment providers to deliver on promise of 5G (May. 19, 2020)
- Huawei responds (May. 19, 2020)
- Mentor's Calibre and Analog FastSPICE platforms achieve certification for TSMC's newest processes (May 18, 2020)
- Synopsys and TSMC Collaborate to Enable Designs of HPC, Mobile, 5G, and AI SoCs with Certified Solutions on TSMC N5 and N6 Processes (May 18, 2020)
- Cadence Expands Design IP Portfolio with 56G Long-Reach PAM4 SerDes on TSMC N7 and N6 Processes (May 18, 2020)
- LeapMind Unveils "Efficiera", the New Ultra Low Power AI Inference Accelerator IP (May 18, 2020)
- UltraSoC appoints Jonathan Lucas as VP of Software (May 18, 2020)
- TSMC Ariz Fab a Tangled Web (May 18, 2020)
- Who Needs Autonomous Vehicles? (May. 18, 2020)
- Aspinity and Infineon partner to accelerate development of intelligent sensing products with longer lasting batteries (May 15, 2020)
- EVS Media Infrastructure adopts intoPIX JPEG-XS solution for Neuron (May 15, 2020)
- TSMC Announces Intention to Build and Operate an Advanced Semiconductor Fab in the United States (May 15, 2020)
- Louis Tannyeres, Former Senior Fellow at Texas Instruments, Appointed Executive Vice-President of Engineering at Kalray (May 14, 2020)
- CHIP Alliance's Newly Enhanced SweRV Cores Available to All for Free (May 14, 2020)
- Prophesee, DMP partner to accelerate development of embedded machine vision and artificial intelligence (AI) applications using Event-Based Vision approach (May 14, 2020)
- CAST Releases 100Gbps UDP/IP Core (May 14, 2020)
- Veriest supports the development of Arbe's innovative automotive Radar device (May 14, 2020)
- Eta Compute Partners with Edge Impulse to Accelerate the Development and Deployment of Machine Learning at the Edge (May 13, 2020)
- OpenFabrics Alliance (OFA) and Gen-Z Consortium Announce MoU Agreement (May 13, 2020)
- GigaDevice Announces a Patent Licensing Agreement with Rambus (May 13, 2020)
- Arm hardware and software ecosystems will converge at virtual Arm DevSummit, formerly known as Arm TechCon (May 13, 2020)
- Foxconn Partners with Socionext and Hailo to Launch Next-Generation AI Processing Solution for Video Analytics at the "Edge" (May 13, 2020)
- TSMC Says it Still Won't Build a Fab in the US (May. 13, 2020)
- Design Of An Ultra-Low-Power Current Steering DAC In A Modern SOI technology (May. 13, 2020)
- Associations collaborate on open standards in IoT security (May. 13, 2020)
- SMIC Reports 2020 First Quarter Results. (May 13, 2020)
- VeriSilicon VIP9000 and ZSP are Adopted by iCatch Next Generation AI-powered Automotive Image Processing SoC (May 12, 2020)
- Coherent Logix Selects Kandou's SerDes IP for its Low-Power, High-Performance C-Programmable Processors (May 12, 2020)
- Arteris IP FlexNoC Interconnect Licensed by Picocom for 5G New Radio Infrastructure Baseband SoCs (May 12, 2020)
- Perceptia Devices Offers Research License (May 12, 2020)
- SMIC Aims to Raise More Than $3B for Expansion (May 12, 2020)
- Configurable Analog Semiconductor IP Enables Faster IoT Chip Design (May 12, 2020)
- SmartDV Ships First Design and Verification IP for MIPI RFFE v3.0 Specification (May 12, 2020)
- Riedel adopts intoPIX TICO-XS FPGA IP-cores to empower broadcasts & events. (May 12, 2020)
- Exploring the 5 Ws of Full AV Stacks (May. 12, 2020)
- RISC-V International and GlobalPlatform Partner to Enhance Security Design of IoT Devices (May 11, 2020)
- Arasan Announces the Availability of MIPI D-PHY IP for TSMC 22nm Process Technology (May 11, 2020)
- CEVA, Inc. Announces First Quarter 2020 Financial Results (May 11, 2020)
- TSMC April 2020 Revenue Report (May 11, 2020)
- TSMC Expected to Rebound in 2021 on AMD Gains (May 11, 2020)
- UMC Reports Sales for April 2020 (May 11, 2020)
- Synopsys Accelerates High-Performance Computing SoC Designs with Industry's Broadest IP Portfolio for TSMC's 5nm Process Technology (May 11, 2020)
- Xylon's MPSoC Multi-Camera Vision Kit Updated (May 11, 2020)
- Dolphin Design Enables Next Generation Energy-Efficient Battery-Operated IoT Devices with New IP Platforms on TSMC 22ULL Process (May 11, 2020)
- TSMC Expects Strong Rebound in 2021 (May. 11, 2020)
- AI Drives Data Centers to the Edge (May. 11, 2020)
- RISC-V International and GlobalPlatform Partner to Enhance Security Design of IoT Devices (May. 11, 2020)
- Imagination Inquiry Exposes Wider Risk of IP Sales to China (May 07, 2020)
- Silex Insight launches Public Key Engine supporting Chinese OSCCA SM9 (May 07, 2020)
- Imagination Technologies and BAIC Capital announce automotive joint venture (May 07, 2020)
- Veridify Security's DOME Client Library Achieves PSA Certified Level 1 Accreditation (May 07, 2020)
- MIPI RFFE v3.0 Delivers Tighter Timing Precision and Reduced Latencies Needed for Successful 5G Rollouts (May 07, 2020)
- Omni Design Appoints Satris Group as Sales Representative in Israel (May 06, 2020)
- HiSilicon First China-Based Semi Supplier to be Ranked in Top-10 (May 06, 2020)
- SmartDV's LPDDR5 IP Clocks 612 MHz in FPGA Functional Test, 1.6GHz at 28nm (May 06, 2020)
- SynSense (formerly aiCTX) closes Series A Round and announces the opening of offices in China (May 06, 2020)
- SMIC Seeks to Raise More Capital, This Time on STAR Market (May. 06, 2020)
- Synopsys Announces Earnings Release Date for Second Quarter Fiscal Year 2020 (May. 06, 2020)
- Alphawave IP Announces Record FY2019, Record 1Q2020 and Dramatic Hiring Plans for Remainder of 2020 and beyond (May 05, 2020)
- Faraday's SoCreative!V Platform Accelerates SoC Development in Edge Applications (May 05, 2020)
- Imagination Previews Shifting Views Prior to UK Hearing (May 05, 2020)
- Xilinx Teams with Leading Universities Around the World to Establish Adaptive Compute Research Clusters (May 05, 2020)
- Global Semiconductor Sales Decrease 3.6 Percent in First Quarter of 2020 (May 05, 2020)
- Rambus Reports First Quarter 2020 Financial Results (May 05, 2020)
- GUC Monthly Sales Report - Apr 2020 (May 05, 2020)
- TSMC Reportedly Gets Major Orders for NVIDIA's Next-Generation 7 Nm Ampere and 5 Nm Hopper GPUs (May. 05, 2020)
- OmniVision Launches Automotive SoC for Entry-Level Rearview Cameras With Industry's Best Low-Light Performance, Lowest Power and Smallest Size (May. 05, 2020)
- New Wave Design and Verification Acquires FlightWire (May 04, 2020)
- Palma Ceia SemiDesign Tapes Out 802.11ax Transceiver for Wi-Fi 6 (May 04, 2020)
- Aldec's New HES FPGA Accelerator Board Targets HPC, HFT and Prototyping Applications plus Hits the "Price/Performance" Sweet Spot (May 04, 2020)
- Is IPO in China Imagination's Only Possible Exit Path? (May 04, 2020)
- Arbe Launches Automotive Grade Imaging Radar Processor Chip (May 04, 2020)
- NVE Introduces Noncontact ABZ TMR Magnetic Encoder Sensor (May 04, 2020)
- Dolphin Design unveils its innovative Energy Efficient Platforms, complete turnkey solutions for competitive SoC designs (May 04, 2020)
- PLDA Announce Complete Support for CXL and Gen-Z protocols (May 04, 2020)
- Global Silicon Wafer Area Shipments Edge Up in First Quarter 2020 Despite COVID-19 Headwinds (May 04, 2020)
- Covid-19 and America's Vulnerabilities - A Way Forward (May 04, 2020)
- Wave Computing Files for Chapter 11 Protection (May 04, 2020)
- Imagination Technologies: Evidence to the Foreign Affairs Committee (May 04, 2020)
- CMC Designates Letis L-UTSOI Standard Model as Chip Industry FD-SOI Standard (May. 04, 2020)
- VESA Releases Updated DisplayPort Alt Mode Spec to Bring DisplayPort 2.0 Performance to USB4 and New USB Type-C Devices (Apr 30, 2020)
- Rambus Announces Complete 800G MACsec Solution for Enhanced Data Center and 5G Infrastructure Security (Apr 30, 2020)
- Imagination supports Google Android GPU Inspector (Apr 30, 2020)
- SmartDV Expands Line of Memory Controller Design IP, strengthening its Already Broad Portfolio of IP Products (Apr 30, 2020)
- Picocom License CEVA DSP for 5G New Radio Infrastructure SoC (Apr 30, 2020)
- SiFive Joins Open COVID Pledge to Fight Global Pandemic (Apr 30, 2020)
- Imagination showcases groundbreaking new safety-critical driver (Apr 29, 2020)
- Total Foundry Revenue to Undergo Single-Digit Growth in 2020, Owing to Deferred Seasonality from COVID-19 (Apr 29, 2020)
- Memory Market Not Forecast to Exceed 2018 High of $163.3B until 2022 (Apr 29, 2020)
- NXP Announces General Availability of the Arm Cortex-M33-based LPC551x/S1x MCU Family (Apr 29, 2020)
- Multi-Constellation GNSS IP licensed to a US Semi-Conductor company for integration into a ultra-low power cellular IOT chip by T2M (Apr 29, 2020)
- Silicon Catalyst Collaborates with Arm to Accelerate Semiconductor Startups (Apr 29, 2020)
- Arm offers silicon startups zero-cost access to the world's most widely used chip designs (Apr 29, 2020)
- PathPartner Joins the Bureau of Indian Standards Artificial Intelligence Sectional Committee (Apr. 29, 2020)
- Why Software Matters in the Age of AI? (Apr. 29, 2020)
- Rianta Releases 400G MACsec IP Core for Ethernet Security Acceleration ASICs and SoCs (Apr 28, 2020)
- OmniVision Unveils World's First 0.7 Micron, 64 Megapixel Image Sensor for Ultra Thin, High End Smartphones (Apr 28, 2020)
- Imec Builds World's First Spiking Neural Network-Based Chip for Radar Signal Processing (Apr 28, 2020)
- Synopsys Introduces 3DIC Compiler, Industry's First Unified Platform to Accelerate Multi-die System Design and Integration (Apr 28, 2020)
- MediaTek to Enable Cutting-edge AV1 Video Codec Technology on Android Smartphones (Apr 28, 2020)
- Khronos Group Releases OpenCL 3.0 (Apr 28, 2020)
- Mixel's MIPI D-PHY IP Integrated into the Lattice CrossLink-NX FPGA (Apr 28, 2020)
- Wave Computing Set to File Chapter 11, With MIPS the Likely Winner (Apr 27, 2020)
- CFX announces commercial availability of anti-fuse OTP technology on CanSemi 0.18um Logic process (Apr 27, 2020)
- North American Semiconductor Equipment Industry Posts March 2020 Billings (Apr 27, 2020)
- GLOBALFOUNDRIES Dresden Certified to Manufacture Secure Products (Apr 27, 2020)
- CFX announces commercial availability of anti-fuse OTP technology on CanSemi 0.18um Logic process (Apr. 27, 2020)
- Renesas Releases Major Update of Flexible Software Package Supporting RA Family of 32-Bit Arm Cortex-M Microcontrollers (Apr 23, 2020)
- Chips&Media Now Reveals c.WAVE120 - New Generation of Super-Resolution HW IP (Apr 23, 2020)
- Codasip Releases Support Package for Western Digital's First RISC-V SweRV Core (Apr 23, 2020)
- Faraday Reports First Quarter 2020 Revenues at NT$1,265 Million (Apr 23, 2020)
- Why Apple needs to ditch Intel for ARM or RISC (Apr. 23, 2020)
- Korean Ministry of SMEs and Startups selects Arm Flexible Access to support local startup companies (Apr 22, 2020)
- IC Unit Shipments Forecast to Display First-Ever Back-to-Back Decline (Apr 22, 2020)
- Debunking the Myth of China's AI Superiority (Apr. 22, 2020)
- Imagination Commits to Keeping U.K. HQ - For Now (Apr 21, 2020)
- Silex Insight takes another key step to strengthen its presence in Israel by partnering with Beyond Electronics (Apr 21, 2020)
- Faraday Releases Licensable Gigabit Ethernet PHY on UMC 40LP Platform (Apr 21, 2020)
- New York Institute of Technology - Vancouver Develops Secure Boot Application for Gowin SecureFPGA (Apr 21, 2020)
- Imperas Leading RISC-V CPU Reference Model for Hardware Design Verification Selected by Mellanox (Apr 21, 2020)
- Cadence Reports First Quarter 2020 Financial Results (Apr 21, 2020)
- SiPearl signs a major licensing agreement with Arm for the development of its first-generation of microprocessors (Apr 21, 2020)
- CEVA Wins 2019 CEM Editor's Choice Award for its Bluetooth 5 IP (Apr 21, 2020)
- Unlocking AI on Arm Microcontrollers with Deep Learning Model Optimization (Apr. 21, 2020)
- Global Semiconductor Sales in February Down 2.4 Percent Month-to-Month: SIA (Apr. 21, 2020)
- 5G and HPC Drive 45% Q1 Revenue Growth at TSMC (Apr 20, 2020)
- Silvaco Leverages Deep SOI Roots (Apr. 17, 2020)
- Arm receives first high assurance Common Criteria security certification for soft processor IP (Apr. 17, 2020)
- TSMC Reports First Quarter EPS of NT$4.51 (Apr 16, 2020)
- Samsung and Xilinx Team Up for Worldwide 5G Commercial Deployments (Apr 16, 2020)
- Virtual Conference Delivers Real Chips (Apr. 16, 2020)
- GLOBALFOUNDRIES Qualifies Synopsys' IC Validator for Signoff Verification on 22FDX Platform (Apr 16, 2020)
- Arm enables global IoT proliferation through Pelion IoT platform ecosystem expansion (Apr 15, 2020)
- UltraSoC and Agile Analog collaborate to detect physical cyber attacks (Apr 15, 2020)
- Gartner Says Worldwide Semiconductor Revenue Declined 12% in 2019 (Apr 15, 2020)
- Kandou Named One of Europe's Most-Promising Growth Companies (Apr 15, 2020)
- Huawei Moves 14 nm Silicon Orders from TSMC to SMIC (Apr. 15, 2020)
- Hardware and Software Puzzle Pieces Fall Into Place for Binarized AI (Apr. 15, 2020)
- Neuromorphic Computing vs AI Chips: Compete or Complement? (Apr. 15, 2020)
- Xylon Expands Its Offer of FMC Expansion Boards Featuring High-Speed Serial Links for FPGA Based Multi-Camera Automotive Application Development (Apr 14, 2020)
- Gradual Rebound or Slight Dip - Two Scenarios for COVID-19 Impact to 2020 Global Silicon Wafer Market Sales (Apr 14, 2020)
- CEVA Wins 2019 CEM Editor's Choice Award for its Bluetooth 5 IP April 14, 2020 RivieraWaves Bluetooth 5 IP recognized as "the most competitive IoT solution in China" MOUNTAIN VIEW, Calif., April 14, 2020 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the le (Apr 14, 2020)
- Softbank Vision Fund loses $16.7bn of its value (Apr 14, 2020)
- Does China Have Imagination? (Apr 14, 2020)
- Imagination Drops CEO, What Next? (Apr 14, 2020)
- 2019 Global Semiconductor Equipment Sales Slip 7 Percent to $59.8 Billion, SEMI Reports (Apr 14, 2020)
- BrainChip and Socionext expect Akida silicon in Q3 (Apr. 14, 2020)
- Port GmbH extends its CANopen driver portfolio and supports the "STMicroelectronics STM32G4xx family" (Apr. 14, 2020)
- Samsung Display closes part of Vietnamese plant to curb coronavirus spread (Apr. 14, 2020)
- Samsung Demonstrates the Full Potential of 5G mmWave with Speeds of 8.5Gbps Across Multiple Devices (Apr. 14, 2020)
- Groq Adopts Synopsys ZeBu Server 4 to Develop Breakthrough AI Chip (Apr 13, 2020)
- Taiwan IC design houses cautious about 3Q20 (Apr. 10, 2020)
- TSMC March 2020 Revenue Report (Apr 10, 2020)
- UMC Reports Sales for March 2020 (Apr 10, 2020)
- Global IC Market Forecast Lowered From 3% to -4% (Apr 10, 2020)
- Flex Logix Discloses Real-World Edge AI Inference Benchmarks Showing Superior Price/Performance For All Models (Apr 10, 2020)
- Imagination Technologies commits to the UK as it looks to accelerate growth in new areas of technological innovation (Apr 10, 2020)
- Covid 19 impact on the Semi-Conductor world : D&R Review (Apr. 09, 2020)
- Gartner Forecasts Worldwide Semiconductor Revenue to Decline 0.9% in 2020 Due to Coronavirus Impact (Apr 09, 2020)
- COVID-19: Economic and Microelectronics Industry Impacts - Insights from McKinsey & Company (Apr 09, 2020)
- Two Months in Hubei, Quarantined Away from Home (Apr 09, 2020)
- Xilinx Appoints Brice Hill as Chief Financial Officer (Apr 09, 2020)
- Vuzix Joins Qualcomm Smart Cities Accelerator Program (Apr. 09, 2020)
- Flex Logix Announces nnMAX IP Delivers Higher-Throughput/$ and Higher Throughput/Watt for Key DSP Functions (Apr 08, 2020)
- BrainChip Announces Wafer Fabrication of the Akida System-on-Chip (Apr 08, 2020)
- Welcome to the Third Era of 32/64-bit Embedded CPUs (Apr 08, 2020)
- x86 Lacks Innovation, Arm is Catching up. Enough to Replace the Giant? (Apr. 08, 2020)
- Startup Finds Ways to Bring AI to the Edge (Apr. 08, 2020)
- Securing IoT in the Quantum Age (Apr. 08, 2020)
- SK Hynix Releases PE8000 NVMe PCIe Gen4 SSD - PCIe 4.0 up to 6,500 MB/sec (Apr. 08, 2020)
- China tops 2019 patent filings (Apr. 08, 2020)
- Seeing AI to AI: NVIDIA Deepens Ties with Top Research Center (Apr. 08, 2020)
- Mirabilis Design is making the standard training class on Model-based System Simulation and Electronic System-Level Design for free (Apr 07, 2020)
- Synopsys Introduces New 64-bit ARC Processor IP Delivering Up to 3x Performance Increase for High-End Embedded Applications (Apr 07, 2020)
- CEVA Announces Industry's First High Performance Sensor Hub DSP Architecture (Apr 07, 2020)
- MaxLinear to acquire Intel's Home Gateway Platform Division (Apr 07, 2020)
- Imagination Tech's Fate Hangs as Chinese Investors Assert Rights (Apr 07, 2020)
- Taiwan Semiconductor: Visibility May Be Limited In The Near-Term, But Long-Term Growth Outlook Is Favorable (Apr. 07, 2020)
- Tenstorrent Takes AI by Storm (Apr. 07, 2020)
- Infineon receives final green light for its acquisition of Cypress (Apr. 07, 2020)
- Global Semiconductor Sales in February Down 2.4 Percent Month-to-Month (Apr 06, 2020)
- HEVC Advance Passes 10,000 Patent Milestone - announces Toshiba Corp. Joins as a Licensor (Apr 06, 2020)
- 25 Gigabit Ethernet Consortium Rebrands to Ethernet Technology Consortium; Announces 800 Gigabit Ethernet (GbE) Specification (Apr 06, 2020)
- GUC Monthly Sales Report - March 2020 (Apr 06, 2020)
- Perceive Corporation Launches to Deliver Data Center-Class Accuracy and Performance at Ultra-Low Power for Consumer Devices (Apr 06, 2020)
- Faraday Adopts Synopsys' Platform Architect and Hybrid Prototyping Solutions to Expand Design Services (Apr 06, 2020)
- eInfochips to Exhibit and Present at Design & Reuse IP-SoC Silicon Valley 2020 (Apr 03, 2020)
- Strategic Investment of NXP in Kalray (Apr 03, 2020)
- CXL Consortium and Gen-Z Consortium Announce MOU Agreement (Apr 03, 2020)
- Silex Insight launches Chinese OSCCA high performance (400 Gbps) SM4 Crypto Core (Apr 02, 2020)
- Sensors: Heart of the Robotic Mobility Disruption (Apr. 02, 2020)
- Compact Model Developed at CEA-Leti for FD-SOI Technologies Designated as a Chip-Industry Standard (Apr 02, 2020)
- Synopsys Expands Collaboration with Broadcom for 7nm and 5nm Designs (Apr 02, 2020)
- BrainChip Introduces Company's Event-Based Neural-Network IP and NSoC Device at Linley Processor Virtual Conference (Apr 02, 2020)
- Allegro DVT AV1 Encoder and Decoder Hardware IPs Embedded in Products by End of 2020 (Apr 02, 2020)
- Leading Industry Veteran Joins SiFive as Chief Financial Officer (Apr 02, 2020)
- GF eMRAM on 22FDX for IoT, Automotive Now in Production (Apr. 02, 2020)
- MagnaChip Semiconductor Announces Definitive Agreement To Sell Foundry Business and Fab 4 (Apr 01, 2020)
- Hardent Joins Forces with Maojet & Fujisoft To Expand Presence in Asia (Apr 01, 2020)
- SEGGER announces comprehensive support for SiFive Insight debug/trace platform (Apr 01, 2020)
- Intel shines amidst the carnage of the 2019 semiconductor market (Apr 01, 2020)
- XMOS and Plumerai partner to accelerate commercialisation of binarized neural networks (Apr. 01, 2020)
- COVID-19 to significantly impact semiconductor market in 2020 (Apr. 01, 2020)
- Imagination announces new mobile graphics teaching course for 2020 (Mar 31, 2020)
- Andes Technology Announces over 5 Billion Cumulative Shipments of SoCs Embedded with Its CPU IP since Company Inception (Mar 31, 2020)
- Synopsys Expands DesignWare MIPI IP Portfolio with Silicon-Proven, Integrated C-PHY/D-PHY IP Solution in FinFET Processes (Mar 31, 2020)
- Veriest International On-line Verification Meetup (Mar. 31, 2020)
- Global Semiconductor Materials Market Revenues Slip 1.1 Percent in 2019, SEMI Reports (Mar 31, 2020)
- SMIC Announces 2019 Annual Results (Mar. 31, 2020)
- TSMC postpones 3nm process plans by 4 months, at least (Mar. 31, 2020)
- New Case Study from Cobham Advanced Electronic Solutions Touts Everspin's Toggle MRAM as a Highly Reliable Memory Technology for Space Applications (Mar. 31, 2020)
- Silvaco Delivers New Generation of MIPI I3C Sensor Connectivity IP (Mar 30, 2020)
- TrendForce Presents Latest Analysis (Updated March 2020) of COVID-19 Pandemic's Impact on Global High-Tech Industries (Mar 30, 2020)
- Dolphin Design attacks the Taiwanese and Japanese markets with an exclusive sales representative (Mar 30, 2020)
- 5G Rollout Will Slow as Standards Work is Suspended (Mar 30, 2020)
- Arm Researcher wins IEEE ComSoc Award in Parliament | STEM for Britain 2020 (Mar. 30, 2020)
- Vervesemi Data converters for 5G applications Now Available on 8nm Process (Mar 27, 2020)
- 100 IC Wafer Fabs Closed or Repurposed Since 2009 (Mar 27, 2020)
- TSN Switch IP for GbE (10GbE) (Mar 27, 2020)
- Rambus Licenses DPA Countermeasures to Utimaco (Mar 26, 2020)
- New Microchip MCU Enables Secure Boot Protection from SPI Flash (Mar. 26, 2020)
- Achronix Selects Synopsys' Leading DesignWare IP Solutions to Accelerate Development of High-Performance Data Acceleration FPGA (Mar 26, 2020)
- Software-Based Encryption at Hardware Level for IoT Security delivered by IKV, based on Intrinsic ID's BroadKey (Mar 26, 2020)
- Vidatronic and Everest Sales and Solutions Join Forces to Expand Sales Coverage Through Mexico and Central America (Mar 26, 2020)
- Stop, Cut or Maintain European Chip Production Amid Covid-19 (Mar 25, 2020)
- Synopsys above ARM in IP licensing revenue in 2019 (Mar 25, 2020)
- SiFive Selects Synopsys Fusion Design Platform and Verification Continuum Platform to Enable Rapid SoC Design (Mar 25, 2020)
- ESD Alliance Reports EDA Industry Revenue Increase for Q4 2019 (Mar 25, 2020)
- TSMC may revise 2020 outlook (Mar. 25, 2020)
- Next-Generation of AI Processors Featured at Linley Spring Processor Conference (Mar. 25, 2020)
- Artificial Intelligence, 5G: How Beijing is preparing for its post-coronavirus economic recovery (Mar. 25, 2020)
- How 5G+AI+AR Will Create Next-Gen Protection Against Pandemics (Mar. 25, 2020)
- Apple reportedly accelerating production relocation (Mar. 25, 2020)
- Efficient computing for AI and autonomous cars (Mar. 25, 2020)
- Arteris IP FlexNoC Interconnect Again Licensed by NETINT Technologies for Codensity Enterprise SSD Controllers (Mar 24, 2020)
- InterMotion Technology boosts IP verification productivity for Lattice Semiconductor's CrossLink FPGA family using Aldec's Active-HDL (Mar 24, 2020)
- CEVA Announces DSP and Voice Neural Networks Integration with TensorFlow Lite for Microcontrollers (Mar 24, 2020)
- Enea and Ampere Partner on Arm-based uCPE Solution for Telco Edge (Mar 24, 2020)
- Neural net accelerates IC design placement (Mar. 24, 2020)
- Synopsys Delivers Industry's First Ethernet 800G Verification IP for Next-Generation Networking and Communications Systems (Mar 23, 2020)
- BrainChip and Socionext Provide a New Low-Power Artificial Intelligence Platform for AI Edge Applications (Mar 23, 2020)
- India Doesn't Need Its Own Fab (Mar 23, 2020)
- Global Top 10 IC Designers' 2019 Revenues Drop by 4.1% YoY, as Industry Growth to Face Challenges from COVID-19 Pandemic in 2020, Says TrendForce (Mar 23, 2020)
- Foundry Revenue Estimated to Grow by 30% YoY in 1Q20, while COVID-19 Pandemic May Hinder Future Market Demand, Says TrendForce (Mar 23, 2020)
- Faraday's 28Gbps SerDes IP Now Available on UMC's 28HPC Process (Mar 23, 2020)
- Intel Scales Neuromorphic Computer to 100 Million Neurons (Mar 23, 2020)
- 'Electronic Nose' Inspired by Neuromorphic Technology (Mar. 23, 2020)
- COVID-19 To Have Significant Effect on Worldwide Semiconductor Market in 2020, According to IDC (Mar 19, 2020)
- Inomize Selects Synopsys' Silicon-Proven 56G Ethernet PHY IP for High-Performance Computing and Communications SoC Design (Mar 19, 2020)
- Data Demands Drive Co-Packaged Silicon and Optics for Switch Fabrics (Mar 19, 2020)
- RISC-V is Here to Stay (Mar. 19, 2020)
- Codasip Awarded European Union Horizon 2020 Funding for Developing New RISC-V Processors (Mar 18, 2020)
- Blu Wireless announces the availability of its 60GHz mmWave evaluation kit (Mar 18, 2020)
- TOSHIBA announced a Microcontroller employing Floadia's SONOS type Flash Memory IP "G1" (Mar 18, 2020)
- New Highly Optimised LDPC Decoder in Software for Intel's FlexRAN Reference Software Will Increase Throughput by up to 3X (Mar 18, 2020)
- Blu Wireless announces the availability of its 60GHz mmWave evaluation kit (Mar 18, 2020)
- Trace and debug claim for RISC-V IP challenged by UltraSoC (Mar. 18, 2020)
- Open source of trouble: China's efforts to decouple from foreign IT technologies (Mar. 18, 2020)
- Intel Scales Neuromorphic Research System to 100 Million Neurons (Mar. 18, 2020)
- Covid-19: The Power of Big Data and AI (Mar. 18, 2020)
- Cadence Elects Ita Brennan and Lewis Chew to Board of Directors (Mar 17, 2020)
- Socionext Prototypes Low-Power AI Chip with Quantized Deep Neural Network Engine (Mar 17, 2020)
- SMIC Graduating from 14nm to Something Sort of Akin to 7nm (Mar 17, 2020)
- Bragi and CEVA Collaborate to Redefine Hearable Devices (Mar 17, 2020)
- SiFive Launches Advanced Trace and Debug Portfolio, SiFive Insight (Mar 17, 2020)
- Cadence Digital Full Flow Optimized to Deliver Improved Quality of Results with Up to 3X Faster Throughput (Mar 17, 2020)
- Faraday Delivers System-Level ESD Protection Service to Reduce ASIC Time-to-Market (Mar 17, 2020)
- Apple partner TSMC considers building powerful new chipsets in the U.S. (Mar. 17, 2020)
- Chip making goes on at GlobalFoundries amid coronavirus (Mar. 17, 2020)
- CEA-Leti Leading: Interview with CEO Emmanuel Sabonnadiere (Mar. 17, 2020)
- Smart and Secure Embedded Solutions for IoT Design (Mar. 17, 2020)
- eMemory Launches Reprogrammable NVM Solution on TSMC Platform (Mar 16, 2020)
- Synopsys Unveils RTL Architect To Accelerate Design Closure (Mar 16, 2020)
- DAeRT: eInfochips' DFT Framework that Increases Productivity and Reduces Silicon Development Cycle (Mar 16, 2020)
- Covid-19 and The Success Story of Taiwan (Mar 16, 2020)
- Silicon Labs to Expand Leading IoT Wireless Platform with Acquisition of Redpine Signals' Connectivity Business (Mar 13, 2020)
- Wireless SoCs Get Hardware Security (Mar. 12, 2020)
- QuickLogic's eFPGA Qualified on GLOBALFOUNDRIES 22FDX Platform for IoT and Edge AI Applications (Mar 12, 2020)
- Cadence Tensilica HiFi IP Accelerates AI Deployment with Support for TensorFlow Lite for Microcontrollers (Mar 12, 2020)
- Everspin Technologies and GLOBALFOUNDRIES Extend MRAM Joint Development Agreement to 12nm (Mar 12, 2020)
- OPENEDGES announces a strategic partnership with The Six Semiconductor Inc to provide a complete GDDR6 memory interface solution (Mar 11, 2020)
- "Black Swan" Event Triggers Revision to 2020 IC Market Forecast (Mar 11, 2020)
- Xilinx Announces World's Highest Bandwidth, Highest Compute Density Adaptable Platform for Network and Cloud Acceleration (Mar 11, 2020)
- TSMC expected to start mass production of 5nm chips in April (Mar. 11, 2020)
- Andes to Presents Andes Custom Extensions to the RISC-V V5 CPU Core for Creating Highly Competitive True Wireless Stereo SoC Designs (Mar. 11, 2020)
- RISC-V Foundation Announces Ratification of the Processor Trace Specification (Mar. 11, 2020)
- Synopsys Advances State-of-the-Art in Electronic Design with Revolutionary Artificial Intelligence Technology (Mar 11, 2020)
- Ambiq Micro's Next-Generation Subthreshold Power-Optimized Technology (SPOT) Platform Features CEVA's Bluetooth Low Energy IP (Mar 10, 2020)
- TSMC February 2020 Revenue Report (Mar 10, 2020)
- Synopsys Custom Design Platform Secures Full-flow Displacement of Legacy Design Tools at Alphawave (Mar 10, 2020)
- AI Sound Recognition on a Cortex-M0: Data is King (Mar. 10, 2020)
- Infineon gets go ahead for Cypress acquisition (Mar. 10, 2020)
- Dover Microsystems and Cadence Partner to Deliver Secure Processing with Silicon-Layer Security for Mission-Critical Applications (Mar 09, 2020)
- Global Fab Equipment Spending Poised for 2021 Record High (Mar 09, 2020)
- Cadence Collaborates with STMicroelectronics on Networking, Cloud and Data Center Electronics (Mar 09, 2020)
- U.S. Considers Blocking Infineon's Purchase of Cypress (Mar 09, 2020)
- Transistor Count Trends Continue to Track with Moore's Law (Mar 09, 2020)
- UMC Reports Sales for February 2020 (Mar 09, 2020)
- AI Chipmaker Hailo Raises $60 Million in Series B Funding (Mar 09, 2020)
- RISC-V Foundation Announces Ratification of the Processor Trace Specification (Mar 09, 2020)
- Samsung Adopts Synopsys' Machine Learning-Driven IC Compiler II for its Next-Generation 5nm Mobile SoC Design (Mar 05, 2020)
- UMC certifies Mentor product lines for its new 22nm ultra-low-power process technology (Mar 05, 2020)
- Faraday Announces Low-DPPM Solution for a Wide Range of ASIC Applications (Mar 05, 2020)
- GUC Monthly Sales Report - Feb 2020 (Mar 05, 2020)
- Tessolve strengthens its VLSI Design services with the acquisition of T&VS (Mar 05, 2020)
- MediaTek and Samsung Introduce World's First Wi-Fi 6 8K TV (Mar 05, 2020)
- HBM Flourishes, But HMC Lives (Mar 05, 2020)
- Veriest contributes to the verification of Nuvoton's Computing MCU devices (Mar 04, 2020)
- Defacto Announces STAR 8.0 and Provides a Unified "All-in-One" SoC Design Solution to Help Conciliating Between RTL, IP-XACT, UPF, SDC, and Physical Design Information (Mar 04, 2020)
- Mellanox to Acquire World Leading Network Intelligence Technology Developer Titan IC to Strengthen Leadership in Security and Data Analytics (Mar 04, 2020)
- CEVA Unveils World's Most Powerful DSP Architecture (Mar 04, 2020)
- Intel is accelerating its shift to 7nm/5nm to compete with TSMC and AMD (Mar. 04, 2020)
- Soitec's engineered substrates for 5G (Mar. 04, 2020)
- How Secure Is Your LoRaWAN IoT Device? (Mar. 04, 2020)
- GlobalFoundries promises embedded MRAM on state-of-the-art FD-SOI node (Mar. 04, 2020)
- Ampere Altra - Industry's First 80-Core Server Processor Unveiled (Mar 03, 2020)
- Xilinx Launches Industry's First SmartNIC Platform Bringing Turnkey Network, Storage and Compute Acceleration to Cloud Data Centers (Mar 03, 2020)
- TSMC and Broadcom Enhance the CoWoS Platform with World's First 2X Reticle Size Interposer (Mar 03, 2020)
- Changing the game for cloud computing with Neoverse (Mar. 03, 2020)
- Blu Wireless appoints Alan Jones as new Chief Executive Officer (Mar 02, 2020)
- Fraunhofer IIS brings comprehensive MPEG audio codec suite to NXP Semiconductors (Mar 02, 2020)
- VeriSilicon Hantro Video and ZSP IP are Adopted by ASPEED Cupola360 Image Processor SoC (Mar 02, 2020)
- Marvell Announces OCTEON TX2 Family of Multi-Core Infrastructure Processors (Mar 02, 2020)
- Espressif's 240MHz ESP32-S2 SoCs, Modules, and Boards Enter Mass Production with RISC-V Coprocessor (Mar. 02, 2020)
- VeriSilicon and MicroEJ Join Forces to Accelerate Hardware IP Innovation, Thanks to Software Virtualization Leveraging 10 Million Software Engineers Worldwide (Feb 27, 2020)
- ESD Alliance Welcomes Avery Design Systems to Member Community (Feb 27, 2020)
- Zhuhai Chuangfeixin eNOR embedded Flash Memory IP Solution and 128M bits SPI NOR Flash Qualified in 55nm Floating-Gate Flash Process (Feb 27, 2020)
- Semiconductor Units To Rebound, Exceed 1 Trillion Devices Again in 2020 (Feb 27, 2020)
- Graphcore secures additional $150 million in new capital Reports Fiscal 2019 business highlights (Feb 27, 2020)
- PRO DESIGN Launches New proFPGA XCVU37P FPGA Module for Prototyping and Verification of High Bandwidth Memory Designs (Feb 27, 2020)
- Synopsys Announces Next-Generation VC SpyGlass RTL Static Signoff Platform (Feb 27, 2020)
- GLOBALFOUNDRIES Delivers Industry's First Production-ready eMRAM on 22FDX Platform for IoT and Automotive Applications (Feb 27, 2020)
- Samsung Begins Mass Production of Industry's First 16GB LPDDR5 DRAM for Next-Generation Premium Smartphones (Feb 27, 2020)
- Winbond Electronics and Secure-IC in Partnership for Embedded Cybersecurity (Feb 26, 2020)
- Menta and Secure-IC partner to optimize embedded cybersecurity (Feb 26, 2020)
- UltraSoC wins Security Award for Bus Sentinel hardware cybersecurity IP (Feb 26, 2020)
- Cadence Announces Industry's First Verification IP for PHY Covering Multiple Protocols (Feb 26, 2020)
- SensiML Delivers AI-Based Sensor Algorithms for IoT Endpoints Using NXP's i.MX RT Crossover MCUs (Feb. 26, 2020)
- All Processing Bends Toward AI (Feb. 26, 2020)
- Artificial Intelligence Innovation in Taiwan (Feb. 26, 2020)
- OpenHW Group Celebrates Rapid Growth to 40+ Members and New Open-Source Processor Implementations Less Than a Year After Launch (Feb 25, 2020)
- SambNova Systems Announces $250 Million Series C as it Continues to Set a New Course for the Future of Enterprise Computing (Feb 25, 2020)
- Titan IC and Decooda Announce Strategic Partnership to Accelerate Cloud-based Data Analytics for Intelligent Customer Experience Solution (Feb 25, 2020)
- Synopsys Delivers Silicon-Proven HBM2E PHY IP Operating at 3.2 Gbps (Feb 25, 2020)
- BrainChip Featured in ActualTech Media's Emerging AI/ML and Data Science EcoCast (Feb. 25, 2020)
- RISC-V gaining ground (Feb. 25, 2020)
- RISC-V reference models support processor verification (Feb. 25, 2020)
- Optimizing Automotive Augmented Reality Applications (Feb. 25, 2020)
- Safety in cars: Infineon's AURIX™ is the first embedded safety controller worldwide to be ASIL-D certified according to ISO 26262:2018 (Feb. 25, 2020)
- Record shipments of Arm-based chips in previous quarter (Feb. 25, 2020)
- UltraSoC launches CAN Sentinel to boost automotive cybersecurity (Feb 24, 2020)
- Arasan Announces immediate availability of its SUREBOOT xSPI Host IP (Feb 24, 2020)
- Intel Announces Unmatched Portfolio for 5G Network Infrastructure (Feb 24, 2020)
- Titan IC Unveils Enhancements to RXP Hardware Search Acceleration Engine at RSA Conference (Feb 24, 2020)
- Hex Five Announces MultiZone Security for Arm Cortex?M Series Processors (Feb 24, 2020)
- Goodix License and Deploy CEVA Bluetooth Low Energy IP in SoCs Targeting Wearables, Mobile Devices, the Internet of Things (Feb 24, 2020)
- Xilinx Recommends Rejection of TRC Capital's "Mini-Tender" Offer (Feb 24, 2020)
- North American Semiconductor Equipment Industry Posts January 2020 Billings (Feb 24, 2020)
- NXP Announces Lead Partnership for Arm Ethos-U55 Neural Processing Unit for Machine Learning (Feb 24, 2020)
- Imperas Collaborates with Mentor on RISC-V Core RTL Coverage Driven Design Verification Analysis (Feb 24, 2020)
- Mobiveil Announces Availability of Compute Express Link (CXL) IP (COMPEX) for High-Performance Applications (Feb 24, 2020)
- Imperas announce first reference model with UVM encapsulation for RISC-V verification (Feb 24, 2020)
- GLOBALFOUNDRIES and GlobalWafers Sign MOU to Increase Capacity, Supply of 300mm SOI Wafers (Feb 24, 2020)
- Hex Five Announces MultiZone Security for Arm Cortex-M Series Processors (Feb 24, 2020)
- Why you should care about Bluetooth LE Audio (Feb. 24, 2020)
- Movellus Names Semiconductor Industry Veteran Ken Wagner to Lead Engineering Team (Feb 20, 2020)
- Weebit Nano and Silvaco Develop New Simulation Capabilities to Increase ReRAM Adoption (Feb 20, 2020)
- Gowin Semiconductor Adds Ubuntu Support to their Gowin EDA FPGA Software for Improved Artificial Intelligence and IoT Development Toolchain Integration (Feb 20, 2020)
- STMicroelectronics and TSMC Collaborate to Accelerate Market Adoption of Gallium Nitride-Based Products (Feb 20, 2020)
- Synopsys Posts Financial Results for First Quarter Fiscal Year 2020 (Feb 20, 2020)
- Bluespec's RISC-V Factory Proves Its Dependable Productization, Helping Calligo Technologies Harness RISC-V for Posit-enabled Computing (Feb 20, 2020)
- Revenue per Wafer Rising As Demand Grows for sub-7nm IC Processes (Feb 20, 2020)
- Dialog Semiconductor to Acquire Adesto Technologies, Broadening Presence in the Industrial Internet of Things Market (IIoT) (Feb 20, 2020)
- Titan IC Secure Licensing Deal for 100Gbps Search Acceleration with FPGA SmartNIC Developer, Silicom (Feb 20, 2020)
- Imagination's RF IP included in Autotalks' PLUTON2 Chipset (Feb 19, 2020)
- CEVA NB-IoT IP Completes Release 14 GCF Certification with Rohde & Schwarz (Feb 19, 2020)
- Imagination announces new iEB110 Bluetooth Low Energy (BLE) v5.2 IP (Feb 19, 2020)
- Synopsys' Fusion Compiler Adopted by AMD (Feb 19, 2020)
- Mixel MIPI C-PHY/D-PHY Combo IP Integrated into Compound Photonics CP1080p26 Microdisplay (Feb 19, 2020)
- Renesas Electronics and Hitachi Develop High-Speed, High-Precision Automotive A/D Converter Circuit With Stable Operation Under Harsh Conditions (Feb. 19, 2020)
- Car to Cloud: Vehicles Are Getting Connected (Feb. 19, 2020)
- Accelerating Innovation for Safety Systems with Arm Flexible Access (Feb. 19, 2020)
- Adesto's EcoXiP™ Octal xSPI Memory Delivers Exceptional System Operation with STMicroelectronics' New STM32H7A3/7B3 and STM32H7B0 MCUs (Feb. 19, 2020)
- Aldec and Codasip at Embedded World: Showcasing an Integrated UVM Simulation Environment for Verifying Custom Instructions with RISC-V Cores (Feb. 19, 2020)
- Adapting the Microcontroller for AI in the Endpoint (Feb. 19, 2020)
- Covid-19 Is Crimping the Electronics Industry (Feb 18, 2020)
- SiPearl launches its development with 6.2m euros of European funds (Feb 18, 2020)
- SmartDV Offers New Design IP for DDR5 and LPDDR5 (Feb 18, 2020)
- SMIC Reports 2019 Fourth Quarter Result (Feb 18, 2020)
- Vintage Investment Partners, Verizon Ventures, Maersk Growth, PepsiCo and NTT DOCOMO Ventures Join Top Tier Investors Backing Wiliot's Postage Stamp Sized Computer (Feb 18, 2020)
- CEA-Leti Presents High-Performance Processor Breakthrough With Active Interposer and 3D Stacked Chiplets at ISSCC 2020 (Feb 18, 2020)
- CEVA, Inc. Announces Fourth Quarter and Year End 2019 Financial Results (Feb 18, 2020)
- OmniVision Announces Its First 64 Megapixel, 0.8 Micron Image Sensor (Feb 18, 2020)
- Accellera Forms Functional Safety Working Group to Standardize Data for Interoperability & Traceability in the Functional Safety Lifecycle (Feb 18, 2020)
- Adesto and MikroElektronika Introduce mikroBUS- compatible FT Click to Speed Industrial IoT Development (Feb 18, 2020)
- The US wants TSMC to stop manufacturing chips for Huawei (Feb. 18, 2020)
- Securing Low-Cost Embedded IoT Devices (Feb. 18, 2020)
- Launch of SiPearl, designing the microprocessor for the European exascale supercomputer (Feb 17, 2020)
- Gen-Z Core Specification 1.1 now available for public download (Feb 17, 2020)
- The FD-SOI Chip Design Book: Yes, It's Finally Here! (Feb. 17, 2020)
- RVSoC Offers a Lightweight Linux-Capable RISC-V Core in Just 5,000 Lines of Verilog (Feb. 17, 2020)
- Medical AI: Automate the Important Stuff (Feb. 17, 2020)
- Cadence Furthers Expansion in 5G RF Communications with Acquisition of Integrand (Feb 14, 2020)
- Synopsys Completes Acquisition of Certain IP Assets from INVECAS (Feb 14, 2020)
- Five Semiconductor Companies Hold 53% of Global Wafer Capacity (Feb 13, 2020)
- Cadence Reports Fourth Quarter 2019 Financial Results (Feb 13, 2020)
- Eta Compute Announces Production Silicon of the World's Most Energy-efficient Edge AI Processor (Feb 13, 2020)
- Faraday's AIoT Platform ASIC Solution Escalates System Accomplishment (Feb 13, 2020)
- Socionext Introduces Time-Sensitive Network (TSN) IP to Realize Smart Factories (Feb 13, 2020)
- XMOS announces world's lowest cost, most flexible AI processor (Feb 13, 2020)
- UltraSoC collaborates with PDF Solutions to prevent in-life product failures using end-to-end analytics and advanced machine learning techniques (Feb 13, 2020)
- Synopsys Launches New ARC Communications IP Subsystem for Wireless Narrowband IoT Designs (Feb 13, 2020)
- UMC Reports Sales for January 2020 (Feb 12, 2020)
- SmartDV Adds Support for MIPI I3C 1.1 Across Entire IP Portfolio (Feb 12, 2020)
- New Mathematically Lossless Video Compression IP Cores Announced by Hardent (Feb 12, 2020)
- Mythic adopts Mentor's Analog FastSPICE and Symphony platforms for AI processor design (Feb 12, 2020)
- BrainChip's Akida Development Environment Now Freely Available for Use (Feb 12, 2020)
- Synopsys Announces First Application Security Testing Solution to Analyze Both Open Source and Proprietary Code on the Developer's Desktop (Feb 12, 2020)
- Full steam ahead for TSMC despite coronavirus (Feb. 12, 2020)
- Edge Intelligence Ticks Many Boxes For AI (Feb. 12, 2020)
- GSMA Statement on MWC Barcelona 2020 from John Hoffman, CEO GSMA Limited (Feb. 12, 2020)
- Mobile World Congress Cancelled (Feb. 12, 2020)
- Low-Latency Ethernet MAC IP Core from CAST now ASIL-D Certified (Feb 11, 2020)
- TSMC Board of Directors Meeting Resolutions (2020) (Feb. 11, 2020)
- Nokia and SoftBank team up to complete world's first 5G connected car test (Feb. 11, 2020)
- Powering the future: Smallest all-digital circuit opens doors to 5 nm next-gen semiconductor (Feb 10, 2020)
- BrainChip Showcases Vision and Learning Capabilities of its Akida Neural Processing IP and Device at tinyML Summit 2020 (Feb 10, 2020)
- TSMC January 2020 Revenue Report (Feb 10, 2020)
- EnSilica to Develop Next-Generation Ka Band Satellite Transceivers for the European Space Agency (Feb 10, 2020)
- SEGGER releases Floating-Point Library for RISC-V (Feb 10, 2020)
- Xilinx Adds Advanced Machine Learning Capabilities for Pro AV and Broadcast Platforms (Feb 10, 2020)
- New AI technology from Arm delivers unprecedented on-device intelligence for IoT (Feb 10, 2020)
- Arm Cortex-M55 and Ethos-U55 Processors: Extending the Performance of Arm's ML Portfolio for Endpoint Devices (Feb. 10, 2020)
- Silex Insight launches True 4K Multiview using AV over IP (Feb 07, 2020)
- SMIC : Donation of RMB 10 million to support the frontline to fight the novel coronavirus epidemic (Feb. 07, 2020)
- RISC-V Foundation Showcases Unprecedented Momentum and Growth at Embedded World 2020 (Feb. 07, 2020)
- Presto Engineering Acquires DELTA Microelectronics Business from FORCE Technology (Feb 06, 2020)
- Acquisition Rebound Lifts 2019 to Third-Largest M&A Year (Feb 06, 2020)
- UMC Announces 14nm certification on Mentor's Calibre Eco Fill Flow (Feb 06, 2020)
- Embedded controller Floating-Point Library supports RISC-V (Feb. 06, 2020)
- 2019 Global Silicon Shipments Dip From 2018 Record High But Revenue Remained Stable Above $11 Billion, SEMI Reports (Feb 05, 2020)
- Gartner Says Worldwide Semiconductor Spending Declined in 2019 Due to Slowing Macroeconomy and Falling Memory Prices (Feb 05, 2020)
- GUC Monthly Sales Report - Jan 2020 (Feb 05, 2020)
- GigaDevice Launches the New GD32E232 Series of MCU's Featuring the Arm Cortex-M23 core for Embedded Systems (Feb 05, 2020)
- GreenWaves GAP9 AI/IoT ULP app processor on GF's 22FDX to sample H1 2020; mass production 2021 (Feb. 05, 2020)
- When ADAS Goes People-Blind (Feb. 05, 2020)
- SmartDV Achieves Record Revenue in 2019 (Feb 04, 2020)
- China Maintains Chip Output in Wake of Virus Outbreak (Feb 04, 2020)
- Arteris IP FlexNoC Interconnect and Resilience Package Licensed by SiEngine for ISO 26262-Compliant Automotive Systems (Feb 04, 2020)
- Worldwide Semiconductor Sales Decrease 12 Percent to $412 Billion in 2019 (Feb 04, 2020)
- Synapse Design's Continued Fast Growth Drives Opening of Two Offshore Semiconductor Design Centers (Feb 04, 2020)
- The First RISC-V Hackathon in Israel (Feb. 04, 2020)
- TI's First Automotive SoC with an AI Accelerator Launches (Feb. 04, 2020)
- Making Kynisys: how we're building the future of AI (Feb. 04, 2020)
- Chips&Media Pioneering With The World's First Real-time Multi-Standard Decoder, including AV1, HW IP, WAVE517 (Feb 03, 2020)
- JEDEC Publishes Update to Universal Flash Storage (UFS) Standard (Feb 03, 2020)
- Semiconductor R&D To Nudge Higher Through 2024 (Feb 03, 2020)
- UltraSoC extends its commitment to Japanese market with appointment of Ryoden (Feb 03, 2020)
- Qorvo Acquires UWB Chip Provider Decawave for $400m (Feb 03, 2020)
- Supply Chain Poised for Coronavirus Disruption (Feb 03, 2020)
- UMC Announces 14nm certification on Mentor's Calibre Eco Fill Flow (Feb. 03, 2020)
- University of Pittsburgh researchers explore enabling lag-free connections in massive IoT devices (Feb. 03, 2020)
- Digital Blocks AMBA Multi-Channel DMA Controller IP Core Family Extends Leadership with targeted applications in DMA Streaming of Video and Data over PCIe or UDP/IP Network Interface. (Jan 30, 2020)
- Xilinx Reports Fiscal Third Quarter 2020 Results (Jan 30, 2020)
- Creonic Joins German Center for Satellite Communications (DESK) (Jan 30, 2020)
- High-Bandwidth Accelerator Access to Memory: Enabling Optimized Data Transfers with RISC-V (Jan. 30, 2020)
- SoM is built around multi-core RISC-V SoC FPGA (Jan. 29, 2020)
- Thales unveils Cybels Analytics AI-based platform to detect complex cyberattacks (Jan. 29, 2020)
- Lattice Semiconductor Showcases Low Power FPGA-based AI/ML Solutions at tinyML Summit (Jan. 29, 2020)
- UK Approves Huawei 5G Equipment with Restrictions (Jan. 29, 2020)
- EU announces strict 5G guidelines amid security risks (Jan. 29, 2020)
- Cobham Gaisler successfully verifies its first RISC-V processor, NOEL-V, using Aldec's Riviera-PRO for HDL Simulation (Jan 28, 2020)
- Rambus Reports Fourth Quarter and Fiscal Year 2019 Financial Results (Jan 28, 2020)
- Arteris IP Adds 17 New Licensees, Revenue Exceeds $31M in 2019 (Jan 28, 2020)
- QuickLogic Announces Restructuring Plan to Reduce Operating Expenses in Order to Achieve Profitability Goals for Fiscal Year 2020 (Jan 28, 2020)
- Intel Moving Select CPU Manufacturing to GlobalFoundries (Jan. 28, 2020)
- Ethernet Enables Higher Data Rates for Space Applications (Jan. 28, 2020)
- WiLAN Awarded $85.23M in Apple Re-Trial (Jan 27, 2020)
- Kneron raises $40m for next-gen Edge AI chip (Jan 27, 2020)
- Flex Logix EFLX 1K eFPGA Core Design Kits Available Now For TSMC 40nm ULP And 40nm LP Process Technologies (Jan 27, 2020)
- proteanTecs Announces Live Webinar on In-Field Failure Prediction Based on IC Deep Data Monitoring (Jan 27, 2020)
- Former Google and Tesla Engineer Chris Lattner to Lead SiFive Platform (Jan 27, 2020)
- Why Imagination Technologies has joined the FIDO Alliance (Jan. 27, 2020)
- ESP Open Source Research Platform Enables the Design of RISC-V & Sparc SoC's with Accelerators (Jan. 26, 2020)
- North American Semiconductor Equipment Industry Posts December 2019 Billings (Jan 24, 2020)
- Lattice Diamond FPGA Development Tool Receives Key Industrial and Automotive Functional Safety Certifications (Jan 24, 2020)
- Groq Hardware Now Available on Nimbix Cloud (Jan 23, 2020)
- Ciaran Kennedy and Himesh Soneji join Enyx (Jan 23, 2020)
- Apple, Huawei Use TSMC, But Their 7nm SoCs Are Different (Jan 23, 2020)
- Intel joins CHIPS Alliance to promote Advanced Interface Bus (AIB) as an open standard (Jan 23, 2020)
- 26 of 33 IC Products Forecast to Demonstrate Positive Growth in 2020 (Jan 23, 2020)
- Synopsys Announces New ARC HS4x/4xD Development Kit to Speed Software Development (Jan 23, 2020)
- Ada and RISC-V Secure Nvidia's Future (Jan. 23, 2020)
- Top 4 ways the food industry can implement IoT (Jan. 23, 2020)
- Silex Insight and Argo collaborate on ensuring the complete security for smart meters in South-Korea (Jan 22, 2020)
- Synopsys and Finastra Partner to Secure Financial Services App Ecosystem (Jan 22, 2020)
- Himax Launches HM0360 1/6" VGA Ultra Low Power CMOS Image Sensor for AIoT and Computer Vision Applications (Jan. 22, 2020)
- Allegro DVT Unveils the Industry's First VVC Compliance Test Bitstreams (Jan 21, 2020)
- Arteris IP FlexNoC Interconnect and AI Package Licensed by Vastai Technologies for Artificial Intelligence Chips (Jan 21, 2020)
- sureCore Opens Low Power Memory Compiler Access (Jan 21, 2020)
- Xilinx Files Patent Infringement Lawsuit Against Analog Devices (Jan 21, 2020)
- New RISC-V Solution: SAFERTOS for IAR Embedded Workbench for RISC-V (Jan. 21, 2020)
- eMemory and UMC Qualify NeoFuse IP on the Foundry's 28nm High Voltage Process (Jan 20, 2020)
- Arm Mali-G77 GPU named Best Processor IP in The Linley Group's Analysts' Choice Awards (Jan 20, 2020)
- TSMC Announces Winners of First IC Layout Contest (Jan 20, 2020)
- Palma Ceia SemiDesign Signs Agreement with BLRLABS for Expansion to India (Jan 20, 2020)
- Global GDP Growth An Increasingly Important Driver of IC Market Growth (Jan 20, 2020)
- TSMC Announces Winners of First IC Layout Contest (Jan. 20, 2020)
- 5G to Drive Doubling of SOI Market by 2024, says Digitimes Research (Jan. 20, 2020)
- eMemory and UMC Qualify NeoFuse IP on the Foundry's 28nm High Voltage Process (Jan. 20, 2020)
- Imagination Technologies charts its future with new Apple deal and post-MIPS strategy (Jan. 18, 2020)
- JEDEC Publishes Update to LPDDR5 Standard for Low Power Memory Devices (Jan 17, 2020)
- Erwan Menard, Director of Infrastructure and Applications Modernization Solutions at Google Cloud, Joins Kalray Board of Directors (Jan 17, 2020)
- Apple Reportedly Acquires Xnor (Jan 17, 2020)
- Synopsys Joins New Autonomous Vehicle Computing Consortium (Jan 17, 2020)
- CAST Adds Switched TSN Endpoint Controller to Time-Sensitive Networking Ethernet IP Cores Family (Jan 17, 2020)
- 4 factors to consider before investing in AI (Jan. 17, 2020)
- TSMC Reports Fourth Quarter EPS of NT$4.47 (Jan 16, 2020)
- Cadence Completes Acquisition of AWR Corporation from National Instruments (Jan 16, 2020)
- Imagination Technologies expands with new design centre in Romania (Jan 16, 2020)
- Mercury Systems Selects Tortuga Logic's Radix for DARPA Program (Jan 16, 2020)
- AI Chips: What Will 2020 Bring? (Jan 16, 2020)
- Is ReRAM Ready to Leave the R&D Phase? (Jan 16, 2020)
- MIPI I3C v1.1 Utility and Control Bus Strengthens Upgrade Path for I2C Implementers (Jan 15, 2020)
- Microchip certifies compiler for functional safety (Jan. 15, 2020)
- Mobile Sales Force Automation Market to Reach $3.68 Billion by 2023 in North America with AI and Machine Learning (Jan. 15, 2020)
- M31 Technology Wins Customers' Choice Award for Automotive IP Paper at TSMC Open Innovation Platform (OIP) Ecosystem Forum (Jan 14, 2020)
- Gartner Says Worldwide Semiconductor Revenue Declined 11.9% in 2019 (Jan 14, 2020)
- Inphi Completes Acquisition of eSilicon (Jan 14, 2020)
- Cadence Expands Collaboration with Broadcom for 5nm and 7nm Designs (Jan 14, 2020)
- What Makes Secure Processors Different? (Jan. 14, 2020)
- PLDA Announces Successful PCIe 4.0 Technology Compliance for its XpressRICH-AXI Controller IP (Jan 13, 2020)
- TSMC December 2019 Revenue Report (Jan 13, 2020)
- Synopsys Acquires Tinfoil Security to Expand DAST and Add API Security Testing (Jan 13, 2020)
- Synopsys Completes Acquisition of Certain IP Assets from eSilicon (Jan 13, 2020)
- The BSC coordinates the manufacture of the first open source chip developed in Spain (Jan 13, 2020)
- SOI in IoT & Automotive (Jan. 13, 2020)
- CSEM Bluetooth 5.1 IP icyTRX is ready for LE Audio on multiple processes (Jan 10, 2020)
- Practical applications for AI and ML in embedded systems (Jan. 10, 2020)
- UMC Reports Sales for December 2019 (Jan 09, 2020)
- Andes Technology Takes the Lead in Launching RISC-V Total Solutions and Driving Industry-Academia Collaboration with over 120 Projects (Jan 09, 2020)
- China Only Region to Register Pure-Play Foundry Market Growth in 2019 (Jan 09, 2020)
- UK Judge Finds Conversant Wireless' European Standard-Essential Patents Infringed by Huawei and ZTE (Jan 09, 2020)
- Synopsys Expands Portfolio of Automotive VDKs with Support for NXP S32G Vehicle Network Processor (Jan 09, 2020)
- Xiaomi and MPEG LA Announce Xiaomi's Signing of MPEG LA's HEVC License (Jan 09, 2020)
- Half-bridge SOI driver offers integrated bootstrap diodes (Jan. 09, 2020)
- Build your own Edge AI SoC with SiFive RISC-V CPUs and CEVA AI chips (Jan. 09, 2020)
- How to Get Started with RISC-V-Based Microcontrollers (Jan. 09, 2020)
- Qualcomm Accelerates Autonomous Driving with New Platform - Qualcomm Snapdragon Ride (Jan 08, 2020)
- Low-Power FD-SOI FPGA Melds AI and Bridging (Jan. 08, 2020)
- Open Source Hardware Risks (Jan. 08, 2020)
- ONiO.zero offers a RISC-V Microcontroller that runs without battery (Jan. 08, 2020)
- SHA IP Core with native SHA2-256 HMAC support (Jan 07, 2020)
- Omni Design Joins TSMC IP Alliance Program (Jan 07, 2020)
- Bluespec, Inc. to Open Source Its Proven BSV High-level HDL Tools (Jan 07, 2020)
- CEVA Speeds the Development of True Wireless Stereo Earbuds with its Support of Bluetooth LE Audio (Jan 07, 2020)
- Synopsys Releases Industry's First Bluetooth LE Audio Codec for Power-Sensitive Audio and Voice Applications (Jan 07, 2020)
- ESD Alliance Reports EDA Industry Revenue Increase for Q3 2019 (Jan 07, 2020)
- LC3 for Bluetooth LE Audio Now Available for Cadence Tensilica HiFi DSPs (Jan 07, 2020)
- Siemens partners with Arm to accelerate the future of mobility by redefining design capabilities for complex electronic systems (Jan 07, 2020)
- SiFive and CEVA Partner to Bring Machine Learning Processors to Mainstream Markets (Jan 07, 2020)
- Synopsys to Acquire Certain IP Assets of INVECAS (Jan 07, 2020)
- Imagination in action at CES 2020 (Jan. 07, 2020)
- Processors for ADAS and auto computing (Jan. 07, 2020)
- IoT security: What we can learn from recent threats (Jan. 07, 2020)
- GUC Monthly Sales Report - Dec 2019 (Jan 06, 2020)
- zGlue Launches ChipBuilder Pro to Quickly and Easily Enable the Next Generation of Consumer Experiences on IoT and AI-Powered Devices (Jan 06, 2020)
- CEVA Debuts SenslinQ Platform to Streamline Development of Contextually Aware IoT Devices (Jan 06, 2020)
- Novatek Adopts CEVA Audio/Voice DSP and Software for Smart TV SoCs (Jan 06, 2020)
- Gowin Semiconductor Takes Leadership Position in Always-on Low Power FPGAs with GW1NZ-ZV Device Production (Jan 06, 2020)
- Siemens-Arm Looks to 2025 Vehicles' Platform Design (Jan. 06, 2020)
- Wi-Fi Alliance brings Wi-Fi 6 into 6 GHz (Jan 03, 2020)
- Global Semiconductor Market Likely to Grow 6% in 2020, reports SIA (Jan. 03, 2020)
- Imagination and Apple Sign New Agreement (Jan 02, 2020)
- HiSilicon No Longer Huawei's Captive Chipmaker (Jan 02, 2020)
- 2020: When AVs Attack, Who's at Fault? (Jan. 02, 2020)
- Cloud, 5G and 'wetware' attacks – the 5 biggest cybersecurity threats of 2020 (Jan. 02, 2020)
- Israeli Startup TriEye Collaborates with Porsche to Help Drivers "See" Better in Low Visibility Conditions (Jan. 02, 2020)
- OmniVision Announces 4K Video Processor with Industry's Lowest Power Consumption and HEVC Compression Capability for Battery-Powered Security and Surveillance Applications (Jan 02, 2020)
- Architecture of AI chip slightly tweaked, results in cutting power consumption by 5x (Jan. 02, 2020)
- CES 2020: Biggest Computing Trends to Watch (Jan. 01, 2020)
- RISC-V Lagarto is First Open Source Chip Developed in Spain (Dec. 31, 2019)
- Our 2020 tech predictions: Samsung, Surface Duo, 5G and Elon Musk (Dec. 31, 2019)
- China semiconductor equipment expense to see double-digit growth (Dec. 31, 2019)
- Digital Blocks extends leadership of UDP/IP networking with 50 & 100 GbE (Dec 30, 2019)
- AImotive's latest aiWare3P delivers superior NN acceleration for production L2-L3 automotive AI (Dec 30, 2019)
- A View of the Future for GLOBALFOUNDRIES (Dec. 30, 2019)
- AI: A Little Too Human, But Not Human Enough (Dec. 30, 2019)
- SiFive to Attend CES 2020 (Dec. 30, 2019)
- 5 Innovations That Will Dominate CES 2020 (Dec. 30, 2019)
- The single most important 2020 IoT trend (Dec. 30, 2019)
- Teardown Reveals Globalfoundries 22FDX Shipping In End Products Like Google's 2nd Gen Nest Mini (Dec. 28, 2019)
- 5 Pivotal Events in IoT and Embedded (Dec. 26, 2019)
- SYSGO and ST to Demonstrate Secure Vehicle Connectivity at CES 2020 (Dec. 26, 2019)
- IoT Applications and AI at The Edge Level (Dec. 24, 2019)
- Record Amount of IC Capacity Forecast to be Added in 2021 (Dec 23, 2019)
- Arm puts loss-making cyber security venture up for sale (Dec 23, 2019)
- PRO DESIGN Extends FPGA Based Prototyping Portfolio With proFPGA XCVU13P Module - Offering Highest Interface and System Performance (Dec 23, 2019)
- Bluespec Unveils Groundbreaking "RISC-V Factory" - Empowering Open Source Hardware Developers to Build Faster and More Efficiently (Dec 23, 2019)
- Semiconductor industry will recover in 2020 (Dec. 23, 2019)
- Why the Memory Subsystem is Critical in Inferencing Chips (Dec. 22, 2019)
- 5 Pivotal Events in AI Chips in 2019 (Dec. 22, 2019)
- NEC Selects Synopsys ZeBu Server 4 Emulation Solution for Super Computer Verification (Dec 20, 2019)
- North American Semiconductor Equipment Industry Posts November 2019 Billings (Dec 20, 2019)
- How RISC-V is creating a globally neutral, open source processor architecture (Dec. 20, 2019)
- Faraday Unveils New IoT SoC Platform to Accelerate Early-Stage ASIC Development (Dec 19, 2019)
- eMemory Joins Arm Ecosystem for Secure IoT Chips (Dec 19, 2019)
- videantis AI processor platform adopted for KI-FLEX autonomous driving chip (Dec 19, 2019)
- Vidatronic Appoints New Member to Its Board of Directors (Dec 19, 2019)
- CEVA Puts Intuitive Motion Control in the Palm of Your Hand with New Sensor Fusion Solution for Consumer Handheld Devices (Dec 19, 2019)
- Atmosic Technologies Raises $28.5 Million in Latest Round of Funding (Dec 19, 2019)
- GreenWaves Unveils Groundbreaking Ultra-Low Power GAP9 IoT Application Processor for the Next Wave of Intelligence at the Very Edge (Dec 19, 2019)
- Xilinx Powers Baidu's Production-Ready ACU-Advanced Platform for Automated Valet Parking (Dec 19, 2019)
- Industry Awards for SOI Luminaries at UCLouvain, Lattice, NXP & Soitec (Dec. 19, 2019)
- FPGA Platform from Lattice Semi Sets a New Standard for Efficiency (Dec. 19, 2019)
- AI processing architecture to be on display at CES 2020 (Dec. 19, 2019)
- Synopsys and Porsche Consulting Introduce a Framework for Accelerating Automotive Development for the Digital Future (Dec. 19, 2019)
- Microchip unveils details and opens early access program for RISC-V enabled low-power PolarFire SoC family (Dec. 19, 2019)
- What Worked, What Didn't In 2019 (Dec. 19, 2019)
- Veriest instrumental in verification of Innoviz automotive LIDAR device (Dec 18, 2019)
- Wind River Announces RISC-V Support for VxWorks RTOS (Dec 18, 2019)
- SLX FPGA v2019.4 Delivers an Average of 45x HLS Performance Improvement (Dec 18, 2019)
- Aldec Enhances Riviera-PRO's VHDL and UVVM Support (Dec 18, 2019)
- Tortuga Logic Awarded Multi-Million Dollar DoD Contracts to Increase The Security and Assurance of Microelectronics (Dec 18, 2019)
- Samsung to make chips for China's Baidu in notable first partnership (Dec. 18, 2019)
- Latest AI Algorithms Presented at NeurIPS (Dec. 18, 2019)
- After the biggest fall for 18 years, it's all going to get better, says SI (Dec. 18, 2019)
- Japan Symposium '19 Summaries Part 1 – 5G/RF-SOI (Dec. 18, 2019)
- Microchip PolarFire Takes a RISC (-V) (Dec. 18, 2019)
- Trust and data privacy remain consumers' biggest fears about connected cars (Dec. 18, 2019)
- Intrinsic ID Raises 2.5 Million Euros for Internet of Things Security (Dec 17, 2019)
- Global Fab Equipment Spending Rebounds in Second Half of 2019 with Stronger 2020 Projected, SEMI Reports (Dec 17, 2019)
- Renesas Electronics Collaborates with Xilinx on Versal ACAP Reference Designs (Dec 17, 2019)
- Mobiveil's PCI Express 4.0 Endpoint Controller Passes PCI-SIG Gold and Interoperability Testing (Dec 17, 2019)
- Apple Buys Image Fusion Startup Spectral Edge (Dec 17, 2019)
- A Renaissance in the Emulation Business Is Nigh (Dec 17, 2019)
- Intel Acquires Artificial Intelligence Chipmaker Habana Labs (Dec 17, 2019)
- Lattice Semiconductor launched new low-power FPGA based on FD-SOI (Dec. 17, 2019)
- Gartner: Blockchain is the perfect match for the IoT (Dec. 17, 2019)
- Mentor collaborates with Arm on unique eMRAM test solution using Samsung FDSOI technology (Dec 16, 2019)
- Enflame leverages Mentor's Tessent DFT solutions for innovative cloud AI chip targeting neural network training (Dec 16, 2019)
- Alma Technologies Announces Availability of a New Ultra-High Throughput JPEG 2000 Encoder IP Core (Dec 16, 2019)
- How to multiply by 18 battery autonomy of voice control devices? (Dec 16, 2019)
- Codasip Studio and Codasip CodeSpace 8.2 available (Dec. 16, 2019)
- An Introduction to Machine Learning on Mobile (Dec. 16, 2019)
- Nokia signs contract with TIM Brazil to launch IoT offer (Dec. 16, 2019)
- The 8 AI trends we're watching in 2020 (Dec. 16, 2019)
- CEA-Leti Builds Fully Integrated Bio-Inspired Neural Network with RRAM-Based Synapses & Analogue Spiking Neurons (Dec 13, 2019)
- Revenue Ranking of Global Top 10 IC Design Companies Shows U.S. Companies Having Divergent Performances in 3Q19, Says TrendForce (Dec 13, 2019)
- INSPECTOR diagnostic and debug platform passed the PCIe 4.0 compliance (Dec 13, 2019)
- Aldec's new FPGA-based NVMe Data Storage Solution Targets High Performance Computing Applications (Dec 13, 2019)
- Breker Verification Systems Launches Unique RISC-V TrekApp for Automated, High-Coverage System Integration Test Suite Synthesis (Dec 13, 2019)
- Functional Safety on Arm – Beyond Automotive (Dec. 13, 2019)
- MediaTek selects Nucleus RTOS for next-generation modem technology (Dec 12, 2019)
- Calterah Semiconductor's Automotive Radar SoC Enters Mass Production Using Synopsys DesignWare ARC Processor IP (Dec 12, 2019)
- Enflame Technology Selects Rambus HBM2 Memory Subsystem Solution For Next-Generation AI Training Chip (Dec 12, 2019)
- Lattice and SiFive Announce Collaboration to Allow Lattice FPGA Developers Easy Access to RISC-V Processors (Dec 12, 2019)
- All M31 Automotive IP Products Received ISO 26262 Certifications (Dec 12, 2019)
- Global Semiconductor Equipment Sales Forecast - 2020 Rebound, 2021 Record High (Dec 12, 2019)
- Enflame Technology Announces CloudBlazer with DTU Chip on GLOBALFOUNDRIES 12LP FinFET Platform for Data Center Training (Dec 12, 2019)
- Codasip Teams Up with Western Digital to Support Adoption of Open-Source Processors (Dec 12, 2019)
- SiFive Announces New Technologies for Mission-Critical and AI Markets (Dec 11, 2019)
- Cobham Releases RISC-V Processor IP Core (Dec 11, 2019)
- Dialog Semiconductor and Flex Logix Establish Strategic Partnership for Mixed Signal Embedded Field-Programmable Gate Arrays (eFPGA) (Dec 11, 2019)
- Lattice Announces New Low Power FPGA Platform (Dec 11, 2019)
- AccelerComm Reduces 5G Latency by up to 16x with NR LDPC Channel Coding (Dec 11, 2019)
- Industry Veteran Randy Allen Joins SiFive as Vice President of RISC-V Software (Dec 11, 2019)
- New Lattice CrossLink-NX FPGAs Bring Power and Performance Leadership to Embedded Vision and Edge AI Applications (Dec 11, 2019)
- Cobham Releases LEON5 Processor IP Core (Dec 11, 2019)
- Lattice Unveils First FPGAs on FD-SOI (Dec. 11, 2019)
- Arm's 2020 predictions (Dec. 11, 2019)
- RISC-V grows globally as an alternative to Arm and its license fees (Dec. 11, 2019)
- Andes Technology and Deeplite, INC. Join Forces To Deploy Highly Compact Deep Learning Models Into Daily Life (Dec 10, 2019)
- TSMC November 2019 Revenue Report (Dec 10, 2019)
- Global Unichip Corporation Uses Cadence Digital Implementation and Signoff Flow to Deliver Advanced-Node Designs for AI and HPC Applications (Dec 10, 2019)
- Hex Five Announces General Availability of MultiZone Security for Linux - The First Commercial Enclave for RISC-V processors (Dec 10, 2019)
- Creonic Continues to Extend its Leading SATCOM IP Core Portfolio (Dec 10, 2019)
- Attopsemi's I-fuse OTP IP Embedded into Melexis' Sensor ICs In Mass Production (Dec 10, 2019)
- Codasip Teams Up with Western Digital to Support Adoption of Open?Source Processors (Dec 10, 2019)
- PLDA Announces Augmented Presence in Asia with Increased R&D, Support and Sales, and a New Chinese Language Website (Dec 10, 2019)
- NSITEXE Selects SmartDV TileLink Verification IP for RISC-V Based Applications (Dec 10, 2019)
- INSPECTOR™ diagnostic and debug platform passed the PCIe 4.0 compliance (Dec. 10, 2019)
- Microchip Unveils Family Details and Opens Early Access Program for RISC-V Enabled Low-Power PolarFire SoC FPGA Family (Dec. 10, 2019)
- RISC-V Xmas gifts: SiFive emits vector-enabled cores, Western Digital teases new SweRVs, VxWorks hugs ISA, Samsung rolls it into 5G... (Dec. 10, 2019)
- Tech Industry Heavyweight Joins SiFive - Manoj Gujral Tapped As SVP & GM of Silicon Business Unit (Dec 09, 2019)
- Andes Corvette-F1 N25 Platform Becomes one of the first RISC-V Platforms Qualified for Amazon FreeRTOS (Dec 09, 2019)
- UltraSoC donates RISC-V trace implementation to enable true open-source development (Dec 09, 2019)
- Xilinx Issues Statement in Response to Analog Devices Patent Infringement Lawsuit (Dec 09, 2019)
- Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2019 (Dec 09, 2019)
- GUC Monthly Sales Report - Nov 2019 (Dec 09, 2019)
- UMC Reports Sales for November 2019 (Dec 09, 2019)
- Verimatrix Completes Sale of its Silicon IP Business Unit to Rambus (Dec 09, 2019)
- Rambus Completes Acquisition of the Verimatrix Silicon IP, Secure Protocols and Provisioning Business (Dec 09, 2019)
- WiLAN Subsidiary and CXMT Enter into License and Acquisition Agreements (Dec 09, 2019)
- Andes' Core has RISC-V Vector Instruction Extension (Dec. 09, 2019)
- New Vidatronic CTO to Innovate and Scale Technology (Dec 06, 2019)
- Andes certifies Imperas models and simulator as reference for new Andes RISC-V Vectors Core with lead customers and partners (Dec 05, 2019)
- SiFive To Present New Technologies At RISC-V Summit 2019 (Dec 05, 2019)
- Andes 45-Series Expands RISC-V High-end Processors 8-Stage Superscalar Processor Balances High Performance, Power Efficiency, and Real-time Determinism with Rich RISC-V Ecosystem (Dec 05, 2019)
- BrainChip and Tata Consultancy Services (TCS) jointly Present a Demonstration Featuring Its Akida Neuromorphic Technology Platform at NeurIPS 2019 (Dec 05, 2019)
- Where Is The Edge AI Market And Ecosystem Headed? (Dec. 05, 2019)
- Taking Self-Driving Safety Standards Beyond ISO 26262 (Dec. 05, 2019)
- Neoverse N1 makes debut in new AWS cloud instances (Dec 04, 2019)
- Third Quarter 2019 Worldwide Semiconductor Equipment Billings Jump 12 Percent, SEMI Reports (Dec 04, 2019)
- Andes Presents Ground-Breaking 27-Series Processor at RISC-V Summit 2019 (Dec 04, 2019)
- SmartDV's TileLink, Verilator VIP on Full Display at RISC-V Summit (Dec 04, 2019)
- Veriest marks 1st anniversary of meetup series with special event in Belgrade (Dec 04, 2019)
- Aldec's Active-HDL Verification Capabilities Enhanced to Support SystemVerilog Constructs and UVM (Dec 04, 2019)
- Global Semiconductor Sales Increase 2.9 Percent Month-to-Month in October; Annual Sales Projected to Decrease 12.8 Percent in 2019 (Dec 04, 2019)
- SOI Consortium 2019/20 New Members AMAT, Analog Bits, Antaios, Silicon Catalyst, SmarterMicro, Thalia (Dec. 04, 2019)
- Cadence to Acquire AWR Corporation from National Instruments to Accelerate System Innovation for 5G RF Communications (Dec 03, 2019)
- Think Silicon demonstrates early preview of Industry's first RISC-V ISA based 3D GPU at the RISC-V Summit (Dec 03, 2019)
- Mixel Announces Immediate Availability of MIPI D-PHY v2.5 IP (Dec 03, 2019)
- SiFive Learn Inventor Development System Now AWS Qualified (Dec 03, 2019)
- Imagination launches IMG A-Series: "The GPU of Everything" (Dec 03, 2019)
- UNISOC and Imagination carry out strategic cooperation on AI based on IMG Series3NX neural network accelerator (Dec 03, 2019)
- RISC-V Foundation Founding Member Andes Technology Turns Platinum (Dec 03, 2019)
- Lift off: De-RISC to create first RISC-V, fully European platform for space (Dec 03, 2019)
- Cadence and National Instruments Enter into Strategic Alliance Agreement to Enhance Electronic System Innovation (Dec 03, 2019)
- D&R announces the opening of an IP Core Store to support Soft IP Cores sales to the Chinese market (Dec. 03, 2019)
- Moortec's In-Chip Monitoring Subsystem Supports Uhnder in Groundbreaking Digital Automotive Radar-on-Chip (Dec 02, 2019)
- SiFive Announces SiFive Learn Initiative (Dec 02, 2019)
- Dolphin Design is ISO 9001 and EN 9100 certified (Dec 02, 2019)
- UMC Announces 22nm Technology Readiness Following Silicon Validation on World's Smallest USB 2.0 Test Vehicle (Dec 02, 2019)
- EnSilica and Macnica Europe GmbH Sign Distribution Agreement for Custom ASIC Design and Supply Services (Dec 02, 2019)
- Intel Completes Sale of Smartphone Modem Business to Apple (Dec 02, 2019)
- SiFive Welcomes Ann Chin As SiFive IP Business Unit General Manager (Nov 28, 2019)
- Semico Forecasts Strong Growth for RISC-V (Nov 28, 2019)
- Creonic Participates in H2020 "VERTIGO" Research Project (Nov 28, 2019)
- University of Tokyo and TSMC Announce Organization-Wide Advanced Semiconductor Technology Collaboration (Nov. 27, 2019)
- GlobalWafers completes new fab in South Korea (Nov. 27, 2019)
- Soitec reports First Half Results of Fiscal Year 2020 (Nov. 27, 2019)
- Trade dispute drives RISC-V-Foundation to Switzerland (Nov. 27, 2019)
- SiFive Welcomes Stuart Ching As Chief Revenue Officer (Nov. 27, 2019)
- Inmarsat GX5 satellite, manufactured by Thales Alenia Space, now in orbit (Nov. 27, 2019)
- European Union Cybersecurity Agency focuses on connected cars in latest research (Nov. 27, 2019)
- Aldec's Latest Embedded Development Platform is First to Feature Largest PolarFire and SmartFusion2 FPGAs on a Single Board (Nov 26, 2019)
- MediaTek Announces Dimensity, World's Most Advanced 5G Chipset Family, & Dimensity 1000 5G SoC (Nov 26, 2019)
- Imperas delivers highest quality RISC-V RV32I compliance test suites to implementers and adopters of RISC-V (Nov 26, 2019)
- Silex Insight Introduces Video Codec IP using RAW input (CFA) (Nov 26, 2019)
- The transformation of UMC (Nov. 26, 2019)
- AccelerComm introduces improved channel equalisation for 5G NR at MWC Barcelona 2020 (Nov 25, 2019)
- MediaTek and Intel Partner to Bring 5G Connectivity to the Next Generation of PCs (Nov 25, 2019)
- S2C Delivers New Prodigy FPGA Prototyping Solutions with the Industry's Highest Capacity FPGA from Intel (Nov 25, 2019)
- WiLAN Signs Wireless License with LG (Nov 25, 2019)
- Netherlands Energy Harvesting Semiconductor Firm Nowi Reaches $14 Million in Funding (Nov 25, 2019)
- SparkFun Picks SiFive's FE310 to Power RISC-V-Based RED-V Thing Plus, RED-V RedBoard Dev Boards (Nov. 23, 2019)
- Renesas' R-IN32M4-CL3 IC Boosts Next-Generation Ethernet TSN, Linking IT and OT Seamlessly With CC-Link IE TSN (Nov. 21, 2019)
- SmartDV's Platform-Independent VIP Portfolio Ensures Seamless Coverage-Driven Verification Flow (Nov 21, 2019)
- UltraSoC joins the OpenHW Group and extends its commitment to an open-source future for technology development (Nov 21, 2019)
- SiFive Welcomes Stuart Ching As Chief Revenue Officer (Nov 21, 2019)
- North American Semiconductor Equipment Industry Posts October 2019 Billings (Nov 20, 2019)
- Alereon Adopts Omni Design's Low Power Analog-to-Digital and Digital-to-Analog Converters for Ultra-Wideband Applications (Nov 20, 2019)
- Credo Joins Open Compute Project (OCP) to Accelerate 400G and Beyond Connectivity Solutions for Hyperscale Datacenters and Telecom (Nov 20, 2019)
- Attopsemi Technology Attended 4th Japan SOI Symposium and Presented a Talk "I-fuse: A Disruptive OTP Technology" (Nov 20, 2019)
- Cadence Named the #1 Technology Company on Investor's Business Daily List of the Top 50 ESG Companies (Nov. 20, 2019)
- High-speed comms options enable in-life debug and optimization for datacenter, HPC and storage customers (Nov 19, 2019)
- Graphcore leveraged Mentor's Questa technologies to verify massive Colossus GC2 AI processor (Nov 19, 2019)
- IntelliProp to Demo World's First UPI to Gen-Z Load/Store Host Adapter at SC19 (Nov 19, 2019)
- Expanding Universe for HPC, NVIDIA CEO Brings GPU Acceleration to Arm (Nov 19, 2019)
- EasyIC Design joins Arm Approved Design Partner Program (Nov 19, 2019)
- UVM-AMS Working Group Formed to Standardize UVM Analog/Mixed-Signal Extensions (Nov 19, 2019)
- RISC-V Not So Risky (Nov. 19, 2019)
- RISC-V Myths and More (Nov. 19, 2019)
- ST signs up for more Cree silicon carbide wafers (Nov. 19, 2019)
- SMIC Proposed Issue of US$200 Million Zero Coupon Convertible Bonds (Nov. 19, 2019)
- Intel to Reclaim Number One Semiconductor Supplier Ranking in 2019 (Nov 18, 2019)
- Faraday and UMC Collaborate to Launch a Complete Set of 22nm Fundamental IP (Nov 18, 2019)
- NUVIA Raises $53 Million to Reimagine Silicon Design for the Data Center (Nov 18, 2019)
- Synopsys Custom Compiler Adopted by Samsung Foundry to Accelerate IP Design for 5LPE Process Technology with EUV Technology (Nov 18, 2019)
- Moortec To Showcase Its Latest Embedded PVT Monitoring IP For 40nm-5nm At The 2019 ICCAD in Nanjing (Nov 18, 2019)
- ArchiTek Select SiFive and DTS-Insight To Enable Next-Generation AI Solution Development (Nov 18, 2019)
- Intel announces open oneAPI initiative and development beta release with Data Parallel C++ language for programming CPUs, GPUs, FPGAs, and other accelerators (Nov 18, 2019)
- Jim Cable (pSemi) & Herb Huang (Ningbo Semi) Honored for Pioneering RF-SOI Work (Nov. 18, 2019)
- RISC-V Markets, Security And Growth Prospects (Nov. 18, 2019)
- Gyrfalcon's New Chip Raises Bar (12.6 TOPS/W) on High Performance Edge AI with Lower Power Use (Nov 15, 2019)
- Synopsys Completes Acquisition of DINI Group (Nov 15, 2019)
- Diamond Design Software from Lattice Semiconductor Enables Enhanced Security Features for MachXO3D FPGAs (Nov 15, 2019)
- Gyrfalcon Unveils Fourth AI Accelerator Chip (Nov. 15, 2019)
- Gyrfalcon Technology and Sensory Deliver Enhanced AI Biometric Access on Edge Devices (Nov 14, 2019)
- Nordic Semiconductor unveils world's first dual Arm Cortex-M33 processor wireless SoC for the most demanding low power IoT applications (Nov 14, 2019)
- FlexIC Foundry enables custom flexible integrated circuit design (Nov 14, 2019)
- Reduce TCO with Arm Based SmartNICs (Nov. 14, 2019)
- Rambus Announces Comprehensive PCI Express 5.0 Interface Solution (Nov 13, 2019)
- New Cadence UltraLink D2D PHY IP for Die-to-Die Connectivity Enables High-Performance Applications with Cost-Effective Packaging (Nov 13, 2019)
- Efinix Rolls Out Trion T120 FPGAs (Nov 13, 2019)
- Secure-IC and Andes Technology jointly provide cybersecurity enhanced RISC-V cores (Nov 13, 2019)
- Mirabilis Design unveils the first rapid prototyping platform for Artificial Intelligence Processors and Applications (Nov. 13, 2019)
- GOWIN Semiconductor Releases the First FPGA with Integrated Bluetooth Radio (Nov 12, 2019)
- Synopsys DesignWare ARC Data Fusion IP Subsystem Incorporated by Himax in Their Artificial Intelligence WiseEye ASIC (Nov 12, 2019)
- Achronix to Showcase 7nm FPGA Solutions at SC19 (Nov 12, 2019)
- Xilinx Announces the World's Highest Performance Adaptive Devices for Advanced ADAS and AD Applications (Nov 12, 2019)
- Blaize Emerges from Stealth to Transform AI Computing (Nov 12, 2019)
- Aerendir Mobile Inc. and SiFive Inc. Collaborate to Accelerate the Adoption of AI-Enabled Processors (Nov 12, 2019)
- New Smart Meter using Adesto's Memory and Communications Technologies Begins Pilot Program in Africa and Middle East (Nov 12, 2019)
- Rianta Releases Ethernet MAC/PCS/FEC IP Suite for ASICs targeting Datacenter, Networking and 5G Mobile Infrastructure (Nov 12, 2019)
- Mentor introduces Tessent Safety ecosystem to meet IC test requirements of the autonomous vehicles era (Nov 12, 2019)
- SMIC Reports 2019 Third Quarter Result (Nov 12, 2019)
- Xilinx Vitis Unified Software Platform Now Available for Download (Nov 12, 2019)
- Silicon Wafer Area Shipments Fall for Fourth Consecutive Quarter (Nov 12, 2019)
- TSMC Board of Directors Meeting Resolutions (2019) (Nov. 12, 2019)
- Avnet Releases MaaXBoard for Embedded Computing, Edge AI Development (Nov. 12, 2019)
- Arasan Announces MIPI D-PHY IP compliant to the latest MIPI D-PHY v2.1 Specifications for TSMC 16nm (Nov 11, 2019)
- Accolade Technology Partners with Titan IC in Search Acceleration on FPGA-based SmartNICs and ATLAS Packet Conditioners (Nov 11, 2019)
- eSilicon to be Acquired by Inphi and Synopsys (Nov 11, 2019)
- Synopsys to Acquire Certain IP Assets from eSilicon (Nov 11, 2019)
- Palma Ceia SemiDesign to Showcase Complete NB-IoT Solution during Synopsys ARC Processor Summit in Beijing (Nov 11, 2019)
- Inphi to Acquire eSilicon, a Leading Provider of 2.5D Packaging, SerDes and Custom Silicon (Nov 11, 2019)
- MediaTek Delivers 112G Long Range SerDes IP, Silicon-Proven on 7nm for ASIC Services (Nov 11, 2019)
- Samsung Foundry Deploys Industry-Leading Synopsys TestMAX XLBIST Dynamic In-System Test Solution for Automotive Safety (Nov 11, 2019)
- Wireless 3D Integration - Making Stacking Silicon as Easy as Stacking Lego (2/2) (Nov. 11, 2019)
- MediaTek's World-Leading 8K DTV SoC in Volume Production on TSMC 12FFC Technology (Nov 08, 2019)
- TSMC October 2019 Revenue Report (Nov 08, 2019)
- UMC Reports Sales for October 2019 (Nov 08, 2019)
- Are Smartphones Equipped to Control a Vehicle? (Nov. 08, 2019)
- SmartDV to Exhibit at SemIsrael Expo, ICCAD China 2019 (Nov 07, 2019)
- CEVA, Inc. Announces Third Quarter 2019 Financial Results (Nov 07, 2019)
- Synopsys VC LP for Low Power Signoff Verification Delivers Up to 5X Runtime Gain at Samsung (Nov 07, 2019)
- Abaco Announces Industry's First 6U VPX Solution to Feature New Xilinx RF System-on-Chip Technology (Nov 07, 2019)
- GLOBALFOUNDRIES and SiFive to Deliver Next Level of High Bandwidth Memory on 12LP Platform for AI Applications (Nov 06, 2019)
- Marvell Completes Acquisition of Avera Semi (Nov 06, 2019)
- Top 5 Share of Semiconductor Industry Capex to Set New Record in 2019 (Nov 06, 2019)
- Announcing OpenTitan, the First Transparent Silicon Root of Trust (Nov 06, 2019)
- Cadence Announces Tempus Power Integrity Solution for Signoff Timing-Aware IR Drop Analysis (Nov 06, 2019)
- Wireless 3D Integration – Making Stacking Silicon as Easy as Stacking Lego (1/2) (Nov. 06, 2019)
- Applause's new AI solution helps tackle bias and sources data at scale (Nov. 06, 2019)
- Dream Chip Technologies (DCT) joins the Arm Functional Safety Partnership Program (Nov 05, 2019)
- IAR Systems delivers development from device to cloud through integration with Amazon Web Services (Nov 05, 2019)
- GUC Monthly Sales Report - Oct 2019 (Nov 05, 2019)
- AdaCore Introduces Support for C++ Embedded Environments (Nov 05, 2019)
- Rambus Reports Third Quarter 2019 Financial Results (Nov 05, 2019)
- Renesas and Altair Semiconductor Announce Collaboration for Cellular IoT Solutions (Nov 05, 2019)
- 6 MEMS and Sensors Startups on Fast Track to Grow (Nov. 05, 2019)
- Wearable AI market to cross $180bn frontier by 2025 (Nov. 05, 2019)
- Xilinx Alveo Accelerators Power SK Telecom's Real-Time AI-based Physical Intrusion and Theft Detection Service (Nov 04, 2019)
- Arasan Announces MIPI D-PHY IP compliant to the latest MIPI D-PHY v2.1 Specifications (Nov 04, 2019)
- Palma Ceia SemiDesign Establishes United Kingdom Center (Nov 04, 2019)
- Global Semiconductor Sales Increase 3.4 Percent Month-to-Month in September (Nov 04, 2019)
- UltraSoC furthers academic support with Europractice partnership (Nov 04, 2019)
- OPENEDGES unveils high performance & low power GDDR6 controller IP (Nov 04, 2019)
- Faraday Reports Third Quarter 2019 Financial Results (Nov 04, 2019)
- TSMC adding 8,000 new jobs as it focuses on 3nm and beyond (Nov. 04, 2019)
- Rambus Achieves Industry-Leading GDDR6 Performance at 18 Gbps (Oct 31, 2019)
- Cadence Presented with Four 2019 TSMC Partner of the Year Awards (Oct 31, 2019)
- AI Takes Over Linley Fall Processor Conference (Oct 31, 2019)
- CEVA Appoints Bernadette Andrietti to its Board of Directors (Oct 31, 2019)
- How to Choose Between AI Accelerators (Oct 31, 2019)
- China GDP and PMI Contraction A Risk Factor For Global Economy (Oct 31, 2019)
- DMP adopted for NEDO project of "Survey of issues for finding ideas regarding Technology Development for AI Chip and Next-generation Computing for High-efficiency and High-speed Processing" (Oct 31, 2019)
- China IC 'Big Fund' Phase II Aims Self-Sufficiency (Oct 31, 2019)
- The Linley Group Microprocessor Report Highlights BrainChip's Akida™ Spiking-Neural-Network Processor (Oct. 31, 2019)
- GLOBALFOUNDRIES Appoints Amir Faintuch as SVP and General Manager Leading Computing and Wired Infrastructure Business (Oct 30, 2019)
- Silex Insight Fast-track FIPS 140-2 Certification with NIST-Validated Crypto Coprocessor (Oct 30, 2019)
- Synopsys and AMD Execute Multi-Year ZeBu Emulation Agreement (Oct 30, 2019)
- Arm to Deliver CHERI-based Prototype to Tackle Security Threats (Oct 29, 2019)
- Synopsys Accelerates Cloud Computing SoC Designs with New Die-to-Die PHY IP in Advanced 7nm FinFET Process (Oct 29, 2019)
- Optima Design Automation Launches with Focus on Next-Generation Semiconductor Functional Safety Tools (Oct 29, 2019)
- AIC Semiconductor Licenses CEVA's 802.11ax Wi-Fi 6 IP for IoT Connectivity (Oct 29, 2019)
- Hex Five Adds MultiZone Security Isolation with Micron's Authenta Flash (Oct 29, 2019)
- 'The AI Inference Processor is Dead' (Oct 29, 2019)
- Achronix and BittWare Launch VectorPath Accelerator Card with Speedster7t FPGAs (Oct 29, 2019)
- Synopsys Ships More Than 3,000 HAPS-80 Prototyping Systems (Oct 29, 2019)
- TSMC and GLOBALFOUNDRIES Announce Resolution of Global Disputes Through Broad Global Patent Cross-License (Oct 29, 2019)
- Pre-Silicon Security Assessment (Oct. 29, 2019)
- Adesto Joins STMicroelectronics Partner Program to Accelerate Time-to-Market for Customers (Oct 29, 2019)
- David Zinsner Appointed to Credo Board of Directors (Oct 29, 2019)
- NSITEXE Achieves First-Pass Silicon Success for High-Performance Data Flow Processor-based SoC Test Chip Using DesignWare IP (Oct 28, 2019)
- Xilinx Envisions its Future Without Huawei (Oct 28, 2019)
- Dr. Necip Sayiner Joins Rambus Board of Directors (Oct 28, 2019)
- SiFive Announces New U8-Series Core IP For High-Performance Compute (Oct 28, 2019)
- Micron Introduces Industry's First Silicon-Based Security-as-a-Service Platform for IoT Edge Devices (Oct 28, 2019)
- North American Semiconductor Equipment Industry Posts September 2019 Billings (Oct 28, 2019)
- Micron Introduces Comprehensive AI Development Platform (Oct 28, 2019)
- Gidel Provides 3x Acceleration of FPGA and ASIC Development and Validation for Vision and Image Processing (Oct 28, 2019)
- Sofics Analog I/O's and ESD clamps proven for TSMC 16nm, 12nm and 7nm FinFET processes (Oct 28, 2019)
- Accellera Announces Standardization Initiative to Address Design Automation and Tool Interoperability for Functional Safety (Oct 28, 2019)
- PathPartner Technology to Showcase Driver and Passenger Safety Solutions at TU-Automotive Europe (Oct. 28, 2019)
- AES Encryption IP Cores from CAST Receive NIST Certification (Oct 24, 2019)
- Renesas Expands Access to Portfolio of Leading-Edge IP Licenses (Oct 24, 2019)
- Innosilicon's Broad IP Portfolio Qualified on GLOBALFOUNDRIES 12LP FinFET Platform for High-Performance Applications (Oct 24, 2019)
- VeriSilicon Releases Most Advanced FD-SOI Design IP Platform on GLOBALFOUNDRIES 22FDX for Edge AI and IoT Applications (Oct 24, 2019)
- TensorFlow gets native support for PowerVR GPUs via optimised open-source SYCL libraries (Oct 24, 2019)
- SiFive Announces New SiFive Shield For Modern SoC Design (Oct 24, 2019)
- Veriest experts presenting at DVCon Europe Conference (Oct 24, 2019)
- RISC-V Challenges And Opportunities (Oct. 24, 2019)
- New Arm IP brings intelligent, immersive experiences to mainstream markets (Oct 23, 2019)
- Astera Labs Accelerates PCI Express 5.0 System Deployment in Collaboration with Intel and Synopsys (Oct 23, 2019)
- TSMC Outlines 5nm Plans, 7nm and EUV Progress (Oct. 23, 2019)
- The Crucial Role of PUF in AIoT Security (Oct. 23, 2019)
- Attopsemi Published Two Papers About Innovative I-fuse™ 0.4V/1uA read and 250°C Bake Reliability Data on 22nm FD-SOI at IEEE S3S Conference, 2019. (Oct. 23, 2019)
- OPENEDGES and INNOSILICON unveil advanced DDR Controller and DDR PHY integrated IP solutions (Oct 22, 2019)
- Rambus Closes Sale of Payments and Ticketing Businesses to Visa (Oct 22, 2019)
- PHY Wireless Launched to Address Today's Real World Cellular Location and Capacity Challenges (Oct 22, 2019)
- Microchip's Low-Power Radiation-Tolerant (RT) PolarFire FPGA Enables High-Bandwidth Space Systems with Lower Total System Cost (Oct 22, 2019)
- Synopsys Launches New ARC VPX DSP Processor IP for High-performance Signal Processing SoC Designs (Oct 22, 2019)
- Cadence Reports Third Quarter 2019 Financial Results (Oct 22, 2019)
- USC ISI The MOSIS Service and Samsung Foundry collaborate to spur microelectronics innovation in the US (Oct 22, 2019)
- CEVA Celebrates Wireless IoT Milestone, Surpassing 100 Licensing Deals for its Bluetooth and Wi-Fi Technologies (Oct 22, 2019)
- Chips&Media Delivers The World's First Commercial AV1 Hardware Decoder IP, WAVE510A (Oct 22, 2019)
- BrainChip Awarded New Patent for Artificial Intelligence Dynamic Neural Network (Oct 22, 2019)
- Cadence Announces First-to-Market NVMe 1.4 Verification IP for High-Performance Computing (Oct 22, 2019)
- Dialog further extends IoT influence, acquires Creative Chips for $80m cash (Oct. 22, 2019)
- GCC support for the draft Bit Manipulation Extension for RISC-V (Oct. 22, 2019)
- Samsung wants to rally more fabless customers (Oct 21, 2019)
- TSMC Recognizes Synopsys with Four "Partner of the Year" Awards (Oct 21, 2019)
- Shanghai FD-SOI Forum 2019 – the Full Recap (Oct. 21, 2019)
- Cadence 3D-IC Advanced Packaging Integration Flow Certified by Samsung Foundry for its 7LPP Process Technology (Oct 18, 2019)
- Cadence Automotive Reference Flow Certified by Samsung Foundry for Advanced-Node Design Creation (Oct 18, 2019)
- M31 Memory Compiler and GPIO are certified with ASIL-D safety level of ISO 26262 (Oct 17, 2019)
- SmartDV Heads to DVCon Europe to Showcase VIP Support for Verilator and TileLink, Demonstrate Smart ViPDebug Protocol Debugger (Oct 17, 2019)
- Locix using Imagination's Ensigma Wi-Fi IP for high-performance local positioning (Oct 17, 2019)
- The Benefits of C-Fuse OTP in IoT, FinTech, and Biometric Applications with High Security Feature (Oct 17, 2019)
- Silex Insight Introduces Hardware Security Module (HSM) for Xilinx FPGA Devices (Oct 17, 2019)
- SEAKR Selects Rambus SerDes and Security IP for Aerospace and Satellite Communications (Oct 17, 2019)
- Lattice MachXO3D Secure Control FPGA Receives Security Certification from NIST (Oct 17, 2019)
- Consortium to Set APIs for AV Hardware (Oct. 17, 2019)
- Cadence Custom/AMS Flow Certified for Samsung 5LPE Process Technology (Oct 17, 2019)
- TSMC Reports Third Quarter EPS of NT$3.90 (Oct 17, 2019)
- Synopsys Design Platforms Enabled for Samsung Foundry 2.5D-IC Multi-Die Integration (Oct 17, 2019)
- Wafer Capacity by Feature Size Shows Rapid Growth at <10nm (Oct 17, 2019)
- X-FAB Adds Non-Volatile Memory Functions to its 180nm BCD-on-SOI Platform (Oct 17, 2019)
- Confidential Computing Consortium Establishes Formation with Founding Members and Open Governance Structure (Oct 17, 2019)
- Samsung Foundry and Synopsys Deliver Comprehensive Automotive Solutions for Autonomous Driving and ADAS (Oct 17, 2019)
- CHIPS Alliance Growth Continues With New Members and Design Workshop this November (Oct 16, 2019)
- Numem Inc. Exhibits at Samsung Foundry SAFE FORUM 2019 (Oct 16, 2019)
- sureCore PowerMiser Low Power SRAM IP Now on Samsung 28nm FDS Process Technology (Oct 16, 2019)
- Silicon IP Provider Allegro DVT Acquires Amphion Semiconductor to Create a New Leader in the Video Codec IP Space (Oct 16, 2019)
- QuickLogic Teams with SiFive to Make eFPGA Technology Available via DesignShare Portfolio (Oct 16, 2019)
- Brite Semiconductor Begins Mass Production of Smart Meter Chips (Oct 16, 2019)
- 360 Reality Audio Immersive Music Services and Devices Announced with MPEG-H (Oct. 16, 2019)
- ON Semi and AImotive hook up on autonomous cars (Oct. 16, 2019)
- View from Brussels: EU refuses to play 5G blame game (Oct. 16, 2019)
- Mercury Systems Announces Strategic Investment in Trusted Microelectronics Technology Innovation (Oct 15, 2019)
- Imagination announces second generation IEEE 802.11n Wi-Fi IP designed for low-power applications (Oct 15, 2019)
- Synopsys Introduces Native Automotive Solutions Optimized for Efficient Design of Autonomous Driving and ADAS SoCs (Oct 15, 2019)
- NXP to Adopt Synopsys' Native Automotive Design Solutions for Next-generation Safety-critical SoCs (Oct 15, 2019)
- BrainChip Introduces First in a Revolutionary New Breed of Neuromorphic Computing Devices at the Linley Processor Conference (Oct 15, 2019)
- TSMC Leads in Adoption of EUV (Oct. 15, 2019)
- Infineon announces new microcontroller optimized for automotive 77 GHz radar applications (Oct. 15, 2019)
- AMBA moves forward with major revisions to AXI and CHI specifications (Oct. 15, 2019)
- Aspects of machine learning on the edge (Oct. 15, 2019)
- GLOBALFOUNDRIES Acquires Smartcom's PDK Engineering Team to Expand Worldwide Design Enablement Capacity (Oct 14, 2019)
- Arm Responds to RISC-V, and More (Oct 14, 2019)
- Samsung To Fabricate RISC-V Chip With 14LPP In Partnership With SemiFive (Oct. 14, 2019)
- Don't Miss SOI Consortium's Japan Event: 30-31 October '19, Yokohama (Oct. 14, 2019)
- Ksmartech, Leading Korean Developer Partners with Verimatrix to Offer Powerful App Security Technology for Automotive, Financial Markets (Oct. 14, 2019)
- When Your Teenage Robot Can Drive (Oct. 13, 2019)
- 2019 Microprocessor Slump Snaps Nine Years of Record Sales (Oct 11, 2019)
- Achronix, Cisco, Facebook, Netronome, NXP and zGlue Collaborate on Proof-of-Concept for Chiplet Solutions as Part of OCP ODSA Subproject (Oct 10, 2019)
- GLOBALFOUNDRIES Qualifies Synopsys Fusion Design Platform on 12LP FinFET Platform (Oct 10, 2019)
- GLOBALFOUNDRIES and Racyics GmbH Demonstrate Ultra-Low-Power Microcontroller for the Internet of Things (Oct 10, 2019)
- Samsung Introduces Advanced Automotive Foundry Solutions Tailored to EMEA Market at Samsung Foundry Forum 2019 Munich (Oct 10, 2019)
- GLOBALFOUNDRIES Brings New Level of Security and Protection on 22FDX Platform for Connected Systems (Oct 10, 2019)
- UMC Reports Sales for September 2019 (Oct 09, 2019)
- TSMC September 2019 Revenue Report (Oct 09, 2019)
- Cadence Collaborates with Arm and Samsung Foundry on Delivery of 5LPE Flow for Mission-Critical Applications Using Next-Generation "Hercules" CPU (Oct 09, 2019)
- Renesas Electronics Unveils RA Family of 32-Bit Arm Cortex-M Microcontrollers with Superior Performance and Advanced Security for Intelligent IoT Applications (Oct 09, 2019)
- Enterprises are leaving IoT devices vulnerable to cybersecurity threats, finds nCipher Security (Oct. 09, 2019)
- IEEE SOI Conference takes place 14-17 October 2019 (Oct. 09, 2019)
- Qorvo Acquires Cavendish Kinetics, Inc. (Oct 08, 2019)
- Dream Chip Technologies joined Samsung Foundry's Design Solution Partner (DSP) Program (Oct 08, 2019)
- IC'Alps joins Arm Approved Design Partner program to better support customers with ASIC development (Oct 08, 2019)
- Synopsys, Arm, and Samsung Foundry Enable Accelerated Development of Next-Generation Arm "Hercules" Processor on 5LPE Process (Oct 08, 2019)
- Silex Insight and Medium Inc. accelerate towards 1 million ECDSA signature verifications per second on a blockchain (Oct. 08, 2019)
- CCIX Consortium Releases CCIX Base Specification Revision 1.1 Version 1.0 with Support for 32GT/s (Oct. 08, 2019)
- A Total Compute approach to delivering digital immersion under a common architecture (Oct 08, 2019)
- Arm and silicon partners collaborate on IoT development through new Mbed OS Partner Governance model (Oct 08, 2019)
- Collaborating for an autonomous future: Arm and industry leaders establish the Autonomous Vehicle Computing Consortium (Oct 08, 2019)
- UltraSoC announces next-generation hardware-based cybersecurity products (Oct 08, 2019)
- Arm Announces Custom Instructions for embedded CPUs and Mbed OS Partner Governance (Oct 08, 2019)
- Samsung Electronics Announces Earnings Guidance for 3Q 2019 (Oct. 08, 2019)
- Mentor boosts 64-bit Arm-based server platform by enabling Arm architecture support for Questa simulation tools (Oct. 08, 2019)
- US adds Chinese AI firms to ban list citing abuses against Muslims in Xinjiang (Oct. 08, 2019)
- MIPI Alliance Advances Activities for ADAS, ADS and Other Automotive Applications (Oct. 08, 2019)
- Synopsys to Showcase Optimized Solutions for Arm-based Designs at Arm TechCon 2019 (Oct 07, 2019)
- GUC Monthly Sales Report - Sep 2019 (Oct 07, 2019)
- Dialog Semiconductor to Acquire Creative Chips adding Industrial IoT Products to its Portfolio (Oct 07, 2019)
- Achronix Exhibits High-Performance FPGA and eFPGA IP Solutions at Arm TechCon (Oct 07, 2019)
- Synopsys Announces Industry-First Unified Functional Safety Verification Solution to Accelerate Time-to-Certification for IPs and SoCs (Oct 07, 2019)
- TSMC's N7+ Technology is First EUV Process Delivering Customer Products to Market in High Volume (Oct 07, 2019)
- Adesto Engages with the European Space Agency to Develop Next-Generation Satellite Communications Technology (Oct 07, 2019)
- Moortec to Showcase its Latest Embedded PVT Monitoring IP for 40nm-5nm at the 2019 ARM TechCon in San Jose (Oct 07, 2019)
- LG Launched Phone Powered by Gyrfalcon Technology Inc.'s AI Chip (Oct. 07, 2019)
- ESA Contract Awarded for High-Performance Compute Board (Oct. 07, 2019)
- Verimatrix nTitleMe Receives Perfect Score from Broadband Technology Report’s Diamond Technology Reviews 2019 (Oct. 07, 2019)
- How China is aiming for a state of technological independence (Oct. 07, 2019)
- CAN to TSN Gateway from CAST Bridges CAN 2.0/FD Buses with Time Sensitive Ethernet (Oct 04, 2019)
- IP Controller Core CAN 2.0b and CAN FD of Fraunhofer IPMS certified according to ISO security standard (Oct. 03, 2019)
- Synopsys Completes Acquisition of QTronic GmbH (Oct 03, 2019)
- Silicon Creations Named 2019 TSMC Partner of the Year for Analog / Mixed-Signal IP (Oct 03, 2019)
- Los Alamos National Laboratory Teams with Arm to Develop Tailored, Efficient Processor Architectures (Oct 03, 2019)
- NXP Launches the GHz Microcontroller Era (Oct 03, 2019)
- Xilinx Announces Vitis - a Unified Software Platform Unlocking a New Design Experience for All Developers (Oct 02, 2019)
- M31 Technology Won TSMC's 2019 Partner of the Year Award for Specialty Process IP (Oct 02, 2019)
- Adesto and Cadence Collaborate to Expand xSPI Ecosystem for Emerging IoT Devices (Oct. 02, 2019)
- SmartDV Adds Support for Verilator Open Source HDL Verilog Simulator (Oct 01, 2019)
- TSMC Files Complaints Against GlobalFoundries in U.S., Germany and Singapore for Infringement of 25 Patents to Affirm its Technology Leadership and to Protect Its Customers and Consumers Worldwide (Oct. 01, 2019)
- HDL Design House Appoints Frank Werner as Worldwide Sales Director (Oct 01, 2019)
- Global Semiconductor Sales Down 15.9 Percent Year-to-Year in August (Oct 01, 2019)
- Andes Technology and Tiempo Secure Announce Strategic Partnership to Enhance RISC-V Platform Security up to CC EAL5+ Certification (Oct. 01, 2019)
- How big data and IoT initiatives render the 'garbage in, garbage out' theory invalid (Oct. 01, 2019)
- Announcing the Winners of the RISC-V Soft CPU Contest (Oct. 01, 2019)
- Total Wafer Shipments to Drop 6 Percent in 2019, Resume Growth in 2020, Set New High in 2022, SEMI Reports (Sep 30, 2019)
- Huawei & Arm Meet Behind Closed Doors (Sep 30, 2019)
- New Lattice CrossLinkPlus FPGAs Accelerate and Enhance Video Bridging for World-class MIPI-based Embedded Vision Systems (Sep 30, 2019)
- Live webinar from Dolphin Design: Pushing the limit of SoC energy efficiency with a NEW secret technique (Sep 30, 2019)
- XMOS secures $19M funding to accelerate growth (Sep 30, 2019)
- SiFive Enables Embedded Vision With New DesignShare Partners (Sep 30, 2019)
- Synopsys Introduces PrimeECO Solution for Zero-Iteration Signoff-Driven Design Closure (Sep 30, 2019)
- Titan IC to Accelerate Pattern and String Matching on Mellanox's New BlueField-2 I/O Processing Unit (IPU) Device (Sep 30, 2019)
- UltraSoC selected by Japan's NSITEXE for automotive development (Sep 30, 2019)
- Gen-Z Physical Layer Specification 1.1 now available for download (Sept. 30, 2019)
- Globalfoundries to IPO (Sept. 30, 2019)
- Going All-in with Edge AI (Sept. 30, 2019)
- Software infuses AI into high-performance computing (Sept. 30, 2019)
- Accurate Current Detection for Motor Control, Battery Life (Sept. 30, 2019)
- AI-Based Soft Switching Cuts Losses to Extend EV Range (Sept. 30, 2019)
- GLOBALFOUNDRIES Achieves More Than $1 Billion in Design Wins for 45RFSOI Solution for Mobile and Wireless Infrastructure Applications (Sep 27, 2019)
- Multiple Mentor product lines now certified on TSMC's most advanced processes (Sep 27, 2019)
- Sofics releases pre-silicon analog I/O's for high-speed SerDes for TSMC N5 process technology (Sep 27, 2019)
- Data Compression Accelerators from CAST Now Available on Xilinx Alveo Boards (Sep 27, 2019)
- GLOBALFOUNDRIES Appoints Michael Hogan as SVP and General Manager to Support New Market Engagement Strategy (Sep 27, 2019)
- Lattice Semiconductor and Synopsys Renew Partnership on FPGA Synthesis Tools (Sep 26, 2019)
- TSMC's Leading-Edge Fab Investments Set Stage for Sale Surge in 2H19 (Sep 26, 2019)
- Rambus Tapes Out 112G XSR SerDes PHY on Leading-edge 7nm Process (Sep 26, 2019)
- Truechip Announces First Customer Shipment of CXL Verification IP (Sep 26, 2019)
- Adesto Reaches Shipment Milestone of One Billion Non-Volatile Memory Devices (Sept. 26, 2019)
- Synopsys and TSMC Collaborate for Certification on 5nm Process Technologies to Address Next-generation HPC, Mobile Design Requirements (Sep 26, 2019)
- Analog Bits Showcases Silicon of Analog and Mixed Signal IP Products on TSMC N7 Process Targeting Automotive Grade with Split Corner Lots and PVT Characterization Results Available (Sep 26, 2019)
- SiFive Announces Key Enablement Of Trace And Debug (Sep 26, 2019)
- Moortec to Showcase its Advances in Embedded PVT Monitoring IP for 40nm-5nm at 2019 TSMC Open Innovation Platform Ecosystem Forum in Santa Clara (Sep 26, 2019)
- Arm and TSMC Demonstrate Industry's First 7nm Arm-based CoWoS Chiplets for High-Performance Computing (Sep 26, 2019)
- Synopsys and TSMC Collaborate to Develop Portfolio of DesignWare IP for TSMC 5nm FinFET Plus (N5P) Process (Sep 26, 2019)
- New Version of Most Widely Used Camera and Imaging Interface - MIPI CSI-2 - Designed to Build Capabilities for Greater Machine Awareness (Sep 26, 2019)
- Veriest announces opening of Budapest office (Sep 25, 2019)
- CEO Leaves Wave, Putting MIPS' Future in Doubt (Sep 25, 2019)
- Synopsys Extends Portfolio of Cloud Computing IP with 112G Ethernet PHY for Hyperscale Data Center SoCs (Sep 25, 2019)
- Achronix Joins TSMC IP Alliance Program (Sept. 25, 2019)
- European Space Agency Selects AdaCore's Qualified Multitasking Solution for Spacecraft Software Development (Sep 25, 2019)
- UMC Receives Final Approval for 100% Acquisition of Mie Fujitsu Semiconductor (Sep 25, 2019)
- Kandou Secures $56 Million in Series C Funding (Sep 25, 2019)
- M31 Technology Develops Optimized IP Solutions on Multiple TSMC Specialty Processes (Sep 25, 2019)
- Breker Verification Systems Unveils Intelligent Regression Optimization Solution to Accelerate Simulation, Emulation Execution (Sep 25, 2019)
- Evaluation Boards Now Available for Flex Logix EFLX4K eFPGA on GLOBALFOUNDRIES' Most Advanced FinFET Platform (Sept. 25, 2019)
- Andes and Dover Microsystems Partner to Deliver Professional Network Security Solution for RISC-V (Sept. 25, 2019)
- Cadence Digital and Signoff Full Flow and Custom/Analog Tools Certified for TSMC N6 and N5/N5P Process Technologies (Sep 25, 2019)
- Moortec to Showcase its Advances in Embedded PVT Monitoring IP for 40nm-5nm at 2019 TSMC Open Innovation Platform® Ecosystem Forum in Santa Clara (Sept. 25, 2019)
- No-Shows Blight AI Hardware Summit (Sept. 25, 2019)
- Alibaba unveils new AI chip aimed at speeding up e-commerce and cloud computing tasks (Sept. 25, 2019)
- CSEM joins GLOBALFOUNDRIES' FDXcelerator Program bringing ultra-lowPower IP to 22FDX process (Sept. 24, 2019)
- Andes Technology Features 32-bit A25MP and 64-bit AX25MP RISC-V Multicore Processors With Andes Custom Extension at TSMC 2019 Open Innovation Platform Ecosystem Forum (Sept. 24, 2019)
- eMemory Wins 2019 TSMC IP Partner of the Year Award (Sep 24, 2019)
- GLOBALFOUNDRIES Introduces 12LP+ FinFET Solution for Cloud and Edge AI Applications (Sept. 24, 2019)
- Analog Bits and Aragio Solutions Team Up with GLOBALFOUNDRIES to Deliver Automotive IP Solutions (Sep 24, 2019)
- Synergy between the Arm ecosystem and OCP communities to support the growth of compute infrastructure (Sept. 24, 2019)
- Tessolve Proudly Announces The Launch Of 'Qubo' By It's Parent Company Hero Electronix (Sept. 24, 2019)
- Avery Design Introduces CXL VIP (Sep 23, 2019)
- Avery Design Partners with Marquee Semiconductor to Provide Sales, Support in India, and Deepens its Relationship to Prime Marquee's SoC Solution Platform (Sep 23, 2019)
- Cambridge Consultants Becomes Arm Approved Design Partner (Sep 23, 2019)
- Spectral Design and Test Inc., Announces a New Family of MemoryIP Targeted at the 5G Market (Sep 23, 2019)
- IAR Systems launches functional safety tools for STMicroelectronics' 8-bit MCUs (Sep 23, 2019)
- Rambus Announces Portfolio of Advanced Memory and SerDes PHYs on TSMC N7 Process (Sep 23, 2019)
- Silicon Creations to Showcase PLL Developments on 22nm to 5nm Processes at TSMC 2019 Open Innovation Platform Ecosystem Forum (Sep 23, 2019)
- eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects (Sep 23, 2019)
- Moortec Drives Optimised Performance & Increased Device Reliability on TSMC's N5 and N5P Process Technologies with its Complete In-Chip Monitoring Subsystem (Sep 23, 2019)
- Dolphin Integration becomes Dolphin Design (Sep 23, 2019)
- North American Semiconductor Equipment Industry Posts August 2019 Billings (Sep 23, 2019)
- Xilinx Announces Chief Financial Officer Transition (Sep 20, 2019)
- Intel Ships Stratix 10 DX FPGAs; VMware Among Early Partners (Sep 20, 2019)
- Alphawave IP Announces Industry Veteran and Marvell Founder Dr. Sehat Sutardja Has Joined Its Board of Directors (Sep 20, 2019)
- Attopsemi Technology Presented "I-fuse: Dream OTP Finally Comes True" and won the best Innovative IP award on IP SoC 2019 China (Sep 20, 2019)
- CAST CAN 2.0/FD Bus IP is Safety-Ready with ISO 26262 Certification (Sep 20, 2019)
- ECOC 2019: eSilicon to Demonstrate 7nm 58G DSP-Based SerDes Over Seven-Meter and Three-Meter Samtec Cable Assemblies (Sep 19, 2019)
- SEGGER Makes Its Entire Ecosystem of Tools Available for AndesCores (Sep 19, 2019)
- Semiconductor Acquisitions Regain Momentum in 2019 (Sep 19, 2019)
- 5G和电动汽车市场快速发展，SOI晶圆会缺货吗？ (Sept. 19, 2019)
- Intensivate Engages SiFive's RISC-V Expertise to Develop Leading Accelerator (Sep 19, 2019)
- Veriest kick-starts Formal Verification methodology at Valens (Sep 18, 2019)
- Faraday's SoC Projects Doubled for Three Consecutive Years (Sep 18, 2019)
- Compute Express Link Consortium (CXL) Officially Incorporates; Announces Expanded Board of Directors (Sep 18, 2019)
- 5倍产能爬坡，FD-SOI的体量又庞大了一圈 (Sept. 18, 2019)
- Mixel's MIPI D-PHY IP Integrated into Microsoft's Azure Kinect DK Depth Camera (Sep 17, 2019)
- Notes from 7th Shanghai FD-SOI Forum held on September 16, 2019 (Sept. 17, 2019)
- Infineon and Synopsys Collaborate to Accelerate Artificial Intelligence in Automotive Applications (Sep 17, 2019)
- Alphawave IP Announces Industry Veteran and Marvell Founder Dr. Sehat Saturdja Has Joined Its Board of Directors (Sep 17, 2019)
- CEVA Introduces New AI Inference Processor Architecture for Edge Devices with Co-processing Support for Custom Neural Network Engines (Sep 17, 2019)
- SmartDV Announces Availability of Ethernet TSN Design IP (Sep 17, 2019)
- ESD Alliance Reports EDA Industry Revenue Increase for Q2 2019 (Sep 17, 2019)
- LIWEST Becomes Latest Austrian Operator to Evolve IPTV Security with Verimatrix and Ocilion (Sept. 17, 2019)
- Intrinsic ID Security Summit 2019 (Sept. 17, 2019)
- UltraSoC opens engineering center in Poland and accelerates its global expansion (Sep 16, 2019)
- Fabs Valued at Nearly $50 Billion to Start Construction in 2020 (Sep 16, 2019)
- Sri Lanka Telecom Selects Proven Partner Ecosystem to Deploy Large Scale TV Everywhere Experience in Island Nation (Sep 16, 2019)
- Arm Flexible Access for Research to accelerate innovation for academia and research (Sep 16, 2019)
- Synopsys Simplifies Automotive SoC Development with New ARC Functional Safety Processor IP (Sep 16, 2019)
- Synopsys' New Embedded Vision Processor IP Delivers Industry-Leading 35 TOPS Performance for Artificial Intelligence SoCs (Sep 16, 2019)
- Wi-Fi CERTIFIED 6 delivers new Wi-Fi era (Sep 16, 2019)
- GOWIN Semiconductor Announces their GoAI Solution for AI Acceleration at the Edge (Sep 16, 2019)
- Silvaco Partners with HDL Design House for Analog and Digital IC Design Services (Sep 16, 2019)
- Socionext Adds 8K Encoding Feature to M820L Media Accelerator Card (Sep 16, 2019)
- Moortec Announces Lee Vick as their New VP of North America Sales (Sep 16, 2019)
- India Branching Out into Chip Design (Sep 16, 2019)
- AI Hardware Summit 2019: Booth-to-Booth eSilicon 58G DSP-Based SerDes Demonstration Over a Five-Meter Samtec Copper Cable (Sep 16, 2019)
- SiTune Passes Milestone of Shipping Two Million 8K TV Silicon Tuners (STN6528) (Sep 16, 2019)
- Advantech accelerates the move to IP with Adeas/Nextera ST2110/NMOS Core (Sep 16, 2019)
- 剪刀手"拍照泄露指纹信息？辟谣来了！ (Sept. 16, 2019)
- Synopsys ARC Embedded Vision Processors Deliver 35 TOPS (Sept. 16, 2019)
- Tasking Lives Up To Its Promises (Sept. 13, 2019)
- Leading the Digital Transformation of the Car at IAA Frankfurt (Sept. 13, 2019)
- MIT engineers build advanced microprocessor out of carbon nanotubes (Sep 12, 2019)
- AI Chip Market to More than Double in 5 Years (Sep 12, 2019)
- Verimatrix signs a binding agreement to sell its Silicon IP business unit to Rambus (Sep 12, 2019)
- AGIC C-Fuse OTP High-Temperature-Immunity Tailored for AEC-Q100 Grade 0 Applications (Sep 12, 2019)
- Rambus Signs Agreement to Acquire Silicon IP and Secure Protocols Business from Verimatrix (Sep 12, 2019)
- Second Quarter 2019 Worldwide Semiconductor Equipment Billings of $13.3 Billion Down 20 Percent from 2018, 3 Percent from Prior Quarter (Sep 12, 2019)
- Silex Insight releases ARIA crypto engine for the Korean market (Sep 12, 2019)
- Samsung's (Very!) Good 28FDS News Just Keeps Coming (Sept. 12, 2019)
- SmartDV to Demonstrate TileLink Verification IP for RISC-V Based Systems, Smart ViPDebug Protocol Debugger at DVCon India (Sep 11, 2019)
- MIPI Alliance Opens Access to its Debug and Trace Specifications (Sep 11, 2019)
- Western Digital Accelerates Leadership in Next-Generation Data Center Architectures With Acquisition of Kazan Networks (Sep 11, 2019)
- JEDEC Announces Publication of Serial Presence Detect Support and Module Labels Specifications to Support New Hybrid Memory (NVDIMM) (Sep 11, 2019)
- Synopsys Delivers Industry's First Compute Express Link (CXL) IP Solution for Breakthrough Performance in Data-Intensive SoCs (Sep 11, 2019)
- IAR Systems updates RISC-V development tools (Sept. 11, 2019)
- Memory Forecast to Account for 43% of Total 2019 Semi Spending (Sep 10, 2019)
- Swift Media Reinvests in Verimatrix with VCAS Ultra Upgrade and Expansion (Sep 10, 2019)
- WiSig Networks License CEVA's Cellular IoT Technology to Serve the India Market (Sep 10, 2019)
- Swift Navigation Partners with Arm to Bring Precise Positioning Technology to Autonomous Vehicle Compute Platforms (Sep 10, 2019)
- TSMC August 2019 Revenue Report (Sep 10, 2019)
- Agile Analog welcomes Sir Hossein Yassaie, former Imagination Technologies Founder and CEO, to its Board (Sep 10, 2019)
- HCL Technologies to acquire Sankalp Semiconductor to enhance leadership in the semiconductors and industrial IoT spaces (Sep 10, 2019)
- The Journey of RISC-V Implementation (Sept. 10, 2019)
- Apple Will Be Hard-Pressed to Build a Rock Star 5G Modem (Sep 09, 2019)
- Synopsys Collaborates with Google Cloud to Broadly Scale Cloud-based Functional Verification (Sep 09, 2019)
- Kandou Announces Development of USB4 Retimer (Sep 09, 2019)
- UMC Reports Sales for August 2019 (Sep 09, 2019)
- PLDA Achieves PCI Express 4.0 Compliance for its XpressRICH PCIe Controller IP During the First Official PCI-SIG PCIe 4.0 Compliance Workshop (Sep 09, 2019)
- eMemory IP Garners Most Stringent Level of Certification for Automotive Applications (Sep 09, 2019)
- Huawei, Qualcomm, Samsung Reveal Integrated 5G Chips (Sep 09, 2019)
- Rambus Reports Inducement Grants under NASDAQ Listing Rule 5635(c)(4) (Sep 09, 2019)
- PUFsecurity Leverages NeoPUF to Lead Hardware Security Technology (Sep 06, 2019)
- Imagination launches game-changing IMG Edge services platform for design verification and validation (Sep 06, 2019)
- Palma Ceia SemiDesign Receives "Excellent Solution Award" at Internet of Things and Smart City Exhibition in Shenzhen (Sep 05, 2019)
- Vidatronic and IP-Semantics Join Forces in California's Silicon Valley (Sep 05, 2019)
- GUC Monthly Sales Report - Aug 2019 (Sep 05, 2019)
- CacheQ Debuts Heterogeneous Compute Development Environment (Sep 05, 2019)
- Veriest collaborates with MINRES on RISC-V development (Sep 05, 2019)
- Silex Insight and Wave Computing Collaborate to Deliver Security-Conscious Artificial Intelligence (AI) Platforms Across Enterprise and Automotive Markets (Sep 05, 2019)
- Edgewater Expands into Licensing of Breakthrough IP (Sep 05, 2019)
- Nations Technologies Selects QuickLogic's ArcticPro eFPGA to Power its Next Generation Low Power IoT SoC (Sep 04, 2019)
- Global Semiconductor Sales Decrease 15.5 Percent Year-to-Year in July (Sep 04, 2019)
- InnoGrit adopts M31's optimization solutions of PCIe 4.0/3.0 and ONFi 4.1 I/O IP cores for Artificial Intelligence Storage chips (Sep 04, 2019)
- Rambus to Acquire Silicon IP and Secure Protocols Business From Verimatrix, Creating Global Authority in Semiconductor Security IP (Sep 04, 2019)
- Credo Announces Production Availability of HiWire Active Electrical Cables (Sep 04, 2019)
- Verimatrix Enters into Exclusivity Agreement to Sell its Silicon IP Business Unit to Rambus (Sep 04, 2019)
- NASA awards five 2019 SBIR/STTR Phase I research programs to Alphacore (Sep 04, 2019)
- VESA Updates DisplayHDR Standard with Tighter Specifications and New DisplayHDR 1400 Performance Level (Sep 04, 2019)
- High-Efficiency Power Management for Electric Vehicles (Sept. 04, 2019)
- Seeed Releases Sipeed's Longan Nano RISC-V Development Board (Sept. 04, 2019)
- RISC-V for everybody (Sept. 04, 2019)
- Nvidia Turns to RISC-V for RC18 Research Chip IO Core (Sept. 04, 2019)
- IP Security Assurance Standard (Sept. 04, 2019)
- Details of Hailo AI Edge Accelerator Emerge (Sep 03, 2019)
- Credo Announces the HiWire Consortium for Standardization and Certification of Active Electrical Cables (AEC) (Sep 03, 2019)
- Brite Semiconductor and Synopsys Extend IP OEM Partnership (Sep 03, 2019)
- USB-IF Announces Publication of USB4 Specification (Sep 03, 2019)
- 300mm Fab Equipment Spending to Seesaw, Reach New Highs in 2021 and 2023, SEMI Reports (Sep 03, 2019)
- Synopsys Enables First-Pass Silicon Success of High Performance NSITEXE Data Flow Processor-based SoC Test Chip for Autonomous Driving (Sep 03, 2019)
- Healthcare IoT requires stronger security strategies against cyberattacks, says Irdeto Research (Sept. 03, 2019)
- ProtectMyApp From Verimatrix Wins Gold in 2019 International Business Awards (Sept. 03, 2019)
- Verimatrix Integrates Multi-DRM with Amazon Web Services Elemental Secure Packager Encoder Key Exchange (SPEKE) API (Sep 02, 2019)
- Keysight Technologies, Kandou Bus Collaborate to Advance Chord Signaling Technology for High-Speed Digital Applications (Sep 02, 2019)
- Moortec's 28nm Embedded Thermal Sensing Solution selected by InnoGrit to Optimise Performance and Reliability in their latest SSD Controller Chip (Sep 02, 2019)
- GlobalFoundries' Goal: Harass TSMC Customers (Sep 02, 2019)
- Gartner forecasts explosion in enterprise and automotive IoT endpoint usage (Sept. 02, 2019)
- Intel Ships First 10nm Agilex FPGAs (Aug 30, 2019)
- Full support for first flash-based RISC-V microcontroller (Aug. 30, 2019)
- SMIC Announces Unaudited 2019 Interim Results (Aug 29, 2019)
- Sean Fan Joins Rambus as Chief Operating Officer (Aug 29, 2019)
- Global Top Ten IC Design Companies for 2Q19 Ranked by Revenue Released, with Top Five Registering Revenue Fall, Says TrendForce (Aug 29, 2019)
- Researchers build RISC-V chip from carbon nanotubes (Aug. 29, 2019)
- BFloat16 processing for Neural Networks on Armv8-A (Aug. 29, 2019)
- Machine vision utilising artificial intelligence (Aug. 29, 2019)
- Global Foundries/TSMC Wrangle Seen Dragging Industry Down (Aug 28, 2019)
- Mellanox Technologies Selects Verimatrix Silicon IP to Secure Family of Chipsets (Aug 28, 2019)
- Sofics releases pre-silicon analog I/O's for high-speed SerDes for 5nm FinFET technology (Aug 28, 2019)
- AndesCore N22 RISC-V Core Supports RV32IMAC or RV32EMAC Instruction Sets (Aug. 28, 2019)
- Homomorphic Encryption Finally Ready for Commercial Adoption (Aug. 28, 2019)
- Blockchain Bolstering the Internet of Things (Aug. 28, 2019)
- Arasan and Xilinx announce their design win in providing a Total UFS 3.0 Solution to Wuhan Jingce (Aug 27, 2019)
- TSMC Will Vigorously Defend its Proprietary Technology in Response to GlobalFoundries Complaints (Aug 27, 2019)
- sureCore Unveils Low Power Design Service (Aug 27, 2019)
- GigaDevice unveils the GD32V series with RISC-V core, in a brand new 32bit general purpose microcontroller (Aug 27, 2019)
- Creonic Participates in National Research Project KI-Radar (Aug 27, 2019)
- Rambus Completes Acquisition of Northwest Logic, Extending Leadership in Interface IP (Aug 27, 2019)
- RISC-V Bases and Extensions Explained (Aug. 27, 2019)
- RISC-V Is Experiencing a Period of Optimism and Growth with Global Revenue Expected to Reach $1.1 Billion by 2025, According to Tractica (Aug. 27, 2019)
- Blog: AI's Memory Problem (Aug. 27, 2019)
- Sofics releases analog I/O's for high-speed SerDes in TSMC N5 FinFET technology (Aug 26, 2019)
- Does Your AI Chip Have Its Own DNN? (Aug 26, 2019)
- GLOBALFOUNDRIES Files Patent Infringement Lawsuits Against TSMC In the U.S. and Germany (Aug 26, 2019)
- DARPA unveils first SSITH prototype to mitigate hardware flaws (Aug. 23, 2019)
- Next Generation Video Codec Standard Proposed: MPEG Video Coding for Machines (VCM) (Aug 22, 2019)
- Synopsys Posts Financial Results for Third Quarter Fiscal Year 2019 (Aug 22, 2019)
- Qualcomm And LGE Enter Into a New Global Patent License Agreement (Aug 22, 2019)
- HDL Design House Introduces Expandable SoC IoT Platform (Aug 22, 2019)
- Porsche Invests in Israeli Startup TriEye to Increase Road Visibility and Safety (Aug 22, 2019)
- Meet EnSilica at TI Automotive, India 2019 (Aug. 22, 2019)
- Is It Time to Forget about Huawei? (Aug 22, 2019)
- Creonic Demonstrates its Beyond 5G FEC IP at the EuCNC Conference (Aug 22, 2019)
- Unlocking Cortex-A53's Safety Potential (Aug. 22, 2019)
- How to Design SmartNICs Using FPGAs to Increase Server Compute Capacity (WP017) (Aug. 22, 2019)
- Top-15 Semiconductor Suppliers' Sales Fall by 18% in 1H19 (Aug 21, 2019)
- Western Digital's Long Trip from Open Standards to Open Source Chips (Aug. 21, 2019)
- Xilinx Announces the World's Largest FPGA Featuring 9 Million System Logic Cells (Aug 21, 2019)
- Intel unwraps its first chip for AI and calls it Spring Hill (Aug. 21, 2019)